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SG100709A1 - Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same - Google Patents

Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same

Info

Publication number
SG100709A1
SG100709A1 SG200103072A SG200103072A SG100709A1 SG 100709 A1 SG100709 A1 SG 100709A1 SG 200103072 A SG200103072 A SG 200103072A SG 200103072 A SG200103072 A SG 200103072A SG 100709 A1 SG100709 A1 SG 100709A1
Authority
SG
Singapore
Prior art keywords
holding
same
semiconductor wafer
machining apparatus
wafer assembly
Prior art date
Application number
SG200103072A
Inventor
Arai Kazuhisa
Takahashi Toshiaki
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG100709A1 publication Critical patent/SG100709A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200103072A 2000-05-31 2001-05-22 Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same SG100709A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000162287A JP2001345300A (en) 2000-05-31 2000-05-31 Semiconductor wafer machining body and machining apparatus comprising chuck table for holding semiconductor wafer machining body

Publications (1)

Publication Number Publication Date
SG100709A1 true SG100709A1 (en) 2003-12-26

Family

ID=18666205

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200103072A SG100709A1 (en) 2000-05-31 2001-05-22 Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same

Country Status (4)

Country Link
US (2) US20010049256A1 (en)
JP (1) JP2001345300A (en)
DE (1) DE10124739A1 (en)
SG (1) SG100709A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10212420A1 (en) * 2002-03-21 2003-10-16 Erich Thallner Device for holding a wafer
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
US20040229002A1 (en) * 2003-05-15 2004-11-18 3D Systems, Inc. Stereolithographic seal and support structure for semiconductor wafer
JP4592270B2 (en) * 2003-10-06 2010-12-01 日東電工株式会社 Method for peeling semiconductor wafer from support and apparatus using the same
JP2007214502A (en) * 2006-02-13 2007-08-23 Oki Electric Ind Co Ltd Semiconductor device and its manufacturing method
JP2009246098A (en) * 2008-03-31 2009-10-22 Disco Abrasive Syst Ltd Method for grinding wafer
US20100112905A1 (en) * 2008-10-30 2010-05-06 Leonard Borucki Wafer head template for chemical mechanical polishing and a method for its use
JP2011029331A (en) * 2009-07-23 2011-02-10 Disco Abrasive Syst Ltd Method for grinding wafer and protective tape
US20130316627A1 (en) * 2012-05-14 2013-11-28 Edmond Arzuman Abrahamians Wafer carrier for batch wafer polishing in wafer polishing machines
JP5969334B2 (en) * 2012-09-13 2016-08-17 株式会社ディスコ Processing apparatus and processing method
JP2014200888A (en) * 2013-04-05 2014-10-27 ローム株式会社 Suction holding device and wafer polishing device
JP6045426B2 (en) * 2013-04-05 2016-12-14 株式会社ディスコ Wafer transfer method and surface protection member
JP6632469B2 (en) * 2016-05-24 2020-01-22 三菱電機株式会社 Wafer tray
KR102420162B1 (en) * 2018-02-09 2022-07-12 삼성전자주식회사 Vacuum chuck and semiconductor manufacturing apparatus having the same
DE102019211540A1 (en) * 2019-08-01 2021-02-04 Disco Corporation METHOD OF EDITING A SUBSTRATE
CN112838072A (en) * 2019-11-22 2021-05-25 深圳市中光工业技术研究院 Alignment method for back side photoetching process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04158549A (en) * 1990-10-22 1992-06-01 Matsushita Electron Corp Exfoliating method of semiconductor chip
JPH08107088A (en) * 1994-10-04 1996-04-23 Fujitsu Ltd Manufacture of semiconductor device
JP2000294603A (en) * 1999-04-06 2000-10-20 Toshiba Corp Electronic parts mounting apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54134973A (en) * 1978-04-12 1979-10-19 Kyushu Nippon Electric Sheet holding jig for semiconductor wafer
JPH0353546A (en) * 1989-07-21 1991-03-07 Mitsubishi Electric Corp Method and apparatus for manufacturing semiconductor device
JP2858705B2 (en) * 1990-10-11 1999-02-17 富士通株式会社 Method for manufacturing semiconductor device
US5268065A (en) * 1992-12-21 1993-12-07 Motorola, Inc. Method for thinning a semiconductor wafer
JPH09213662A (en) * 1996-01-31 1997-08-15 Toshiba Corp Method of splitting wafer and method of manufacturing semiconductor device
JPH10116801A (en) * 1996-10-09 1998-05-06 Rohm Co Ltd Method for dividing substrate and manufacture of light emitting element using the method
JP4322328B2 (en) * 1997-06-05 2009-08-26 テキサス インスツルメンツ インコーポレイテツド Method and apparatus for bonding wafer to wafer tape
JPH1140520A (en) * 1997-07-23 1999-02-12 Toshiba Corp Method of dividing wafer and manufacture of semiconductor device
JP3602943B2 (en) * 1997-07-25 2004-12-15 シャープ株式会社 Semiconductor wafer grinding machine
JP3275299B2 (en) * 1998-01-19 2002-04-15 株式会社東京精密 Dicing apparatus and dressing method for cutting blade
JPH11307488A (en) * 1998-04-24 1999-11-05 Denso Corp Semiconductor device, its manufacture, process guide and its processing device
US6142853A (en) * 1998-12-23 2000-11-07 Lucent Technologies, Inc. Method and apparatus for holding laser wafers during a fabrication process to minimize breakage
US6153536A (en) * 1999-03-04 2000-11-28 International Business Machines Corporation Method for mounting wafer frame at back side grinding (BSG) tool
US6344414B1 (en) * 1999-04-30 2002-02-05 International Business Machines Corporation Chemical-mechanical polishing system having a bi-material wafer backing film assembly
US6468135B1 (en) * 1999-04-30 2002-10-22 International Business Machines Corporation Method and apparatus for multiphase chemical mechanical polishing
US6431957B1 (en) * 2000-01-25 2002-08-13 Parker-Hannifin Corporation Directional flow control valve with recirculation for chemical-mechanical polishing slurries
JP2003179006A (en) * 2002-09-20 2003-06-27 Toshiba Corp Wafer dividing method and method of manufacturing semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04158549A (en) * 1990-10-22 1992-06-01 Matsushita Electron Corp Exfoliating method of semiconductor chip
JPH08107088A (en) * 1994-10-04 1996-04-23 Fujitsu Ltd Manufacture of semiconductor device
JP2000294603A (en) * 1999-04-06 2000-10-20 Toshiba Corp Electronic parts mounting apparatus

Also Published As

Publication number Publication date
DE10124739A1 (en) 2002-04-04
US20010049256A1 (en) 2001-12-06
US20030181150A1 (en) 2003-09-25
JP2001345300A (en) 2001-12-14

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