KR20240155040A - Electronic device including a heat dissipation member - Google Patents

Abstract

According to one embodiment of the present disclosure, an electronic device may include a first housing including a front surface, a back surface opposite the front surface, a side surface surrounding a space between the front surface and the back surface, and a first inner wall portion facing the inner space, a first mounting portion formed in the first housing and having a first electronic component disposed thereon, a second mounting portion formed in the first housing and having a second electronic component disposed thereon, a first partition wall portion extending from the first inner wall portion and partitioning the first mounting portion and the second mounting portion, a first heat exchange portion positioned in the first mounting portion and in contact with the first electronic component, a second heat exchange portion positioned in the second mounting portion, and a first conduit including at least a portion of the first partition wall portion and the first inner wall portion connecting the first heat exchange portion and the second heat exchange portion. Various other embodiments are possible.

Description

{ELECTRONIC DEVICE INCLUDING A HEAT DISSIPATION MEMBER}

One embodiment disclosed in this document relates to an electronic device including a heat dissipation member.

With the advancement of technology, high-performance electronic components are placed inside electronic devices. Electronic components may generate heat as they operate. The heat generated from the electronic components may deteriorate the performance of the electronic components. Therefore, the electronic device may include a structure that diffuses the heat generated from the electronic components to the surroundings. For example, a structure such as a vapor chamber or a heat pipe that comes into contact with the electronic components and diffuses the heat to the surroundings may be placed inside the electronic device. In addition, various types of heat dissipation structures are designed in electronic devices to diffuse the heat from the electronic components to the surroundings.

The above information may be provided as related art for the purpose of assisting in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

Electronic components that generate high heat, such as an application processor (AP), may be placed inside the electronic device. In one embodiment, heat generated by the electronic component may be diffused to the surroundings as a heat dissipation member comes into contact with the electronic component. For example, heat generated by the electronic component may be diffused to the surroundings as a vapor chamber placed inside the electronic device comes into contact with the electronic component.

Meanwhile, when a heat dissipation member is placed in an electronic device, the thickness of the housing of the electronic device may be reduced by the amount of space occupied by the heat dissipation member. For example, the housing may be processed in the thickness direction of the housing so that the heat dissipation member can be fixed. In this case, the rigidity of the housing is weakened, so that the housing may be easily damaged by external impact.

According to one embodiment of the present disclosure, a heat dissipation structure can be proposed that minimizes processing on a housing and expands an area of heat diffusion inside an electronic device.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which the present invention belongs from the description below.

According to one embodiment of the present disclosure, an electronic device may include a first housing including a front surface, a back surface opposite the front surface, a side surface surrounding a space between the front surface and the back surface, and a first inner wall portion facing the inner space. In addition, the electronic device may include a first mounting portion formed in the first housing, on which a first electronic component is disposed. In addition, the electronic device may include a second mounting portion formed in the first housing, on which a second electronic component is disposed. In addition, the electronic device may include a first partition wall portion extending from the first inner wall portion and partitioning the first mounting portion and the second mounting portion, and a first heat exchange portion positioned in the first mounting portion and in contact with the first electronic component. In addition, the electronic device may include a first heat dissipation member including a second heat exchange portion positioned in the second mounting portion, and a first conduit at least partially positioned in the first partition wall portion and the first inner wall portion, connecting the first heat exchange portion and the second heat exchange portion.

An electronic device according to one embodiment of the present disclosure includes a housing including a mounting portion on which an electronic component is placed, a first inner wall portion facing the mounting portion, a first inner wall portion positioned between the mounting portion and the first inner wall portion, and a first inner wall portion facing the first inner wall portion, and a heat dissipation member at least partially in contact with the first electronic component, wherein the heat dissipation member may include a first heat exchange portion in contact with the first electronic component, a second heat exchange portion positioned inside the first inner wall portion, a steam pipe positioned inside the first inner wall portion and connecting the first heat exchange portion and the second heat exchange portion, and a liquid pipe positioned inside the first inner wall portion and connecting the first heat exchange portion and the second heat exchange portion.

According to one embodiment of the present disclosure, a heat dissipation structure can be proposed that minimizes processing of a housing and expands an area of heat diffusion inside an electronic device. For example, a loop heat pipe that comes into contact with an electronic component can be arranged inside the electronic device. Since the loop heat pipe is arranged along a side inner wall portion of the housing, processing of the housing in the thickness direction may not be required. Accordingly, a certain level of rigidity of the housing can be secured.

The effects obtainable from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by a person skilled in the art to which the present disclosure belongs from the description below.

In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.
FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.
FIG. 2A is a perspective view of a front side of an electronic device according to one embodiment of the present disclosure.
FIG. 2b is a perspective view of the rear surface of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.
FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.
FIG. 4A is a perspective view of a heat dissipation unit disposed inside an electronic device according to one embodiment of the present disclosure.
FIG. 4b is an enlarged view of a first heat exchange unit of a heat dissipation member according to one embodiment of the present disclosure.
FIG. 5a is a drawing showing a state in which a first heat exchange unit of a heat dissipation member according to one embodiment of the present disclosure is arranged in a housing.
Figure 5b is a drawing showing the state in which the second heat exchanger, steam pipe, and liquid pipe of the heat dissipation member of Figure 5a are arranged.
Figure 5c is an enlarged view of the first opening through which a portion of the heat dissipation member of Figures 5a and 5b passes.
FIG. 6 is a drawing showing a state in which a heat dissipation member is arranged on one surface of a housing according to one embodiment of the present disclosure, and an enlarged view of a second opening through which a part of the heat dissipation member passes in a bulkhead portion of the housing.
FIG. 7 is a drawing showing a state in which a portion of a heat dissipation member is arranged inside an inner wall portion of a housing according to one embodiment of the present disclosure.
FIG. 8a is a cross-sectional view of a steam pipe of a heat dissipation member according to one embodiment of the present disclosure.
FIG. 8b is a cross-sectional view of a liquid tube of a heat dissipation member according to one embodiment of the present disclosure.
FIG. 8c is a cross-sectional view of a steam pipe of a heat dissipation member according to one embodiment of the present disclosure.
FIG. 8d is a cross-sectional view of a liquid tube of a heat dissipation member according to one embodiment of the present disclosure.
FIG. 9 is a drawing explaining the heat dissipation performance of a heat dissipation member according to one embodiment of the present disclosure.
FIG. 10 is a drawing illustrating a state in which a heat dissipation member is arranged in a first housing according to one embodiment of the present disclosure.
FIG. 11 is a drawing illustrating a state in which a portion of a first heat dissipation member disposed in a first housing and a portion of a second heat dissipation member disposed in a second housing are in contact with an electronic component disposed in the first housing, according to one embodiment of the present disclosure.
FIG. 12a and FIG. 12b are drawings explaining a state in which a first heat dissipation member arranged in a first housing and a second heat dissipation member arranged in a second housing are connected through a connecting portion located in a folding area.
FIGS. 13A to 13C are drawings illustrating various embodiments of a connecting portion according to one embodiment of the present disclosure.
FIG. 14 is a drawing explaining a state in which a first heat dissipation member arranged in a first housing and a second heat dissipation member arranged in a second housing are connected through a third heat dissipation member located in a folding area.

In the following description, various embodiments of the present document are described with reference to the attached drawings. It should be understood that the various embodiments of the present document and the terms used therein are not intended to limit the technical features described in the present document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments.

In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items, unless the context clearly indicates otherwise.

In this document, the phrases "A or B", "at least one of A and B", "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one or all possible combinations of the items listed in that phrase. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

The processor (120) may control at least one other component (e.g., a hardware or software component) of an electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store result data in a nonvolatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

The auxiliary processor (123) may control at least a portion of functions or states associated with at least one of the components of the electronic device (101) (e.g., the display module (160), the sensor module (176), or the communication module (190)), for example, while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) on which artificial intelligence is performed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or nonvolatile memory (134).

The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The audio output module (155) can output an audio signal to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive an incoming call. According to one embodiment, the receiver can be implemented separately from the speaker or as a part thereof.

The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) can include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) can include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can obtain sound through an input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an electronic device (102)) (e.g., a speaker or a headphone) directly or wirelessly connected to the electronic device (101).

The sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an external environmental state (e.g., user state) and generate an electric signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) can include one or more lenses, image sensors, image signal processors, or flashes.

The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery (189) can power at least one component of the electronic device (101). In one embodiment, the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module (190) may support establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)), and performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

The wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G network, for example, NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), terminal power minimization and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) may support various requirements specified in an electronic device (101), an external electronic device (e.g., an electronic device (104)), or a network system (e.g., a second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

The antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module (197) can include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) can include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), can be selected from the plurality of antennas by, for example, the communication module (190). A signal or power can be transmitted or received between the communication module (190) and the external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) can be additionally formed as a part of the antenna module (197).

In one embodiment, the antenna module (197) can form a mmWave antenna module. In one embodiment, the mmWave antenna module can include a printed circuit board, an RFIC positioned on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) positioned on or adjacent a second side (e.g., a top side or a side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

At least some of the above components may be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

In one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). In one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to perform at least a part of the function or service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result, as is or additionally processed, as at least a part of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an IoT (Internet of Things) device. The server (108) may be an intelligent server using machine learning and/or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199). The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2A is a perspective view of a front side of an electronic device according to an embodiment of the present disclosure. FIG. 2B is a perspective view of a rear side of the electronic device of FIG. 2A according to an embodiment of the present disclosure.

The electronic device (200) described below may include at least one of the components of the electronic device (101) described above in FIG. 1.

Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing may refer to a structure forming a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 2A . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (218) (or “side member”) that is coupled with the front plate (202) and the back plate (211) and comprises a metal and/or polymer. In some embodiments, the back plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

In the illustrated embodiment, the front plate (202) can include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) can include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) can include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first side (210A) and the first region (210D) of the side (210C). The display (201) may be coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and/or at least a portion of the key input device (217), may be disposed in the first region (210D), and/or the second region (210E).

The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The audio output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), the speakers (207, 214), and the connector (208) may be arranged at least partially in the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone (203) and the speakers (207, 214). In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

The sensor modules (204, 219) can generate electrical signals or data values corresponding to the internal operating state of the electronic device (200) or the external environmental state. The sensor modules (204, 219) can include, for example, a first sensor module (204) (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and/or a third sensor module (219) (e.g., a heart rate monitor (HRM) sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor can be disposed on the first surface (210A) of the housing (210) (e.g., a home key button), a portion of the second surface (210B), and/or below the display (201). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

The camera modules (205, 212) may include a first camera module (205) disposed on a first side (210A) of the electronic device (200), a second camera module (212) disposed on a second side (210B), and/or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and/or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).

The key input device (217) may be positioned on a side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide, for example, a light source that is linked to the operation of the camera module (205). The indicator may include, for example, a light emitting diode (LED), an infrared (IR) LED, and/or a xenon lamp.

The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and/or data with an external electronic device, and/or a second connector hole (or earphone jack) (not shown) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

Some of the camera modules (205, 212), some of the sensor modules (204, 219), or the indicator may be arranged to be visually exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area where content is displayed. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area that overlaps with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of the display (201) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under display camera (UDC). In one embodiment, some of the sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of the display (201) that faces the sensor module may not require a perforated opening.

According to one embodiment, the electronic device (200) has a bar type or plate type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be a part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and/or a rollable electronic device. The terms "foldable electronic device", "slidable electronic device", "stretchable electronic device" and/or "rollable electronic device" may refer to an electronic device in which a display (e.g., a display (330) of FIG. 3) is capable of bending deformation, such that at least a portion thereof is folded, wound or rolled, at least a portion thereof is expanded, and/or the display can be housed inside a housing (e.g., a housing (210) of FIGS. 2A and 2B). The foldable electronic device, the slidable electronic device, the stretchable electronic device and/or the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of the display to the outside, depending on the needs of the user.

FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.

The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIGS. 2A and 2B, or may include other embodiments of the electronic device.

Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (200) of FIG. 2A or FIG. 2B) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or a support structure), a front plate (320) (e.g., a front cover) (e.g., the front plate (202) of FIG. 2A), a display (330) (e.g., the display (201) of FIG. 2A), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover) (e.g., the rear plate (211) of FIG. 2B). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or FIG. 2B, and any redundant description will be omitted below.

The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed of, for example, a metal material and/or a non-metal (e.g., a polymer) material. The first support member (311) may have a display (330) coupled to one surface and a substrate (340) coupled to the other surface. The substrate (340) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and/or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector.

The battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the substrate (340). The battery (350) may be integrally disposed within the electronic device (300). In one embodiment, the battery (350) may be disposed to be detachable from the electronic device (300).

The antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or a combination of the side bezel structure (310) and/or the first support member (311).

FIG. 4A is a perspective view of a heat dissipation member disposed inside an electronic device according to one embodiment of the present disclosure. FIG. 4B is an enlarged view of a first heat exchange section of the heat dissipation member according to one embodiment of the present disclosure.

According to one embodiment, a heat dissipation member (510) may be disposed inside an electronic device (400) (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and/or the electronic device (300) of FIG. 3), as illustrated in FIG. 4A. In one embodiment, the heat dissipation member (510) may be a micro loop heat pipe (MLHP). For example, the heat dissipation member (510) may include a first heat exchange unit (511) (e.g., an evaporator) that absorbs heat from an external heat source to evaporate a working fluid, a second heat exchange unit (512) (e.g., a condenser) that releases heat to the outside to condense a gas into a fluid, and a conduit (513) that connects the first heat exchange unit (511) and the second heat exchange unit (512). In one embodiment, in the first heat exchange unit (511), the liquid present in the heat dissipation member (510) may be converted into vapor through heat transferred from the first electronic component by contacting the first electronic component disposed in the electronic device (400). In the second heat exchange unit (512), the vapor generated in the first heat exchange unit (511) may be converted into liquid. In one embodiment, the conduit (513) may include a vapor conduit (5131) through which the gas generated in the first heat exchange unit (511) moves to the second heat exchange unit (512), and a liquid conduit (5132) through which the liquid generated in the second heat exchange unit (512) is transferred to the first heat exchange unit (511). In one embodiment, the vapor conduit (5131) and the liquid conduit (5132) may be arranged to be spaced apart from each other. The heat dissipation member (510) forms one loop inside the electronic device (400), and the working fluid can move in one direction inside the heat dissipation member (510). As described below, at least a portion of the heat dissipation member (510) can be disposed in the partition wall portion (424) and the inner wall portion (421) of the housing (410) of FIGS. 5A and 5B (e.g., the housing (210) of FIG. 2A) to form one loop.

According to one embodiment, the first heat exchange unit (511) may include a contact unit (5111) that comes into contact with an electronic component (e.g., a first electronic component disposed in the first mounting unit (422) of FIGS. 5A to 5B), a compensation chamber (5112) into which liquid generated in the second heat exchange unit (512) is supplied, and a blocking unit (5114) that partitions the contact unit (5111) and the compensation chamber (5112). In one embodiment, referring to FIG. 4B, the contact unit (5111) may include a wick structure positioned therein. The wick structure (5113) may be a mesh structure formed of metal. In one embodiment, the wick structure (5113) may be a structure in which a plurality of heat dissipation fins are arranged. In one embodiment, the wick structure (5113) may act as a pump to move the condensed heat medium from the compensation chamber (5112) to the contact portion (5111). Additionally, the wick structure (5113) may maximize the surface area, such as a mesh or a plurality of heat dissipation fins, to increase the heat transfer efficiency. In one embodiment, the wick structure (5113) may be formed only on the first heat exchange portion (511) of the heat dissipation member (510).

In one embodiment, the first heat exchanger (511) may consist only of the contact portion (5111). For example, the first heat exchanger (511) may not include the compensation chamber (5112) and the blocking portion (5114). In this case, the liquid transferred from the second heat exchanger (512) to the first heat exchanger (511) through the liquid pipe (5132) may be vaporized into gas in the first heat exchanger (511) and transferred to the second heat exchanger (512) through the vapor pipe (5131).

In one embodiment, the liquid generated in the second heat exchange unit (512) may be supplied to the compensation chamber (5112) of the first heat exchange unit (511). The liquid introduced into the compensation chamber (5112) may pass through the wick structure (5113) and be evaporated through the heat generated in the first electronic component. The gas formed through the evaporation of the liquid may be transferred to the second heat exchange unit (512) through the vapor pipe (5131). The gas transferred to the second heat exchange unit (512) may be phase-converted into liquid and be compensated into the compensation chamber (5112) of the first heat exchange unit (511). Therefore, the fluid located inside the heat dissipation member (510) may be continuously circulated.

In one embodiment, the heat dissipation member (510) may be formed of a metal material. In one embodiment, the interior of the heat dissipation member (510) may be in a vacuum state. In one embodiment, the fluid located inside the heat dissipation member (510) may be filled inside the heat dissipation member (510) so as to occupy about 60 to about 80% of the interior space of the heat dissipation member (510).

FIG. 5A is a drawing showing a state in which a first heat exchange unit of a heat dissipation member according to one embodiment of the present disclosure is arranged in a housing. FIG. 5B is a drawing showing a state in which a second heat exchange unit, a vapor pipe, and a liquid pipe of the heat dissipation member of FIG. 5A are arranged. FIG. 5C is an enlarged view of a first opening through which a part of the heat dissipation members of FIGS. 5A and 5B pass. FIG. 6 is a drawing showing a state in which a heat dissipation member is arranged on one surface of a housing according to one embodiment of the present disclosure, and an enlarged view of a second opening through which a part of the heat dissipation member passes in a partition of the housing.

According to one embodiment of the present disclosure, a housing (410) (e.g., housing (210) of FIG. 2A) may be configured as follows. In one embodiment, the housing (410) may include a front surface (410A) on which a display (e.g., display module (160) of FIG. 1, display (201) of FIG. 2A, display (330) of FIG. 3) is disposed, a back surface (410B) opposite to the front surface (410A), and a side surface (410C) enclosing a space between the front surface (410A) and the back surface (410B). In one embodiment, the housing (410) may include an inner wall portion (421) protruding toward the inner space. In one embodiment, the inner wall portion (421) may be a portion protruding toward the inner space from the side surface (410C) of the housing (410). In one embodiment, the housing (410) may include a first mounting portion (422) in which at least one electronic component is placed and a second mounting portion (423) in which at least one other electronic component is placed. In one embodiment, the second mounting portion (423) may be wrapped through the inner wall portion (421). In one embodiment, the housing (410) may include a partition portion (424) extending from the inner wall portion (421). In one embodiment, the partition portion (424) may partition the first mounting portion (422) and the second mounting portion (423).

In one embodiment, the inner wall portion (421) may include a first surface (421A) facing the bulkhead portion (424), a second surface (421B) perpendicular to the first surface (421A) and positioned between the bulkhead portion (424) and the first surface (421A), and a third surface (421C) facing the second surface (421B). In one embodiment, at least a portion of the heat dissipation member (510) may be disposed on the first surface (421A), the second surface (421B), and/or the third surface (421C) of the inner wall portion (421).

In one embodiment, a high-heat source electronic component such as an AP (Application Processor) may be placed in the first mounting portion (422). In one embodiment, the second mounting portion (423) may be a battery mounting portion. For example, the electronic component placed in the second mounting portion (423) may be a battery. In addition, various electronic components may be placed in the first mounting portion (422) and the second mounting portion (423). Hereinafter, the electronic component placed in the first mounting portion (422) will be described as the first electronic component, and the electronic component placed in the second mounting portion (423) will be described as the second electronic component.

In one embodiment, the first heat exchange unit (511) of the heat dissipation member (510) may be in contact with the first electronic component disposed in the first mounting unit (422). The second heat exchange unit (512) may be disposed in the inner wall unit (421) of the second mounting unit (423). In one embodiment, the first heat exchange unit (511) for phase conversion from liquid to gas and the second heat exchange unit (512) for phase conversion from gas to liquid may be positioned to be spaced apart from each other so that heat exchange for phase conversion can be efficiently performed. For example, the second heat exchange unit (512) may be disposed on the first surface (421A) of the inner wall unit (421) facing the partition wall unit (424). In one embodiment, the steam pipe (5131) may be disposed at least partially on the second surface (421B) of the baffle portion (424) and the inner wall portion (421) to supply steam generated in the first heat exchange unit (511) to the second heat exchange unit (512). In one embodiment, the liquid pipe (5132) may be disposed at least partially on the third surface (421C) of the inner wall portion (421) and the baffle portion (424) to supply liquid generated in the second heat exchange unit (512) to the first heat exchange unit (511). In one embodiment, the second heat exchange unit (512), the steam pipe (5131), and the liquid pipe (5132) may be positioned on the second mounting portion (423) to face the second electronic component. In one embodiment, the second heat exchanger (512), the steam pipe (5131) and the liquid pipe (5132) second electronic component may be in contact with the second electronic component or may be attached to the second electronic component via an adhesive member.

According to one embodiment, one of the first mounting portion (422) and the second mounting portion (423) may be formed in the housing (410) so as to face the front surface (410A) of the electronic device (400) and the other may be formed so as to face the back surface (410B) of the electronic device (400). In one embodiment, referring to FIG. 5A, the first mounting portion (422) may be formed in the housing (410) so as to face the front surface (410A) of the electronic device (400). Referring to FIG. 5B, the second mounting portion (423) may be formed so as to face the back surface (410B) of the electronic device (400). The inner wall portion (421) may surround the second mounting portion (423) on the back surface (410B) of the electronic device (400). In one embodiment, referring to FIGS. 5A and 5B, the first heat exchange member (511) of the heat dissipation member (510) may be positioned at the first mounting portion (422). The second heat exchange member (512) may be positioned at the first surface (421A) of the inner wall portion (421) positioned at the second mounting portion (423). The vapor pipe (5131) may be positioned at the second surface (421B) of the inner wall portion (421) and the partition wall portion (424). The liquid pipe (5132) may be positioned at the third surface (421C) of the inner wall portion (421) and the partition wall portion (424). In one embodiment, referring to FIG. 5C, the housing (410) may include a first opening (431) connecting the front surface (410A) of the housing (410) and the back surface (410B) of the housing (410) so that a first heat exchanger (511) positioned at the first mounting portion (422) and a second heat exchanger (512) positioned at the second mounting portion (423) may be connected. In one embodiment, a steam pipe (5131) of the heat dissipation member (510) extends from the first heat exchanger (511) and passes through the first opening (431), and a portion thereof may be disposed at the bulkhead portion (424) and the second surface (421B) of the inner wall portion (421) to be connected to the second heat exchanger (512) positioned at the first surface (421A) of the inner wall portion (421). In one embodiment, the liquid pipe (5132) extends from the second heat exchanger (512) and is disposed at a third surface (421C) of the inner wall (421) and the baffle (424) and may pass through the first opening (431) to be connected to the first heat exchanger (511).

In the above description, it is assumed that the first mounting portion (422) is formed to face the front (410A) of the electronic device (400) and the second mounting portion (423) is formed to face the back (410B) of the electronic device (400), but it may not be limited thereto. Even if the first mounting portion (422) is formed to face the back (410B) of the electronic device (400) and the second mounting portion (423) is formed to face the front (410A) of the electronic device (400), the above description may be equally applied.

According to one embodiment, the first mounting portion (422) and the second mounting portion (423) may be formed in the housing (410) so as to face the front (410A) or the back (410B) of the electronic device (400). In one embodiment, referring to FIG. 6, the first mounting portion (422) and the second mounting portion (423) may be formed in the housing (410) so as to face the back (410B) of the electronic device (400). In one embodiment not shown in the drawing, the first mounting portion (422) and the second mounting portion (423) may be formed in the housing (410) so as to face the front (410A) of the electronic device (400).

According to one embodiment, as illustrated in FIG. 6, the first heat exchange member (511) of the heat dissipation member (510) may be positioned in the first mounting member (422). The second heat exchange member (512) may be positioned on the first surface (421A) of the inner wall portion (421) positioned in the second mounting member (423). The vapor pipe (5131) may be positioned at least partially on the second surface (421B) of the inner wall portion (421) and the partition wall portion (424). The liquid pipe (5132) may be positioned at least partially on the third surface (421C) of the inner wall portion (421) and the partition wall portion (424). In one embodiment, referring to FIG. 6, the partition wall portion (424) may include a second opening (432) through which a portion of the heat dissipation member (510) passes. In one embodiment, referring to FIG. 6, the vapor pipe (5131) of the heat dissipation member (510) may extend from the first heat exchange unit (511), pass through the second opening (432), and be connected to the second heat exchange unit (512) located at the first surface (421A) of the inner wall unit (421) by having a portion disposed on the second surface (421B) of the partition wall unit (424) and the inner wall unit (421) and a portion disposed on the third surface (421C) of the inner wall unit (421) and the partition wall unit (424) by passing through the second opening (432) and being connected to the first heat exchange unit (511). In one embodiment, the liquid pipe (5132) may extend from the second heat exchange unit (512), be connected to the third surface (421C) of the inner wall unit (421) and the partition wall unit (424) by having a portion disposed on the second surface (421C) of the inner wall unit (421) and a portion disposed on the second surface (432) of the inner wall unit (421) and a portion disposed on the second surface (432) of the inner wall unit (511).

FIG. 7 is a drawing showing a state in which a portion of a heat dissipation member is arranged inside an inner wall portion of a housing according to one embodiment of the present disclosure.

According to one embodiment, as illustrated in FIG. 7, at least a portion of the heat dissipation member (510) may be positioned within an inner wall portion (421) of a housing (410) (e.g., housing (210) of FIG. 2A). In one embodiment, the inner wall portion (421) may include a first-first inner wall portion (421-1) facing a partition wall portion (424), a first-second inner wall portion (421-2) positioned perpendicular to the first-first inner wall portion (421-1) between the partition wall portion (424) and the first-first inner wall portion (421-1), and a first-third inner wall portion (421-3) facing the first-second inner wall portion (421-2). In one embodiment, the first surface (421A) of the inner wall portion (421) described above may be one surface of the first inner wall portion (421-1), the second surface (421B) of the inner wall portion (421) may be one surface of the first-second inner wall portion (421-2), and the third surface (421C) of the inner wall portion (421) may be one surface of the first-third inner wall portion (421-3). In one embodiment, the first-first inner wall portion (421-1), the first-second inner wall portion (421-2), and the first-third inner wall portion (421-3) may include an internal space in which a portion of the heat dissipation member (510) may be disposed. In one embodiment, the internal spaces formed in the first-first inner wall portion (421-1), the first-second inner wall portion (421-2), and the first-third inner wall portion (421-3) may be connected to each other. In one embodiment, the second heat exchange unit (512) may be located within the first-first inner wall portion (421-1). The vapor pipe (5131) may be located at least partially within the first-second inner wall portion (421-2) to connect the first heat exchange unit (511) located at the first mounting portion (422) and the second heat exchange unit (512) located within the first-first inner wall portion (421-1). The liquid pipe (5132) may be located at least partially within the first-third inner wall portion (421-3) to connect the first heat exchange unit (511) and the second heat exchange unit (512).

As described above, when a part of the heat dissipation member (510) is positioned inside the inner wall portion (421), the area occupied by the heat dissipation member (510) inside the electronic device (400) may increase compared to a case where a part of the heat dissipation member (510) is positioned on the outer surface of the inner wall portion (421) (e.g., the first surface (421A), the second surface (421B), the third surface (421C)) and the partition wall portion (424). For example, the area occupied by the heat dissipation member (510) in the X-axis and/or Y-axis direction with respect to FIG. 7 may increase. In this case, the area in which heat generated from the first electronic component is spread increases, so that the heat dissipation efficiency of the electronic device (400) may be improved.

FIG. 8A is a cross-sectional view of a vapor tube of a heat dissipating member according to an embodiment of the present disclosure. FIG. 8B is a cross-sectional view of a liquid tube of a heat dissipating member according to an embodiment of the present disclosure. FIG. 8C is a cross-sectional view of a vapor tube of a heat dissipating member according to an embodiment of the present disclosure. FIG. 8D is a cross-sectional view of a liquid tube of a heat dissipating member according to an embodiment of the present disclosure.

According to one embodiment, the heat dissipation member (510) can be formed in various shapes. In one embodiment, as shown in FIG. 5A, FIG. 5B, and FIG. 6, the heat dissipation member (510) can have at least one surface that is flat so that the first heat exchange member (511) is disposed on the first mounting portion (422), the second heat exchange member (512) is disposed on the first surface (421A) of the inner wall portion (421), the steam pipe (5131) is disposed on the bulkhead portion (424) and the second surface (421B) of the inner wall portion (421), and the liquid pipe (5132) is disposed on the third surface (421C) of the inner wall portion (421) and the bulkhead portion (424). In one embodiment, referring to FIGS. 8a and 8b, the vapor pipe (5131) and the liquid pipe (5132) may be formed with at least two sides as planes so as to be in close contact with the partition wall portion (424) and reduce the volume occupied by the second mounting portion (423). In one embodiment, referring to FIGS. 8c and 8d, the vapor pipe (5131) and the liquid pipe (5132) may be formed in a circular pipe shape. In one embodiment, referring to FIGS. 7, 8c and 8d, the vapor pipe (5131) may be formed in a pipe shape having a circular cross-section and may be arranged inside the first-second inner wall portion (421-2), and the liquid pipe (5132) may be arranged in a pipe shape having a circular cross-section and may be arranged inside the third inner wall portion (421-3) of the shape-shifter.

According to one embodiment, the outer surface of the heat dissipation member (510) may be formed of a metal material. For example, it may be formed of a material such as copper, gold, silver, and/or aluminum. In one embodiment, referring to FIGS. 8A to 8D, the outer surface (5131a) of the vapor tube (5131) and the outer surface (5132a) of the liquid tube (5132) may be formed of a metal material.

According to one embodiment, the conduit (513) (e.g., steam conduit (5131), liquid conduit (5132)) may include a mesh structure disposed therein. In one embodiment, referring to FIGS. 8a and 8c, the steam conduit (5131) may include a wick structure (5131b) disposed therein. The wick structure (5131b) may be a mesh structure in a net shape formed of metal. In one embodiment, the steam conduit (5131) may move steam to the second heat exchanger (512) through a capillary phenomenon by the wick structure (5131b). In one embodiment, referring to FIGS. 8b and 8d, the liquid conduit (5132) may include a wick structure (5132b) disposed therein. In one embodiment, the liquid tube (5132) can move the liquid to the first heat exchanger (511) through capillary action by the wick structure (5132b).

FIG. 9 is a drawing explaining the heat dissipation performance of a heat dissipation member (510) according to one embodiment of the present disclosure.

According to one embodiment of the present disclosure, the heat dissipation performance of the heat dissipation member (510) can be confirmed through FIG. 9 and [Table 1].

T[°C] Case 1 Case 2 front 43.3 43.3 back side 42.4 42.3 1st electronic component 68.2 67.6

In one embodiment, referring to the above [Table 1], when the first heat exchange unit (511) of the heat dissipation member (510) is positioned at the front (410A) of the electronic device (400) as shown in FIGS. 5A and 5B, and the remaining components, namely the second heat exchange unit (512), the vapor pipe (5131), and the liquid pipe (5132), are positioned at the back (410B) of the electronic device (400) (e.g., case 1 of [Table 1]), it can be confirmed that the temperature of the front (410A) of the electronic device (400) is about 43.3 degrees, the temperature of the back (410B) of the electronic device (400) is about 42.4 degrees, and the temperature of the first electronic component is about 68.2 degrees. In addition, in one embodiment, referring to the above [Table 1], when the first heat exchange part (511), the second heat exchange part (512), the vapor pipe (5131), and the liquid pipe (5132) of the heat dissipation member (510) are arranged in the housing (410) (e.g., the housing (210) of FIG. 2A) toward the back surface (410B) of the electronic device (400) as illustrated in FIG. 6 (e.g., case 2 of [Table 1]), it can be confirmed that the temperature of the front surface (410A) of the electronic device (400) is about 43.3 degrees, the temperature of the back surface (410B) of the electronic device (400) is about 42.3 degrees, and the temperature of the first electronic component is about 67.6 degrees.

In one embodiment, referring to FIG. 9, it can be confirmed that the temperature distribution is efficiently spread over the entire area of the electronic device (400) in a structure to which the heat dissipation member (510) of the present disclosure is applied. In one embodiment, referring to FIG. 9, when the first heat exchange unit (511), the second heat exchange unit (512), the vapor pipe (5131), and the liquid pipe (5132) of the heat dissipation member (510) are positioned in the housing (410) toward the back surface (410B) of the electronic device (400) as shown in FIG. 6 (e.g., case 2 of [Table 1]), and when the first heat exchange unit (511) of the heat dissipation member (510) is positioned at the front surface (410A) of the electronic device (400) and the remaining components, the second heat exchange unit (512), the vapor pipe (5131), and the liquid pipe (5132) are positioned at the back surface (410B) of the electronic device (400) as shown in FIG. 5A and FIG. 5B, the front surface (410A), the back surface (410B) of the electronic device (400), It can be confirmed that the temperatures of the first electronic component are similar.

According to one embodiment of the present disclosure, the area of heat diffusion inside the electronic device (400) can be expanded through the heat dissipation member (510) to which the micro loop heat pipe structure is applied. In addition, since at least a part of the heat dissipation member (510) (e.g., the second heat exchange member (512), the vapor pipe (5131), and the liquid pipe (5132)) is arranged along the inner wall portion (421) and/or the partition portion (424) of the housing (410), a certain level of rigidity of the housing (410) can be secured without performing separate processing in the thickness direction of the housing (410) to arrange the heat dissipation member (510).

FIG. 10 is a drawing explaining a state in which a heat dissipation member is arranged in a first housing according to one embodiment of the present disclosure. FIG. 11 is a drawing explaining a state in which a part of a first heat dissipation member arranged in a first housing and a part of a second heat dissipation member arranged in a second housing at least a part of which is in contact with an electronic component arranged in the first housing (610) according to one embodiment of the present disclosure. FIGS. 12A and 12B are drawings explaining a state in which a first heat dissipation member arranged in a first housing and a second heat dissipation member arranged in a second housing are connected through a connecting portion located in a folding region. FIGS. 13A to 13C are drawings explaining various embodiments of a connecting portion according to one embodiment of the present disclosure. FIG. 14 is a drawing explaining a state in which a first heat dissipation member arranged in a first housing and a second heat dissipation member arranged in a second housing are connected through a third heat dissipation member located in a folding region.

The electronic device (600) described below is an electronic device (600) of a different form factor from the electronic devices (200, 300, 400) described in FIGS. 3 to 8d, and may be a foldable electronic device (600) that is coupled to a plurality of housings through a hinge device and can be folded based on a folding axis. In the description below, components that are the same or similar to those described above in FIGS. 3 to 8d are given the same reference numerals, and detailed descriptions thereof are omitted.

In one embodiment, the electronic device (600) may include a pair of housings (610, 620) that are rotatably coupled about a folding axis (F) via at least one hinge device (not shown) so as to be foldable relative to one another. In one embodiment, the electronic device (600) may include a display (e.g., a display module (160) of FIG. 1 , a display (201) of FIG. 2A , a display (330) of FIG. 3 )) disposed in the pair of housings (610, 620). In one embodiment, the display may be folded or unfolded about the folding axis together with the electronic device (600).

In one embodiment, the pair of housings (610, 620) may include a first housing (610) and a second housing (620) that are foldably arranged relative to each other via at least one hinge device. In one embodiment, the first housing (610) and the second housing (620) are arranged on opposite sides with respect to a folding axis (F), have an overall symmetrical shape with respect to the folding axis (F), and can be folded to match each other. In some embodiments, the first housing (610) and the second housing (620) may be folded asymmetrically with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (610) and the second housing (620) may be different depending on whether the electronic device (600) is in an unfolded state, a folded state, or an intermediate state.

According to one embodiment, the first housing (610) and the second housing (620) may be configured as follows. In one embodiment, the first housing (610) and the second housing (620) may each include a front surface on which a display is arranged, a back surface which is an opposite surface of the front surface, and a side surface which surrounds a space between the front surface and the back surface. In one embodiment, the first housing (610) may include a first inner wall portion (611) protruding toward the inner space. In one embodiment, the first housing (610) may include a first mounting portion (612) on which at least one electronic component (e.g., a first electronic component) is arranged, and a second mounting portion (613) on which at least one other electronic component (e.g., a second electronic component) is arranged. In one embodiment, the second mounting portion (613) may be surrounded by the first inner wall portion (611). In one embodiment, the first housing (610) may include a first partition wall portion (614) extending from the first inner wall portion (611). In one embodiment, the first partition wall portion (614) may define a first mounting portion (612) and a second mounting portion (613). In one embodiment, the second housing (620) may include a second inner wall portion (621) protruding toward the interior space. In one embodiment, the second housing (620) may include a third mounting portion (622) in which at least one electronic component (e.g., a third electronic component) is disposed, and a fourth mounting portion (623) in which at least one other electronic component (e.g., a fourth electronic component) is disposed. In one embodiment, the third mounting portion (622) may be enclosed by the second inner wall portion (621). In one embodiment, the second housing (620) may include a second bulkhead portion (624) extending from the second inner wall portion (621). In one embodiment, the second bulkhead portion (624) may partition a third mounting portion (622) and a fourth mounting portion (623).

The first electronic component, the second electronic component, the third electronic component, and the fourth electronic component described above may be various types of electronic components. For example, they may be various types of electronic components such as a battery, an AP, and a printed circuit board.

In one embodiment, the first inner wall portion (611) of the first housing (610) may include a first surface (611A) facing the first bulkhead portion (614), a second surface (611B) perpendicular to the first surface (611A) and positioned between the first bulkhead portion (614) and the first surface (611A), and a third surface (611C) facing the second surface (611B). In one embodiment, at least a portion of the first heat dissipation member (710) may be disposed on the first surface (611A), the second surface (611B), and/or the third surface (611C) of the first inner wall portion (611). In one embodiment, the second inner wall portion (621) of the second housing (620) may include a first surface (621A) facing the second bulkhead portion (624), a second surface (621B) perpendicular to the first surface (621A) and positioned between the second bulkhead portion (624) and the first surface (621A), and a third surface (621C) facing the second surface (621B). In one embodiment, at least a portion of the second heat dissipation member (720) may be disposed on the first surface (621A), the second surface (621B), and/or the third surface (621C) of the second load-bearing portion (621).

In one embodiment, the first heat dissipation member (710) and the second heat dissipation member (720) may be formed of a metal material having high heat conduction efficiency. For example, the first heat dissipation member (710) and the second heat dissipation member (720) may be formed of a material such as copper, gold, silver, and/or aluminum.

According to one embodiment, as illustrated in FIG. 10, the electronic device (600) may include a first heat dissipation member (710) disposed in the first housing (610). In one embodiment, the first heat dissipation member (710) may have substantially the same configuration as the heat dissipation member of FIG. 4A described above. For example, the first heat dissipation member (710) may include a first heat exchange unit (711) (e.g., the first heat exchange unit (511) of FIG. 4A), a second heat exchange unit (712) (e.g., the second heat exchange unit (512) of FIG. 4A), a first conduit (713) (e.g., a first vapor conduit (7131) (e.g., a vapor conduit (5131) of FIG. 4A), and a first liquid conduit (7132) (e.g., a liquid conduit (5132) of FIG. 4A)). Referring to FIG. 10 in one embodiment, the first heat exchange member (711) of the first heat dissipation member (710) may be positioned at the first mounting portion (612) and may be in contact with the first electronic component. The second heat exchange member (712) may be positioned at the first surface (611A) of the first inner wall portion (611) positioned at the second mounting portion (613). The first vapor pipe (7131) may be positioned at the second surface (611B) of the first inner wall portion (611) and the first partition wall portion (614). The first liquid pipe (7132) may be positioned at the third surface (611C) of the first inner wall portion (611) and the first partition wall portion (614). In one embodiment, the second heat exchanger (712), the first vapor pipe (7131) and the first liquid pipe (7132) can face the second electronic component. In one embodiment, the second heat exchanger (712), the first vapor pipe (7131) and the first liquid pipe (7132) can be in contact with the second electronic component or can be attached to the second electronic component via an adhesive member.

In one embodiment, the first bulkhead portion (614) can include a first opening (616) through which a portion of the first heat dissipation member (710) passes. In one embodiment, referring to FIG. 6, the first steam pipe (7131) of the first heat dissipation member (710) extends from the first heat exchange portion (711) and passes through the first opening (616), and a portion thereof can be disposed on the first bulkhead portion (614) and the second face (611B) of the first inner wall portion (611) to be connected to the second heat exchange portion (712) positioned on the first face (611A) of the first inner wall portion (611). In one embodiment, the first liquid pipe (7132) extends from the second heat exchanger (712) and is disposed at a third surface (611C) of the first inner wall portion (611) and the first baffle portion (614) and may pass through the first opening (616) to be connected to the first heat exchanger (711).

According to one embodiment, as illustrated in FIG. 11, the electronic device (600) may include a second heat dissipation member (720) disposed in the second housing (620). In one embodiment, the second heat dissipation member (720) may have substantially the same configuration as the heat dissipation member of FIG. 4A described above. For example, the second heat dissipation member (720) may include a third heat exchange unit (721) (e.g., the first heat exchange unit (511) of FIG. 4A), a fourth heat exchange unit (722) (e.g., the second heat exchange unit (512) of FIG. 4A), and a second conduit (723) (e.g., a second vapor conduit (7231) (e.g., the vapor conduit (5131) of FIG. 4A)) and a second liquid conduit (7232) (e.g., the liquid conduit (5132) of FIG. 4A)). In one embodiment, referring to FIG. 11, the third heat exchange part (721) of the second heat dissipation member (720) may be positioned at the first mounting part (612) and may be in contact with the first electronic component. In one embodiment, the fourth heat exchange part (722), the second vapor pipe (7231), and the second liquid pipe (7232) of the second heat dissipation member (720) may be positioned at the fourth mounting part (623) of the second housing (620). In one embodiment, referring to FIG. 11, the fourth heat exchange part (722) may be positioned at the first surface (621A) of the second inner wall part (621) positioned at the fourth mounting part (623). The second vapor pipe (7231) may be positioned at least partially at the second surface (611B) of the second inner wall part (621). The second liquid pipe (7232) may be disposed at least partially on the third surface (621C) of the second inner wall portion (621) and the second bulkhead portion (624). Accordingly, as illustrated in FIG. 11, the first electronic component disposed on the first mounting portion (612) may increase the area where heat is spread by contacting the first heat dissipation member (710) and the second heat dissipation member (720) compared to the case where the first electronic component is in contact only with the first heat dissipation member (710), thereby improving heat dissipation efficiency.

In one embodiment not shown in the drawing, the third heat exchange member (721) of the second heat dissipation member (720) may be positioned on the third mounting portion (622) and may be in contact with the third electronic component. The fourth heat exchange member (722) may be positioned on the first surface (621A) of the second inner wall portion (621) positioned on the fourth mounting portion (623). The second vapor pipe (7231) may be positioned on the second surface (621B) of the second inner wall portion (621) and the second bulkhead portion (624). The second liquid pipe (7232) may be positioned on the third surface (621C) of the second inner wall portion (621) and the second bulkhead portion (624). In one embodiment, the fourth heat exchanger (722), the second vapor pipe (7231), and the second liquid pipe (7232) may face the fourth electronic component. In one embodiment, the fourth heat exchanger (722), the second vapor pipe (7231), and the second liquid pipe (7232) may be in contact with the fourth electronic component or may be attached to the fourth electronic component via an adhesive member.

According to one embodiment, as illustrated in FIG. 11, the second heat dissipation member (720) may include a connecting portion (730) at least partially positioned in the folding area of the display and folded together with the electronic device (600). In one embodiment, the connecting portion (730) may be configured to connect the third heat exchange unit (721) and the second vapor pipe (7231) and the fourth heat exchange unit (722) and the second liquid pipe (7232). In one embodiment, the connecting portion (730) may be a portion of the second vapor pipe (7231) and/or a portion of the second liquid pipe (7232). For example, the connecting portion (730) may be a region positioned in the folding area among a region of the second vapor pipe (7231). Alternatively, the connecting portion (730) may be a region positioned in the folding area among a region of the second liquid pipe (7232). Referring to FIGS. 13A and 13B described below, the connecting portion (730) may include a groove (731) having a predetermined pattern. The connecting portion (730) may be folded or unfolded together with the electronic device (600) through the groove (731) formed in a predetermined pattern.

According to one embodiment, as illustrated in FIGS. 12a and 12b, the first heat dissipation member (710) may be disposed in the first housing (610) and the second housing (620).

In one embodiment, referring to FIG. 12A, the first heat dissipation member (710) may be disposed in the first mounting portion (612) of the first housing (610), the second mounting portion (613) of the first housing (610), and the fourth mounting portion (623) of the second housing (620). In one embodiment, the first heat exchange portion (711) of the first heat dissipation member (710) may be disposed in the first mounting portion (612) and may be in contact with the first electronic component. In one embodiment, the second heat exchange portion (712) may be disposed on the third surface (621C) of the second inner wall portion (621). The first steam pipe (7131) may be arranged on the first bulkhead portion (614) of the first housing (610), the first surface (611A) of the first inner wall portion (611), the second surface (611B) of the first inner wall portion (611), the third surface (611C) of the first inner wall portion (611), and the first surface (621A) of the second inner wall portion (621) of the second housing (620) and the second surface (621B) of the second inner wall portion (621). The first liquid pipe (7132) may be arranged on the second bulkhead portion (624). The above-described arrangement structure of the first heat dissipation member (710) is merely an example and may be variously modified within a range that can be implemented by a person skilled in the art.

In one embodiment, referring to FIG. 12B, the first heat exchange member (711) of the first heat dissipation member (710) may be disposed on the first mounting member (612) and may be in contact with the first electronic component. In one embodiment, the second heat exchange member (712) may be disposed on the third surface (621C) of the second inner wall portion (621). The first vapor pipe (7131) may be disposed on the first bulkhead portion (614) of the first housing (610), the first surface (611A) of the first inner wall portion (611), the second surface (611B) of the first inner wall portion (611), and the first surface (621A) of the second inner wall portion (621). The first liquid pipe (7132) may be disposed on the second bulkhead portion (624). The arrangement structure of the first heat dissipation member (710) described above is merely an example and can be modified in various ways within the range that can be implemented by a person skilled in the art.

According to one embodiment of the present disclosure, as illustrated in FIGS. 12A and 12B , the first heat dissipation member (710) may be disposed in the first housing (610) and the second housing (620). In this case, compared to a case where the first heat dissipation member (710) is disposed only in the first housing (610), an area where heat generation of the first electronic component disposed in the first mounting portion (612) is spread may increase, thereby improving heat dissipation efficiency.

According to one embodiment, as illustrated in FIGS. 12A and 12B , the first heat dissipation member (710) may include a connecting portion (730) at least partly positioned in the folding area of the display and folded together with the electronic device (600). In one embodiment, the connecting portion (730) may be a component of the first vapor tube (7131) and the first liquid tube (7132). For example, the connecting portion (730) may be a region positioned in the folding area of one region of the first vapor tube (7131). Additionally, the connecting portion (730) may be a region positioned in the folding area of one region of the first liquid tube (7132). Referring to FIGS. 13A and 13B described below, the connecting portion (730) may include a groove (731) having a predetermined pattern. The connecting portion (730) can be folded or unfolded together with the electronic device (600) through a groove (731) formed in a certain pattern.

According to one embodiment, the connecting portion (730) may be a portion that folds together with a folding region among one component (e.g., the first heat exchange portion (711), the second heat exchange portion (712), the third heat exchange portion (721), the fourth heat exchange portion (722), the first vapor pipe (7131), the second vapor pipe (7231), the first liquid pipe (7132), and the second liquid pipe (7232)) of the first heat dissipation member (710) and/or the second heat dissipation member (720). Hereinafter, for convenience of explanation, it is assumed that the connecting portion (730) is formed in the first vapor pipe (7131) and the first liquid pipe (7132) of the first heat dissipation member (710), as illustrated in FIGS. 12a and 12b. However, it may not be limited thereto, and as illustrated in FIG. 11, the connecting portion (730) may be formed in the second steam pipe (7231) and/or the second liquid pipe (7232) of the second heat dissipation member (720).

In one embodiment, referring to FIG. 13a, the connecting portion (730) may include a plurality of grooves (731) extending in a direction parallel to the folding axis of the electronic device (600). In one embodiment, the plurality of grooves (731) may be formed by processing an outer surface (7131a) of a first vapor tube (7131) or an outer surface (7132a) of a first liquid tube (7132) formed of a metal material. In one embodiment, referring to FIG. 13b, the connecting portion (730) may include a groove (731) extending in a direction inclined at a predetermined angle with respect to the folding axis of the electronic device (600). In one embodiment, the connecting portion (730) may secure flexibility to be folded or unfolded together with the electronic device (600) through the plurality of grooves (731).

In one embodiment, referring to FIGS. 13a and 13b, a wick structure (732) may be arranged in a conduit (7131b) of a first vapor pipe (7131). The wick structure (732) may be a mesh structure formed of metal. In one embodiment, the first vapor pipe (7131) may move vapor to the second heat exchange unit (712) through a capillary phenomenon by the wick structure (732). In one embodiment, a wick structure (732) may be arranged in a conduit (7132b) of a first liquid pipe (7132). The first liquid pipe (7132) may move liquid to the first heat exchange unit (711) through a capillary phenomenon by the wick structure (732).

In one embodiment, referring to FIG. 13c, a cover member (734) may be placed on the connection member (730) to cover a groove (731) of the connection member (730). In one embodiment, the cover member (734) may be formed of a polymer material (734) such as silicone or polyurethane. In one embodiment, the cover member (734) may be placed on the connection member (730) of the first vapor pipe (7131) to block vapor from leaking out. In one embodiment, the cover member (734) may be placed on the connection member (730) of the first liquid pipe (7132) to block vapor from leaking out.

According to one embodiment, the diameters of the first vapor pipe (7131), the first liquid pipe (7132) of the first heat dissipation member (710), the second vapor pipe (7231), and the second liquid pipe (7232) of the second heat dissipation member (720) can be determined based on the bending radii of the first vapor pipe (7131), the first liquid pipe (7132), the second vapor pipe (7231), and the second liquid pipe (7232) at the connection portion (730). In one embodiment, as illustrated in FIGS. 12a and 12b, when a portion (e.g., a connection portion (730)) of the first vapor pipe (7131) and the first liquid pipe (7132) is folded in the folding region, the diameter of the first vapor pipe (7131) and the first liquid pipe (7132) may be formed to be about 1/3 times the preset bending radius of the first vapor pipe (7131) and the first liquid pipe (7132). In one embodiment, when a portion (e.g., a connection portion (730)) of the second vapor pipe (7231) and the second liquid pipe (7232) is folded in the folding region, the diameter of the second vapor pipe (7231) and the second liquid pipe (7232) may be formed to be about 1/3 times the preset bending radius of the first vapor pipe (7131) and the first liquid pipe (7132).

According to one embodiment, as illustrated in FIG. 14, a first heat dissipation member (710) disposed in a first housing (610) and a second heat dissipation member (720) disposed in a second housing (620) may be connected through a third heat dissipation member (740) positioned in a folding area. In one embodiment, the third heat dissipation member (740) may be made of a metal material and may thermally connect the first heat dissipation member (710) and the second heat dissipation member (720). In this case, heat of the first electronic component spread to the first heat dissipation member (710) may be transferred to the second heat dissipation member (720) through the third heat dissipation member (740). Accordingly, an area in which heat generated from the first electronic component spreads may increase, so that heat dissipation efficiency of the electronic device (600) may be improved.

The electronic devices according to various embodiments disclosed in this document may be devices of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliance devices. The electronic devices according to embodiments of this document are not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integrally configured component or a minimum unit of the component or a portion thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the called at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, ‘non-transitory’ simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store ^TM ) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a part of the computer program product may be at least temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or an intermediary server.

According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately arranged in other components. According to various embodiments, one or more of the components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, the multiple components (e.g., a module or a program) may be integrated into one component. In such a case, the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components before the integration. According to various embodiments, the operations performed by the module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

It will be appreciated that the present invention contemplates and includes, in addition to the embodiments disclosed above, embodiments based on combinations of any two or more of the embodiments disclosed above, and embodiments comprising any combination of the features disclosed herein. That is, the absence of an explicit indication that two features may be combined or that two embodiments may be combined does not mean that such a combination is not envisioned, but rather that such a combination is intended to be included herein.

According to one embodiment of the present disclosure, an electronic device (400) (e.g., the electronic device (101) of FIG. 1 , the electronic device (200) of FIG. 2A , the electronic device (300) of FIG. 3 , and/or the electronic device (600) of FIG. 10 ) may include a first housing (410) (e.g., the first housing (610) of FIG. 10 ) including a front surface (410A) (e.g., the front surface (210A) of FIG. 2A ), a back surface (410B) opposite to the front surface (e.g., the back surface (210B) of FIG. 2B ), a side surface (410C) surrounding a space between the front surface and the back surface (e.g., the side surface (210C) of FIG. 2A ), and a first inner wall portion (421) facing the inner space (e.g., the first inner wall portion (611) of FIG. 10 ). In addition, it may include a first mounting portion (422) formed in the first housing and on which a first electronic component is placed (e.g., the first mounting portion (612) of FIG. 10). In addition, it may include a second mounting portion (423) formed in the first housing and on which a second electronic component is placed (e.g., the second mounting portion (613) of FIG. 10). In addition, it may include a first heat dissipation member (510) (e.g., the first heat dissipation member (710) of FIG. 10) including a first partition wall portion (424) (e.g., the first partition wall portion (614) of FIG. 10) extending from the first inner wall portion and separating the first mounting portion and the second mounting portion, a first heat exchange unit (511) (e.g., the first heat exchange unit (711) of FIG. 10) positioned in the first mounting portion and in contact with the first electronic component, a second heat exchange unit (512) (e.g., the second heat exchange unit (712) of FIG. 10) positioned in the second mounting portion, and a first conduit (513) (e.g., the first conduit (713) of FIG. 10) at least partially disposed in the first partition wall portion and the first inner wall portion and connecting the first heat exchange unit and the second heat exchange unit.

In addition, one of the first mounting portion and the second mounting portion faces the front surface of the electronic device, and the other one faces the back surface of the electronic device, and the first housing may include a first opening (431) connecting the front surface and the back surface of the electronic device and through which a part of the first heat dissipation member passes.

In addition, the first mounting portion and the second mounting portion may be formed in the first housing so as to face one of the front and back surfaces of the electronic device, and the first partition wall portion may include a second opening (432) (e.g., the second opening (616) of FIG. 10) that connects the first mounting portion and the second mounting portion and through which a part of the first heat dissipation member passes.

In addition, the first heat exchange unit of the first heat dissipation member may convert liquid into vapor through heat transferred from the first electronic component, the second heat exchange unit of the first heat dissipation member may convert vapor generated in the first heat exchange unit into liquid, and the first conduit may include a first vapor conduit (5131) (e.g., the first vapor conduit (7131) of FIG. 10) that transfers vapor generated in the first heat exchange unit to the second heat exchange unit, and a first liquid conduit (5132) (e.g., the first liquid conduit (7132) of FIG. 10) that transfers liquid generated in the second heat exchange unit to the first heat exchange unit.

In addition, the first inner wall portion may include a first surface (421A) facing the first bulkhead portion and on which the second heat exchange portion is arranged (e.g., the first surface (611A) of FIG. 10), a second surface (421B) located between the bulkhead portion and the first surface and on which the first steam pipe is arranged (e.g., the second surface (611B) of FIG. 10), and a third surface (421C) facing the second surface and on which the first liquid pipe is arranged (e.g., the third surface (611C) of FIG. 10).

Additionally, at least one surface of the second heat exchanger, the first steam pipe, and the first liquid pipe may be formed as a plane.

Additionally, the cross sections of the second heat exchanger, the first steam pipe, and the first liquid pipe may be circular.

Additionally, the second heat exchanger, the first steam pipe and the first liquid pipe may face the second electronic component.

In addition, the first heat exchange unit of the first heat dissipation member may include a contact unit (5111) that comes into contact with the first electronic component, a compensation chamber (5112) through which liquid generated in the second heat exchange unit is transferred, and a blocking unit (5114) that partitions the contact unit and the compensation chamber.

Additionally, at least one of the contact portion, the vapor pipe and the liquid pipe of the first heat exchanger may include a wick structure (5113) positioned therein.

In addition, the display (330) may further include a front surface, a back surface opposite to the front surface, a side surface surrounding a space between the front surface and the back surface, and a second inner wall portion (621) facing the inner space, a second housing (620) that is rotatably connected to the first housing, and a folding region that is arranged on the front surface of the first housing and the second housing and in which a portion of the folding region is deformed by rotation of the second housing relative to the first housing (e.g., the display (160) of FIG. 1 and/or the display (201) of FIG. 2A).

In addition, it may include a second heat dissipation member (720) including a third mounting portion (622) formed in the second housing and having a third electronic component placed therein, a fourth mounting portion (623) formed in the second housing and having a fourth electronic component placed therein, a second partition portion (624) extending from the second inner wall portion and partitioning the third mounting portion and the fourth mounting portion, a third heat exchange portion (721) positioned in the third mounting portion and in contact with the third electronic component, a fourth heat exchange portion (722) positioned in the fourth mounting portion, and a second conduit (723) at least partially disposed in the second partition portion and the second inner wall portion and connecting the third heat exchange portion and the fourth heat exchange portion.

In addition, the third heat exchange unit of the second heat dissipation member may convert liquid into vapor through heat transferred from the third electronic component, the fourth heat exchange unit of the second heat dissipation member may convert vapor generated in the third heat exchange unit into liquid, and the second conduit may include a second steam pipe (7231) that transfers vapor generated in the third heat exchange unit to the fourth heat exchange unit and a second liquid pipe (7232) that transfers liquid generated in the fourth heat exchange unit to the third heat exchange unit.

In addition, the second heat dissipation member (720) may further include a third mounting portion (622) formed in the second housing and having a third electronic component disposed thereon, a fourth mounting portion (623) formed in the second housing and having a fourth electronic component disposed thereon, a second partition wall portion (624) extending from the second inner wall portion and partitioning the third mounting portion and the fourth mounting portion, a third heat exchange portion (721) positioned in the first mounting portion and in contact with the first electronic component, a fourth heat exchange portion (722) positioned in the fourth mounting portion, and a second conduit (723) at least partially disposed in the second partition wall portion and the second inner wall portion and connecting the third heat exchange portion and the fourth heat exchange portion.

Additionally, at least one of the first heat dissipation member and the second heat dissipation member may include a connecting portion (730) at least a portion of which is positioned in the folding area.

Additionally, the connecting portion may include a groove (731) extending in a direction parallel to the folding axis of the electronic device.

Additionally, the connecting portion may include a groove (731) extending in a direction inclined at a certain angle with respect to the folding axis of the electronic device.

In addition, it may further include a cover part (734) formed of a polymer material and covering the above connecting part.

In addition, it may further include a second heat dissipation member (720) disposed in the second housing and a third heat dissipation member (740) formed of a metal material and having at least a portion positioned in the folding area and connecting the first heat dissipation member and the second heat dissipation member.

According to one embodiment of the present disclosure, an electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, the electronic device (300) of FIG. 3, and/or the electronic device (600) of FIG. 10) may include a housing (410) (e.g., the first housing (610) of FIG. 10) including a mounting portion (422) on which an electronic component is placed (e.g., the first mounting portion (612) of FIG. 10), a first-first inner wall portion (421-1) facing the mounting portion, a first-second inner wall portion (421-2) positioned between the mounting portion and the first inner wall portion, and a first-third inner wall portion (421-3) facing the first-second inner wall portion. In addition, at least a portion of the heat dissipation member (510) (e.g., the first heat dissipation member (710) of FIG. 10) that is in contact with the first electronic component may be included, and the heat dissipation member may include a first heat exchange unit (511) (e.g., the first heat exchange unit (711) of FIG. 10) that is in contact with the first electronic component, a second heat exchange unit (512) (e.g., the second heat exchange unit (712) of FIG. 10) located inside the 1-1 inner wall portion, a steam pipe (5131) (e.g., the first steam pipe (7131) of FIG. 10) located inside the 1-2 inner wall portion and connecting the first heat exchange unit and the second heat exchange unit, and a liquid pipe (5132) (e.g., the first liquid pipe (7132) of FIG. 10) located inside the 1-3 inner wall portion and connecting the first heat exchange unit and the second heat exchange unit.

400: Electronic Device 401: Display
410: Housing 510: First heat dissipation member
511: First heat exchanger 5111: Contact part
5112: Compensation chamber 5113: Wick structure
5114: Block 512: Second heat exchanger
513: Pipe 5131: Steam pipe
5132: Liquid tube 600: Electronic device
610: First housing 611: First inner wall
620: Second housing 621: Second inner wall
710: First heat dissipation member 720: Second heat dissipation member
730: Connection

Claims (20)

In electronic devices (101, 200, 300, 400, 600),
A first housing (410, 610) including a front surface (210A, 410A), a back surface (210B, 410B) opposite to the front surface, a side surface (210C, 410C) surrounding a space between the front surface and the back surface, and a first inner wall portion (421, 611) facing the inner space;
A first mounting portion (422, 612) formed in the first housing and on which a first electronic component is placed;
A second mounting portion (423, 613) formed in the first housing and in which a second electronic component is placed;
A first partition wall portion (424, 614) extending from the first inner wall portion and dividing the first mounting portion and the second mounting portion; and
An electronic device comprising: a first heat exchange member (510, 710) positioned on the first mounting portion and in contact with the first electronic component; a second heat exchange member (512, 712) positioned on the second mounting portion; and a first conduit (513, 713) at least part of which is disposed on the first bulkhead portion and the first inner wall portion and connects the first heat exchange member and the second heat exchange member.
In the first paragraph,
One of the first mounting portion and the second mounting portion faces the front surface of the electronic device, and the other one faces the back surface of the electronic device,
The above first housing,
An electronic device comprising a first opening (431) connecting the front and back surfaces of the electronic device and through which a portion of the first heat dissipation member passes.
In the first paragraph,
The above first anchorage and the above second anchorage,
formed in the first housing so as to face either the front or back surface of the electronic device,
The above first bulkhead section,
An electronic device comprising a second opening (432, 616) connecting the first mounting portion and the second mounting portion and through which a part of the first heat dissipation member passes.
In the first paragraph,
The first heat exchange part of the first heat dissipation member is,
The liquid is converted into vapor through the heat transferred from the first electronic component,
The second heat exchanger of the first heat dissipation member is,
The steam generated in the first heat exchanger is converted into liquid,
The above first conduit is,
An electronic device including a first steam pipe (5131, 7131) that transfers steam generated in the first heat exchange unit to the second heat exchange unit and a first liquid pipe (5132, 7132) that transfers liquid generated in the second heat exchange unit to the first heat exchange unit.
In paragraph 4,
The above first inner wall portion,
An electronic device comprising a first surface (421A, 611A) facing the first bulkhead section and having the second heat exchange section arranged thereon, a second surface (421B, 611B) located between the bulkhead section and the first surface and having the first vapor pipe arranged thereon, and a third surface (421C, 611C) facing the second surface and having the first liquid pipe arranged thereon.
In paragraph 4,
An electronic device in which at least one surface of the second heat exchanger, the first steam pipe, and the first liquid pipe is formed as a plane.
In paragraph 4,
An electronic device in which the cross sections of the second heat exchanger, the first steam pipe, and the first liquid pipe are circular.
In paragraph 4,
An electronic device wherein the second heat exchanger, the first steam pipe, and the first liquid pipe face the second electronic component.
In paragraph 4,
The first heat exchange part of the first heat dissipation member is,
An electronic device comprising a contact portion (5111) that comes into contact with the first electronic component, a compensation chamber (5112) to which liquid generated in the second heat exchange portion is transferred, and a blocking portion (5114) that partitions the contact portion and the compensation chamber.
In paragraph 4,
An electronic device comprising a wick structure (5113) positioned inside at least one of the contact portion, the vapor pipe and the liquid pipe of the first heat exchanger.
In the first paragraph,
A second housing (620) including a front side, a back side opposite to the front side, a side surface surrounding the space between the front side and the back side, and a second inner wall portion (621) facing the inner space, and rotatably connected to the first housing; and
An electronic device further comprising a display (160, 201, 330) disposed on the front surface of the first housing and the second housing and including a folding area in which a portion of the folding area is deformed by rotation of the second housing relative to the first housing.
In Article 11,
A third mounting portion (622) formed in the second housing and in which a third electronic component is placed;
A fourth mounting portion (623) formed in the second housing and in which a fourth electronic component is placed;
A second partition wall portion (624) extending from the second inner wall portion and dividing the third mounting portion and the fourth mounting portion; and
An electronic device comprising a second heat dissipation member (720) including a third heat exchange member (721) positioned in the third mounting portion and in contact with the third electronic component, a fourth heat exchange member (722) positioned in the fourth mounting portion, and a second conduit (723) at least part of which is disposed in the second bulkhead portion and the second inner wall portion and connects the third heat exchange member and the fourth heat exchange member.
In Article 12,
The third heat exchanger of the second heat dissipation member is,
The liquid is converted into vapor through the heat transferred from the third electronic component,
The fourth heat exchanger of the second heat dissipation member is,
The vapor generated in the third heat exchanger is converted into liquid,
The above second conduit,
An electronic device including a second steam pipe (7231) that transfers steam generated in the third heat exchange unit to the fourth heat exchange unit and a second liquid pipe (7232) that transfers liquid generated in the fourth heat exchange unit to the third heat exchange unit.
In Article 12,
A third fixing portion (622) in which a third electronic component is placed and formed in the second housing;
A fourth fixing portion (623) in which a fourth electronic component is placed and formed in the second housing;
A second partition wall portion (624) extending from the second inner wall portion and dividing the third mounting portion and the fourth mounting portion; and
An electronic device further comprising a second heat dissipation member (720) including a third heat exchange member (721) positioned in the first mounting portion and in contact with the first electronic component, a fourth heat exchange member (722) positioned in the fourth mounting portion, and a second conduit (723) at least part of which is disposed in the second bulkhead portion and the second inner wall portion and connects the third heat exchange member and the fourth heat exchange member.
In Article 11 or 14,
An electronic device comprising a connecting portion (730) in which at least one of the first heat dissipation member and the second heat dissipation member is located at least partially in the folding area.
In Article 15,
The above connecting part,
An electronic device comprising a groove (731) extending in a direction parallel to the folding axis of the electronic device.
In Article 15,
The above connecting part,
An electronic device including a groove (731) extending in a direction inclined at a certain angle with respect to the folding axis of the electronic device.
In Article 16 or 17,
An electronic device further comprising a cover portion (734) formed of a polymer material and covering the above connecting portion.
In Article 11,
A second heat dissipation member (720) disposed in the second housing; and
An electronic device further comprising a third heat dissipation member (740) formed of a metal material and at least a portion of which is positioned in the folding area and connects the first heat dissipation member and the second heat dissipation member.
In electronic devices (101, 200, 300, 400, 600),
A housing (410, 610) including a mounting portion (422, 612) on which electronic components are placed, a first-first inner wall portion (421-1) facing the mounting portion, a first-second inner wall portion (421-2) positioned between the mounting portion and the first inner wall portion, and a first-third inner wall portion (421-3) facing the first-second inner wall portion; and
At least a portion of the heat dissipation member (510, 710) is in contact with the first electronic component;
The above heat dissipation member is,
An electronic device comprising a first heat exchange unit (511, 711) in contact with the first electronic component, a second heat exchange unit (512, 712) located inside the 1-1 inner wall portion, a steam pipe (5131, 7131) located inside the 1-2 inner wall portion and connecting the first heat exchange unit and the second heat exchange unit, and a liquid pipe (5132, 7132) located inside the 1-3 inner wall portion and connecting the first heat exchange unit and the second heat exchange unit.

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