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SG10201510350WA - Arrays of inductive elements for minimizing radial non-uniformity in plasma - Google Patents

Arrays of inductive elements for minimizing radial non-uniformity in plasma

Info

Publication number
SG10201510350WA
SG10201510350WA SG10201510350WA SG10201510350WA SG10201510350WA SG 10201510350W A SG10201510350W A SG 10201510350WA SG 10201510350W A SG10201510350W A SG 10201510350WA SG 10201510350W A SG10201510350W A SG 10201510350WA SG 10201510350W A SG10201510350W A SG 10201510350WA
Authority
SG
Singapore
Prior art keywords
arrays
uniformity
plasma
inductive elements
radial non
Prior art date
Application number
SG10201510350WA
Inventor
Neil Benjamin
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201510350WA publication Critical patent/SG10201510350WA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
SG10201510350WA 2007-06-29 2008-06-25 Arrays of inductive elements for minimizing radial non-uniformity in plasma SG10201510350WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94738007P 2007-06-29 2007-06-29

Publications (1)

Publication Number Publication Date
SG10201510350WA true SG10201510350WA (en) 2016-01-28

Family

ID=40158983

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201510350WA SG10201510350WA (en) 2007-06-29 2008-06-25 Arrays of inductive elements for minimizing radial non-uniformity in plasma
SG2012047965A SG182966A1 (en) 2007-06-29 2008-06-25 Arrays of inductive elements for minimizing radial non-uniformity in plasma

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012047965A SG182966A1 (en) 2007-06-29 2008-06-25 Arrays of inductive elements for minimizing radial non-uniformity in plasma

Country Status (7)

Country Link
US (1) US20090000738A1 (en)
JP (1) JP5554706B2 (en)
KR (1) KR101494927B1 (en)
CN (1) CN101720502B (en)
SG (2) SG10201510350WA (en)
TW (1) TWI473536B (en)
WO (1) WO2009006151A2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8528498B2 (en) * 2007-06-29 2013-09-10 Lam Research Corporation Integrated steerability array arrangement for minimizing non-uniformity
WO2009039623A2 (en) * 2007-09-25 2009-04-02 Roger Vanderlinden Sealed pick-up head for a mobile sweeper
US8637794B2 (en) 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
KR101644673B1 (en) * 2009-12-15 2016-08-01 램 리써치 코포레이션 Adjusting substrate temperature to improve cd uniformity
US8791392B2 (en) 2010-10-22 2014-07-29 Lam Research Corporation Methods of fault detection for multiplexed heater array
US8546732B2 (en) 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
US9307578B2 (en) 2011-08-17 2016-04-05 Lam Research Corporation System and method for monitoring temperatures of and controlling multiplexed heater array
US10388493B2 (en) * 2011-09-16 2019-08-20 Lam Research Corporation Component of a substrate support assembly producing localized magnetic fields
US8624168B2 (en) 2011-09-20 2014-01-07 Lam Research Corporation Heating plate with diode planar heater zones for semiconductor processing
US8461674B2 (en) 2011-09-21 2013-06-11 Lam Research Corporation Thermal plate with planar thermal zones for semiconductor processing
US9324589B2 (en) 2012-02-28 2016-04-26 Lam Research Corporation Multiplexed heater array using AC drive for semiconductor processing
US8809747B2 (en) 2012-04-13 2014-08-19 Lam Research Corporation Current peak spreading schemes for multiplexed heated array
US10049948B2 (en) 2012-11-30 2018-08-14 Lam Research Corporation Power switching system for ESC with array of thermal control elements
US10332725B2 (en) * 2015-03-30 2019-06-25 Lam Research Corporation Systems and methods for reversing RF current polarity at one output of a multiple output RF matching network
FR3046582B1 (en) * 2016-01-12 2018-01-26 Valeo Systemes D'essuyage AUTOMOTIVE VEHICLE WIPER DEFLECTOR AND BRUSH

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US5397962A (en) * 1992-06-29 1995-03-14 Texas Instruments Incorporated Source and method for generating high-density plasma with inductive power coupling
JPH0878191A (en) * 1994-09-06 1996-03-22 Kobe Steel Ltd Plasma treatment method and device therefor
US5811022A (en) * 1994-11-15 1998-09-22 Mattson Technology, Inc. Inductive plasma reactor
US5874704A (en) * 1995-06-30 1999-02-23 Lam Research Corporation Low inductance large area coil for an inductively coupled plasma source
US5907221A (en) * 1995-08-16 1999-05-25 Applied Materials, Inc. Inductively coupled plasma reactor with an inductive coil antenna having independent loops
US6209480B1 (en) * 1996-07-10 2001-04-03 Mehrdad M. Moslehi Hermetically-sealed inductively-coupled plasma source structure and method of use
JPH1064697A (en) * 1996-08-12 1998-03-06 Anelva Corp Plasma processing device
US6204607B1 (en) * 1998-05-28 2001-03-20 Applied Komatsu Technology, Inc. Plasma source with multiple magnetic flux sources each having a ferromagnetic core
TW434636B (en) * 1998-07-13 2001-05-16 Applied Komatsu Technology Inc RF matching network with distributed outputs
US6469919B1 (en) * 1999-07-22 2002-10-22 Eni Technology, Inc. Power supplies having protection circuits
US6392210B1 (en) * 1999-12-31 2002-05-21 Russell F. Jewett Methods and apparatus for RF power process operations with automatic input power control
US6156667A (en) * 1999-12-31 2000-12-05 Litmas, Inc. Methods and apparatus for plasma processing
JP3411539B2 (en) * 2000-03-06 2003-06-03 株式会社日立製作所 Plasma processing apparatus and plasma processing method
JP4371543B2 (en) * 2000-06-29 2009-11-25 日本電気株式会社 Remote plasma CVD apparatus and film forming method
US6642661B2 (en) * 2001-08-28 2003-11-04 Tokyo Electron Limited Method to affect spatial distribution of harmonic generation in a capacitive discharge reactor
JP3787079B2 (en) * 2001-09-11 2006-06-21 株式会社日立製作所 Plasma processing equipment
JP4008728B2 (en) * 2002-03-20 2007-11-14 株式会社 液晶先端技術開発センター Plasma processing equipment
JP3854909B2 (en) * 2002-08-06 2006-12-06 株式会社日立製作所 Plasma processing equipment
US7567037B2 (en) * 2003-01-16 2009-07-28 Japan Science And Technology Agency High frequency power supply device and plasma generator
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Also Published As

Publication number Publication date
US20090000738A1 (en) 2009-01-01
CN101720502A (en) 2010-06-02
JP5554706B2 (en) 2014-07-23
SG182966A1 (en) 2012-08-30
TWI473536B (en) 2015-02-11
KR101494927B1 (en) 2015-02-23
CN101720502B (en) 2011-09-14
TW200922387A (en) 2009-05-16
WO2009006151A2 (en) 2009-01-08
KR20100035170A (en) 2010-04-02
JP2010532583A (en) 2010-10-07
WO2009006151A3 (en) 2009-03-05

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