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KR900002671A - 리플로우 납땜장치 - Google Patents

리플로우 납땜장치 Download PDF

Info

Publication number
KR900002671A
KR900002671A KR1019880008802A KR880008802A KR900002671A KR 900002671 A KR900002671 A KR 900002671A KR 1019880008802 A KR1019880008802 A KR 1019880008802A KR 880008802 A KR880008802 A KR 880008802A KR 900002671 A KR900002671 A KR 900002671A
Authority
KR
South Korea
Prior art keywords
chamber
reflow
heated air
preheating
reflow soldering
Prior art date
Application number
KR1019880008802A
Other languages
English (en)
Inventor
겐시 곤도오
Original Assignee
겐시 곤도오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 겐시 곤도오 filed Critical 겐시 곤도오
Publication of KR900002671A publication Critical patent/KR900002671A/ko
Priority to KR2019910001173U priority Critical patent/KR910003176Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

내용 없음

Description

리플로우 납땜장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예를 나타내는 측단면도.

Claims (1)

  1. 사전에 도포한 땜납 페이스트상에 칩부품을 배설한 프린트 기판을 반송하는 반송수단을 형성하고, 가열된 공기에 의해 상기 프린트 기판을 가열하는 예비 가열실을 형성하고, 가열된 공기에 의해 상기 땜 납 페이스트를 융해하여 납땜을 하는 리플로우실을 형성하고, 상기 가열된 공기를 아래쪽으로 향해 송풍하기 위한 상기 예비 가열실과 상기 리플로우실의 위부분에 각각 팬을 형성한 리플로우 납땜장치에 있어서, 상기 예비 가열실(22)(23)과 상기 리플로우실(7) 내의 상기 가열된 공기의 흐름을 정류하여 상기 프린트 기판(1)을 균등하게 가열하기 위한 정류판(25)을 상기 예비 가열실(22)(23)과 상기 리플로우실(7)의 내부에 각각 형성하고, 또한 상기 가열된 공기를 상기 팬(13)(14)(15)으로써 상기 예비 가열실(22)(23)과 상기 리플로우실(7)의 내부에서 각각 순환시키기 위한 흡입구(27)와 배출구(28)와를 형성한 측판(26)을 형성한 것을 특징으로 하는 리플로우 납땜장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880008802A 1987-01-20 1988-07-15 리플로우 납땜장치 KR900002671A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910001173U KR910003176Y1 (ko) 1988-07-15 1991-01-28 리플로우 납땜장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62008965A JPS63177960A (ja) 1987-01-20 1987-01-20 リフロ−はんだ付け装置
JP8965 1987-01-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019910001173U Division KR910003176Y1 (ko) 1988-07-15 1991-01-28 리플로우 납땜장치

Publications (1)

Publication Number Publication Date
KR900002671A true KR900002671A (ko) 1990-02-28

Family

ID=11707388

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880008802A KR900002671A (ko) 1987-01-20 1988-07-15 리플로우 납땜장치

Country Status (2)

Country Link
JP (1) JPS63177960A (ko)
KR (1) KR900002671A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02284764A (ja) * 1989-04-25 1990-11-22 Osaka Asahi Kagaku Kk プリント基板の両面実装用半田付装置
JPH03106260U (ko) * 1990-02-20 1991-11-01
US5154338A (en) * 1990-06-06 1992-10-13 Senju Metal Industry Co., Ltd. Solder reflow furnace
JPH07115166B2 (ja) * 1991-03-26 1995-12-13 日立テクノエンジニアリング株式会社 リフローはんだ付け方法およびその装置
KR0123188B1 (ko) * 1992-11-17 1997-12-03 모리시타 요이찌 리플로장치
JPH08250852A (ja) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd リフロー方法、リフロー炉およびリフロー炉用熱風式ヒーター
CN207422911U (zh) * 2017-08-25 2018-05-29 张跃 一种高温用空心板

Also Published As

Publication number Publication date
JPS63177960A (ja) 1988-07-22
JPH055581B2 (ko) 1993-01-22

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
WICV Withdrawal of application forming a basis of a converted application