KR970008385A - 폴리싱 패드 조정 - Google Patents
폴리싱 패드 조정 Download PDFInfo
- Publication number
- KR970008385A KR970008385A KR1019960026711A KR19960026711A KR970008385A KR 970008385 A KR970008385 A KR 970008385A KR 1019960026711 A KR1019960026711 A KR 1019960026711A KR 19960026711 A KR19960026711 A KR 19960026711A KR 970008385 A KR970008385 A KR 970008385A
- Authority
- KR
- South Korea
- Prior art keywords
- polishing pad
- cutting means
- article
- cutting
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims 2
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
본 발명은 상부 표면에 고정된 폴리싱 패드를 갖는 회전 연마 휘일 및 폴리싱 패드와 접촉하여 연마되는 제품을 지지하기 위한 또한 제품에 소정의 압력을 작용시키기 위한 수직으로 이동가능한 캐리어 요소를 포함하고 있는 제품을 연마하기 위한 장치에 관한 것이다. 캐리어와 함께 이동가능한 그리고 접촉에 의해 폴리싱 패드를 조정하기 위해 원형 형상으로 배치된 절단 수단을 아래 표면상에 갖는 조정 요소가 캐리어에 작동가능하게 부착되어 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 패드 조정 수단을 포함하는 연마 장치를 도시한 개략적인 배면도이다.
Claims (10)
- 상부 표면에 고정된 폴리싱 패드를 갖는 회전 폴리싱 패드, 폴리싱 패드와 일정한 압력하에 접촉하여 연마되는 제품을 운반하기 위한 수직으로 이동할 수 있는 캐리어 요소, 및 접촉에 의해 폴리싱 패드를 조정하기 위한 원형 형상으로 배치된 절단 수단을 하부 표면상에 가진 캐리어 요소와 함께 이동할 수 있는 조정 요소를 포함하는 것을 특징으로 하는 제품을 연마하기 위한 장치.
- 제1항에 있어서, 조정 요소의 하부 표면은 절단 수단을 형성하는 날카로운 점에서 끝난다는 것을 특징으로 하는 제품을 연마하기 위한 장치.
- 제1항에 있어서, 조정 요소는 하부 주변을 따라 이격된 절단 부분이 제공된다는 것을 특징으로 하는 제품을 연마하기 위한 장치.
- 제1항에 있어서, 절단 수단은 조정 요소의 하부 표면에 고정된 단단한 절단 요소인 것을 특징으로 하는 제품을 연마하기 위한 장치.
- 제1항에 있어서, 절단 수단은 다이아몬드 입자인 것을 특징으로 하는 제품을 연마하기 위한 장치.
- 제1항에 있어서, 절단 수단은 절단 날을 포함하는 것을 특징으로 하는 제품을 연마하기 위한 장치.
- 제1항에 있어서, 절단 수단은 톱니 모양의 날인 것을 특징으로 하는 제품을 연마하기 위한 장치.
- 연마되는 제품을 일정 압력하에서 제품을 연마하기 위해 폴리싱 패드와 함께 상부 표면상에 덮여 있는 회전 연마 휘일과 접촉시키는 단계, 및 제품을 연마하면서 패드를 조정하기 위한 절단 수단을 가진 조정 요소와 패드를 접촉시키는 단계를 포함하는 것을 특징으로 하는 제품을 연마하기 위한 방법.
- 제8항에 있어서, 연마제 슬러리는 연마시 폴리싱 패드 및 제품사이에 도입되는 것을 특징으로 하는 제품을 연마하기 위한 방법.
- 제8항에 있어서, 조정 요소는 패드에 접촉하고 있는 동안 회전하는 것을 특징으로 하는 제품을 연마하기 위한 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/497,530 | 1995-07-03 | ||
US08/497,530 US5569062A (en) | 1995-07-03 | 1995-07-03 | Polishing pad conditioning |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970008385A true KR970008385A (ko) | 1997-02-24 |
Family
ID=23977234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960026711A KR970008385A (ko) | 1995-07-03 | 1996-07-02 | 폴리싱 패드 조정 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5569062A (ko) |
JP (1) | JPH09103954A (ko) |
KR (1) | KR970008385A (ko) |
DE (1) | DE19626048A1 (ko) |
GB (1) | GB2302830A (ko) |
MY (1) | MY113867A (ko) |
SG (1) | SG44959A1 (ko) |
TW (1) | TW348088B (ko) |
Families Citing this family (84)
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US8647172B2 (en) | 2010-03-12 | 2014-02-11 | Wayne O. Duescher | Wafer pads for fixed-spindle floating-platen lapping |
US8500515B2 (en) * | 2010-03-12 | 2013-08-06 | Wayne O. Duescher | Fixed-spindle and floating-platen abrasive system using spherical mounts |
US8647170B2 (en) | 2011-10-06 | 2014-02-11 | Wayne O. Duescher | Laser alignment apparatus for rotary spindles |
US8758088B2 (en) | 2011-10-06 | 2014-06-24 | Wayne O. Duescher | Floating abrading platen configuration |
US8602842B2 (en) * | 2010-03-12 | 2013-12-10 | Wayne O. Duescher | Three-point fixed-spindle floating-platen abrasive system |
US8740668B2 (en) * | 2010-03-12 | 2014-06-03 | Wayne O. Duescher | Three-point spindle-supported floating abrasive platen |
US8641476B2 (en) | 2011-10-06 | 2014-02-04 | Wayne O. Duescher | Coplanar alignment apparatus for rotary spindles |
US8647171B2 (en) * | 2010-03-12 | 2014-02-11 | Wayne O. Duescher | Fixed-spindle floating-platen workpiece loader apparatus |
US8696405B2 (en) | 2010-03-12 | 2014-04-15 | Wayne O. Duescher | Pivot-balanced floating platen lapping machine |
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US8337280B2 (en) | 2010-09-14 | 2012-12-25 | Duescher Wayne O | High speed platen abrading wire-driven rotary workholder |
US8430717B2 (en) | 2010-10-12 | 2013-04-30 | Wayne O. Duescher | Dynamic action abrasive lapping workholder |
US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
US9174323B2 (en) * | 2012-11-07 | 2015-11-03 | Intermolecular, Inc. | Combinatorial tool for mechanically-assisted surface polishing and cleaning |
JP6749755B2 (ja) * | 2015-11-30 | 2020-09-02 | 富士紡ホールディングス株式会社 | 研磨用保持具及びその製造方法 |
US10786885B2 (en) | 2017-01-20 | 2020-09-29 | Applied Materials, Inc. | Thin plastic polishing article for CMP applications |
US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
US11717936B2 (en) | 2018-09-14 | 2023-08-08 | Applied Materials, Inc. | Methods for a web-based CMP system |
US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH079896B2 (ja) * | 1988-10-06 | 1995-02-01 | 信越半導体株式会社 | 研磨装置 |
US5119599A (en) * | 1990-06-04 | 1992-06-09 | Clipper Diamond Tool Co., Inc. | Diamond dressing unit for grinding wheels |
NL9100023A (nl) * | 1991-01-09 | 1992-08-03 | Crown Gear Bv | Slijpschijf voor het vervaardigen van kroonwielen, alsmede werkwijze voor het vervaardigen van een dergelijke slijpschijf. |
US5216843A (en) * | 1992-09-24 | 1993-06-08 | Intel Corporation | Polishing pad conditioning apparatus for wafer planarization process |
US5433650A (en) * | 1993-05-03 | 1995-07-18 | Motorola, Inc. | Method for polishing a substrate |
US5456627A (en) * | 1993-12-20 | 1995-10-10 | Westech Systems, Inc. | Conditioner for a polishing pad and method therefor |
US5486131A (en) * | 1994-01-04 | 1996-01-23 | Speedfam Corporation | Device for conditioning polishing pads |
JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
-
1995
- 1995-07-03 US US08/497,530 patent/US5569062A/en not_active Expired - Lifetime
-
1996
- 1996-01-26 TW TW085100957A patent/TW348088B/zh active
- 1996-06-24 JP JP16279696A patent/JPH09103954A/ja active Pending
- 1996-06-24 SG SG1996010139A patent/SG44959A1/en unknown
- 1996-06-28 DE DE19626048A patent/DE19626048A1/de not_active Withdrawn
- 1996-07-01 MY MYPI96002704A patent/MY113867A/en unknown
- 1996-07-02 GB GB9613871A patent/GB2302830A/en not_active Withdrawn
- 1996-07-02 KR KR1019960026711A patent/KR970008385A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPH09103954A (ja) | 1997-04-22 |
US5569062A (en) | 1996-10-29 |
GB9613871D0 (en) | 1996-09-04 |
MY113867A (en) | 2002-06-29 |
TW348088B (en) | 1998-12-21 |
GB2302830A (en) | 1997-02-05 |
DE19626048A1 (de) | 1997-01-09 |
SG44959A1 (en) | 1997-12-19 |
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