KR20240004020A - Curable composition, cured layer using the composition, color filter including the cured layer and display device including the color filter - Google Patents
Curable composition, cured layer using the composition, color filter including the cured layer and display device including the color filter Download PDFInfo
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- KR20240004020A KR20240004020A KR1020220082045A KR20220082045A KR20240004020A KR 20240004020 A KR20240004020 A KR 20240004020A KR 1020220082045 A KR1020220082045 A KR 1020220082045A KR 20220082045 A KR20220082045 A KR 20220082045A KR 20240004020 A KR20240004020 A KR 20240004020A
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- formula
- curable composition
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- weight
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- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- IPTNXMGXEGQYSY-UHFFFAOYSA-N acetic acid;1-methoxybutan-1-ol Chemical compound CC(O)=O.CCCC(O)OC IPTNXMGXEGQYSY-UHFFFAOYSA-N 0.000 description 1
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- 125000003342 alkenyl group Chemical group 0.000 description 1
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- HXTBYXIZCDULQI-UHFFFAOYSA-N bis[4-(methylamino)phenyl]methanone Chemical compound C1=CC(NC)=CC=C1C(=O)C1=CC=C(NC)C=C1 HXTBYXIZCDULQI-UHFFFAOYSA-N 0.000 description 1
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- 229910052794 bromium Inorganic materials 0.000 description 1
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- 238000004364 calculation method Methods 0.000 description 1
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
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- 239000012046 mixed solvent Substances 0.000 description 1
- ZWRDBWDXRLPESY-UHFFFAOYSA-N n-benzyl-n-ethylethanamine Chemical compound CCN(CC)CC1=CC=CC=C1 ZWRDBWDXRLPESY-UHFFFAOYSA-N 0.000 description 1
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- MZYHMUONCNKCHE-UHFFFAOYSA-N naphthalene-1,2,3,4-tetracarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=C(C(O)=O)C(C(O)=O)=C21 MZYHMUONCNKCHE-UHFFFAOYSA-N 0.000 description 1
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- UFOIOXZLTXNHQH-UHFFFAOYSA-N oxolane-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C1OC(C(O)=O)C(C(O)=O)C1C(O)=O UFOIOXZLTXNHQH-UHFFFAOYSA-N 0.000 description 1
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- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
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- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 1
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- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G03F7/004—Photosensitive materials
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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Abstract
(A) 인듐 산화물로 패시베이션된 양자점; 및 (B) 중합성 화합물을 포함하는 경화성 조성물, 상기 경화성 조성물을 이용하여 제조된 경화막, 상기 경화막을 포함하는 컬러필터 및 상기 컬러필터를 포함하는 디스플레이 장치가 제공된다.(A) Quantum dots passivated with indium oxide; and (B) a curable composition containing a polymerizable compound, a cured film manufactured using the curable composition, a color filter containing the cured film, and a display device containing the color filter.
Description
본 기재는 경화성 조성물, 상기 조성물을 이용하여 제조된 경화막, 상기 경화막을 포함하는 컬러필터 및 상기 컬러필터를 포함하는 디스플레이 장치에 관한 것이다.This description relates to a curable composition, a cured film manufactured using the composition, a color filter comprising the cured film, and a display device comprising the color filter.
일반적인 양자점의 경우, 소수성을 가지는 표면 특성으로 인해 분산되는 용매가 제한적이고, 그러다 보니 바인더나 경화성 모노머 등과 같은 극성 시스템으로의 도입에 많은 어려움을 겪고 있는 것이 사실이다. In the case of general quantum dots, the solvent in which they are dispersed is limited due to their hydrophobic surface characteristics, and as a result, it is true that they face many difficulties in introducing them into polar systems such as binders or curable monomers.
일 예로, 활발히 연구되고 있는 양자점 잉크 조성물의 경우에도 그 초기 단계에서는 상대적으로 극성도가 낮으며 소수성 정도가 높은 경화성 조성물에 사용되는 용매에 그나마 분산되는 수준이었다. 이 때문에 전체 조성물 총량 대비 20 중량% 이상의 양자점을 포함시키기 어려워 잉크의 광효율을 일정 수준 이상 증가시킬 수 없었고, 광효율을 증가시키기 위해 무리하게 양자점을 추가 투입해 분산시키더라도 잉크-젯팅(Ink-jetting)이 가능한 점도 범위를 넘어서게 되어, 공정성을 만족시킬 수 없었다. For example, even in the case of quantum dot ink compositions that are being actively studied, at the initial stage, they were dispersed in solvents used in curable compositions with relatively low polarity and high hydrophobicity. For this reason, it was difficult to include more than 20% by weight of quantum dots relative to the total amount of the composition, making it impossible to increase the luminous efficiency of the ink beyond a certain level, and even if additional quantum dots were added and dispersed to increase luminous efficiency, ink-jetting was not possible. This possible point also exceeded the range, so fairness could not be satisfied.
또한, 잉크-젯팅(Ink-jetting)이 가능한 점도 범위를 구현하기 위해 전체 조성물 총량 대비 50 중량% 이상의 용매를 포함시켜 잉크 고형분 함량을 낮추는 방법을 사용해 왔는데, 이 방법 역시 점도 면에서는 어느정도 만족할 만한 결과를 제공하나, 잉크-젯팅(Ink-jetting) 시 용매 휘발에 의한 노즐 건조, 노즐 막힘 현상, 잉크-젯팅(Ink-jetting) 후 시간에 따른 단막 두께 감소 등의 문제와 함께 경화 후 두께 편차가 심해지게 되어, 실제 공정에 적용하기 힘든 단점을 가진다.In addition, in order to achieve a viscosity range that allows ink-jetting, a method of lowering the ink solid content by including more than 50% by weight of solvent relative to the total amount of the composition has been used, and this method also has somewhat satisfactory results in terms of viscosity. However, during ink-jetting, there are problems such as nozzle drying due to solvent volatilization, nozzle clogging, and single film thickness decrease over time after ink-jetting, and the thickness deviation after curing is severe. It has the disadvantage of being difficult to apply to actual processes.
따라서, 양자점 잉크는 용매를 포함하지 않는 무용매 타입이 실제 공정에 적용하기에 가장 바람직한 형태이며, 현재의 양자점 자체를 용매형 조성물에 적용하는 기술은 이제 어느정도 한계에 다다랐다고 평가되고 있다.Therefore, the solvent-free type of quantum dot ink that does not contain a solvent is the most desirable form to apply in actual processes, and the current technology for applying quantum dots themselves to solvent-type compositions is evaluated to have reached a certain limit.
무용매형 경화성 조성물(양자점 잉크 조성물)의 경우, 중합성 화합물이 과량 포함되는 특성으로 말미암아, 휘발성으로 인한 노즐 건조에 따른 막힘 및 토출 불량, 패턴 격벽 픽셀 내 젯팅된 잉크 조성물의 휘발로 인한 단막 두께 감소 등이 문제가 된다. 따라서, 무용매형 경화성 조성물의 점도를 최대한 낮추는 것이 좋다. 이에 상기 중합성 단량체의 분자량을 증가시키거나 히드록시기를 포함하는 화학구조를 도입시키는 등 상기 중합성 화합물의 구조를 개질시켜 무용매형 경화성 조성물의 점도를 낮추려는 노력들이 있어 왔다. In the case of solvent-free curable compositions (quantum dot ink compositions), due to the nature of containing an excessive amount of polymerizable compounds, clogging and discharge defects due to nozzle drying due to volatility, and single film thickness reduction due to volatilization of the ink composition jetted within the pattern partition pixels etc. becomes a problem. Therefore, it is best to lower the viscosity of the solvent-free curable composition as much as possible. Accordingly, efforts have been made to lower the viscosity of the solvent-free curable composition by modifying the structure of the polymerizable compound, such as increasing the molecular weight of the polymerizable monomer or introducing a chemical structure containing a hydroxy group.
그런데, 무용매형 경화성 조성물의 점도 뿐만 아니라, 최근에는 양자점의 고내구성 또한 중요한 이슈가 되고 있다. 예전과 달리, 갈수록 사용되는 광원의 광량이 높아지고 있기에, 이러한 높은 광량에도 취약하지 않은, 즉 내구성이 우수한 양자점의 개발도, 경화성 조성물의 점도 못지 않게 중요하다는 것이 최근 여러 연구들을 통해 밝혀진 바 있다.However, in addition to the viscosity of solvent-free curable compositions, the high durability of quantum dots has also recently become an important issue. Unlike in the past, as the amount of light from the light source being used is increasing, it has been revealed through several recent studies that the development of quantum dots that are not vulnerable to such high amounts of light, that is, have excellent durability, and the viscosity of the curable composition are equally important.
그러나, 경화성 조성물의 점도 외에, 상기 경화성 조성물에 포함되는 양자점의 내구성을 향상시키려는 노력은 매우 부족하였으며, 최근들어 이에 대한 연구가 시작되고 있는 중이다.However, in addition to the viscosity of the curable composition, efforts to improve the durability of quantum dots included in the curable composition have been very insufficient, and research on this has recently begun.
일 구현예는 내구성이 우수한 양자점을 포함하는 경화성 조성물을 제공하기 위한 것이다.One embodiment is to provide a curable composition containing quantum dots with excellent durability.
다른 일 구현예는 상기 경화성 조성물을 이용하여 제조된, 장기 신뢰성이 우수한 경화막을 제공하기 위한 것이다.Another embodiment is to provide a cured film manufactured using the curable composition and having excellent long-term reliability.
또 다른 일 구현예는 상기 경화막을 포함하는 컬러필터를 제공하기 위한 것이다.Another embodiment is to provide a color filter including the cured film.
또 다른 일 구현예는 상기 컬러필터를 포함하는 디스플레이 장치를 제공하기 위한 것이다.Another embodiment is to provide a display device including the color filter.
일 구현예는 (A) 인듐 산화물로 패시베이션된 양자점; 및 (B) 중합성 화합물을 포함하는 경화성 조성물을 제공한다.One embodiment includes (A) quantum dots passivated with indium oxide; and (B) a polymerizable compound.
상기 양자점은 인듐 산화물 패시베이션층을 포함하고, 상기 패시베이션층은 0.1nm 내지 1nm의 두께를 가질 수 있다.The quantum dot includes an indium oxide passivation layer, and the passivation layer may have a thickness of 0.1 nm to 1 nm.
상기 양자점은 그 표면이 표면개질물질로 표면개질된 양자점일 수 있다.The quantum dot may be a quantum dot whose surface has been surface modified with a surface modification material.
상기 표면개질물질은 하기 화학식 1 및/또는 화학식 2로 표시될 수 있다.The surface modification material may be represented by Formula 1 and/or Formula 2 below.
[화학식 1][Formula 1]
상기 화학식 1에서,In Formula 1,
L1 및 L2는 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,L 1 and L 2 are each independently a substituted or unsubstituted C1 to C20 alkylene group,
R1은 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이고,R 1 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group,
R2는 하기 화학식 R-1로 표시되고,R 2 is represented by the following formula R-1,
[화학식 R-1][Formula R-1]
상기 화학식 R-1에서,In the above formula R-1,
X는 CR(R은 수소원자 또는 치환 또는 비치환된 C1 내지 C10 알킬기임) 또는 N이고,X is CR (R is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group) or N,
L5 및 L6은 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,L 5 and L 6 are each independently a single bond or a substituted or unsubstituted C1 to C20 alkylene group,
n1은 0 내지 20의 정수이다.n1 is an integer from 0 to 20.
[화학식 2][Formula 2]
상기 화학식 2에서,In Formula 2,
L3 및 L4는 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,L 3 and L 4 are each independently a substituted or unsubstituted C1 to C20 alkylene group,
R3은 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이고,R 3 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group,
n2는 0 내지 20의 정수이다.n2 is an integer from 0 to 20.
상기 표면개질물질은 상기 화학식 1 및 화학식 2로 표시되는 화합물을 포함하고, 상기 표면개질물질 총량에 대해 상기 화학식 1로 표시되는 화합물은 상기 화학식 2로 표시되는 화합물과 동일하거나 보다 적은 함량으로 포함될 수 있다.The surface modification material includes compounds represented by Formula 1 and Formula 2, and the compound represented by Formula 1 may be included in an amount equal to or less than the compound represented by Formula 2 relative to the total amount of the surface modification material. there is.
상기 표면개질물질 총량에 대해 상기 화학식 1로 표시되는 화합물 및 화학식 2로 표시되는 화합물은 1:9 내지 5:5의 중량비로 포함될 수 있다.The compound represented by Formula 1 and the compound represented by Formula 2 may be included in a weight ratio of 1:9 to 5:5 relative to the total amount of the surface modification material.
상기 화학식 1로 표시되는 화합물은 하기 화학식 1-1 또는 화학식 1-2로 표시될 수 있다.The compound represented by Formula 1 may be represented by Formula 1-1 or Formula 1-2 below.
[화학식 1-1][Formula 1-1]
[화학식 1-2][Formula 1-2]
상기 화학식 1-1 및 화학식 1-2에서,In Formula 1-1 and Formula 1-2,
L1, L2, L5 및 L6은 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,L 1 , L 2 , L 5 and L 6 are each independently a substituted or unsubstituted C1 to C20 alkylene group,
R1은 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이고,R 1 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group,
n1 및 n2는 각각 독립적으로 0 내지 20의 정수이다.n1 and n2 are each independently integers from 0 to 20.
상기 화학식 1로 표시되는 화합물은 하기 화학식 1A 또는 화학식 1B로 표시될 수 있다.The compound represented by Formula 1 may be represented by Formula 1A or Formula 1B below.
[화학식 1A][Formula 1A]
[화학식 1B][Formula 1B]
상기 화학식 2로 표시되는 화합물은 하기 화학식 2A 또는 화학식 2B로 표시될 수 있다.The compound represented by Formula 2 may be represented by Formula 2A or Formula 2B below.
[화학식 2A][Formula 2A]
[화학식 2B][Formula 2B]
상기 경화성 조성물은 무용매형 경화성 조성물일 수 있다.The curable composition may be a solvent-free curable composition.
상기 무용매형 경화성 조성물은, 상기 무용매형 경화성 조성물 총량에 대해, 상기 양자점 5 중량% 내지 60 중량%; 및 상기 중합성 화합물 40 중량% 내지 95 중량%를 포함할 수 있다.The solvent-free curable composition includes 5 to 60 wt% of the quantum dots, based on the total amount of the solvent-free curable composition; And it may include 40% by weight to 95% by weight of the polymerizable compound.
상기 경화성 조성물은 중합개시제, 광확산제, 중합금지제 또는 이들의 조합을 더 포함할 수 있다.The curable composition may further include a polymerization initiator, a light diffuser, a polymerization inhibitor, or a combination thereof.
상기 광확산제는 황산바륨, 탄산칼슘, 이산화티타늄, 지르코니아 또는 이들의 조합을 포함할 수 있다.The light diffuser may include barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.
상기 경화성 조성물은 용매를 더 포함할 수 있다.The curable composition may further include a solvent.
상기 경화성 조성물은, 상기 경화성 조성물 전체 중량을 기준으로, 상기 양자점 1 중량% 내지 40 중량%; 상기 중합성 화합물 1 중량% 내지 20 중량%; 및 상기 용매 40 중량% 내지 80 중량%를 포함할 수 있다.The curable composition includes 1% to 40% by weight of the quantum dots, based on the total weight of the curable composition; 1% to 20% by weight of the polymerizable compound; And it may include 40% by weight to 80% by weight of the solvent.
상기 경화성 조성물은 말론산; 3-아미노-1,2-프로판디올; 실란계 커플링제; 레벨링제; 불소계 계면활성제; 또는 이들의 조합을 더 포함할 수 있다.The curable composition includes malonic acid; 3-amino-1,2-propanediol; Silane-based coupling agent; leveling agent; Fluorine-based surfactant; Or, it may further include a combination thereof.
다른 일 구현예는 상기 경화성 조성물을 이용하여 제조된 경화막을 제공한다.Another embodiment provides a cured film manufactured using the curable composition.
또 다른 일 구현예는 상기 경화막을 포함하는 컬러필터를 제공한다.Another embodiment provides a color filter including the cured film.
또 다른 일 구현예는 상기 컬러필터를 포함하는 디스플레이 장치를 제공한다.Another embodiment provides a display device including the color filter.
기타 본 발명의 측면들의 구체적인 사항은 이하의 상세한 설명에 포함되어 있다.Details of other aspects of the invention are included in the detailed description below.
양자점 표면을 인듐 산화물로 코팅(또는 패시베이션)한 후, 이를 경화성 조성물에 사용함으로써, 상기양자점 함유 경화성 조성물의 경화 단막은 경화 공정을 여러 번 거치더라도 발광 효율을 계속 높은 수준으로 유지할 수 있다. By coating (or passivating) the surface of the quantum dots with indium oxide and then using it in a curable composition, the cured single film of the curable composition containing the quantum dots can maintain luminous efficiency at a high level even after going through several curing processes.
도 1은 인듐 산화물로 코팅(또는 패시베이션)되고, 동시에 표면개질물질로 표면개질된 양자점을 나타낸 그림이다.Figure 1 is a diagram showing quantum dots coated (or passivated) with indium oxide and simultaneously surface modified with a surface modification material.
이하, 본 발명의 구현예를 상세히 설명하기로 한다. 다만, 이는 예시로서 제시되는 것으로, 이에 의해 본 발명이 제한되지는 않으며 본 발명은 후술할 청구범위의 범주에 의해 정의될 뿐이다. Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, and the present invention is not limited thereby, and the present invention is only defined by the scope of the claims to be described later.
본 명세서에서 특별한 언급이 없는 한, "알킬기"란 C1 내지 C20 알킬기를 의미하고, "알케닐기"란 C2 내지 C20 알케닐기를 의미하고, "사이클로알케닐기"란 C3 내지 C20 사이클로알케닐기를 의미하고, "헤테로사이클로알케닐기"란 C3 내지 C20 헤테로사이클로알케닐기를 의미하고, "아릴기"란 C6 내지 C20 아릴기를 의미하고, "아릴알킬기"란 C6 내지 C20 아릴알킬기를 의미하며, "알킬렌기"란 C1 내지 C20 알킬렌기를 의미하고, "아릴렌기"란 C6 내지 C20 아릴렌기를 의미하고, "알킬아릴렌기"란 C6 내지 C20 알킬아릴렌기를 의미하고, "헤테로아릴렌기"란 C3 내지 C20 헤테로아릴렌기를 의미하고, "알콕실렌기"란 C1 내지 C20 알콕실렌기를 의미한다.Unless otherwise specified herein, “alkyl group” refers to a C1 to C20 alkyl group, “alkenyl group” refers to a C2 to C20 alkenyl group, and “cycloalkenyl group” refers to a C3 to C20 cycloalkenyl group. , “Heterocycloalkenyl group” refers to a C3 to C20 heterocycloalkenyl group, “aryl group” refers to a C6 to C20 aryl group, “arylalkyl group” refers to a C6 to C20 arylalkyl group, and “alkylene group” means a C1 to C20 alkylene group, “arylene group” means a C6 to C20 arylene group, “alkylarylene group” means a C6 to C20 alkylarylene group, and “heteroarylene group” means a C3 to C20 heteroarylene group. It means an arylene group, and “alkoxylene group” means a C1 to C20 alkoxylene group.
본 명세서에서 특별한 언급이 없는 한, "치환"이란 적어도 하나의 수소 원자가 할로겐 원자(F, Cl, Br, I), 히드록시기, C1 내지 C20 알콕시기, 니트로기, 시아노기, 아민기, 이미노기, 아지도기, 아미디노기, 히드라지노기, 히드라조노기, 카르보닐기, 카르바밀기, 티올기, 에스테르기, 에테르기, 카르복실기 또는 그것의 염, 술폰산기 또는 그것의 염, 인산이나 그것의 염, C1 내지 C20 알킬기, C2 내지 C20 알케닐기, C2 내지 C20 알키닐기, C6 내지 C20 아릴기, C3 내지 C20 사이클로알킬기, C3 내지 C20 사이클로알케닐기, C3 내지 C20 사이클로알키닐기, C2 내지 C20 헤테로사이클로알킬기, C2 내지 C20 헤테로사이클로알케닐기, C2 내지 C20 헤테로사이클로알키닐기, C3 내지 C20 헤테로아릴기 또는 이들의 조합의 치환기로 치환된 것을 의미한다.Unless otherwise specified herein, “substitution” means that at least one hydrogen atom is replaced by a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, Azido group, amidino group, hydrazino group, hydrazono group, carbonyl group, carbamyl group, thiol group, ester group, ether group, carboxyl group or its salt, sulfonic acid group or its salt, phosphoric acid or its salt, C1 to C20 alkyl group, C2 to C20 alkenyl group, C2 to C20 alkynyl group, C6 to C20 aryl group, C3 to C20 cycloalkyl group, C3 to C20 cycloalkenyl group, C3 to C20 cycloalkynyl group, C2 to C20 heterocycloalkyl group, C2 to C20 heterocycloalkenyl group, C2 to C20 heterocycloalkynyl group, C3 to C20 heteroaryl group, or a combination thereof.
또한 본 명세서에서 특별한 언급이 없는 한, "헤테로"란, 화학식 내에 N, O, S 및 P 중 적어도 하나의 헤테로 원자가 적어도 하나 포함된 것을 의미한다.Also, unless otherwise specified herein, “hetero” means that at least one hetero atom of N, O, S, and P is included in the chemical formula.
또한 본 명세서에서 특별한 언급이 없는 한, "(메타)아크릴레이트"는 "아크릴레이트"와 "메타크릴레이트" 둘 다 가능함을 의미하며, "(메타)아크릴산"은 "아크릴산"과 "메타크릴산" 둘 다 가능함을 의미한다. Also, unless otherwise specified in the specification, “(meth)acrylate” means that both “acrylate” and “methacrylate” are possible, and “(meth)acrylic acid” means “acrylic acid” and “methacrylic acid.” "It means that both are possible.
본 명세서에서 특별한 언급이 없는 한, "조합"이란 혼합 또는 공중합을 의미한다.Unless otherwise specified herein, “combination” means mixing or copolymerization.
본 명세서 내 화학식에서 별도의 정의가 없는 한, 화학결합이 그려져야 하는 위치에 화학결합이 그려져있지 않은 경우는 상기 위치에 수소 원자가 결합되어 있음을 의미한다.Unless otherwise defined in the chemical formulas in this specification, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is bonded at that position.
또한 본 명세서에서 특별한 언급이 없는 한, "*"는 동일하거나 상이한 원자 또는 화학식과 연결되는 부분을 의미한다.Additionally, unless otherwise specified in the specification, “*” refers to a portion connected to the same or different atom or chemical formula.
본 발명에 따른 양자점 함유 경화성 조성물은 인듐 산화물로 패시베이션된 양자점을 포함함으로써, 상기 양자점의 내구성이 우수해져, 경화성 조성물로 제조된 경화 단막이 오랜 시간동안 발광 효율을 높게 유지할 수 있다.The quantum dot-containing curable composition according to the present invention includes quantum dots passivated with indium oxide, so that the durability of the quantum dots is excellent, and a cured single film made from the curable composition can maintain high luminous efficiency for a long time.
양자점 어플리케이션에 있어서 제품화를 위해 가장 중요한 사항은 양자점 디스플레이 내 양자점 입자의 내구성 및 신뢰성 안정화에 있다. 특히, 현재 청색 백라이트(blue backlight unit)로 사용되고 있는 OLED는 점점 NED 혹은 μLED로 대체되어 가고 있으며, 상기 NED 혹은 μLED 청색 백라이트(blue BLU)의 광량은 상기 OLED의 광량보다 10배 내지 100배 정도 더 높다. In quantum dot applications, the most important factor for commercialization is stabilizing the durability and reliability of quantum dot particles in quantum dot displays. In particular, OLED, which is currently used as a blue backlight unit, is gradually being replaced by NED or μLED, and the light amount of the NED or μLED blue backlight (blue BLU) is about 10 to 100 times greater than that of the OLED. high.
그러나, 현재 시중에 시판 중인 대부분의 양자점 디스플레이를 보면, 고형분의 양자점 필름 단막의 장기 신뢰성은 매우 취약한 수준으로 나타나고 있어, 보다 높은 광량을 가지는 청색 백라이트로 광원이 대체될 경우를 대비하여, 고내구성을 가지는 양자점에 대한 필요성이 점점 강조되고 있는 추세이다.However, looking at most quantum dot displays currently on the market, the long-term reliability of the solid quantum dot film single layer appears to be very weak, so in case the light source is replaced by a blue backlight with a higher light quantity, high durability is required. The need for quantum dots is increasingly being emphasized.
양자점 입자가 청색 광을 흡수하면 대부분 발광 빛으로 변환되어 에너지를 내어 놓지만, 미세하게 격자 진동에 의해 일부는 열로 소진된다. 그러나, 청색 광 에너지가 증가하면 양자점 표면의 발열 증가에 의해 열로 소진되는 부분이 더 많아지게 되고, 이는 양자점의 성능 저하의 큰 원인이 된다. 또한, 종래 표면개질물질로 양자점을 표면개질하더라도, 높은 광량을 가지는 청색 백라이트를 사용할 경우에는, 양자점의 내광성 등을 개선하려는 양자점 표면개질의 의미가 많이 퇴색될 수 있는 한계가 있다.When quantum dot particles absorb blue light, most of it is converted into luminous light and gives off energy, but some of it is dissipated as heat due to minute lattice vibrations. However, as blue light energy increases, more heat is dissipated due to increased heat generation on the surface of the quantum dot, which is a major cause of deterioration in the performance of the quantum dot. In addition, even if quantum dots are surface modified with a conventional surface modification material, when a blue backlight with a high amount of light is used, there is a limitation in that the meaning of quantum dot surface modification to improve the light resistance of quantum dots may be greatly faded.
이에 본 발명자들은 상기와 같은 문제점을 정확히 인식하고, 높은 광량을 가지는 청색 백라이트를 사용한다 하더라도 양자점이 내구성을 그대로 유지할 수 있도록 하기 위해, 수많은 연구를 진행하고 너무나도 많은 시행착오를 겪은 끝에, 마침내 양자점 표면을 인듐 산화물로 코팅시킴으로써, 상기 문제점을 해결할 수 있음을 확인하고, 본 발명을 완성하기에 이르렀다.Accordingly, the present inventors accurately recognized the above problem, and in order to ensure that the quantum dots maintain their durability even when using a blue backlight with a high amount of light, after conducting numerous researches and experiencing a lot of trial and error, they finally achieved the surface of the quantum dots. It was confirmed that the above problem could be solved by coating with indium oxide, and the present invention was completed.
이하에서 일 구현예에 따른 경화성 조성물을 구성하는 각각의 성분에 대하여 구체적으로 설명한다.Hereinafter, each component constituting the curable composition according to one embodiment will be described in detail.
양자점quantum dot
일 구현예에 따른 경화성 조성물 내 양자점은 그 표면이 인듐 산화물(In2O3)로 코팅 또는 패시베이션되어 있다. 이를 통해 양자점의 내구성, 구체적으로 내열 안정성이 크게 개선될 수 있다. 상기 산화물은 반드시 인듐 산화물이어야 하며, 인듐이 아닌 다른 금속 산화물, 예컨대 망간, 철, 아연 등의 금속 산화물을 사용할 경우에는 더블 피크가 발생하게 되어 색순도가 저하되는 문제가 필연적으로 발생하게 되는 바, 상기 양자점 표면은 반드시 인듐 산화물로 코팅 또는 패시베이션되어야 한다.The surface of the quantum dots in the curable composition according to one embodiment is coated or passivated with indium oxide (In 2 O 3 ). Through this, the durability of quantum dots, specifically heat stability, can be greatly improved. The oxide must be indium oxide, and when metal oxides other than indium, such as manganese, iron, and zinc, are used, a double peak is generated and the problem of color purity deterioration inevitably occurs. The quantum dot surface must be coated or passivated with indium oxide.
일 구현예는 표면이 인듐 산화물(In2O3)로 코팅 또는 패시베이션된 양자점을 포함하는 경화성 조성물, 구체적으로 무용매형 경화성 조성물을 제공할 수 있으며, 이러한 경화성 조성물은 이 기술분야에서 아직까지 한번도 시도되지 않았던, 새로운 형태의 조성을 가지는 경화성 조성물임에 틀림없다.One embodiment may provide a curable composition, specifically a solvent-free curable composition, including quantum dots whose surface is coated or passivated with indium oxide (In 2 O 3 ), and such a curable composition has never been attempted yet in this technical field. It must be a curable composition with a new type of composition that has never been used before.
예컨대, 상기 양자점은 인듐 산화물 패시베이션층(또는 코팅층)을 포함하고, 상기 패시베이션층(또는코팅층)은 1nm 이하, 예컨대 0.1nm 내지 1nm의 두께를 가질 수 있다. 경화성 조성물에 사용되는 일 구성요소로서의 양자점이, 패시베이션층을 가질 경우, 상기 패시베이션층의 두께는 양자점의 내구성 및 경화성 조성물에 의해 제조된 경화 단막의 광효율 유지율에 직접적으로 영향을 미치는 구성에 해당하기에, 매우 중요할 수 있다. 예컨대, 상기 패시베이션층의 두께가 0.1nm 미만인 경우에는 그 두께가 너무 얇아 패시베이션의 효과를 기대하기 어려울 수 있으며(또한, 0.1nm 미만의 두께를 가지는 패시베이션층의 제조 자체도 공정 상 쉽지 않음), 상기 패시베이션층의 두께가 1nm 초과인 경우에는 그 두께가 너무 두꺼워 후술하는 표면개질물질에 의한 양자점 표면개질 효과가 반감될 수 있다.For example, the quantum dot includes an indium oxide passivation layer (or coating layer), and the passivation layer (or coating layer) may have a thickness of 1 nm or less, for example, 0.1 nm to 1 nm. When quantum dots as a component used in a curable composition have a passivation layer, the thickness of the passivation layer corresponds to a configuration that directly affects the durability of the quantum dots and the luminous efficiency maintenance rate of the cured single film manufactured by the curable composition. , can be very important. For example, if the thickness of the passivation layer is less than 0.1 nm, it may be difficult to expect a passivation effect because the thickness is too thin (in addition, manufacturing the passivation layer itself with a thickness of less than 0.1 nm is not easy in terms of the process). If the thickness of the passivation layer is more than 1 nm, the thickness may be too thick and the effect of quantum dot surface modification by the surface modification material described later may be halved.
한편, 양자점 표면을 유기물 리간드로 패시베이션(passivation)할 수 있는 현존하는 가장 효율적인 리간드 구조는 이미 잘 알려진 바와 같이 티올기(thiol group)를 가지고 있는 리간드이며, 카르복실산(Carboxylic acid)형 리간드는 양자점 표면과의 상호작용(interaction)이 상대적으로 약한 편이고, 인산(phosphoric acid)형 리간드는 양자점의 분산성은 좋으나, 효율을 저하시키는 약점(색변현상 유발)을 가지고 있다.Meanwhile, as is well known, the most efficient existing ligand structure that can passivate the surface of quantum dots with organic ligands is a ligand containing a thiol group, and carboxylic acid-type ligands are used to passivate the surface of quantum dots with organic ligands. The interaction with the surface is relatively weak, and the phosphoric acid-type ligand has good dispersibility of quantum dots, but has a weakness that reduces efficiency (causing color change).
과거 LCD부터 시작하여, OLED, NED, 그리고 최근의 마이크로 LED까지 현재 디스플레이 기술이 개발되어 왔는데, 전술한 바와 같이 갈수록 청색광의 세기가 증가하고 있으므로, 이에 따라 양자점 또한 그 내구성이 현재 수준 대비 월등히 개선될 필요가 있다.Current display technologies have been developed, starting with LCD in the past, OLED, NED, and recently micro LED. As mentioned above, the intensity of blue light is increasing, and the durability of quantum dots is expected to be significantly improved compared to the current level. There is a need.
이에 양자점의 내구성 향상을 극대화하기 위해, 상기 인듐 산화물로 패시베이션된 양자점 표면을 티올기 함유 리간드(표면개질물질)로 더욱 표면개질시킬 수 있다. Accordingly, in order to maximize the improvement of the durability of the quantum dots, the surface of the quantum dots passivated with the indium oxide can be further surface modified with a thiol group-containing ligand (surface modification material).
예컨대, 상기 티올기 함유 표면개질물질은 bidentate thiol 리간드, 구체적으로 하기 화학식 1로 표시되는 표면개질물질일 수 있고, 하기 화학식 2로 표시되는 표면개질물질일 수도 있으며, 이들을 동시에 적용할 수도 있다. 인듐 산화물 코팅층 외에 추가로 양자점 표면이 상기 표면개질물질로 더욱 표면개질되어 있을 경우, 최종 양자점 함유 경화성 조성물이 단막 상태로 디스플레이 패널(display panel)에 탑재되었을 때 강한 청색광에 장시간 노출되었을 때에도 초기의 광효율을 유지하는 내광 특성이 좋은 양자점 및 이를 포함하는 양자점 함유 경화성 조성물을 제공할 수 있다.For example, the thiol group-containing surface modification material may be a bidentate thiol ligand, specifically a surface modification material represented by the following formula (1), or a surface modification material represented by the following formula (2), and these may be applied simultaneously. When the quantum dot surface is further surface modified with the surface modification material in addition to the indium oxide coating layer, the initial luminous efficiency is maintained even when exposed to strong blue light for a long time when the final quantum dot-containing curable composition is mounted on a display panel in the form of a single film. It is possible to provide quantum dots with good light resistance properties that maintain and a curable composition containing quantum dots containing the same.
[화학식 1][Formula 1]
상기 화학식 1에서,In Formula 1,
L1 및 L2는 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,L 1 and L 2 are each independently a substituted or unsubstituted C1 to C20 alkylene group,
R1은 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이고,R 1 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group,
R2는 하기 화학식 R-1로 표시되고,R 2 is represented by the following formula R-1,
[화학식 R-1][Formula R-1]
상기 화학식 R-1에서,In the above formula R-1,
X는 CR(R은 수소원자 또는 치환 또는 비치환된 C1 내지 C10 알킬기임) 또는 N이고,X is CR (R is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group) or N,
L5 및 L6은 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,L 5 and L 6 are each independently a single bond or a substituted or unsubstituted C1 to C20 alkylene group,
n1은 0 내지 20의 정수이다.n1 is an integer from 0 to 20.
[화학식 2][Formula 2]
상기 화학식 2에서,In Formula 2,
L3 및 L4는 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,L 3 and L 4 are each independently a substituted or unsubstituted C1 to C20 alkylene group,
R3은 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이고,R 3 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group,
n2는 0 내지 20의 정수이다.n2 is an integer from 0 to 20.
상기 화학식 1 및 화학식 2로 표시되는 표면개질물질로 동시에 표면개질된 양자점의 경우 고농도 혹은 고농축 양자점 분산액의 제조가 매우 용이(후술하는 중합성 단량체에 대한 양자점의 분산성 향상)하여, 낮은 점도 및 내광 특성 개선에 큰 영향을 미칠 수 있으며, 특히 무용매형 경화성 조성물 구현에 유리할 수 있다. 나아가, 상기 화학식 1 및 화학식 2로 표시되는 표면개질물질의 혼합 중량비를 제어함으로써, 내광 특성을 더욱 향상시킬 수 있다. In the case of quantum dots that are simultaneously surface-modified with the surface modification materials represented by Formula 1 and Formula 2, it is very easy to prepare a high-concentration or highly concentrated quantum dot dispersion (improved dispersibility of quantum dots with respect to polymerizable monomers, which will be described later), resulting in low viscosity and light resistance. It can have a significant impact on improving properties, and can be particularly advantageous in implementing solvent-free curable compositions. Furthermore, light resistance properties can be further improved by controlling the mixing weight ratio of the surface modification materials represented by Formula 1 and Formula 2.
예컨대, 상기 양자점 표면개질물질 총량에 대해 상기 화학식 1로 표시되는 표면개질물질은 상기 화학식 2로 표시되는 표면개질물질과 동일하거나 보다 적은 함량으로 포함될 수 있다.For example, the surface modification material represented by Formula 1 may be included in an amount equal to or smaller than the surface modification material represented by Formula 2 relative to the total amount of the quantum dot surface modification material.
예컨대, 상기 양자점 표면개질물질 총량에 대해 상기 화학식 1로 표시되는 표면개질물질과 상기 화학식 2로 표시되는 표면개질물질은 1:9 내지 5:5의 중량비, 예컨대 1:9 내지 3:7의 중량비, 예컨대 1:9 내지 2:8의 중량비로 포함될 수 있다. 상기 화학식 1로 표시되는 표면개질물질 및 상기 화학식 2로 표시되는 표면개질물질이 상기와 같은 중량비를 가질 경우, 일 구현예에 따른 경화성 조성물의 낮은 점도, 예컨대 30cPs, 예컨대 29 cPs 이하의 낮은 점도를 유지하면서, 동시에 높은 내광 특성을 가질 수 있다.For example, with respect to the total amount of the quantum dot surface modification material, the surface modification material represented by Formula 1 and the surface modification material represented by Formula 2 have a weight ratio of 1:9 to 5:5, for example, 1:9 to 3:7. , for example, may be included in a weight ratio of 1:9 to 2:8. When the surface modification material represented by Formula 1 and the surface modification material represented by Formula 2 have the above weight ratio, the curable composition according to one embodiment has a low viscosity, for example, 30 cPs, for example, 29 cPs or less. It can maintain high light resistance properties while maintaining high light resistance.
예컨대, 상기 화학식 1로 표시되는 표면개질물질은 하기 화학식 1-1 또는 화학식 1-2로 표시될 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the surface modification material represented by Formula 1 may be represented by the following Formula 1-1 or Formula 1-2, but is not necessarily limited thereto.
[화학식 1-1][Formula 1-1]
[화학식 1-2][Formula 1-2]
상기 화학식 1-1 및 화학식 1-2에서,In Formula 1-1 and Formula 1-2,
L1, L2, L5 및 L6은 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,L 1 , L 2 , L 5 and L 6 are each independently a substituted or unsubstituted C1 to C20 alkylene group,
R1은 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이고,R 1 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group,
n1 및 n2는 각각 독립적으로 0 내지 20의 정수이다.n1 and n2 are each independently integers from 0 to 20.
예컨대, 상기 화학식 1로 표시되는 표면개질물질은 하기 화학식 1A 또는 화학식 1B로 표시될 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the surface modification material represented by Formula 1 may be represented by Formula 1A or Formula 1B below, but is not necessarily limited thereto.
[화학식 1A][Formula 1A]
[화학식 1B][Formula 1B]
예컨대, 상기 화학식 2로 표시되는 표면개질물질은 하기 화학식 2A 또는 화학식 2B로 표시될 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the surface modification material represented by Formula 2 may be represented by Formula 2A or Formula 2B below, but is not necessarily limited thereto.
[화학식 2A][Formula 2A]
[화학식 2B][Formula 2B]
상기 화학식 1로 표시되는 표면개질물질 및 상기 화학식 2로 표시되는 표면개질물질로 표면개질된 양자점을 후술하는 중합성 화합물에 투입하여 교반하면, 매우 투명한 분산액을 얻을 수 있으며, 이는 양자점의 표면개질이 매우 잘 되었음을 확인하는 척도가 된다. When quantum dots surface-modified with the surface modification material represented by Formula 1 and the surface modification material represented by Formula 2 are added to a polymerizable compound described later and stirred, a very transparent dispersion can be obtained, which is achieved by surface modification of quantum dots. It serves as a measure to confirm that something was done very well.
예컨대, 상기 양자점은 500nm 내지 680nm에서 최대형광 발광파장을 가질 수 있다.For example, the quantum dots may have a maximum fluorescence emission wavelength of 500 nm to 680 nm.
예컨대, 일 구현예에 따른 경화성 조성물이 무용매형 경화성 조성물일 경우, 상기 양자점은 5 중량% 내지 60 중량%, 예컨대 10 중량% 내지 60 중량%, 예컨대 20 중량% 내지 60 중량%, 예컨대 30 중량% 내지 50 중량%로 포함될 수 있다. 상기 양자점이 상기 범위 내로 포함될 경우, 경화 후에도 높은 광유지율 및 광효율을 달성할 수 있다.For example, when the curable composition according to one embodiment is a solvent-free curable composition, the quantum dots are present in an amount of 5% by weight to 60% by weight, such as 10% by weight to 60% by weight, such as 20% by weight to 60% by weight, such as 30% by weight. It may be included in 50% by weight. When the quantum dots are included within the above range, high light retention rate and light efficiency can be achieved even after curing.
예컨대, 일 구현예에 따른 경화성 조성물이 용매를 포함하는 경화성 조성물일 경우, 상기 양자점은 상기 경화성 조성물 총량에 대해 1 중량% 내지 40 중량%, 예컨대 3 중량% 내지 30 중량% 포함될 수 있다. 상기 양자점이 상기 범위 내로 포함될 경우, 광변환율 및 패턴특성이 우수할 수 있다. For example, when the curable composition according to one embodiment is a curable composition containing a solvent, the quantum dots may be included in an amount of 1% to 40% by weight, for example, 3% to 30% by weight, based on the total amount of the curable composition. When the quantum dots are included within the above range, optical conversion rate and pattern characteristics may be excellent.
현재까지의 양자점 함유 경화성 조성물(잉크)은 양자점과의 상용성이 좋은 티올계 바인더 또는 모노머를 특화시키는 쪽으로 개발이 이루어지고 있으며, 나아가 제품화까지 이루어지고 있다.To date, curable compositions (inks) containing quantum dots have been developed to specialize in thiol-based binders or monomers with good compatibility with quantum dots, and are even being commercialized.
예컨대, 상기 양자점은 360nm 내지 780nm의 파장영역, 예컨대 400nm 내지 780nm의 파장영역의 광을 흡수하여, 500nm 내지 700nm의 파장영역, 예컨대 500nm 내지 580nm에서 형광을 방출하거나, 600nm 내지 680nm에서 형광을 방출할 수 있다. 즉, 상기 양자점은 500nm 내지 680nm에서 최대형광 발광파장(fluorescence λem)을 가질 수 있다. For example, the quantum dots absorb light in a wavelength range of 360 nm to 780 nm, for example, 400 nm to 780 nm, and emit fluorescence in a wavelength range of 500 nm to 700 nm, for example, 500 nm to 580 nm, or emit fluorescence in a wavelength range of 600 nm to 680 nm. You can. That is, the quantum dot may have a maximum fluorescence emission wavelength (fluorescence λ em ) of 500 nm to 680 nm.
상기 양자점은 각각 독립적으로 20nm 내지 100nm, 예컨대 20nm 내지 50nm의 반치폭(Full width at half maximum; FWHM)을 가질 수 있다. 상기 양자점이 상기 범위의 반치폭을 가질 경우, 색순도가 높음에 따라, 컬러필터 내 색재료로 사용 시 색재현율이 높아지는 효과가 있다.The quantum dots may each independently have a full width at half maximum (FWHM) of 20 nm to 100 nm, for example, 20 nm to 50 nm. When the quantum dot has a half width in the above range, color purity is high, which has the effect of increasing color reproduction rate when used as a color material in a color filter.
상기 양자점은 각각 독립적으로 유기물이거나 무기물 또는 유기물과 무기물의 하이브리드(혼성물)일 수 있다.The quantum dots may each independently be an organic material, an inorganic material, or a hybrid of an organic material and an inorganic material.
상기 양자점은 각각 독립적으로 코어 및 상기 코어를 감싸는 쉘로 구성될 수 있으며, 상기 코어 및 쉘은 각각 독립적으로 II-IV족, III-V족 등으로 이루어진 코어, 코어/쉘, 코어/제1쉘/제2쉘, 합금, 합금/쉘 등의 구조를 가질 수 있으며, 이에 한정되는 것은 아니다.The quantum dots may each independently consist of a core and a shell surrounding the core, and the core and shell each independently consist of a core made of group II-IV, group III-V, etc., core/shell, core/first shell/ It may have a structure such as a second shell, an alloy, or an alloy/shell, but is not limited thereto.
예컨대, 상기 코어는 CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs 및 이들의 합금으로 이루어진 군으로부터 선택된 적어도 하나 이상의 물질을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다. 상기 코어를 둘러싼 쉘은 CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe 및 이들의 합금으로 이루어진 군으로부터 선택된 적어도 하나 이상의 물질을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다. For example, the core may include at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs, and alloys thereof. , but is not necessarily limited to this. The shell surrounding the core may include at least one material selected from the group consisting of CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe, and alloys thereof, but is not necessarily limited thereto.
일 구현예에서는, 최근 전 세계적으로 환경에 대한 관심이 크게 증가하고 유독성 물질에 대한 규제가 강화되고 있으므로, 카드뮴계 코어를 갖는 발광물질을 대신하여, 양자 효율(quantum yield)은 다소 낮지만 친환경적인 비카드뮴계 발광소재(InP/ZnS, InP/ZeSe/ZnS 등)를 사용하였으나, 반드시 이에 한정되는 것은 아니다.In one embodiment, as interest in the environment has recently greatly increased worldwide and regulations on toxic substances have been strengthened, a light-emitting material with a cadmium-based core may be used instead of a light-emitting material, which has a somewhat low quantum yield but is environmentally friendly. Non-cadmium-based light emitting materials (InP/ZnS, InP/ZeSe/ZnS, etc.) were used, but are not necessarily limited thereto.
상기 코어/쉘 구조의 양자점의 경우, 쉘을 포함한 전체 양자점 각각의 크기(평균 입경)는 1nm 내지 15nm, 예컨대 5nm 내지 15nm 일 수 있다. In the case of the quantum dots of the core/shell structure, the size (average particle diameter) of each quantum dot including the shell may be 1 nm to 15 nm, for example, 5 nm to 15 nm.
예컨대, 상기 양자점은 각각 독립적으로 적색 양자점, 녹색 양자점 또는 이들의 조합을 포함할 수 있다. 상기 적색 양자점은 각각 독립적으로 10nm 내지 15nm의 평균 입경을 가질 수 있다. 상기 녹색 양자점은 각각 독립적으로 5nm 내지 8nm의 평균 입경을 가질 수 있다.For example, the quantum dots may each independently include red quantum dots, green quantum dots, or a combination thereof. The red quantum dots may each independently have an average particle diameter of 10 nm to 15 nm. The green quantum dots may each independently have an average particle diameter of 5 nm to 8 nm.
한편, 상기 양자점의 분산안정성을 위해, 일 구현예에 따른 경화성 조성물은 분산제를 더 포함할 수도 있다. 상기 분산제는 양자점과 같은 광변환 물질이 경화성 조성물 내에서 균일하게 분산되도록 도와주며, 비이온성, 음이온성 또는 양이온성 분산제 모두를 사용할 수 있다. 구체적으로는 폴리알킬렌 글리콜 또는 이의 에스테르류, 폴리옥시 알킬렌, 다가 알코올 에스테르 알킬렌 옥사이드 부가물, 알코올 알킬렌 옥사이드 부가물, 술폰산 에스테르, 술폰산 염, 카르복시산 에스테르, 카르복시산 염, 알킬 아미드 알킬렌 옥사이드 부가물, 알킬 아민 등을 사용할 수 있으며, 이들은 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다. 상기 분산제는 양자점과 같은 광변환 물질의 고형분 대비 0.1 중량% 내지 100 중량%, 예컨대 10 중량% 내지 20 중량%로 사용될 수 있다.Meanwhile, for the dispersion stability of the quantum dots, the curable composition according to one embodiment may further include a dispersant. The dispersant helps the light conversion material such as quantum dots to be uniformly dispersed within the curable composition, and nonionic, anionic, or cationic dispersants can all be used. Specifically, polyalkylene glycol or its esters, polyoxy alkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonic acid salt, carboxylic acid ester, carboxylic acid salt, alkyl amide alkylene oxide. Adducts, alkyl amines, etc. can be used, and these can be used alone or in a mixture of two or more types. The dispersant may be used in an amount of 0.1% to 100% by weight, for example, 10% to 20% by weight, based on the solid content of the light conversion material such as quantum dots.
중합성 화합물polymerizable compound
일 구현예에 따른 경화성 조성물은 중합성 화합물을 포함하며, 상기 중합성 화합물은 말단에 탄소-탄소 이중결합을 가질 수 있다.The curable composition according to one embodiment includes a polymerizable compound, and the polymerizable compound may have a carbon-carbon double bond at the terminal.
상기 말단에 탄소-탄소 이중결합을 갖는 중합성 화합물은 상기 무용매형 경화성 조성물 총량에 대하여 40 중량% 내지 95 중량%, 예컨대 50 중량% 내지 90 중량%로 포함될 수 있다. 상기 말단에 탄소-탄소 이중결합을 갖는 중합성 화합물의 함량이 상기 범위 내이어야 잉크 젯팅이 가능한 점도를 가지는 무용매형 경화성 조성물의 제조가 가능하며, 또한 제조된 무용매형 경화성 조성물 내 양자점이 우수한 분산성을 가질 수 있어, 광특성 또한 향상될 수 있다. The polymerizable compound having a carbon-carbon double bond at the terminal may be included in an amount of 40% by weight to 95% by weight, for example, 50% by weight to 90% by weight, based on the total amount of the solvent-free curable composition. When the content of the polymerizable compound having a carbon-carbon double bond at the terminal is within the above range, it is possible to manufacture a solvent-free curable composition having a viscosity capable of ink jetting. In addition, the quantum dots in the prepared solvent-free curable composition have excellent dispersibility. , optical characteristics can also be improved.
예컨대, 상기 말단에 탄소-탄소 이중결합을 갖는 중합성 화합물은 170 g/mol 내지 1,000 g/mol의 분자량을 가질 수 있다. 상기 말단에 탄소-탄소 이중결합을 갖는 중합성 화합물의 분자량이 상기 범위일 경우 양자점의 광특성을 저해하지 않으면서 조성물의 점도를 높이지 않아 잉크-젯팅에 유리할 수 있다.For example, the polymerizable compound having a carbon-carbon double bond at the terminal may have a molecular weight of 170 g/mol to 1,000 g/mol. When the molecular weight of the polymerizable compound having a carbon-carbon double bond at the terminal is within the above range, it can be advantageous for ink-jetting because it does not impair the optical properties of the quantum dots and does not increase the viscosity of the composition.
예컨대, 상기 말단에 탄소-탄소 이중결합을 갖는 중합성 화합물은 하기 화학식 6으로 표시될 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the polymerizable compound having a carbon-carbon double bond at the terminal may be represented by the following formula (6), but is not necessarily limited thereto.
[화학식 6][Formula 6]
상기 화학식 6에서,In Formula 6 above,
R6 및 R7은 각각 독립적으로 수소 원자 또는 치환 또는 비치환된 C1 내지 C10 알킬기이고,R 6 and R 7 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group,
L7 및 L9는 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C10 알킬렌기이고,L 7 and L 9 are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group,
L8은 치환 또는 비치환된 C1 내지 C10 알킬렌기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬렌기 또는 에테르기(*-O-*)이다.L 8 is a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, or an ether group (*-O-*).
예컨대, 상기 말단에 탄소-탄소 이중결합을 가지는 중합성 화합물은 하기 화학식 6-1 또는 6-2로 표시될 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the polymerizable compound having a carbon-carbon double bond at the terminal may be represented by the following formula 6-1 or 6-2, but is not necessarily limited thereto.
[화학식 6-1][Formula 6-1]
[화학식 6-2][Formula 6-2]
예컨대, 상기 말단에 탄소-탄소 이중결합을 갖는 중합성 화합물은 상기 화학식 6-1 또는 화학식 6-2로 표시되는 화합물 외에도, 에틸렌글리콜디아크릴레이트, 트리에틸렌글리콜디아크릴레이트, 1,4-부탄디올디아크릴레이트, 1,6-헥산디올디아크릴레이트, 네오펜틸글리콜디아크릴레이트, 펜타에리트리톨디아크릴레이트, 펜타에리트리톨트리아크릴레이트, 디펜타에리트리톨디아크릴레이트, 디펜타에리트리톨트리아크릴레이트, 디펜타에리트리톨펜타아크릴레이트, 디펜타에리트리톨헥사아크릴레이트, 펜타에리트리톨헥사아크릴레이트, 비스페놀 A 디아크릴레이트, 트리메틸올프로판트리아크릴레이트, 노볼락에폭시아크릴레이트, 에틸렌글리콜디메타크릴레이트, 트리에틸렌글리콜디메타크릴레이트, 프로필렌글리콜디메타크릴레이트, 1,4-부탄디올디메타크릴레이트, 1,6-헥산디올디메타크릴레이트 또는 이들의 조합을 더 포함할 수 있다.For example, polymerizable compounds having a carbon-carbon double bond at the terminal include, in addition to the compounds represented by Formula 6-1 or Formula 6-2, ethylene glycol diacrylate, triethylene glycol diacrylate, and 1,4-butanediol. Diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate , dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, novolac epoxy acrylate, ethylene glycol dimethacrylate, It may further include triethylene glycol dimethacrylate, propylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, or a combination thereof.
또한, 상기 말단에 탄소-탄소 이중결합을 가지는 중합성 화합물과 더불어 종래의 열경화성 또는 광경화성 조성물에 일반적으로 사용되는 단량체를 더 포함할 수 있으며, 예컨대 상기 단량체는 비스[1-에틸(3-옥세타닐)]메틸 에테르 등의 옥세탄계 화합물 등을 더 포함할 수 있다.In addition, in addition to the polymerizable compound having a carbon-carbon double bond at the terminal, it may further include a monomer commonly used in conventional thermosetting or photocuring compositions. For example, the monomer may be bis[1-ethyl(3-ox). [cetanyl)] It may further include oxetane-based compounds such as methyl ether.
또한, 상기 경화성 조성물이 용매를 포함하는 경우, 상기 중합성 화합물은 상기 경화성 조성물 총량에 대해 1 중량% 내지 20 중량%, 1 중량% 내지 15 중량%, 예컨대 5 중량% 내지 15 중량%로 포함될 수 있다. 상기 중합성 화합물이 상기 범위 내로 포함될 경우 상기 양자점의 광특성 향상을 꾀할 수 있다.In addition, when the curable composition includes a solvent, the polymerizable compound may be included in an amount of 1% to 20% by weight, 1% to 15% by weight, such as 5% to 15% by weight, based on the total amount of the curable composition. there is. When the polymerizable compound is included within the above range, the optical properties of the quantum dots can be improved.
광확산제light diffuser
일 구현예에 따른 경화성 조성물은 광확산제를 더 포함할 수 있다.The curable composition according to one embodiment may further include a light diffuser.
예컨대, 상기 광확산제는 황산바륨(BaSO4), 탄산칼슘(CaCO3), 이산화티타늄(TiO2), 지르코니아(ZrO2) 또는 이들의 조합을 포함할 수 있다.For example, the light diffuser may include barium sulfate (BaSO 4 ), calcium carbonate (CaCO 3 ), titanium dioxide (TiO 2 ), zirconia (ZrO 2 ), or a combination thereof.
상기 광확산제는 전술한 양자점에 흡수되지 않은 광을 반사시키고, 상기 반사된 광을 양자점이 다시 흡수할 수 있도록 한다. 즉, 상기 광확산제는 양자점에 흡수되는 광의 양을 증가시켜, 경화성 조성물의 광변환 효율을 증가시킬 수 있다.The light diffuser reflects light that is not absorbed by the quantum dots and allows the quantum dots to reabsorb the reflected light. That is, the light diffuser can increase the amount of light absorbed by the quantum dots, thereby increasing the light conversion efficiency of the curable composition.
상기 광확산제는 평균 입경(D50)이 150nm 내지 250nm 일 수 있으며, 구체적으로는 180nm 내지 230nm일 수 있다. 상기 광확산제의 평균 입경이 상기 범위 내일 경우, 보다 우수한 광확산 효과를 가질 수 있으며, 광변환 효율을 증가시킬 수 있다.The light diffuser may have an average particle diameter (D 50 ) of 150 nm to 250 nm, specifically 180 nm to 230 nm. When the average particle diameter of the light diffuser is within the above range, a better light diffusion effect can be achieved and light conversion efficiency can be increased.
상기 광확산제는 상기 경화성 조성물 총량에 대해 1 중량% 내지 20 중량%, 예컨대 2 중량% 내지 15 중량%, 예컨대 3 중량% 내지 10 중량%,로 포함될 수 있다. 상기 광확산제가 상기 경화성 조성물 총량에 대해 1 중량% 미만으로 포함될 경우, 광확산제를 사용함에 따른 광변환 효율 향상 효과를 기대하기가 어렵고, 20 중량%를 초과하여 포함할 경우에는 양자점 침강 문제가 발생될 우려가 있다. The light diffuser may be included in an amount of 1% to 20% by weight, such as 2% to 15% by weight, such as 3% to 10% by weight, based on the total amount of the curable composition. If the light diffuser is included in less than 1% by weight based on the total amount of the curable composition, it is difficult to expect an effect of improving light conversion efficiency due to the use of the light diffuser, and if it is included in more than 20% by weight, there is a problem of quantum dot precipitation. There is a risk that this may occur.
중합개시제polymerization initiator
일 구현예에 따른 경화성 조성물은 중합개시제를 더 포함할 수 있으며, 예컨대, 광중합 개시제, 열중합 개시제 또는 이들의 조합을 포함할 수 있다. The curable composition according to one embodiment may further include a polymerization initiator, for example, a photopolymerization initiator, a thermal polymerization initiator, or a combination thereof.
상기 광중합 개시제는 감광성 수지 조성물에 일반적으로 사용되는 개시제로서, 예를 들어 아세토페논계 화합물, 벤조페논계 화합물, 티오크산톤계 화합물, 벤조인계 화합물, 트리아진계 화합물, 옥심계 화합물, 아미노케톤계 화합물 등을 사용할 수 있으나, 반드시 이에 한정되는 것은 아니다.The photopolymerization initiator is an initiator commonly used in photosensitive resin compositions, for example, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, oxime-based compounds, and aminoketone-based compounds. etc. may be used, but are not necessarily limited thereto.
상기 아세토페논계의 화합물의 예로는, 2,2'-디에톡시 아세토페논, 2,2'-디부톡시 아세토페논, 2-히드록시-2-메틸프로피오페논, p-t-부틸트리클로로 아세토페논, p-t-부틸디클로로 아세토페논, 4-클로로 아세토페논, 2,2'-디클로로-4-페녹시 아세토페논, 2-메틸-1-(4-(메틸티오)페닐)-2-모폴리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모폴리노페닐)-부탄-1-온 등을 들 수 있다.Examples of the acetophenone-based compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloro acetophenone, p-t-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropane- 1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.
상기 벤조페논계 화합물의 예로는, 벤조페논, 벤조일 안식향산, 벤조일 안식향산 메틸, 4-페닐 벤조페논, 히드록시벤조페논, 아크릴화 벤조페논, 4,4'-비스(디메틸 아미노)벤조페논, 4,4'-비스(디에틸아미노)벤조페논, 4,4'-디메틸아미노벤조페논, 4,4'-디클로로벤조페논, 3,3'-디메틸-2-메톡시벤조페논등을 들 수 있다.Examples of the benzophenone-based compounds include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4 Examples include '-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.
상기 티오크산톤계 화합물의 예로는, 티오크산톤, 2-메틸티오크산톤, 이소프로필 티오크산톤, 2,4-디에틸 티오크산톤, 2,4-디이소프로필 티오크산톤, 2-클로로티오크산톤 등을 들 수 있다.Examples of the thioxanthone-based compounds include thioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2- Chlorothioxanthone, etc. can be mentioned.
상기 벤조인계 화합물의 예로는, 벤조인, 벤조인 메틸 에테르, 벤조인 에틸 에테르, 벤조인 이소프로필 에테르, 벤조인 이소부틸 에테르, 벤질디메틸케탈 등을 들 수 있다.Examples of the benzoin-based compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyldimethyl ketal.
상기 트리아진계 화합물의 예로는, 2,4,6-트리클로로-s-트리아진, 2-페닐-4,6-비스(트리클로로메틸)-s-트리아진, 2-(3',4'-디메톡시스티릴)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(4'-메톡시나프틸)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(p-메톡시페닐)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(p-톨릴)-4,6-비스(트리클로로 메틸)-s-트리아진, 2-비페닐-4,6-비스(트리클로로 메틸)-s-트리아진, 비스(트리클로로메틸)-6-스티릴-s-트리아진, 2-(나프토-1-일)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(4-메톡시나프토-1-일)-4,6-비스(트리클로로메틸)-s-트리아진, 2-4-비스(트리클로로메틸)-6-피페로닐-s-트리아진, 2-4-비스(트리클로로메틸)-6-(4-메톡시스티릴)-s-트리아진 등을 들 수 있다.Examples of the triazine-based compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4' -Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine , 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine , 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl)- 4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4 -bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, etc. .
상기 옥심계 화합물의 예로는 O-아실옥심계 화합물, 2-(O-벤조일옥심)-1-[4-(페닐티오)페닐]-1,2-옥탄디온, 1-(O-아세틸옥심)-1-[9-에틸-6-(2-메틸벤조일)-9H-카르바졸-3-일]에탄온, O-에톡시카르보닐-α-옥시아미노-1-페닐프로판-1-온 등을 사용할 수 있다. 상기 O-아실옥심계 화합물의 구체적인 예로는, 1,2-옥탄디온, 2-디메틸아미노-2-(4-메틸벤질)-1-(4-모르폴린-4-일-페닐)-부탄-1-온, 1-(4-페닐술파닐페닐)-부탄-1,2-디온-2-옥심-O-벤조에이트, 1-(4-페닐술파닐페닐)-옥탄-1,2-디온-2-옥심-O-벤조에이트, 1-(4-페닐술파닐페닐)-옥탄-1-온옥심-O-아세테이트 및 1-(4-페닐술파닐페닐)-부탄-1-온옥심-O-아세테이트 등을 들 수 있다. Examples of the oxime-based compounds include O-acyloxime-based compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime) -1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, etc. can be used. Specific examples of the O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butane- 1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione -2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-oneoxime-O-acetate and 1-(4-phenylsulfanylphenyl)-butane-1-oneoxime- O-acetate, etc. can be mentioned.
상기 아미노케톤계 화합물의 예로는 2-벤질-2-디메틸아미노-1-(4-모폴리노페닐)-부탄온-1 (2-Benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1) 등을 들 수 있다.Examples of the aminoketone-based compound include 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone -1), etc.
상기 광중합 개시제는 상기 화합물 이외에도 카바졸계 화합물, 디케톤류 화합물, 술포늄 보레이트계 화합물, 디아조계 화합물, 이미다졸계 화합물, 비이미다졸계 화합물 등을 사용할 수 있다.In addition to the above compounds, the photopolymerization initiator may include carbazole-based compounds, diketone-based compounds, sulfonium borate-based compounds, diazo-based compounds, imidazole-based compounds, and biimidazole-based compounds.
상기 광중합 개시제는 빛을 흡수하여 들뜬 상태가 된 후 그 에너지를 전달함으로써 화학반응을 일으키는 광 증감제와 함께 사용될 수도 있다.The photopolymerization initiator may be used together with a photosensitizer that absorbs light, becomes excited, and then transmits the energy to cause a chemical reaction.
상기 광 증감제의 예로는, 테트라에틸렌글리콜 비스-3-머캡토 프로피오네이트, 펜타에리트리톨 테트라키스-3-머캡토 프로피오네이트, 디펜타에리트리톨 테트라키스-3-머캡토 프로피오네이트 등을 들 수 있다. Examples of the photosensitizer include tetraethylene glycol bis-3-mercapto propionate, pentaerythritol tetrakis-3-mercapto propionate, dipentaerythritol tetrakis-3-mercapto propionate, etc. can be mentioned.
상기 열중합 개시제의 예로는, 퍼옥사이드, 구체적으로 벤조일 퍼옥사이드, 다이벤조일 퍼옥사이드, 라우릴 퍼옥사이드, 다이라우릴 퍼옥사이드, 다이-tert-부틸 퍼옥사이드, 사이클로헥산 퍼옥사이드, 메틸 에틸 케톤 퍼옥사이드, 하이드로퍼옥사이드(예컨대, tert-부틸 하이드로퍼옥사이드, 쿠멘 하이드로퍼옥사이드), 다이사이클로헥실 퍼옥시다이카르보네이트, 2,2-아조-비스(아이소부티로니트릴), t-부틸 퍼벤조에이트 등을 들 수 있고, 2,2'-아조비스-2-메틸프로피오니트릴 등을 들 수도 있으나, 반드시 이에 한정되는 것은 아니고, 당업계에 널리 알려진 것이면 어느 것이든 사용할 수 있다.Examples of the thermal polymerization initiator include peroxides, specifically benzoyl peroxide, dibenzoyl peroxide, lauryl peroxide, dilauryl peroxide, di-tert-butyl peroxide, cyclohexane peroxide, and methyl ethyl ketone peroxide. Oxides, hydroperoxides (e.g., tert-butyl hydroperoxide, cumene hydroperoxide), dicyclohexyl peroxydicarbonate, 2,2-azo-bis(isobutyronitrile), t-butyl perbenzo ate, etc., and 2,2'-azobis-2-methylpropionitrile, etc., but are not necessarily limited thereto, and any one widely known in the art can be used.
상기 중합 개시제는 상기 경화성 조성물 총량에 대해 0.1 중량% 내지 5 중량%, 예컨대 1 중량% 내지 4 중량%로 포함될 수 있다. 중합 개시제가 상기 범위 내로 포함될 경우, 노광 또는 열경화 시 경화가 충분히 일어나 우수한 신뢰성을 얻을 수 있으며, 미반응 개시제로 인한 투과율의 저하를 막아 양자점의 광특성 저하를 방지할 수 있다. The polymerization initiator may be included in an amount of 0.1% to 5% by weight, for example, 1% to 4% by weight, based on the total amount of the curable composition. When the polymerization initiator is included within the above range, curing occurs sufficiently during exposure or heat curing to obtain excellent reliability, and a decrease in transmittance due to unreacted initiator can be prevented, thereby preventing a decrease in the optical properties of the quantum dots.
바인더 수지binder resin
일 구현예에 따른 경화성 조성물은 바인더 수지를 더 포함할 수 있다.The curable composition according to one embodiment may further include a binder resin.
상기 바인더 수지는 아크릴계 수지, 카도계 수지, 에폭시 수지 또는 이들의 조합을 포함할 수 있다.The binder resin may include an acrylic resin, a cardo-based resin, an epoxy resin, or a combination thereof.
상기 아크릴계 수지는 제1 에틸렌성 불포화 단량체 및 이와 공중합 가능한 제2 에틸렌성 불포화 단량체의 공중합체로, 하나 이상의 아크릴계 반복단위를 포함하는 수지일 수 있다.The acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and may be a resin containing one or more acrylic repeating units.
상기 아크릴계 바인더 수지의 구체적인 예로는 폴리벤질메타크릴레이트, (메타)아크릴산/벤질메타크릴레이트 공중합체, (메타)아크릴산/벤질메타크릴레이트/스티렌 공중합체, (메타)아크릴산/벤질메타크릴레이트/2-히드록시에틸메타크릴레이트 공중합체, (메타)아크릴산/벤질메타크릴레이트/스티렌/2-히드록시에틸메타크릴레이트 공중합체 등을 들 수 있으나, 이에 한정되는 것은 아니며, 이들을 단독 또는 2종 이상을 배합하여 사용할 수도 있다.Specific examples of the acrylic binder resin include polybenzyl methacrylate, (meth)acrylic acid/benzyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene copolymer, (meth)acrylic acid/benzyl methacrylate/ Examples include, but are not limited to, 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymer, and these can be used alone or in combination of two types. The above can also be used in combination.
상기 아크릴계 수지의 중량평균 분자량은 5,000 g/mol 내지 15,000g/mol 일 수 있다. 상기 아크릴계 수지의 중량평균 분자량이 상기 범위 내일 경우, 기판과의 밀착성이 우수하고 물리적, 화학적 물성이 좋으며, 점도가 적절하다.The weight average molecular weight of the acrylic resin may be 5,000 g/mol to 15,000 g/mol. When the weight average molecular weight of the acrylic resin is within the above range, it has excellent adhesion to the substrate, good physical and chemical properties, and appropriate viscosity.
상기 아크릴계 수지의 산가는 80 mgKOH/g 내지 130 mgKOH/g 일 수 있다. 상기 아크릴계 수지의 산가가 상기 범위 내일 경우 픽셀 패턴의 해상도가 우수하다.The acid value of the acrylic resin may be 80 mgKOH/g to 130 mgKOH/g. When the acid value of the acrylic resin is within the above range, the resolution of the pixel pattern is excellent.
상기 카도계 수지는 통상적인 경화성 수지(또는 감광성 수지)조성물에 사용되는 것을 사용할 수 있으며, 예컨대 한국 공개특허 10-2018-0067243호에 제시된 것을 사용할 수 있으나, 이에 한정되지 않는다. The cardo-based resin can be used in a typical curable resin (or photosensitive resin) composition, for example, the one shown in Korean Patent Publication No. 10-2018-0067243 can be used, but is not limited thereto.
상기 카도계 수지는 예컨대, 9,9-비스(4-옥시라닐메톡시페닐)플루오렌 등의 플루오렌 함유 화합물; 벤젠테트라카르복실산 디무수물, 나프탈렌테트라카르복실산 디무수물, 비페닐테트라카르복실산 디무수물, 벤조페논테트라카르복실산 디무수물, 피로멜리틱 디무수물, 사이클로부탄테트라카르복실산 디무수물, 페릴렌테트라카르복실산 디무수물, 테트라히드로푸란테트라카르복실산 디무수물, 테트라하이드로프탈산 무수물 등의 무수물 화합물; 에틸렌글리콜, 프로필렌글리콜, 폴리에틸렌글리콜 등의 글리콜 화합물; 메탄올, 에탄올, 프로판올, n-부탄올, 사이클로헥산올, 벤질알코올 등의 알코올 화합물; 프로필렌글리콜 메틸에틸아세테이트, N-메틸피롤리돈 등의 용매류 화합물; 트리페닐포스핀 등의 인 화합물; 및 테트라메틸암모늄 클로라이드, 테트라에틸암모늄 브로마이드, 벤질디에틸아민, 트리에틸아민, 트리부틸아민, 벤질트리에틸암모늄 클로라이드 등의 아민 또는 암모늄염 화합물 중에서 둘 이상을 혼합하여 제조할 수 있다.The cardo-based resin includes, for example, fluorene-containing compounds such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; Benzene tetracarboxylic acid dianhydride, naphthalene tetracarboxylic acid dianhydride, biphenyl tetracarboxylic acid dianhydride, benzophenone tetracarboxylic acid dianhydride, pyromellitic dianhydride, cyclobutane tetracarboxylic acid dianhydride, Anhydride compounds such as rylene tetracarboxylic acid dianhydride, tetrahydrofuran tetracarboxylic acid dianhydride, and tetrahydrophthalic acid anhydride; Glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; Alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol methyl ethyl acetate and N-methylpyrrolidone; Phosphorus compounds such as triphenylphosphine; and amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, and benzyltriethylammonium chloride.
상기 카도계 수지의 중량평균 분자량은 500 g/mol 내지 50,000 g/mol, 예컨대 1,000 g/mol 내지 30,000 g/mol 일 수 있다. 상기 카도계 수지의 중량평균 분자량이 상기 범위 내일 경우 경화막 제조 시 잔사 없이 패턴 형성이 잘되며, 경화성 조성물의 현상 시 막두께의 손실이 없고, 양호한 패턴을 얻을 수 있다.The weight average molecular weight of the cardo-based resin may be 500 g/mol to 50,000 g/mol, for example, 1,000 g/mol to 30,000 g/mol. If the weight average molecular weight of the cardo-based resin is within the above range, a pattern can be easily formed without residue when producing a cured film, there is no loss of film thickness when developing the curable composition, and a good pattern can be obtained.
상기 바인더 수지가 카도계 수지일 경우, 이를 포함하는 경화성 조성물, 특히 감광성 수지 조성물의 현상성이 우수하고, 광경화 시 감도가 좋아 미세 패턴 형성성이 우수하다.When the binder resin is a cardo-based resin, the curable composition containing it, especially the photosensitive resin composition, has excellent developability, has good sensitivity during photocuring, and has excellent fine pattern formation.
상기 에폭시 수지는 열에 의해서 중합될 수 있는 모노머(monomer) 또는 올리고머(oligomer)로서, 탄소-탄소 불포화 결합 및 탄소-탄소 고리형 결합을 가지는 화합물 등을 포함할 수 있다.The epoxy resin is a monomer or oligomer that can be polymerized by heat, and may include compounds having a carbon-carbon unsaturated bond and a carbon-carbon cyclic bond.
상기 에폭시 수지로는 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 페놀 노볼락형 에폭시 수지, 고리형 지방족 에폭시 수지 및 지방족 폴리글리시딜 에테르 등을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다.The epoxy resin may include, but is not limited to, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, phenol novolac-type epoxy resin, cyclic aliphatic epoxy resin, and aliphatic polyglycidyl ether.
이러한 화합물의 시판품으로, 비스페닐 에폭시 수지에는 유까쉘 에폭시(주)社의 YX4000, YX4000H, YL6121H, YL6640, YL6677; 크레졸 노볼락형 에폭시 수지에는 크레졸 노블락형 에폭시 수지에는 닛본 가야꾸(주)社의 EOCN-102, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, EOCN-1027 및 유까쉘 에폭시(주)社의 에피코트 180S75; 비스페놀 A형 에폭시 수지에는 유까쉘 에폭시(주)社의 에피코트 1001, 1002, 1003, 1004, 1007, 1009, 1010 및 828; 비스페놀 F형 에폭시 수지에는 유까쉘 에폭시(주)社의 에피코트 807 및 834; 페놀 노블락형 에폭시 수지에는 유까쉘 에폭시(주)社의 에피코트 152, 154, 157H65 및 닛본 가야꾸(주)社의 EPPN 201, 202; 그 밖의 고리형 지방족 에폭시 수지에는 CIBA-GEIGY A.G 社의 CY175, CY177 및 CY179, U.C.C 社의 ERL-4234, ERL-4299, ERL-4221 및 ERL-4206, 쇼와 덴꼬(주)社의 쇼다인 509, CIBA-GEIGY A.G 社의 아랄다이트 CY-182, CY-192 및 CY-184, 다이닛본 잉크 고교(주)社의 에피크론 200 및 400, 유까쉘 에폭시(주)社의 에피코트 871, 872 및 EP1032H60, 셀라니즈 코팅(주)社의 ED-5661 및 ED-5662; 지방족 폴리글리시딜에테르에는 유까쉘 에폭시(주)社의 에피코트 190P 및 191P, 교에샤 유시 가가꾸 고교(주)社의 에포라이트 100MF, 닛본 유시(주)社의 에피올 TMP 등을 들 수 있다.As commercial products of these compounds, bisphenyl epoxy resins include YX4000, YX4000H, YL6121H, YL6640, and YL6677 from Yukashell Epoxy Co., Ltd.; Cresol novolak-type epoxy resins include EOCN-102, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, EOCN-1027 from Nippon Kayaku Co., Ltd. and Yukashell Epoxy Co., Ltd. )'s Epicoat 180S75; Bisphenol A type epoxy resins include Epicoat 1001, 1002, 1003, 1004, 1007, 1009, 1010, and 828 from Yukashell Epoxy Co., Ltd.; Bisphenol F-type epoxy resins include Epicoat 807 and 834 from Yukashell Epoxy Co., Ltd.; Phenolic noblock-type epoxy resins include Epicoat 152, 154, and 157H65 from Yukashell Epoxy Co., Ltd. and EPPN 201 and 202 from Nippon Kayaku Co., Ltd.; Other cyclic aliphatic epoxy resins include CY175, CY177 and CY179 from CIBA-GEIGY A.G., ERL-4234, ERL-4299, ERL-4221 and ERL-4206 from U.C.C., and Shodine 509 from Showa Denko Co., Ltd. , Araldite CY-182, CY-192 and CY-184 from CIBA-GEIGY A.G., Epicron 200 and 400 from Dainipbon Ink Kogyo Co., Ltd., and Epicot 871 and 872 from Yukashell Epoxy Co., Ltd. and EP1032H60, ED-5661 and ED-5662 from Celanese Coatings Co., Ltd.; Aliphatic polyglycidyl ethers include Epicoat 190P and 191P from Yukashell Epoxy Co., Ltd., Eporite 100MF from Kyoesha Yushi Chemical Co., Ltd., and Epiol TMP from Nippon Yushi Co., Ltd. You can.
예컨대, 일 구현예에 따른 경화성 조성물이 무용매형 경화성 조성물일 경우, 상기 바인더 수지는 경화성 조성물 총량에 대하여 0.5 중량% 내지 10 중량%, 예컨대 1 중량% 내지 5 중량%로 포함될 수 있다. 이 경우, 상기 무용매형 경화성 조성물의 내열성 및 내화학성을 향상시킬 수 있으며, 조성물의 저장 안정성 또한 개선시킬 수 있다. For example, when the curable composition according to one embodiment is a solvent-free curable composition, the binder resin may be included in an amount of 0.5% by weight to 10% by weight, for example, 1% by weight to 5% by weight, based on the total amount of the curable composition. In this case, the heat resistance and chemical resistance of the solvent-free curable composition can be improved, and the storage stability of the composition can also be improved.
예컨대, 일 구현예에 따른 경화성 조성물이 용매를 포함하는 경화성 조성물일 경우, 상기 바인더 수지는 경화성 조성물 총량에 대하여 1 중량% 내지 30 중량%, 예컨대 3 중량% 내지 20 중량%로 포함될 수 있다. 이 경우, 우수하며 패턴특성과 내열성 및 내화학성을 향상시킬 수 있다.For example, when the curable composition according to one embodiment is a curable composition containing a solvent, the binder resin may be included in an amount of 1% to 30% by weight, for example, 3% to 20% by weight, based on the total amount of the curable composition. In this case, it is excellent and can improve pattern characteristics, heat resistance, and chemical resistance.
기타 첨가제Other additives
상기 양자점의 안정성 및 분산성 향상을 위해, 일 구현예에 따른 경화성 조성물은 중합금지제를 더 포함할 수 있다.To improve the stability and dispersibility of the quantum dots, the curable composition according to one embodiment may further include a polymerization inhibitor.
상기 중합 금지제는 하이드로퀴논계 화합물, 카테콜계 화합물 또는 이들의 조합을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다. 일 구현예에 따른 경화성 조성물이 상기 하이드로퀴논계 화합물, 카테콜계 화합물 또는 이들의 조합을 더 포함함에 따라, 경화성 조성물을 인쇄(코팅) 후, 노광하는 동안 상온 가교를 방지할 수 있다.The polymerization inhibitor may include a hydroquinone-based compound, a catechol-based compound, or a combination thereof, but is not necessarily limited thereto. As the curable composition according to one embodiment further includes the hydroquinone-based compound, the catechol-based compound, or a combination thereof, room temperature crosslinking can be prevented during exposure to light after printing (coating) the curable composition.
예컨대, 상기 하이드로퀴논계 화합물, 카테콜계 화합물 또는 이들의 조합은 하이드로퀴논, 메틸 하이드로퀴논, 메톡시하이드로퀴논, t-부틸 하이드로퀴논, 2,5-디-t-부틸 하이드로퀴논, 2,5-비스(1,1-디메틸부틸) 하이드로퀴논, 2,5-비스(1,1,3,3-테트라메틸부틸) 하이드로퀴논, 카테콜, t-부틸 카테콜, 4-메톡시페놀, 피로가롤, 2,6-디-t-부틸-4-메틸페놀, 2-나프톨, 트리스(N-하이드록시-N-니트로소페닐아미나토-O,O')알루미늄(Tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminium) 또는 이들의 조합을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the hydroquinone-based compound, catechol-based compound, or combinations thereof include hydroquinone, methyl hydroquinone, methoxyhydroquinone, t-butyl hydroquinone, 2,5-di- t -butyl hydroquinone, 2,5- Bis(1,1-dimethylbutyl) hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl) hydroquinone, catechol, t-butyl catechol, 4-methoxyphenol, pyroga Roll, 2,6-di- t -butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylaminato-O,O') aluminum (Tris(N-hydroxy-N -nitrosophenylamineto-O,O')aluminium) or a combination thereof, but is not necessarily limited thereto.
상기 하이드로퀴논계 화합물, 카테콜계 화합물 또는 이들의 조합은 분산액의 형태로 사용될 수 있으며, 상기 분산액 형태의 중합 금지제는 경화성 조성물 총량에 대하여 0.001 중량% 내지 3 중량%, 예컨대 0.01 중량% 내지 2 중량%로 포함될 수 있다. 상기 중합 금지제가 상기 범위 내로 포함될 경우, 상온 경시 문제를 해결함과 동시에, 감도 저하 및 표면 박리 현상을 방지할 수 있다.The hydroquinone-based compound, catechol-based compound, or a combination thereof may be used in the form of a dispersion, and the polymerization inhibitor in the form of the dispersion is 0.001% by weight to 3% by weight, for example, 0.01% by weight to 2% by weight, based on the total amount of the curable composition. It can be included as a percentage. When the polymerization inhibitor is included within the above range, it is possible to solve the problem of aging at room temperature and prevent deterioration of sensitivity and surface peeling.
또한, 일 구현예에 따른 경화성 조성물은 내열성 및 신뢰성 향상을 위해, 말론산; 3-아미노-1,2-프로판디올; 실란계 커플링제; 레벨링제; 불소계 계면활성제; 또는 이들의 조합을 더 포함할 수 있다.In addition, the curable composition according to one embodiment includes malonic acid to improve heat resistance and reliability; 3-amino-1,2-propanediol; Silane-based coupling agent; leveling agent; Fluorine-based surfactant; Or it may further include a combination thereof.
예컨대, 일 구현예에 따른 경화성 조성물은 기판과의 밀착성 등을 개선하기 위해 비닐기, 카르복실기, 메타크릴옥시기, 이소시아네이트기, 에폭시기 등의 반응성 치환기를 갖는 실란계 커플링제를 더 포함할 수 있다.For example, the curable composition according to one embodiment may further include a silane-based coupling agent having a reactive substituent such as a vinyl group, carboxyl group, methacryloxy group, isocyanate group, or epoxy group to improve adhesion to the substrate.
상기 실란계 커플링제의 예로는, 트리메톡시실릴 벤조산, γ메타크릴 옥시프로필 트리메톡시실란, 비닐 트리아세톡시실란, 비닐 트리메톡시실란, γ이소시아네이트 프로필 트리에톡시실란, γ글리시독시 프로필 트리메톡시실란, β에폭시사이클로헥실)에틸트리메톡시실란 등을 들 수 있으며, 이들을 단독 또는 2종 이상 혼합하여 사용할 수 있다. Examples of the silane-based coupling agent include trimethoxysilyl benzoic acid, γ methacryl oxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ isocyanate propyl triethoxysilane, and γ glycidoxy propyl. Trimethoxysilane, β-epoxycyclohexyl)ethyltrimethoxysilane, etc. can be used, and these can be used alone or in combination of two or more.
상기 실란계 커플링제는 상기 경화성 조성물 100 중량부에 대하여 0.01 중량부 내지 10 중량부로 포함될 수 있다. 실란계 커플링제가 상기 범위 내로 포함될 경우 밀착성, 저장성 등이 우수하다. The silane-based coupling agent may be included in an amount of 0.01 parts by weight to 10 parts by weight based on 100 parts by weight of the curable composition. When the silane-based coupling agent is included within the above range, adhesion and storage properties are excellent.
또한 상기 경화성 조성물은 필요에 따라 코팅성 향상 및 결점 생성 방지 효과를 위해, 즉 레벨링(leveling) 성능을 개선시키기 위해 계면 활성제, 예컨대 불소계 계면활성제를 더 포함할 수 있다. In addition, the curable composition may further include a surfactant, such as a fluorine-based surfactant, if necessary, to improve coating properties and prevent defects, that is, to improve leveling performance.
상기 불소계 계면활성제는 4,000 g/mol 내지 10,000 g/mol의 낮은 중량평균 분자량을 가질 수 있으며, 구체적으로는 6,000 g/mol 내지 10,000g/mol의 중량평균 분자량을 가질 수 있다. 또한 상기 불소계 계면활성제는 표면장력이 18 mN/m 내지 23 mN/m(0.1% 프로필렌글리콜 모노메틸에테르 아세테이트(PGMEA) 용액에서 측정)일 수 있다. 상기 불소계 계면활성제의 중량평균 분자량 및 표면장력이 상기 범위 내일 경우 레벨링 성능을 더욱 개선할 수 있으며, 고속 코팅(high speed coating)시 얼룩 발생을 방지할 수 있고, 기포 발생이 적어 막 결함이 적기 때문에, 고속 코팅법인 슬릿 코팅(slit coating)에 우수한 특성을 부여한다. The fluorine-based surfactant may have a low weight average molecular weight of 4,000 g/mol to 10,000 g/mol, and specifically, may have a weight average molecular weight of 6,000 g/mol to 10,000 g/mol. Additionally, the fluorine-based surfactant may have a surface tension of 18 mN/m to 23 mN/m (measured in 0.1% propylene glycol monomethyl ether acetate (PGMEA) solution). If the weight average molecular weight and surface tension of the fluorine-based surfactant are within the above range, leveling performance can be further improved, stains can be prevented during high speed coating, and there are fewer film defects due to less bubble generation. , gives excellent properties to slit coating, a high-speed coating method.
상기 불소계 계면활성제로는, BM Chemie社의 BM-1000®, BM-1100® 등; 다이 닛폰 잉키 가가꾸 고교(주)社의 메카 팩 F 142D®, 동 F 172®, 동 F 173®, 동 F 183® 등; 스미토모 스리엠(주)社의 프로라드 FC-135®, 동 FC-170C®, 동 FC-430®, 동 FC-431® 등; 아사히 그라스(주)社의 사프론 S-112®, 동 S-113®, 동 S-131®, 동 S-141®, 동 S-145® 등; 도레이 실리콘(주)社의 SH-28PA®, 동-190®, 동-193®, SZ-6032®, SF-8428® 등; DIC(주)社의 F-482, F-484, F-478, F-554 등의 명칭으로 시판되고 있는 불소계 계면활성제를 사용할 수 있다.Examples of the fluorine-based surfactants include BM-1000 ® and BM-1100 ® from BM Chemie; Mecha pack F 142D ® , F 172 ® , F 173 ® , F 183 ® , etc. from Dai Nippon Inki Chemicals Co., Ltd.; Prorad FC-135 ® , FC-170C ® , FC-430 ® , FC-431 ® , etc. from Sumitomo 3M Co., Ltd.; Asahi Grass Co., Ltd.'s Saffron S-112 ® , S-113 ® , S-131 ® , S-141 ® , S-145 ® , etc.; Toray Silicone Co., Ltd.'s SH-28PA ® , Dong-190 ® , Dong-193 ® , SZ-6032 ® , SF-8428 ® , etc.; Fluorine-based surfactants commercially available under names such as F-482, F-484, F-478, and F-554 from DIC Co., Ltd. can be used.
또한, 일 구현예에 따른 경화성 조성물은 전술한 불소계 계면활성제와 함께 실리콘계 계면활성제를 사용할 수도 있다. 상기 실리콘계 계면활성제의 구체적인 예로는 도시바 실리콘社의 TSF400, TSF401, TSF410, TSF4440 등이 있으나, 이에 한정되는 것은 아니다. Additionally, the curable composition according to one embodiment may use a silicone-based surfactant along with the fluorine-based surfactant described above. Specific examples of the silicone-based surfactant include TSF400, TSF401, TSF410, and TSF4440 manufactured by Toshiba Silicone, but are not limited thereto.
상기 불소계 계면활성제 등을 포함하는 계면활성제는 상기 경화성 조성물 100 중량부에 대하여 0.01 중량부 내지 5 중량부, 예컨대 0.1 중량부 내지 2 중량부로 포함될 수 있다. 상기 계면활성제가 상기 범위 내로 포함될 경우 분사된 조성물 내에 이물이 발생되는 현상이 줄어들게 된다.Surfactants including the fluorine-based surfactant may be included in an amount of 0.01 parts by weight to 5 parts by weight, for example, 0.1 parts by weight to 2 parts by weight, based on 100 parts by weight of the curable composition. When the surfactant is contained within the above range, the occurrence of foreign substances in the sprayed composition is reduced.
또한 일 구현예에 따른 경화성 조성물은 물성을 저해하지 않는 범위 내에서 산화방지제 등의 기타 첨가제가 일정량 더 첨가될 수도 있다.Additionally, a certain amount of other additives such as antioxidants may be added to the curable composition according to one embodiment within a range that does not impair the physical properties.
용매menstruum
한편, 일 구현예에 따른 경화성 조성물은 용매를 더 포함할 수도 있다.Meanwhile, the curable composition according to one embodiment may further include a solvent.
상기 용매는 예컨대 메탄올, 에탄올 등의 알코올류; 에틸렌 글리콜 메틸에테르, 에틸렌 글리콜 에틸에테르, 프로필렌 글리콜 메틸에테르 등의 글리콜 에테르류; 메틸 셀로솔브 아세테이트, 에틸 셀로솔브 아세테이트, 디에틸 셀로솔브 아세테이트 등의 셀로솔브 아세테이트류; 메틸에틸 카르비톨, 디에틸 카르비톨, 디에틸렌 글리콜 모노메틸에테르, 디에틸렌 글리콜 모노에틸에테르, 디에틸렌 글리콜 디메틸에테르, 디에틸렌 글리콜 메틸에틸에테르, 디에틸렌 글리콜 디에틸에테르 등의 카르비톨류; 프로필렌 글리콜 모노메틸에테르 아세테이트, 프로필렌 글리콜 프로필에테르 아세테이트 등의 프로필렌 글리콜 알킬에테르 아세테이트류; 메틸에틸케톤, 사이클로헥사논, 4-히드록시-4-메틸-2-펜타논, 메틸-n-프로필케톤, 메틸-n-부틸케톤, 메틸-n-아밀케톤, 2-헵타논 등의 케톤류; 초산 에틸, 초산-n-부틸, 초산 이소부틸 등의 포화 지방족 모노카르복실산 알킬 에스테르류; 메틸 락테이트, 에틸 락테이트 등의 락트산 알킬 에스테르류; 메틸 히드록시아세테이트, 에틸 히드록시아세테이트, 부틸 히드록시아세테이트 등의 히드록시아세트산 알킬 에스테르류; 메톡시메틸 아세테이트, 메톡시에틸 아세테이트, 메톡시부틸 아세테이트, 에톡시메틸 아세테이트, 에톡시에틸 아세테이트 등의 아세트산 알콕시알킬 에스테르류; 메틸 3-히드록시프로피오네이트, 에틸 3-히드록시프로피오네이트 등의 3-히드록시프로피온산 알킬 에스테르류; 메틸 3-메톡시프로피오네이트, 에틸 3-메톡시프로피오네이트, 에틸 3-에톡시프로피오네이트, 메틸 3-에톡시프로피오네이트 등의 3-알콕시프로피온산 알킬 에스테르류; 메틸 2-히드록시프로피오네이트, 에틸 2-히드록시프로피오네이트, 프로필 2-히드록시프로피오네이트 등의 2-히드록시프로피온산 알킬 에스테르류; 메틸 2-메톡시프로피오네이트, 에틸 2-메톡시프로피오네이트, 에틸 2-에톡시프로피오네이트, 메틸 2-에톡시프로피오네이트 등의 2-알콕시프로피온산 알킬 에스테르류; 메틸 2-히드록시-2-메틸프로피오네이트, 에틸 2-히드록시-2-메틸프로피오네이트 등의 2-히드록시-2-메틸프로피온산 알킬 에스테르류; 메틸 2-메톡시-2-메틸프로피오네이트, 에틸 2-에톡시-2-메틸프로피오네이트 등의 2-알콕시-2-메틸프로피온산 알킬 에스테르류; 2-히드록시에틸 프로피오네이트, 2-히드록시-2-메틸에틸 프로피오네이트, 히드록시에틸 아세테이트, 메틸 2-히드록시-3-메틸부타노에이트 등의 에스테르류; 또는 피루빈산 에틸 등의 케톤산 에스테르류의 화합물이 있으며, 또한 N-메틸포름아미드, N,N-디메틸포름아미드, N-메틸포름아닐리드, N-메틸아세트아미드, N,N-디메틸아세트아미드, N-메틸피롤리돈, 디메틸술폭시드, 벤질에틸에테르, 디헥실에테르, 아세틸아세톤, 이소포론, 카프론산, 카프릴산, 1-옥탄올, 1-노난올, 벤질알코올, 초산 벤질, 안식향산 에틸, 옥살산 디에틸, 말레인산 디에틸, γ-부티로락톤, 에틸렌 카보네이트, 프로필렌 카보네이트, 페닐 셀로솔브 아세테이트 등을 들 수 있으나, 이에 한정되는 것은 아니다.The solvent includes, for example, alcohols such as methanol and ethanol; Glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether, and propylene glycol methyl ether; Cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; Carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone ; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid alkyl esters such as methyl lactate and ethyl lactate; hydroxyacetic acid alkyl esters such as methyl hydroxyacetate, ethyl hydroxyacetate, and butyl hydroxyacetate; acetic acid alkoxyalkyl esters such as methoxymethyl acetate, methoxyethyl acetate, methoxybutyl acetate, ethoxymethyl acetate, and ethoxyethyl acetate; 3-hydroxypropionic acid alkyl esters such as methyl 3-hydroxypropionate and ethyl 3-hydroxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-hydroxypropionic acid alkyl esters such as methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, and propyl 2-hydroxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-hydroxy-2-methylpropionic acid alkyl esters such as methyl 2-hydroxy-2-methylpropionate and ethyl 2-hydroxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as 2-hydroxyethyl propionate, 2-hydroxy-2-methylethyl propionate, hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutanoate; Alternatively, there are compounds of keto acid esters such as ethyl pyruvate, and also N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, and N,N-dimethylacetamide. , N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, benzoic acid. Examples include ethyl, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, phenyl cellosolve acetate, etc., but are not limited thereto.
예컨대, 상기 용매는 에틸렌 글리콜 모노에틸에테르, 에틸렌디글리콜메틸에틸에테르 등의 글리콜 에테르류; 에틸 셀로솔브 아세테이트 등의 에틸렌 글리콜 알킬에테르 아세테이트류; 2-히드록시 프로피온산 에틸 등의 에스테르류; 디에틸렌 글리콜 모노메틸에테르 등의 카르비톨류; 프로필렌 글리콜 모노메틸에테르 아세테이트, 프로필렌 글리콜 프로필에테르 아세테이트 등의 프로필렌 글리콜 알킬에테르 아세테이트류; 에탄올 등의 알코올류 또는 이들의 조합을 사용하는 것이 바람직하다.For example, the solvent may include glycol ethers such as ethylene glycol monoethyl ether and ethylene diglycol methyl ethyl ether; Ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; Carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; It is preferable to use alcohols such as ethanol or a combination thereof.
예컨대, 상기 용매는 프로필렌 글리콜 모노메틸에테르 아세테이트, 디프로필렌 글리콜 메틸에테르 아세테이트, 에탄올, 에틸렌글리콜디메틸에테르, 에틸렌디글리콜메틸에틸에테르, 디에틸렌글리콜디메틸에테르, 2-부톡시에탄올, N-메틸피롤리딘, N-에틸피롤리딘, 프로필렌 카보네이트, γ-부티로락톤 또는 이들의 조합을 포함하는 극성 용매일 수 있다.For example, the solvent is propylene glycol monomethyl ether acetate, dipropylene glycol methyl ether acetate, ethanol, ethylene glycol dimethyl ether, ethylene diglycol methyl ethyl ether, diethylene glycol dimethyl ether, 2-butoxyethanol, N-methylpyrroli It may be a polar solvent including dine, N-ethylpyrrolidine, propylene carbonate, γ-butyrolactone, or a combination thereof.
상기 용매는 경화성 조성물 총량에 대하여 40 중량% 내지 80 중량%, 예컨대 45 중량% 내지 80 중량%로 포함될 수 있다. 용매가 상기 범위 내로 포함될 경우 용매형 경화성 조성물이 적절한 점도를 가짐에 따라 스핀 코팅 및 슬릿을 이용한 대면적 코팅 시 우수한 코팅성을 가질 수 있다. The solvent may be included in an amount of 40% to 80% by weight, for example, 45% to 80% by weight, based on the total amount of the curable composition. When the solvent is included within the above range, the solvent-type curable composition has an appropriate viscosity and can have excellent coating properties during large-area coating using spin coating and slit.
다른 일 구현예는 상기 경화성 조성물, 예컨대 상기 경화성 조성물을 이용하여 제조된 경화막, 상기 경화막을 포함하는 컬러필터 및 상기 컬러필터를 포함하는 디스플레이 장치를 제공한다.Another embodiment provides the curable composition, for example, a cured film manufactured using the curable composition, a color filter including the cured film, and a display device including the color filter.
상기 경화막의 제조방법 중 하나는, 상기 경화성 조성물을 기판 위에 잉크젯 분사 방법으로 도포하여 패턴을 형성하는 단계(S1); 및 상기 패턴을 경화하는 단계(S2)를 포함한다.One of the methods for producing the cured film includes forming a pattern by applying the curable composition on a substrate using an inkjet spraying method (S1); and curing the pattern (S2).
(S1) 패턴을 형성하는 단계(S1) Step of forming a pattern
상기 경화성 조성물은 잉크젯 분산 방식으로 0.5 내지 20 ㎛의 두께로 기판 위에 도포하는 것이 바람직하다. 상기 잉크젯 분사는 각 노즐당 단일 컬러만 분사하여 필요한 색의 수에 따라 반복적으로 분사함으로써 패턴을 형성할 수 있으며, 공정을 줄이기 위하여 필요한 색의 수를 각 잉크젯 노즐을 통해 동시에 분사하는 방식으로 패턴을 형성할 수도 있다. The curable composition is preferably applied to the substrate at a thickness of 0.5 to 20 ㎛ by inkjet dispersion. The inkjet spraying can form a pattern by spraying only a single color per nozzle and spraying repeatedly according to the number of colors required. To reduce the process, the pattern can be formed by spraying the required number of colors simultaneously through each inkjet nozzle. It can also be formed.
(S2) 경화하는 단계(S2) Curing step
상기 수득된 패턴을 경화시켜 화소를 얻을 수 있다. 이때 경화시키는 방법으로는 열경화 공정 또는 광경화 공정을 모두 적용할 수 있다. 상기 열경화 공정은 100℃ 이상의 온도로 가열하여 경화시키는 것이 바람직하고, 더욱 바람직하게는 100℃ 내지 300℃로 가열하여 경화시킬 수 있으며, 조금 더 바람직하게는 160℃ 내지 250℃로 가열하여 경화시킬 수 있다. 상기 광경화 공정은 190nm 내지 450nm, 예컨대 200nm 내지 500nm의 UV 광선 등의 활성선을 조사한다. 조사에 사용되는 광원으로는 저압 수은등, 고압 수은등, 초고압 수은등, 금속 할로겐화물 램프, 아르곤 가스 레이저 등을 사용할 수 있으며, 경우에 따라 X선, 전자선 등도 이용할 수 있다. Pixels can be obtained by curing the obtained pattern. At this time, as a curing method, either a thermal curing process or a photo curing process can be applied. The thermal curing process is preferably performed by heating to a temperature of 100°C or higher, more preferably by heating to 100°C to 300°C, and more preferably by heating to 160°C to 250°C. You can. The photocuring process irradiates active rays such as UV light of 190 nm to 450 nm, for example, 200 nm to 500 nm. Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.
상기 경화막의 제조방법 중 또 다른 하나는 상기 경화성 조성물을 이용하여 리소그래피법을 이용하여 경화막을 제조하는 것으로, 제조방법은 다음과 같다.Another method of manufacturing the cured film is to manufacture the cured film using the lithography method using the curable composition, and the manufacturing method is as follows.
(1) 도포 및 도막 형성 단계(1) Application and film formation stage
상기 경화성 조성물을 소정의 전처리를 한 기판 상에 스핀 또는 슬릿 코트법, 롤 코트법, 스크린 인쇄법, 어플리케이터법 등의 방법을 사용하여 원하는 두께, 예를 들어 2㎛ 내지 10㎛의 두께로 도포한 후, 70℃내지 90℃의 온도에서 1분 내지 10분 동안 가열하여 용매를 제거함으로써 도막을 형성한다. The curable composition is applied to a desired thickness, for example, 2㎛ to 10㎛, using a method such as spin or slit coating, roll coating, screen printing, or applicator method on a substrate that has undergone a predetermined pretreatment. Afterwards, the solvent is removed by heating at a temperature of 70°C to 90°C for 1 to 10 minutes to form a coating film.
(2) 노광 단계(2) exposure step
상기 얻어진 도막에 필요한 패턴 형성을 위해 소정 형태의 마스크를 개재한 뒤, 190nm 내지 450nm, 예컨대 200nm 내지 500nm의 UV 광선 등의 활성선을 조사한다. 조사에 사용되는 광원으로는 저압 수은등, 고압 수은등, 초고압 수은등, 금속 할로겐화물 램프, 아르곤 가스 레이저 등을 사용할 수 있으며, 경우에 따라 X선, 전자선 등도 이용할 수 있다. In order to form the necessary pattern on the obtained coating film, a mask of a predetermined shape is interposed, and then actinic rays such as UV rays of 190 nm to 450 nm, for example, 200 nm to 500 nm, are irradiated. Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.
노광량은 상기 경화성 조성물 각 성분의 종류, 배합량 및 건조 막 두께에 따라 다르지만, 예를 들어 고압 수은등을 사용할 경우 500 mJ/cm2 이하(365 nm 센서에 의함)이다.The exposure amount varies depending on the type, mixing amount, and dry film thickness of each component of the curable composition, but is, for example, 500 mJ/cm 2 or less (based on a 365 nm sensor) when using a high-pressure mercury lamp.
(3) 현상 단계(3) Development stage
상기 노광 단계에 이어, 알칼리성 수용액을 현상액으로 이용하여 불필요한 부분을 용해, 제거함으로써 노광 부분만을 잔존시켜 화상 패턴을 형성시킨다. 즉, 알칼리 현상액으로 현상하는 경우, 비노광부는 용해되고, 이미지 컬러필터 패턴이 형성되게 된다.Following the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, leaving only the exposed parts remaining to form an image pattern. That is, when developing with an alkaline developer, the unexposed portion is dissolved and an image color filter pattern is formed.
(4) 후처리 단계(4) Post-processing step
상기 현상에 의해 수득된 화상 패턴을 내열성, 내광성, 밀착성, 내크랙성, 내화학성, 고강도, 저장 안정성 등의 면에서 우수한 패턴을 얻기 위해, 다시 가열하거나 활성선 조사 등을 행하여 경화시킬 수 있다.The image pattern obtained by the above phenomenon can be cured by heating again or irradiating with actinic rays, etc., in order to obtain a pattern excellent in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc.
이하, 본 발명의 바람직한 실시예를 기재한다. 다만, 하기의 실시예는 본 발명의 바람직한 일 실시예일뿐, 본 발명이 하기 실시예에 의해 한정되는 것은 아니다.Hereinafter, preferred embodiments of the present invention will be described. However, the following example is only a preferred example of the present invention, and the present invention is not limited by the following example.
(경화성 조성물의 제조)(Preparation of curable composition)
실시예 1Example 1
일반적으로 코어-쉘 양자점에서 상기 쉘의 두께가 두꺼울수록 안정성이 우수하기에, 쉘의 두께가 두꺼운 적색 양자점 대신, 쉘의 두께가 보다 얇은 녹색 양자점을 사용하여 양자점 표면개질을 진행하였다. 구체적으로 양자점 함유 CHA(Cyclohexyl acetate) 용액 30g에 Indium acetate (III) 13.13g, oleylamine 10mL 를 넣고 1시간 동안 170℃에서 교반하였다. 1L 용량 nalgene bottle에 에탄올 600g을 준비한 다음, 상기 양자점 반응액을 넣고 침전시켰다. 6000rpm, 5분간 원심 분리하여 맑은 여액을 따라 내고, wet 양자점 입자를 24시간 동안 진공 건조하였다. 수득된 양자점 파우더를 다시 CHA에 25% 농도로 재분산하였다. 26.66g의 양자점 재분산액에 하기 화학식 2A로 표시되는 화합물 2.2g을 넣고 24시간 동안 100℃에서 교반하였다. Nalgene bottle에 cyclohexane 400g을 준비하고 여기에 양자점 반응액을 넣고 침전시켰다. 원심 분리 후 여액을 제거하고 24시간 동안 진공 건조하여 양자점 파우더(인듐 산화물 코팅층의 두께; 1nm)를 수득하였다.In general, in core-shell quantum dots, the thicker the shell, the better the stability. Therefore, instead of the red quantum dots with a thick shell, green quantum dots with a thinner shell were used to surface modify the quantum dots. Specifically, 13.13 g of indium acetate (III) and 10 mL of oleylamine were added to 30 g of a CHA (cyclohexyl acetate) solution containing quantum dots and stirred at 170°C for 1 hour. After preparing 600g of ethanol in a 1L capacity nalgene bottle, the quantum dot reaction solution was added and precipitated. It was centrifuged at 6000 rpm for 5 minutes, the clear filtrate was poured out, and the wet quantum dot particles were vacuum dried for 24 hours. The obtained quantum dot powder was redispersed in CHA at a concentration of 25%. 2.2 g of the compound represented by the following formula 2A was added to 26.66 g of quantum dot redispersion and stirred at 100°C for 24 hours. Prepare 400g of cyclohexane in a Nalgene bottle, add quantum dot reaction solution to it, and precipitate it. After centrifugation, the filtrate was removed and vacuum dried for 24 hours to obtain quantum dot powder (thickness of indium oxide coating layer; 1 nm).
하기 화학식 6-2로 표시되는 중합성 화합물(M200, 미원 케미칼社)에 50% 농도로 양자점 파우더를 분산시켜 12시간 동안 교반하여 분산 용액을 만든 후, 여기에 중합금지제(메틸하이드로퀴논; TOKYO CHEMICAL社)를 넣고 5분 간 교반한다. 이어서 광중합 개시제(TPO-L; 폴리네트론社)를 투입하고 난 후, 광확산제(이산화티탄 분산액; rutile type TiO2; D50(180nm); 고형분 50중량%; ㈜이리도스)를 넣어, 경화성 조성물을 제조하였다.Quantum dot powder was dispersed at a concentration of 50% in a polymerizable compound (M200, Miwon Chemical Co., Ltd.) represented by the following formula 6-2 and stirred for 12 hours to make a dispersion solution, and then a polymerization inhibitor (methylhydroquinone; TOKYO) was added. Add CHEMICAL Co., Ltd. and stir for 5 minutes. Next, after adding the photopolymerization initiator (TPO-L; Polynetron Co., Ltd.), a light diffuser (titanium dioxide dispersion; rutile type TiO 2 ; D50 (180nm); solid content 50% by weight; Iridos Co., Ltd.) was added to increase curability. A composition was prepared.
(실시예 1의 경우를 예로 들면, 표면개질된 녹색 양자점 41g과 중합성 화합물로서 하기 화학식 6-2로 표시되는 화합물 41g을 혼합, 교반하여 녹색 양자점 분산액을 제조한 후, 여기에 상기 화학식 6-2로 표시되는 또다른 경화성 모노머 10g, 중합금지제 1g을 넣고 5분 간 교반하고, 이어서 광중합 개시제 3g과 광확산제 4g을 넣고 교반하여, 경화성 조성물(잉크)을 제조한다.)(For example, in the case of Example 1, 41 g of the surface-modified green quantum dots and 41 g of a polymerizable compound represented by the following formula 6-2 were mixed and stirred to prepare a green quantum dot dispersion, and then the formula 6- 10 g of another curable monomer represented by number 2 and 1 g of a polymerization inhibitor were added and stirred for 5 minutes, and then 3 g of a photopolymerization initiator and 4 g of a light diffuser were added and stirred to prepare a curable composition (ink).)
[화학식 2A][Formula 2A]
[화학식 6-2][Formula 6-2]
(화학식 2A로 표시되는 화합물(제2 표면개질물질) 합성: (Synthesis of the compound (second surface modification material) represented by Formula 2A:
PH-4 (한농화성) 100g을 2구 환저 플라스크에 넣고 테트라하이드로퓨란(THF) 300mL에 충분히 용해시킨다. 여기에 0℃에서 NaOH 15.4g, 물 100mL를 투입한 후, 맑은 용액이 될 때까지 충분히 용해시킨다. Para-toluene sulfonic chloride 73g 을 THF 100mL에 녹인 용액을 0℃에서 천천히 주입한다. 주입은 1시간 동안 진행되었으며, 이후 상온에서 12시간 동안 교반한다. 반응 종료 후 과량의 methylene chloride를 넣고 교반 후 NaHCO3 포화 용액을 넣고 추출, 적정, 수분 제거를 진행한다. 용매를 제거한 후 진공 오븐에서 24시간 건조한다. 수득한 건조물 50g을 2구 환저 플라스크에 넣고 에탄올 300mL에 충분히 교반한다. 이후 Thiourea 27g 을 넣고 분산 후 80℃에서 12시간 reflux한다. 이후 NaOH 4.4g을 20mL 물에 녹인 수용액을 주입하고 5시간 더 교반하면서 과량의 methylene chloride을 넣고 교반 후 염산수용액을 넣고 추출, 적정, 수분제거, 용매 제거를 차례로 진행한다. 진공 오븐에서 24시간 건조하여, 하기 화학식 2A로 표시되는 화합물을 수득한다.)Put 100g of PH-4 (Han Nong Chemical) into a two-neck round bottom flask and sufficiently dissolve in 300mL of tetrahydrofuran (THF). Add 15.4 g of NaOH and 100 mL of water at 0°C and dissolve sufficiently until a clear solution is formed. A solution of 73 g of para-toluene sulfonic chloride dissolved in 100 mL of THF is slowly injected at 0°C. Injection was carried out for 1 hour, and then stirred at room temperature for 12 hours. After completion of the reaction, an excess amount of methylene chloride is added and stirred, then a saturated NaHCO 3 solution is added and extraction, titration, and moisture removal are performed. After removing the solvent, dry in a vacuum oven for 24 hours. 50 g of the obtained dried material was placed in a two-necked round bottom flask and thoroughly stirred in 300 mL of ethanol. Afterwards, add 27g of Thiourea, disperse, and reflux at 80°C for 12 hours. Afterwards, an aqueous solution of 4.4 g of NaOH dissolved in 20 mL of water was injected and stirred for an additional 5 hours. An excess amount of methylene chloride was added. After stirring, an aqueous hydrochloric acid solution was added and extraction, titration, moisture removal, and solvent removal were sequentially performed. By drying in a vacuum oven for 24 hours, a compound represented by the following formula 2A is obtained.)
실시예 2Example 2
상기 화학식 2A로 표시되는 화합물 2.2g 대신, 상기 화학식 2A로 표시되는 화합물 1.98g 및 하기 화학식 1A로 표시되는 화합물 0.22g을 사용한 것을 제외하고는, 실시예 1과 동일하게 하였다.It was the same as Example 1, except that instead of 2.2g of the compound represented by Formula 2A, 1.98g of the compound represented by Formula 2A and 0.22g of the compound represented by Formula 1A below were used.
[화학식 1A][Formula 1A]
(화학식 1A로 표시되는 화합물(제1 표면개질물질) 합성:(Synthesis of the compound (first surface modification material) represented by Formula 1A:
Triethylene glycol monomethyl ether (TCI) 10g, allyl bromide (TCI) 11g을 플라스크에 넣고, 디메틸포름아미드(DMF) 100mL 에 녹인다. 플라스크를 쿨링한 후 여기에 60% NaH 3g 을 portion-wise로 투입하고 10시간 동안 교반한다. 여기에 50mL 물을 넣고 반응을 종료한 후, separation funnel 로 옮긴다. 300mL의 ethyl acetate를 넣고 포화된 sodium bicarbonate 용액을 50mL 넣고 3회 동안 추출 반복한다. 유기층을 분리하고 여기에 MgSO-4 투입후 1시간 동안 교반한다. 필터링을 거친 후 농축하고, 24시간 동안 건조 오븐에서 추가 건조한다. 수득된 중간물 중 8g을 다시 플라스크에 넣고 methylene chloride 100mL에 녹인다. m-CPBA (sigma Aldrich) 10g을 넣고 50℃에서 10시간 동안 교반한다. 용매를 제거한 후 물 100mL에 재분산한 다음 황산 한 방울을 넣고 60℃에서 6시간 동안 교반한다. Suction filter로 수분과 분리한 혼합물을 column 정제 (에탄올 3% methylene chloride 혼합 용매)한다. 용매를 제거하고 TEGME-diol을 수득한다. 이 수득물을 THF/DIW (5/5) 용매에 재분산하고, ice bath 하에서 분산 용액에 NaOH 2.2 당량을 넣고 10분 동안 교반한다. 2.2 당량의 p-toluenesulfonic chloride (삼전화학) (30% THF) 용액을 drop-wise로 투입하고 이후 상온(23℃)에서 12시간 교반한다. 300mL의 methylene chloride 에 녹인 다음 희석 염산 수용액을 넣고 3회 추출 및 중화한다. 수분 및 용매제거 후 24시간 동안 진공 건조한다. 얻어진 수득물을 플라스크에 넣고 아세톤 300mL에 녹이고 여기에 2.2 당량의 potassium thioacetate (TCI)를 넣고 60℃에서 12시간 교반한다. 300mL의 methylene chloride, 200mL의 물을 넣고 추출 3회, 수분 및 용매 제거 후 24시간 진공 건조한다. 얻어진 수득물을 에탄올 300mL에 녹이고 여기에 염산 2.5당량을 넣고 100℃로 12시간 교반한다. 과량의 methlylene chloride와 물을 넣고 5회 추출, 중화, 용매 제거 후 24시간 진공 건조하여, 하기 화학식 1A로 표시되는 화합물을 수득한다.)Add 10g of triethylene glycol monomethyl ether (TCI) and 11g of allyl bromide (TCI) to a flask and dissolve in 100mL of dimethylformamide (DMF). After cooling the flask, add 3g of 60% NaH portion-wise and stir for 10 hours. Add 50mL water here, complete the reaction, and then transfer to the separation funnel. Add 300mL of ethyl acetate, add 50mL of saturated sodium bicarbonate solution, and repeat extraction three times. Separate the organic layer, add MgSO- 4 to it, and stir for 1 hour. After filtering, it is concentrated and further dried in a drying oven for 24 hours. Put 8g of the obtained intermediate back into the flask and dissolve in 100mL of methylene chloride. Add 10 g of m-CPBA (sigma Aldrich) and stir at 50°C for 10 hours. After removing the solvent, redisperse in 100 mL of water, add a drop of sulfuric acid, and stir at 60°C for 6 hours. The mixture separated from moisture using a suction filter is column purified (ethanol 3% methylene chloride mixed solvent). The solvent is removed and TEGME-diol is obtained. This obtained product was redispersed in THF/DIW (5/5) solvent, and 2.2 equivalents of NaOH was added to the dispersion solution under an ice bath and stirred for 10 minutes. Add 2.2 equivalents of p-toluenesulfonic chloride (Samchun Chemical) (30% THF) solution drop-wise and stir at room temperature (23°C) for 12 hours. Dissolve in 300mL of methylene chloride, add diluted hydrochloric acid solution, extract and neutralize three times. After removing moisture and solvent, vacuum dry for 24 hours. Put the obtained product in a flask, dissolve it in 300 mL of acetone, add 2.2 equivalents of potassium thioacetate (TCI), and stir at 60°C for 12 hours. Add 300 mL of methylene chloride and 200 mL of water, extract 3 times, remove moisture and solvent, and vacuum dry for 24 hours. Dissolve the obtained product in 300 mL of ethanol, add 2.5 equivalents of hydrochloric acid, and stir at 100°C for 12 hours. Excess methlylene chloride and water are added, extracted 5 times, neutralized, solvent removed, and vacuum dried for 24 hours to obtain a compound represented by the following formula 1A.)
실시예 3Example 3
인듐 산화물 코팅층의 두께를 0.5nm로 제어한 것을 제외하고는, 실시예 1과 동일하게 하였다.It was the same as Example 1, except that the thickness of the indium oxide coating layer was controlled to 0.5 nm.
실시예 4Example 4
인듐 산화물 코팅층의 두께를 1.5nm로 제어한 것을 제외하고는, 실시예 1과 동일하게 하였다.It was the same as Example 1, except that the thickness of the indium oxide coating layer was controlled to 1.5 nm.
비교예 1Comparative Example 1
인듐 산화물을 코팅시키지 않은 것을 제외하고는, 실시예 1과 동일하게 하였다.It was the same as Example 1, except that indium oxide was not coated.
비교예 2Comparative Example 2
인듐 산화물 대신 아연 산화물을 코팅시킨 것을 제외하고는, 실시예 1과 동일하게 하였다.It was the same as Example 1, except that zinc oxide was coated instead of indium oxide.
비교예 3Comparative Example 3
인듐 산화물 대신 망간 산화물을 코팅시킨 것을 제외하고는, 실시예 1과 동일하게 하였다.It was the same as Example 1, except that manganese oxide was coated instead of indium oxide.
평가: 경화성 조성물의 내광 특성 평가Evaluation: Evaluation of the light resistance properties of the curable composition
실시예 1 내지 실시예 4 및 비교예 1 내지 비교예 3에 따른 경화성 조성물 각각에 대하여 내광 특성을 평가하여, 그 결과를 하기 표 1에 나타내었다.The light resistance properties were evaluated for each of the curable compositions according to Examples 1 to 4 and Comparative Examples 1 to 3, and the results are shown in Table 1 below.
(내광 특성 평가)(Evaluation of light resistance characteristics)
상기 제조한 경화성 조성물을 2mL 사용하여 유리 기판 상에 1,500rpm으로 스핀 코팅한 후, 질소 UV 노광기(395nm)에서 5J로 9초간 노광하여 형성된 QD필름(9㎛)에 대해 광효율 측정기(QE-2100, Otsuka 社)로 초기 blue 광 변환율을 측정하였다.2 mL of the curable composition prepared above was spin-coated on a glass substrate at 1,500 rpm, and then exposed to 5 J for 9 seconds in a nitrogen UV exposure machine (395 nm). The QD film (9 ㎛) formed was measured using a light efficiency meter (QE-2100, The initial blue light conversion rate was measured using Otsuka Co., Ltd.).
이 후, 상기 QD필름이 형성된 기판을 hot plate 180℃, 질소 분위기에서 30분 및 1시간 동안 baking(POB; post baking)한 후 상온(23℃)에서 3시간 동안 냉각한다. 이 때, 상기 baking을 3회 실시하고, baking 종료 시마다 광효율 측정기로 blue 광 변환율을 측정한 다음, 하기 계산식을 통해 열공정 유지율(%)을 계산하였다.Afterwards, the substrate on which the QD film was formed was baked (POB; post baking) on a hot plate at 180°C in a nitrogen atmosphere for 30 minutes and 1 hour, and then cooled at room temperature (23°C) for 3 hours. At this time, the baking was performed three times, and the blue light conversion rate was measured with a light efficiency meter at each end of baking, and then the thermal process maintenance rate (%) was calculated using the following calculation formula.
열공정 유지율 (%) = [광 변환율(Baking 후)/초기 광 변환율] * 100 Thermal process maintenance rate (%) = [light conversion rate (after baking)/initial light conversion rate] * 100
상기 표 1로부터, 실시예 1 내지 실시예 4에 따른 경화성 조성물은 비교예 1 내지 비교예 3에 따른 경화성 조성물과 비교하여, POB 횟수가 증가함에 따라 열공정 유지율의 저하가 최소화되어 내광성이 우수함을 확인할 수 있다. From Table 1, compared to the curable compositions according to Examples 1 to 4, the curable compositions according to Examples 1 to 3 have excellent light resistance as the decrease in thermal process maintenance rate is minimized as the number of POB increases. You can check it.
본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.The present invention is not limited to the above-mentioned embodiments, but can be manufactured in various different forms, and those skilled in the art may recognize other specific forms without changing the technical idea or essential features of the present invention. You will be able to understand that this can be implemented. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.
1
양자점
2
패시베이션층
3
표면개질물질1 quantum dot
2 Passivation layer
3 Surface modification materials
Claims (19)
(B) 중합성 화합물
을 포함하는 경화성 조성물.
(A) Quantum dots passivated with indium oxide; and
(B) Polymerizable compounds
A curable composition comprising a.
상기 양자점은 인듐 산화물 패시베이션층을 포함하고,
상기 패시베이션층은 0.1nm 내지 1nm의 두께를 가지는 경화성 조성물.
According to paragraph 1,
The quantum dot includes an indium oxide passivation layer,
The passivation layer is a curable composition having a thickness of 0.1 nm to 1 nm.
상기 양자점은 그 표면이 표면개질물질로 표면개질된 양자점인 경화성 조성물.
According to paragraph 1,
A curable composition wherein the quantum dots are quantum dots whose surface has been surface modified with a surface modification material.
상기 표면개질물질은 하기 화학식 1 및/또는 화학식 2로 표시되는 경화성 조성물.
[화학식 1]
(상기 화학식 1에서,
L1 및 L2는 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,
R1은 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이고,
R2는 하기 화학식 R-1로 표시되고,
[화학식 R-1]
상기 화학식 R-1에서,
X는 CR(R은 수소원자 또는 치환 또는 비치환된 C1 내지 C10 알킬기임) 또는 N이고,
L5 및 L6은 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,
n1은 0 내지 20의 정수이다)
[화학식 2]
(상기 화학식 2에서,
L3 및 L4는 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,
R3은 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이고,
n2는 0 내지 20의 정수이다)
According to paragraph 3,
The surface modification material is a curable composition represented by the following Chemical Formula 1 and/or Chemical Formula 2.
[Formula 1]
(In Formula 1 above,
L 1 and L 2 are each independently a substituted or unsubstituted C1 to C20 alkylene group,
R 1 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group,
R 2 is represented by the following formula R-1,
[Formula R-1]
In the above formula R-1,
X is CR (R is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group) or N,
L 5 and L 6 are each independently a single bond or a substituted or unsubstituted C1 to C20 alkylene group,
n1 is an integer from 0 to 20)
[Formula 2]
(In Formula 2 above,
L 3 and L 4 are each independently a substituted or unsubstituted C1 to C20 alkylene group,
R 3 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group,
n2 is an integer from 0 to 20)
상기 표면개질물질은 상기 화학식 1 및 화학식 2로 표시되는 화합물을 포함하고,
상기 표면개질물질 총량에 대해 상기 화학식 1로 표시되는 화합물은 상기 화학식 2로 표시되는 화합물과 동일하거나 보다 적은 함량으로 포함되는 경화성 조성물.
According to paragraph 4,
The surface modification material includes compounds represented by Formula 1 and Formula 2,
A curable composition in which the compound represented by Formula 1 is included in an amount equal to or less than that of the compound represented by Formula 2 relative to the total amount of the surface modification material.
상기 표면개질물질 총량에 대해 상기 화학식 1로 표시되는 화합물 및 화학식 2로 표시되는 화합물은 1:9 내지 5:5의 중량비로 포함되는 경화성 조성물.
According to clause 5,
A curable composition in which the compound represented by Formula 1 and the compound represented by Formula 2 are included in a weight ratio of 1:9 to 5:5 relative to the total amount of the surface modification material.
상기 화학식 1로 표시되는 화합물은 하기 화학식 1-1 또는 화학식 1-2로 표시되는 경화성 조성물:
[화학식 1-1]
[화학식 1-2]
상기 화학식 1-1 및 화학식 1-2에서,
L1, L2, L5 및 L6은 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 알킬렌기이고,
R1은 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이고,
n1 및 n2는 각각 독립적으로 0 내지 20의 정수이다.
According to paragraph 4,
The compound represented by Formula 1 is a curable composition represented by the following Formula 1-1 or Formula 1-2:
[Formula 1-1]
[Formula 1-2]
In Formula 1-1 and Formula 1-2,
L 1 , L 2 , L 5 and L 6 are each independently a substituted or unsubstituted C1 to C20 alkylene group,
R 1 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group,
n1 and n2 are each independently integers from 0 to 20.
상기 화학식 1로 표시되는 화합물은 하기 화학식 1A 또는 화학식 1B로 표시되는 경화성 조성물.
[화학식 1A]
[화학식 1B]
In clause 7,
The compound represented by Formula 1 is a curable composition represented by Formula 1A or Formula 1B below.
[Formula 1A]
[Formula 1B]
상기 화학식 2로 표시되는 화합물은 하기 화학식 2A 또는 화학식 2B로 표시되는 경화성 조성물.
[화학식 2A]
[화학식 2B]
According to paragraph 4,
The compound represented by Formula 2 is a curable composition represented by Formula 2A or Formula 2B below.
[Formula 2A]
[Formula 2B]
상기 경화성 조성물은 무용매형 경화성 조성물인 경화성 조성물.
According to paragraph 1,
The curable composition is a solvent-free curable composition.
상기 무용매형 경화성 조성물은, 상기 무용매형 경화성 조성물 총량에 대해,
상기 양자점 5 중량% 내지 60 중량%; 및
상기 중합성 화합물 40 중량% 내지 95 중량%
를 포함하는 무용매형 경화성 조성물.
According to clause 10,
The solvent-free curable composition is, relative to the total amount of the solvent-free curable composition,
5% to 60% by weight of the quantum dots; and
40% to 95% by weight of the polymerizable compound
A solvent-free curable composition comprising a.
상기 경화성 조성물은 중합개시제, 광확산제, 중합금지제 또는 이들의 조합을 더 포함하는 경화성 조성물.
According to paragraph 1,
The curable composition further includes a polymerization initiator, a light diffuser, a polymerization inhibitor, or a combination thereof.
상기 광확산제는 황산바륨, 탄산칼슘, 이산화티타늄, 지르코니아 또는 이들의 조합을 포함하는 경화성 조성물.
According to clause 12,
The light diffuser is a curable composition comprising barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.
상기 경화성 조성물은 용매를 더 포함하는 경화성 조성물.
According to paragraph 1,
The curable composition further includes a solvent.
상기 경화성 조성물은, 상기 경화성 조성물 전체 중량을 기준으로, 상기 양자점 1 중량% 내지 40 중량%; 상기 중합성 화합물 1 중량% 내지 20 중량%; 및 상기 용매 40 중량% 내지 80 중량%를 포함하는 경화성 조성물.
According to clause 14,
The curable composition includes 1% to 40% by weight of the quantum dots, based on the total weight of the curable composition; 1% to 20% by weight of the polymerizable compound; And a curable composition comprising 40% by weight to 80% by weight of the solvent.
상기 경화성 조성물은 말론산; 3-아미노-1,2-프로판디올; 실란계 커플링제; 레벨링제; 불소계 계면활성제; 또는 이들의 조합을 더 포함하는 경화성 조성물.
According to paragraph 1,
The curable composition includes malonic acid; 3-amino-1,2-propanediol; Silane-based coupling agent; leveling agent; Fluorine-based surfactant; Or a curable composition further comprising a combination thereof.
A cured film manufactured using the curable composition according to any one of claims 1 to 16.
A color filter comprising the cured film of claim 17.
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