RO83564B - Dispozitiv pentru aplicarea unui aliaj de lipit pe placi conductoare - Google Patents
Dispozitiv pentru aplicarea unui aliaj de lipit pe placi conductoareInfo
- Publication number
- RO83564B RO83564B RO105263A RO10526381A RO83564B RO 83564 B RO83564 B RO 83564B RO 105263 A RO105263 A RO 105263A RO 10526381 A RO10526381 A RO 10526381A RO 83564 B RO83564 B RO 83564B
- Authority
- RO
- Romania
- Prior art keywords
- bath
- distance
- applying
- soldering
- alloy
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Prezenta inventie se refera la un dispozitiv pentru aplicarea unui aliaj de lipit pe placi conductoare de latimi si grosimi diferite si chiar pe placi conductoare, care nu sunt exact plane, putînd fi introduse cu o viteza mare de lucru în baia de aliaj de lipit, fara a fi necesara o pozitionare foarte exacta, placile conductoare în timpul miscarii lor putînd fi ghidate si sustinute foarte bine. Dispozitivul conform inventiei, prezinta un numar de elemente de ghidare în forma de bara, dispuse vertical în pereche fata în fata la o anumita distanta, elemente ce sunt amplasate distribuit în siruri fata în fata si în interiorul unui sir, la distanta fata în fata, pe latimea unei placi conductoare, elementele de ghidare întinzîndu-se în baia de aliaj, pîna în zona fundului perforat, si prezentînd cîte o portiune finala, care iese în sus peste oglinda baii, iar distanta dintre sirurile elementelor de ghidare micsorîndu-se avantajos în partea de jos, unde sunt legate împreuna cu capetele lor de jos.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH6760/80A CH656769A5 (de) | 1980-09-09 | 1980-09-09 | Vorrichtung zum aufbringen von lot auf leiterplatten. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RO83564A RO83564A (ro) | 1984-04-02 |
| RO83564B true RO83564B (ro) | 1984-04-30 |
Family
ID=4314614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RO105263A RO83564B (ro) | 1980-09-09 | 1981-09-09 | Dispozitiv pentru aplicarea unui aliaj de lipit pe placi conductoare |
Country Status (29)
| Country | Link |
|---|---|
| US (2) | US4414914A (ro) |
| EP (1) | EP0047441B1 (ro) |
| JP (1) | JPS592399B2 (ro) |
| KR (1) | KR860000414B1 (ro) |
| AR (1) | AR229100A1 (ro) |
| AT (1) | ATE14691T1 (ro) |
| AU (1) | AU545145B2 (ro) |
| BR (1) | BR8105766A (ro) |
| CA (1) | CA1167978A (ro) |
| CH (1) | CH656769A5 (ro) |
| CS (1) | CS253562B2 (ro) |
| DD (1) | DD201747A5 (ro) |
| DE (1) | DE3171701D1 (ro) |
| ES (1) | ES8302505A1 (ro) |
| GB (1) | GB2083395B (ro) |
| HK (1) | HK75785A (ro) |
| HU (1) | HU181826B (ro) |
| IE (1) | IE52592B1 (ro) |
| IL (1) | IL63738A (ro) |
| MX (1) | MX150893A (ro) |
| MY (1) | MY8600215A (ro) |
| PH (1) | PH19590A (ro) |
| PL (1) | PL135245B1 (ro) |
| RO (1) | RO83564B (ro) |
| SG (1) | SG44785G (ro) |
| SU (1) | SU1144615A3 (ro) |
| TR (1) | TR21220A (ro) |
| YU (1) | YU41986B (ro) |
| ZA (1) | ZA816059B (ro) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4541358A (en) * | 1983-11-28 | 1985-09-17 | The Htc Corporation | Method and apparatus for solder removal |
| US4608941A (en) * | 1985-01-10 | 1986-09-02 | Teledyne Electro-Mechanisms | Apparatus for soldering printed circuit panels |
| JPS625651A (ja) * | 1985-03-28 | 1987-01-12 | Senjiyu Kinzoku Kogyo Kk | 微細構造の被めっき部分のめっき方法およびそのための支持装置 |
| US4637541A (en) * | 1985-06-28 | 1987-01-20 | Unit Industries, Inc. | Circuit board soldering device |
| US4776508A (en) * | 1985-06-28 | 1988-10-11 | Unit Design Inc. | Electronic component lead tinning device |
| US4676426A (en) * | 1986-03-10 | 1987-06-30 | Ibm Corp. | Solder leveling technique |
| US4745004A (en) * | 1987-01-08 | 1988-05-17 | Schwerin Thomas E | Method and apparatus for transporting circuit or other work units being processed |
| JPS6420894U (ro) * | 1987-07-29 | 1989-02-01 | ||
| US5130164A (en) * | 1989-04-28 | 1992-07-14 | United Technologies Corporation | Solder-coating method |
| US5226964A (en) * | 1991-07-26 | 1993-07-13 | Monitriol, Inc. | Vertical solder coating apparatus |
| US5240738A (en) * | 1991-12-31 | 1993-08-31 | International Business Machines Corporation | Method of applying solder to a flexible circuit |
| NL1010214C2 (nl) * | 1998-09-29 | 2000-03-30 | Lantronic Bv | Inrichting voor het behandelen van printplaten. |
| JP2013509863A (ja) | 2009-11-03 | 2013-03-21 | エイチティージー モレキュラー ダイアグノスティクス， インコーポレイテッド | 定量的ヌクレアーゼ保護シークエンシング（ｑＮＰＳ） |
| CH706161A1 (de) | 2012-03-15 | 2013-10-15 | Oti Greentech Group Ag | Ölrückgewinnung. |
| US10362720B2 (en) | 2014-08-06 | 2019-07-23 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
| US10774600B2 (en) | 2016-08-19 | 2020-09-15 | Weatherford Technology Holdings, Llc | Slip monitor and control |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL88301C (ro) * | 1900-01-01 | |||
| US2999302A (en) * | 1961-09-12 | Certificate of correction | ||
| US1479783A (en) * | 1921-12-03 | 1924-01-08 | Frank F Bentley | Soldering apparatus |
| US1572953A (en) * | 1924-05-15 | 1926-02-16 | Pletsch Carl | Galvanizing apparatus |
| US2803216A (en) * | 1956-05-02 | 1957-08-20 | Itt | Apparatus for printed-circuit solder coating |
| US3416958A (en) * | 1966-02-25 | 1968-12-17 | Lear Siegler Inc | Alloy coating for electrical conductors |
| GB1207667A (en) * | 1966-11-03 | 1970-10-07 | Zeva Elek Zitats Ges Smits & L | Methods of and machines for soldering printed circuit panels |
| DE1807989C3 (de) * | 1968-11-06 | 1979-12-13 | Ersa, Ernst Sachs Kg Gmbh & Co, 6980 Wertheim | Vorrichtung zur Lötung elektrischer Verbindungen, insbesondere gedruckter Schaltungen |
| US3606132A (en) * | 1970-02-25 | 1971-09-20 | Mann Henry Inc | Soldering apparatus for printed circuit boards |
| GB1446636A (en) * | 1972-12-01 | 1976-08-18 | Xerox Corp | Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon |
| US3795358A (en) * | 1972-12-11 | 1974-03-05 | Ibm | Immersion solder leveling apparatus using ultrasonic cavitation |
| US3825164A (en) * | 1972-12-11 | 1974-07-23 | Ibm | Apparatus for soldering printed circuit cards |
| US3924794A (en) * | 1973-08-14 | 1975-12-09 | Us Energy | Solder leveling process |
| US3865298A (en) * | 1973-08-14 | 1975-02-11 | Atomic Energy Commission | Solder leveling |
| US4083323A (en) * | 1975-08-07 | 1978-04-11 | Xerox Corporation | Pneumatic system for solder leveling apparatus |
| DE2836493C2 (de) * | 1978-08-21 | 1979-11-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Leiterplattenhalterung |
| US4333417A (en) * | 1979-12-13 | 1982-06-08 | Camp Neal H | Coating system |
-
1980
- 1980-09-09 CH CH6760/80A patent/CH656769A5/de not_active IP Right Cessation
-
1981
- 1981-08-27 AT AT81106652T patent/ATE14691T1/de not_active IP Right Cessation
- 1981-08-27 EP EP81106652A patent/EP0047441B1/de not_active Expired
- 1981-08-27 DE DE8181106652T patent/DE3171701D1/de not_active Expired
- 1981-09-01 ZA ZA816059A patent/ZA816059B/xx unknown
- 1981-09-01 GB GB8126439A patent/GB2083395B/en not_active Expired
- 1981-09-01 PH PH26131-AA patent/PH19590A/en unknown
- 1981-09-04 IL IL63738A patent/IL63738A/xx unknown
- 1981-09-04 YU YU2124/81A patent/YU41986B/xx unknown
- 1981-09-07 AR AR286669A patent/AR229100A1/es active
- 1981-09-08 PL PL1981232948A patent/PL135245B1/pl unknown
- 1981-09-08 MX MX189081A patent/MX150893A/es unknown
- 1981-09-08 IE IE2070/81A patent/IE52592B1/en unknown
- 1981-09-08 CA CA000385416A patent/CA1167978A/en not_active Expired
- 1981-09-08 DD DD81233134A patent/DD201747A5/de unknown
- 1981-09-08 ES ES505285A patent/ES8302505A1/es not_active Expired
- 1981-09-08 SU SU813337802A patent/SU1144615A3/ru active
- 1981-09-09 AU AU75076/81A patent/AU545145B2/en not_active Ceased
- 1981-09-09 RO RO105263A patent/RO83564B/ro unknown
- 1981-09-09 TR TR21220A patent/TR21220A/xx unknown
- 1981-09-09 JP JP56141119A patent/JPS592399B2/ja not_active Expired
- 1981-09-09 BR BR8105766A patent/BR8105766A/pt unknown
- 1981-09-09 US US06/300,971 patent/US4414914A/en not_active Expired - Fee Related
- 1981-09-09 HU HU812599A patent/HU181826B/hu unknown
- 1981-09-09 CS CS816650A patent/CS253562B2/cs unknown
- 1981-09-09 KR KR1019810003361A patent/KR860000414B1/ko active
-
1982
- 1982-09-30 US US06/431,093 patent/US4469716A/en not_active Expired - Fee Related
-
1985
- 1985-06-11 SG SG44785A patent/SG44785G/en unknown
- 1985-10-03 HK HK757/85A patent/HK75785A/xx unknown
-
1986
- 1986-12-30 MY MY215/86A patent/MY8600215A/xx unknown
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