KR20240072377A - Semi standard-based equipment data acquisition supporting device and session operation method thereof - Google Patents

Abstract

A SEMI standard-based equipment data collection support device and its session operation method are disclosed. The equipment data collection device according to an embodiment of the present invention includes a web application server driver that allocates one thread to each of the messages in the order in which the messages are received from the semiconductor equipment, and receives the messages through the thread. , and a message order guarantee support unit that performs post-processing on the messages in the order in which the messages are received, wherein the message order guarantee support unit operates in a semiconductor device-thread mapping queue created in response to the semiconductor device. Queuing the identification information of the thread in the order of allocation of the thread, and when one thread has completed receiving any one message, the identification information of the one thread and the semiconductor device-thread mapping queue Using this, the processing order of any one of the messages can be determined, and the identification information of the thread corresponding to the message whose processing order has arrived can be dequeued in the semiconductor device-thread mapping queue.

Description

SEMI standard-based equipment data collection support device and its session operation method {SEMI STANDARD-BASED EQUIPMENT DATA ACQUISITION SUPPORTING DEVICE AND SESSION OPERATION METHOD THEREOF}

The present invention relates to a device for supporting equipment data collection based on SEMI standards and a session operation method thereof. The present invention relates to a device for supporting the process of a user collecting data from semiconductor equipment according to the SEMI standard and a session operation method for collecting equipment data. will be.

The content described below simply provides background information related to an embodiment of the present invention and does not constitute prior art.

Productivity improvement through automation of semiconductor processes and optimization of data communication is emerging as an important factor. Accordingly, in order to standardize data communication in semiconductor processes, the Equipment Automation Division of SEMI (Semiconductor Equipment and Materials International) has established a standard protocol for data communication for the interface between semiconductor equipment and external computers. The SECS (SEMI Equipment Communications Standard) protocol is being established. Through this, SEMI requires semiconductor equipment manufacturers to apply this as an option, so that semiconductor production-related equipment follows the SECS protocol standard in the interface area.

In addition, as semiconductor processes continue to develop and micro-processes increase, the demand for acquiring and analyzing more sensors and high-resolution process data from equipment is increasing. As a result, SEMI established a protocol to exclusively process analysis data through a separate channel from the SECS protocol, and defines it as the Equipment Data Acquisition standard (hereinafter referred to as the EDA standard).

The EDA standard provides a document explaining the specification and WSDL (Web Service Description Language) necessary for transmitting XML Schema and SOAP Message as a complementary file.

The EDA standard consists of the following four parts and defines a series of services for collecting equipment data, through which data from equipment can be transmitted to an analysis system.

E120: Common Equipment Model

It provides guidance on the equipment structure required to create equipment metadata and definitions of attribute values provided by each equipment node.

E125: Equipment Self Description

Equipment manufacturers provide parameters, event information (state machine, simple event), exceptions, and SEMI objects necessary for data collection of equipment nodes. When metadata is reissued (revision), the device provides notification of metadata changes to the client.

E132: Authentication & Authorization

Through interface discovery, the client (system supervisor) receives the service URL of the server (equipment). Create and manage ACL (Access Control List) through Security Admin. The created ACL is managed using the session management service. When establishing a session, the client specifies the consumer's URL (HTTP End Point) to the device, and the device provides client services to the URL.

E134: Data Collection Management

A data collection plan (DCP) is created from the metadata received from the equipment. The data collection plan is set to Event, Exception, and Trace, and data is transmitted from when the plan is activated.

KR2004-0105767

The purpose of the present invention is to provide a session operation method for collecting device and equipment data to support the process of collecting data from semiconductor equipment according to SEMI standards.

In order to achieve the above object, a session operation method for equipment data collection according to an embodiment of the present invention involves an equipment data collection support device connecting a user terminal session to a user terminal that wishes to control data collection from semiconductor equipment. A step of receiving, by the equipment data collection support device, an activation request for a data collection plan corresponding to the semiconductor device through a user terminal session, and the equipment data collection support device collects data through an EDA session different from the user terminal session. The step of activating the plan may be included.

The step of connecting the user terminal session includes receiving a first control command corresponding to control of data collection from the user terminal and providing a user terminal session with first control result information that is a response according to the first control command to the user terminal. It may include a connecting step.

The session operation method for device data collection further includes the step of connecting, by the device data collection support device, an EDA session to the semiconductor device, wherein the step of connecting the EDA session transmits a second control command to the semiconductor device, It may include receiving second control result information, which is a response according to a second control command, from the semiconductor device, and connecting an EDA session in which a device data collection device collecting data from the semiconductor device is set as an end point. You can.

The step of connecting the EDA session includes connecting the EDA session based on an access control list (ACL) corresponding to equipment engineering system (EES) designation information received from the user terminal, , the equipment data collection device can post-process the data collected from the semiconductor equipment and transmit it to the equipment engineering system.

Before connecting the EDA session, the device data collection support device loads information about EDA sessions connected to the semiconductor device from a database, and the device data collection support device provides information about the EDA sessions to the user terminal. It may further include the step of providing, and the step of connecting the EDA session may include connecting the EDA session so that the equipment data collection support device does not overlap the access control list and the endpoint.

After connecting the EDA session, the device data collection support device further includes a step of loading metadata of the semiconductor device and the device data collection support device providing metadata to the user terminal, and providing the metadata to the user terminal. In the loading step, the device data collection support device determines whether metadata exists in the database. If metadata does not exist in the database, the device data collection support device loads metadata from the semiconductor device, It may include storing the loaded metadata in a database, and, when the equipment data collection support device, loads the metadata from the database if the metadata exists in the database.

After connecting the EDA session, the device data collection support device loads status information of the data collection plan created for the semiconductor device from a database, and the device data collection support device transmits the status of the data collection plan to the user terminal. The step of providing information may further be included.

The data collection plan or metadata may be provided to the data collection device when the database is updated or when the data collection device is initialized.

Activating the data collection plan may include activating the data collection plan through an EDA session corresponding to an endpoint included in the activation request of the data collection plan.

In addition, the device data collection support device according to an embodiment of the present invention includes a memory in which at least one program is recorded and a central processing unit (CPU) that executes the program, and the program includes data from the semiconductor device. Connecting a user terminal session to a user terminal for which collection is to be controlled, receiving an activation request for a data collection plan corresponding to the semiconductor device through the user terminal session, and collecting data through an EDA session different from the user terminal session. You can issue commands to perform steps to activate the plan.

According to the present invention, it is possible to provide a session operation method for collecting device and equipment data to support the process of collecting data from semiconductor equipment according to SEMI standards.

Figure 1 is a diagram showing a network relationship between an equipment data collection support device and other entities that transmit and receive data according to an embodiment of the present invention.
Figure 2 is a reference diagram showing the SEMI standard-based equipment data collection architecture according to an embodiment of the present invention.
Figure 3 is a block diagram showing the configuration of a device for supporting equipment data collection according to an embodiment of the present invention.
Figure 4 is an operation flowchart showing a method of supporting equipment data collection according to an embodiment of the present invention.
Figure 5 is an operation flowchart showing a method of supporting equipment data collection according to another embodiment of the present invention.
Figure 6 is an operation flowchart showing a method of supporting equipment data collection according to another embodiment of the present invention.
Figure 7 is an operation flowchart showing a method of supporting equipment data collection according to another embodiment of the present invention.
Figure 8 is a reference diagram showing a session connection structure for collecting SEMI standard-based equipment data according to an embodiment of the present invention.
Figure 9 is an operation flowchart showing a session operation method for collecting equipment data according to an embodiment of the present invention.
Figure 10 is an operation flowchart showing a session operation method for collecting equipment data according to another embodiment of the present invention.
Figure 11 is a block diagram showing the configuration of an equipment data collection device according to an embodiment of the present invention.
Figure 12 is an operation flowchart showing a method of ensuring the collection order of equipment data according to an embodiment of the present invention.
Figure 13 is an operation flowchart showing a method of ensuring the collection order of equipment data according to another embodiment of the present invention.
Figure 14 is a reference diagram showing the structure of processes executed in the equipment data collection device according to an embodiment of the present invention.
Figure 15 is an operation flowchart showing a process conversion method in an equipment data collection device according to an embodiment of the present invention.
Figure 16 is an operation flowchart showing a process conversion method in an equipment data collection device according to another embodiment of the present invention.
Figure 17 is an operation flowchart showing a process conversion method in an equipment data collection device according to another embodiment of the present invention.
Figure 18 is a diagram showing a computer system according to an embodiment of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Although terms such as “first” or “second” are used to describe various components, these components are not limited by the above terms. The above terms may be used only to distinguish one component from another component. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

The terms used in this specification are for describing embodiments and are not intended to limit the invention. As used herein, singular forms also include plural forms, unless specifically stated otherwise in the context. As used in the specification, “comprises” or “comprising” implies that the mentioned element or step does not exclude the presence or addition of one or more other elements or steps.

Unless otherwise defined, all terms used in this specification can be interpreted as meanings commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless clearly specifically defined.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the attached drawings.

Figure 1 is a diagram showing a network relationship between an equipment data collection support device 110 and other entities that transmit and receive data according to an embodiment of the present invention.

Referring to FIG. 1, the device data collection support device 110 according to an embodiment of the present invention transmits and receives data to and from the user terminal 130 through a first interface, and communicates with the semiconductor device 150 through a second interface. Data can be sent and received.

The first interface is for the equipment data collection support device 110 to be a server and the user terminal 130 to be a client, and for the equipment data collection support device 110 to receive commands from the user terminal 130 and respond to the received commands. It could be an interface.

The second interface is where the semiconductor device 150 is an EDA server according to the Equipment Data Acquisition (EDA) standard, the device data collection support device 110 is an EDA client, and the device data collection support device 110 is a semiconductor device. It may be an interface for transmitting a command to 150 and receiving a response according to the command.

The device data collection support device 110 may function as an integrated host application server (Host Application Server, HAS) to provide a device data collection service to the user terminal 130.

In the EDA standard, an EDA client is defined as being able to perform the functions of a host application server and a consumer server, and the equipment data collection support device 110 of the present invention is one of the functions performed by the EDA client. It can be viewed as a device that mainly performs the role of a host application server, excluding the functions performed by a consumer server.

The user terminal 130 can perform control related to data collection of the semiconductor equipment 150 via the equipment data collection support device 110, and collect data from the semiconductor equipment 150 through an equipment engineering system (Equipment Engineering System). It can be obtained through EES, 140).

The semiconductor device 150 receives a control command related to data collection from the user terminal 130 via the device data collection support device 110, and sends data to the device data collection device 120 in response to the received command. Can be transmitted.

In the EDA standard, an EDA client is defined as being able to perform the functions of a host application server and a consumer server, and the equipment data collection device 120 of the present invention performs the function of a consumer server among the functions performed by the EDA client. It can be seen as a device that mainly performs tasks.

For example, the equipment data collection device 120 may perform the function of a consumer server that collects data from the semiconductor equipment 150, processes the data, and provides it to the equipment engineering system 140.

As an optional embodiment, the device data collection device 120 may be a server that is physically separate from the device data collection support device 110.

Through this, regardless of the connection state between the device data collection support device 110 and the semiconductor device 150, the session between the semiconductor device 150 and the device data collection device 120 can be maintained in an active state, thereby allowing device data There is an advantageous effect in that the equipment data collection device 120 can continuously collect data from the semiconductor device 150 without the intervention of the collection support device 110.

Here, the user terminal 130 refers to a communication terminal that can use a terminal application in a wired or wireless communication environment. Here, the communication terminal may be the user's personal computer, the user's portable terminal, or an Internet of Things (Internet of Things)-based terminal.

To explain this in more detail, communication terminal computers (e.g., desktops, laptops, tablets, etc.), media computing platforms (e.g., cable, satellite set-top boxes, digital video recorders), and handheld computing devices (e.g., PDAs, email clients, etc.), any type of cell phone, any other type of computing or communication platform, but the present invention is not limited thereto.

The device data collection support device 110 may be connected to the user terminal 130 and the semiconductor device 150 through a communication network.

A communication network refers to an access path for data to be transmitted and received between the above entities. For example, communication networks include wired networks such as LANs (Local Area Networks), WANs (Wide Area Networks), MANs (Metropolitan Area Networks), and ISDNs (Integrated Service Digital Networks), or wireless networks such as wireless LANs, CDMA, Bluetooth, and satellite communications. It may encompass networks, but the scope of communication networks applicable to the present invention is not limited thereto.

Figure 2 is a reference diagram showing the SEMI standard-based equipment data collection architecture according to an embodiment of the present invention.

Referring to FIG. 2, the SEMI standard-based equipment data collection architecture includes a equipment data collection support device 110, equipment data collection devices 120-1, 120-2, and 120-3, and user terminals 130-1, 130-2), an equipment engineering system 140, semiconductor equipment 150-1, 150-2, and a database 160.

The equipment data collection support device 110 may be connected to the user terminals 130-1 and 130-2 in a one-to-many relationship through a first interface to transmit and receive data.

The device data collection support device 110 can be connected to the semiconductor devices 150-1 and 150-2 in a one-to-many relationship through a second interface to transmit and receive data.

The semiconductor devices 150-1, 150-2 and the equipment data collection devices 120-1, 120-2, and 120-3 are connected in a many-to-many relationship, and the semiconductor devices 150-1, 150- 2) Data is transmitted to the equipment data collection devices 120-1, 120-2, and 120-3 in a push manner, and the data is transmitted to the equipment data collection devices 120-1, 120-2, and 120-3. ) can transmit and receive data by calling back to the semiconductor devices 150-1 and 150-2.

Here, the equipment data collection devices 120-1, 120-2, and 120-3 serve as end points of sessions established for the semiconductor devices 150-1 and 150-2. You can.

As an optional embodiment, the equipment data collection devices 120-1, 120-2, and 120-3 store data received from the semiconductor devices 150-1 and 150-2 in a queue-structured storage. As much as possible, the order of received data can be guaranteed.

As another optional embodiment, a plurality of applications are run in each of the equipment data collection devices 120-1, 120-2, and 120-3, and one of the applications performs a consumer role, and one of the applications performs a consumer role. If a failure occurs in an application, another running application can take on the role of a consumer and overcome the consumer server's failure. In this case, since the access addresses of the consumer servers mapped to the semiconductor devices are maintained as is, there is an advantageous effect in that a failure of the consumer servers can be overcome without the intervention of the device data collection support device 110.

As another optional embodiment, the semiconductor devices 150-1 and 150-2 and the device data collection devices 120-1, 120-2, and 120-3 are connected in a many-to-many relationship to collect device data. If a failure occurs in one of the devices (eg, 120-1), connection relationship conversion may be performed so that semiconductor devices connected to the corresponding device data collection device 120-1 are connected to other device data collection devices. In this case, the access addresses of consumer servers mapped to semiconductor devices may be newly mapped by the device data collection support device 110.

The equipment data collection devices 120-1, 120-2, and 120-3 can receive data from the semiconductor equipment 150-1 and 150-2, convert the data, and transmit it to the equipment engineering system 140. there is.

In the semiconductor devices 150-1 and 150-2, messages in an EDA standard format (e.g., SOAP or XML) are collected as data, and the device data collection devices 120-1, 120-2, and 120-3 Converts data into a message in a format required by the user or the equipment engineering system and provides it to the equipment engineering system 140.

The equipment engineering system 140 may include various equipment engineering systems, including FDC (Fault Detection & Classification), and provide converted data to the user terminals 130-1 and 130-2.

The database 160 stores information including session information, metadata information, and data collection plan information, as well as various information about semiconductor devices, and includes the device data collection support device 110, the device data collection devices 120-1, It may be a repository that allows information required by 120-2, 120-3) and the equipment engineering system 140 to be integrated and managed.

Figure 3 is a block diagram showing the configuration of an equipment data collection support device 110 according to an embodiment of the present invention.

Referring to FIG. 3, the equipment data collection support device 110 according to an embodiment of the present invention includes a plurality of interfaces 111, a metadata management unit 112, a session management unit 113, a security management unit 114, and It may include a data collection plan management unit 115.

A plurality of interfaces 111 include a first interface for receiving commands from a user terminal and responding to the received commands, and a first interface for transmitting commands to semiconductor equipment according to Equipment Data Acquisition (EDA) standards and following the commands. It may include a second interface for receiving a response.

The metadata management unit 112 may provide access to metadata of the semiconductor device to the user terminal through the first interface.

When a session is connected, the metadata manager 112 may receive metadata from the semiconductor device through the second interface and store it in a database, or provide it to the user terminal through the first interface.

Here, metadata may be converted and stored in tree form or table form.

As an optional embodiment, the metadata management unit 112 may load metadata from the database and provide it to the user terminal through the first interface when the default location for loading metadata when a session is connected is set to a database rather than a semiconductor device. You can.

The session management unit 113 may register the semiconductor device in the device list based on the access address for the semiconductor device received from the user terminal through the first interface.

Here, the access address may be a Uniform Resource Locator (URL).

The session management unit 113 may map the access address of the consumer server to the semiconductor device registered in the device list based on the access address of the consumer server received from the user terminal through the first interface.

Here, the consumer server is a server physically separated from the device data collection support device 110, and the access address of the consumer server may be a different address from the access address of the device data collection support device 110.

The session management unit 113 may provide a session connection based on an access control list (ACL) including access authority information for semiconductor equipment to the user terminal through the first interface.

When receiving a session connection command from the user terminal through the first interface, the session manager 113 may connect a session based on an access control list item corresponding to the user of the user terminal in response.

The session includes a user terminal session connected between the user terminal and the equipment data collection support device 110, an EDA session connected between the equipment data collection support device 110, the semiconductor equipment and the equipment data collection device 120, and the analysis system server and equipment. It can be divided into EES sessions connected between engineering systems.

EDA sessions can be connected using access control lists and endpoint information corresponding to semiconductor equipment users according to SEMI standards.

The session management unit 113 can manage the session activation status for each semiconductor device and data collection plan.

The session management unit 113 may receive session information from the semiconductor device and verify the session information received from the semiconductor device using at least one of a data collection plan among the session and metadata managed by the device data collection support device.

The session management unit 113 can synchronize the parameters of the semiconductor device through the second interface so that the access address of the consumer server mapped to the semiconductor device and the active state of the data collection plan defined for the semiconductor device can be applied to the semiconductor device. there is.

The security management unit 114 may provide access to the access control list to the user terminal through the first interface.

The security management unit 114 may receive an ACL acquisition command (Get ACL) from the user terminal through the first interface, and receive privilege items from the semiconductor device in response.

Next, the security management unit 114 may receive an Add Role command from the user terminal through the first interface and map role information to at least one of the permission items in response. .

Next, the security management unit 114 may receive an Add Principal command from the user terminal through the first interface, and map principal information to at least one of the permission items in response. .

The access control list includes the above mapping result, and the access control list may include items in which role information or principal information is mapped to at least one of the permission items for semiconductor equipment.

The security management unit 114 can activate or deactivate a session connection for a specific user.

For example, the security management unit 114 may provide a list of activated sessions to the user terminal through the first interface and deactivate the session in response to a deactivation command for a specific session received from the user terminal.

The data collection plan management unit 115 may provide the user terminal with access to a data collection plan (DCP) of the semiconductor device defined based on metadata through the first interface.

When a session is connected, the data collection plan management unit 115 may receive a list of data collection plans defined in the semiconductor device through the second interface and provide it to the user terminal through the first interface.

The data collection plan management unit 115 receives a data collection plan refresh command from the user terminal through a first interface, and in response, provides a list of data collection plans defined in the semiconductor equipment through the second interface. It can be received and provided to the user terminal through the first interface.

The data collection plan management unit 115 receives a data collection plan creation (Define DCP) command including the type of data collection plan to be created and setting values of the data collection plan from the user terminal through the first interface, and provides In response, a data collection plan of the type specified by the user can be created.

Here, the type of data collection plan may include at least one of trace, event, exception, and combination.

If the type of data collection plan is tracking, data may be collected or stopped from semiconductor equipment depending on whether an event or alarm is specified in the start or stop trigger.

The data collection plan management unit 115 may receive an activation or deactivation command of a specific data collection plan from the user terminal through the first interface, and may activate or deactivate the data collection plan specified by the user in response.

The data collection plan management unit 115 may receive a command to delete a specific data collection plan from the user terminal through the first interface and delete the data collection plan specified by the user in response.

The data collection plan management unit 115 may define a data collection plan using metadata stored in a database to prevent duplicate metadata from being collected from the same semiconductor equipment for each user and session.

The data collection plan management unit 115 may perform a redundancy check of data collection plans to prevent duplicate data collection plans from being created for the same semiconductor equipment.

Figure 4 is an operation flowchart showing a method of supporting equipment data collection according to an embodiment of the present invention.

Referring to FIG. 4, in the device data collection support method according to an embodiment of the present invention, first, the device data collection support device adds an access control list (Access Control List, ACL) containing access authority information for semiconductor equipment. You can do it (S410).

Here, the device data collection support device receives a privilege list from the semiconductor device, and an access control list including items to which at least one of the privileges included in the privilege list and a role or principal are mapped. can be created.

Next, the device data collection support device may connect a session to the semiconductor device based on the item corresponding to the user of the user terminal among the items included in the access control list (S420).

Here, the equipment data collection support device may disable another user's session connection upon the user's request.

For example, the equipment data collection support device may provide a list of active sessions to the user terminal and deactivate the session in response to a deactivation command for a specific session received from the user terminal.

Next, the device data collection support device can load metadata from the semiconductor device connected to the session (S430).

Here, the device data collection support device may store metadata of the semiconductor device in a database or provide it to a user terminal.

Next, the device data collection support device can generate a data collection plan (DCP) for the semiconductor device based on the metadata (S440).

Here, the equipment data collection support device may perform a redundancy check to determine whether the new data collection plan overlaps with the existing data collection plan.

Next, the equipment data collection support device can activate the created data collection plan (S450).

Figure 5 is an operation flowchart showing a method of supporting equipment data collection according to another embodiment of the present invention.

In particular, Figure 5 is an operation flowchart showing the process of registering a user of a device data collection support device, a semiconductor device that is an EDA server, and a consumer server that is subject to an EDA client service.

Referring to FIG. 5, in the device data collection support method according to another embodiment of the present invention, the device data collection support device connects to the device data collection support device based on information about other users received from the user terminal. Users can be registered (S510).

Next, the device data collection support device may register semiconductor devices to be managed by the device data collection support device based on the access address for the semiconductor device received from the user terminal (S520).

Here, when there is an interface search command from the user terminal, the device data collection support device connects to the semiconductor device using the access address of the semiconductor device, and retrieves the equipment name and EDA web service address (Web Service URL) from the semiconductor device. ) can be received and mapped to semiconductor equipment.

Next, the device data collection support device may register consumer servers that will collect data from semiconductor devices based on the access address for the consumer server received from the user terminal (S530).

Here, the device data collection support device can map the access address of the consumer server that is the target of the EDA client service to the semiconductor device.

Figure 6 is an operation flowchart showing a method of supporting equipment data collection according to another embodiment of the present invention.

In particular, Figure 6 is an operation flowchart showing the process of creating and managing a data collection plan in an equipment data collection support device.

Referring to FIG. 6, in the device data collection support method according to another embodiment of the present invention, when the device data collection support device loads metadata from a semiconductor device connected to a session, the data collection plan list defined in the semiconductor device can be received together (S610).

Next, the equipment data collection support device can receive real-time parameter values, events, and alarms corresponding to the new data collection plan (S620).

The equipment data collection support device may provide real-time parameter values corresponding to the new data collection plan to the user terminal, thereby providing real-time data collection testing according to the new data collection plan.

Through this, the equipment data collection support device creates a new data collection plan that does not overlap with the existing data collection plan list predefined in the semiconductor equipment, and can test in real time whether data is properly collected according to the new data collection plan. It has a beneficial effect.

Figure 7 is an operation flowchart showing a method of supporting equipment data collection according to another embodiment of the present invention.

In particular, Figure 7 is an operation flowchart showing the process of applying the data collection plan generated in the equipment data collection support device to the semiconductor device and collecting data.

Referring to FIG. 7, in the device data collection support method according to another embodiment of the present invention, the device data collection support device can activate the created new data collection plan (S450).

Here, the new data collection plan is set so that the status value in the equipment data collection support device indicates an active state, and the new data collection plan or the active state of the new data collection plan may be synchronized to the semiconductor device.

Next, the equipment data collection support device can redefine the data collection plan of the semiconductor equipment to a new data collection plan and synchronize the active state of the new data collection plan, allowing real-time data to be collected from the semiconductor equipment to the consumer server. (S710).

As an optional embodiment, the device data collection support device displays real-time data collected by the consumer server on a user interface provided through a user terminal, providing different visual effects for each type of data collection plan corresponding to real-time data. It can be applied and displayed.

Figure 8 is a reference diagram showing a session connection structure for collecting SEMI standard-based equipment data according to an embodiment of the present invention.

Referring to FIG. 8, entities for collecting SEMI standard-based equipment data according to an embodiment provide a equipment data collection support device 110, a device data collection device 120, and a semiconductor device 150 to the semiconductor factory (FAB). and the database 160 may be located, and the user terminal 130 and the equipment engineering system 140 may be located on the office side.

The semiconductor factory (FAB) and the office may be geographically distant and may be different location areas.

The equipment data collection support device 110 receives control commands for data collection control from a plurality of user terminals 130 that wish to control data collection from the semiconductor equipment 150, and provides control result information to the user in response. It can be provided to terminals 130.

The device data collection support device 110 transmits a second control command corresponding to the first control command received from the plurality of user terminals 130 to the semiconductor device 150, and 2 First control result information corresponding to control result information may be provided to the user terminals 130.

Here, the connection between the device data collection support device 110 and the user terminal 130 is made through a user terminal session, and the connection between the device data collection support device 110 and the semiconductor device 150 can be made through an EDA session. .

The device data collection support device 110 may set the device data collection device 120 to collect data from the semiconductor device as an endpoint to establish an EDA session with the semiconductor device 150.

That is, since all user terminals 130 are not directly connected to the semiconductor equipment 150 that the user wants to control, but are connected to the equipment data collection support device 110 that performs the role of the HAS server, the factory (FAB) side Network traffic between and user terminals 130 may occur only between the equipment data collection support device 110 and the user terminals 130.

In addition, because the equipment engineering systems 140 do not collect data directly from the semiconductor equipment 150, but collect data from the equipment data collection device 120 or the analysis system server behind the equipment data collection device 120, the factory Network traffic between the (FAB) side and the equipment engineering system 140 occurs only between the equipment data collection device 120 and the equipment engineering system 140, or between the analysis system server and the equipment engineering system 140. It can only occur in

Accordingly, the network traffic between the factory (FAB) side and the office (Office) side is a first firewall setting and equipment engineering system 140 to allow user terminals 130 to access the equipment data collection support device 110. It can be managed through a second firewall setting to allow them to access the equipment data collection device 120 or the analysis system server.

Figure 9 is an operation flowchart showing a session operation method for collecting equipment data according to an embodiment of the present invention.

Referring to FIG. 9, in the session operation method for equipment data collection according to an embodiment of the present invention, the equipment data collection support device first connects a user terminal session to a user terminal that wishes to control data collection from semiconductor equipment. (S910).

Here, the user terminal session is a session in which the equipment data collection support device receives a first control command corresponding to control of data collection from the user terminal and provides first control result information that is a response according to the first control command to the user terminal. It can be.

Although not shown in FIG. 9, the device data collection support device connects the semiconductor device and the EDA session after connecting the user terminal session, or provides information about the already connected EDA session to the user terminal through the user terminal session. can be provided.

Here, the EDA session may be a session in which the device data collection support device transmits a second control command to the semiconductor device and receives second control result information, which is a response according to the second control command, from the semiconductor device.

The device data collection support device may load information about EDA sessions connected to semiconductor equipment from a database before connecting an EDA session, and provide information about the EDA sessions to the user terminal.

The equipment data collection support device connects the EDA session based on the Access Control List (ACL) corresponding to the Equipment Engineering System (EES) designation information received from the user terminal, and is an equipment data collection device. Data collected from semiconductor equipment can be post-processed and transmitted to the equipment engineering system.

When an EDA session is connected, a device data collection device that collects data from semiconductor equipment may be set as an end point.

Equipment data collection support devices can connect EDA sessions to ensure that access control lists and endpoints do not overlap.

After connecting an EDA session, the device data collection support device can load metadata of the semiconductor device and provide the metadata to the user terminal.

The device data collection support device determines whether metadata exists in the database, and if metadata does not exist in the database, loads metadata from the semiconductor device, stores the loaded metadata in the database, and stores the metadata in the database. If data exists, metadata can be loaded from the database.

After connecting an EDA session, the equipment data collection support device may load status information of the data collection plan created for the semiconductor equipment from the database and provide status information of the data collection plan to the user terminal.

The data collection plan or metadata may be provided to the data collection device when the database is updated or when the data collection device is initialized.

Next, the device data collection support device may receive a request for activation of a data collection plan corresponding to the semiconductor device through a user terminal session (S920).

Next, the equipment data collection support device may activate the data collection plan through the EDA session (S930).

Device Data Collection Support A data collection plan can be activated through an EDA session corresponding to an endpoint included in the device data collection plan's activation request.

Figure 10 is an operation flowchart showing a session operation method for collecting equipment data according to another embodiment of the present invention.

Referring to FIG. 10, in the session operation method for equipment data collection according to another embodiment of the present invention, first, the first user terminal 130-1 requests the equipment data collection support device 110 to connect to an EDA session. In this case, the device data collection support device 110 may connect an EDA session with the first semiconductor device 150-1 and store the EDA session information in the database 160.

In the initial state, since the metadata of the first semiconductor device 150-1 is not stored in the device data collection support device 110 or the database 160, the device data collection support device 110 directly Metadata may be received from the semiconductor device 150-1, provided to the first user terminal 130-1, and stored in the database 160.

Next, when the first user terminal 130-1 requests the device data collection support device 110 to create a DCP, the device data collection support device 110 is connected to the first semiconductor device 150-1. Using an EDA session, the first semiconductor device 150-1 can be requested to create a DCP, and the requested DCP information can be stored in the database 160.

Next, when the first user terminal 130-1 requests DCP activation from the device data collection support device 110, the device data collection support device 110 is connected to the first semiconductor device 150-1. DCP activation in the first semiconductor device 150-1 can be requested using an EDA session, and status information indicating that the DCP is active can be stored in the database 160.

In this way, according to the request received from the first user terminal 130-1, an EDA session is connected between the equipment data collection support device 110 and the first semiconductor equipment 150-1, the metadata is stored once, and the DCP When is created and status information is created, related information may be provided so that the second user terminal 130-2 that connects later can use it.

For example, when the second user terminal 130-2 connects to the device data collection support device 110, the device data collection support device 110 obtains session information, metadata, and DCP information stored in the database and By providing the information to the user terminal 130-2, the user of the second user terminal 130-2 can confirm that an EDA session has been created for the first user terminal 130-1 and that the DCP has been created and is active. there is.

When the second user terminal 130-2 requests the device data collection support device 110 to deactivate DCP, the device data collection support device 110 opens an EDA session connected to the first semiconductor device 150-1. Using this method, deactivation of the DCP in the first semiconductor device 150-1 can be requested, and status information indicating that the DCP is in an inactive state can be stored in the database 160.

Figure 11 is a block diagram showing the configuration of the equipment data collection device 120 according to an embodiment of the present invention.

Referring to FIG. 11, the equipment data collection device 120 according to an embodiment of the present invention may include a web application server driver 121 and a message order guarantee support unit 122.

The semiconductor device 150 may transmit data collected according to the activated data collection plan to the device data collection device 120 in the form of a message.

The web application server driving unit 121 allocates one thread to each message in the order in which it receives the messages from the semiconductor device 150, and operates a web application server (Web Application Server) for receiving messages through the thread. WAP) can be run.

Here, when the web application server receives a packet from the semiconductor device through the connection unit, it determines whether the packet format corresponds to the HTTP protocol from the header of the packet, and operates a thread pool (payload) to receive the full text (payload) of the packet. You can allocate any one of the threads registered in the thread pool.

A thread is allocated to perform the entire process from receiving, objectifying, and post-processing a single message, that is, one thread can be dedicated to one message.

The web application server can manage the message order guarantee support unit 122 through the management unit.

For example, the management unit may be a servlet handler in the case of Java, and the message order guarantee support unit 122 may be a servlet managed by the servlet handler.

A thread can perform various steps, including logging, depending on the interceptor chain included in the servlet. When a message is received, it determines the processing order and post-processes among the various functions included in the interceptor chain. You can call a function for execution.

As an optional embodiment, a CXF servlet may be used to perform the role of message order guarantee support unit 122.

In this case, the CXF servlet is executed with the One Way Processor Interceptor of the interceptor chain disabled, thereby preventing new threads from being allocated to execute functions called in the interceptor chain.

Through this, when a function for determining the processing order and performing post-processing is called in the interceptor chain included in the CXF servlet, the message is not changed from the thread that received the message to another thread, and the processing order is determined and processed by the thread that received the message. A function for performing post-processing may be executed.

Here, the message order guarantee support unit 122 may queue identification information of threads in the order of allocation of threads to a queue created corresponding to a semiconductor device.

Here, the identification information may be in the form of an IP (Internet Protocol) address or a combination of an IP address and a port.

A thread can queue identification information in the semiconductor device-thread mapping queue, then receive the full message and objectify it.

Semiconductor device-thread mapping queues are created one by one for each semiconductor device, and semiconductor devices and semiconductor device-thread mapping queues may have a one-to-one correspondence.

Here, objectification may mean changing the full text of a message transmitted by a semiconductor device into an objectified data format (eg, XML or JSON format) according to the EDA standard.

Here, when one thread has completed receiving one message, the message order guarantee support unit 122 determines the processing order of one message using the identification information of one thread and the semiconductor device-thread mapping queue. You can judge.

The message order guarantee support unit 122 may perform post-processing on messages in the order in which they are received.

Here, post-processing may mean converting the form of the message into a form required by the equipment engineering system (EES).

Here, the message order guarantee support unit 122 may dequeue the identification information of the thread corresponding to the message whose processing order has arrived in the semiconductor device-thread mapping queue.

Figure 12 is an operation flowchart showing a method of ensuring the collection order of equipment data according to an embodiment of the present invention.

Referring to FIG. 12, in the method of ensuring the collection order of equipment data according to an embodiment of the present invention, the equipment data collection device may first allocate a first thread to receive the first message from the semiconductor equipment. (S1210).

Here, the equipment data collection device may allocate one thread to each of the messages in the order in which the first packet of the message is received.

Next, the equipment data collection device may store the reception order of the first message using the first identification information of the first thread (S1220).

Here, the device data collection device may store the reception order of the first message by queuing the first identification information in a semiconductor device-thread mapping queue created corresponding to the semiconductor device.

Next, the equipment data collection device may determine the processing order of the second message using the second identification information of the second thread that has completed receiving the second message and the reception order of the messages (S1230).

Here, if the second identification information and the first item of the semiconductor device-thread mapping queue correspond, the equipment data collection device may determine that the processing order of the second message has arrived.

More specifically, the equipment data collection device calls a function for determining the processing order and performing post-processing through the second thread that has completed receiving the second message, which is one of the messages, and the second thread of the second thread that called the function The identification information and the first item of the semiconductor device-thread mapping queue are compared, and if the second identification information and the first item of the semiconductor device-thread mapping queue correspond, the processing order of the second message that the second thread has completed receiving. It can be judged that has arrived.

Here, the device data collection device may repeatedly compare the second identification information and the first item of the semiconductor device-thread mapping queue during the life cycle preset to the second thread.

If no correspondence is found even after comparing the second identification information and the first item of the semiconductor device-thread mapping queue during the preset life cycle, processing of the second message may be skipped.

Next, the equipment data collection device may perform post-processing on the second message in processing order (S1240).

Here, the device data collection device may dequeue the first item of the semiconductor device-thread mapping queue.

Figure 13 is an operation flowchart showing a method of ensuring the collection order of equipment data according to another embodiment of the present invention.

In particular, Figure 13 is an operational flowchart showing the process of determining the processing order of a message received by a thread.

Referring to FIG. 13, the method of ensuring the collection order of equipment data according to another embodiment of the present invention first involves the equipment data collection device determining the processing order and performing post-processing through a thread that has received a message. can be called (S1310).

Next, the device data collection device can compare the identification information of the thread that called the function and the front item of the semiconductor device-thread mapping queue (S1320).

Here, the device data collection device may determine whether the thread's identification information and the first item of the semiconductor device-thread mapping queue correspond (S1330).

As a result of the determination, if the identification information of the thread and the first item of the semiconductor device-thread mapping queue correspond, the device data collection device may determine that the processing order of the message that the thread has completed has arrived (S1340).

As a result of the determination, if the identification information of the thread and the first item of the semiconductor device-thread mapping queue do not correspond, the device data collection device may determine whether a preset life cycle time for the thread has elapsed (S1335).

As a result of the determination, if the preset life cycle time for the thread has not elapsed, the equipment data collection device may repeatedly compare the second identification information and the first item of the semiconductor device-thread mapping queue (S1320).

As a result of the determination, if a preset life cycle time has elapsed for the thread, the equipment data collection device may not determine that the processing order of the message has arrived, and the data collection device may determine the processing order in a later step (e.g., S1240). Since the message is processed according to this, the processing of the message can be skipped.

Figure 14 is a diagram showing the structure of processes executed in the equipment data collection device according to an embodiment of the present invention.

Referring to FIG. 14, the equipment data collection device 120 according to an embodiment of the present invention includes a monitoring target including an operation management maintenance process 123, an operation management maintenance sub-process 124, and a consumer process pair 125. Processes can be executed.

The execution status of the operation management maintenance sub-process 124 is monitored by the operation management maintenance process 123, and the operation management maintenance process 123 is monitored by the operation management maintenance sub-process 124, and the operation management maintenance process ( 123) and the operation management maintenance subprocess 124 may have a mutual monitoring structure.

In addition, the execution state of the consumer process pair 125 is monitored by the operation management maintenance process 123, and the active state is switched between the two consumer processes 125-1 and 125-2 forming the consumer process pair 125. It may be a (switch over) structure.

When the execution state of the activated consumer process 125-1 is abnormal, the operation management maintenance process 123 terminates the activated consumer process 125-1 and activates the waiting consumer process 125-2. You can do it. In this case, the operation management maintenance process 123 can manage a new consumer process (not shown) by executing it in a waiting state and including it in the consumer process pair 125.

Here, the consumer process pair 125 has the same port address for collecting data from the semiconductor device, only one consumer process among the consumer process pairs is activated at the same time, and the port address is actually occupied by the activated consumer process. It may be a group made up of two consumer processes (125-1, 125-2).

For example, among the two consumer processes 125-1 and 125-2 forming the consumer process pair 125, only the first consumer process 125-1 is activated, and the other consumer process 125-1 is activated. 2) is on standby, and then a switch over may be performed in which the first consumer process 125-1 is deactivated and the second consumer process 125-2 is activated by the operation management maintenance process 123.

In this case, the two consumer processes (125-1, 125-2) are set to the same IP address and port address, and the corresponding IP address and port address are changed by the first consumer process (125-1) before switching over. is occupied, but after the switch over is performed, the corresponding IP address and port address may be occupied by the second consumer process 125-2.

Through this, the semiconductor device can transmit data without interruption while maintaining the EDA session with the same IP address and port address as the destination in the two consumer processes 125-1 and 125-2. The equipment data collection device 120 can also receive data from semiconductor equipment without interruption.

Through this, the equipment data collection device 120 can provide a switch-over function that prevents consumer process functions, such as receiving data from specific semiconductor equipment, from being interrupted.

As an optional embodiment, the operation management maintenance process 123 terminates the activated consumer process 125-1 as necessary even if the execution state of the activated consumer process 125-1 is not abnormal, and The consumer process (125-2) can be activated.

For example, when the operation management maintenance process 123 needs to apply an update to the consumer process, it applies the update to the waiting consumer process 125-2, terminates the activated consumer process 125-1, and terminates the waiting consumer process 125-2. By activating the consumer process 125-2, updates can be applied without interruption of consumer process functions, such as receiving data from semiconductor equipment.

Figure 15 is an operation flowchart showing a process conversion method in an equipment data collection device according to an embodiment of the present invention.

Referring to FIG. 15, in the process switching method in the equipment data collection device according to an embodiment of the present invention, the equipment data collection device can first check the execution status of the monitored processes through an operation management maintenance process. (S1510).

Here, the monitored processes may include equipment data collection processes, that is, consumer processes.

As an optional embodiment, the monitored processes may include an operation management maintenance sub-process paired with an operation management maintenance process. The operation management maintenance subprocess can check the execution status of the operation management maintenance process and terminate or re-execute the operation management maintenance process.

The equipment data collection device can check whether the monitoring target processes respond within a standard time or whether the execution state is normal based on status messages received from the monitored target processes.

Here, the equipment data collection device is subject to monitoring not only when it receives a status message indicating an abnormal state, but also when the process to be monitored is down or does not respond for a preset time (hang or deadlock, etc.). The execution state of the process may be determined to be abnormal.

Next, the equipment data collection device may terminate or re-execute the monitored processes so that they remain running normally through the operation management maintenance process (S1520).

The equipment data collection device can terminate processes that are running but are in an abnormal state. Additionally, the equipment data collection device may run a process that is not running or has been terminated.

Next, the equipment data collection device may switch the activation target process so that one of the first processes included in the monitored target processes is deactivated and the other second process is activated through the operation management maintenance process (S1530 ).

Here, the equipment data collection device can check whether the monitoring target processes are activated through an operation management maintenance process and activate a monitoring target process that is not activated among the monitoring target processes.

Figure 16 is an operation flowchart showing a process conversion method in an equipment data collection device according to another embodiment of the present invention.

Referring to FIG. 16, in the process switching method in the equipment data collection device according to another embodiment of the present invention, the equipment data collection device can first check which of the processes to be monitored is not running or has terminated ( S1511).

The equipment data collection device may re-execute a process that is not running or has been terminated among the monitored processes (S1521).

Next, the equipment data collection device can check processes that are running or have not been terminated among the monitoring target processes and whose execution status is abnormal (S1512).

The equipment data collection device may terminate a process whose execution state is abnormal among the monitored processes (S1522).

Figure 17 is an operation flowchart showing a process conversion method in an equipment data collection device according to another embodiment of the present invention.

Referring to FIG. 17, the process switching method in the equipment data collection device according to another embodiment of the present invention first involves the equipment data collection device performing a consumer process pair unit included in the processes to be monitored through an operation management maintenance process. You can check whether an activated consumer process exists (S1531).

Next, if an activated consumer process does not exist in any one consumer process pair, the equipment data collection device checks whether an inactive consumer process exists in any one consumer process pair through an operation management maintenance process. (S1532).

Next, the equipment data collection device can activate the consumer process that is not activated through the operation management maintenance process (S1533).

Figure 18 is a diagram showing a computer system according to an embodiment of the present invention.

The equipment data collection support device 110 or the equipment data collection device 120 of the present invention may be implemented in a computer system 1000 such as a computer-readable recording medium.

Referring to FIG. 18, the computer system 1000 includes one or more processors 1010, memory 1030, user interface input device 1040, user interface output device 1050, and storage that communicate with each other through a bus 1020. It may include (1060). Additionally, the computer system 1000 may further include a network interface 1070 connected to the network 1080. The processor 1010 may be a central processing unit or a semiconductor device that executes processing instructions stored in the memory 1030 or storage 1060. Memory 1030 and storage 1060 may be various types of volatile or non-volatile storage media. For example, memory may include ROM 1031 or RAM 1032.

The specific implementations described in the present invention are examples and do not limit the scope of the present invention in any way. For the sake of brevity of the specification, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted. In addition, the connections or connection members of lines between components shown in the drawings exemplify functional connections and/or physical or circuit connections, and in actual devices, various functional connections or physical connections may be replaced or added. Can be represented as connections, or circuit connections. Additionally, if there is no specific mention such as “essential,” “important,” etc., it may not be a necessary component for the application of the present invention.

Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and the scope of the patent claims described below as well as all scopes equivalent to or equivalently changed from the scope of the claims are within the scope of the spirit of the present invention. It will be said to belong to

110: Equipment data collection support device
111: interface
112: Metadata management department
113: Session management unit
114: Security Management Department
115: Data collection plan management department
120, 120-1, 120-2, 120-3: Equipment data collection device
121: Web application server
122: Message order assurance support department
123: Operation management maintenance process
124: Operation management maintenance subprocess
125, 125-1, 125-2: Equipment data collection process
130, 130-1, 130-2: User terminal
140: Equipment engineering system
150, 150-1, 150-2: Semiconductor equipment
160: database
1000: computer system
1010: processor
1020: Bus
1030: Memory
1031: Rom
1032: RAM
1040: User interface input device
1050: User interface output device
1060: Storage
1070: Network interface
1080: Network

Claims (10)

Connecting, by an equipment data collection support device, a user terminal session to a user terminal that wishes to control data collection from semiconductor equipment;
receiving, by the device data collection support device, an activation request for a data collection plan corresponding to the semiconductor device through the user terminal session; and
activating, by the equipment data collection support device, the data collection plan through an EDA session different from the user terminal session.
A session operation method for collecting equipment data, including. According to paragraph 1,
The step of connecting the user terminal session is
Receiving a first control command corresponding to control of the data collection from the user terminal and connecting a user terminal session to provide first control result information that is a response according to the first control command to the user terminal
A session operation method for collecting equipment data, including. According to paragraph 1,
Connecting, by the device data collection support device, an EDA session to the semiconductor device
It further includes,
The step of connecting the EDA session is
A device data collection device that transmits a second control command to the semiconductor device, receives second control result information that is a response according to the second control command from the semiconductor device, and collects data from the semiconductor device is an endpoint ( Steps to connect an EDA session established as an end point
A session operation method for collecting equipment data, including. According to paragraph 3,
The step of connecting the EDA session is
Connecting the EDA session based on an Access Control List (ACL) corresponding to Equipment Engineering System (EES) designation information received from the user terminal.
Including,
A session operation method for collecting equipment data, wherein the equipment data collection device post-processes data collected from the semiconductor equipment and transmits it to the equipment engineering system. According to paragraph 3,
Before connecting the EDA session,
Loading, by the equipment data collection support device, information about EDA sessions connected to the semiconductor equipment from a database; and
The equipment data collection support device providing information about the EDA sessions to the user terminal.
It further includes,
The step of connecting the EDA session is
Connecting, by the equipment data collection support device, an EDA session so that the access control list and the endpoint do not overlap.
A session operation method for collecting equipment data, including. According to paragraph 3,
After connecting the EDA session,
Loading, by the device data collection support device, metadata of the semiconductor device; and
The equipment data collection support device providing the metadata to the user terminal.
It further includes,
The step of loading the metadata is
determining, by the device data collection support device, whether the metadata exists in a database;
When the metadata does not exist in the database, the device data collection support device loading the metadata from the semiconductor device and storing the loaded metadata in the database; and
Loading, by the equipment data collection support device, the metadata from the database when the metadata exists in the database.
A session operation method for collecting equipment data, including. According to clause 6,
After connecting the EDA session,
Loading, by the equipment data collection support device, status information of a data collection plan created for the semiconductor equipment from the database; and
The equipment data collection support device providing status information of the data collection plan to the user terminal.
A session operation method for collecting equipment data, further comprising: In clause 7,
The above data collection plan or metadata
A session operation method for collecting equipment data, provided to the data collection device when the database is updated or when the data collection device is initialized. According to paragraph 3,
The step of activating the data collection plan is
Activating the data collection plan through an EDA session corresponding to an endpoint included in the activation request of the data collection plan.
A session operation method for collecting equipment data, including. a memory in which at least one program is recorded; and
A central processing unit (CPU) that executes the program
Including,
The above program is
Connecting a user terminal session to a user terminal that wishes to control data collection from semiconductor equipment;
Receiving an activation request for a data collection plan corresponding to the semiconductor device through the user terminal session; and
Activating the data collection plan through an EDA session different from the user terminal session.
An equipment data collection support device that includes instructions to perform.

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