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Application filed by 안병훈, 이순일filedCritical안병훈
Priority to KR1019890014452ApriorityCriticalpatent/KR910007654A/en
Publication of KR910007654ApublicationCriticalpatent/KR910007654A/en
합성수지제 조립 접착 물체의 제조 방법Method of manufacturing a synthetic adhesive assembled object
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제3도는 (가), (나)는 본 발명의 조립 접착 실시예시 발췌 단면도.Figure 3 is a (a), (b) is a cross-sectional view taken in the assembly bonding embodiment of the present invention.
제4도는 본 발명의 접착재의 예시 단면도.4 is an exemplary cross-sectional view of the adhesive material of the present invention.
Claims (1)
철분말 또는 가성 분말과 제품 물체의 동질 합성수지로서 혼합 물체를 이루는 접착부 상태에 알맞는 접착때를 형성하여 이를 상측 부재와 하측부재의 조립 접착부에 배설하고 그 주위에 설치한 고주파 유도코일에 의한 가열 용융에 의해서 동일체에 가까운 상태로 접착하게 하는 합성수지제 조립 접착 물체의 제조 방법.As homogeneous resin of iron powder or caustic powder and product object, it forms a bonding time suitable for the bonding part which forms the mixed object, and it is heated and melted by high frequency induction coil installed around the upper and lower parts. A method for producing a granulated adhesive object made of synthetic resin, which is made to adhere in a state close to the same by means of a resin.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890014452A1989-10-071989-10-07
Method of manufacturing a synthetic adhesive assembled object
KR910007654A
(en)
Process for producing modified phenolic resin, molding material based on modified phenolic resin, and material for electrical or electronic parts and semiconductor sealant compounds each produced utilizing the molding material.