Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/26—Testing of individual semiconductor devices
  • G01R31/265—Contactless testing
  • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
  • G01N21/9501—Semiconductor wafers
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
  • G01R23/16—Spectrum analysis; Fourier analysis
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/302—Contactless testing
  • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
  • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
  • H01L22/10—Measuring as part of the manufacturing process
  • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N2201/00—Features of devices classified in G01N21/00
  • G01N2201/12—Circuits of general importance; Signal processing

Landscapes

• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• General Physics & Mathematics (AREA)
• Health & Medical Sciences (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• Electromagnetism (AREA)
• Toxicology (AREA)
• Manufacturing & Machinery (AREA)
• General Engineering & Computer Science (AREA)
• Computer Vision & Pattern Recognition (AREA)
• Mathematical Physics (AREA)
• Life Sciences & Earth Sciences (AREA)
• Pathology (AREA)
• Immunology (AREA)
• General Health & Medical Sciences (AREA)
• Biochemistry (AREA)
• Analytical Chemistry (AREA)
• Chemical & Material Sciences (AREA)
• Power Engineering (AREA)
• Tests Of Electronic Circuits (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)
• Measuring Leads Or Probes (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=51262384

Family Applications (3)

Family Applications Before (1)

Family Applications After (1)

Country Status (5)

Families Citing this family (14)

Family Cites Families (34)

• 2014
  • 2014-01-30 US US14/764,327 patent/US9618563B2/en active Active
  • 2014-01-30 KR KR1020157019600A patent/KR101679527B1/en active IP Right Grant
  • 2014-01-30 SG SG11201505836WA patent/SG11201505836WA/en unknown
  • 2014-01-30 JP JP2014559747A patent/JP5744353B2/en active Active
  • 2014-01-30 WO PCT/JP2014/052146 patent/WO2014119676A1/en active Application Filing
  • 2014-01-30 SG SG10201604835TA patent/SG10201604835TA/en unknown
  • 2014-01-30 SG SG11201505833XA patent/SG11201505833XA/en unknown
  • 2014-01-30 KR KR1020157018901A patent/KR101777031B1/en active IP Right Grant
  • 2014-01-30 KR KR1020177015376A patent/KR20170069292A/en not_active Application Discontinuation
  • 2014-01-30 WO PCT/JP2014/052145 patent/WO2014119675A1/en active Application Filing
  • 2014-01-30 KR KR1020167032138A patent/KR101764560B1/en active IP Right Grant
  • 2014-01-30 US US14/764,246 patent/US9562944B2/en active Active
  • 2014-01-30 JP JP2014559748A patent/JP5745707B2/en active Active
  • 2014-01-30 KR KR1020177024676A patent/KR101923846B1/en active IP Right Grant
• 2015
  • 2015-05-01 JP JP2015094299A patent/JP6389797B2/en active Active
• 2016
  • 2016-07-26 US US15/219,946 patent/US10191104B2/en active Active
• 2017
  • 2017-03-02 US US15/447,525 patent/US10101383B2/en active Active

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