KR20230165173A - Device handler - Google Patents

Abstract

The present invention relates to a device sorting device, and more specifically, to a device sorting device that automatically classifies devices such as semiconductor chips according to classification standards.
The present invention includes a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded; a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test; An XY table 410 that moves the burn-in board 20 in the ; an unloading unit 300 in which the elements 10 to be sorted, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the sorting criteria according to preset classification criteria; The tray 30 is installed to be movable to a loading position on the upper side of the DC test unit 170 and an avoidance position spaced horizontally from the loading position, so that the DC test unit 170 is placed on the tray 30. a first buffer tray unit 610 on which devices 10 that were found to be defective as a result of the test are temporarily loaded; Among the elements 10 to be classified that are located between the extraction position of the element 10 with respect to the burn-in board 20 and the unloading unit 300 and are extracted from the burn-in board 20, they are classified into a classification grade other than good products. Disclosed is a device sorting device that includes a second buffer tray unit 620 on which devices 10 to be sorted are temporarily loaded.

Description

Element sorting device {Device handler}

The present invention relates to a device sorting device, and more specifically, to a device sorting device that automatically classifies devices such as semiconductor chips according to classification standards.

Semiconductor devices (hereinafter referred to as 'devices') undergo various tests such as electrical characteristics, reliability tests for heat and pressure, etc. after completing the packaging process.

Among these tests for semiconductor devices, there is a burn-in test. The burn-in test involves inserting a number of devices into a burn-in board, storing the burn-in board in a burn-in test device, and applying heat or pressure for a certain period of time. This is a test to determine whether a defect occurs in the rear device.

The device sorting device for burn-in testing generally sorts (unloads) devices from the burn-in board loaded with devices that have completed the burn-in test into each tray according to the classification criteria assigned according to the inspection results for each device, such as good products or defective products, This refers to a device that inserts (loads) a new device to perform a burn-in test again into an empty spot (socket) on the burn-in board where the device was located.

Meanwhile, the performance of the device sorting device as described above is evaluated by the number of units sorted per unit time (UPH: Units Per Hour), and UPH is the time required to transfer devices and burn-in boards between each component that makes up the device sorting device. It is decided according to.

Therefore, there is a need to improve the structure and arrangement of each component in order to increase the UPH, which is the performance of the device sorting device.

As an element sorting device for increasing UPH as described above, Korean Patent No. 10-1133188 (Patent Document 1), Korean Patent No. 10-1177319 (Patent Document 2), and Korean Patent Publication No. 10-2016-48628 ( Patent Document 3), etc.

Meanwhile, mass production of standardized devices such as SD RAM and, more recently, NAND flash memory, is expanding as the market size expands.

In addition, in the mass production of devices, the demand for device inspection also increases, so it is necessary to install a large number of device sorting devices to classify devices according to inspection results as a post-process.

Accordingly, in device sorting devices, the footprint of the device varies depending on the logistics supply structure inside the device, such as trays and boards. The supply structure of trays and boards for the device is a very important factor in the arrangement of the device. do.

The purpose of the present invention is to provide a device classification device for supplying devices for burn-in testing and sorting devices that have completed burn-in testing, from a loading section where devices to be inspected are loaded, a DC test section for performing DC tests, and a burn-in board. The aim is to provide an element sorting device that can efficiently perform the sorting process of elements while minimizing the footprint by optimizing the arrangement of the unloading unit, where drawn elements are loaded onto a tray.

The present invention was created to achieve the object of the present invention as described above, and the present invention includes a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded; a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test; An X-Y table 410 that moves the burn-in board 20 in the ; a buffer unit 600 in which the elements 10 to be sorted taken out from the burn-in board 20 are temporarily loaded; a good product tray unit 200 in which non-defective devices to be sorted (10) among the devices to be sorted (10) loaded in the buffer unit (600) are loaded on a tray (30); a DC tray unit 310 in which the devices 10 tested as unqualified in the DC test unit 170 are sorted and loaded; Disclosed is a device sorting device that includes a reject tray 320 that sorts and loads devices 10 excluding non-defective products in the buffer unit 600.

The present invention also includes a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded; a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test; An X-Y table 410 that moves the burn-in board 20 in the ; an unloading unit 300 in which the elements 10 to be sorted, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the sorting criteria according to preset classification criteria; The tray 30 is installed to be movable to a loading position on the upper side of the DC test unit 170 and an avoidance position spaced horizontally from the loading position, so that the DC test unit 170 is placed on the tray 30. a first buffer tray unit 610 on which devices 10 that were found to be defective as a result of the test are temporarily loaded; Among the elements 10 to be classified that are located between the extraction position of the element 10 with respect to the burn-in board 20 and the unloading unit 300 and are extracted from the burn-in board 20, they are classified into a classification grade other than good products. Disclosed is a device sorting device that includes a second buffer tray unit 620 on which devices 10 to be sorted are temporarily loaded.

The loading unit 100, the extraction position of the element 10 with respect to the burn-in board 20, and the arrangement direction of the unloading unit 300 are referred to as the X-axis, and the direction horizontally perpendicular to the In this case, the loading unit 100 may include a guide unit that guides the tray 30 so that it can be moved in the Y-axis direction, and a drive unit that moves the tray 30 along the guide unit.

The unloading unit 300 includes a good product tray unit 301 where a tray 30 on which devices 10 to be classified as good products are loaded is located; a DC tray unit 302 where a tray 30 is placed on which devices 10 that were tested as defective as a result of the DC test unit 170 are loaded; The burn-in board 20 includes one or more reject trays 303 and 304 on which a tray 30 is placed, on which elements 10 to be classified into each classification grade are loaded, corresponding to the number of classification grades other than good products. can do.

The good product tray part 301, the DC tray part 302, and the reject tray parts 303 and 304 each include a guide part that guides the tray 30 to move in the Y-axis direction, and the tray ( 30) may include a driving unit for moving the guide unit.

It is installed to be reciprocatable in the Loading transfer tool 510; A plurality of devices installed to be reciprocatable in the an insert transfer tool 520 for loading (10) onto the burn-in board 20; It is installed to be movable back and forth between the extraction position of the element 10 with respect to the burn-in board 20 and the second buffer tray unit 620, so that the second buffer tray unit 620 is transferred from the burn-in board 20. A remove transfer tool 530 that transfers the elements 10 to the tray 30 of; It is installed between the second buffer tray unit 620 and the unloading unit 300 to transfer devices 10 to be classified as good products from the second buffer tray unit 620 to the unloading unit 300. It may include an unloading transfer tool 540.

It is installed to be reciprocatable in the Loading transfer tool 510; A plurality of devices installed to be reciprocatable in the an insert transfer tool 520 for loading (10) onto the burn-in board 20; It is installed to be movable back and forth along the withdrawal position of the element 10 with respect to the burn-in board 20, the second buffer tray unit 620, and the unloading unit 300, and is picked up from the burn-in board 20. If all the devices 10 are good products, the devices 10 are delivered to the good product tray 301, and among the devices 10 picked up from the burn-in board 20, devices 10 of a classification level other than good products are selected. When included, it may include a remove transfer tool 530 that transfers the elements 10 to the tray 30 of the second buffer tray unit 620.

The first buffer tray unit 610 and the unloading at a position spaced apart from the reciprocating movement line of the loading transfer tool 510, the insert transfer tool 520, and the limb unit transfer tool 530 in the Y-axis direction. It is installed to move linearly back and forth between the units 300, and is inspected for defective DC test results of the DC test unit 170 among the elements 10 loaded on the tray 30 of the first buffer tray unit 610. The elements 10 loaded on the tray 30 of the second buff tray unit 610 are transferred to the good product tray unit 301 according to the classification level. ), may include a sorting transfer tool 550 that is delivered to the corresponding tray 30 among the reject tray units 303 and 304.

The first buffer tray unit 610 may be configured to have two or more moving sections up and down in which the tray 30 reciprocates in the Y-axis direction between the loading position and the moving section of the sorting transfer tool 550. there is.

The second buff tray unit 610 is configured to have two or more moving sections up and down in which the tray 30 reciprocates in the Y-axis direction between the loading position and the moving section of the remove transfer tool 530. You can.

Socket press 45 on two or more types of burn-in boards 40, test sockets of two types of DC test units 170, trays 30 of two or more types of first buffer tray units 610, and two or more types of second buffers A stacking support part (681) on which the tray 30 of the tray part 610 is loaded, and both sides of the stacking support part (681) so that the stacking support part (681) is spaced apart from the upper side of the DC test part 170. It includes a replacement parts loading part 680 including a supporting base support part 682, and a socket press 45 on the burn-in board 40 and the DC test part 170 according to the external specifications of the device 10. ) test socket, the tray 30 of the first buffer tray unit 610, and the tray 30 of the second buffer tray unit 610 can be automatically replaced.

The socket press 45 on the burn-in board 40, the test socket of the DC test unit 170, the tray 30 of the first buffer tray unit 610, and the tray of the second buffer tray unit 610. (30) is from the replacement parts loading unit 680 by a tray transfer unit 670 installed to transfer the tray 30 of the loading unit 100 and the tray 30 of the unloading unit 300. It can be withdrawn or loaded.

The present invention also includes a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded; a DC test unit 170 that receives the elements 10 to be tested from the loading unit 200 and performs a DC test; An X-Y table 410 that moves the burn-in board 20 in the ; an unloading unit 300 in which the elements 10 to be sorted, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the sorting criteria according to preset classification criteria; A socket press (45) on two or more types of burn-in boards (40), a loading support portion (681) on which test sockets of two types of DC test portions (170) are loaded, and the loading support portion (681) is connected to a DC test portion (170). ) and a replacement parts loading portion 680 including a base support portion 682 supporting both sides of the loading support portion 681 so as to be spaced apart from the upper side of the burn-in board according to the external specifications of the device 10. Disclosed is a device sorting device characterized in that the socket press 45 on (40) and the test socket of the DC test unit 170 are automatically replaced.

The socket press 45 on the burn-in board 40 and the test socket of the DC test unit 170 are connected to the tray 30 of the loading unit 100 and the tray 30 of the unloading unit 300. It can be withdrawn or loaded from the replacement parts loading unit 680 by the tray transfer unit 670 installed for transfer.

The device sorting device according to the present invention is a device inspection device for supplying and sorting devices before and after inspection, such as a burn-in test, in the tray transfer direction of the loading section where devices to be inspected are loaded, and devices inspected as good products on the burn-in board. The tray transfer directions of the unloading section, where trays are loaded and unloaded, are arranged parallel to each other, and the supply and discharge of trays to the device are performed adjacent to the unloading section, thereby automating the supply and discharge of trays and significantly reducing the footprint. There is an advantage to reducing it.

In addition, the device sorting device according to the present invention optimizes the arrangement of the loading section where devices to be inspected are loaded, the DC test section for performing DC tests, and the unloading section where devices pulled out from the burn-in board are loaded on the tray, etc. There is an advantage in that the device sorting process can be performed efficiently while minimizing printing.

In addition, the device sorting device according to the present invention is further equipped with a module replacement unit that automatically replaces the test sockets, trays, etc. of the DC test unit used inside the device according to changes in the external specifications of the device, such as plan size, thereby facilitating the use of the device. There is a convenient advantage.

In particular, the device sorting device according to the present invention has the advantage of optimizing the arrangement by locating the module exchange part at the top of the device, minimizing the footprint, and efficiently performing the device sorting process.

For example, among the module exchange parts, the loading part where the test sockets and trays of the DC test part are loaded is located on the upper side, and in particular, by sharing at least a part of it with the transport rail of the transport tool, the arrangement is optimized to minimize the footprint and at the same time, the device There is an advantage in that the classification process can be performed efficiently.

1 is a plan layout view showing an element sorting device according to a first embodiment of the present invention.
FIG. 2 is a plan view showing the concepts of a tray, test tray, and buffer tray used in the device sorting device of FIG. 1.
Figure 3 is a plan layout diagram showing the arrangement of an element sorting device according to a second embodiment of the present invention.
FIG. 4 shows the device transfer process between the loading unit, DC test unit, first buffer tray unit, burn-in board, second buffer tray unit, and unloading unit of the device sorting device of FIG. 3, showing the transfer tools used therein. This is a front view showing an example of layout.
FIG. 5 is a rear view showing an example in which a configuration for replacing the test socket of the DC test unit, the tray of the first buffer tray unit, the tray of the second buffer tray unit, and the socket press on the burn-in board of the device sorting device of FIG. 3 has been added. .
FIG. 6 is a side view showing a process of replacing a tray of the first buffer tray or a tray of the second buffer tray of the device sorting device of FIG. 3 with a different type of tray.
FIG. 7 is a rear view showing a process of replacing a tray of the first buffer tray or a tray of the second buffer tray of the device sorting device of FIG. 3 with a different type of tray.
Figure 8 is a side view showing the process of replacing the test socket of the DC test part of the device sorting device of Figure 3 with another type of test socket.
Figure 9 is a rear view showing the process of replacing the test socket of the DC test part of the device sorting device of Figure 3 with another type of test socket.

Hereinafter, the device sorting device according to the present invention will be described with the accompanying drawings.

As shown in FIGS. 1 and 2, the device sorting device according to the first embodiment of the present invention includes a loading unit 100 on which a tray 30 loaded with devices 10 to be inspected is loaded; a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test; an X-Y table 410 that moves the burn-in board 20 in the a buffer unit 600 in which the elements 10 to be sorted taken out from the burn-in board 20 are temporarily loaded; a good product tray unit 200 in which non-defective devices to be sorted (10) among the devices to be sorted (10) loaded in the buffer unit (600) are loaded on a tray (30); a DC tray unit 310 in which devices 10 that have been tested as unqualified in the DC test unit 170 are sorted and loaded; It includes a reject tray 320 in which the devices 10 excluding non-defective products are sorted and loaded in the buffer unit 600 .

The burn-in board 20 refers to a board on which elements 10 are loaded so that they can undergo a burn-in test in a burn-in test device (not shown), and the elements 10 can be tested for electrical and signal characteristics under high temperature. ) is provided with sockets into which each is inserted.

The burn-in board 20 is mounted on the X-Y table 410 installed in the device sorting device, and the devices 10 that have completed the burn-in test are unloaded and the devices 10 are loaded.

The X-Y table 410 is configured to load the burn-in board 20 into which the elements 10 are inserted and at the same time unload the burn-in board 20 into which the elements 10 are inserted. , as shown in FIG. 1, a burn-in board exchange device (not shown) is used to receive a burn-in board 20 for replacing the element 10 or to discharge the burn-in board 20 on which the element 10 has been replaced. ) includes.

And the X-Y table 410 is an It is configured to move the burn-in board 20 by being driven by a driving unit (not shown).

The X-Y table driving unit operates the second transfer tool 540 and the first transfer tool 530 to facilitate the removal or loading of the elements 10 from the burn-in board 20. Various configurations are possible, such as X-Y movement or X-Y-θ movement of the X-Y table 410 on which the burn-in board 20 is loaded in conjunction with the tool 530.

That is, the The X-Y table 410 is moved to insert into the empty space of (20), and when the insertion of the elements 10 into the burn-in board 20 is completed, the .

Meanwhile, the (10) may include a top plate (not shown) formed with an opening (not shown) for removing or loading the burn-in board 20.

Additionally, a socket press 45 is installed on the upper side of the

The socket press 45 enables the extraction or loading of elements inserted into the socket of the burn-in board 20, and various configurations are possible depending on the socket structure of the burn-in board 20.

Meanwhile, the socket press 45 needs to vary depending on the external specifications of the element 10, so it is preferable to install it so that manual or automatic replacement is possible.

And on the upper part of the socket press 45, there is a vision for aligning the position of the burn-in board 20 for extraction and discharge of the element 10 by the first transfer tool 530 and the second transfer tool 540. Device 970 may be installed.

The loading unit 100 is configured to load trays 30 on which a plurality of devices 10 to be loaded on the burn-in board 20 are loaded, and various configurations are possible.

Meanwhile, the loading unit 100 is installed at the upper part of the tray 30 in the transport direction and inspects the tray cover, the tray 30 itself, the elements 10 contained in the tray 30, etc., and recognizes the QR code. A 2D scanner 960 may be installed.

In addition, the good product tray unit 200 is a component for loading and unloading good devices (hereinafter referred to as 'good products') among the devices 10 on the tray 30, and various configurations are possible.

The loading unit 100 and the non-defective tray unit 200 include a guide unit that guides the tray 30 to move, and a drive unit (not shown) for moving the tray 30, respectively, as in Patent Documents 1 to 3. It is generally composed including poetry).

Meanwhile, after the elements 10 are extracted from the tray 30 in the loading unit 100, the empty trays 30 are transferred by a tray transfer unit (not shown) set at the rear side of the device, as shown in FIG. 1. The elements 10 may be delivered to the good quality tray unit 200, the tray handling unit 900, etc. so that they can be loaded.

At this time, the elements 10 may remain in the tray 30, and the elements 10 remaining in the tray 30 may be removed before the tray 30 is transferred from the loading unit 100 to the non-defective tray unit 200. In order to remove the remaining elements 10 by rotating the tray 30, a tray rotation unit 150 may be additionally installed.

As shown in FIG. 1, the tray rotation unit 150 is installed on the transfer path (T2) of the tray 30 between the loading unit 100 and the non-defective tray unit 200, and is moved by the tray transfer unit to the loading unit. It is configured to receive the tray 30 from 100, rotate the tray 30, and then deliver the tray 30 to the good product tray unit 200.

The DC test unit 170 is installed between the loading unit 100 and the socket press 45 and receives the elements 10 to be tested from the loading unit 100 to perform a DC test. Various configurations are possible. do.

The DC test unit 170 can have various configurations, such as consisting of a plurality of sockets to which the elements 10 can be electrically connected, and preferably has the same number of sockets in the horizontal direction as the horizontal number of the trays 30. of sockets can be installed.

The test results for each element 10 of the DC test unit 170 are used as data for sorting in the DC tray unit 310, which will be described later.

Here, the element transfer from the tray 30 of the loading unit 100 to the DC test unit 170 is performed by the third transfer tool 510.

Meanwhile, the DC test unit 170 may include a plurality of test tray units 171 that are movably installed in parallel with the tray transport direction in the loading unit 100.

Specifically, the test tray unit 171 is composed of two or more pieces so that the device sorting position (DC2) and the device exchange position (DC1) can be sequentially moved.

And at the device exchange position DC1, the test tray unit 171 is moved from the tray 30 of the loading unit 100 by the third transfer tool 510 to the position drawn out by the second transfer tool 540. Elements 10 are loaded.

And after completing the loading of the elements 10 at the element exchange position (DC1), it is moved to the element sorting position (DC2), and the test tray unit 171 that has completed element sorting at the element sorting position (DC2) is moved to the element exchange position. As described above, the elements 10 are moved to (DC1) and loaded from the tray 30 of the loading unit 100 by the third transfer tool 510 in the position extracted by the second transfer tool 540. do.

Meanwhile, in the test tray unit 171 moved to the device sorting position DC2, the devices 10 that were inspected as unqualified in the DC test unit 170 by the fifth transfer tool 550 are transferred to the DC tray unit 310. Sorted and stacked.

Here, the DC tray unit 310 is a configuration in which the devices 10 that have been inspected as unqualified in the DC test unit 170 are classified and loaded, and is a tray used in the loading unit 100 and the non-defective tray unit 200 ( The same tray as in 30) is used.

Meanwhile, after being transferred from the test tray unit 171 moved to the device sorting position DC2 to the DC tray unit 310, the empty space is transferred to the second transfer tool 540 before being moved to the device exchange position DC1. It is preferable that the pickers are rearranged in the fifth transfer tool 550 to fill the arrangement of the pickers constituting the second transfer tool 540 to ensure smooth device extraction.

Meanwhile, the external specifications of the test tray unit 171 and the device 10 need to vary, so it is preferable that they are installed so that manual or automatic replacement is possible.

Additionally, the test tray unit 171 may be configured as shown in FIG. 3 of Patent Document 3 in reciprocating movement between the element sorting position DC2 and the element exchange position DC1.

In addition, the test tray unit 171 is a head exchange unit equipped with a plurality of pickup heads to enable automatic replacement of the pickup head of at least one picker of the second transfer tool 540 and the third transfer tool 510, which will be described later. Part 172 may be installed together.

The buffer unit 600 is a configuration in which the elements 10 to be sorted taken out from the burn-in board 20 on the X-Y table 410 are temporarily loaded, and various configurations are possible.

In particular, the buffer unit 600 is preferably installed similarly to the structure of the DC test unit 170 described above.

Here, the element transfer from the burn-in board 20 on the Transfer is performed by the fourth transfer tool 520.

Meanwhile, the buffer unit 600 may include a plurality of buffer tray units 610 that are movably installed parallel to the tray transport direction in the unloading unit 2100.

Specifically, the buffer tray unit 610 is composed of two or more pieces so that the device sorting position (S2) and the device unloading position (S1) can be sequentially moved.

And at the device unloading position (S1), the buffer tray unit 610 is transferred to the burn-in board 20 on the ) Elements 10 are loaded from ).

After completing the loading of the devices 10 at the device unloading position (S1), they are moved to the device sorting position (S2), and the buffer tray unit 610, which has completed device sorting at the device sorting position (S2), is placed in the device unloading position (S1). It is moved to the loading position (S1) and, as described above, the element 10 is transferred from the burn-in board 20 on the ) are loaded.

Meanwhile, in the buffer tray unit 610 moved to the device classification position (S2), the devices 10 that were inspected as unqualified in the burn-in test device, etc. by the sixth transfer tool 560 are sorted into the reject tray unit 320. It is loaded.

Here, the reject tray unit 320 is a configuration in which devices 10 that have been inspected as unqualified in a burn-in test device, etc. are sorted and loaded, that is, devices 10 excluding non-defective products are sorted and loaded in the buffer unit 600, The same tray as the tray 30 used in the loading unit 100 and the non-defective tray unit 200 is used.

Meanwhile, in the buffer tray unit 610 moved to the device sorting position (S2), after being transferred to the reject tray unit 320, the empty space is moved to the device unloading position (S1) before being moved to the fourth transfer tool ( It is preferable that the pickers are rearranged in the sixth transfer tool 560 to fill the arrangement of the pickers constituting the fourth transfer tool 520 to ensure smooth device extraction.

Meanwhile, since it needs to be changed depending on the external specifications of the buffer tray unit 610 and the device 10, it is preferable to install it so that manual or automatic replacement is possible.

Additionally, the buffer tray unit 610 may be configured as shown in FIG. 3 of Patent Document 3 in reciprocating movement between the device sorting position (S2) and the device unloading position (S1).

In addition, the buffer tray unit 610 is a head exchange unit equipped with a plurality of pickup heads to enable automatic replacement of the pickup head of at least one picker of the second transfer tool 530 and the fourth transfer tool 520, which will be described later. Unit 620 may be installed together.

Meanwhile, the DC tray unit 310 and the reject tray unit 320 are installed in plural numbers according to the number of classification grades preset at the front of the device, and are installed in the loading unit 100 and the non-defective tray unit 200. The tray 30 is arranged in a direction perpendicular to the transport direction.

And the DC tray unit 310 and the reject tray unit 320, together with one end of the loading unit 100 and the non-defective tray unit 200, can form a front tray transfer line T1.

Specifically, the reject tray unit 320 may be arranged with four classification trays according to four classification levels, and the DC tray unit 310 may be arranged with two classification trays according to two classification levels. .

In addition, a tray buffer unit 330 can be set between the DC tray unit 310 and the loading unit 100 for tray supply to the DC tray unit 310 and the reject tray unit 320, temporary storage of trays, etc. there is.

In addition, a rear tray transfer line (T2) can be formed along with the loading unit 100, the other end of the good product tray unit 200, and the tray rotation unit 150 at the rear of the device, opposite to the front tray transfer line (T1). .

The transfer tools (510, 520, 530, 540, 550, 560) are between the loading unit 100 and the DC test unit 170, between the buffer unit 600 and the good product tray unit 200, and the burn-in board 20. ) and the buffer unit 600, between the DC test unit 170 and the burn-in board 20, between the DC test unit 170 and the DC tray unit 310, the buffer unit 600 and the reject tray unit 320 ), and various configurations are possible depending on the arrangement of each component.

For example, the transfer tool is used between the third transfer tool 510, the buffer unit 600, and the non-defective tray unit 200 for element transfer between the loading unit 100 and the DC test unit 170. The fourth transfer tool 520 for element transfer, the first transfer tool 530 for element transfer between the burn-in board 20 and the buffer unit 600, the DC test unit 170, and the burn-in board 20 ) a second transfer tool 540 for element transfer between the DC test unit 170 and the DC tray unit 310, a fifth transfer tool 550 for element transfer between the DC test unit 170 and the DC tray unit 310, and a buffer unit 600. And it may include a sixth transfer tool 560 for transferring elements between the reject tray units 320.

In addition, the first transfer tool 530 withdraws the device 10 from the burn-in board 20 and transfers it to the buffer unit 600, and the second transfer tool 540 transfers the device 10 from the DC test unit 170. (10) is pulled out and inserted into the empty spot of the burn-in board (20) pulled out by the first transfer tool (530).

Meanwhile, the arrangement of the elements 10 loaded on the burn-in board 20 is different from the arrangement of the elements 10 loaded on the tray 30 such as the loading unit 100, and the arrangement on the burn-in board 20 is different. Relatively many.

Accordingly, the first transfer tool 530 and the second transfer tool 540, which transfer or withdraw the elements 10 to the burn-in board 20, transfer a relatively large number of elements 10 compared to the remaining transfer tools. It is desirable to be configured. For example, the first transfer tool 530 and the second transfer tool 540 can be 5 × 2, and the remaining transfer tools can be 4 × 1, etc.

When the transfer tools are configured as described above, the transfer tool is used to transfer a small number of elements 10 in locations that require a relatively small number of transfers, except for positions that require transfer of a relatively large number of elements 10. This makes it possible to reduce the manufacturing cost of the device and improve the size and stability of the device.

Meanwhile, the first transfer tool 530 and the second transfer tool 540 may be configured to move integrally with each other, considering that loading and unloading of the device 10 on the burn-in board 20 is performed alternately.

In addition, the horizontal number of pickers of the first transfer tool 530 and the second transfer tool 540 is determined in the first transfer buffer 600 and the second transfer buffer 700 in consideration of the efficiency of the device 10. It may be configured to be equal to the number of device receiving grooves (not shown) in the horizontal direction for loading the device 10.

Meanwhile, the third transfer tool 510 and the fourth transfer tool 520 are used in consideration of transporting the elements 10 in correspondence with the second transfer tool 540 and the first transfer tool 530, respectively. It is preferable that the horizontal number of pickers of the second transfer tool 540 and the first transfer tool 530 are configured to be the same.

Meanwhile, it is common for the pitch between the elements 10 on the burn-in board 20 and the pitch between the elements 10 on the tray 30 to be different (double, etc.). For this purpose, the “first transfer tool” (530) and the second transfer tool 540", and the "third transfer tool 510 and the fourth transfer tool 520", the pitch between the elements 10 picked up by the pickers is It is desirable to configure it to be variable.

The fifth transfer tool 550 moves between the DC test unit 170 and the DC tray unit 310 and moves the DC devices 10 contained in the test tray 171 located at the device sorting position DC2. The device 10 that is inspected as defective in the test unit 170 may be transferred to be loaded on a tray designated as DC defective among the trays arranged in the DC tray unit 310.

The sixth transfer tool 560 transfers good quality elements among the elements 10 contained in the buffer tray unit 610, which transfers the elements 10 between the buffer unit 600 and the reject tray 320. Depending on the excluded classification level, the device 10 can be transferred to be loaded on a tray among the trays arranged in the reject tray 320 according to the classification level.

As described above, if the device is composed of the fifth transfer tool 550 and the sixth transfer tool 560 for device sorting, more rapid device classification can be achieved.

Meanwhile, the transfer tools may be configured to include one or more pickers each having an adsorption head for adsorbing the element 10 by vacuum pressure at the end, and a picker transfer device for moving the picker in the X-Z, Y-Z or X-Y-Z directions. .

In particular, the pickers of the transfer tools may be arranged in a row or in a double row, such as 5×2 or 4×2.

Meanwhile, as shown in FIG. 1, the device sorting device according to the present invention includes a board loader 800 installed on one side to continuously receive burn-in boards 20.

The board loader 800 is configured to load the burn-in boards 20 into which the elements 10 are inserted and sequentially load the burn-in boards 20 into which the elements 10 are inserted and transfer them to the burn-in test. That is, it is a configuration for continuously exchanging the

Meanwhile, the board loader 800 is preferably installed adjacent to the loading unit 100.

In particular, when the board loader 800 is installed adjacent to the loading unit 100, when the direction perpendicular to the tray transfer direction in the loading unit 100 is called the Y-axis, it moves in the X-axis direction with respect to the loading unit 100. Combination is preferred.

At this time, by combining the board loader 800 as described above, the rack 50 loaded with the burn-in boards 20 can be introduced or discharged into the X-axis direction on the right side of the device, especially adjacent to the loading unit 100. there is.

Additionally, a 2D scanner 950 for recognizing a QR code or the like for the burn-in board 20 may be installed between the board loader 800 and the loading unit 100 or in the board loader 800.

In particular, the 2D scanner 950 is used between the board loader 800 and the loading unit 100 to enable recognition of QR codes, etc. during the transfer process of the burn-in board 20 between the board loader 800 and the X-Y table 410. It is desirable to install it in .

Meanwhile, in response to the arrangement of the board loader 800 as described above, a tray handling unit 900 for introducing and discharging the tray 30 may be additionally installed adjacent to the good product tray unit 200.

Here, the tray handling unit 900 is preferably installed adjacent to the good product tray unit 200 in the X-axis direction perpendicular to the tray transport direction (Y-axis direction) in the good product tray unit 200.

In relation to the arrangement of the tray handling unit 900, the device sorting device as a whole includes a tray handling unit 900, a good product tray unit 200, a buffer unit 600, a socket press 45, and a DC test unit. (170), the loading unit 100, and the board loader 800 are preferably arranged sequentially.

The tray handling unit 900 is preferably configured so that a single tray or a plurality of trays stacked up and down can be transferred along the front tray transfer line (T1) and the rear tray transfer line (T2) described above.

Here, tray transfer along the front tray transfer line (T1) is performed by the first tray transfer unit (not shown), and tray transfer along the rear tray transfer line (T2) is performed by the second tray transfer unit (not shown). It is carried out by.

Meanwhile, in the tray handling unit 900, a tray exchange unit 910 for supplying and discharging trays by workers, etc. may be set at either one end or the other end of the tray transport direction in the non-defective tray unit 200.

Here, the supply and discharge of the tray to the device is located in an opposite position to the supply and discharge of the burn-in board of the previously described board loader 800, thereby providing external logistics for the supply and discharge of the burn-in board 20 and the tray 30. The line can be managed effectively.

Meanwhile, the tray handling unit 900 may be equipped with a tray transfer unit 920 for tray transfer (transfer in the Y-axis direction) between the front tray transfer line (T1) and the rear tray transfer line (T2).

The tray transfer unit 920 is a component for transferring trays between the front tray transfer line (T1) and the rear tray transfer line (T2) and can be configured in various ways, such as a conveyor belt.

As shown in FIGS. 3 to 9, the device sorting device according to the second embodiment of the present invention includes a loading unit 100 on which a tray 30 loaded with devices 10 to be inspected is loaded; a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test; an X-Y table 410 that moves the burn-in board 20 in the an unloading unit 300 in which the devices 10 to be classified, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the classification criteria according to preset classification criteria; The tray 30 is installed to be movable to a loading position on the upper side of the DC test unit 170 and an avoidance position away from the loading position, so that the elements 10 that are tested as defective as a result of the DC test of the DC test unit 170 are temporarily stored. A first buffer tray unit 610 loaded with; Among the elements 10 to be classified that are located between the extraction position of the element 10 with respect to the burn-in board 20 and the unloading unit 300 and are extracted from the burn-in board 20, elements to be classified into a classification grade other than good products. (10) includes a second buffer tray unit 620 on which it is temporarily loaded.

Here, components not shown in FIG. 3 are given the same reference numerals as in FIG. 1 for convenience of explanation, and descriptions of some of the same or similar components are omitted for convenience.

The burn-in board 20 refers to a board on which elements 10 are loaded so that they can undergo a burn-in test in a burn-in test device (not shown), and the elements 10 can be tested for electrical and signal characteristics under high temperature. ) is provided with sockets into which each is inserted.

The burn-in board 20 is mounted on the X-Y table 410 installed in the device sorting device, and the devices 10 that have completed the burn-in test are unloaded and the devices 10 are loaded.

The X-Y table 410 is configured to load the burn-in board 20 into which the elements 10 are inserted and at the same time unload the burn-in board 20 into which the elements 10 are inserted. , as shown in FIG. 1, a burn-in board exchange device (not shown) is used to receive a burn-in board 20 for replacing the element 10 or to discharge the burn-in board 20 on which the element 10 has been replaced. ) includes.

And the X-Y table 410 is driven by an It is configured to move the burn-in board 20.

The X-Y table driving unit includes a remove transfer tool 530 and an insert transfer tool ( 520), various configurations are possible, such as X-Y movement or X-Y-θ movement of the X-Y table 410 on which the burn-in board 20 is loaded.

That is, the When the X-Y table 410 is moved to insert into the empty space of the burn-in board 20 and the insertion of the elements 10 into the burn-in board 20 is completed, the X-Y table 410 can be moved to the burn-in board exchange position.

Meanwhile, the 520) may include a top plate (not shown) with an opening (not shown; hereinafter referred to as a 'pull-out position' or 'loading position') for extracting or loading the elements 10 from the burn-in board 20.

Additionally, a socket press 45 is installed on the upper side of the

The socket press 45 enables the extraction or loading of elements inserted into the socket of the burn-in board 20, and various configurations are possible depending on the socket structure of the burn-in board 20.

Meanwhile, the socket press 45 needs to be changed depending on the external specifications of the element 10, and can be operated manually or automatically with other types of socket presses 45 loaded on the replacement parts loading unit 680 shown in FIG. 5. It is desirable to install it so that it can be replaced (see the process of FIGS. 5 to 9).

And at the top of the socket press 45, there is a vision device for aligning the position of the burn-in board 20 for extraction and discharge of the element 10 by the remove transfer tool 530 and the insert transfer tool 520. (970) can be installed.

The loading unit 100 is configured to load trays 30 on which a plurality of devices 10 to be loaded on the burn-in board 20 are loaded, and various configurations are possible.

Meanwhile, the loading unit 100 is installed at the upper part of the tray 30 in the transport direction and inspects the tray cover, the tray 30 itself, the elements 10 contained in the tray 30, etc., and recognizes the QR code. A 2D scanner 960 may be installed.

The loading unit 100 and the unloading unit 300 are, as in Patent Documents 1 to 3, a guide unit that guides the tray 30 to move in the Y-axis direction, and a guide unit for moving the tray 30. It is generally configured to include a driving unit (not shown).

Here, when the extraction position of the element 10 with respect to the burn-in board 20 and the arrangement direction of the unloading unit 300 are taken as the X-axis, the horizontal direction perpendicular to the X-axis is defined as the Y-axis.

In addition, the unloading unit 300 is a configuration for loading the elements 10 to be classified, taken out from the burn-in board 20, into the tray 30 corresponding to the classification criteria according to preset classification criteria, and has various configurations. This is possible.

For example, as shown in FIG. 3, the unloading unit 300 includes a good product tray unit 301 where a tray 30 on which devices 10 to be classified as good products are loaded; a DC tray unit 302 where a tray 30 is placed on which devices 10 that were tested as defective as a result of the inspection by the DC test unit 170 are loaded; The burn-in board 20 may include one or more reject trays 303 and 304 on which a tray 30 is placed, on which elements 10 to be classified into each classification grade are loaded, corresponding to the number of classification grades other than good products. You can.

The non-defective tray unit 301 is a configuration in which the tray 30 on which devices 10 to be classified as non-defective products are loaded, and can have various configurations, such as being configured similarly to the loading unit 100.

The DC tray unit 302 is a configuration in which the tray 30 is placed on which devices 10 that have been tested as defective as a result of the inspection by the DC test unit 170 are loaded, and is configured similarly to the loading unit 100. Various configurations are possible.

The reject tray units 303 and 304 are configured to position a tray 30 on which elements 10 to be classified into each classification grade correspond to the number of classification grades other than non-defective products on the burn-in board 20. , various configurations are possible, such as being configured similarly to the loading unit 100.

Here, the number of reject trays 303 and 304 may be determined according to the number of classification levels.

Meanwhile, the good product tray unit 301, DC tray unit 302, and reject tray units 303 and 304 are each a guide unit that guides the tray 30 to move in the Y-axis direction, and the tray 30 Various configurations are possible, such as including a driving part for moving along the guide part.

Meanwhile, after the elements 10 are extracted from the tray 30 in the loading unit 100, the empty trays 30 are transferred to the tray transfer unit 670 (see FIG. 5) set at the rear side of the device, as shown in FIG. 1. ) can be delivered to the unloading unit 300, the tray handling unit 900, etc.

At this time, the elements 10 may remain in the tray 30, and the elements 10 remaining in the tray 30 may be removed before the tray 30 is transferred from the loading unit 100 to the non-defective tray unit 200. In order to remove the remaining elements 10 by rotating the tray 30, a tray rotation unit 150 may be additionally installed.

As shown in FIGS. 1 and 3, the tray rotation unit 150 is installed on the transfer path (T2) of the tray 30 between the loading unit 100 and the unloading unit 300 and is connected to the tray transfer unit ( It is configured to receive the tray 30 from the loading unit 100 by 670, rotate the tray 30, and then deliver the tray 30 to the unloading unit 300.

Meanwhile, opposite to the front tray transfer line (T1), a rear tray transfer line (T2) can be formed at the rear of the device together with the other ends of the loading unit 100 and unloading unit 300 and the tray rotation unit 150. .

The DC test unit 170 is installed between the loading unit 100 and the socket press 45 and receives the elements 10 to be tested from the loading unit 100 to perform a DC test. Various configurations are possible. do.

The DC test unit 170 can have various configurations, such as consisting of a plurality of sockets to which the elements 10 can be electrically connected, and preferably has the same number of sockets in the horizontal direction as the horizontal number of the trays 30. of sockets can be installed.

The test results for each element 10 of the DC test unit 170 are used as data for sorting by the sorting transfer tool 550, which will be described later.

Here, the element transfer from the tray 30 of the loading unit 100 to the DC test unit 170 is performed by the loading transfer tool 510.

Meanwhile, if the external specifications, such as the size of the device 10 to be handled, change, the test socket constituting the DC test unit 170 needs to be replaced.

Accordingly, as in the replacement process of the socket press 45 described above, it is installed to enable automatic replacement with other types of test sockets loaded in the replacement parts loading unit 680 shown in FIGS. 5, 8, and 9, which will be described later. desirable.

Here, in order to smoothly replace the test socket of the DC test unit 170, it is preferable that the test socket of the DC test unit 170 be installed to be movable in the Y-axis direction.

The first buffer tray unit 610 is installed so that the tray 30 can be moved to a loading position on the upper side of the DC test unit 170 and an avoidance position away from the loading position, so that the DC test unit 170 can perform a DC test. Various configurations are possible as a configuration in which devices 10 that have been tested as defective are temporarily loaded.

For example, the first buffer tray unit 610, like the loading unit 100, may be installed so that the tray 30 can move in the X-axis direction.

In addition, the part directly above the DC test unit 170 can be set as a loading position, and the front and rear in the X-axis direction based on the part directly above the DC test unit 170 can be set as an avoidance position.

In addition, in order to smoothly transfer the elements 10 that are tested as defective as a result of the DC test in the DC test unit 170, two or more trays 30 may be configured to be transferred, and the movement path is vertical to prevent interference during movement. can be placed.

That is, the first buffer tray unit 610 has two or more moving sections up and down in which the tray 30 moves back and forth in the Y-axis direction between the loading position and the moving section of the sorting transfer tool 550. desirable.

Meanwhile, the process of transferring the element 10 between the DC test unit 170 and the first buffer tray unit 610 can be performed in various ways for smooth operation of the handler.

As an example, if the device is transferred to the DC test unit 170 by the loading transfer tool 510 and all DC test results are determined to be good products, it is directly transferred to the burn-in board 40 by the insert transfer tool 520. do.

Meanwhile, if there are some elements 10 that were tested as defective as a result of the DC test, all elements 10 loaded in the DC test unit 170 are pulled out by the loading and transfer tool 510 and then transferred to the first buffer tray unit ( All are loaded onto the tray 30 (610).

And when all the elements 10 are loaded on the tray 30 of the first buffer tray 610, the tray 30 is moved onto the transfer path of the sorting transfer tool 550. At this time, when the tray 30 is moved on the transfer path of the sorting transfer tool 550, another tray 30 receives the element 10 that was inspected as defective as a result of the DC test.

Meanwhile, in the tray 30 moved on the transfer path of the sorting transfer tool 550, all the elements 10 that were inspected as defective as a result of the DC test, excluding the elements 10 judged to be good products, were all removed by the sorting transfer tool 550. They are delivered to the DC tray unit 302, and only good quality devices 10 remain on the tray 30.

Meanwhile, the tray 30 from which all elements 10 inspected as defective have been removed is moved back to the loading position and then transferred to the burn-in board 40 by the insert transfer tool 520.

In addition, the tray 30 needs to be replaced according to the external specifications of the element 10, and similarly to the replacement process of the DC test unit 170, the replacement parts loading unit 680 shown in FIGS. 5 to 7, which will be described later, is replaced. It is desirable to install it so that it can be automatically replaced with other types of trays loaded.

The second buffer tray unit 620 is located between the extraction position of the elements 10 with respect to the burn-in board 20 and the unloading unit 300 to store the elements 10 to be sorted extracted from the burn-in board 20. Among these, various configurations are possible as a configuration in which the element 10 to be classified as a classification other than a good product is temporarily loaded.

For example, the second buffer tray unit 620, like the loading unit 100, may be installed so that the tray 30 can move in the X-axis direction.

And the transfer path of the element 10 from the burn-in board 40 to the unloading unit 300, that is, the loading position located on the moving path of the remove transfer tool 530, and the X-axis direction based on the loading position. The front and rear can be used as avoidance positions.

In addition, two or more trays 30 may be configured to be transferred in order to smoothly transfer the elements 10 classified into classification grades other than good products among the elements 10 pulled out from the burn-in board 40. Movement paths may be arranged up and down for interference.

That is, the second buff tray unit 610 has two or more moving sections set up and down in which the tray 30 reciprocates in the Y-axis direction between the loading position and the moving section of the remove transfer tool 530. It is desirable.

Meanwhile, the process of transferring the device 10 between the burn-in board 40 and the second buffer tray unit 620 can be performed in various ways for smooth operation of the handler.

As an example, among the elements 10 extracted from the burn-in board 40 by the remove transfer tool 530, there are some elements 10 classified into a classification level other than good products. All elements 10 picked up by the remove transfer tool 530 are loaded onto the tray 30 of the second buffer tray unit 620.

And when all the elements 10 are loaded on the tray 30 of the second buffer tray unit 620, the tray 30 is moved onto the transfer path of the sorting transfer tool 550.

And according to the classification level of the device 10, all of them are transferred to the unloading unit 300 by the sorting transfer tool 550. At this time, when the tray 30 is moved on the transfer path of the sorting transfer tool 550, among the elements 10 extracted from the burn-in board 40, elements classified into a classification grade other than good products ( If some 10) are present, all elements 10 picked up by the remove transfer tool 530 are transferred.

Meanwhile, when all the elements 10 are removed from the tray 30 of the second buffer tray unit 620, the tray 30 is moved back to the loading position.

In addition, the tray 30 needs to be replaced according to the external specifications of the device 10. Similar to the replacement process of the tray 30 of the second buffer tray unit 620, the replacement shown in FIGS. 5 to 7 described later is performed. It is desirable to install it so that it can be automatically replaced with other types of trays loaded in the parts loading unit 680.

Meanwhile, the elements 10 have various structures for smooth transfer of the elements 10, and a plurality of transfer tools can be arranged in various ways.

As an example, as shown in FIG. 4, the transfer tools are installed to be reciprocatable in the X-axis direction between the loading unit 100 and the DC test unit 170 to transfer a plurality of elements ( 10) a loading transfer tool 510 that transfers them to the DC test unit 170; A plurality of elements 10 are installed to be reciprocatable in the an insert transfer tool 520 for loading them onto the burn-in board 20; The tray 30 of the second buffer tray 620 is installed to be reciprocatable between the extraction position of the device 10 relative to the burn-in board 20 and the second buffer tray 620. ) and a remove transfer tool 530 that transfers the elements 10 to; An unloading transfer tool installed between the second buffer tray unit 620 and the unloading unit 300 to transfer the devices 10 to be classified as good products from the second buffer tray unit 620 to the unloading unit 300. It may include (540).

As another example, the transfer tools are installed to be reciprocatable in the A loading transfer tool 510 delivered to 170); A plurality of elements 10 are installed to be reciprocatable in the an insert transfer tool 520 for loading them onto the burn-in board 20; The extraction position of the element 10 with respect to the burn-in board 20 is installed to be movable back and forth along the second buffer tray unit 620 and the unloading unit 300, and the element 10 picked up from the burn-in board 20 ) are all non-defective products, the devices 10 are delivered to the non-defective tray unit 301, and if the devices 10 picked up from the burn-in board 20 include devices 10 of a classification level other than non-defective products, the second It may include a remove transfer tool 530 that transfers the elements 10 to the tray 30 of the buffer tray unit 620.

In addition, the remove transfer tool 530 withdraws the element 10 from the burn-in board 20 and transfers it to the tray 30 of the unloading unit 300 and/or the second buffer tray unit 620, The insert transfer tool 520 can withdraw the element 10 from the DC test unit 170 and insert it into the empty spot of the burn-in board 20 drawn out by the remove transfer tool 530.

Meanwhile, the arrangement of the elements 10 loaded on the burn-in board 20 is different from the arrangement of the elements 10 loaded on the tray 30 such as the loading unit 100, and the arrangement on the burn-in board 20 is different. Relatively many.

Therefore, the remove transfer tool 530 and the insert transfer tool 520, which transfer or withdraw the elements 10 to the burn-in board 20, are configured to transfer a relatively large number of elements 10 compared to the remaining transfer tools. This is desirable. For example, the remove transfer tool 530 and the insert transfer tool 520 may be 5×2, and the remaining transfer tools may be 5×1.

When the transfer tools are configured as described above, the transfer tool is used to transfer a small number of elements 10 in locations that require a relatively small number of transfers, except for positions that require transfer of a relatively large number of elements 10. This makes it possible to reduce the manufacturing cost of the device and improve the size and stability of the device.

The horizontal number of pickers of the remove transfer tool 530 and the insert transfer tool 520 is determined in the first buffer tray unit 610 and the second buffer tray unit 620 in consideration of the efficiency of the device 10. It may be configured to be equal to the number of device receiving grooves (not shown) in the horizontal direction for loading the device 10.

Meanwhile, the loading transfer tool 510 and the unloading transfer tool 540 are insert transfer tools considering that they transfer the elements 10 in correspondence with the insert transfer tool 520 and the remove transfer tool 530, respectively. It is preferable that the horizontal number of pickers of the pickers 520 and the remove transfer tool 530 are configured to be the same.

Meanwhile, it is common for the pitch between the elements 10 on the burn-in board 20 and the pitch between the elements 10 on the tray 30 to be different (double, etc.). For this purpose, the “insert transfer tool ( 520) and the remove transfer tool 530", and either the "loading transfer tool 510 and the unloading transfer tool 540" so that the pitch between the elements 10 picked up by the pickers is variable. It is desirable to be configured.

Meanwhile, the first buffer tray unit 610 and the unloading unit 300 are located at a position spaced apart from the reciprocating movement line of the loading transfer tool 510, the insert transfer tool 520, and the limb transfer tool 530 in the Y-axis direction. ), and among the elements 10 loaded on the tray 30 of the first buffer tray 610, the element 10 was inspected as defective as a result of the DC test of the DC test unit 170. They are delivered to the DC tray unit 302, and the elements 10 loaded on the tray 30 of the second buff tray unit 610 are transferred to the good product tray unit 301, the reject tray unit 303, and the good product tray unit 301 according to the classification level. Among the 304), a sorting transfer tool 550 is installed to deliver to the corresponding tray 30.

The sorting transfer tool 550 selects the elements 10 that are tested as defective as a result of the DC test of the DC test unit 170 among the elements 10 loaded on the tray 30 of the first buffer tray 610. It is delivered to the DC tray unit 302, and the elements 10 loaded on the tray 30 of the second buff tray unit 610 are transferred to the good product tray unit 301 and the reject tray unit 303, 304 according to the classification level. ), various configurations are possible as a configuration for delivering to the corresponding tray 30.

Meanwhile, the transfer tools may be configured to include one or more pickers each having an adsorption head for adsorbing the element 10 by vacuum pressure at the end, and a picker transfer device for moving the picker in the X-Z, Y-Z or X-Y-Z directions. .

In particular, the pickers of the transfer tools may be arranged in a row or in a double row, such as 5×2 or 4×2.

Meanwhile, as shown in FIG. 3, the device sorting device according to the present invention includes a board loader 800 installed on one side to continuously receive burn-in boards 20.

The board loader 800 is configured to load the burn-in boards 20 into which the elements 10 are inserted and sequentially load the burn-in boards 20 into which the elements 10 are inserted and transfer them to the burn-in test. That is, it is a configuration for continuously exchanging the

Meanwhile, the board loader 800 is preferably installed adjacent to the loading unit 100.

In particular, when the board loader 800 is installed adjacent to the loading unit 100, when the direction perpendicular to the tray transfer direction in the loading unit 100 is called the Y-axis, it moves in the X-axis direction with respect to the loading unit 100. Combination is preferred.

At this time, by combining the board loader 800 as described above, the rack 50 loaded with the burn-in boards 20 can be introduced or discharged into the X-axis direction on the right side of the device, especially adjacent to the loading unit 100. there is.

Additionally, a 2D scanner 950 for recognizing a QR code or the like for the burn-in board 20 may be installed between the board loader 800 and the loading unit 100 or in the board loader 800.

In particular, the 2D scanner 950 is used between the board loader 800 and the loading unit 100 to enable recognition of QR codes, etc. during the transfer process of the burn-in board 20 between the board loader 800 and the X-Y table 410. It is desirable to install it in .

Meanwhile, in response to the arrangement of the board loader 800 as described above, a tray handling unit 900 for introducing and discharging the tray 30 may be additionally installed adjacent to the good product tray unit 200.

Here, the tray handling unit 900 is preferably installed adjacent to the good product tray unit 200 in the X-axis direction perpendicular to the tray transport direction (Y-axis direction) in the good product tray unit 200.

In relation to the arrangement of the tray handling unit 900, the device sorting device as a whole includes a tray handling unit 900, a good product tray unit 200, a buffer unit 600, a socket press 45, and a DC test unit. (170), the loading unit 100, and the board loader 800 are preferably arranged sequentially.

The tray handling unit 900 is preferably configured so that a single tray or a plurality of trays stacked up and down can be transferred along the front tray transfer line (T1) and the rear tray transfer line (T2) described above.

Here, tray transfer along the front tray transfer line (T1) is performed by the first tray transfer unit (not shown), and tray transfer along the rear tray transfer line (T2) is performed by the second tray transfer unit (not shown). It is carried out by.

Meanwhile, the device 10 to be handled generally has a rectangular planar shape, and its external dimensions such as horizontal and vertical length may vary depending on the type of device.

At this time, if the external specifications of the element 10 to be handled are different, the tray 30 of the loading unit 100 and the tray 30 of the unloading unit 300 automatically correspond to the external specifications according to the external tray supply. can be replaced

However, in the case of the socket press 45 on the burn-in board 40, the test socket of the DC test unit 170, etc., they are manually replaced by the operator after the device has stopped operating, which causes a problem in that the operating efficiency of the device is reduced. .

Accordingly, in order to replace the socket press 45 on the burn-in board 40 and the test socket of the DC test unit 170, two or more types of socket press 45 on the burn-in board 40 and the DC test unit 170 are used. A replacement parts loading unit 680 where test sockets, etc. are loaded may be additionally installed.

The replacement parts loading unit 680 can have various structures and be located at appropriate positions for smooth replacement of parts.

For example, the replacement parts loading unit 680 includes the socket press 45 on two or more types of burn-in boards 40, the test socket of the DC test unit 170, and the tray 30 of the first buffer tray unit 610. ), the tray 30 of the second buffer tray unit 610 can be loaded.

And the replacement parts loading unit 680 includes socket presses 45 on two or more types of burn-in boards 40, test sockets of two types of DC test units 170, and two or more types of first buffer tray units 610. A tray 30, a stacking support part (681) on which the trays 30 of two or more types of second buffer tray parts 610 are loaded, and the stacking support part (681) is spaced above the DC test part 170. Preferably, it may include a base support part 682 supporting both sides of the loading support part 681.

By this replacement parts loading unit 680, the socket press 45 on the burn-in board 40, the test socket of the DC test unit 170, and the first buffer tray unit ( The tray 30 of 610 and the tray 30 of the second buffer tray unit 610 can be automatically replaced.

In addition, the replacement parts loading unit 680 may further include a wall unit 683 to support each part on the opposite side toward the tray transfer unit 670.

In addition, the replacement parts loading unit 680 may be provided with bottom supports 671, 672, and 673 that support the bottom of each part for replacement and independent support of each part.

Meanwhile, the replacement parts loading unit 680 may be installed on the rear side of the device, for example, near the transfer path T2 of the tray 30 in order to increase space utilization of the device.

And the parts loaded on the replacement parts loading unit 680 can be transferred by the tray transfer unit 670 that moves along the transfer path T2 of the tray 30.

For example, the parts loaded in the replacement parts loading unit 680 are moved to the tray 30 of the tray transfer unit 670 by a pusher (not shown), a gripper (not shown), etc., as shown in FIGS. 5 to 9. ), is moved to the transfer path (T2), is gripped by the tray transfer unit 670, is moved downward, and then can be moved to the replacement position of each part.

Meanwhile, the replacement parts loading unit 680 can be transferred to the tray transfer unit 670 by a separately installed pusher, gripper, etc.

In addition, since the tray transfer unit 670 is configured to transport the standardized tray 30, the replacement parts loaded in the replacement parts loading unit 680 preferably have a structure that allows transfer by the tray transfer unit 670. do.

Since the above is only a description of some of the preferred embodiments that can be implemented by the present invention, as is well known, the scope of the present invention should not be construed as limited to the above embodiments, and the scope of the present invention described above Both the technical idea and the technical idea underlying it will be said to be included in the scope of the present invention.

10: element 20: burn-in board 30: tray
100: loading unit 200: unloading unit
310: first sorting unit 320: second sorting unit

Claims (14)

a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded;
a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test;
An XY table 410 that moves the burn-in board 20 in the ;
a buffer unit 600 in which the elements 10 to be sorted taken out from the burn-in board 20 are temporarily loaded;
a good product tray unit 200 in which non-defective devices to be sorted (10) among the devices to be sorted (10) loaded in the buffer unit (600) are loaded on a tray (30);
a DC tray unit 310 in which the devices 10 tested as unqualified in the DC test unit 170 are sorted and loaded;
An element sorting device comprising a reject tray 320 that sorts and loads the elements 10 excluding non-defective products in the buffer unit 600. a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded;
a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test;
An XY table 410 that moves the burn-in board 20 in the ;
an unloading unit 300 in which the elements 10 to be sorted, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the sorting criteria according to preset classification criteria;
The tray 30 is installed to be movable to a loading position on the upper side of the DC test unit 170 and an avoidance position spaced horizontally from the loading position, so that the DC test unit 170 is placed on the tray 30. a first buffer tray unit 610 on which devices 10 that were found to be defective as a result of the test are temporarily loaded;
Among the elements 10 to be classified that are located between the extraction position of the element 10 with respect to the burn-in board 20 and the unloading unit 300 and are extracted from the burn-in board 20, they are classified into a classification grade other than good products. An element sorting device comprising a second buffer tray unit 620 on which elements to be sorted (10) are temporarily loaded. In claim 2,
The loading unit 100, the extraction position of the element 10 with respect to the burn-in board 20, and the arrangement direction of the unloading unit 300 are referred to as the X-axis, and the direction horizontally perpendicular to the When you say,
The loading unit 100 is an element sorting device characterized in that it includes a guide unit that guides the tray 30 so that it can be moved in the Y-axis direction, and a drive unit that moves the tray 30 along the guide unit. . In claim 3,
The unloading unit 300,
a good product tray unit 301 where a tray 30 on which devices 10 to be classified as good products are loaded;
a DC tray unit 302 where a tray 30 is placed on which devices 10 that were tested as defective as a result of the DC test unit 170 are loaded;
The burn-in board 20 includes one or more reject trays 303 and 304 on which a tray 30 is placed, on which elements 10 to be classified into each classification grade are loaded, corresponding to the number of classification grades other than good products. An element sorting device characterized in that: In claim 4,
The good product tray unit 301, the DC tray unit 302, and the reject tray units 303 and 304, respectively.
An element sorting device comprising a guide part for guiding the tray 30 to move in the Y-axis direction, and a driving part for moving the tray 30 along the guide part. In claim 4,
It is installed to be reciprocatable in the Loading transfer tool 510;
A plurality of devices installed to be reciprocatable in the an insert transfer tool 520 for loading (10) onto the burn-in board 20;
It is installed to be movable back and forth between the extraction position of the element 10 with respect to the burn-in board 20 and the second buffer tray unit 620, so that the second buffer tray unit 620 is transferred from the burn-in board 20. A remove transfer tool 530 that transfers the elements 10 to the tray 30 of;
It is installed between the second buffer tray unit 620 and the unloading unit 300 to transfer devices 10 to be classified as good products from the second buffer tray unit 620 to the unloading unit 300. An element sorting device comprising an unloading transfer tool (540). In claim 4,
It is installed to be reciprocatable in the Loading transfer tool 510;
A plurality of devices installed to be reciprocatable in the an insert transfer tool 520 for loading (10) onto the burn-in board 20;
It is installed to be movable back and forth along the withdrawal position of the element 10 with respect to the burn-in board 20, the second buffer tray unit 620, and the unloading unit 300, and is picked up from the burn-in board 20. If all the devices 10 are good products, the devices 10 are delivered to the good product tray 301, and among the devices 10 picked up from the burn-in board 20, devices 10 of a classification level other than good products are selected. An element sorting device comprising a remove transfer tool 530 that transfers the elements 10 to the tray 30 of the second buffer tray 620. In claim 6 or claim 7,
The first buffer tray unit 610 and the unloading at a position spaced apart from the reciprocating movement line of the loading transfer tool 510, the insert transfer tool 520, and the limb unit transfer tool 530 in the Y-axis direction. It is installed to move linearly between parts 300,
Among the devices 10 loaded on the tray 30 of the first buffer tray 610, the devices 10 that were tested as defective as a result of the DC test of the DC test unit 170 were placed in the DC tray unit 302. Delivered to,
The elements 10 loaded on the tray 30 of the second buff tray unit 610 are placed in the corresponding tray among the good product tray unit 301 and the reject tray units 303 and 304 according to the classification level. An element sorting device comprising a sorting transfer tool 550 that is transmitted to 30). In claim 8,
The first buffer tray unit 610,
An element sorting device, characterized in that two or more moving sections are set up and down in which the tray (30) reciprocates in the Y-axis direction between the loading position and the moving section of the sorting transfer tool (550). In claim 9,
The second buff tray unit 610,
An element sorting device, characterized in that two or more moving sections are set up and down in which the tray (30) reciprocates in the Y-axis direction between the loading position and the moving section of the remove transfer tool (530). The method of any one of claims 1 to 7,
Socket press 45 on two or more types of burn-in boards 40, test sockets of two types of DC test units 170, trays 30 of two or more types of first buffer tray units 610, and two or more types of second buffers A stacking support part (681) on which the tray 30 of the tray part 610 is loaded, and both sides of the stacking support part (681) so that the stacking support part (681) is spaced apart from the upper side of the DC test part 170. It includes a replacement parts loading unit 680 including a supporting base support unit 682,
According to the external specifications of the device 10, the socket press 45 on the burn-in board 40, the test socket of the DC test unit 170, the tray 30 of the first buffer tray unit 610, and the A device sorting device characterized in that the tray 30 of the second buffer tray unit 610 is automatically replaced. In claim 11,
The socket press 45 on the burn-in board 40, the test socket of the DC test unit 170, the tray 30 of the first buffer tray unit 610, and the tray of the second buffer tray unit 610. (30) is from the replacement parts loading unit 680 by a tray transfer unit 670 installed to transfer the tray 30 of the loading unit 100 and the tray 30 of the unloading unit 300. An element sorting device characterized by being withdrawn or loaded. a loading unit 100 on which a tray 30 loaded with elements 10 to be inspected is loaded;
a DC test unit 170 that receives the elements 10 to be tested from the loading unit 100 and performs a DC test;
An XY table 410 that moves the burn-in board 20 in the ;
an unloading unit 300 in which the elements 10 to be sorted, taken out from the burn-in board 20, are loaded on a tray 30 corresponding to the sorting criteria according to preset classification criteria;
A socket press (45) on two or more types of burn-in boards (40), a loading support portion (681) on which test sockets of two types of DC test portions (170) are loaded, and the loading support portion (681) is connected to a DC test portion (170). ) and a replacement parts loading portion 680 including a base support portion 682 supporting both sides of the loading support portion 681 so as to be spaced apart from the upper side of the
An element sorting device characterized in that the socket press (45) on the burn-in board (40) and the test socket of the DC test unit (170) are automatically replaced according to the external specifications of the element (10). In claim 13,
The socket press 45 on the burn-in board 40 and the test socket of the DC test unit 170 are connected to the tray 30 of the loading unit 100 and the tray 30 of the unloading unit 300. An element sorting device characterized in that it is withdrawn or loaded from the replacement parts loading unit 680 by a tray transfer unit 670 installed for transfer.

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