KR20240152270A - Test chamber - Google Patents

Abstract

The present invention relates to a technology for controlling the temperature of electronic components accommodated in a test chamber used for testing electronic components.
According to the present invention, a supply duct for supplying temperature-controlling air to a receiving space of a test chamber is composed of an induction section, a discharge section, and a connection section, and the direction of movement of the temperature-controlling air is switched at the connection section, thereby enabling the temperature-controlling air to be supplied uniformly to each location in the receiving space. In addition, an injection duct for injecting temperature-controlling air while facing a test board one-to-one within the receiving space is provided, thereby enabling precise temperature control of electronic components, thereby improving the reliability of testing.

Description

Test Chamber {TEST CHAMBER}

The present invention relates to a test chamber capable of accommodating a test board loaded with electronic components and then controlling the temperature of the electronic components electrically connected to a tester.

The produced electronic components are tested by testers and then divided into good and bad products, and only good products are shipped.

Since electronic components can be used in various environments, it is necessary to maintain a harsh high-temperature environment when testing electronic components. Therefore, the electronic components are accommodated in a space within a sealable test chamber, and the space is maintained in a harsh temperature environment so that thermal stress is applied to the electronic components. Of course, the electronic components are electrically connected to the tester while positioned in the space. Of course, the harsh temperature environment can be not only a high-temperature environment but also a low-temperature environment, and the daily temperature environment can be room temperature, so equipment capable of testing for each situation is required.

On the other hand, the shorter the electrical connection distance between the tester and the electronic component, the better. This is because if the electrical connection distance between the tester and the electronic component is long, not only may the electrical signal be distorted or noisy, but data may also be lost, making it difficult to ensure test reliability.

Of course, there are tests where a long electrical connection between the tester and the electronic components will not be a particular problem, but there are also tests where the above problems can occur if the electrical connection between the tester and the electronic components is long, and there are also tests that require high speed.

For example, in the case of the Burn In test, which has a very long test time, there has been no particular problem even if the electrical connection distance between the tester and the electronic component is long. Here, the Burn In test refers to a test that is performed under a high temperature (85 to 125 degrees) stress condition to find potential defects in the electronic component. This is because the Burn In test process did not perform a test that required high speed, and there was no need to perform one.

Burn-in testing is performed over a long period of time while applying electrical stress such as voltage and current higher than the actual usage conditions of electronic components as well as temperature. For this burn-in testing, a tester, burn-in board, and burn-in chamber are required.

A burn-in board is a type of test board that can carry a large number of electronic components and electrically connect them to a tester. It can carry electronic components and has a mounting socket, electrical circuit, and connector for electrically connecting the electronic components to the tester.

A burn-in chamber is a type of test chamber that has a space for accommodating a test board with electronic components, and can create a temperature environment to apply thermal stress to the electronic components accommodated in the space.

Figure 1 shows a structure in which a burn-in board (BIB) accommodated in a burn-in chamber is electrically connected to a tester (TESTER).

As referenced in Fig. 1, in order for an electronic component (D) to be connected to a tester (TESTER), a terminal of a mounting socket (S), an electric circuit (EC), a connector (C), and a connecting member (CE, a connecting part along a path passing through the wall of a burn-in chamber) are required. In other words, the distance of the connecting circuit for connecting the electronic component (D) to the tester (TESTER) is long and multiple connecting elements are provided. For this reason, tests that may cause problems if the electrical connection distance between the tester (TESTER) and the electronic component (D) is long or tests that require a fast and immediate response cannot be performed with a conventional burn-in tester.

For example, electronic components such as memory semiconductor devices have additional test items for electronic components, unlike in the past. In addition to simple ON/OFF operation tests, tests are required for how quickly data (such as large amounts of data such as video) can be read or stored, how quickly they can be displayed on the screen, and whether they can operate without problems. In addition, these tests need to be performed in a very short period of time, and for this to happen, the connection distance between the electronic component and the tester must be short. As a result, a separate test system different from the burn-in test system is required, which leads to a waste of resources, time, and manpower.

In addition, as electronic components evolve, it cannot be ruled out that the electric circuit (EC) of the burn-in board may have various electronic components required for testing. In such a case, the various electronic components may be damaged or have their lifespan shortened by being exposed to the harsh temperature environment created in the receiving space of the test chamber.

On the other hand, tests requiring a short time, or tests due to the evolution of electronic components or additional test items may require more precise control of the temperature of electronic components. Since the temperature of the electronic components being tested is related to the reliability of the test, the temperature conditions for each individual electronic component required in each test need to be precisely controlled so as not to exceed the allowable error range.

Republic of Korea Publication Patent No. 10-2003-0029266 Republic of Korea Publication Patent No. 10-2005-0055685

The present invention has the following purposes.

First, it provides a technology that enables instantaneous temperature control of electronic components, considering cases where short and rapid tests are involved.

Second, it provides a technology that allows all electronic components to be tested under the same temperature conditions as possible, even if they are located in separate spaces within the test chamber.

A test chamber according to a first aspect of the present invention comprises: a chamber body having an accommodation space for accommodating test boards having electronic components, one side of which is open; an opening/closing door for opening or closing the accommodation space by opening/closing one side of the chamber body; and a temperature control device for regulating the temperature of electronic components mounted on the test boards accommodated in the chamber body; wherein the temperature control device comprises: an air supplier for supplying temperature-regulating air for regulating the temperature of the accommodation space; and a supply duct for distributing and supplying the temperature-regulating air supplied from the air supplier to various locations in the accommodation space; wherein the supply duct comprises: a discharge section having discharge holes for discharging air to locations corresponding to the various locations; an induction section for guiding temperature-regulating air from the air supplier to the discharge section; and a connecting section for connecting the induction section and the discharge section. , and the direction of movement of the temperature-controlling air is switched at the connecting portion, so that the direction of movement of the temperature-controlling air at the discharge portion and the direction of movement of the temperature-controlling air at the induction portion are different from each other.

The above discharge portion and the above induction portion are provided together on one side based on the above receiving space.

The above connecting portion changes the direction of movement of temperature-controlling air coming through the above induction portion by 180 degrees, and the distance between the discharge portion and the receiving space and the distance between the induction portion and the receiving space are the same.

The above supply duct further includes a re-entry section that allows temperature-controlling air that has passed through the discharge section to re-enter the induction section, thereby allowing temperature-controlling air to circulate within the supply duct.

The above-described accommodation space can accommodate a plurality of test boards, and the temperature control device is positioned in the accommodation space and arranged to face the plurality of test boards one-to-one, and includes a plurality of injection ducts for injecting temperature-controlling air coming through the supply duct toward the test boards; and a plurality of branch ducts branching from the injection duct to move temperature-controlling air discharged from the supply duct through the discharge holes to the injection ducts.

The above-mentioned receiving space is divided into several independent spaces with air exchange between them blocked, and the several injection ducts are arranged one-to-one in the several independent spaces.

The above injection duct has a plurality of injection holes for injecting temperature-controlling air, and the injection duct has an induction member that induces the movement of temperature-controlling air so that the temperature-controlling air introduced through the branch duct is evenly divided and injected into the plurality of injection holes.

The above-mentioned induction member includes a switching plate that switches the direction of the temperature-controlling air; and a securing plate that secures a movement path so that the temperature-controlling air, the direction of which is switched by the switching plate, can pass over the entire area of the injection duct; and the plurality of injection holes are formed in an area excluding the path along which the temperature-controlling air flows into the injection duct and reaches the switching plate.

A test chamber according to a second aspect of the present invention comprises: a chamber body having an accommodation space for accommodating test boards having electronic components, one side of which is open; an opening/closing door for opening or closing the accommodation space by opening/closing one side of the chamber body; and a temperature control device for regulating the temperature of the electronic components mounted on the test boards accommodated in the chamber body; wherein the temperature control device comprises: an air supplier for supplying temperature-regulating air for regulating the temperature of the accommodation space; and a plurality of injection ducts positioned in the accommodation space for distributing and supplying the temperature-regulating air supplied from the air suppliers to a plurality of locations in the accommodation space; wherein a plurality of test boards can be accommodated in the accommodation space while being spaced apart from each other, and the plurality of injection ducts are arranged to face the plurality of test boards one-to-one, such that the remaining injection ducts, except for the injection duct at one end of one side, are positioned between neighboring test boards.

The above-mentioned receiving space is divided into several independent spaces with air exchange between them blocked, and the several injection ducts are arranged one-to-one in the several independent spaces.

A test chamber according to a third aspect of the present invention comprises: a chamber body having an accommodation space for accommodating test boards having electronic components, one side of which is open; an opening/closing door for opening or closing the accommodation space by opening/closing one side of the chamber body; and a temperature control device for regulating the temperature of electronic components mounted on the test boards accommodated in the chamber body; wherein the temperature control device comprises: an air supplier for supplying temperature-regulating air for regulating the temperature of the accommodation space; and at least one injection duct positioned in the accommodation space and injecting temperature-regulating air supplied from the air supplier into the accommodation space; wherein the injection duct has a plurality of injection holes for injecting the temperature-regulating air, and the injection duct has an induction member for inducing the movement of the temperature-regulating air so that the introduced temperature-regulating air is evenly divided and injected into the plurality of injection holes.

The above-mentioned induction member includes a switching plate that switches the direction of the temperature-controlling air; and a securing plate that secures a movement path so that the temperature-controlling air, the direction of which is switched by the switching plate, can pass over the entire area of the injection duct; and the plurality of injection holes are formed in an area excluding the path along which the temperature-controlling air flows into the injection duct and reaches the switching plate.

According to the present invention, the following effects are achieved.

First, since the temperature-controlling air is directly injected into the electronic components, immediate and precise temperature control of the electronic components is possible, thereby ensuring reliability for tests requiring short test times and high speeds.

Second, temperature control is possible because it is efficient across high, room, and low temperatures.

Third, the reliability of the test is improved because the test can be conducted without temperature deviation for each electronic component.

Fourth, by supplying temperature-controlling air through multiple injection ducts using a single air supply and evenly distributing the amount of air supplied to each injection duct, the temperature conditions of electronic components accommodated in each independent space can be the same even if the accommodation space is divided into several independent spaces.

Figure 1 is a reference diagram for explaining the connection structure of a tester and electronic components in a burn-in test.
Figure 2 is a plan perspective view of the test board.
Figure 3 is a bottom perspective view of the test board of Figure 2.
Figure 4 is an exploded perspective view of the test board of Figure 2.
Figure 5 is a conceptual side view of the test board of Figure 2.
Figure 6 is a front perspective view of a test chamber according to one embodiment.
Fig. 7 is a reference diagram for explaining an independent space in the test chamber of Fig. 6.
FIGS. 8 and 9 are reference drawings for explaining a test chamber according to another embodiment.
Figures 10 and 11 are reference drawings for explaining modified examples of the test board and test chamber.
Figure 12 is a reference diagram for explaining a conventional technology related to temperature control of electronic components.
Figure 13 is an excerpted perspective view of a temperature control device provided in a test chamber according to the present invention.
Fig. 14 is an excerpt of a supply duct applied to the temperature control device of Fig. 13.
Figures 15 and 16 are reference drawings for explaining the advantages of the supply duct of Figure 14.
Figure 17 is a reference drawing for explaining the location of the supply duct of Figure 14.
Figure 18 is a partially exploded perspective view of the supply duct of Figure 14.
Figure 19 is a reference drawing for explaining the arrangement relationship between the supply duct and the receiving space of Figure 14.
Fig. 20 is a partially exploded perspective view of the injection duct applied to the temperature control device of Fig. 13.
Fig. 21 is a reference diagram for explaining another example of a test chamber to which the temperature control device of Fig. 13 is applied.

A preferred embodiment of the present invention will be described with reference to the attached drawings. However, for the sake of brevity, descriptions of redundant or substantially identical components are omitted or compressed as much as possible.

<Description of the test board - Example of a test board with an insulating space>

FIG. 2 is a plan perspective view of a test board (TB) that can be accommodated in a test chamber according to the present invention, FIG. 3 is a bottom perspective view of the test board (TB) of FIG. 2, FIG. 4 (a) and (b) are a top exploded perspective view and a bottom exploded perspective view, respectively, of the test board (TB) of FIG. 2, and FIG. 5 is a conceptual side view of the test board (TB) of FIG. 2.

As shown in FIGS. 2 to 5, the test board (TB) includes a board body (BB), a connector (C), an auxiliary tester (AT), and a shielding material (SE).

The board body (BB) can carry electronic components and includes a mounting socket (S) and a circuit board (CB).

The mounting socket (S) is provided in a matrix form, and the electronic components to be tested are loaded into it. In this embodiment, the mounting socket (S) is provided in 8 rows, with 12 in each row. Therefore, a total of 96 electronic components are loaded one by one into each of the mounting sockets (S) and are loaded onto the board body (BB). Of course, the number of mounting sockets (S) may vary depending on the embodiment for each test board (TB).

The circuit board (CB) has an electric circuit (EC) that relays electrical signals between electronic components and a tester, and the mounting socket (S) above is electrically connected to the electric circuit (EC), so that electronic components mounted on the mounting socket (S) can be electrically connected to the tester through the electric circuit (CE).

The connector (C) is coupled to one side of the board body (BB) and is electrically connected to the electric circuit (EC) and also electrically connected to the tester, thereby electrically connecting the electric circuit (EC) to the tester. Therefore, when the connector (C) is electrically connected to the tester, the electronic component is electrically connected to the tester by placing the mounting socket (S), the electric circuit (EC), the connector (C), and the connecting member (see background art).

The auxiliary tester (AT) is provided so as to be exposed downward on the bottom surface side of the circuit board (CB) and is electrically connected to the electronic components loaded in the mounting socket (S) through the electric circuit (EC) to perform an auxiliary test different from the main test performed by the tester. Here, the main test may be, for example, a burn-in test, and the auxiliary test may be, for example, a test on the electrical operation characteristics of the electronic components with a short test time. The auxiliary tester (AT) may be implemented to generate a signal for the auxiliary test and apply it to the electronic components, and to send a response signal from the electronic components to the tester as it is or to send it to the tester after amplifying it. Therefore, it is preferable that one auxiliary tester (AT) is provided per one mounting socket (S). However, depending on the implementation, it may also be sufficiently considered that one auxiliary tester (AT) corresponds to multiple mounting sockets (S), as referenced in (b) of FIG. 4. Of course, in the case where one auxiliary tester (AT) corresponds to multiple fixing sockets (S) as in (b) of Fig. 4, it is desirable that the distances between the auxiliary tester (AT) and multiple fixing sockets are all the same in order to obtain the same test conditions. In addition, since the auxiliary tester (AT) is electrically connected to the electric circuit (EC), it can also be interpreted as one electronic component constituting the electric circuit (EC).

The shielding material (SE) is provided to form an insulating space (IS) on the side where the auxiliary tester (AT) is present. Here, the auxiliary tester (AT) is provided on the circuit board (CB), but since it is provided on the side opposite to the side where the mounting socket (S) having electronic components is installed, the insulating space (IS) formed by the shielding material (SE) is located on the side opposite to the side where the electronic components are mounted. Therefore, the auxiliary tester (AT) is installed on the circuit board (CB) so as to be exposed on the side of the insulating space (IS) formed by the shielding material (SE). The shielding material (SE) has a supply hole (SH) and a return hole (RH) for supplying and recovering a temperature-controlling fluid to the insulating space (IS) in order to control the temperature of the insulating space (IS). Here, the temperature-controlling fluid may be air at room temperature, dry air at room temperature, a gas mixed with dry air at room temperature and a low-temperature gas (LN2 gas), or a single low-temperature gas. The reason for using such a variety of fluid types is that the test temperature can be high temperature, room temperature, low temperature, etc., and the type of temperature-controlling fluid and the temperature of the temperature-controlling fluid can vary depending on the various test temperature conditions. For example, if condensation is expected, dry air should be supplied, and if not, normal air can be supplied. Also, in the case of room temperature, the same fluid at the same temperature can be supplied equally through all injection locations, or different fluids at different temperatures can be supplied depending on the injection location. In other words, there may or may not be a temperature difference depending on the injection location (area).

For reference, a supply device for supplying a fluid for temperature control may be provided in the test chamber (100), but may also utilize a fluid supply system built as a basic facility in the factory.

The supply holes (SH) are arranged in two separate sections and are formed to supply temperature-control fluid to the insulating space (IS).

The recovery holes (RH) are arranged in groups of four, with a total of eight, so that four are allocated to each supply hole (SH), and are formed to recover the temperature-controlling fluid used for temperature control of the auxiliary tester (AT) to the supply device after flowing into the insulating space (IS) through the supply hole (SH).

It is preferable that the above supply hole (SH) and return hole (RH) are formed in the same direction, taking into consideration the design of the pipe for supplying and recovering the temperature control fluid, the connection structure of the supply hole (SH) and the return hole (RH) and the pipe (a structure that allows the supply hole and the return hole to be connected to each pipe together through a single installation operation), etc. Therefore, in order to prevent the temperature control fluid supplied to the insulation space (IS) through the supply hole (SH) from being directly recovered to the supply device through the recovery hole (RH), it is preferable that the test board (TB) additionally have a supply pipe (ST) that allows the temperature control fluid supplied to the supply hole (SH) to be supplied throughout the entire insulation space (IS) and then recovered.

The supply pipe (ST) may be provided so that the temperature-controlling fluid is sprayed from the opposite side of the supply hole (SH) and the return hole (RH). In addition, the supply pipe (ST) may be provided so that the temperature-controlling fluid is evenly sprayed into the insulating space (IS) by forming a plurality of injection holes in the longitudinal direction of the supply pipe (ST). Here, it may be considered preferable that the plurality of injection holes are formed at positions where they can be directly and intensively sprayed toward an auxiliary tester (which may be electronic components such as an AT or an amplifier). Of course, it may also be sufficiently considered to design an indirect injection method in which the temperature-controlling fluid supplied through the supply pipe (ST) is sprayed toward the bottom surface of the insulating space (IS) so that the temperature of the entire insulating space (IS) is synchronized and the temperature of the electronic components is controlled.

And it is preferable that the supply hole (SH) and the return hole (RH) are formed on the connector (C) side. The reason for this is that when the test board (TB) accommodated in the test chamber is pressurized so that the test board (TB) is electrically connected to the tester, the supply hole (SH) and the return hole (RH) are also connected to the flow path of the pipe in the test chamber, which is convenient and structurally stable because two tasks (electrical connection task and flow path connection task) can be performed at the same time. That is, when the test board (TB) is mounted in the test chamber, the test board (TB) is pushed so that the connector (C) is electrically connected to the tester, and at this time, it is preferable to have an arrangement structure so that the supply hole (SH) and the return hole (RH) can also be closely connected to the flow path of the pipe in the test chamber.

According to the test board (TB) having the structure above, when a specific pause time is given before or after the main test is performed or during the main test (when the time required for the auxiliary test is secured), the auxiliary test is performed by the auxiliary tester (AT) at that time. When the auxiliary test is performed in this way, the auxiliary tester (AT) generates a test signal and applies it to the electronic component, and sends a response signal fed back from the electronic component to the tester through the electric circuit (EC) and the connector (C). At this time, the auxiliary tester (AT) can amplify the response signal and send it to the tester. Of course, depending on the implementation, it is entirely possible to consider configuring the electric circuit (EC) so that the auxiliary tester (AT) only generates a test signal and applies it to the electronic component, and the response signal fed back from the electronic component is directly sent to the tester.

For reference, the power required to operate the auxiliary tester (AT) can be obtained from the tester.

Here, the use of the test board (TB) is explained. When several test boards (TB) with electronic components are accommodated in the test chamber, the supply hole (SH) and the return hole (RH) are closely connected to the flow paths of the pipes provided in the test chamber, and the electronic components are electrically connected to the tester through the electric circuit (EC) and the connector (C). In this state, the main test can be performed by the tester, and as mentioned above, the auxiliary tester (AT) can also perform the auxiliary test. Meanwhile, since the accommodation space in the test chamber is maintained in a high-temperature environment, for example, in order to apply thermal stress to the electronic components, a temperature control fluid is continuously supplied to the insulating space (IS) and then recovered. Accordingly, the auxiliary tester (AT) can maintain an appropriate temperature regardless of the temperature environment of the accommodation space in the test chamber. For example, in the case of a burn-in test, since the temperature of the electronic components is set to a high temperature for the main test and the auxiliary tester (AT) may generate its own heat while the auxiliary test is in progress, it may be desirable to supply a low-temperature temperature-controlling fluid containing LN2 gas to the insulating space (IS) to reflect this situation.

Meanwhile, the above embodiment describes that the auxiliary tester (AT) generates the test signal. However, depending on the type of test, the auxiliary test signal for the auxiliary test may be received from the tester, and instead, an amplifier may be configured in the electric circuit to amplify the response signal fed back from the electronic component in response to the auxiliary test signal and send it to the tester. In other words, it may be sufficiently considered to provide an amplifier in the electric circuit (EC) of the test board (TB) instead of the auxiliary tester (AT).

<Description of the test chamber - Example of a test chamber with an insulated space>

In the description of the test board (TB) above, it was described that the insulating space is formed in the test board (TB), but an insulating space or a buffer space for protecting electronic components such as an auxiliary tester may be formed by a structure in the test chamber. In this case, the test board (TB) may also be provided with an insulating space, but it does not have to be provided. The embodiment of the test chamber according to the present invention will be described below.

1. First embodiment for test chamber

As shown in the schematic diagram of Fig. 6, the test chamber (100) according to the present embodiment includes a chamber body (110), an opening/closing door (120), and a temperature control device (130).

The chamber body (110) has an accommodation space (ES, dotted inner area) for accommodating a test board (TB) having electronic components. One side (the front side in FIG. 6) of the accommodation space (ES) is open so that the test board (TB) can be supplied to or retrieved from the accommodation space (ES). In addition, the test board (TB) accommodated in the accommodation space (ES) is electrically connected to a tester through a connecting member, and at this time, in order to ensure a close connection between the test board (TB) and the tester, it is necessary to push the test board (TB) and properly install it in the accommodation space (ES). This chamber body (110) is provided with support rails (111) and partition plates (112).

The support rail (111) serves to guide the movement of the test board (TB) when the test board (TB) is brought into or taken out of the receiving space (ES), and at the same time serves to support the test board (TB) accommodated in the receiving space (ES).

The partition plates (112) divide the receiving space (ES) into a plurality of independent spaces (SS). The plurality of independent spaces (SS) formed by the partition plates (112) block the movement of air between each other, and one test board (TB) can be accommodated in one independent space (SS).

Meanwhile, since the support rail (111) is provided between the partition plates (112) on both the upper and lower sides, when the test board (TB) is mounted in the independent space (SS) as shown in the reference drawing of FIG. 7, the independent space (SS) is divided into a first region (1S) on the upper side and a second region (2S) on the lower side with the test board (TB) in between. At this time, it is most ideal that the first region (1S) and the second region (2S) are separated into mutually thermally isolated regions where the exchange of air between them is blocked. That is, each independent space (SS) is separated into a first region (1S) and a second region (2S) by the test board (TB), the support rail (111), and the partition plate (112), and the second region (2S) below the test board (TB) functions as an insulating space. Of course, electronic components (such as auxiliary testers or amplifiers) on the test board (TB) are exposed to the second area (2S) side.

In this embodiment, since the second region (2S) formed at the bottom of the test board (TB) by the partition plate (112) is opened toward the opening/closing door (120), the second region (2S) should also be closed when the opening/closing door (120) is closed. To this end, the opening/closing door (120) is provided with sealing members (121) so that the independent spaces (SS) can be sealed by the closing of the opening/closing door (120), and at the same time, the first region (1S) and the second region (2S) are separated so that the heat transfer through mutual convection is cut off. Accordingly, when the test board (TB) is positioned in the independent space (SS) and the opening/closing door (120) is closed, the movement of air between the first area (1S) and the second area (2S) is blocked, so that the first area (1S) can function as a setting space for setting the temperature of the electronic component, and the second area (2S) can function as an insulating space or buffer space that is not affected by the temperature of the setting space or is only affected to a certain degree by conduction, etc.

And, in order to control the temperature of the second area (2S) that functions as an insulating space or buffer space, an injection hole (IH) and a suction hole (OH) are formed in the chamber body (110) to supply a temperature-controlling fluid to the inner wall forming the receiving space (ES). Accordingly, the chamber body (110) is provided with an injection pipe (IP) and a suction pipe (OP).

Of course, the injection pipe (IP) is provided to inject a temperature-controlling fluid to control the temperature of the second region (2S) into the second region (2S), and the suction pipe (OP) is provided to enable the supply device to suck the temperature-controlling fluid supplied to the second region (2S) through the injection pipe (IP) from the second region (2S).

For reference, in this embodiment, since the partition plate (112) is prepared in the test chamber (100), the flow path and the injection hole (IH) and the suction hole (OH) in the test chamber (100) can be stably connected to each other, so that the design of their formation positions can be free. That is, the injection hole (IH) and the suction hole (OH) may be formed in opposite directions, and may be installed in any direction considering the design with other structures. In addition, since the flow path of the pipes (IP, OP) and the injection hole (IH) and the suction hole (OH) are fixedly connected to each other, it is possible to secure a stable flow path for supplying and then recovering the temperature control fluid to the insulating space or buffer space, which is the second region (2S).

As described above, the opening/closing door (120) opens or closes the receiving space (ES) by opening/closing one open side of the chamber body (110). Of course, when the test board (TB) is brought into or taken out of the receiving space (ES), the receiving space (ES) must be opened, and when the electronic component is tested, the receiving space (ES) must be closed. In addition, in the present embodiment, the independent space (SS) is divided into a first region (1S) and a second region (2S) by the test board (TB), and these first region (1S) and second region (2S) are naturally also opened toward the opening/closing door (120), and by opening/closing the opening/closing door (120), the first region (1S) and second region (2S) are also opened or closed toward the opening/closing door (120).

The temperature control device (130) controls the temperature of electronic components exposed to the first region by supplying temperature control air to the first region. Since this temperature control device (130) is an important feature of the present invention, it will be described in detail later with a different table of contents.

The above-described exemplary embodiment can be appropriately applied when an electronic component such as an auxiliary tester (AT) forming an electric circuit (EC) is exposed on one side (bottom) of a test board (TB). Here, the electric circuit (EC) or the auxiliary tester (AT) are replaced with the description of the above-described test board (TB).

2. Second embodiment

The test chamber (100) according to the present embodiment also includes a chamber body (110), an opening/closing door (120), and a temperature control device (130).

As in the first embodiment, the chamber body (110) includes a support rail (111) and a partition plate (112), and further includes an auxiliary tester (113).

In this embodiment, the chamber body (100) and the opening/closing door (120), the support rail (111) and the partition plate (112) have the same roles as those in the first embodiment, so their description is omitted.

However, this embodiment is different from the first embodiment in that auxiliary testers (113) are provided in the test chamber (100) as referenced in FIG. 8. Therefore, according to this embodiment, the electric circuit (EC) of the test board (TB) is not provided with an electronic component such as an auxiliary tester (AT). However, when the test board (TB) is mounted in the test chamber (100), the auxiliary tester (113) in the test chamber (100) must have a connection structure that can be electrically connected to the electric circuit (EC) of the test board (TB).

An example of a connection structure may be a structure in which an elastically retractable terminal is provided on the electric circuit (EC) of the test board (TB) so that when the test board (TB) is completely mounted in the receiving space (ES), the electric circuit (EC) of the test board (TB) and the auxiliary tester (113) are electrically connected. A terminal using a ball plunger, etc. may be considered as such a structure. Of course, it may also be sufficiently considered to provide the retractable terminal on the auxiliary tester (113) side.

In addition, as another example of a connection structure, as schematically illustrated in FIG. 8, when a test board (TB) enters an independent space (SS) along a support rail (111), an auxiliary tester (113) is raised by an elevator (114) such as a cylinder or motor, so that the electric circuit (EC) of the test board (TB) and the auxiliary tester (113) are electrically connected. Therefore, in the case of this example, the test chamber (100) needs to be equipped with a separate elevator (114) for raising and lowering the auxiliary tester (13).

As mentioned in the supplementary description of the test board (TB) above, in this embodiment too, the auxiliary tester (113) may be replaced with an amplifier.

3. Third embodiment

The test chamber (100) according to the present embodiment also includes a chamber body (110), an opening/closing door (120), and a temperature control device (130). In addition, the chamber body (110) includes a support rail (111) and a partition plate (112). The present embodiment is the same as the first embodiment described above, but differs in that the test board (TB) has an auxiliary tester (AT) and an insulating space (IS) according to the examples of FIGS. 2 to 5, as in the schematic conceptual diagram of FIG. 9.

Therefore, according to the present embodiment, the second area (2S) formed between the test board (TB) and the partition plate (112) functions as a buffer space to supplement the insulation function of the insulation space (IS). That is, the auxiliary tester (AT) equipped on the test board (TB) is not exposed to the buffer space, which is the second area (2S), but is only exposed to the insulation space (IS) in the test board (TB).

The second region (2S), which is a buffer space, primarily blocks the movement of heat from the lower independent space (SS) to the test board (TB) mounted in the upper independent space (SS) through heat conduction, etc. Here, the structure by which heat can be conducted from the lower independent space (SS) to the upper independent space (SS) will be described later.

Meanwhile, according to the present example, the test chamber (100) has supply pipes (SP) and return pipes (RP) for supplying a temperature-controlling fluid to the insulating space (IS) of the test board (TB) or recovering the temperature-controlling fluid from the insulating space (IS), and has injection pipes (IP) and suction pipes (OP) for supplying a temperature-controlling fluid to the second region (2S) that functions as a buffer space or recovering the supplied temperature-controlling fluid. Of course, the conceptual diagram of FIG. 9 illustrates each pipe (SP, RP, IP, OP) so that it is all visible for convenience of explanation, but it is preferable that the supply pipe (SP) and the return pipe (RP) be provided toward the connector (C) side of the test board (TB) corresponding to the supply hole (SH) and the return hole (RH) of the test board (TB) of FIG. 2.

For example, the temperature of the insulating space (IS) to which the auxiliary tester (AT) is exposed can be controlled to about 5 degrees, and the second area (2S) that functions as a buffer space can be controlled to about room temperature or about 25 degrees, thereby saving energy. That is, the temperature of the temperature-controlling fluid injected into the second area (2S), which is a buffer space, through the injection pipe (IP) is set to be lower than the temperature of the first area (1S), and higher than the temperature of the temperature-controlling fluid supplied to the insulating space (IS) through the supply pipe (SP). Of course, even so, the temperatures of a plurality of areas separated from each other may be the same or different depending on the temperature conditions for testing or the heat generation status of electronic components such as the auxiliary tester (AT) or amplifier, and the types of temperature-controlling fluids supplied may also be appropriately mixed depending on the situation.

Of course, as in the modified example of Fig. 10, the partition plate (112) can be omitted and both the insulation space (IS) and the buffer space (AS) can be provided in the test board (TB), but in this case, the thickness of the test board (TB) becomes too thick, which can be difficult in terms of its mobility, management, or the design of the positions of the pipes to be provided in the test chamber (100).

In addition, as in the modified example of Fig. 11, instead of providing an insulating space (IS) in the test board (TB), a partition plate (112) and a buffer plate (115) are provided in the test chamber (100), thereby allowing a structure in which both an insulating space (IS) and a buffer space (AS) can be provided in the test chamber (100).

<Description of temperature control technology for electronic components>

The above examples have all focused on explaining the technology for controlling the temperature of electronic components such as the auxiliary tester (AT, 113). However, the temperature of the electronic components is closely related to the temperature control of the electronic components loaded on the mounting socket (S). And since the main feature of the present invention lies in the temperature control device (130) for controlling the temperature of the electronic components, this will be explained in more detail.

As mentioned in the background art, electronic components are tested while maintaining a constant temperature environment. However, as electronic components become more highly integrated and advanced, more self-heating occurs in the electronic components, and thus the need to control the temperature of the electronic components during testing is increasing. Furthermore, as explained above, if a separate auxiliary tester (AT, 113) or amplifier is configured, it is expected that the heat generated from the electronic device may affect the electronic components by conduction, etc. In addition, the temperature of the electronic components accommodated in the receiving space (ES) divided into independent spaces (SS) where the heat transfer by convection is blocked from each other needs to be managed within the same range. Therefore, it is necessary to consider a new technology for more precise temperature control of the electronic components being tested.

In general, electronic components mounted on a test board (TB) mounted in an accommodation space (ES) must be tested under an artificially created temperature environment. Therefore, the test chamber (100) must be equipped with a temperature control device (130) for controlling the temperature of the electronic components mounted on the test board (TB) accommodated in the chamber body (110). An artificially controlled temperature environment is established in the accommodation space (ES) by the temperature control device (130). To this end, as shown in the schematic diagram of FIG. 12, temperature control air supplied by the temperature control device (130) is sprayed (see arrow) from one side wall of the test chamber (100) into the accommodation space (ES), thereby uniformly controlling the temperature of the entire accommodation space (ES) by allowing the air to pass between the test boards (TB) (see Patent Publication No. 10-2010-0093896). However, a form like that of Fig. 12 has a disadvantage in that the temperature control air is not directly injected to the electronic component mounted in the mounting socket (S) but moves to the upper side of the electronic component, so the temperature control of the electronic component cannot be directly and immediately performed but must be performed only indirectly.

Meanwhile, according to the test chambers (100) described as examples of the test chamber (100) above, the receiving space (ES) is divided into several independent spaces (SS), and each independent space (SS) is divided into a first region (1S) on the upper side and a second region (2S) on the lower side with a test board (TB) therebetween. And the electronic component loaded on the mounting socket (S) is exposed to the first region (1S) on the upper side. Therefore, the temperature control of the electronic component must be performed through the first region (1S). Accordingly, by utilizing a structure in which the receiving space (ES) is divided into independent spaces (SS) as in the test chamber (100) described above, and the independent spaces (SS) are divided again by the test board (TB), it has become possible to propose a new type of temperature control device (130) that constitutes an important feature of the present invention.

Fig. 13 shows a new type of temperature control device (130) that can be applied to a test chamber (100).

Referring to FIG. 13, a temperature control device (130) provided in a test chamber (100) according to the present invention has an air supply (131), a supply duct (132), control plates, injection ducts (134), and branch ducts (135).

The air supplier (131) supplies temperature-regulating air to control the temperature of the receiving space (ES). The air supplier (131) supplies temperature-regulating air to one side (P ₁ ) and draws in temperature-regulating air that passes through the receiving space (ES) to the other side (P ₂ ).

The supply duct (132) is provided to distribute and supply temperature-controlling air supplied from the air supplier (131) to various locations in the receiving space (ES), i.e., locations corresponding to each independent space (SS). As referenced in the extract of FIG. 14, the supply duct (132) can be divided into a discharge portion (132a), an induction portion (132b), a connection portion (132c), and a re-entry portion (132d).

The discharge portion (132a) has discharge holes (DH: DH ₁ , ..., DH ₂ ) for discharging temperature-controlling air, and the discharge holes (DH) are formed at positions corresponding to the independent spaces (SS). For reference, the temperature-controlling air discharged through the discharge holes (DH) is supplied to the injection duct (134) through the branch duct (135) described later.

The induction part (132b) induces temperature-controlling air from the air supplier (131) to the discharge part (132a).

The connecting portion (132c) connects the discharge portion (132a) and the induction portion (132b) so that the direction of movement of air moving in the discharge portion (132a) and the direction of movement of air moving in the induction portion (132b) are switched 180 degrees.

For reference, as in the example of Fig. 15, the temperature control air supplied from the air supplier (131) without the induction portion (132b) may be configured to enter directly into the closed, straight discharge portion (132a). However, if the example of Fig. 15 is followed, a large difference in air pressure occurs between the area where the discharge hole (DH ₁ ) close to the air supplier (131) is located and the area where the discharge hole (DH ₂ ) far from the air supplier (131) is located according to Bernoulli's principle, so it may be very difficult for the temperature control air to be evenly distributed to each of the injection ducts (134). That is, in the example of Fig. 15, the speed of the temperature control air decreases and the air pressure increases as the distance from the air supplier (131) increases, so the discharge amount of the temperature control air through each of the discharge holes (DH ₁ , ..., DH ₂ ) greatly differs. Of course, even in the case of Fig. 15, it is possible to control the discharge amount to a certain extent by forming the discharge holes (DH ₁ , ..., DH ₂ ) in different sizes _or configuring a control plate to adjust the discharge holes (DH ₁ , ..., DH ₂ ). However, it may be difficult to control the complex air flow for temperature control by only adjusting the size of the discharge holes (DH 1, ..., DH ₂ ).

Accordingly, in this embodiment, by utilizing the phenomenon in which the movement of temperature-controlling air stagnates in a corresponding area when the direction of movement of temperature-controlling air changes 180 degrees at the connection portion (132c) as shown in Fig. 14, the air pressure in the area with the first discharge hole (DH ₁ ) and the area with the last discharge hole (DH ₂ ) on the movement line of temperature-controlling air is designed to be as uniform as possible.

The re-entry portion (132d) is provided to enable the temperature-controlling air to circulate within the supply duct (132) by re-entering the induction portion (132b) after passing through the last discharge hole (DH ₂ ). By providing the re-entry portion (132d) so that the end of the discharge portion (132a) is not closed, the air pressure difference between the area where the first discharge hole (DH ₁ ) is located and the area where the last discharge hole (DH ₂ ) is located on the air movement line is further reduced, thereby enabling the air pressure in the area where all the discharge holes (DH; DH ₁ , ..., DH ₂ ) are located to become more uniform. For reference, even in the case where the supply duct (132) is in a U-shape as in FIG. 16, stagnation of air occurs at the connection portion (132c) where the direction of air movement is changed. However, since the air pressure is the largest in the area where the last discharge hole (DH ₂ ) is located, the amount of air discharged through the last discharge hole (DH ₂ ) is the largest. In this case, a temperature difference may occur in each electronic component accommodated in each independent space (SS). Therefore, in the present embodiment, as in FIG. 14, by opening the end of the discharge portion (132a) and connecting it to the induction portion (132b), the air pressure in the area where the last discharge hole (DH ₂ ) is located is lowered by Bernoulli's principle, thereby allowing the air pressures in the areas where all the discharge holes (DH; DH ₁ , ..., DH ₂ ) are located to be uniform.

Meanwhile, since the discharge portion (132a) and the guide portion (132b) are provided together on one side with respect to the receiving space (ES), not only can the overall width of the equipment be reduced, but also the design of the re-entry portion (132d) can be easily resolved. Of course, in terms of reducing the overall width of the equipment, it is preferable that the distance between the discharge portion (132a) and the receiving space (ES) and the distance between the guide portion (132b) and the receiving space (ES) be the same. That is, as shown in FIG. 17, when viewed from a plane, the distance from the center line (C ₁ ) of the discharge portion (132a) to the center line (C ₂ ) of the receiving space and the distance from the center line (C ₁ ) of the guide portion (132b) to the center line (C ₂ ) of the receiving space are designed to be the same. However, depending on the implementation, the distance between the discharge portion (132a) and the receiving space (ES) and the distance between the guiding portion (132b) and the receiving space (ES) may be different by changing the area of the flow path between the discharge portion (132a) and the guiding portion (132b).

Referring to the extract drawing of FIG. 18, which shows a part of the supply duct (132) disassembled, the control plate (133) is provided to perform the function of a valve for controlling the size of the discharge holes (DH). This is to ensure that the temperature-controlling air can be evenly distributed to the injection ducts (134) by individually controlling the size of the discharge holes (DH), considering that despite the various arrangements mentioned above, there may be an air pressure difference in each area of the discharge portion (132a). That is, due to the complex fluid dynamics within the discharge portion (132a), an air pressure difference may occur in each section of the discharge holes (DH), and due to this cause, the amount of temperature-controlling air discharged through each discharge hole (DH) may be different from each other. Therefore, by controlling the size of the discharge holes (DH) with the control plate (133) (specifically, controlling the discharge area of air through the discharge holes), the temperature-controlling air can be evenly distributed to each injection duct (134). Of course, if the size of the discharge hole (DH) is formed differently depending on the location by considering fluid dynamics, the control plate (133) may be omitted. However, if the size of the discharge hole (DH) is formed differently, various variables such as the flow rate, the flow rate, and the cross-sectional area of the flow path must be considered, and the flow rate or the flow rate may act as variables depending on the test temperature environment conditions, which may cause test failure. Therefore, it is more desirable and can be considered easier to control the size of the discharge hole (DH) using the control plate (133).

In this embodiment, since the operator can set the size of the discharge hole by sliding the control plate (133), as shown in Fig. 18, one side (F) of the supply duct (132) is provided in a detachable manner for this setting. However, depending on the implementation, it may be considered that the supply duct (132) is provided as an integral part, and the control plate (133) is provided to be automatically operated by a separate driving source.

As shown in FIG. 19, the injection ducts (134) are positioned at a certain interval from each other in the receiving space (ES) and are arranged to face multiple test boards (TB) one-to-one. In the present embodiment, one injection duct (133) is accommodated in one independent space (SS) and faces the test board (TB) in the independent space (SS). That is, the injection surface of the injection duct (134) onto which temperature control air is injected faces the surface on which the electronic components of the test board (TB) are installed (the surface on which the mounting socket is installed). The injection duct (134) must inject the temperature control air coming through the supply duct (131) and the branch duct (135) toward the test board (TB). To this end, as shown in FIG. 20, injection holes (IH) are formed in the injection duct (134) at positions corresponding one-to-one with the electronic components mounted on the test board (TB). According to the present embodiment, since the injection duct (134) is located on the upper side of the independent space (SS) as referred to in FIG. 19, when the independent space (SS) is separated by the test board (TB), it is located in the first region (1S) and faces the electronic components mounted on the test board (TB). Therefore, the air injected from the injection duct (134) is directly injected toward the electronic components, and also controls the temperature of only the first region (1S) of the independent spaces (SS). Since the air injected from the injection duct (134) is directly injected toward the electronic components, the temperature of the electronic components can be controlled at a high speed, unlike in the past. In addition, since the first region (1S), which is the space where the temperature should be controlled, is narrower than in the past, faster temperature control is possible, while also reducing energy consumption. And the air injected into the first area (1S) by the injection duct (134) moves to the recovery room (RR) located outside the independent space (SS) and is then recovered by the air supplier (131).

Meanwhile, as shown in Fig. 20, the injection duct (134) is equipped with an induction member (134a) that induces the movement of temperature-controlling air so that the temperature-controlling air introduced is evenly divided and sprayed through the injection holes (IH).

The guide member (134a) includes transition plates (TP) and securing plates (GP).

The switching plates (TP) are provided to change the direction of temperature-regulating air flowing in in the direction of arrow a.

The securing plate (GP) secures a path (see arrow b) for the temperature-regulating air diverted by the diverting plate (TP) to pass through the entire area of the injection duct (134) by blocking the temperature-regulating air from passing through the corresponding location.

In this way, while providing the induction member (134a) as shown in FIG. 20, the injection holes (IH) are formed in an area excluding the path (see arrow a) through which the temperature-controlling air flows into the injection duct (134) and reaches the switching plate (TP). That is, the injection holes (IH) are not formed on the path (arrow a) through which the temperature-controlling air that flows into the injection duct (134) reaches the switching plate (TP). Accordingly, since the temperature-controlling air that flows into the injection duct (134) has its movement direction changed by the switching plates (TP) and bypasses the path blocked by the securing plate (GP) as referred to by arrow b, and returns through the entire injection surface where the injection holes (IH) are located, the temperature-controlling air can be relatively evenly sprayed through each of the injection holes (IH).

The branch duct (135) is provided to provide a path for moving temperature-controlling air discharged from the supply duct (132) through the discharge hole (DH) to the injection duct (134), and for this purpose, multiple paths are provided to form paths branching from the supply duct (132) as many as the number of discharge holes (DH).

According to the temperature control device (130) as described above, temperature control air supplied by the air supplier (131) flows into the injection duct (134) through the supply duct (132) and the branch duct (135) and is then sprayed into the independent space (SS) through the injection holes (IH). Then, the temperature control air sprayed into the independent space (SS) controls the temperature of electronic components and creates a temperature environment of the independent space (SS), and then flows outward and is recovered back into the air supplier (131) through the recovery room (RR).

According to the above explanations, it has been described above that the insulating space (IS) of the test board (TB) or the second region (2S, used as an insulating space or a buffer space) provided in the test chamber (100) is separated from the first region (1S) by the test board (TB). However, the insulating space (IS) or the second region (2S) is also affected by the thermal environment of the first region (1S) created by the temperature control device (130) or the temperature state of the electronic component due to minute gaps or heat conduction that may exist in the test board (TB). Therefore, as mentioned above, in order to protect electronic components such as the auxiliary tester (AT, 113), it is necessary to manage the temperature of the insulating space (IS) or the first region (2S) at a different temperature from that of the first region (1S).

For reference, although the second region (2S) in the upper independent space (SS) is separated from the first region (1S) in the lower independent space (SS) by a partition plate (112), the high temperature heat of the first region (1S) in the lower independent space (SS) may move to the second region (2S) in the upper independent space (SS) through conduction, etc. Therefore, it is desirable to provide the buffer space described above so that the insulating space (IS) is not directly affected by the high temperature created in the first region (1S) of the lower independent space (SS). At this time, in order to save energy, it may be desirable to consider that the temperature of the buffer space is higher than that of the insulating space (IS) and lower than that of the first region (1S).

According to the above embodiment, a structure is adopted in which one injection duct (134) is arranged per one independent space (SS) as in Fig. 19. However, even in cases where the receiving space (ES) is not divided into each independent space (SS) by a separate partition plate (112) as in Fig. 21, the temperature control device (130) according to the present invention, which has a structure in which temperature control air is directly injected toward electronic components, may be applied in any way.

In addition, referring to FIG. 19 and FIG. 21 above, looking into one more feature of the test chamber (100) according to the present invention, it can be seen that multiple test boards (TB) can be accommodated in the receiving space (ES) in a form of being arranged in the vertical direction with a gap between them, and the injection ducts (134) are arranged to face the test boards (TB) one-to-one. Accordingly, except for the injection duct (134) located on one side (the upper side in this embodiment), the remaining injection ducts (134) are located between the neighboring test boards (TB).

Meanwhile, the temperature-controlling air passing through the discharge portion (132a) via the re-entry portion (132d) may rejoin the induction portion (132b) after passing through the discharge portion (132a). Therefore, a difference may occur between the temperature of the temperature-controlling air supplied from the air supplier (131) and the temperature of the temperature-controlling air sprayed from the injection duct (134). And if a difference occurs between the temperatures of the temperature-controlling air at both locations, the electronic components may not be tested under the actual required temperature conditions. In order to prevent this, as referred to in FIG. 13, it is preferable to have a first temperature sensor (TS ₁ ) for detecting the temperature of the temperature-controlling air supplied from the air supplier (131) and a second temperature sensor (TS ₂ ) for detecting the temperature of the temperature-controlling air sprayed from the injection duct (134). In this case, by continuously monitoring the temperature deviation detected by the two temperature sensors (TS ₁ , TS ₂ ) and adjusting the temperature of the temperature control air supplied from the air supply (131) whenever necessary, the temperature of the electronic components can be managed more precisely.

<Note>

As described above, the first region (1S) must have a temperature environment created to control the temperature of electronic components, and the insulating space (IS) must have a temperature environment created to control the temperature of heat-generating electronic components such as an auxiliary tester (AT, 113) or an amplifier. In addition, the buffer space (AS, including an example in which the second region functions as a buffer space) must have a temperature environment created to prevent the thermal state of the first region (1S) on the lower side from affecting the insulating space (IS).

Therefore, considering the various test temperature conditions, the first zone (1S), the insulation space (IS) and the buffer space (AS, when the second zone functions as a buffer space, the second zone) must be able to be managed at different temperatures.

For example, the temperature of each space (1S, IS, AS) can be managed in various ways depending on the test temperature conditions.

During a high temperature test, the temperature of the first area (1S) may be the highest and the temperature of the insulated space (IS) may be the lowest. At this time, the temperature of the buffer space (AS) will have a value between the temperature of the first area (1S) and the temperature of the insulated space (IS).

However, during the low-temperature test, the temperature of the first area (1S) is the lowest, and the temperature of the insulating space (1S) should be managed higher than the temperature of the first area (1S) to prevent condensation. At this time, since the buffer space (AS) is in contact with the first area (1S) on the lower side, the temperature of the insulating space (1S) needs to be managed higher than the temperature of the buffer space (AS) or at least the same. Of course, during the low-temperature test, it will be necessary to supply dry air conditioning fluid to the insulating space (IS) to prevent condensation.

As described above, although the specific description of the present invention has been made by means of embodiments with reference to the attached drawings, since the above-described embodiments have only described preferred examples of the present invention, the present invention should not be understood as being limited to the above-described embodiments, and the scope of the rights of the present invention should be understood by the claims described below and their equivalents.

100 : Test Chamber
110 : Chamber body
ES: Reception space
SS: Independent space
120 : Opening door
130 : Temperature control device
131 : Air supply unit
132 : Supply duct
132a: Discharge part 132b: Induction part
132c: Connection part 132d: Re-entry part
DH: Discharge hole
134 : Injection duct
134a : Inductive Absence
TP: Transition board GP: Secured board
IH : Injection hole
135 : Branch duct

Claims (4)

A chamber body having an open side and a receiving space for receiving test boards containing electronic components;
An opening/closing door that opens or closes the receiving space by opening/closing one side of the chamber body; and
A temperature control device for controlling the temperature of electronic components mounted on the test boards accommodated in the chamber body;
The above temperature control device,
An air supply unit that supplies temperature-regulating air to control the temperature of the above-mentioned accommodation space; and
It includes several injection ducts located in the above-mentioned receiving space and for distributing and supplying temperature-controlling air supplied from the air supplier to several locations in the above-mentioned receiving space;
In the above-mentioned accommodation space, multiple test boards can be accommodated with a distance from each other.
The above-mentioned accommodation space is divided into multiple independent spaces with air movement between them blocked by partitions.
Each of the above multiple independent spaces can accommodate one test board.
The above multiple injection ducts are arranged to face each other on the above multiple test boards, so that the remaining injection ducts, except for the injection duct at one end, are located between the neighboring test boards.
Test chamber. In the first paragraph,
The above-mentioned accommodation space is divided into several independent spaces with no air exchange between them.
The above multiple injection ducts are arranged one-to-one in the above multiple independent spaces.
Test chamber. A chamber body having an open side and a receiving space for receiving test boards containing electronic components;
An opening/closing door that opens or closes the receiving space by opening/closing one side of the chamber body; and
A temperature control device for controlling the temperature of electronic components mounted on the test boards accommodated in the chamber body;
The above temperature control device,
An air supply unit that supplies temperature-regulating air to control the temperature of the above-mentioned accommodation space; and
At least one injection duct positioned in the above-mentioned receiving space and injecting temperature-controlling air supplied from the air supplier into the above-mentioned receiving space;
The above-mentioned accommodation space is divided into multiple independent spaces with air movement between them blocked by partitions.
Each of the above multiple independent spaces can accommodate one test board.
The above injection duct has a number of injection holes for injecting air for temperature control,
The above injection duct is equipped with an induction member that induces the movement of temperature-controlling air so that the temperature-controlling air introduced is evenly divided and sprayed through the plurality of injection holes.
Test chamber. In the third paragraph,
The above inductive member is a switching plate that switches the direction of the air for temperature control; and
A securing plate that secures a path for temperature-controlling air, the direction of which has been changed by the switching plate, to pass through the entire area of the injection duct;
The above-mentioned plurality of injection holes are formed in an area excluding the path through which temperature-controlling air flows into the injection duct and reaches the switching plate.
Test chamber.