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SG10201608038VA - Methods and apparatuses for cleaning electroplating substrate holders - Google Patents

Methods and apparatuses for cleaning electroplating substrate holders

Info

Publication number
SG10201608038VA
SG10201608038VA SG10201608038VA SG10201608038VA SG10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA
Authority
SG
Singapore
Prior art keywords
apparatuses
methods
substrate holders
electroplating substrate
cleaning electroplating
Prior art date
Application number
SG10201608038VA
Inventor
Santosh Kumar
Bryan L Buckalew
Steven T Mayer
Thomas Ponnuswamy
Chad Michael Hosack
Robert Rash
Lee Peng Chua
David Porter
Original Assignee
Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Publication of SG10201608038VA publication Critical patent/SG10201608038VA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/022Cleaning travelling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/041Cleaning travelling work
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • C25D7/123Semiconductors first coated with a seed layer or a conductive layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
SG10201608038VA 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders SG10201608038VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261616909P 2012-03-28 2012-03-28
US201261676841P 2012-07-27 2012-07-27

Publications (1)

Publication Number Publication Date
SG10201608038VA true SG10201608038VA (en) 2016-11-29

Family

ID=49261220

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201608038VA SG10201608038VA (en) 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders
SG11201406133WA SG11201406133WA (en) 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201406133WA SG11201406133WA (en) 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders

Country Status (6)

Country Link
US (1) US10092933B2 (en)
KR (1) KR102112881B1 (en)
CN (1) CN104272438B (en)
SG (2) SG10201608038VA (en)
TW (1) TWI591214B (en)
WO (1) WO2013148890A1 (en)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
JP6095958B2 (en) * 2011-12-27 2017-03-15 新光電気工業株式会社 Light emitting device
SG10201608038VA (en) 2012-03-28 2016-11-29 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
KR102092416B1 (en) 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 Cleaning electroplating substrate holders using reverse current deplating
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
US9746427B2 (en) * 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
US9518334B2 (en) * 2013-03-11 2016-12-13 Taiwan Semiconductor Manufacturing Company, Ltd. Electro-plating and apparatus for performing the same
JP2015071802A (en) * 2013-10-02 2015-04-16 株式会社荏原製作所 Plating apparatus and cleaning device used in the same
US10014191B2 (en) 2014-10-06 2018-07-03 Tel Fsi, Inc. Systems and methods for treating substrates with cryogenic fluid mixtures
US10625280B2 (en) 2014-10-06 2020-04-21 Tel Fsi, Inc. Apparatus for spraying cryogenic fluids
US20180025904A1 (en) * 2014-10-06 2018-01-25 Tel Fsi, Inc. Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
KR102476040B1 (en) 2014-10-06 2022-12-08 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. Systems and methods for treating substrates with cryogenic fluid mixtures
US9812344B2 (en) * 2015-02-03 2017-11-07 Applied Materials, Inc. Wafer processing system with chuck assembly maintenance module
JP1546799S (en) * 2015-06-12 2016-03-28
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US10307798B2 (en) 2015-08-28 2019-06-04 Taiwan Semiconducter Manufacturing Company Limited Cleaning device for cleaning electroplating substrate holder
KR101593887B1 (en) * 2015-10-23 2016-02-12 선호경 Spraying apparatus for plating solution on printed circuit board
US9864283B2 (en) * 2015-11-18 2018-01-09 Applied Materials, Inc. Apparatus and methods for photomask backside cleaning
CN108291325B (en) * 2015-12-04 2019-12-20 盛美半导体设备(上海)有限公司 Substrate holding device
JP1564934S (en) * 2016-02-26 2016-12-05
JP6462620B2 (en) * 2016-03-29 2019-01-30 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
TW201905250A (en) * 2017-06-23 2019-02-01 美商應用材料股份有限公司 Methods of inhibiting metal deposition
KR102454873B1 (en) * 2018-02-01 2022-10-13 어플라이드 머티어리얼스, 인코포레이티드 Cleaning components and methods of a plating system
JP6963524B2 (en) 2018-03-20 2021-11-10 キオクシア株式会社 Electroplating equipment
KR102521479B1 (en) * 2018-03-29 2023-04-12 어플라이드 머티어리얼스, 인코포레이티드 Substrate cleaning components and methods of a plating system
US11274377B2 (en) 2018-04-20 2022-03-15 Applied Materials, Inc. Seal apparatus for an electroplating system
WO2019204513A1 (en) * 2018-04-20 2019-10-24 Applied Materials, Inc. Cleaning components and methods in a plating system
JP7034880B2 (en) * 2018-10-05 2022-03-14 株式会社荏原製作所 Cleaning equipment, plating equipment equipped with this, and cleaning method
US11371159B2 (en) * 2019-06-22 2022-06-28 Applied Materials, Inc. Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor
KR102374313B1 (en) 2019-12-24 2022-03-14 경북대학교 산학협력단 Portable water purifier having piezoelectric polymer filter
JP7455608B2 (en) * 2020-02-25 2024-03-26 株式会社荏原製作所 Cleaning method and cleaning equipment
WO2021221887A1 (en) * 2020-04-30 2021-11-04 Lam Research Corporation Blended contact fingers for preventing cracks during thin substrate handling
US20230313408A1 (en) * 2020-08-14 2023-10-05 Lam Research Corporation Plating-deplating waveform based contact cleaning for a substrate electroplating system
CN112831810B (en) * 2020-12-31 2023-05-30 大连大学 Process for preparing micro-columnar structure by maskless localized electrodeposition method
CN114555870A (en) * 2021-03-17 2022-05-27 株式会社荏原制作所 Plating apparatus and method for cleaning contact member of plating apparatus
TWI790581B (en) * 2021-03-26 2023-01-21 日商荏原製作所股份有限公司 Plating device and method for cleaning contact members of the plating device
JP7194305B1 (en) 2022-07-01 2022-12-21 株式会社荏原製作所 Substrate holder, plating equipment, and plating method
JP7572593B1 (en) 2024-03-28 2024-10-23 株式会社荏原製作所 Plating apparatus and substrate processing method
CN118685846A (en) * 2024-08-21 2024-09-24 洛阳国联新材料研究院有限公司 Aluminum magnesium alloy electroplating equipment and method thereof

Family Cites Families (142)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2773257A (en) * 1956-07-27 1956-12-04 Goodman Mfg Co Conveyor having flexible strand side frames and troughing roller assembly therefor
US3225899A (en) * 1959-01-02 1965-12-28 Goodman Mfg Co Rope frame conveyor with controlled belt deflection
US3334750A (en) 1963-05-31 1967-08-08 Mullins Mfg Corp Dishwasher strainer with alternate filtering positions
US3430055A (en) 1965-04-02 1969-02-25 Bowles Eng Corp Surface flaw detector
US3716765A (en) * 1966-03-14 1973-02-13 Hughes Aircraft Co Semiconductor device with protective glass sealing
BE757899A (en) * 1969-10-25 1971-04-01 Asturiana De Zinc Sa METHOD AND INSTALLATION FOR REMOVING THE ZINC FORMED ON CATHODES DURING AN ELECTROLYTIC TREATMENT
US3684633A (en) 1971-01-05 1972-08-15 Mobil Oil Corp Laminated thermoplastic foam-film dish
US4418432A (en) 1981-08-26 1983-12-06 Vidal Stella M Drain filter having filamentary surface irregularities to entangle hair and debris
US4569695A (en) * 1983-04-21 1986-02-11 Nec Corporation Method of cleaning a photo-mask
US4466864A (en) 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US4654235A (en) 1984-04-13 1987-03-31 Chemical Fabrics Corporation Novel wear resistant fluoropolymer-containing flexible composites and method for preparation thereof
JPH01500744A (en) * 1986-06-26 1989-03-16 バクスター、インターナショナル、インコーポレイテッド Equipment for continuously cleaning and/or decontaminating bands of thermoplastic films
US5000827A (en) 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US5368711A (en) 1990-08-01 1994-11-29 Poris; Jaime Selective metal electrodeposition process and apparatus
USRE37749E1 (en) 1990-08-01 2002-06-18 Jaime Poris Electrodeposition apparatus with virtual anode
JPH0819516B2 (en) 1990-10-26 1996-02-28 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン Method and structure for forming thin film alpha Ta
US5221449A (en) 1990-10-26 1993-06-22 International Business Machines Corporation Method of making Alpha-Ta thin films
US5482611A (en) 1991-09-30 1996-01-09 Helmer; John C. Physical vapor deposition employing ion extraction from a plasma
US5227041A (en) 1992-06-12 1993-07-13 Digital Equipment Corporation Dry contact electroplating apparatus
US5289639A (en) * 1992-07-10 1994-03-01 International Business Machines Corp. Fluid treatment apparatus and method
FI94271C (en) * 1992-11-03 1995-08-10 Valmet Paper Machinery Inc Method of cleaning rollers and roller cleaning device
US5311634A (en) 1993-02-03 1994-05-17 Nicholas Andros Sponge cleaning pad
JP2955990B2 (en) * 1996-06-28 1999-10-04 株式会社沖電気コミュニケーションシステムズ Screen plate cleaning device
JP3490238B2 (en) 1997-02-17 2004-01-26 三菱電機株式会社 Plating apparatus and plating method
US20020157686A1 (en) * 1997-05-09 2002-10-31 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
US20060118132A1 (en) * 2004-12-06 2006-06-08 Bergman Eric J Cleaning with electrically charged aerosols
US20060151007A1 (en) * 1997-05-09 2006-07-13 Bergman Eric J Workpiece processing using ozone gas and chelating agents
ES2268773T3 (en) 1997-05-12 2007-03-16 Microban Products Company ANTIMICROBIAL BRUSH.
US5985762A (en) 1997-05-19 1999-11-16 International Business Machines Corporation Method of forming a self-aligned copper diffusion barrier in vias
US6156167A (en) 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US6179983B1 (en) 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
US6126798A (en) 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
US6159354A (en) 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
CN1222641C (en) 1998-02-12 2005-10-12 Acm研究公司 Plating apparatus and method
JPH11274282A (en) * 1998-03-23 1999-10-08 Toshiba Corp Substrate housing vessel, substrate housing vessel cleaner, substrate housing cleaning method and substrate treating apparatus
JP2002506488A (en) 1998-04-21 2002-02-26 アプライド マテリアルズ インコーポレイテッド Electrochemical deposition system and substrate electroplating method
US6217716B1 (en) 1998-05-06 2001-04-17 Novellus Systems, Inc. Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
US6071388A (en) 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6099702A (en) 1998-06-10 2000-08-08 Novellus Systems, Inc. Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
US6080291A (en) 1998-07-10 2000-06-27 Semitool, Inc. Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
EP1018568A4 (en) 1998-07-10 2006-05-31 Ebara Corp Plating device
US6773560B2 (en) 1998-07-10 2004-08-10 Semitool, Inc. Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces
CN1244722C (en) 1998-07-10 2006-03-08 塞米用具公司 Method and apparatus for copper plating using electroless plating and electroplating
US6303010B1 (en) 1999-07-12 2001-10-16 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6074544A (en) 1998-07-22 2000-06-13 Novellus Systems, Inc. Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
US6176985B1 (en) 1998-10-23 2001-01-23 International Business Machines Corporation Laminated electroplating rack and connection system for optimized plating
US7070686B2 (en) 2000-03-27 2006-07-04 Novellus Systems, Inc. Dynamically variable field shaping element
US6402923B1 (en) 2000-03-27 2002-06-11 Novellus Systems Inc Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
US6613214B2 (en) 1998-11-30 2003-09-02 Applied Materials, Inc. Electric contact element for electrochemical deposition system and method
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US6413388B1 (en) 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US6124203A (en) 1998-12-07 2000-09-26 Advanced Micro Devices, Inc. Method for forming conformal barrier layers
US6309520B1 (en) 1998-12-07 2001-10-30 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
DE19859467C2 (en) 1998-12-22 2002-11-28 Steag Micro Tech Gmbh substrate holder
US6193854B1 (en) 1999-01-05 2001-02-27 Novellus Systems, Inc. Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source
US6179973B1 (en) 1999-01-05 2001-01-30 Novellus Systems, Inc. Apparatus and method for controlling plasma uniformity across a substrate
US6221757B1 (en) 1999-01-20 2001-04-24 Infineon Technologies Ag Method of making a microelectronic structure
US6368475B1 (en) 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US6197182B1 (en) 1999-07-07 2001-03-06 Technic Inc. Apparatus and method for plating wafers, substrates and other articles
US7645366B2 (en) 1999-07-12 2010-01-12 Semitool, Inc. Microelectronic workpiece holders and contact assemblies for use therewith
US6267860B1 (en) 1999-07-27 2001-07-31 International Business Machines Corporation Method and apparatus for electroplating
US6309981B1 (en) * 1999-10-01 2001-10-30 Novellus Systems, Inc. Edge bevel removal of copper from silicon wafers
US6379468B1 (en) * 1999-12-20 2002-04-30 Engineered Materials Solutions, Inc. Method for cleaning thin metal strip material
US6612915B1 (en) 1999-12-27 2003-09-02 Nutool Inc. Work piece carrier head for plating and polishing
US6270646B1 (en) 1999-12-28 2001-08-07 International Business Machines Corporation Electroplating apparatus and method using a compressible contact
US6277249B1 (en) 2000-01-21 2001-08-21 Applied Materials Inc. Integrated process for copper via filling using a magnetron and target producing highly energetic ions
US6251242B1 (en) 2000-01-21 2001-06-26 Applied Materials, Inc. Magnetron and target producing an extended plasma region in a sputter reactor
JP3939077B2 (en) * 2000-05-30 2007-06-27 大日本スクリーン製造株式会社 Substrate cleaning device
US6398926B1 (en) 2000-05-31 2002-06-04 Techpoint Pacific Singapore Pte Ltd. Electroplating apparatus and method of using the same
EP1167582B1 (en) * 2000-07-01 2005-09-14 Shipley Company LLC Metal alloy compositions and plating method related thereto
JP2002069698A (en) 2000-08-31 2002-03-08 Tokyo Electron Ltd Equipment and method for liquid treatment
WO2002029137A2 (en) 2000-10-03 2002-04-11 Applied Materials,Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6627052B2 (en) 2000-12-12 2003-09-30 International Business Machines Corporation Electroplating apparatus with vertical electrical contact
JP4025953B2 (en) * 2001-01-05 2007-12-26 荒川化学工業株式会社 Cleaning composition
US6546938B2 (en) * 2001-03-12 2003-04-15 The Regents Of The University Of California Combined plasma/liquid cleaning of substrates
US6540899B2 (en) 2001-04-05 2003-04-01 All Wet Technologies, Inc. Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces
US6551487B1 (en) 2001-05-31 2003-04-22 Novellus Systems, Inc. Methods and apparatus for controlled-angle wafer immersion
US6800187B1 (en) 2001-05-31 2004-10-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating wafers
JP2003086548A (en) 2001-06-29 2003-03-20 Hitachi Ltd Manufacturing method of semiconductor device and polishing liquid therefor
US6908540B2 (en) 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
US20030019741A1 (en) 2001-07-24 2003-01-30 Applied Materials, Inc. Method and apparatus for sealing a substrate surface during an electrochemical deposition process
US6989084B2 (en) 2001-11-02 2006-01-24 Rockwell Scientific Licensing, Llc Semiconductor wafer plating cell assembly
US6579430B2 (en) 2001-11-02 2003-06-17 Innovative Technology Licensing, Llc Semiconductor wafer plating cathode assembly
US7033465B1 (en) 2001-11-30 2006-04-25 Novellus Systems, Inc. Clamshell apparatus with crystal shielding and in-situ rinse-dry
US6755946B1 (en) 2001-11-30 2004-06-29 Novellus Systems, Inc. Clamshell apparatus with dynamic uniformity control
JP4118659B2 (en) * 2001-12-03 2008-07-16 東京応化工業株式会社 Substrate tray
TWI244548B (en) 2002-01-22 2005-12-01 Taiwan Semiconductor Mfg Method for detecting the defect of a wafer
WO2004001813A2 (en) 2002-06-21 2003-12-31 Ebara Corporation Substrate holder and plating apparatus
US20040002430A1 (en) * 2002-07-01 2004-01-01 Applied Materials, Inc. Using a time critical wafer cleaning solution by combining a chelating agent with an oxidizer at point-of-use
JP2004083932A (en) 2002-08-22 2004-03-18 Ebara Corp Electrolytic treatment apparatus
US7300630B2 (en) * 2002-09-27 2007-11-27 E. I. Du Pont De Nemours And Company System and method for cleaning in-process sensors
US6867119B2 (en) 2002-10-30 2005-03-15 Advanced Micro Devices, Inc. Nitrogen oxidation to reduce encroachment
US6837943B2 (en) * 2002-12-17 2005-01-04 Samsung Electronics Co., Ltd. Method and apparatus for cleaning a semiconductor substrate
US20060113192A1 (en) 2003-01-23 2006-06-01 Keiichi Kurashina Plating device and planting method
US7087144B2 (en) 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
KR20040072446A (en) 2003-02-12 2004-08-18 삼성전자주식회사 Method of selectively removing metal on a semiconductor wafer edge
KR100935281B1 (en) * 2003-03-06 2010-01-06 도쿄엘렉트론가부시키가이샤 Process liquid supply nozzle and process liquid supply apparatus
JP3886919B2 (en) 2003-03-12 2007-02-28 富士通株式会社 Plating equipment
KR20040081577A (en) * 2003-03-14 2004-09-22 삼성전자주식회사 Wafer polishing apparatus
DE10313127B4 (en) 2003-03-24 2006-10-12 Rena Sondermaschinen Gmbh Process for the treatment of substrate surfaces
KR20060067973A (en) * 2003-09-16 2006-06-20 글로벌 이오닉 인코퍼레이티드 An electrolytic cell for removal of material from a solution
US20050081899A1 (en) * 2003-10-16 2005-04-21 Michael Shannon Adjustable spacer attachment for a power washer
JP2005146398A (en) 2003-11-19 2005-06-09 Ebara Corp Plating method and plating apparatus
KR20050068038A (en) * 2003-12-29 2005-07-05 동부아남반도체 주식회사 Cup for cleaning a conditioner of a chemical-mechanical polisher and method thereof
TWI251857B (en) * 2004-03-09 2006-03-21 Tokyo Electron Ltd Two-fluid nozzle for cleaning substrate and substrate cleaning device
US20050218000A1 (en) 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US7285195B2 (en) 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
US7182673B2 (en) * 2004-06-29 2007-02-27 Novellus Systems, Inc. Method and apparatus for post-CMP cleaning of a semiconductor work piece
US7301458B2 (en) 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
US7837851B2 (en) * 2005-05-25 2010-11-23 Applied Materials, Inc. In-situ profile measurement in an electroplating process
KR100727484B1 (en) * 2005-07-28 2007-06-13 삼성전자주식회사 Chemical mechanical polishing apparatus and method for conditioning polishing pad
KR20070064847A (en) 2005-12-19 2007-06-22 삼성전자주식회사 Electroplating apparatus for semiconductor wafer
JP4453840B2 (en) 2006-02-03 2010-04-21 Tdk株式会社 Electrode assembly and plating apparatus
JP2007229614A (en) * 2006-02-28 2007-09-13 Fujitsu Ltd Washing apparatus, washing method, and production method of product
US20080011322A1 (en) * 2006-07-11 2008-01-17 Frank Weber Cleaning systems and methods
KR20080007931A (en) 2006-07-19 2008-01-23 삼성전자주식회사 Electro-plating apparatus
KR100979979B1 (en) * 2006-07-26 2010-09-03 도쿄엘렉트론가부시키가이샤 Liquid processing apparatus and liquid processing method
JP2008045179A (en) 2006-08-18 2008-02-28 Ebara Corp Plating apparatus and plating method
JP2008095157A (en) 2006-10-13 2008-04-24 Ebara Corp Plating device and plating method
JP2009014510A (en) 2007-07-04 2009-01-22 Hitachi High-Technologies Corp Inspection method and inspection apparatus
US7894037B2 (en) 2007-07-30 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7985325B2 (en) 2007-10-30 2011-07-26 Novellus Systems, Inc. Closed contact electroplating cup assembly
US7935231B2 (en) 2007-10-31 2011-05-03 Novellus Systems, Inc. Rapidly cleanable electroplating cup assembly
JP5134339B2 (en) 2007-11-02 2013-01-30 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
US8105997B2 (en) * 2008-11-07 2012-01-31 Lam Research Corporation Composition and application of a two-phase contaminant removal medium
US8172992B2 (en) 2008-12-10 2012-05-08 Novellus Systems, Inc. Wafer electroplating apparatus for reducing edge defects
US9512538B2 (en) 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
CN101599420A (en) * 2009-07-24 2009-12-09 上海宏力半导体制造有限公司 Wafer cleaning device
JP5279664B2 (en) 2009-09-01 2013-09-04 本田技研工業株式会社 Cylinder barrel surface treatment equipment
JP5766048B2 (en) 2010-08-19 2015-08-19 株式会社荏原製作所 Substrate holder and plating apparatus
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
SG10201608038VA (en) 2012-03-28 2016-11-29 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
KR102092416B1 (en) 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 Cleaning electroplating substrate holders using reverse current deplating
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
US9746427B2 (en) 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
US10260855B2 (en) 2013-06-12 2019-04-16 Applied Materials, Inc. Electroplating tool with feedback of metal thickness distribution and correction
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US20170073832A1 (en) 2015-09-11 2017-03-16 Lam Research Corporation Durable low cure temperature hydrophobic coating in electroplating cup assembly

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TW201402874A (en) 2014-01-16
CN104272438B (en) 2018-01-12
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CN104272438A (en) 2015-01-07
US10092933B2 (en) 2018-10-09

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