US2773257A
(en)
*
|
1956-07-27 |
1956-12-04 |
Goodman Mfg Co |
Conveyor having flexible strand side frames and troughing roller assembly therefor
|
US3225899A
(en)
*
|
1959-01-02 |
1965-12-28 |
Goodman Mfg Co |
Rope frame conveyor with controlled belt deflection
|
US3334750A
(en)
|
1963-05-31 |
1967-08-08 |
Mullins Mfg Corp |
Dishwasher strainer with alternate filtering positions
|
US3430055A
(en)
|
1965-04-02 |
1969-02-25 |
Bowles Eng Corp |
Surface flaw detector
|
US3716765A
(en)
*
|
1966-03-14 |
1973-02-13 |
Hughes Aircraft Co |
Semiconductor device with protective glass sealing
|
BE757899A
(en)
*
|
1969-10-25 |
1971-04-01 |
Asturiana De Zinc Sa |
METHOD AND INSTALLATION FOR REMOVING THE ZINC FORMED ON CATHODES DURING AN ELECTROLYTIC TREATMENT
|
US3684633A
(en)
|
1971-01-05 |
1972-08-15 |
Mobil Oil Corp |
Laminated thermoplastic foam-film dish
|
US4418432A
(en)
|
1981-08-26 |
1983-12-06 |
Vidal Stella M |
Drain filter having filamentary surface irregularities to entangle hair and debris
|
US4569695A
(en)
*
|
1983-04-21 |
1986-02-11 |
Nec Corporation |
Method of cleaning a photo-mask
|
US4466864A
(en)
|
1983-12-16 |
1984-08-21 |
At&T Technologies, Inc. |
Methods of and apparatus for electroplating preselected surface regions of electrical articles
|
US4654235A
(en)
|
1984-04-13 |
1987-03-31 |
Chemical Fabrics Corporation |
Novel wear resistant fluoropolymer-containing flexible composites and method for preparation thereof
|
JPH01500744A
(en)
*
|
1986-06-26 |
1989-03-16 |
バクスター、インターナショナル、インコーポレイテッド |
Equipment for continuously cleaning and/or decontaminating bands of thermoplastic films
|
US5000827A
(en)
|
1990-01-02 |
1991-03-19 |
Motorola, Inc. |
Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
|
US5368711A
(en)
|
1990-08-01 |
1994-11-29 |
Poris; Jaime |
Selective metal electrodeposition process and apparatus
|
USRE37749E1
(en)
|
1990-08-01 |
2002-06-18 |
Jaime Poris |
Electrodeposition apparatus with virtual anode
|
JPH0819516B2
(en)
|
1990-10-26 |
1996-02-28 |
インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン |
Method and structure for forming thin film alpha Ta
|
US5221449A
(en)
|
1990-10-26 |
1993-06-22 |
International Business Machines Corporation |
Method of making Alpha-Ta thin films
|
US5482611A
(en)
|
1991-09-30 |
1996-01-09 |
Helmer; John C. |
Physical vapor deposition employing ion extraction from a plasma
|
US5227041A
(en)
|
1992-06-12 |
1993-07-13 |
Digital Equipment Corporation |
Dry contact electroplating apparatus
|
US5289639A
(en)
*
|
1992-07-10 |
1994-03-01 |
International Business Machines Corp. |
Fluid treatment apparatus and method
|
FI94271C
(en)
*
|
1992-11-03 |
1995-08-10 |
Valmet Paper Machinery Inc |
Method of cleaning rollers and roller cleaning device
|
US5311634A
(en)
|
1993-02-03 |
1994-05-17 |
Nicholas Andros |
Sponge cleaning pad
|
JP2955990B2
(en)
*
|
1996-06-28 |
1999-10-04 |
株式会社沖電気コミュニケーションシステムズ |
Screen plate cleaning device
|
JP3490238B2
(en)
|
1997-02-17 |
2004-01-26 |
三菱電機株式会社 |
Plating apparatus and plating method
|
US20020157686A1
(en)
*
|
1997-05-09 |
2002-10-31 |
Semitool, Inc. |
Process and apparatus for treating a workpiece such as a semiconductor wafer
|
US20060118132A1
(en)
*
|
2004-12-06 |
2006-06-08 |
Bergman Eric J |
Cleaning with electrically charged aerosols
|
US20060151007A1
(en)
*
|
1997-05-09 |
2006-07-13 |
Bergman Eric J |
Workpiece processing using ozone gas and chelating agents
|
ES2268773T3
(en)
|
1997-05-12 |
2007-03-16 |
Microban Products Company |
ANTIMICROBIAL BRUSH.
|
US5985762A
(en)
|
1997-05-19 |
1999-11-16 |
International Business Machines Corporation |
Method of forming a self-aligned copper diffusion barrier in vias
|
US6156167A
(en)
|
1997-11-13 |
2000-12-05 |
Novellus Systems, Inc. |
Clamshell apparatus for electrochemically treating semiconductor wafers
|
US6179983B1
(en)
|
1997-11-13 |
2001-01-30 |
Novellus Systems, Inc. |
Method and apparatus for treating surface including virtual anode
|
US6126798A
(en)
|
1997-11-13 |
2000-10-03 |
Novellus Systems, Inc. |
Electroplating anode including membrane partition system and method of preventing passivation of same
|
US6159354A
(en)
|
1997-11-13 |
2000-12-12 |
Novellus Systems, Inc. |
Electric potential shaping method for electroplating
|
CN1222641C
(en)
|
1998-02-12 |
2005-10-12 |
Acm研究公司 |
Plating apparatus and method
|
JPH11274282A
(en)
*
|
1998-03-23 |
1999-10-08 |
Toshiba Corp |
Substrate housing vessel, substrate housing vessel cleaner, substrate housing cleaning method and substrate treating apparatus
|
JP2002506488A
(en)
|
1998-04-21 |
2002-02-26 |
アプライド マテリアルズ インコーポレイテッド |
Electrochemical deposition system and substrate electroplating method
|
US6217716B1
(en)
|
1998-05-06 |
2001-04-17 |
Novellus Systems, Inc. |
Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
|
US6071388A
(en)
|
1998-05-29 |
2000-06-06 |
International Business Machines Corporation |
Electroplating workpiece fixture having liquid gap spacer
|
US6099702A
(en)
|
1998-06-10 |
2000-08-08 |
Novellus Systems, Inc. |
Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
|
US6080291A
(en)
|
1998-07-10 |
2000-06-27 |
Semitool, Inc. |
Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
|
EP1018568A4
(en)
|
1998-07-10 |
2006-05-31 |
Ebara Corp |
Plating device
|
US6773560B2
(en)
|
1998-07-10 |
2004-08-10 |
Semitool, Inc. |
Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces
|
CN1244722C
(en)
|
1998-07-10 |
2006-03-08 |
塞米用具公司 |
Method and apparatus for copper plating using electroless plating and electroplating
|
US6303010B1
(en)
|
1999-07-12 |
2001-10-16 |
Semitool, Inc. |
Methods and apparatus for processing the surface of a microelectronic workpiece
|
US6074544A
(en)
|
1998-07-22 |
2000-06-13 |
Novellus Systems, Inc. |
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
|
US6176985B1
(en)
|
1998-10-23 |
2001-01-23 |
International Business Machines Corporation |
Laminated electroplating rack and connection system for optimized plating
|
US7070686B2
(en)
|
2000-03-27 |
2006-07-04 |
Novellus Systems, Inc. |
Dynamically variable field shaping element
|
US6402923B1
(en)
|
2000-03-27 |
2002-06-11 |
Novellus Systems Inc |
Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
|
US6613214B2
(en)
|
1998-11-30 |
2003-09-02 |
Applied Materials, Inc. |
Electric contact element for electrochemical deposition system and method
|
US6258220B1
(en)
|
1998-11-30 |
2001-07-10 |
Applied Materials, Inc. |
Electro-chemical deposition system
|
US6413388B1
(en)
|
2000-02-23 |
2002-07-02 |
Nutool Inc. |
Pad designs and structures for a versatile materials processing apparatus
|
US6124203A
(en)
|
1998-12-07 |
2000-09-26 |
Advanced Micro Devices, Inc. |
Method for forming conformal barrier layers
|
US6309520B1
(en)
|
1998-12-07 |
2001-10-30 |
Semitool, Inc. |
Methods and apparatus for processing the surface of a microelectronic workpiece
|
DE19859467C2
(en)
|
1998-12-22 |
2002-11-28 |
Steag Micro Tech Gmbh |
substrate holder
|
US6193854B1
(en)
|
1999-01-05 |
2001-02-27 |
Novellus Systems, Inc. |
Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source
|
US6179973B1
(en)
|
1999-01-05 |
2001-01-30 |
Novellus Systems, Inc. |
Apparatus and method for controlling plasma uniformity across a substrate
|
US6221757B1
(en)
|
1999-01-20 |
2001-04-24 |
Infineon Technologies Ag |
Method of making a microelectronic structure
|
US6368475B1
(en)
|
2000-03-21 |
2002-04-09 |
Semitool, Inc. |
Apparatus for electrochemically processing a microelectronic workpiece
|
US6197182B1
(en)
|
1999-07-07 |
2001-03-06 |
Technic Inc. |
Apparatus and method for plating wafers, substrates and other articles
|
US7645366B2
(en)
|
1999-07-12 |
2010-01-12 |
Semitool, Inc. |
Microelectronic workpiece holders and contact assemblies for use therewith
|
US6267860B1
(en)
|
1999-07-27 |
2001-07-31 |
International Business Machines Corporation |
Method and apparatus for electroplating
|
US6309981B1
(en)
*
|
1999-10-01 |
2001-10-30 |
Novellus Systems, Inc. |
Edge bevel removal of copper from silicon wafers
|
US6379468B1
(en)
*
|
1999-12-20 |
2002-04-30 |
Engineered Materials Solutions, Inc. |
Method for cleaning thin metal strip material
|
US6612915B1
(en)
|
1999-12-27 |
2003-09-02 |
Nutool Inc. |
Work piece carrier head for plating and polishing
|
US6270646B1
(en)
|
1999-12-28 |
2001-08-07 |
International Business Machines Corporation |
Electroplating apparatus and method using a compressible contact
|
US6277249B1
(en)
|
2000-01-21 |
2001-08-21 |
Applied Materials Inc. |
Integrated process for copper via filling using a magnetron and target producing highly energetic ions
|
US6251242B1
(en)
|
2000-01-21 |
2001-06-26 |
Applied Materials, Inc. |
Magnetron and target producing an extended plasma region in a sputter reactor
|
JP3939077B2
(en)
*
|
2000-05-30 |
2007-06-27 |
大日本スクリーン製造株式会社 |
Substrate cleaning device
|
US6398926B1
(en)
|
2000-05-31 |
2002-06-04 |
Techpoint Pacific Singapore Pte Ltd. |
Electroplating apparatus and method of using the same
|
EP1167582B1
(en)
*
|
2000-07-01 |
2005-09-14 |
Shipley Company LLC |
Metal alloy compositions and plating method related thereto
|
JP2002069698A
(en)
|
2000-08-31 |
2002-03-08 |
Tokyo Electron Ltd |
Equipment and method for liquid treatment
|
WO2002029137A2
(en)
|
2000-10-03 |
2002-04-11 |
Applied Materials,Inc. |
Method and associated apparatus for tilting a substrate upon entry for metal deposition
|
US6627052B2
(en)
|
2000-12-12 |
2003-09-30 |
International Business Machines Corporation |
Electroplating apparatus with vertical electrical contact
|
JP4025953B2
(en)
*
|
2001-01-05 |
2007-12-26 |
荒川化学工業株式会社 |
Cleaning composition
|
US6546938B2
(en)
*
|
2001-03-12 |
2003-04-15 |
The Regents Of The University Of California |
Combined plasma/liquid cleaning of substrates
|
US6540899B2
(en)
|
2001-04-05 |
2003-04-01 |
All Wet Technologies, Inc. |
Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces
|
US6551487B1
(en)
|
2001-05-31 |
2003-04-22 |
Novellus Systems, Inc. |
Methods and apparatus for controlled-angle wafer immersion
|
US6800187B1
(en)
|
2001-05-31 |
2004-10-05 |
Novellus Systems, Inc. |
Clamshell apparatus for electrochemically treating wafers
|
JP2003086548A
(en)
|
2001-06-29 |
2003-03-20 |
Hitachi Ltd |
Manufacturing method of semiconductor device and polishing liquid therefor
|
US6908540B2
(en)
|
2001-07-13 |
2005-06-21 |
Applied Materials, Inc. |
Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
|
US20030019741A1
(en)
|
2001-07-24 |
2003-01-30 |
Applied Materials, Inc. |
Method and apparatus for sealing a substrate surface during an electrochemical deposition process
|
US6989084B2
(en)
|
2001-11-02 |
2006-01-24 |
Rockwell Scientific Licensing, Llc |
Semiconductor wafer plating cell assembly
|
US6579430B2
(en)
|
2001-11-02 |
2003-06-17 |
Innovative Technology Licensing, Llc |
Semiconductor wafer plating cathode assembly
|
US7033465B1
(en)
|
2001-11-30 |
2006-04-25 |
Novellus Systems, Inc. |
Clamshell apparatus with crystal shielding and in-situ rinse-dry
|
US6755946B1
(en)
|
2001-11-30 |
2004-06-29 |
Novellus Systems, Inc. |
Clamshell apparatus with dynamic uniformity control
|
JP4118659B2
(en)
*
|
2001-12-03 |
2008-07-16 |
東京応化工業株式会社 |
Substrate tray
|
TWI244548B
(en)
|
2002-01-22 |
2005-12-01 |
Taiwan Semiconductor Mfg |
Method for detecting the defect of a wafer
|
WO2004001813A2
(en)
|
2002-06-21 |
2003-12-31 |
Ebara Corporation |
Substrate holder and plating apparatus
|
US20040002430A1
(en)
*
|
2002-07-01 |
2004-01-01 |
Applied Materials, Inc. |
Using a time critical wafer cleaning solution by combining a chelating agent with an oxidizer at point-of-use
|
JP2004083932A
(en)
|
2002-08-22 |
2004-03-18 |
Ebara Corp |
Electrolytic treatment apparatus
|
US7300630B2
(en)
*
|
2002-09-27 |
2007-11-27 |
E. I. Du Pont De Nemours And Company |
System and method for cleaning in-process sensors
|
US6867119B2
(en)
|
2002-10-30 |
2005-03-15 |
Advanced Micro Devices, Inc. |
Nitrogen oxidation to reduce encroachment
|
US6837943B2
(en)
*
|
2002-12-17 |
2005-01-04 |
Samsung Electronics Co., Ltd. |
Method and apparatus for cleaning a semiconductor substrate
|
US20060113192A1
(en)
|
2003-01-23 |
2006-06-01 |
Keiichi Kurashina |
Plating device and planting method
|
US7087144B2
(en)
|
2003-01-31 |
2006-08-08 |
Applied Materials, Inc. |
Contact ring with embedded flexible contacts
|
KR20040072446A
(en)
|
2003-02-12 |
2004-08-18 |
삼성전자주식회사 |
Method of selectively removing metal on a semiconductor wafer edge
|
KR100935281B1
(en)
*
|
2003-03-06 |
2010-01-06 |
도쿄엘렉트론가부시키가이샤 |
Process liquid supply nozzle and process liquid supply apparatus
|
JP3886919B2
(en)
|
2003-03-12 |
2007-02-28 |
富士通株式会社 |
Plating equipment
|
KR20040081577A
(en)
*
|
2003-03-14 |
2004-09-22 |
삼성전자주식회사 |
Wafer polishing apparatus
|
DE10313127B4
(en)
|
2003-03-24 |
2006-10-12 |
Rena Sondermaschinen Gmbh |
Process for the treatment of substrate surfaces
|
KR20060067973A
(en)
*
|
2003-09-16 |
2006-06-20 |
글로벌 이오닉 인코퍼레이티드 |
An electrolytic cell for removal of material from a solution
|
US20050081899A1
(en)
*
|
2003-10-16 |
2005-04-21 |
Michael Shannon |
Adjustable spacer attachment for a power washer
|
JP2005146398A
(en)
|
2003-11-19 |
2005-06-09 |
Ebara Corp |
Plating method and plating apparatus
|
KR20050068038A
(en)
*
|
2003-12-29 |
2005-07-05 |
동부아남반도체 주식회사 |
Cup for cleaning a conditioner of a chemical-mechanical polisher and method thereof
|
TWI251857B
(en)
*
|
2004-03-09 |
2006-03-21 |
Tokyo Electron Ltd |
Two-fluid nozzle for cleaning substrate and substrate cleaning device
|
US20050218000A1
(en)
|
2004-04-06 |
2005-10-06 |
Applied Materials, Inc. |
Conditioning of contact leads for metal plating systems
|
US7285195B2
(en)
|
2004-06-24 |
2007-10-23 |
Applied Materials, Inc. |
Electric field reducing thrust plate
|
US7182673B2
(en)
*
|
2004-06-29 |
2007-02-27 |
Novellus Systems, Inc. |
Method and apparatus for post-CMP cleaning of a semiconductor work piece
|
US7301458B2
(en)
|
2005-05-11 |
2007-11-27 |
Alien Technology Corporation |
Method and apparatus for testing RFID devices
|
US7837851B2
(en)
*
|
2005-05-25 |
2010-11-23 |
Applied Materials, Inc. |
In-situ profile measurement in an electroplating process
|
KR100727484B1
(en)
*
|
2005-07-28 |
2007-06-13 |
삼성전자주식회사 |
Chemical mechanical polishing apparatus and method for conditioning polishing pad
|
KR20070064847A
(en)
|
2005-12-19 |
2007-06-22 |
삼성전자주식회사 |
Electroplating apparatus for semiconductor wafer
|
JP4453840B2
(en)
|
2006-02-03 |
2010-04-21 |
Tdk株式会社 |
Electrode assembly and plating apparatus
|
JP2007229614A
(en)
*
|
2006-02-28 |
2007-09-13 |
Fujitsu Ltd |
Washing apparatus, washing method, and production method of product
|
US20080011322A1
(en)
*
|
2006-07-11 |
2008-01-17 |
Frank Weber |
Cleaning systems and methods
|
KR20080007931A
(en)
|
2006-07-19 |
2008-01-23 |
삼성전자주식회사 |
Electro-plating apparatus
|
KR100979979B1
(en)
*
|
2006-07-26 |
2010-09-03 |
도쿄엘렉트론가부시키가이샤 |
Liquid processing apparatus and liquid processing method
|
JP2008045179A
(en)
|
2006-08-18 |
2008-02-28 |
Ebara Corp |
Plating apparatus and plating method
|
JP2008095157A
(en)
|
2006-10-13 |
2008-04-24 |
Ebara Corp |
Plating device and plating method
|
JP2009014510A
(en)
|
2007-07-04 |
2009-01-22 |
Hitachi High-Technologies Corp |
Inspection method and inspection apparatus
|
US7894037B2
(en)
|
2007-07-30 |
2011-02-22 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
US7985325B2
(en)
|
2007-10-30 |
2011-07-26 |
Novellus Systems, Inc. |
Closed contact electroplating cup assembly
|
US7935231B2
(en)
|
2007-10-31 |
2011-05-03 |
Novellus Systems, Inc. |
Rapidly cleanable electroplating cup assembly
|
JP5134339B2
(en)
|
2007-11-02 |
2013-01-30 |
ルネサスエレクトロニクス株式会社 |
Manufacturing method of semiconductor integrated circuit device
|
US8105997B2
(en)
*
|
2008-11-07 |
2012-01-31 |
Lam Research Corporation |
Composition and application of a two-phase contaminant removal medium
|
US8172992B2
(en)
|
2008-12-10 |
2012-05-08 |
Novellus Systems, Inc. |
Wafer electroplating apparatus for reducing edge defects
|
US9512538B2
(en)
|
2008-12-10 |
2016-12-06 |
Novellus Systems, Inc. |
Plating cup with contoured cup bottom
|
EP2221396A1
(en)
*
|
2008-12-31 |
2010-08-25 |
Rohm and Haas Electronic Materials LLC |
Lead-Free Tin Alloy Electroplating Compositions and Methods
|
CN101599420A
(en)
*
|
2009-07-24 |
2009-12-09 |
上海宏力半导体制造有限公司 |
Wafer cleaning device
|
JP5279664B2
(en)
|
2009-09-01 |
2013-09-04 |
本田技研工業株式会社 |
Cylinder barrel surface treatment equipment
|
JP5766048B2
(en)
|
2010-08-19 |
2015-08-19 |
株式会社荏原製作所 |
Substrate holder and plating apparatus
|
US9221081B1
(en)
|
2011-08-01 |
2015-12-29 |
Novellus Systems, Inc. |
Automated cleaning of wafer plating assembly
|
US9988734B2
(en)
|
2011-08-15 |
2018-06-05 |
Lam Research Corporation |
Lipseals and contact elements for semiconductor electroplating apparatuses
|
US9228270B2
(en)
|
2011-08-15 |
2016-01-05 |
Novellus Systems, Inc. |
Lipseals and contact elements for semiconductor electroplating apparatuses
|
US10066311B2
(en)
|
2011-08-15 |
2018-09-04 |
Lam Research Corporation |
Multi-contact lipseals and associated electroplating methods
|
SG10201608038VA
(en)
|
2012-03-28 |
2016-11-29 |
Novellus Systems Inc |
Methods and apparatuses for cleaning electroplating substrate holders
|
KR102092416B1
(en)
|
2012-03-30 |
2020-03-24 |
노벨러스 시스템즈, 인코포레이티드 |
Cleaning electroplating substrate holders using reverse current deplating
|
US10416092B2
(en)
|
2013-02-15 |
2019-09-17 |
Lam Research Corporation |
Remote detection of plating on wafer holding apparatus
|
US9746427B2
(en)
|
2013-02-15 |
2017-08-29 |
Novellus Systems, Inc. |
Detection of plating on wafer holding apparatus
|
US10260855B2
(en)
|
2013-06-12 |
2019-04-16 |
Applied Materials, Inc. |
Electroplating tool with feedback of metal thickness distribution and correction
|
US10053793B2
(en)
|
2015-07-09 |
2018-08-21 |
Lam Research Corporation |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
|
US20170073832A1
(en)
|
2015-09-11 |
2017-03-16 |
Lam Research Corporation |
Durable low cure temperature hydrophobic coating in electroplating cup assembly
|