KR960701117A - 인-개질된 에폭시 수지, 이들의 제조방법 및 이들의 용도(phosphorus-modified epoxy resins, process for producing them and their use) - Google Patents
인-개질된 에폭시 수지, 이들의 제조방법 및 이들의 용도(phosphorus-modified epoxy resins, process for producing them and their use) Download PDFInfo
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- KR960701117A KR960701117A KR1019950703896A KR19950703896A KR960701117A KR 960701117 A KR960701117 A KR 960701117A KR 1019950703896 A KR1019950703896 A KR 1019950703896A KR 19950703896 A KR19950703896 A KR 19950703896A KR 960701117 A KR960701117 A KR 960701117A
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- epoxy resin
- modified epoxy
- phosphorus
- phosphor
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- 238000000034 method Methods 0.000 title claims 13
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title 2
- 239000003822 epoxy resin Substances 0.000 claims abstract 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract 24
- 150000001875 compounds Chemical class 0.000 claims abstract 8
- 239000004593 Epoxy Substances 0.000 claims abstract 5
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims abstract 4
- 125000003700 epoxy group Chemical group 0.000 claims abstract 4
- 150000002148 esters Chemical class 0.000 claims abstract 4
- 229920005989 resin Polymers 0.000 claims abstract 4
- 239000011347 resin Substances 0.000 claims abstract 4
- 238000004519 manufacturing process Methods 0.000 claims abstract 3
- 238000000576 coating method Methods 0.000 claims abstract 2
- 150000002118 epoxides Chemical class 0.000 claims 6
- 239000004215 Carbon black (E152) Substances 0.000 claims 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- 229930195733 hydrocarbon Natural products 0.000 claims 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 3
- 150000008064 anhydrides Chemical class 0.000 claims 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims 3
- 229910052698 phosphorus Inorganic materials 0.000 claims 3
- 239000011574 phosphorus Substances 0.000 claims 3
- 238000006243 chemical reaction Methods 0.000 claims 2
- 239000000470 constituent Substances 0.000 claims 2
- 239000003085 diluting agent Substances 0.000 claims 2
- 150000002989 phenols Chemical class 0.000 claims 2
- XNQULTQRGBXLIA-UHFFFAOYSA-O phosphonic anhydride Chemical compound O[P+](O)=O XNQULTQRGBXLIA-UHFFFAOYSA-O 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000004870 electrical engineering Methods 0.000 claims 1
- 150000002170 ethers Chemical class 0.000 claims 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 1
- 238000005984 hydrogenation reaction Methods 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 238000005809 transesterification reaction Methods 0.000 claims 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
- C08G59/1422—Polycondensates modified by chemical after-treatment with inorganic compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/14—Macromolecular materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (26)
- (A) 분자당 2개 이상의 에폭시가를 가지는 폴리에폭시 화합물 및 (B) 포스핀산 및/또는 포스폰산 무수물로부터 유도된 구조 단위를 포함하고, 0 내지 1몰/100g의 에폭시가를 가지는 인-개질된 에폭시 수지.
- 제1항에 있어서, 인 함량이 수지를 기준으로 하여 0.5 내지 13중량%인 인-개질된 에폭시 수지.
- 제1항 떠는 제2항에 있어서, 에폭시가가 0.02 내지 1몰/100g인 인-개질된 에폭시 수지
- 제1항 내지 제3항 중 어느 한 항에 있어서, 평균적으로 분자당 1개 이상의 에폭시기를 함유하는 인-개질된 에폭시 수지.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 수지의 평균 분자량 Mn이 200 내지 5,000인 인-개질된 에폭시 수지.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 구성 블록 (A)의 평균 분자량 Mn이 150 내지 4,000인 인-개질된 에폭시 수지
- 제1항 내지 제6항 중 어느 한 항에 있어서, 상기 구성 블록 (A)가 분자당 2 내지 6개의 에폭시기를 가지는 폴리에폭시 화합물로부터 유도되는 인-개질된 에폭시 수지
- 제1항 내지 제7항 중 어느 한 항에 있어서, 상기 구성 블록 (A)가 다가 페놀, 이들 페놀의 수소화반응 생성물 및/또는 노볼락을 가재로 하는 폴리글리시딜 에테르로부터 유도되는 인-개질된 에폭시 수지.
- 제1항 내지 제8항 중 어느 한 항에 있어서, 상기 구조 단위 (B)가 하기 일반식(Ⅰ) 및/또는 (Ⅱ)의 포스핀산 무수물로부터 유도되는 인-개질된 에폭시 수지.상기 식에서, R 및 R¹은 각각 독립적으로 탄소 원자를 1 내지 20개, 바람직하게는 1 내지 6개 가지는 탄화수소 라디칼이고; A는 탄소 원자를 1내지 10개, 바람직하게는 1내지 6개 가지는 2가의 탄화수소 라디칼이고; 및 y는 1이상, 바람직하게는 1 내지 100의 정수이다.
- 제9항에 있어서, 상기 구조 단위(B)가 택일적으로 또는 부가적으로 하기 일반식(Ⅲ)의 포스핀산 무수물로부터 유도되는 인-개질된 에폭시 수지.상기 식에서, R¹은 일반식(Ⅰ) 및 (Ⅱ)의 R/R¹에서 정의한 바와 같고;z는 3이상, 바람직하게는 3 내지 100이다.
- 제1항 내지 제10항 중 어느 한 항에 있어서, 하기 일반식(Ⅳ),(Ⅴ) 및/또는 (Ⅵ)을 가지는 인-개질된 에폭시 수지:상기 식에서, R, R¹및 R³은 상기 일반식(Ⅰ) 내지 (Ⅲ)에서 정의한 바와 같고;R²는 글리시딜 기가 없는 폴리에폭시 화합물의 라디칼이고;n은 1 내지 5의 정수이며;m은 1 내지 5의 정수이며; 그의 합 n+m은 2 내지 6의 정수이어야 한다.
- 제11항에 있어서, 본질적으로 일반식(Ⅳ)만을 가지는 인-개질된 에폭시 수지.
- 불황성 희석제중에서 또는 희석제/용매의 부재하에 폴리에폭시 화합물(A)와 포스핀산 및/도는 포스핀산 무수물(B)를 반응시키는 것을 포함하는, 제1항 내지 제12항 중 어느 한 항에 따른 인-개질된 에폭시 수지를 제조하는 방법.
- 제13항에 있어서, 상기 반응을 -20 내지 130℃에서 수행되는 방법.
- 제13항 또는 제14항에 있어서,폴리에폭시 화합물과 포스핀산 및/또는 포스폰산 무수물의 당량비가 1:0.1 내지 1:0.8인 방법.
- (A) 분자당 2개 이상의ㅣ 에폭시기를 가지는 폴리에폭시 화합물 및 (C) 80℃ 이상의 온도에서 포스폰산 반에스테르에서 유도되는 구조 단위를 포함하는 인-개질된 에폭사이드(Ⅳ)에서 알코올을 제거함을 포함하고, 구조 단위(B)는 포스폰산 반에스테르로 부터만 유도되는, 제1항 내지 제12항 중 어느 한 항에 딴 인-개질된 에폭시 수지를 제조하는 방법.
- 제16항에 있어서, 80 내지 250℃, 바람직하게는 100 내지 150℃의 온도에서 상기 알코올의 제거반응을 수행하는 방법.
- 제16항 내지 제17항에 있어서, 낮은 압력, 바람직하게는 100 내지 0.1torr의 압력하에서 상기 알코올의 제거반응을 수행하는 방법.
- 제16항 내지 제19항 중 어느 한 항에 있어서, 상기 인-개질된 에폭시 수지(Ⅳ)의 인 함량이 수지를 기준으로 0.5 내지 13중량%인 방법.
- 제16항 내지 제19항 중 어느 한 항에 있어서, 상기 인-개질된 에폭시 수지(Ⅳ)의 에폭시가가 0.02 내지 1몰/100g인 방법.
- 제16항 내지 제20항 중 어느 한 항에 있어서, 상기 인-개질된 에폭시 수지(Ⅳ)의 평균 분자량 Mu이 200 내지 5000인 방법.
- 제16항 내지 제21항 중 어느 한 항에 있어서, 에스테르 교환반응 촉매제의 존재하에서 알코올의 제거반응을 수행하는 방법.
- 제16항 내지 제22항중 어느 한 항에 있어서, 상기 인-개질된 에폭시 수지(Ⅳ)의 구성 블록(B)가 하기 일반식(Ⅹ)의 포스폰산 반에스테르로부터 유도되는 방법.상기 식에서, R6는 탄소 원자를 1 내지 20개, 바람직하게는 1 내지 6개 가지는 탄화수소 라디칼이고; 및 R7은 탄소 원자를 1 내지 10개, 바람직하게는 1 내지 4개 가지는 탄화수소 라디칼이다.
- 제23항에 있어서, R6및 R7이 각각 알킬 라디칼인 방법.
- 바람직하게는 전기 공학 분야에서 성형품, 코팅제 또는 라미네이트를 제조하기 위한, 제1항 내지 제12항 중 어느 한 항에 다른 인-개질된 에폭시 수지 또는 제13항 내지 제24항 중 어느 한 항에 따라 제조된 이-개질된 에폭시 수지의 용도.
- 제1항 내지 제12항 중 어느 한 항에 따른 인-개질된 에폭시 수지 또는 제13항 내지 제24항 중 어느 한 항에 따라 제조된 인-개질된 에폭시 수지를 사용하여 제조한 성형품, 코팅제 또는 라미네이트.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19934308185 DE4308185A1 (de) | 1993-03-15 | 1993-03-15 | Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung sowie deren Verwendung |
DEP4308185.1 | 1993-03-15 | ||
DEP4404906.4 | 1994-02-16 | ||
DE19944404906 DE4404906A1 (de) | 1994-02-16 | 1994-02-16 | Verfahren zur Herstellung phosphormodifizierter Epoxidharze |
PCT/EP1994/000748 WO1994021704A1 (de) | 1993-03-15 | 1994-03-10 | Phosphormodifizierte epoxidharze, verfahren zu ihrer herstellung sowie deren verwendung |
Publications (1)
Publication Number | Publication Date |
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KR960701117A true KR960701117A (ko) | 1996-02-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019950703896A KR960701117A (ko) | 1993-03-15 | 1994-03-10 | 인-개질된 에폭시 수지, 이들의 제조방법 및 이들의 용도(phosphorus-modified epoxy resins, process for producing them and their use) |
Country Status (13)
Country | Link |
---|---|
US (1) | US5756638A (ko) |
EP (1) | EP0689558A1 (ko) |
JP (1) | JPH08507812A (ko) |
KR (1) | KR960701117A (ko) |
CN (1) | CN1051325C (ko) |
CA (1) | CA2158361A1 (ko) |
CZ (1) | CZ240195A3 (ko) |
FI (1) | FI954291A0 (ko) |
HU (1) | HU214503B (ko) |
PL (1) | PL310628A1 (ko) |
RU (1) | RU2129570C1 (ko) |
SG (1) | SG72674A1 (ko) |
WO (1) | WO1994021704A1 (ko) |
Families Citing this family (26)
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DE4427456A1 (de) * | 1994-08-03 | 1996-02-08 | Siemens Ag | Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung und ihre Verwendung |
TW294694B (ko) * | 1994-09-09 | 1997-01-01 | Siemens Ag | |
DE4447277A1 (de) | 1994-12-30 | 1996-07-04 | Hoechst Ag | Stabilisierte, phosphormodifizierte Epoxidharze und ihre Verwendung |
DE19543890A1 (de) * | 1995-11-24 | 1997-05-28 | Siemens Ag | Flammwidrige Polyamide |
DE19608613C2 (de) * | 1996-03-06 | 2002-01-17 | Celanese Ventures Gmbh | Lagerstabile, phosphormodifizierte Epoxidharze |
EP0799846B1 (de) * | 1996-04-01 | 2000-06-14 | Clariant GmbH | Phosphormodifizierte Epoxid-harzmischungen aus Expoxid-harzen, phosphorhaltigen Verbindungen und einem Härter |
DE19613067C2 (de) * | 1996-04-01 | 1998-12-03 | Clariant Gmbh | Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung |
DE19613064C2 (de) * | 1996-04-01 | 1998-12-17 | Clariant Gmbh | Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, Verfahren zu ihrer Herstellung und ihre Verwendung |
DE19613063C2 (de) * | 1996-04-01 | 1998-09-17 | Clariant Gmbh | Phosphormodifizierte Epoxidharze und ein Verfahren zu ihrer Herstellung |
DE19613061C2 (de) * | 1996-04-01 | 1998-07-02 | Clariant Gmbh | Phosphormodifizierte Epoxidharze aus Epoxidharzen und phosphorhaltigen Verbindungen |
ATE271574T1 (de) | 1996-09-26 | 2004-08-15 | Siemens Ag | Epoxidharzmischungen |
EP1513890A1 (en) * | 2002-05-30 | 2005-03-16 | Dow Global Technologies Inc. | Halogen free ignition resistant thermoplastic resin compositions |
US20070221890A1 (en) | 2004-05-28 | 2007-09-27 | Joseph Gan | Phosphorus Containing Compounds Useful for Making Halogen-Free, Ignition-Resistant Polymer |
WO2008051901A2 (en) * | 2006-10-24 | 2008-05-02 | Akzo Nobel Coatings International B.V. | Non-stick coating composition |
US8323470B2 (en) * | 2007-08-15 | 2012-12-04 | Ppg Industries Ohio, Inc. | Electrodeposition coatings for use over aluminum substrates |
US8877029B2 (en) | 2007-08-15 | 2014-11-04 | Ppg Industries Ohio, Inc. | Electrodeposition coatings including a lanthanide series element for use over aluminum substrates |
EP2083030A1 (en) * | 2008-01-15 | 2009-07-29 | Cytec Surface Specialties Austria GmbH | Water-borne epoxy resin systems |
EP2385969A4 (en) * | 2009-01-06 | 2017-11-08 | Blue Cube IP LLC | Metallic compounds in non-brominated flame retardant epoxy resins |
US20110065870A1 (en) | 2009-09-11 | 2011-03-17 | Chemtura Corporation | Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins |
US20110065838A1 (en) | 2009-09-11 | 2011-03-17 | Chemtura Corporation | Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins |
DE102011077927A1 (de) * | 2011-06-21 | 2012-12-27 | Tesa Se | Verfahren zur reversiblen kovalenten Vernetzung von Klebemassen |
US9029437B2 (en) | 2011-09-14 | 2015-05-12 | Prc-Desoto International, Inc. | Coating/sealant systems, aqueous resinous dispersions, methods for making aqueous resinous dispersions, and methods of electrocoating |
US9181628B2 (en) | 2011-09-14 | 2015-11-10 | Prc-Desoto International, Inc. | Coating/sealant systems, aqueous resinous dispersions, and methods of electrocoating |
RU2573003C2 (ru) * | 2013-11-28 | 2016-01-20 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) | Эпоксивинилэфирная смола и огнестойкий полимерный композиционный материал на ее основе |
US9534108B2 (en) | 2015-03-13 | 2017-01-03 | Chemtura Corporation | Flame retardant epoxy resins comprising phosphorus containing flame retardants |
CN113166376A (zh) * | 2018-11-29 | 2021-07-23 | Dic株式会社 | 双液固化型环氧树脂组合物、固化物、纤维增强复合材料及成形品 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3585166A (en) * | 1969-06-11 | 1971-06-15 | Monsanto Co | Organic compositions containing esters,salts and acids of partial anhydrides of phosphine oxides |
DE2726478A1 (de) * | 1977-06-11 | 1978-12-14 | Hoechst Ag | Phosphor enthaltende polyaddukte und verfahren zu deren herstellung |
DE2908264A1 (de) * | 1979-03-02 | 1980-09-11 | Hoechst Ag | Verfahren zur herstellung von phosphin- und phosphonsaeureanhydriden |
US4952646A (en) * | 1989-07-20 | 1990-08-28 | Akzo America Inc. | Epoxy resin compositions containing a polyphosphoric/polyphosphonic anhydride curing agent |
DE4308187A1 (de) * | 1993-03-15 | 1994-09-22 | Siemens Ag | Epoxidharzmischungen |
-
1994
- 1994-03-10 RU RU95121631A patent/RU2129570C1/ru active
- 1994-03-10 SG SG1996008685A patent/SG72674A1/en unknown
- 1994-03-10 KR KR1019950703896A patent/KR960701117A/ko not_active Application Discontinuation
- 1994-03-10 US US08/525,531 patent/US5756638A/en not_active Expired - Fee Related
- 1994-03-10 CZ CZ952401A patent/CZ240195A3/cs unknown
- 1994-03-10 JP JP52060594A patent/JPH08507812A/ja active Pending
- 1994-03-10 CA CA 2158361 patent/CA2158361A1/en not_active Abandoned
- 1994-03-10 CN CN94191472A patent/CN1051325C/zh not_active Expired - Fee Related
- 1994-03-10 EP EP94911148A patent/EP0689558A1/de not_active Withdrawn
- 1994-03-10 HU HU9502640A patent/HU214503B/hu not_active IP Right Cessation
- 1994-03-10 PL PL31062894A patent/PL310628A1/xx unknown
- 1994-03-10 WO PCT/EP1994/000748 patent/WO1994021704A1/de not_active Application Discontinuation
-
1995
- 1995-09-13 FI FI954291A patent/FI954291A0/fi unknown
Also Published As
Publication number | Publication date |
---|---|
FI954291A (fi) | 1995-09-13 |
CN1119446A (zh) | 1996-03-27 |
HU9502640D0 (en) | 1995-11-28 |
JPH08507812A (ja) | 1996-08-20 |
US5756638A (en) | 1998-05-26 |
EP0689558A1 (de) | 1996-01-03 |
RU2129570C1 (ru) | 1999-04-27 |
FI954291A0 (fi) | 1995-09-13 |
PL310628A1 (en) | 1995-12-27 |
CN1051325C (zh) | 2000-04-12 |
CA2158361A1 (en) | 1994-09-29 |
HUT73148A (en) | 1996-06-28 |
HU214503B (hu) | 1998-03-30 |
SG72674A1 (en) | 2000-05-23 |
CZ240195A3 (en) | 1996-01-17 |
WO1994021704A1 (de) | 1994-09-29 |
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