RU2488188C2 - Способ и устройство нанесения нанорисунка на большие площади - Google Patents
Способ и устройство нанесения нанорисунка на большие площади Download PDFInfo
- Publication number
- RU2488188C2 RU2488188C2 RU2010134893/28A RU2010134893A RU2488188C2 RU 2488188 C2 RU2488188 C2 RU 2488188C2 RU 2010134893/28 A RU2010134893/28 A RU 2010134893/28A RU 2010134893 A RU2010134893 A RU 2010134893A RU 2488188 C2 RU2488188 C2 RU 2488188C2
- Authority
- RU
- Russia
- Prior art keywords
- substrate
- cylinder
- mask
- radiation
- rotatable
- Prior art date
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1186108P | 2008-01-22 | 2008-01-22 | |
US61/011,861 | 2008-01-22 | ||
PCT/US2008/012901 WO2009094009A1 (en) | 2008-01-22 | 2008-11-18 | Large area nanopatterning method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
RU2010134893A RU2010134893A (ru) | 2012-02-27 |
RU2488188C2 true RU2488188C2 (ru) | 2013-07-20 |
Family
ID=40901352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2010134893/28A RU2488188C2 (ru) | 2008-01-22 | 2008-11-18 | Способ и устройство нанесения нанорисунка на большие площади |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP2238608A4 (zh) |
JP (1) | JP5102879B2 (zh) |
KR (1) | KR20110008159A (zh) |
CN (2) | CN101911249A (zh) |
AU (1) | AU2008348353A1 (zh) |
CA (1) | CA2709718A1 (zh) |
MX (1) | MX2010007954A (zh) |
RU (1) | RU2488188C2 (zh) |
TW (1) | TWI518027B (zh) |
WO (1) | WO2009094009A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2593463C2 (ru) * | 2013-12-23 | 2016-08-10 | Станислав Викторович Хартов | Способ получения проводящих сетчатых микро- и наноструктур и структура для его реализации |
RU2809344C1 (ru) * | 2023-01-27 | 2023-12-11 | Альберт Георгиевич Битуев | Способ изготовления микросхем |
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FR2871366A1 (fr) | 2004-06-09 | 2005-12-16 | Ceravic Soc Par Actions Simpli | Implant expansible prothetique osseux |
WO2008153674A1 (en) | 2007-06-09 | 2008-12-18 | Boris Kobrin | Method and apparatus for anisotropic etching |
US8518633B2 (en) | 2008-01-22 | 2013-08-27 | Rolith Inc. | Large area nanopatterning method and apparatus |
US8192920B2 (en) | 2008-04-26 | 2012-06-05 | Rolith Inc. | Lithography method |
US8334217B2 (en) | 2008-06-09 | 2012-12-18 | Rolith Inc. | Material deposition over template |
CN101692151B (zh) * | 2009-09-17 | 2011-12-28 | 复旦大学 | 一种基于软模板纳米压印技术的硅纳米线制作方法 |
US9465296B2 (en) * | 2010-01-12 | 2016-10-11 | Rolith, Inc. | Nanopatterning method and apparatus |
CA2786489A1 (en) * | 2010-01-12 | 2011-07-21 | Rolith, Inc. | Nanopatterning method and apparatus |
CN101846880B (zh) * | 2010-05-12 | 2012-05-30 | 上海交通大学 | 激发表面等离子体的纳米光刻方法 |
AT510217B1 (de) * | 2010-08-13 | 2013-12-15 | Hueck Folien Gmbh | Verfahren zur partiellen mattierung von uv-lackschichten |
EP2609467A4 (en) * | 2010-08-23 | 2014-07-30 | Rolith Inc | MASK FOR NEAR FIELD LITHOGRAPHY AND ITS MANUFACTURE |
US9187839B2 (en) * | 2010-10-07 | 2015-11-17 | Michael Sheehy | Process for the manufacture of sealed anodized aluminum components |
CN102169819B (zh) * | 2011-01-14 | 2013-01-30 | 中国科学院物理研究所 | 一种制备纳米金属结构的方法 |
WO2013049367A2 (en) * | 2011-09-30 | 2013-04-04 | Rolith, Inc. | Plasmonic lithography using phase mask |
KR101260221B1 (ko) * | 2011-12-01 | 2013-05-06 | 주식회사 엘지화학 | 마스크 |
US9720330B2 (en) * | 2012-04-17 | 2017-08-01 | The Regents Of The University Of Michigan | Methods for making micro- and nano-scale conductive grids for transparent electrodes and polarizers by roll to roll optical lithography |
WO2013165915A1 (en) * | 2012-05-02 | 2013-11-07 | Rolith,Inc. | Cylindrical polymer mask and method of fabrication |
US9782917B2 (en) | 2013-01-31 | 2017-10-10 | Metamaterial Technologies Usa, Inc. | Cylindrical master mold and method of fabrication |
US9481112B2 (en) | 2013-01-31 | 2016-11-01 | Metamaterial Technologies Usa, Inc. | Cylindrical master mold assembly for casting cylindrical masks |
US20150336301A1 (en) | 2012-05-02 | 2015-11-26 | Rolith, Inc. | Cylindrical polymer mask and method of fabrication |
CN102759855A (zh) * | 2012-07-17 | 2012-10-31 | 西安交通大学 | 一种单码道绝对式光栅尺辊压印模具制造方法 |
TWI474432B (zh) * | 2012-11-15 | 2015-02-21 | Lextar Electronics Corp | 晶粒定位裝置、具有晶粒定位裝置的晶粒定位系統與發光二極體顯示板的晶粒定位方法 |
US9244356B1 (en) | 2014-04-03 | 2016-01-26 | Rolith, Inc. | Transparent metal mesh and method of manufacture |
KR101636696B1 (ko) | 2014-05-23 | 2016-07-06 | 연세대학교 산학협력단 | 플렉서블 나노박막 광구조를 이용하는 가변 대면적 나노이미징 광학헤드 및 이미징 장치 |
WO2015183243A1 (en) | 2014-05-27 | 2015-12-03 | Rolith, Inc. | Anti-counterfeiting features and methods of fabrication and detection |
KR102252049B1 (ko) * | 2014-08-04 | 2021-05-18 | 삼성디스플레이 주식회사 | 노광용 마스크, 이의 제조 방법 및 이를 이용한 기판의 제조 방법 |
KR102240761B1 (ko) | 2015-01-29 | 2021-04-15 | 삼성디스플레이 주식회사 | 가변 마스크 |
JP6808155B2 (ja) * | 2015-08-19 | 2021-01-06 | 国立大学法人 東京大学 | 母型の製造方法 |
TWI579640B (zh) * | 2015-10-15 | 2017-04-21 | 許銘案 | 薄膜光罩、貼合輔具、貼合與曝光輔助裝置及將一薄膜光罩貼合於一曲面基板的方法 |
CN106773531B (zh) * | 2017-01-03 | 2020-06-16 | 京东方科技集团股份有限公司 | 一种纳米压印装置中的压印滚轮及纳米压印装置 |
CN106547044B (zh) * | 2017-01-24 | 2019-03-01 | 深圳市华星光电技术有限公司 | 一种偏光片的加工设备及制造方法 |
CN106647192A (zh) * | 2017-03-10 | 2017-05-10 | 深圳市华星光电技术有限公司 | 曝光设备 |
CN109390263A (zh) * | 2017-08-07 | 2019-02-26 | 财团法人工业技术研究院 | 元件扩距转移方法及实施此转移方法的设备 |
CN109901362B (zh) * | 2017-12-11 | 2022-04-19 | 中国科学院光电技术研究所 | 二次成像光学光刻方法和设备 |
EP3732047A4 (en) * | 2017-12-29 | 2021-09-29 | 3M Innovative Properties Company | PATTERNED NON-FLAT NANOSTRUCTURED SURFACE AND PRINTING PROCESSES TO PRODUCE SUCH SURFACE |
KR102096606B1 (ko) * | 2018-08-29 | 2020-04-02 | 부산대학교 산학협력단 | 실린더 표면의 나노구조 임프린트를 위한 소프트 몰드 제조 및 이를 이용한 나노임프린트 공정 방법 |
GB2576922B (en) * | 2018-09-06 | 2021-10-27 | Stensborg As | An optical engine for an imprinter |
CN109668631B (zh) * | 2018-12-11 | 2021-06-01 | 中国科学院光电技术研究所 | 一种大面积、低成本的超导纳米线单光子探测器的制备方法 |
CN111807320B (zh) * | 2019-04-10 | 2024-07-09 | 青岛九环新越新能源科技股份有限公司 | 用于轧制纳米尺度孔结构材料的轧辊及轧辊组和轧制生产线 |
TWI765276B (zh) * | 2020-06-12 | 2022-05-21 | 光群雷射科技股份有限公司 | 透鏡的轉印式製造方法及透鏡轉印層的製造方法 |
Citations (10)
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US5425848A (en) * | 1993-03-16 | 1995-06-20 | U.S. Philips Corporation | Method of providing a patterned relief of cured photoresist on a flat substrate surface and device for carrying out such a method |
US5865978A (en) * | 1997-05-09 | 1999-02-02 | Cohen; Adam E. | Near-field photolithographic masks and photolithography; nanoscale patterning techniques; apparatus and method therefor |
US5928815A (en) * | 1997-11-14 | 1999-07-27 | Martin; Joseph | Proximity masking device for near-field optical lithography |
US6045980A (en) * | 1995-09-29 | 2000-04-04 | Leybold Systems Gmbh | Optical digital media recording and reproduction system |
WO2003001869A2 (en) * | 2001-06-29 | 2003-01-09 | California Institute Of Technology | Method and apparatus for use of plasmon printing in near-field lithography |
RU2214359C1 (ru) * | 2002-09-05 | 2003-10-20 | Санкт-Петербургский государственный институт точной механики и оптики (технический университет) | Способ формирования решетки нанокластеров кремния на структурированной подложке |
US20060014108A1 (en) * | 2004-06-28 | 2006-01-19 | Canon Kabushiki Kaisha | Resist pattern forming method based on near-field exposure, and substrate processing method and device manufacturing method using the resist pattern forming method |
US7274998B2 (en) * | 2005-09-30 | 2007-09-25 | Intel Corporation | Near-field photo-lithography using nano light emitting diodes |
TW200738272A (en) * | 2005-11-23 | 2007-10-16 | Coca Cola Co | Dental composition with high-potency sweetener |
US20070287100A1 (en) * | 2006-06-07 | 2007-12-13 | Canon Kabushiki Kaisha | Near-field exposure method |
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2008
- 2008-11-18 JP JP2010543093A patent/JP5102879B2/ja active Active
- 2008-11-18 WO PCT/US2008/012901 patent/WO2009094009A1/en active Application Filing
- 2008-11-18 CN CN2008801245193A patent/CN101911249A/zh active Pending
- 2008-11-18 MX MX2010007954A patent/MX2010007954A/es not_active Application Discontinuation
- 2008-11-18 EP EP08871196A patent/EP2238608A4/en not_active Withdrawn
- 2008-11-18 TW TW097144514A patent/TWI518027B/zh not_active IP Right Cessation
- 2008-11-18 KR KR1020107018711A patent/KR20110008159A/ko active Search and Examination
- 2008-11-18 CA CA2709718A patent/CA2709718A1/en not_active Abandoned
- 2008-11-18 CN CN201510644135.6A patent/CN105171985A/zh active Pending
- 2008-11-18 RU RU2010134893/28A patent/RU2488188C2/ru not_active IP Right Cessation
- 2008-11-18 AU AU2008348353A patent/AU2008348353A1/en not_active Abandoned
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US20060014108A1 (en) * | 2004-06-28 | 2006-01-19 | Canon Kabushiki Kaisha | Resist pattern forming method based on near-field exposure, and substrate processing method and device manufacturing method using the resist pattern forming method |
US7274998B2 (en) * | 2005-09-30 | 2007-09-25 | Intel Corporation | Near-field photo-lithography using nano light emitting diodes |
TW200738272A (en) * | 2005-11-23 | 2007-10-16 | Coca Cola Co | Dental composition with high-potency sweetener |
US20070287100A1 (en) * | 2006-06-07 | 2007-12-13 | Canon Kabushiki Kaisha | Near-field exposure method |
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Choi et al. Fluorinated Organic-inorganic Hibrid Mold as a New Stamp for Nanoimprint and Soft Lithography. Langmur 2005, p.9390-9392. * |
Hua Tan et al. Roller nanoimprint lithography. J. Vac. Sci. Technol. В 16(6), Nov/Dec 1998, p.3926-3928. * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2593463C2 (ru) * | 2013-12-23 | 2016-08-10 | Станислав Викторович Хартов | Способ получения проводящих сетчатых микро- и наноструктур и структура для его реализации |
RU2809344C1 (ru) * | 2023-01-27 | 2023-12-11 | Альберт Георгиевич Битуев | Способ изготовления микросхем |
Also Published As
Publication number | Publication date |
---|---|
TWI518027B (zh) | 2016-01-21 |
CN105171985A (zh) | 2015-12-23 |
CN101911249A (zh) | 2010-12-08 |
AU2008348353A1 (en) | 2009-07-30 |
KR20110008159A (ko) | 2011-01-26 |
WO2009094009A1 (en) | 2009-07-30 |
MX2010007954A (es) | 2010-11-05 |
JP5102879B2 (ja) | 2012-12-19 |
EP2238608A4 (en) | 2012-02-22 |
EP2238608A1 (en) | 2010-10-13 |
TW200932666A (en) | 2009-08-01 |
RU2010134893A (ru) | 2012-02-27 |
JP2011526069A (ja) | 2011-09-29 |
CA2709718A1 (en) | 2009-07-30 |
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