KR930009720A

KR930009720A - Punching device and punching method using the same

Info

Publication number: KR930009720A
Application number: KR1019920019321A
Authority: KR
Inventors: 기요시 오꾸다
Original assignee: 요시무라 시로우; 가부시끼가이샤 세이꼬샤
Priority date: 1991-11-19
Filing date: 1992-10-21
Publication date: 1993-06-21
Also published as: KR960012098B1; JPH0811389B2; JPH05138595A; TW247881B

Abstract

본 발명은 화상 인식할 부분의 프린트 기판의 휘어짐을 확실하게 교정하여 극히 정도가 좋게 위치 검출을 할 수가 있다.Industrial Applicability The present invention can reliably correct the warpage of a printed board of a portion to be image-recognized and detect the position with an extremely high degree.

교정부재(15)에 의해 프린트 기판(W)의 위치 결정용 마크(M)의 부분을 눌러 프린트기판(W)의 휘어짐을 교정한 상태에서, 촬상 수단(21)에 의해 마크(M)를 촬영하고, 화상 처리 회로(26)에 의해 마크(M)의 중심 위치를 검출한다. 그래서 검출 결과에 기초하여 클램프 장치(22)에 의해 프린트 기판(W)을 이동시키고, 펀치(14)와 마크(M)의 중심을 일치시킨 후 가동측 금형(25)을 작동시켜 펀치(14)로써 마크(M)위치에 구멍내기를 한다.The mark M is photographed by the image pickup means 21 while the portion of the positioning mark M of the printed board W is pressed by the straightening member 15 to correct the warpage of the printed board W. FIG. Then, the center position of the mark M is detected by the image processing circuit 26. Thus, based on the detection result, the printed circuit board W is moved by the clamp device 22, the center of the punch 14 and the mark M are aligned, and then the movable side mold 25 is operated to punch the punch 14. To make a hole at the mark (M).

Description

Punching device and punching method using the same

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 따른 펀칭 장치의 초기상태를 도시한 요부 단면도.1 is a sectional view showing the principal parts of an initial state of a punching apparatus according to the present invention;

제2도는 본 발명에 따른 펀칭 장치의 블럭도.2 is a block diagram of a punching apparatus according to the present invention.

제3도는 본 발명에 따른 펀칭 장치의 화상인식 공정을 도시한 요부 단면도.3 is a sectional view showing the principal parts of the image recognition process of the punching apparatus which concerns on this invention.

제4도는 본 발명에 따른 펀칭장치의 구멍내기 공정을 도시한 요부단면도.4 is a sectional view showing the main parts of a punching process of the punching device according to the present invention.

제5도는 본 발명에 따른 구멍내기 방법의 플로우챠트.5 is a flowchart of a perforation method according to the present invention.

Claims

On the basis of the fixed side mold provided so as to face the printed board, the imaging means capable of photographing the positioning mark pre-formed on the printed board via the hole formed in the fixed side mold, and the imaging data from the scratch means. And a chemical conversion processing circuit for detecting the center position of the mark, and installed at the mark center position of the printed circuit board detected by the image processing circuit, provided to face the fixed side mold while sandwiching the printed board. A movable shaft mold having a cylindrical punch, a calibration member fitted to slide independently of the punch in a central hole of the punch, and driving means for driving the calibration member to abut the printed board. Punching device characterized in that equipped with.

The mark is picked up by the imaging means in a state where the bending of the printed board is corrected by pressing the printed board by the calibration member, and the image processing circuit is used to photograph the mark based on the imaging data from the imaging means. Detecting a center position, and matching the center of the punch with the center of the mark based on the detection result, and then operating the movable shaft mold to drill a hole in the mark position with the punch. The punching method using the punching apparatus of an item | term description.

※ Note: The disclosure is based on the initial application.