KR20230110020A - Wireless connector module, inspection jig and inspection equipment having the same - Google Patents

Abstract

The present invention relates to an inspection jig and an inspection device having a wireless connector. Disclosed is the inspection device comprising inspection equipment aligned with the inspection jig. The inspection equipment includes a first wireless connector including first wireless chips provided at positions opposite to those of second wireless chips and in the same number of the second wireless chips. The first wireless chips constituting the first wireless connector and arranged adjacent to each other are arranged so that the antenna transmission directions thereof are different from each other by more than 45 degrees. The second wireless chips constituting a second wireless connector and arranged adjacent to each other are arranged so that the antenna transmission directions thereof are different from each other by more than 45 degrees. The antenna transmission directions of the first wireless chips and the second wireless chips arranged to face each other face each other while being placed on the same vertical line. Therefore, the present invention enables data transmission in a very close range in a contactless manner through the wireless connector without a physical contact pin, thereby enabling accurate data transmission at all times without wear of pogo pins or contact defects caused by foreign substances.

Description

Inspection jig and inspection device having a wireless connector {WIRELESS CONNECTOR MODULE, INSPECTION JIG AND INSPECTION EQUIPMENT HAVING THE SAME}

The present invention relates to an inspection jig and an inspection device having a wireless connector, and more particularly, to a wireless connector for supplying test input data to a display panel wirelessly and transmitting and receiving test output data according to the test input data through non-contact short-range communication. It relates to an inspection jig and an inspection device.

In order to ensure product reliability of display panels, power and signals are applied to the panels to inspect the operation status and durability of the panels to determine or repair defective products, and an aging process to check whether there are any abnormalities in performance and function through harsh environments for a certain period of time (usually aging in a high temperature or electrical aging that repeatedly outputs display patterns).

In order to ensure the product reliability of the display panel, the test is conducted using an inspection jig (carrier) and inspection equipment. The inspection jig is provided with a wired connector connected to the connector of the display panel. The inspection equipment consists of a power supply board, an MCU board, a PG board (Pattern Generator) that generates images of a certain pattern for testing, and a contact pin block composed of 120 POGO pins. The contact pin block of the inspection equipment is connected to the PG board (Pattern Generator), and the image signal generated by the PG board is transmitted to the inspection jig through the pogo pin. The inspection jig drives the display panel through the connector with the video signal received using the pogo pin, and the signal output from the display panel is transmitted to the inspection equipment through the pogo pin through GPIO communication, SPI communication, I ² C communication, UART communication, and eDP communication. At this time, the display panel is seated on the inspection jig (carrier), moved on the conveyor of the automation line, and is seated into the inspection machine by the robot.

Inspectors using pogo pins generate contact resistance due to the pogo pins, which lowers the reliability of inspection and acts as a factor that increases the defect rate. The size of the contact resistance that causes defects when using the pogo pin and the cause of the increase in the contact resistance will be described.

The size of the contact resistance is formed as several mΩ in a normal situation without pogo pin wear, but as wear progresses, the contact resistance increases, causing a defective rate of the product. In most cases, the contact resistance increases in the following two cases. 1 is an explanatory diagram explaining contact resistance generated in a pogo pin. The pogo pin is in contact with the conductive pattern formed under the test object (PCB), and at this time, contact resistance is generated at the contact point between the plunger header and the conductive pattern and between the plunger and the body of the pogo pin.

Contact resistance occurs at the point of contact between the conductive pattern formed on the bottom of the PCB, which is the object to be tested, and the head of the pogo pin. In this case, if the material of the conductive pattern in contact with the pogo pin is a material with good electrical conductivity, such as gold or silver, the contact resistance will be low, but if it is a metal such as lead, iron, or aluminum, the contact resistance is relatively high. In addition, when used for a long time, the contact portion of the conductive pattern is worn and the plating is peeled off, resulting in increased contact resistance due to contact with the plunge header. If this occurs, the pogo pin must be replaced.

The second contact resistance is the resistance generated inside the pogo pin and is generated at the contact surface between the plunger and the body. The second contact resistance causes abrasion due to frequent contact between the inner surface of the pogo pin body and the lower part of the plunger, resulting in increased contact resistance, which causes signal distortion and causes a defective rate.

The contact resistance caused by these pogo pins causes abrasion and contamination of the pogo pins during mass production when repeating fastening-disassembly, and further increases the contact resistance, which increases the error rate of GPIO communication, SPI communication, I ² C communication, UART communication, and eDP communication transmitted to the pogo pin, greatly increasing the defect rate of the carrier jig. In addition, there is a problem in that a lot of maintenance costs are incurred in repairing and cleaning the pogo pin.

Korean Registered Patent No. 10-1584336 (registered on January 05, 2016)

An object of the present invention is to provide an inspection jig and an inspection device having a wireless connector using 60 GHz ultra-proximity wireless communication that can perform the inspection process through GPIO communication, SPI communication, I ² C communication, UART communication, and eDP communication without using a pogo pin, which is a problem during the final inspection of a display panel, and without contact resistance.

The above object of the present invention is a test jig used to test whether a display panel operates normally by applying a test pattern wirelessly transmitted from a test equipment to a display panel in a state where a display panel having a panel connection terminal board having a plurality of panel connection terminals is seated on one side thereof, - a touch panel is provided on the front surface of the display panel - a pattern connection terminal electrically connected to a panel connection terminal to receive the test pattern, and a main board to receive the test pattern transmitted through the pattern connection terminal inside. It is fixedly installed, has a panel mounting portion providing a space for seating the display panel on the upper surface, and a body portion having a second opening opening to expose a portion of the lower surface of the main board to the outside, and a second wireless connector composed of a plurality of second wireless chips mounted on the lower surface of the main board.

Another object of the present invention can be achieved by a test device comprising the aforementioned test jig and test equipment aligned with the test jig, wherein the test equipment includes a first wireless connector composed of the same number of second wireless chips at positions opposite to the second wireless chips.

Since the present invention enables non-contact and ultra-close distance data transmission through a wireless connector without using a physical contact pin such as a pogo pin, contact failure due to wear and foreign matter due to increased use time of the pogo pin does not increase, so accurate inspection can always be performed.

In the case of a physical contact method using a conventional pogo pin or the like, there is a contact resistance, so there is a limit in transmitting test data during inspection. For example, when eDP data is transmitted through a pogo pin, the maximum bandwidth allowed by eDO communication cannot be used due to the contact resistance between the pogo pin and the conductive pattern, and the inspection must be performed using a bandwidth of about 1/3 of the maximum bandwidth. There was a problem in that sufficient inspection was not performed. In contrast, in the present invention, eDP data can be transmitted at the maximum bandwidth using a high-speed wireless chip operating at 60 GHz, thereby increasing inspection accuracy.

In addition, the contact terminal of the inspection equipment can also replace the pin block board of the inspection equipment due to wear due to frequent contact, or eliminate the maintenance of foreign substances of the pogo pin and the replacement time due to wear of the contact pin, so the production can be increased.

1 is an explanatory diagram explaining contact resistance generated from a pogo pin;
Figure 2 is a configuration diagram of an inspection device composed of an inspection jig and inspection equipment.
3 is a front perspective view of an inspection jig according to an embodiment of the present invention;
Figure 4 is a rear perspective view of an inspection jig according to an embodiment of the present invention.
5 is cross-sectional views of the inspection jig shown in FIG. 3 in directions AA and BB;
6 is a configuration diagram of an inspection device according to an embodiment of the present invention;
7 is a configuration diagram of a signal processing unit of an embodiment provided in the inspection equipment according to the present invention.
8 is a partial configuration diagram of a main board provided in an inspection jig according to an embodiment of the present invention.
9 is a connection diagram showing a method of processing a UART signal in a TDM Master/Slave provided in a test equipment;
10 is a connection diagram showing a method of processing an I ² C signal in a TDM Master/Slave provided in a test equipment.
11 is a connection diagram showing an SPI signal processing method in the TDM Master/Slave provided in the test equipment.
12 is a state diagram illustrating a state in which data is transmitted between wireless connectors in a state in which the test jig is aligned with the test equipment;
13 is a symbol diagram of the wireless chip showing the transmission direction of the antenna of the wireless chip and the position of pin 1;
14 to 18 are layout views of wireless chips installed in the first wireless connector and the second wireless connector according to various embodiments of the present invention.
19 is an exemplary view of installing a blocking member between wireless chips;
20 is an exemplary view showing that the blocking member can be formed in a laminated manner;
21 is a state diagram in which blocking members are installed in the first wireless connector and the second wireless connector in a state in which the inspection jig is aligned with the inspection equipment;

Terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprise" or "have" are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but it should be understood that the presence or addition of one or more other features or numbers, steps, operations, components, parts, or combinations thereof is not excluded in advance.

Also, in the present specification, "on ~ or ~ on top" means located above or below the target part, and does not necessarily mean located on the upper side relative to the direction of gravity. In addition, when a part such as a region, plate, etc. is said to be "on or over" another part, this includes not only the case where it is in contact with or spaced "directly on or above" another part, but also the case where there is another part in the middle.

In addition, in the present specification, when one component is referred to as "connected" or "connected" to another component, the one component may be directly connected or directly connected to the other component, but unless otherwise specifically stated, it should be understood that it may be connected or connected through another component in the middle.

Also, in this specification, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another.

2 is a configuration diagram of an inspection device composed of an inspection jig and inspection equipment. The inspection equipment 200 is a device that generates a signal to inspect a display panel (hereinafter, referred to as 'inspection input signal'). A plurality of align rods 201a and 201b protruding are installed on the surface coupled to the inspection jig 100, and a first opening 230 is provided on at least a part of the surface coupled to the inspection jig 100, and a plurality of first wireless connectors 20 inside the first opening 230. 5) is provided. The inspection jig 100 is a device that supplies inspection input signals input from the inspection equipment 200 to the display panel and transmits inspection result signals output from the display panel to the inspection equipment 200 while being electrically connected to the display panel. A second opening 130 is also provided on the lower surface of the inspection jig 100 facing the inspection equipment 200, and a second wireless connector 105 is provided inside the second opening 130. In the inspection jig 100, alignment grooves 101a and 101b are provided at positions corresponding to the alignment rods 201a and 201b of the inspection equipment 200. In a state where the alignment grooves 101a and 101b of the inspection jig 200 are aligned to be inserted into the alignment rods 201a and 201b of the inspection equipment 100, the first wireless connector 205 and the second wireless connector 105 exchange data at a short distance, and the inspection proceeds.

The inspection device of the present invention is for inspecting whether a flat panel display panel providing a high resolution of 4K or higher is normally operated. A flat panel display panel providing a high resolution of 4K or higher can be implemented with an OLED panel or an LCD panel.

3 is a front perspective view of an inspection jig according to an embodiment of the present invention, and FIG. 4 is a rear perspective view of an inspection jig according to an embodiment of the present invention. In the case of a display panel for a smartphone, it has a substantially rectangular shape, and a panel connection terminal board portion protruding outward by a certain length is provided on one side of the panel, and a plurality of panel connection terminals are provided on the panel connection terminal board portion. The inspection jig 100 is provided with a panel seating portion 110 for seating the display panel and the panel connection terminal substrate. The inspection jig 100 includes a connection board pattern-printed with pattern connection terminals corresponding to the terminal connection terminals, and presses the connection board from the top of the panel connection terminals to stably connect the pattern connection terminals of the connection board and the panel connection terminals. A pressing member 120 is provided. A second opening 130 is provided at the bottom of the inspection jig 100, and the second wireless connector 105 mounted on the bottom of the main board 127 is installed so as to be visible from the outside through the second opening 130. As shown in FIGS. 3 and 4 , alignment grooves 101a and 101b are formed through two diagonal corners of the inspection jig 100 .

5 is a cross-sectional view of the inspection jig shown in FIG. 3 in directions A-A and B-B. More precisely, FIG. 5 shows a cutaway view in the A-A' direction of FIG. 3 from the top to the main board 127, and a cutaway view in the B-B' direction of FIG. 3 from the main board 127 to the bottom.

5 shows a state before the pressing member 120 presses the panel connection terminal 300a. The inspection jig 100 is composed of a body member 140 and a pressing member 120 hinged with the body member 140 . A panel mounting portion 110 is provided on the upper surface of the body member 140, and a main board 127 is fixedly installed therein. A plurality of second wireless chips 105a to 105f are provided under the main board 127, and the plurality of second wireless chips 105a to 105f are installed to be visible to the outside through the second opening 130 provided on the lower surface of the body member 140.

A connection board 125 is provided to be fixed to the lower surface of the pressing member 120, and the pressing member 120 is hinged with the body member 140 by a hinge member 141 formed to be led out on one side of the upper surface of the body member 140. The main board 127 and the connection board 125 are connected to each other by a flexible cable 121 .

During the inspection, after the display panel 300 is seated on the panel seating portion 110, the pressing member 120 is pressed and the plurality of pattern connection terminals 125a formed at the bottom of the connection board 125 and the panel connection terminal of the display panel.

6 is a configuration diagram of an inspection device according to an embodiment of the present invention. In the inspection jig 100 and the inspection equipment 200, the second wireless connector 105 and the first wireless connector 205, each operating at 60 Ghz, are installed facing each other at a distance of less than 1 cm, so as to transmit and receive data in a non-contact state. The second wireless connector 105 and the first wireless connector 205 have the same operating principle, and are named as the first and second wireless connectors, respectively, in order to distinguish between them.

The inspection equipment 200 includes a pattern generating unit 201, a power supply unit 203, a control unit 204, a first wireless connector 205, an RF ID reader 206, a signal processing unit 227, and a memory 207. The memory 207 stores inspection data and error codes for inspecting the display panel 300 . The pattern generating unit 201 generates a test pattern for inspecting the display panel 300 using the test data stored in the memory 207, transmits the test pattern to the signal processor 227, and analyzes the type of failure using measurement data input from the signal processor 227 and generates a corresponding error code. The signal processing unit 227 converts the test pattern output from the pattern generator 201 into 60 GHh wireless data, transmits it to the test jig 100 through the first wireless connector 205, and performs a function of restoring measurement data input from the test jig 100 through the first wireless connector 205. The control unit 24 and the power supply unit 22 are modules that generate control signals for controlling each module in the inspection equipment 20 and supply power.

The test jig 100 processes the test pattern input through the second wireless connector 105 in the main board 127 and transmits the signal to the display panel 300 through the connection board 125, and the measurement data output from the display panel 300 is transmitted to the main board 127 through the connection board 125, converted into a 60 GHz ultra-high speed signal, and then converted into a 60 GHz high-speed signal, and then passed through the second wireless connector 105 to test equipment ( 200) is sent. The second wireless connector 105 transmits measurement data to the first wireless connector 205 through an ultra-close 60 GHz wireless chip.

The inspection jig 100 is provided with an RF ID chip 151, and the inspection equipment 200 reads the corresponding RF ID chip 151 using the RF ID reader 206 to recognize the inspection jig being tested.

7 is a configuration diagram of a signal processing unit of an embodiment provided in the inspection equipment according to the present invention. The test pattern generated by the pattern generator 201 is transmitted to the signal processing unit 227 in the form of eDP, I ² C, SPI, UART, and GPIO signals. The double image data and image control signals are directly transmitted to the first wireless chips 205a to 205e without any special processing through the first bypass wiring unit 207, and control signals unrelated to the remaining image data are time-division modulated in the TDM Master and then transmitted to the first wireless chip 205f.

The signal processing unit 227 is composed of a TDM master and a first wireless connector 205. The eDP transmitted from the pattern generator 201 includes image data and image control signals, and is directly transmitted to the inspection jig using the five first wireless chips 205a to 205e without passing through the TDM Master. Among the signals transmitted from the pattern generator 201, signals unrelated to image data control are transmitted through I ² C, SPI, UART, and GPIO protocols, and signals irrelevant to image data control are merged into 60 GHz data by the TDM Master and then transmitted to the inspection jig through one first wireless chip 205f. Each number of I ² C, SPI, UART, and GPIO can be properly designed and provided as the required number.

The display panel inspected by the inspection jig may be a variety of panels with completely different driving voltages and driving methods, such as LCD panels or OLED panels, according to customer requests. In order to perform the inspection of these various display panels, the inspection jig must generate and provide voltages required by various display panels or generate and provide various signals including signals for manipulating the touch panel provided on the front of the display panel. In order to generate these various manipulation signals in the inspection jig, the inspection equipment transmits signals unrelated to image data control to the inspection jig.

As shown in FIG. 7, in the present invention, each data line for transmitting video data among eDP signals is transmitted using one wireless chip (205a, 205b, 205c, 205d), and the Aux channel and HPD (Hot Plug detect) signal, which are image control signals used for video data control, are designed to be transmitted using the other wireless chip (205e). As a specific example, the first data (Lane0[p], Lane0[n]) constituting the eDP signal is transmitted using the wireless chip 205a, the second data (Lane1[p], Lane1[n]) is transmitted using the wireless chip 205b, the third data (Lane2[p], Lane2[n]) is transmitted using the wireless chip 205c, and the fourth data (Lane3[p], Lane3[n]) is designed to be transmitted using the wireless chip 205d. The first wireless chips 205a to 205d used for image data transmission and the corresponding second wireless chips 105a to 105d need only be designed to perform one-way communication. The wireless chips 205e and 105e that transmit the video control signal perform bidirectional communication and may operate at a lower data rate than the communication chips 105a, 105b, 105c, 105d, 205a, 205b, 205c, and 205d used for video data transmission.

8 is a partial configuration diagram of a main board provided in an inspection jig according to an embodiment of the present invention. Among the inspection patterns transmitted to the second wireless chips 105a to 105e through the first wireless chips 205a to 205e, the image data and image control signals are directly transmitted to the display panel as eDP signals without signal processing in the TDM Slave. Among the test patterns transmitted to the second wireless connector 105 through the first wireless connector 205, the remaining signals (I ² C, SPI, UART, and GPIO) except for the eDP video signal are processed by the TDM Slave and then control the display panel.

7 and 8, the inspection equipment is designed as a TDM Master and the inspection jig is designed to operate as a TDM Slave. In order to transmit signals unrelated to image data control, bi-directional communication is performed between the inspection equipment and the inspection jig. Signals unrelated to image data control are modulated into TDM signals in the TDM Master of the inspection equipment and sent to the inspection jig, and are demodulated and received by the TDM Slave of the inspection jig. When a signal irrelevant to video data control in the opposite direction is transmitted from the inspection jig to the inspection equipment, the TDM Slave of the inspection jig modulates the TDM signal and transmits it to the inspection equipment, and the TDM Master of the inspection equipment demodulates and receives it. Since the TMD Master provided in the test equipment and the TDM Slave provided in the test jig do not have a significant difference in configuration, the signal processing unit of FIG. 7 will be described, and FIG. 8 will not be separately described.

In FIG. 7, among the signals input to the TDM Master, the UART signal and the GPIO signal are asynchronous signals, and the remaining signals (I ² C and SPI) are synchronous signals. In TDM Master, we will first explain how the UART signal, which is an asynchronous signal, is processed.

9 is a connection diagram showing a UART signal processing method in the TDM Master provided in the test equipment. The TDM Master provided in the inspection equipment is configured to include a clock generator, TDM Mux and TDM Demux. 9 shows that three UART signals are input from the pattern generator. TDM Master connects the Tx terminal of each UART device to the input terminal of TDM Mux, and connects the Rx terminal of each UART device to the output terminal of TDM Demux. The TDM Mux performs a function of selecting one of a plurality of input terminals and transmitting the signal to one of the first wireless chips 205f in time division, and the TDM Demux performs a function of selecting one of a plurality of output terminals, receiving a signal input from one of the first wireless chips 205f in a time division, and transmitting the signal to each UART Rx terminal. Similar to the UART signal, the GPIO signal can be designed so that the data output terminal is directly connected to one input terminal of the TDM Mux and the data input terminal is directly connected to the output terminal of the TDM Demux, respectively, so detailed descriptions will be omitted.

10 is a connection diagram showing a method of processing an I ² C signal in the TDM Master provided in the test equipment. 10 shows that two I ² C signals are input from the pattern generator. The TDM Master is composed of I ² C data extraction and output units 11a and 12a and I ² C data extraction and input units 11 b and 12 b, clock generator, TDM Mux and TDM Demux. Since the clock generator, TDM Mux, and TDM Demux are components already presented in FIG. 9, descriptions thereof will be omitted.

The I ² C data extraction and output units 11a and 12a extract the I ² C Tx data (SDA) in synchronization with the clock signal (SCL) input from the I ² C bus, synthesize it into a TDM clock, and transmit it to one input terminal of the TDM Mux. The I ² C data extraction and output units 11a and 12a are connected to the I ² C bus and consist of an I ² C Tx data extraction unit 13 that extracts Tx data in synchronization with the SCL clock, an I ² C Tx data storage unit 15 that temporarily stores Tx data, and an I ² C Tx data synthesis unit 17 that synthesizes Tx data in synchronization with TDM CLK.

The data extraction and input units 11b and 12b are component blocks that extract the Rx data from the Rx signal input from the TDM Demux in synchronization with the TDM clock, synthesize it into the SCL clock, and transmit it to the I ² C bus. The I ² C data extraction and input units 11b and 12b are connected to the TDM Demux and are composed of an I ² C Rx data extraction unit 14 that extracts Rx data in synchronization with the TDM clock, an I ² C Rx data storage unit 16 that temporarily stores Rx data, and an I ² C Rx data synthesis unit 18 that synthesizes Rx data in synchronization with the SLK clock.

11 is a connection diagram showing a method of processing an SPI signal in a TDM Master provided in an inspection equipment. 11 shows that two SPI signals are input from the pattern generating unit. The TDM Master is configured to include SPI data extraction and output units 11a and 12a, SPI data extraction and input units 11b and 12b, clock generator, TDM Mux and TDM Demux. Since the clock generator, TDM Mux, and TDM Demux are components already presented in FIG. 9, descriptions thereof will be omitted.

The SPI data extraction and output units 21a and 22a are component blocks that extract the SPI Tx data (MISO) in synchronization with the clock signal (SCK) input from the SPI bus, synthesize it into a TDM clock, and transmit it to one input terminal of the TDM Mux. The SPI data extraction and output units 21a and 22a are connected to the SPI bus and consist of an SPI Tx data extraction unit 23 that extracts Tx data from the MOSI (Master Out Slaver In) line in synchronization with the SCK clock, an SPI Tx data storage unit 25 that temporarily stores the Tx data, and an SPI Tx data synthesis unit 27 that synthesizes Tx data in synchronization with the TDM CLK.

The SPI data extraction and input units 21b and 22b are component blocks that extract Rx data from the Rx signal input from the TDM Demux in synchronism with the TDM clock, combine it with the SCK clock, and transmit it to the SPI bus. The SPI data extraction and input units 11b and 12b are connected to the TDM Demux and consist of an SPI Rx data extraction unit 24 that extracts Rx data in synchronization with the TDM clock, an SPI Rx data storage unit 26 that temporarily stores Rx data, and an SPI Rx data synthesis unit 28 that synthesizes Rx data in synchronization with the SCK clock. The data synthesized by the SPI Rx data synthesis unit 28 is carried on the MISO (Master In Slave Out) line and transmitted.

12 illustrates a state in which data is transmitted between wireless connectors in a state in which the test jig is aligned with the test equipment. The first wireless connector mounted on the signal processing unit 227 of the inspection equipment 200 is composed of six first wireless chips 205a to 205f, and the second wireless connector mounted on the main board 127 of the inspection jig 100 is composed of six second wireless chips 105a to 105f. When the inspection jig 100 is aligned and coupled to the inspection equipment 20, the lower surface of the body member 140 of the inspection jig 100 and the upper surface 240 of the outer case of the inspection equipment 200 come into contact with each other, and the wireless chips mounted inside the first opening and the second opening communicate with each other. The first wireless chips 205a to 205f wirelessly transmit and receive data on a one-to-one basis with the second wireless chips 105a to 105f disposed opposite to each other. For example, the first wireless chip 205b exchanges data with the second wireless chip 105b. At this time, the distance (d) between the wireless chips communicating with each other is maintained at a very close distance of 1 cm or less.

However, since there is not enough space to install the chip, the horizontal distance between the centers of the adjacent wireless chips (refer to FIG. 12) is inevitably formed close, resulting in interference due to crosstalk between wireless chips. For example, when the 205b first wireless chip transmits data to the 105b second wireless chip, under normal circumstances, the 205b first wireless chip and the 105b second wireless chip transmit data in the a1 direction. Since the wireless chip applied in the present invention uses ultra-high frequency communication using a 60 GHz frequency, even if the first wireless connector and the second wireless connector are properly designed so that crosstalk does not occur and the wireless chips are placed, crosstalk may occur between some wireless chips after actual implementation.

An antenna is provided inside the wireless chip, and since the antenna is installed at the same location for each chip, the transmission direction of the antenna is determined. 13 is a symbol of a wireless chip showing the transmission direction of the antenna of the wireless chip and the position of the first pin. The direction of the arrow shown in FIG. 13 is the direction in which radio waves are transmitted from the antenna embedded in the wireless chip, and the chamfered corner indicates the position of the No. 1 pin.

14 to 18 are layout views of wireless chips installed in the first wireless connector and the second wireless connector according to various embodiments of the present invention. According to the experiment of the inventor of the present application, it was found that crosstalk may occur when the separation distance between the center points of the wireless chips is maintained at 20 mm or less. In addition, it has been found that such crosstalk can be reduced when the antenna directions of neighboring wireless chips are arranged differently at an angle of 45° or more, and when the transmitting and receiving wireless chips are positioned opposite to each other, they are positioned on the same vertical line and the antenna directions of the wireless chips face each other. 12 can be regarded as an exemplary diagram in which the transmitting side and the receiving side radio chips are positioned on the same vertical line when positioned opposite to each other. Specifically, it can be seen that the crosstalk is minimized when the antennas of the transmitting and receiving wireless chips are positioned on the same vertical line and the antennas are arranged in opposite directions.

In the case of FIGS. 14, 15 and 18, the antenna directions of the wireless chips 205a to 205f included in the first wireless connector 205 are arranged such that 90° is maintained between neighboring wireless chips, and the wireless chips 205a to 205f included in the first wireless connector 205 and the wireless chips provided in the second wireless connector 105 placed opposite to each other ( 205a to 205f) are arranged to face each other.

For example, arrangement directions of some wireless chips will be described in FIG. 14 . The directions of the antennas of the first wireless chip 205a, the first wireless chip 205b, and the first wireless chip 205c, which are disposed adjacent to each other, are arranged to maintain 90 degrees from each other. The second wireless chip 105a and the first wireless chip 205a are folded and installed in an inspection jig and an inspection equipment so as to face each other. It can be seen that the antenna direction of the second wireless chip 105a is arranged so that data transmission is performed from top to bottom, and the antenna direction of the first wireless chip 205a is arranged to face each other so that data transmission is performed from bottom to top.

In the case of FIG. 16 , the antenna directions of the wireless chips 205a to 205f included in the first wireless connector 205 are arranged so as to maintain 135° between neighboring wireless chips, and the wireless chips 205a to 205 provided in the second wireless connector 105 placed opposite to the wireless chips 205a to 205f included in the first wireless connector 205 The directions of the antennas in f) are arranged to face each other. In the case of FIG. 17, the antenna directions of the wireless chips 205a to 205f included in the first wireless connector 205 are arranged so as to maintain an angle of 45° between the neighboring wireless chips, and the wireless chips 205a to 205f provided in the second wireless connector 105 disposed to face each other with the wireless chips 205a to 205f provided in the first wireless connector 205 ) is an embodiment in which the directions of the antennas are arranged to face each other.

Since the arrangement direction of the wireless chip is arranged according to the design of the first wireless connector 205 and the second wireless connector 105, it is very difficult to change the direction of the wireless chip even if crosstalk occurs after the arrangement. In this case, it can be solved by installing a blocking member in a space between neighboring wireless chips where crosstalk occurs ex post facto. 19 is an exemplary view showing a blocking member installed between wireless chips. A linear blocking member is installed in the space between the wireless chip 105a and the wireless chip 105b, and a 'L' shaped blocking member is installed in the space between the wireless chip 105b and the wireless chip 105c. The blocking member is composed of the body portion 501 and the adhesive 503 applied to the lower portion of the body portion, so that it can be easily installed at a desired location where crosstalk occurs. The body portion 501 of the blocking member may be formed of a metallized polymer, a composite material, a low-loss, high-permittivity material, a metal shell, and/or other materials, and provides a function of reflecting a 60 GHz signal propagated from a wireless chip. When the body portion 501 is made of a low-loss, high dielectric constant material, it is preferable to use a material having a dielectric constant of 2.0 or more.

20 is an exemplary view showing that the blocking member can be formed in a laminated manner. When one linear blocking member 500 is insufficient, the blocking members 500 are stacked so as to overlap each other to a height capable of eliminating crosstalk.

21 is a state diagram in which blocking members are installed in the first wireless connector and the second wireless connector in a state in which the inspection jig is aligned with the inspection equipment. As shown in FIG. 21, the blocking member may be installed in various forms. The blocking members 500a and 500b may be installed to completely block the space formed between the 105c wireless chip and the 205c wireless chip, and, if necessary, as installed around the 105e wireless chip and the 205e, the space between the 105e wireless chip and the 205e is not completely blocked. Since the second wireless connector 105 can be mounted on the main board of the inspection jig, the blocking member installed around the wireless chip constituting the second wireless connector 105 can be installed to adhere to the rear surface of the main board. Similarly, since the first wireless connector 205 can be mounted on the signal processing unit of the test equipment, the blocking member installed around the wireless chip constituting the first wireless connector 205 can be attached to the signal processing unit.

The embodiment of FIG. 12 shows the disposition of each wireless chip capable of reducing crosstalk. For example, the antenna propagation direction of the wireless chips 105a, 205c, and 105e is arranged in the right direction, and the antenna propagation direction of the opposite wireless chips 205a, 105c, and 205e is arranged in the left direction. Similarly, the antenna propagation directions of the wireless chips 105b, 205d, and 105f are arranged in a direction coming out of the ground, and the antenna propagation directions of the wireless chips 205b, 105d, and 205f are arranged in a direction entering the ground, so that they propagate in opposite directions. At this time, the antennas of the radio chips disposed facing each other were arranged to be positioned on the same vertical line.

Although the preferred embodiments of the present invention have been described above using specific terms, such terms are only used to clearly explain the present invention, and the embodiments and described terms of the present invention are the technical spirit and scope of the following claims. It is obvious that various changes and changes can be made without departing from the scope. Such modified embodiments should not be individually understood from the spirit and scope of the present invention, and should be said to fall within the scope of the claims of the present invention.

11a, 12a: I ² C data extraction and output unit 11b, 12b: I ² C data extraction and input unit
13: I ² C Tx data extraction unit 15: I ² C Tx data storage unit
17: I ² C Tx data synthesis unit 14: I ² C Rx data extraction unit
16: I ² C Rx data storage unit 18: I ² C Rx data synthesis unit
21a, 22a: SPI data extraction and output unit 21b, 22b: SPI data extraction and input unit
23: SPI Tx data extraction unit 25: SPI Tx data storage unit
27: SPI Tx data synthesis unit 24: SPI Rx data extraction unit
26: SPI Rx data storage unit 28: SPI Rx data synthesis unit
100: inspection jig 101a, 101b: align home
105: second wireless connector 107: first bypass wiring unit
110: panel seating part 120: pressing member
121: flexible cable 125: connection board
125a: pattern connection terminal 127: main board
130: second opening 140: body member
141: hinge member 151: RF ID chip
200: inspection equipment 201a, 201b: align bar
205: first wireless connector 206: RF ID reader
207: second bypass wiring unit 227: signal processing unit
230: first opening 300: display panel
300a: panel connection terminal 310: panel connection terminal substrate
500, 500a ~ 500f: blocking member 501: body
503: glue

Claims (12)

In a state in which a display panel having a panel connection terminal substrate having a plurality of panel connection terminals is seated on one side, a test pattern received wirelessly from a test equipment is applied to the display panel to check whether the display panel operates normally In the test jig used,
a pattern connection terminal electrically connected to the panel connection terminal and receiving the inspection pattern;
Inside, a main board for receiving a test pattern transmitted through the pattern connection terminal is fixedly installed, and a panel seating part is provided on the upper surface to provide a space for seating the display panel, and a lower part is provided with a second opening opening to expose a part of the lower surface of the main board to the outside.
It includes a second wireless connector composed of a plurality of second wireless chips mounted on the lower surface of the main board,
An inspection jig characterized in that the plurality of second wireless chips mounted on the lower surface of the main board are mounted in an area visible from the outside through the second opening.
According to claim 1,
A touch panel is provided on the front surface of the display panel,
The inspection pattern includes image data transmitted through a plurality of data lines (Lane0, Lane1, Lane2, and Lane3) transmitted in parallel for displaying the display panel, image control signals related to the displayed image data control, and signals unrelated to image data control including touch panel manipulation signals through a plurality of communication protocols.
The second wireless connector
second wireless chips (105a, 105b, 105c, 105d) involved in transmission of the plurality of data lines, respectively;
A second wireless chip 105e involved in transmitting the image control signal; and
A second wireless chip 105f involved in signal transmission unrelated to the image data control
including,
On the main board
A second bypass wiring unit for providing electrical wiring for connecting a plurality of data lines (Lane0, Lane1, Lane2, and Lane3) transmitted from the test equipment through the second wireless chips (105a, 105b, 105c, and 105d) to the pattern connection terminal, and for providing the image control signal transmitted through the second wireless chip (105e) to the pattern connection terminal;
A TDM slave that modulates and demodulates a signal irrelevant to video data control transmitted through the second wireless chip 105f into a time-division signal.
Inspection jig comprising a.
According to claim 2,
The TDM Slave has
A TDM CLK generator for generating a clock (TDM CLK) used for time division modulation and demodulation;
TDM Mux operating as TDM CLK and
TDM Demux running with TDM CLK
Inspection jig comprising a.
According to claim 3,
Signals unrelated to the video data control include SCL clock and SDA data transmitted through an I ² C bus,
The TDM Slave has
An I ² C data extraction and input unit that extracts data input synchronized to the TDM CLK from the output terminal of the TDM Demux and converts it into data synchronized with the SCL clock and receives the input data;
I ² C data extraction and output unit that extracts input data synchronized with the SCL clock, converts it into data synchronized with the TDM CLK, and provides it to the input terminal of the TDM Mux
Inspection jig characterized in that it is included.
According to claim 3,
The low-speed data signal includes a UART signal,
The TDM Slave has
Wiring connecting one of the output terminals of the TDM Demux to the Rx line of the UART of the display panel; and
Wiring connecting the Tx line of the UART of the display panel and one of the input terminals of the TDM Mux
Inspection jig comprising a.
According to claim 3,
The inspection jig, characterized in that the second wireless chips (105a to 105f) constituting the second wireless connector are arranged so that the transmission directions of the antennas of the second wireless chips disposed adjacent to each other are different by 45° or more.
According to claim 3,
The second wireless chips (105a to 105f) constituting the second wireless connector further include a blocking member provided in a space between neighboring second wireless chips to prevent crosstalk between the neighboring second wireless chips (105a to 105f).
According to claim 7,
The blocking member is formed of a body portion and an adhesive applied to the lower surface of the body portion, and the body portion is formed of any one of a metallized polymer, a composite material, a low-loss and high permittivity (dielectric constant of 2.0 or more) material, and a metal shell. Inspection jig, characterized in that.
The inspection jig and
Including inspection equipment aligned with the inspection jig,
The test device includes a first wireless connector composed of the same number of first wireless chips at a position opposite to the second wireless chips.
According to claim 9,
The first wireless chips constituting the first wireless connector and disposed adjacent to each other are disposed such that antenna transmission directions are different from each other by 45° or more;
The second wireless chips disposed adjacent to each other constituting the second wireless connector are disposed such that antenna transmission directions are different from each other by 45° or more;
The test apparatus characterized in that antenna directions of the respective first wireless chips and the second wireless chips disposed to face each other are configured to face each other while being placed on the same vertical line.
According to claim 10,
The first wireless chips (205a to 205f) constituting the first wireless connector further include a blocking member provided in a space between the neighboring first wireless chips to prevent crosstalk between the neighboring first wireless chips (205a to 205f).
According to claim 11,
The blocking member is formed of a body portion and an adhesive applied to the lower surface of the body portion, and the body portion is formed of any one of a metallized polymer, a composite material, a low-loss, high dielectric constant material (dielectric constant of 2.0 or more), and a metal shell. Inspection device, characterized in that formed.