KR20230102422A - Epoxy foam composition containing a carboxyl group for manufacturing a ship structure and a ship structure formed therefrom - Google Patents
Epoxy foam composition containing a carboxyl group for manufacturing a ship structure and a ship structure formed therefrom Download PDFInfo
- Publication number
- KR20230102422A KR20230102422A KR1020210192531A KR20210192531A KR20230102422A KR 20230102422 A KR20230102422 A KR 20230102422A KR 1020210192531 A KR1020210192531 A KR 1020210192531A KR 20210192531 A KR20210192531 A KR 20210192531A KR 20230102422 A KR20230102422 A KR 20230102422A
- Authority
- KR
- South Korea
- Prior art keywords
- curing agent
- epoxy resin
- weight
- epoxy
- carboxyl group
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 82
- 239000004593 Epoxy Substances 0.000 title claims abstract description 47
- 239000006260 foam Substances 0.000 title claims abstract description 31
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 77
- 239000003822 epoxy resin Substances 0.000 claims abstract description 71
- -1 aliphatic amine compound Chemical class 0.000 claims abstract description 69
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 28
- 229920000554 ionomer Polymers 0.000 claims abstract description 23
- 239000004094 surface-active agent Substances 0.000 claims abstract description 23
- 239000000945 filler Substances 0.000 claims abstract description 21
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- 150000001412 amines Chemical class 0.000 claims abstract description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920002647 polyamide Polymers 0.000 claims abstract description 16
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 13
- 239000001257 hydrogen Substances 0.000 claims abstract description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 239000010703 silicon Substances 0.000 claims abstract description 6
- 238000005187 foaming Methods 0.000 claims description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000003368 amide group Chemical group 0.000 claims description 3
- 125000003172 aldehyde group Chemical group 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 125000005462 imide group Chemical group 0.000 claims description 2
- 125000002560 nitrile group Chemical group 0.000 claims description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 24
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 10
- 125000000524 functional group Chemical group 0.000 description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000004760 aramid Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000539 dimer Substances 0.000 description 5
- 229910021485 fumed silica Inorganic materials 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000005215 alkyl ethers Chemical class 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000013518 molded foam Substances 0.000 description 3
- 125000005375 organosiloxane group Chemical group 0.000 description 3
- 229920000962 poly(amidoamine) Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 150000008442 polyphenolic compounds Chemical class 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 150000003377 silicon compounds Chemical class 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- NBNGHXWJFSMASY-UHFFFAOYSA-N 2,3,4-tris(dimethylamino)phenol Chemical compound CN(C)C1=CC=C(O)C(N(C)C)=C1N(C)C NBNGHXWJFSMASY-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 239000004953 Aliphatic polyamide Substances 0.000 description 2
- 239000004604 Blowing Agent Substances 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920003182 Surlyn® Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229920003231 aliphatic polyamide Polymers 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000005037 alkyl phenyl group Chemical group 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 150000004982 aromatic amines Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 235000013877 carbamide Nutrition 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000004005 microsphere Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 2
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- 229940051841 polyoxyethylene ether Drugs 0.000 description 2
- 229920000056 polyoxyethylene ether Polymers 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
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- 230000009257 reactivity Effects 0.000 description 2
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- 150000004756 silanes Chemical class 0.000 description 2
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- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- PZWQOGNTADJZGH-SNAWJCMRSA-N (2e)-2-methylpenta-2,4-dienoic acid Chemical group OC(=O)C(/C)=C/C=C PZWQOGNTADJZGH-SNAWJCMRSA-N 0.000 description 1
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
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- BAHPQISAXRFLCL-UHFFFAOYSA-N 2,4-Diaminoanisole Chemical compound COC1=CC=C(N)C=C1N BAHPQISAXRFLCL-UHFFFAOYSA-N 0.000 description 1
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- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
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- BYACHAOCSIPLCM-UHFFFAOYSA-N 2-[2-[bis(2-hydroxyethyl)amino]ethyl-(2-hydroxyethyl)amino]ethanol Chemical compound OCCN(CCO)CCN(CCO)CCO BYACHAOCSIPLCM-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical class NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- HJXPGCTYMKCLTR-UHFFFAOYSA-N 2-bromo-9,9-diethylfluorene Chemical compound C1=C(Br)C=C2C(CC)(CC)C3=CC=CC=C3C2=C1 HJXPGCTYMKCLTR-UHFFFAOYSA-N 0.000 description 1
- OHPBKUJGDFXDRM-UHFFFAOYSA-N 3,4-diethyl-5-(2-phenylpropan-2-yl)benzene-1,2-diamine Chemical compound CCC1=C(N)C(N)=CC(C(C)(C)C=2C=CC=CC=2)=C1CC OHPBKUJGDFXDRM-UHFFFAOYSA-N 0.000 description 1
- MBWYRMCXWROJMP-UHFFFAOYSA-N 3-(1-aminoethyl)aniline Chemical compound CC(N)C1=CC=CC(N)=C1 MBWYRMCXWROJMP-UHFFFAOYSA-N 0.000 description 1
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
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- CDSPOZXUDJUBEZ-UHFFFAOYSA-N 4-(1-aminoethyl)aniline Chemical compound CC(N)C1=CC=C(N)C=C1 CDSPOZXUDJUBEZ-UHFFFAOYSA-N 0.000 description 1
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- KXEPRLUGFAULQX-UHFFFAOYSA-N 4-[2,5-di(propan-2-yl)phenyl]aniline Chemical compound CC(C)C1=CC=C(C(C)C)C(C=2C=CC(N)=CC=2)=C1 KXEPRLUGFAULQX-UHFFFAOYSA-N 0.000 description 1
- UHNUHZHQLCGZDA-UHFFFAOYSA-N 4-[2-(4-aminophenyl)ethyl]aniline Chemical compound C1=CC(N)=CC=C1CCC1=CC=C(N)C=C1 UHNUHZHQLCGZDA-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
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- 239000005995 Aluminium silicate Substances 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
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- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 239000005510 Diuron Substances 0.000 description 1
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- 239000002841 Lewis acid Substances 0.000 description 1
- 239000002879 Lewis base Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
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- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000004965 Silica aerogel Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 1
- CFMVOYREGHZAQA-UHFFFAOYSA-N chlorosilane trichloro(methyl)silane Chemical class C[Si](Cl)(Cl)Cl.Cl[SiH3] CFMVOYREGHZAQA-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011280 coal tar Substances 0.000 description 1
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- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
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- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical group C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- RSIHJDGMBDPTIM-UHFFFAOYSA-N ethoxy(trimethyl)silane Chemical compound CCO[Si](C)(C)C RSIHJDGMBDPTIM-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010881 fly ash Substances 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 150000007527 lewis bases Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920006113 non-polar polymer Polymers 0.000 description 1
- 235000014571 nuts Nutrition 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 210000003660 reticulum Anatomy 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 230000007928 solubilization Effects 0.000 description 1
- 238000005063 solubilization Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004616 structural foam Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0066—Use of inorganic compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
본 발명은 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물 및 이로부터 형성된 선박구조체에 관한 것으로, 보다 상세하게는 구조강성, 경량화, 진동 및 소음차폐의 기능을 제공하는 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물 및 이로부터 형성된 선박구조체에 관한 것이다.The present invention relates to an epoxy foam composition containing a carboxyl group for manufacturing a ship structure and a ship structure formed therefrom, and more particularly, a carboxyl group for manufacturing a ship structure that provides structural rigidity, light weight, vibration and noise shielding functions. It relates to an included epoxy foam composition and a ship structure formed therefrom.
다수의 산업, 예를 들면 자동차 산업에서 강함과 가벼움 모두를 갖춘 부품을 필요로 하는 것은 공지되어 있다. 이러한 강도와 최소 중량 사이의 균형을 맞추기 위한 노력의 일환으로, 비교적 얇은 금속 시트로 건조된 중공형 부품을 이용한다. 그러나, 중공형 금속 부품은 쉽게 변형된다. 따라서, 중공형 부품의 동공 내에 구조 발포체가 존재하는 것이 상기와 같은 부품의 강도 및 강성을 향상시킬 수 있다는 것 또한 공지되어 있다. 문, 지붕, 트렁크 뚜껑 또는 본넷트와 같은 자동차 차체의 편평한 부품에 대해서는, 발포성 또는 비발포성 에폭시 또는 폴리우레탄 수지를 기재로 한 시트를 상기 부품에 접합시킴으로써 상기 부품의 강성 및 경직성을 증가시키는 것이 공지되어 있다.It is known that many industries, for example the automotive industry, require components that are both strong and light. In an effort to strike this balance between strength and minimal weight, hollow parts built from relatively thin metal sheets are used. However, hollow metal parts are easily deformed. Accordingly, it is also known that the presence of structural foam in the cavities of hollow parts can improve the strength and rigidity of such parts. For flat parts of automobile bodies such as doors, roofs, trunk lids or bonnets, it is known to increase the stiffness and rigidity of these parts by bonding to them sheets based on foamed or non-foamed epoxy or polyurethane resins. there is.
발포구조체의 특정 제법은 매우 다양하다. 예를 들어, 미국특허 제 5,575,526호는 제법2를 포함하는 다양한 수지를 기재로 하는 구조발포체를 교시하고 있는 데, 상기 제법은 54.5% EPON 828 에폭시 수지, 7.5% HALOXY 62 에폭시 희석제, 6.1% DER 732 유연성 에폭시, 2.0% EXPANCEL 551DU 발포제, 8.8% MICROS 미소구체, 17.7% 3M K20 미소구체 및 3.4% DI-CY 디시안디아미드 경화제를 포함한다. 미국특허 제5,755,486호는 열적으로 팽창가능한 수지를 기재로 하는 재료를 개시하고 있는데, 상기 재료는 예를 들어, 에폭시 수지, 아크릴로니트릴-부타디엔 고무, 탄산칼슘, 카본블랙, 훈증된 실리카, 유리구, 경화제, 가속제 및 발포제를 포함한다.The specific manufacturing method of the foam structure is very diverse. For example, U.S. Patent No. 5,575,526 teaches a structured foam based on various resins, including recipe 2, which contains 54.5% EPON 828 epoxy resin, 7.5% HALOXY 62 epoxy diluent, 6.1% DER 732 Flexible Epoxy, 2.0% EXPANCEL 551DU blowing agent, 8.8% MICROS microspheres, 17.7% 3M K20 microspheres and 3.4% DI-CY dicyandiamide hardener. U.S. Patent No. 5,755,486 discloses materials based on thermally expandable resins, which materials include, for example, epoxy resins, acrylonitrile-butadiene rubber, calcium carbonate, carbon black, fumed silica, and glass spheres. , curing agents, accelerators and blowing agents.
이러한 에폭시 발포구조체의 경우 여러 문제가 산재해 있으나, 가장 큰 문제는 상대적으로 짧은 저장수명을 갖는 것이다. 이상적으로는, 그러한 제법의 성분들이 일단 서로 회합되면 안정하게 유지되어야 하고, 저장 및 적재 중에 통상 대하는 상황에서 반응이 되지 않아야 하며, 몇 주 혹은 몇 개월의 동안 상온 혹은 그 이상에서 저장될 때, 제형의 특성이 변하지 않는 것이 바람직하다.In the case of such an epoxy foam structure, various problems are scattered, but the biggest problem is that it has a relatively short shelf life. Ideally, the components of such a recipe, once associated with each other, should remain stable, should not react under conditions normally encountered during storage and loading, and should not react when stored at room temperature or higher for weeks or months. It is desirable that the properties of do not change.
에폭시 발포구조체의 또 하나의 문제점은 기본적인 기계적 물성, 특히 강도를 만족하지 못하는 점이고, 발포제어가 어려워, 과 발열로 인한 성형물 파괴, 공동형상 구조물(BODY-SHELL 구조물)의 충진 및 성형의 어려움이 있다. 이는 에폭시 수지의 특성 때문으로, 함께 혼합되는 충전재나 기타 고분자 수지, 특히 비극성 고분자 수지와의 혼화성이 좋지 못하며, 경화 시 응력에 대한 수축 등의 변화 및 열경화성 수지인 에폭시 발포 폼에 대한 열역학적 상관관계의 부조화 발생하여 기계적 물성에 악영향을 주기 때문으로 보인다.Another problem of the epoxy foam structure is that it does not satisfy basic mechanical properties, especially strength, and it is difficult to control foaming. . This is due to the nature of the epoxy resin, and it has poor miscibility with fillers or other polymer resins, especially non-polar polymer resins, and changes in shrinkage against stress during curing and thermodynamic correlation with epoxy foam, which is a thermosetting resin. It seems to be due to the occurrence of disharmony, which adversely affects the mechanical properties.
상기와 같은 문제를 해결하기 위하여, 본 발명은 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물을 제공하는 것을 목적으로 한다.In order to solve the above problems, an object of the present invention is to provide an epoxy foaming composition containing a carboxyl group for manufacturing a ship structure.
또한, 본 발명은 상기 조성물로부터 형성된 선박구조체를 제공하는 것을 목적으로 한다.In addition, an object of the present invention is to provide a ship structure formed from the composition.
또한, 본 발명은 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 경화물을 제공하는 것을 목적으로 한다.In addition, an object of the present invention is to provide an epoxy foam cured product containing a carboxyl group for manufacturing a ship structure.
상기 목적을 달성하기 위하여 본 발명은,In order to achieve the above object, the present invention,
a) 제 1 에폭시 수지, b) 액상형 비스페놀계 에폭시 수지 또는 지방족 아민 화합물로 개질된 변성 에폭시 수지, 및 이들의 혼합물을 포함하는 제 2 에폭시 수지, c) 실리콘 수소화합물이 포함된 실리콘 화합물, d) 반응성 계면활성제, 및 e) 충전재를 포함하는 주재; 및a) a first epoxy resin, b) a liquid bisphenol-based epoxy resin or a modified epoxy resin modified with an aliphatic amine compound, and a second epoxy resin including a mixture thereof, c) a silicone compound containing a silicon hydrogen compound, d) a reactive surfactant, and e) a main material comprising a filler; and
이오노머를 포함하는 아민계 및 폴리아미드계 경화제로, 상기 이오노머를 전체 경화제 100 중량부 대비 0.1 내지 2 중량부를 함유하는 경화제;를 포함하고,An amine-based and polyamide-based curing agent containing an ionomer, and a curing agent containing 0.1 to 2 parts by weight of the ionomer based on 100 parts by weight of the total curing agent;
상기 주재 성분 중 카르복실기의 함량이 15 내지 30%인 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물을 제공한다.Provides an epoxy foaming composition containing a carboxyl group for manufacturing a ship structure having a carboxyl group content of 15 to 30% of the main component.
또한 상기 다른 목적을 달성하기 위하여 본 발명은 상기 조성물로부터 형성된 선박구조체를 제공한다.In addition, in order to achieve the above other object, the present invention provides a ship structure formed from the composition.
또한 상기 또 다른 목적을 달성하기 위하여 본 발명은 a) 제 1 에폭시 수지, b) 액상형 비스페놀계 에폭시 수지 또는 지방족 아민 화합물로 개질된 변성 에폭시 수지, 및 이들의 혼합물을 포함하는 제 2 에폭시 수지, c) 실리콘 수소화합물이 포함된 실리콘 화합물, d) 반응성 계면활성제, 및 e) 충전재를 포함하는 주재; 및이오노머를 포함하는 아민계 및 폴리아미드계 경화제로, 상기 이오노머를 전체 경화제 100 중량부 대비 0.1 내지 2 중량부를 함유하는 경화제;를 포함하는 2액형 조성물을 혼합하여 경화한 에폭시 발포 경화물로서,In addition, in order to achieve the above another object, the present invention provides a) a first epoxy resin, b) a liquid bisphenol-based epoxy resin or a modified epoxy resin modified with an aliphatic amine compound, and a second epoxy resin comprising a mixture thereof, c ) a main material containing a silicone compound containing a silicon hydrogen compound, d) a reactive surfactant, and e) a filler; And An amine-based and polyamide-based curing agent containing an ionomer, a curing agent containing 0.1 to 2 parts by weight of the ionomer based on 100 parts by weight of the total curing agent; As an epoxy foam cured product cured by mixing a two-component composition comprising,
상기 조성물은 주재 100 중량부 대비 경화제 20 내지 50 중량부로 혼합되고,The composition is mixed with 20 to 50 parts by weight of the curing agent based on 100 parts by weight of the main material,
압축 강도가 500 내지 700 psi인 선박구조체 제조를 위한 에폭시 발포 경화물을 제공한다.Provided is an epoxy foam cured product for manufacturing a ship structure having a compressive strength of 500 to 700 psi.
본 발명의 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물은 에폭시 수지에 특정 조성의 경화제, 실리콘 화합물 및 충전재를 포함함으로써 강화된 기계적 물성을 만족하면서도 비중 0.17 g/cc 내지 0.25 g/cc 경량 에폭시 발포 폼 경화물을 획득하여, 선박 구조체 및 해양 복합소재 구조물내의 공동형상 구조물(BODY-SHELL 구조물)에 적용시 강도가 높은 경량 충진재 또는 Core-material로 사용 할 수 있는 특성을 가진다. The epoxy foaming composition containing a carboxyl group for manufacturing a ship structure according to the present invention satisfies enhanced mechanical properties by including a specific composition of a curing agent, a silicone compound, and a filler in an epoxy resin and has a specific gravity of 0.17 g/cc to 0.25 g/cc lightweight epoxy. It has characteristics that can be used as a lightweight filler or core-material with high strength when applied to a hollow structure (BODY-SHELL structure) in a ship structure and marine composite material structure by obtaining a foamed cured product.
이것은 열역학적으로 안정하여, 상온 (24℃)에서 발포 성형물 제조가 가능하여, 에폭시 발포폼을 경화 시키기 위한 추가적인 경화설비가 필요치 아니하다.It is thermodynamically stable, and it is possible to manufacture a foam molding at room temperature (24 ℃), so there is no need for additional curing equipment for curing the epoxy foam.
또한, 균일한 Close-cell 구조를 가지며, 예를 들면, 우레탄 발포 경화물 대비 내수성이 향상되고, 화학반응에 의한 자체적인 발포 가스생성으로 환경유해물질 빌생이 저감되는 특성을 가진다.In addition, it has a uniform close-cell structure, has improved water resistance compared to, for example, urethane foam cured products, and has characteristics of reducing the production of environmentally harmful substances by generating foam gas by itself through chemical reactions.
이하, 본 발명에 대하여 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail.
본 발명의 일측면에 따르면, a) 제 1 에폭시 수지, b) 액상형 비스페놀계 에폭시 수지 또는 지방족 아민 화합물로 개질된 변성 에폭시 수지, 및 이들의 혼합물을 포함하는 제 2 에폭시 수지, c) 실리콘 수소화합물이 포함된 실리콘 화합물, d) 반응성 계면활성제, 및 e) 충전재를 포함하는 주재; 및 이오노머를 포함하는 아민계 및 폴리아미드계 경화제로, 상기 이오노머를 전체 경화제 100 중량부 대비 0.1 내지 2 중량부를 함유하는 경화제;를 포함하고, 상기 주재 성분 중 카르복실기의 함량이 15 내지 30%인 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물을 제공한다.According to one aspect of the present invention, a) a first epoxy resin, b) a liquid bisphenol-based epoxy resin or a modified epoxy resin modified with an aliphatic amine compound, and a second epoxy resin including a mixture thereof, c) a silicone hydrogen compound a main material including a silicone compound containing; d) a reactive surfactant; and e) a filler; And an amine-based and polyamide-based curing agent including an ionomer, a curing agent containing 0.1 to 2 parts by weight of the ionomer based on 100 parts by weight of the total curing agent; a ship having a carboxyl group content of 15 to 30% among the main components Provided is an epoxy foaming composition containing a carboxyl group for manufacturing a structure.
본 발명에서 제 1 에폭시 수지는 하나 또는 복수의 에폭시기를 갖는 열경화성 수지로, 에폭시기 뿐만 아니라 하나 또는 복수의 관능기를 포함함으로써 다른 조성물과의 화학적 결합을 유도하여 조성물의 혼화성과 발포체의 기계적 물성을 높이는 역할을 한다. 상기 에폭시 수지는 폴리에폭사이드로도 불리며, 원칙적으로 포화, 불포화, 고리형 또는 비고리형의 지방족, 지환족, 방향족 또는 헤테로고리형 폴리에폭사이드일 수 있다. 폴리에폭사이드의 예에는, 알칼리의 존재 하에서의 에피클로로히드린 또는 에피브로모히드린 또는 폴리페놀의 반응에 의해 생성되는 폴리글리시딜 에테르가 포함될 수 있다.In the present invention, the first epoxy resin is a thermosetting resin having one or a plurality of epoxy groups, and contains not only an epoxy group but also one or a plurality of functional groups to induce chemical bonding with other compositions to increase the miscibility of the composition and mechanical properties of the foam. do The epoxy resin is also called polyepoxide, and in principle may be a saturated, unsaturated, cyclic or acyclic aliphatic, alicyclic, aromatic or heterocyclic polyepoxide. Examples of polyepoxides may include polyglycidyl ethers produced by reaction of epichlorohydrin or epibromohydrin or polyphenols in the presence of an alkali.
상기 폴리페놀로 예를 들면 레조르시놀, 파이로카테콜, 히드로퀴논, 비스페놀 A (비스(4-히드록시-페닐)-2,2-프로판), 비스페놀 F (비스(4-히드록시페닐)메탄), 비스(4-히드록시페닐)-1,1-이소부탄, 4,4'-디히드록 시벤조페논, 비스(4-히드록시페닐)-1,1-에탄 및 1,5-히드록시나프탈렌 등을 들 수 있으며, 이들 중 비스페놀 A형이나 비스페놀 F형의 폴리페놀을 베이스로 하는 것이 발포체의 내열성, 내충격성, 내습성을 향상시킬 수 있어 바람직하다.Examples of the polyphenol include resorcinol, pyrocatechol, hydroquinone, bisphenol A (bis(4-hydroxyphenyl)-2,2-propane), bisphenol F (bis(4-hydroxyphenyl)methane) ), bis(4-hydroxyphenyl)-1,1-isobutane, 4,4'-dihydroxybenzophenone, bis(4-hydroxyphenyl)-1,1-ethane and 1,5-hydroxy oxynaphthalene and the like, among which polyphenols of the bisphenol A type or the bisphenol F type can be used as a base to improve the heat resistance, impact resistance and moisture resistance of the foam, and are therefore preferable.
또 다른 폴리에폭사이드는 폴리카르복실산 또는 히드록시카르복실산의 폴리글리시딜 에스테르, 예를 들면 글리시돌 또는 에피클로로히드린과 지방족 또는 방향족 폴리카르복실산, 예컨대 옥살산, 숙신산, 글루타르산, 프탈산, 테트라히드로프탈산, 테레프탈산, 이량체 지방산 또는 p-히드록시벤조산 또는 베타-히드록시 나프토산의 반응 생성물이나, 올레핀성 불포화 지환족 화합물의 에폭시화 생성물로부터, 또는 천연 오일 및 지방 또는 합성 폴리올레핀으로부터 유도된다. 다른 적당한 폴리에폭사이드에는 글리시딜화 아미노알코올 화합물 및 아미노페놀 화합물, 히단토인 디에폭사이드 및 우레탄-개질된 에폭시 수지가 포함된다.Another polyepoxide is a combination of polycarboxylic acids or polyglycidyl esters of hydroxycarboxylic acids, such as glycidol or epichlorohydrin, with aliphatic or aromatic polycarboxylic acids, such as oxalic acid, succinic acid, glue from the reaction products of tartaric acid, phthalic acid, tetrahydrophthalic acid, terephthalic acid, dimer fatty acids or p-hydroxybenzoic acid or beta-hydroxy naphthoic acid, or from the epoxidation products of olefinically unsaturated cycloaliphatic compounds, or from natural oils and fats or It is derived from synthetic polyolefins. Other suitable polyepoxides include glycidylated aminoalcohol compounds and aminophenol compounds, hydantoin diepoxides and urethane-modified epoxy resins.
상기와 같은 에폭시 수지는 하나 또는 복수의 관능기를 포함할 수 있다. 상기와 같이 관능기를 가지는 에폭시 수지는 조성물의 점도를 저하시키고 비결정성을 부여할 수 있으며, 다른 비극성 조성물 또는 극성 조성물과의 혼화성을 높여 반응성 희석제로서 작용할 수 있다.The epoxy resin as described above may include one or more functional groups. As described above, the epoxy resin having a functional group may lower the viscosity of the composition and impart amorphousness, and may function as a reactive diluent by increasing miscibility with other non-polar or polar compositions.
상기 다관능성 에폭시 수지는 반복 단위를 이루는 한 단위구조 내에 하나 이상, 더욱 바람직하게는 2개 이상의 관능기를 가질 수 있다. 이때 상기 관능기의 예로는 히드록시기, 알콕시키, 할로겐기, 알데히드기, 카르보닐기, 카르복실기, 아민기, 니트릴기, 니트로기, 아미드기 및 이미드기 등이 있으며, 이들은 단독으로 또는 둘 이상 포함되어도 좋다.The multifunctional epoxy resin may have one or more, more preferably two or more functional groups in one unit structure constituting a repeating unit. Examples of the functional group include a hydroxy group, an alkoxy group, a halogen group, an aldehyde group, a carbonyl group, a carboxyl group, an amine group, a nitrile group, a nitro group, an amide group, and an imide group, and these may be used alone or in combination of two or more.
다관능성 에폭시 수지의 점도는 25℃에서 2,000 내지 20,000 cPs일 수 있고, 바람직하게는 8,000 내지 15,000 cPs, 더욱 바람직하게는 11,500 내지 13,500 cPs 인 것이 작업성 및 혼화성 측면에서 바람직하다. 또한 에폭시 당량은 100 내지 700 g/eq일 수 있으며, 더욱 바람직하게는 150 내지 350 g/eq인 것이 도막의 내열성, 내충격성, 내습성 등을 유지할 수 있어 바람직하다.The viscosity of the multifunctional epoxy resin may be 2,000 to 20,000 cPs at 25 ° C, preferably 8,000 to 15,000 cPs, more preferably 11,500 to 13,500 cPs It is preferable in terms of workability and miscibility. In addition, the epoxy equivalent may be 100 to 700 g / eq, more preferably 150 to 350 g / eq is preferable because heat resistance, impact resistance, moisture resistance, etc. of the coating film can be maintained.
또한 상기 발포 조성물은 다관능성 에폭시 수지 이외에도 내열성, 내충격성, 유연성 등을 보완하기 하나 또는 복수의 에폭시 수지를 더 포함할 수 있다. 본 발명에서는 제 1 에폭시 수지에 비스페놀계 에폭시 또는 변성 에폭시 수지, 및 이들의 혼합물을 포함하는 제 2 에폭시 수지를 혼합하여 사용한다.In addition, the foaming composition may further include one or more epoxy resins to supplement heat resistance, impact resistance, and flexibility in addition to the multifunctional epoxy resin. In the present invention, the first epoxy resin is mixed with a second epoxy resin including a bisphenol-based epoxy or modified epoxy resin, and a mixture thereof.
본 발명에서의 비스페놀계 에폭시 수지는 조성물과의 혼화성을 높이기 위해 액상 형태로 혼합하며, 특히 다른 조성물과의 혼화성을 높이고 조성물 내의 핀홀을 방지하여 기계적 강도를 높여야 하므로 낮은 점도, 구체적으로 25℃에서 8,000 내지 20,000cPs, 바람직하게는 12,000~15,000 cPs인 것이 바람직하다.The bisphenol-based epoxy resin in the present invention is mixed in a liquid form to increase miscibility with the composition, and especially to increase miscibility with other compositions and prevent pinholes in the composition to increase mechanical strength, so low viscosity, specifically 25 ° C. 8,000 to 20,000 cPs, preferably 12,000 to 15,000 cPs.
상기 비스페놀계 에폭시 수지는 하기 화학식 1의 구조를 가질 수 있다.The bisphenol-based epoxy resin may have a structure represented by Chemical Formula 1 below.
[화학식 1][Formula 1]
상기 화학식 1에서 R1 및 R2는 각각 독립적으로 수소, (C1-C10)알킬기일 수 있으며, 구체적으로 메틸기, 에틸기, 프로필기, 이소프로필기, tert-부틸기, 페틸기, 이소펜틸기, 네오펜틸기, 또는 tert-펜틸기다.In Formula 1, R 1 and R 2 may each independently be hydrogen or a (C1-C10)alkyl group, specifically methyl, ethyl, propyl, isopropyl, tert-butyl, phenyl, isopentyl, A neopentyl group or a tert-pentyl group.
본 발명에서 변성 에폭시 수지는 에폭시 수지의 단점인 유연성을 크게 높여 기계적 물성을 높이기 위한 것으로, 특히 CARBOXYL GROUP을 함유한 원료 및 CARBOXYL GROUP을 함유한 EPOXY 화합물로 개질한 경우, 가교점간의 분자쇄에 의한 자유회전 운동이 향상되어 유연성을 높일 수 있다. 이때 CARBOXYL GROUP을 함유한 원료 화합물로 DIMER FATTY ACID MODIFIESD EPOXY(다이머산 변성 에폭시), 국도화학 YD-172, YD-171, EPIKOTE KER-872, HUNTSMAN HyPox DA-323, DIMER FATTY ACID, MONOMER FATTY ACID, CTBN MODIFIED EPOXY, ATBN MODIFIED EPOXY, ETBN MODIFIED EPOXY, VTBNX MODIFIED EPOXY, CTBN, ATBN, ETB, VTB, PTBN 및 HTBN을 사용할 수 있으며, 이들 변성 에폭시 수지는 조성물 내에서 가소제 역할을 하여 유연성, 내수성 등의 물성을 부여할 수 있다. 구체적으로 변성 에폭시 수지는 25℃에서 점도가 SEMI-SOLID, 에폭시 당량 (EEW)은 350-400 g/eq이며, 특히 다이머산 변성 에폭시의 경우 점도가 350 내지 1000 cPs, 바람직하게는 600 내지 800 cPs, 또는 SEMI-SOLID이다.In the present invention, the modified epoxy resin is intended to greatly increase the flexibility, which is a disadvantage of the epoxy resin, to improve mechanical properties, especially when modified with raw materials containing CARBOXYL GROUP and EPOXY compounds containing CARBOXYL GROUP, Free rotation movement is improved, which can increase flexibility. At this time, DIMER FATTY ACID MODIFIESD EPOXY (dimer acid modified epoxy), Kukdo Chemical YD-172, YD-171, EPIKOTE KER-872, HUNTSMAN HyPox DA-323, DIMER FATTY ACID, MONOMER FATTY ACID, CTBN MODIFIED EPOXY, ATBN MODIFIED EPOXY, ETBN MODIFIED EPOXY, VTBNX MODIFIED EPOXY, CTBN, ATBN, ETB, VTB, PTBN and HTBN can be used, and these modified epoxy resins act as plasticizers in the composition to improve physical properties such as flexibility and water resistance. can be granted. Specifically, the modified epoxy resin has a viscosity of SEMI-SOLID at 25 ° C and an epoxy equivalent weight (EEW) of 350-400 g / eq, and in particular, in the case of dimer acid-modified epoxy, the viscosity is 350 to 1000 cPs, preferably 600 to 800 cPs , or SEMI-SOLID.
본 발명에서의 제 1 에폭시 수지 및 제 2 에폭시 수지는 전체 주재 100 중량% 중 80 내지 90중량% 포함되는 것이 바람직하다. 이때 제 1 에폭시 수지 및 제 2 에폭시 수지를 포함하는 주재 성분 중 카르복실의 함량은 15 내지 30%를 차지한다.The first epoxy resin and the second epoxy resin in the present invention are preferably included in 80 to 90% by weight of 100% by weight of the total main material. At this time, the content of carboxyl among the main components including the first epoxy resin and the second epoxy resin accounts for 15 to 30%.
상기 범위 미만 첨가되는 경우 조성물의 기계적 물성이 하락할 수 있으며, 상기 범위를 초과하는 경우 조성물의 유연성이 떨어져다른 조성물과의 혼화성에 문제가 발생할 수 있다.When added below the above range, the mechanical properties of the composition may be reduced, and when the above range is exceeded, the flexibility of the composition may deteriorate, resulting in miscibility with other compositions.
본 발명에서 실리콘 수소화물이 포함된 실리콘 화합물은 상기 에폭시 수지의 관능기와 높은 반응성을 보이며, 특히 히드록시기 등에 의해 수소나 가연성 가스 등을 생성하여 조성물의 발포가 진행될 수 있다.In the present invention, the silicone compound containing silicon hydride shows high reactivity with the functional group of the epoxy resin, and in particular, the composition can be foamed by generating hydrogen or combustible gas through a hydroxyl group.
실리콘 화합물의 예로는 오가노실란, 오가노실라잔, 폴리메틸실록산, 오가노하이드로겐폴리실록산 및 오가노실록산 올리고머 등이 있으며, 구체적으로 트리메틸클로로실란, 디메틸클로로실란, 메틸트리클로로실란 등의 오가노클로로실란; 메틸트리메톡시실란, 메틸트리에톡시실란, 페닐트리메톡시실란, 에틸트리메톡시실란, n-프로필트리메톡시실란의 유기 트리알콕시실란; 디메틸디메톡시실란, 디메틸디에톡시실란, 디페닐디메톡시실란 등의 디오가노디알콕시실란; 트리메틸메톡시실란, 트리메틸에톡시실란 등의 트리오가노알콕시실란; 이들 오가노알콕시실란의 부분 축합물; 헥사메틸디실라잔 등의 오가노실라잔; 폴리메틸실록산, 오가노하이드로겐폴리실록산, 실라놀기 또는 알콕시기를 갖는 오가노실록산 올리고머 등을 사용할 수 있으며, 이에 한정되지는 않지만 바람직하게는 오가노실라잔, 폴리메틸실록산, 오가노실록산 올리고머이며, 더욱 바람직하게는 폴리메틸실록산이다.Examples of the silicone compound include organosilanes, organosilazanes, polymethylsiloxanes, organohydrogenpolysiloxanes, and organosiloxane oligomers. Specifically, organosilanes such as trimethylchlorosilane, dimethylchlorosilane, and methyltrichlorosilane chlorosilanes; organic trialkoxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, ethyltrimethoxysilane, and n-propyltrimethoxysilane; diorganodialkoxysilanes such as dimethyldimethoxysilane, dimethyldiethoxysilane, and diphenyldimethoxysilane; triorganoalkoxysilanes such as trimethylmethoxysilane and trimethylethoxysilane; partial condensates of these organoalkoxysilanes; organosilazanes such as hexamethyldisilazane; Polymethylsiloxane, organohydrogenpolysiloxane, organosiloxane oligomers having a silanol group or alkoxy group may be used, but are not limited thereto, and organosilazanes, polymethylsiloxanes, and organosiloxane oligomers are preferred. Preferably it is polymethylsiloxane.
상기 폴리메틸실록산은 실록산 사슬을 따라 메틸기와 수소를 포함하는 고분자로 보통 유연제와 방수처리제 등과 같은 다양한 코팅 및 처리제로 사용되나, 알코올, 알데히드, 케톤, 올레핀, 산, 산촉매, 염기 등과 반응하여 수소와 같은 기체를 발생시킬 수 있다. 또한 상기 폴리메틸실록산은 산이나 염기 촉매(예, 루이스 산이나 염기, 점토 등)가 존재할 경우, 습기가 없어도 실록산 주 사슬의 특성에 따라 Me3SiH, Me2SiH2, MeSiH3와 같은 고인화성 부산물이 형성되는 실록산 사슬의 재분배가 일어나며, 이를 통해 실란 가스(SiH4) 등과 같은 발화성 가스가 발생하여 조성물의 발포가 발생하게 된다.The polymethylsiloxane is a polymer containing a methyl group and hydrogen along the siloxane chain and is usually used as a variety of coating and treatment agents such as softeners and waterproofing agents, but reacts with alcohol, aldehydes, ketones, olefins, acids, acid catalysts, bases, etc. same gas can be produced. In addition, the polymethylsiloxane is a siloxane chain in which highly inflammable by-products such as Me3SiH, Me2SiH2, and MeSiH3 are formed according to the characteristics of the siloxane main chain even in the absence of moisture when an acid or base catalyst (eg, Lewis acid or base, clay, etc.) is present. Redistribution of occurs, and through this, an ignitable gas such as silane gas (SiH4) is generated, causing foaming of the composition.
본 발명에서 실리콘 수소화물이 포함된 실리콘 화합물은 전체 주재 조성물 100 중량% 중 3 내지 10 중량%를 포함하는 것이 바람직하다. 상기 실리콘 화합물이 상기 범위 미만 첨가되는 경우 조성물의 발포가 부족할 수 있으며, 상기 범위 초과 첨가하는 경우 제어되지 않는 발열반응이 발생하여 에폭시 수지의 열화를 발생시킬 수 있다.In the present invention, the silicon compound containing silicon hydride preferably contains 3 to 10% by weight based on 100% by weight of the total main composition. When the silicone compound is added below the above range, foaming of the composition may be insufficient, and when the silicone compound is added above the above range, an uncontrolled exothermic reaction may occur, resulting in deterioration of the epoxy resin.
본 발명에서 계면활성제는 조성물의 표면장력 저하, 습윤, 유화, 가용화, 분산성, 기포성 등의 특성을 부여하기 위한 것으로, 특히 함께 혼합되는 실리콘 화합물을 분산시켜 셀의 크기와 구조, 밀도 등을 조절하는 역할을 한다.In the present invention, the surfactant is for imparting properties such as lowering of surface tension, wetting, emulsifying, solubilization, dispersibility, and foaming of the composition, and in particular, controlling the size, structure, density, etc. of the cell by dispersing the silicone compound mixed together play a role
본 발명에서 상기 계면활성제는 여러 계면활성제 중 반응성 계면활성제를 사용하는 것이 바람직하다. 상기와 같은 반응성 계면활성제는 조성물의 경화 시 반응이 가능한 작용기를 함유하기 때문에 경화 과정에서 모노머로도 작용하여 중합 후의 남는 계면활성제의 양을 감소시키기 때문에 보다 향상된 기계적 물성을 가지는 발포체로 제조될 수 있다.In the present invention, it is preferable to use a reactive surfactant among various surfactants as the surfactant. Since the reactive surfactant as described above contains a functional group capable of reacting during curing of the composition, it also acts as a monomer during the curing process to reduce the amount of the surfactant remaining after polymerization, so that it can be manufactured into a foam having more improved mechanical properties. .
상기와 같은 반응성 계면활성제는 주로 메틸기, 에틸기, 프로필기, 펜틸기 등의 탄소수 1 내지 20의 알킬기와, 페닐기, 나프틸기, 안트릴기 등의 탄소수 6 내지 20의 아릴기, 아르알킬기, 아릴렌기 등의 소수성기와 알콕시기, 히드록시기, 에폭시기 등의 친수성기를 포함하는 것일 수 있다. 이러한 반응성 계면활성제의 예를 들면, 실리콘계 계면활성제, 폴리에틸렌글리콜, 폴리프로필렌글리콜, 도데실폴리옥시에틸렌에테르, 트리데실폴리옥시에틸렌에테르, 알킬폴리글리코사이드, 알킬페놀에톡실레이트, 벤질알콜, n-부틸글리시딜에테르, 폴리옥시에틸렌알킬 에테르, 폴리옥시에틸렌알킬에테르의 술포숙신산에스테르염, 폴리옥시에틸렌알킬 에테르의 황산에스테르염, 폴리옥시에틸렌페닐에테르, 폴리옥시에틸렌페닐에테르의 술포숙신산에스테르염, 폴리옥시에틸렌페닐에테르의 황산에스테르염, 폴리옥시에틸렌알킬페닐에테르, 폴리옥시에틸렌알킬페닐에테르의 술포숙신산에스테르염, 폴리옥시에틸렌알킬페닐에테르의 황산에스테르염, 폴리옥시에틸렌아르알킬페닐에테르, 폴리옥시에틸렌아르알킬페닐에테르의 술포숙신산에스테르염, 폴리옥시에틸렌아르알킬페닐에테르의 황산에스테르염이나, 폴리옥시에틸렌알킬페닐에테르의 인산에스테르염, 폴리옥시에틸렌알킬페닐에테르의 지방족 또는 방향족 카르복실산염, 산성 인산(메트)아크릴산에스테르계 유화제 및 로진글리시딜에스테르아크릴레이트의 산 무수물 변성물 등을 들 수 있다. 이들 중 유화성의 관점에서 알킬글리시딜에테르나 알킬페놀에톡실레이트, 벤질알콜, 폴리에틸렌글리콜, 폴리프로필렌글리콜 및 실리콘계 계면활성제를 사용하는 것이 가장 바람직하다.Reactive surfactants as described above are mainly composed of alkyl groups having 1 to 20 carbon atoms such as methyl, ethyl, propyl, and pentyl groups, aryl groups having 6 to 20 carbon atoms, such as phenyl, naphthyl, and anthryl groups, aralkyl groups, and arylene groups. It may contain a hydrophilic group such as a hydrophobic group such as an alkoxy group, a hydroxyl group, or an epoxy group. Examples of such reactive surfactants include silicone surfactants, polyethylene glycol, polypropylene glycol, dodecyl polyoxyethylene ether, tridecyl polyoxyethylene ether, alkyl polyglycoside, alkyl phenol ethoxylate, benzyl alcohol, n- Butyl glycidyl ether, polyoxyethylene alkyl ether, sulfosuccinic acid ester salt of polyoxyethylene alkyl ether, sulfuric acid ester salt of polyoxyethylene alkyl ether, polyoxyethylene phenyl ether, polyoxyethylene phenyl ether sulfosuccinic acid ester salt, Sulfuric acid ester salt of polyoxyethylene phenyl ether, polyoxyethylene alkylphenyl ether, sulfosuccinic acid ester salt of polyoxyethylene alkylphenyl ether, sulfuric acid ester salt of polyoxyethylene alkylphenyl ether, polyoxyethylene aralkylphenyl ether, polyoxyethylene Sulfosuccinic acid ester salt of ethylene aralkyl phenyl ether, sulfuric acid ester salt of polyoxyethylene aralkyl phenyl ether, phosphoric acid ester salt of polyoxyethylene alkyl phenyl ether, aliphatic or aromatic carboxylate salt of polyoxyethylene alkyl phenyl ether, acidic phosphoric acid (meth)acrylic acid ester type emulsifiers and acid anhydride modified products of rosin glycidyl ester acrylate; and the like. Among them, it is most preferable to use alkyl glycidyl ethers, alkyl phenol ethoxylates, benzyl alcohol, polyethylene glycol, polypropylene glycol, and silicone surfactants from the viewpoint of emulsification.
본 발명에서 계면활성제는 전체 주재 조성물 100 중량% 중 1 내지 10 중량% 포함하는 것이 바람직하다. 계면활성제가 상기 범위 미만 첨가되는 경우 조성물의 유동성이 저하되어 혼합이 제대로 이루어지지 않으며, 10 중량% 초과 첨가하는 경우 오히려 과도한 반응성으로 인해 조성물의 혼합과 동시에 급격한 경화반응이 발생하여 성형성이 크게 떨어질 수 있다.In the present invention, the surfactant is preferably included in an amount of 1 to 10% by weight based on 100% by weight of the total main composition. When the surfactant is added in less than the above range, the fluidity of the composition is lowered and mixing is not performed properly, and when the surfactant is added in excess of 10% by weight, a rapid curing reaction occurs simultaneously with mixing of the composition due to excessive reactivity, resulting in greatly reduced moldability. can
본 발명에서 충전재는 발포체의 기계적 물성, 내열성을 개선하고, 상술한 실리콘 화합물과의 반응을 통해 발포 작용을 촉진시키는 역할을 한다. 상기와 같은 충전재의 예를 들면 탄산칼슘, 산화칼슘, 활석, 콜타르, 카본블랙, 유리섬유, 탄소섬유, 실리케이트, 운모, 분말화된 석영, 산화알루미늄, 벤토나이트, 규회석, 카올린, 흄드 실리카 및 실리카 에어로겔 등이 있으며, 이들은 단독으로 또는 둘 이상 혼합하여 사용하여도 좋다.In the present invention, the filler serves to improve the mechanical properties and heat resistance of the foam, and promotes the foaming action through a reaction with the above-mentioned silicone compound. Examples of such fillers include calcium carbonate, calcium oxide, talc, coal tar, carbon black, glass fibers, carbon fibers, silicates, mica, powdered quartz, aluminum oxide, bentonite, wollastonite, kaolin, fumed silica and silica aerogels. and the like, and these may be used alone or in combination of two or more.
상기 충전재로 더욱 바람직하게는 흄드 실리카를 들 수 있다. 상기 흄드 실리카는 규소의 표면에 히드록시기가 다수 배열된 구조로서 에폭시 수지의 최대 단점인 낮은 취성을 개선하며, 균일하게 분산될 경우 조성물의 열안정성과 열전도도와 같은 열적 성질, 파단강도와 인장강도 등의 기계적 성질을 향상시킴과 동시에 표면의 실라놀기와 실리콘 화합물이 반응하여 발포 가스의 생성을 촉진시키게 된다.More preferably, fumed silica is used as the filler. The fumed silica has a structure in which a large number of hydroxyl groups are arranged on the surface of silicon and improves low brittleness, which is the biggest disadvantage of epoxy resins. At the same time as improving the mechanical properties, the silanol group on the surface reacts with the silicon compound to promote the generation of foaming gas.
충전재는 상기 성분들 이외에도 요변제 또는 유변학적 조절제로 사용되는 다양한 무기입자 또는 유기입자를 포함할 수 있다. 예를 들어 월라스토나이트 섬유, 카본 섬유, 세라믹 섬유, 아라미드 섬유 등의 유기 또는 무기섬유, 페놀계 수지, 에폭시 수지 또는 폴리에스테르 기재의 중공형 비드, (메트)아크릴산에스테르 공중합체, 폴리스티렌, 스티렌/(메트)아크릴레이트 공중합체 및, 특히 폴리비닐리덴 클로라이드 및 비닐리덴 클로라이드와 아크릴로니트릴 또는 (메트)아크릴산 에스테르의 공중합체와 같은 고분자의 미소입자, 플라이애시(fly ash)나 캐슈넛, 코르크, 코크 등을 더 포함할 수 있다.In addition to the above components, the filler may include various inorganic or organic particles used as thixotropic agents or rheological modifiers. For example, organic or inorganic fibers such as wollastonite fibers, carbon fibers, ceramic fibers, aramid fibers, phenolic resins, epoxy resins, or polyester-based hollow beads, (meth)acrylic acid ester copolymers, polystyrene, styrene/ Microparticles of polymers such as (meth)acrylate copolymers and, in particular, polyvinylidene chloride and copolymers of vinylidene chloride and acrylonitrile or (meth)acrylic acid esters, fly ash, cashew nuts, cork, coke etc. may be further included.
이들 중 상기 충전재는 아라미드 섬유, 카본 섬유, 알루미늄 섬유, 유리 섬유, 폴리아미드 섬유, 폴리에틸렌 섬유 또는 폴리에스테르 섬유를 기재로 한 섬유를 더 부가하여 기계적 물성을 더 높일 수 있고 발포 효과 또한 높일 수 있다.Among these, the filler may further increase mechanical properties and foaming effect by adding fibers based on aramid fibers, carbon fibers, aluminum fibers, glass fibers, polyamide fibers, polyethylene fibers, or polyester fibers.
상기 충전재는 상기 주재 100 중량% 중 1 내지 10 중량%를 포함하는 것이 바람직하다. 1 중량% 미만 첨가되는 경우 상술한 특성, 특히 실리콘 화합물의 발포 효과가 미비할 수 있으며, 상기 범위 초과 첨가하는 경우 조성물의 상분리가 발생하여 기계적 물성이 오히려 하락할 수 있다.The filler preferably comprises 1 to 10% by weight based on 100% by weight of the main material. When less than 1% by weight is added, the above-described properties, in particular, the foaming effect of the silicone compound may be insufficient, and when added in excess of the above range, phase separation of the composition may occur and mechanical properties may rather deteriorate.
본 발명에서 주재는 제조방법을 한정하지 않는다. 일예로 먼저 제 1 에폭시 수지, 액상형 비스페놀계 에폭시 수지 또는 지방족 아민 화합물로 개질된 변성 에폭시 수지, 및 이들의 혼합물을 포함하는 제 2 에폭시 수지 80 내지 90 중량%에 실리콘 화합물 3 내지 10 중량%를 혼합한 후, 이를 호모게나이저나 인펠라 등으로 70 내지 80℃의 온도 하에서 300 내지 700 rpm의 속도로 교반한다. 그리고 여기에 반응성 계면활성제 1 내지 10중량% 및 충전재 1 내지 10중량%를 투입하고 잔열을 이용하여 동일한 속도로 교반한다. 상기와 같이 반응성 계면활성제까지 투입된 조성물에는 필러를 투입하고 충분히 교반한다.In the present invention, the main material does not limit the manufacturing method. For example, first, 3 to 10% by weight of a silicone compound is mixed with 80 to 90% by weight of a first epoxy resin, a liquid bisphenol-based epoxy resin or a modified epoxy resin modified with an aliphatic amine compound, and a second epoxy resin including a mixture thereof After that, it is stirred at a speed of 300 to 700 rpm under a temperature of 70 to 80 ° C. with a homogenizer or impeller. Then, 1 to 10% by weight of a reactive surfactant and 1 to 10% by weight of a filler are added thereto and stirred at the same speed using residual heat. As described above, a filler is added to the composition into which the reactive surfactant is added, and the mixture is sufficiently stirred.
본 발명에 따른 주재는 상기 성분들 이외에도 다양한 성분의 첨가제를 더 첨가하여도 무방하다. 이때 상기 첨가제는 희석제, 열가소성 중합체 분말, 커플링제, 가소제, 유변성제, 습윤제, 접착제, 안정화제 및 색소 등에서 선택되는 어느 하나 또는 복수일 수 있으며, 이들 이외에도 발포촉진제, 커플링제 등을 더 포함하여도 무방하다.The main material according to the present invention may further add additives of various components in addition to the above components. In this case, the additive may be any one or a plurality selected from a diluent, a thermoplastic polymer powder, a coupling agent, a plasticizer, a rheology modifier, a wetting agent, an adhesive, a stabilizer, and a colorant, and in addition to these, a foam accelerator, a coupling agent, etc. free
예를 들어 상기 발포촉진제는 우레아, 유기산이나 백금, 아민, 납, 주석, 아연, 칼슘, 카드뮴 등의 산화물 및 이들의 염을 더 포함할 수 있으며, 본 발명이 이에 한정되는 것은 아니다.For example, the foam accelerator may further include urea, an organic acid, an oxide of platinum, amine, lead, tin, zinc, calcium, cadmium, or the like, and a salt thereof, but the present invention is not limited thereto.
또한 커플링제는 실란 및 유기메탈레이트, 예컨대 유기 실란, 티타네이트, 지르코네이트 등이 있으며, 이들 이외에도 상업적으로 사용 가능한 커플링제라면 종류에 한정치 않는다.In addition, coupling agents include silanes and organic metalates, such as organic silanes, titanates, zirconates, and the like, and other than these, commercially available coupling agents are not limited to the type.
본 발명에서 경화제는 상기 주재의 에폭시를 경화하기 위한 것으로, 상온에서의 경화가 가능하며, 주재와 경화제를 따로 계량하여 배합하여야 하는 2액형 조성물이나, 내약품성, 내열성, 내충격성, 내습성이 뛰어난 특성으로 본 발명에서 원하는 항공, 선박, 자동차 등의 복합소재, 단열재, 몰드재, 접착제 등의 다양한 용도로 사용될 수 있다.In the present invention, the curing agent is for curing the epoxy of the main material, and can be cured at room temperature, and is a two-component composition in which the main material and the curing agent must be separately measured and mixed, but has excellent chemical resistance, heat resistance, impact resistance, and moisture resistance. Due to its characteristics, it can be used for various purposes such as composite materials, insulation materials, mold materials, adhesives, etc. for aviation, ship, automobile, etc. desired in the present invention.
본 발명에서 경화제로 더욱 바람직하게는 아민계 경화제와 폴리아미드형 경화제의 혼합물일 수 있다. 상기와 같은 경화제는 다관능성 에폭시 수지, 특히 비스페놀계 에폭시 수지와 반응하여 기계적 강도를 크게 높일 수 있다.In the present invention, the curing agent may be more preferably a mixture of an amine-based curing agent and a polyamide-type curing agent. The above curing agent reacts with a multifunctional epoxy resin, particularly a bisphenol-based epoxy resin, to greatly increase mechanical strength.
본 발명에서 아민계 경화제는 조성물의 가교밀도를 높여 조성물의 내화학성, 내수성 및 내열성을 향상시키는 역할을 하는 것으로, 상기 아민계 경화제는 지방족 아민계 화합물 또는 중합체, 특히 변성 지방족 또는 지환족 아민계를 포함할 수 있다.In the present invention, the amine-based curing agent serves to improve the chemical resistance, water resistance and heat resistance of the composition by increasing the crosslinking density of the composition. can include
상기와 같은 아민계 경화제의 예를 들면, 1,3-벤젠디메탄아민, 에틸렌디아민, 1,3-디아미노프로판, 1,4-디아미노프로판, 헥사메틸렌디아민, 2,5-디메틸헥사메틸렌디아민, 트리메틸헥사메틸렌디아민, 디에틸렌트리아민, 이미노비스프로필아민, 비스(헥사메틸렌)트리아민, 트리에틸렌테트라민, 테트라에틸렌펜타민, 펜타에틸렌헥사민, N-히드록시에틸에틸렌디아민, 테트라(히드록시에틸)에틸렌디아민, 트리에틸렌글리콜디아민, 테트라에틸렌글리콜디아민, 디에틸렌글리콜비스(프로필아민), 폴리옥시프로필렌디아민, 폴리옥시프로필렌트리아민, 이소포론디아민, 메타센디아민, N-아미노에틸피페라진, 비스(4-아미노-3-메틸디시클로헥실)메탄, 비스(아미노메틸)시클로헥산, 3,9-비스(3-아미노프로필)2,4,8,10-테트라옥사스피로(5,5)운데칸, 노르보르넨디아민, 테트라클로로-p-크실렌디아민, m-크실렌디아민, p-크실렌디아민, m-페닐렌디아민, o-페닐렌디아민, p-페닐렌디아민, 2,4-디아미노아니솔, 2,4-톨루엔디아민, 2,4-디아미노디페닐메탄, 4,4'-디아미노디페닐메탄, 4,4'-디아미노1,2-디페닐에탄, 2,4-디아미노디페닐술폰, m-아미노페놀, m-아미노벤질아민, 벤질디메틸아민, 2-디메틸아미노메틸)페놀, 트리에탄올아민, 메틸벤질아민, α-(m-아미노페닐)에틸아민, α-(p-아미노페닐)에틸아민, 디아미노디에틸디메틸디페닐메탄 및 α,α'-비스(4-아미노페닐)-p-디이소프로필벤젠 등이 있으며, 이들 중 1,3-벤젠디메탄아민을 사용하는 것이 상온에서의 경화속도를 높이며, 조성물의 더 높은 유리전이온도, 개선된 내약품성, 기계적 물성을 부여할 수 있다.Examples of the above amine-based curing agent include 1,3-benzenedimethaneamine, ethylenediamine, 1,3-diaminopropane, 1,4-diaminopropane, hexamethylenediamine, and 2,5-dimethylhexamethylene. Diamine, trimethylhexamethylenediamine, diethylenetriamine, iminobispropylamine, bis(hexamethylene)triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-hydroxyethylethylenediamine, tetra( Hydroxyethyl) ethylenediamine, triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis (propylamine), polyoxypropylene diamine, polyoxypropylene triamine, isophorone diamine, metacene diamine, N-aminoethyl pipette Razine, bis(4-amino-3-methyldicyclohexyl)methane, bis(aminomethyl)cyclohexane, 3,9-bis(3-aminopropyl)2,4,8,10-tetraoxaspiro(5, 5) Undecane, norbornenediamine, tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4- Diaminoanisole, 2,4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino1,2-diphenylethane, 2, 4-diaminodiphenylsulfone, m-aminophenol, m-aminobenzylamine, benzyldimethylamine, 2-dimethylaminomethyl)phenol, triethanolamine, methylbenzylamine, α-(m-aminophenyl)ethylamine, α -(p-aminophenyl)ethylamine, diaminodiethyldimethyldiphenylmethane, and α,α'-bis(4-aminophenyl)-p-diisopropylbenzene. The use of methanamine increases the curing speed at room temperature, and can impart a higher glass transition temperature, improved chemical resistance, and mechanical properties of the composition.
폴리아미드계 경화제는 에폭시 수지와 직접 중합되어 상기 에폭시 수지에 다수의 관능기를 부여하기 위한 것으로, 특히 아미드기가 상술한 충전재, 특히 흄드실리카 등의 관능기와 수소결합하여 조성물의 내열성 및 내구성을 더욱 높이는 역할을 한다.The polyamide-based curing agent is directly polymerized with an epoxy resin to impart a plurality of functional groups to the epoxy resin, and in particular, the amide group hydrogen bonds with the above-mentioned filler, in particular, a functional group such as fumed silica to further increase the heat resistance and durability of the composition play a role
상기 폴리아미드계 경화제는 지방족 폴리아미드 또는 방향족 폴리아미드일 수 있으며, 발포체의 사용 목적에 따라 이들의 종류를 자유롭게 변경할 수 있다. 예를 들어 상기 발포체가 유연성을 요구하는 경우, 방향족 폴리아미드보다는 지방족 폴리아미드를 사용하는 것이 좋으며, 내열성이나 기계적 물성을 더욱 높이기 위해서는 방향족 폴리아미드를 사용하는 것이 바람직하다.The polyamide-based curing agent may be an aliphatic polyamide or an aromatic polyamide, and the type thereof may be freely changed according to the purpose of use of the foam. For example, when the foam requires flexibility, it is preferable to use aliphatic polyamide rather than aromatic polyamide, and to further improve heat resistance or mechanical properties, it is preferable to use aromatic polyamide.
본 발명에서 폴리아미드계 경화제의 예를 들면, 폴리아미도아민, 디에틸렌 트리아민, 트리에틸렌테트라아민, 테트라에틸렌 펜타아민, 3,3-아미노 비스프로필아민 및 m-크실렌다이아민에서 선택되는 어느 하나 또는 복수를 들 수 있으며, 이들 중 폴리아미도아민을 사용하는 것이 유연성을 만족하면서도 폴리아미도아민의 분자쇄 길이를 자유롭게 조절함에 따라 내열성 또한 조절 가능하기 때문에 바람직하다.In the present invention, the polyamide-based curing agent is, for example, any one selected from polyamidoamine, diethylene triamine, triethylenetetraamine, tetraethylene pentaamine, 3,3-amino bispropylamine and m-xylenediamine Or a plurality may be mentioned, and among them, the use of polyamidoamine is preferable because it can also adjust heat resistance by freely adjusting the molecular chain length of polyamidoamine while satisfying flexibility.
이외에도 상기 경화제는 아민계 및 폴리아미드형 경화제 이외에도 보조 경화제를 더 포함할 수도 있으며, 함량은 주재 100 중량부 대비 5 내지 15 중량부이다.In addition, the curing agent may further include an auxiliary curing agent in addition to the amine-based and polyamide-type curing agents, and the content is 5 parts based on 100 parts by weight of the main material to 15 parts by weight.
상기 보조 경화제의 예를 들면 이미다졸, p-클로로페닐-N,N-디메틸우레아(MONURON), 3-페닐-1,1-디메틸우레아(FENURON) 또는 3,4-디클로로페닐-N,N-디메틸우레아(DIURON)와 같은 치환된 우레아, 예를들면 벤질디메틸아민과 같은 3차 아릴- 또는 알킬아민 등의 아미노 화합물, 트리스(디메틸아미노)페놀, 피페리딘 또는 피페리딘 유도체, 아민 염 및 4차 암모늄 화합물 또는 사이클로 아민류 중 예를 들면, 1,3-비스(아미노 메틸)사이클로헥산, P-아미노 디사이클로헥실메탄, 이소포론 디아민 또는 아로마틱 아민류 중 메타크실렌 디아민을 들 수 있으며, 바람직하게는 이미다졸, 메타크실렌 디아민 및 트리스(디메틸아미노)페놀이며, 더욱 바람직하게는 이미다졸 및 메타크실렌 디아민이며, 가장 바람직하게는 메타크실렌 디아민이다.Examples of the auxiliary curing agent include imidazole, p-chlorophenyl-N,N-dimethylurea (MONURON), 3-phenyl-1,1-dimethylurea (FENURON) or 3,4-dichlorophenyl-N,N- substituted ureas such as dimethylurea (DIURON), amino compounds such as for example tertiary aryl- or alkylamines such as benzyldimethylamine, tris(dimethylamino)phenol, piperidine or piperidine derivatives, amine salts and Examples of quaternary ammonium compounds or cycloamines include 1,3-bis(amino methyl)cyclohexane, P-amino dicyclohexylmethane, isophorone diamine, or metaxylene diamine among aromatic amines, preferably imidazole, metaxylene diamine and tris(dimethylamino)phenol, more preferably imidazole and metaxylene diamine, most preferably metaxylene diamine.
본 발명에서 경화제는 아민계 경화제 10 내지 50 중량%에 폴리아미드형 경화제 50 내지 90 중량%를 첨가하는 것이 바람직하다. 상기 범위를 벗어나는 경우 조성물의 기계적 물성이 떨어지거나 각 조성물 간의 혼화성이 하락할 수 있어 좋지 않다.In the present invention, it is preferable to add 50 to 90% by weight of a polyamide type curing agent to 10 to 50% by weight of an amine-based curing agent. If it is out of the above range, it is not good because the mechanical properties of the composition may deteriorate or miscibility between each composition may decrease.
또한 경화제는 상기 아민계 및 폴리아미드계 이외에 조성물 간의 화학적 결합을 높여 기계적 물성을 향상시킬 수 있도록 하나 또는 복수의 이오노머를 더 포함할 수 있다.In addition, the curing agent may further include one or a plurality of ionomers in addition to the amine-based and polyamide-based curing agents to improve mechanical properties by increasing chemical bonding between the compositions.
이오노머는 에틸렌 아크릴산 또는 에틸렌 메타크릴산의 공중합체의 카르복실산기의 일부가 금속 양이온으로 치환된 것을 의미하며, 본 발명에서 사용하는 바람직한 이오노머로는 에틸렌과 같은 올레핀 공중합체(olefin copolymer)와 아연(Zn), 나트륨(Na), 마그네슘(Mg) 혹은 리튬(Li) 등의 금속이온이 중화된 카르복실릭산을 함유하고 있고, 아크릴(acryl) 혹은 메타크릴(methacryl)산과 같은 불포화 카르복실산의 공중합체(copolymer)를 사용할 수 있다.The ionomer means that a part of the carboxylic acid group of a copolymer of ethylene acrylic acid or ethylene methacrylic acid is substituted with a metal cation, and preferred ionomers used in the present invention include olefin copolymers such as ethylene and zinc ( It contains carboxylic acids neutralized with metal ions such as Zn), sodium (Na), magnesium (Mg) or lithium (Li). A copolymer may be used.
상업적으로 사용되는 이오노머는 나트륨에 의하여 중화된 등급(grade)으로 SURLYN 8140이 있고, 아연에 의해 중화된 등급으로는 SURLYN 9910 등이 있으나, 이에 제한된 것은 아니다.Commercially used ionomers include SURLYN 8140 as a grade neutralized by sodium and SURLYN 9910 as a grade neutralized by zinc, but are not limited thereto.
상기 이오노머는 전체 경화제 100 중량부 대비 0.1 내지 2 중량부, 바람직하게는 0.1 내지 1.5 중량부, 더욱 바람직하게는 0.1 내지 1.0 중량부를 첨가하는 것이 바람직하다. 상기 범위 미만 첨가되는 경우 이오노머 첨가에 따른 제반 물성 향상의 효과가 나타나지 않으며, 상기 범위를 초과하여 첨가하는 경우 계면 혼화성의 지나친 증가로 인해 경화속도가 급속히 증가하여 조성물의 성형성과 기계적 물성이 하락할 수 있다.The ionomer is preferably added in an amount of 0.1 to 2 parts by weight, preferably 0.1 to 1.5 parts by weight, more preferably 0.1 to 1.0 parts by weight, based on 100 parts by weight of the total curing agent. When added below the above range, the effect of improving physical properties due to the addition of the ionomer does not appear, and when added above the above range, the curing rate rapidly increases due to an excessive increase in interfacial miscibility, and the moldability and mechanical properties of the composition may deteriorate. there is.
본 발명에 따른 발포 성형폼은 상술한 바와 같이 먼저 주재를 구성하는 성분들을 혼합하여 조성물 형태로 제조한 다음, 여기에 폴리아미드계 경화제와 아민계 경화제를 혼합하고, 여기에 기타 첨가제를 혼합하는 것이 바람직하다. 이때 특히 경화제를 첨가하는 중에 조성물의 온도는 100℃ 이하, 더욱 바람직하게는 상온(20℃ 내외)에서 혼합하는 것이 바람직하다.As described above, the foam molded foam according to the present invention is prepared in the form of a composition by first mixing the components constituting the main material, then mixing a polyamide-based curing agent and an amine-based curing agent, and mixing other additives thereto. desirable. At this time, it is preferable to mix the composition at a temperature of 100° C. or less, more preferably at room temperature (around 20° C.) during the addition of the curing agent.
또한 상기 주재와 경화제의 조성비는 본 발명에서 한정하는 것은 아니나, 주재 100 중량부 대비 경화제 20 내지 50 중량부로 혼합하는 것이 성형성 및 발포특성을 만족할 수 있어 바람직하다.In addition, the composition ratio of the main material and the curing agent is not limited in the present invention, but mixing 20 to 50 parts by weight of the curing agent with respect to 100 parts by weight of the main material is preferable because it can satisfy moldability and foaming characteristics.
상기와 같이 혼합된 조성물은 중간에 저장되거나, 사출성형기, 압출기 또는 캘린더링 기계와 같은 추가 가공용 장비로 직접 이송될 수 있다. 특히 발포 성형폼을 제조하기 위해서는 사출 금형에 상기 조성물을 넣고 이를 발포, 경화시키되, 금형의 온도 또한 상온으로 유지시키는 것이 바람직하다.The mixed composition may be stored intermediately or directly transferred to equipment for further processing, such as an injection molding machine, an extruder or a calendering machine. In particular, in order to manufacture an expanded molded foam, it is preferable to put the composition into an injection mold, foam and harden it, and maintain the temperature of the mold at room temperature.
본 발명의 에폭시 발포 조성물은 작은 변형량을 가지면서 파괴되는 성질의 취성을 가지는 brittleness를 보완하기 위해 linear한 분자사슬의 카르복실기를 가진 원료를 추가 사용하므로, 상기 에폭시 발포 조성물은 수지 성분 함량 중 카르복실의 함량은 15 내지 30%이다. Since the epoxy foaming composition of the present invention additionally uses a raw material having a carboxyl group of a linear molecular chain in order to compensate for the brittleness of the brittleness of the breaking property while having a small deformation amount, the epoxy foaming composition has the carboxyl content of the resin component. The content is 15 to 30%.
본 발명의 다른 일측면에 따르면, 상기 에폭시 발포 조성물로부터 형성된 선박구조체를 제공한다.According to another aspect of the present invention, a ship structure formed from the epoxy foam composition is provided.
본 발명의 또 다른 일측면에 따르면, a) 제 1 에폭시 수지, b) 액상형 비스페놀계 에폭시 수지 또는 지방족 아민 화합물로 개질된 변성 에폭시 수지, 및 이들의 혼합물을 포함하는 제 2 에폭시 수지, c) 실리콘 수소화합물이 포함된 실리콘 화합물, d) 반응성 계면활성제, 및 e) 충전재를 포함하는 주재; 및 이오노머를 포함하는 아민계 및 폴리아미드계 경화제로, 상기 이오노머를 전체 경화제 100 중량부 대비 0.1 내지 2 중량부를 함유하는 경화제;를 포함하는 2액형 조성물을 혼합하여 경화한 에폭시 발포 경화물로서, 상기 조성물은 주재 100 중량부 대비 경화제 20 내지 50 중량부로 혼합되고, 압축 강도가 500 내지 700 psi인 것을 특징으로 하는 선박구조체 제조를 위한 에폭시 발포 경화물을 제공한다.According to another aspect of the present invention, a) a first epoxy resin, b) a liquid bisphenol-based epoxy resin or a modified epoxy resin modified with an aliphatic amine compound, and a second epoxy resin including a mixture thereof, c) silicone a main material including a silicone compound containing a hydrogen compound, d) a reactive surfactant, and e) a filler; And an amine-based and polyamide-based curing agent including an ionomer, a curing agent containing 0.1 to 2 parts by weight of the ionomer based on 100 parts by weight of the total curing agent; The composition is mixed with 20 to 50 parts by weight of the curing agent relative to 100 parts by weight of the main material, and provides an epoxy foamed and cured product for manufacturing ship structures, characterized in that the compressive strength is 500 to 700 psi.
주재 성분 중 카르복실기 함량 15 내지 30%일 때, 기계적 물성이 전체적으로 향상된다. 카르복실의 함량이 15 내지 30%일 때 항복점에서의 압축강도의 경우 500 내지 700psi, 바람직하게는 550 내지 650 psi로, 기준(STANDARD:486) 대비 100 내지 150% 증가한다.When the carboxyl group content in the main component is 15 to 30%, mechanical properties are improved as a whole. When the carboxyl content is 15 to 30%, the compressive strength at the yield point is 500 to 700 psi, preferably 550 to 650 psi, and increases by 100 to 150% compared to STANDARD: 486.
이외, 압축탄성률의 경우, 전체 수지 조성물 중 카르복실의 함량이 15 내지 30%일 때, 8000 내지 40000 psi, 바람직하게는 10000 내지 40000 psi, 더욱 바람직하게는 11000 내지 39000 psi로, 기준(Standard:7600 psi) 대비 100 내지 530% 증가한다.In addition, in the case of compressive modulus, when the content of carboxyl in the total resin composition is 15 to 30%, 8000 to 40000 psi, preferably 10000 to 40000 psi, more preferably 11000 to 39000 psi, standard (Standard: 7600 psi) increases by 100 to 530%.
또한, 최대인장강도의 경우, 전체 수지 조성물 중 카르복실의 함량이 15 내지 30%일 때, 500 내지 700 psi, 바람직하게는 500 내지 650 psi로, 기준(STANDARD:486 psi) 대비 100 내지 145%증가한다.In addition, in the case of ultimate tensile strength, when the content of carboxyl in the total resin composition is 15 to 30%, 500 to 700 psi, preferably 500 to 650 psi, 100 to 145% compared to the standard (STANDARD: 486 psi) It increases.
비중은 전체 수지 조성물 중 카르복실의 함량이 15 내지 30%일 때, 모두 0.25g/cc로, 기준(Standard:0.25g/cc)과 같다.The specific gravity is 0.25 g/cc when the content of carboxyl in the total resin composition is 15 to 30%, the same as standard (0.25 g/cc).
이하, 본 명세서를 구체적으로 설명하기 위해 실시예를 들어 상세하게 설명하기로 한다. 그러나, 본 명세서에 따른 실시예들은 여러 가지 다른 형태로 변형될 수 있으며, 본 명세서의 범위가 아래에서 기술하는 실시예들에 한정되는 것으로 해석되지 않는다. 본 명세서의 실시예들은 당업계에서 평균적인 지식을 가진 자에게 본 명세서를 보다 완전하게 설명하기 위해 제공되는 것이다.Hereinafter, examples will be described in detail in order to specifically describe the present specification. However, embodiments according to the present specification may be modified in many different forms, and the scope of the present specification is not construed as being limited to the embodiments described below. The embodiments herein are provided to more completely explain the present specification to those skilled in the art.
<실시예><Example>
선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물의 제조Preparation of epoxy foaming composition containing carboxyl group for manufacturing ship structure
하기 표 1의 조성비를 바탕으로 조성물을 제조하되, 조성물의 혼합 온도는 상온(20℃)이며, 교반속도 500 rpm이었다. 제조된 조성물은 먼저 5분간 예비 겔화시키고, 사출장치에서 30분간 경화 및 발포시켜 10 ㎝ × 10㎝ × 1㎝ 크기의 시편을 완성하였다.A composition was prepared based on the composition ratio of Table 1 below, but the mixing temperature of the composition was room temperature (20° C.) and the stirring speed was 500 rpm. The prepared composition was pre-gelled for 5 minutes, cured and foamed for 30 minutes in an injection device to complete a specimen having a size of 10 cm × 10 cm × 1 cm.
(중량비)The main material: hardener
(weight ratio)
화합물silicon
compound
상기 표 1에서 에폭시는 제 1 에폭시 수지, 액상형 비스페놀계 에폭시 수지 또는 지방족 아민 화합물로 개질된 변성 에폭시 수지, 및 이들의 혼합물을 포함하는 제 2 에폭시 수지를 포함한다. 또한, 이오노머는 경화제 전체 100 중량부 대비 첨가량(중량부)을 의미한다.Epoxy in Table 1 includes a first epoxy resin, a liquid bisphenol-based epoxy resin or a modified epoxy resin modified with an aliphatic amine compound, and a second epoxy resin including a mixture thereof. In addition, the ionomer means the added amount (parts by weight) relative to 100 parts by weight of the total curing agent.
물성 측정Physical property measurement
제조한 실시예1~3, 비교예1~11의 여러 물성을 측정하였다.Various physical properties of prepared Examples 1 to 3 and Comparative Examples 1 to 11 were measured.
ⓐ 인강강도 및 신율 : ASTM D 638에 의거하여 실시하였다.ⓐ Tensile strength and elongation: Conducted in accordance with ASTM D 638.
ⓑ 굴곡강도 및 굴곡탄성율 : ASTM D 790에 의거하여 실시하였다.ⓑ Flexural strength and flexural modulus: Conducted in accordance with ASTM D 790.
ⓒ IZOD 충격강도 : ASTM D 256에 의거하여 실시하였다.ⓒ IZOD impact strength: conducted in accordance with ASTM D 256.
ⓓ 항복점에서의 압축강도 및 압축탄성율(3% 변형시) : ASTM D 1621에 의거하여 실시하였다.ⓓ Compressive strength and compressive modulus at yield point (at 3% strain): Conducted in accordance with ASTM D 1621.
ⓔ 겉보기 전체 밀도 : ISO-845에 의거하여 실시하였다.ⓔ Apparent overall density: Conducted in accordance with ISO-845.
<결과 및 평가><Results and evaluation>
(kgf/cm2)tensile strength
(kgf/cm 2 )
(%)elongation
(%)
(kgf/cm2)flexural strength
(kgf/cm 2 )
(kgf/cm2)flexural modulus
(kgf/cm 2 )
(kgf/cm2)impact strength
(kgf/cm 2 )
(psi)compressive strength
(psi)
탄성율
(psi)compression
modulus of elasticity
(psi)
(g/cc)apparent overall density
(g/cc)
표 2는 제조한 실시예 1~3, 비교예 1~11의 물성값을 나타낸 것이다. 제조된 발포 성형폼은 인장강도, 신율, 굴곡강도, 굴곡탄성율, 충격강도 등 모든 기계적인 물성에서 높은 수치를 보임을 알 수 있었다. 특히 이오노머를 포함하는 실시예 2 및 실시예 3의 경우, 그렇지 않은 실시예 1에 비해 모든 기계적 물성이 상승한 것을 확인하였으며, 이는 이오노머의 긴 분자쇄가 자유회전 운동을 함에 따라 유연성이 부가되면서도, 카르복실기와 같은 관능기가 다른 에폭시 수지나 충전재와 화학적 결합이 진행되어 충격강도 등이 증가한 것으로 보인다. Table 2 shows the physical property values of Examples 1 to 3 and Comparative Examples 1 to 11 prepared. It was found that the manufactured expanded molded foam showed high values in all mechanical properties such as tensile strength, elongation, flexural strength, flexural modulus, and impact strength. In particular, in the case of Examples 2 and 3 including the ionomer, it was confirmed that all mechanical properties were increased compared to Example 1, which did not include the ionomer. It seems that the impact strength, etc., has increased as the functional groups such as the chemical bonding with other epoxy resins or fillers have progressed.
전술한 내용은 후술할 발명의 청구범위를 더욱 잘 이해할 수 있도록 본 발명의 특징과 기술적 장점을 다소 폭넓게 상술하였다. 본 발명이 속하는 기술 분야의 통상의 지식을 가진 자는 본 발명이 그 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The foregoing has outlined rather broadly the features and technical advantages of the present invention in order that the scope of the invention which follows may be better understood. Those skilled in the art to which the present invention pertains will understand that the present invention can be embodied in other specific forms without changing its technical spirit or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. The scope of the present invention is indicated by the following claims rather than the above detailed description, and all changes or modifications derived from the claims and equivalent concepts should be construed as being included in the scope of the present invention.
Claims (7)
이오노머를 포함하는 아민계 및 폴리아미드계 경화제로, 상기 이오노머를 전체 경화제 100 중량부 대비 0.1 내지 2 중량부를 함유하는 경화제;를 포함하고,
상기 주재 성분 중 카르복실기의 함량이 15 내지 30%인 것을 특징으로 하는 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물.
a) a first epoxy resin, b) a liquid bisphenol-based epoxy resin or a modified epoxy resin modified with an aliphatic amine compound, and a second epoxy resin including a mixture thereof, c) a silicone compound containing a silicon hydrogen compound, d) a reactive surfactant, and e) a main material comprising a filler; and
An amine-based and polyamide-based curing agent containing an ionomer, and a curing agent containing 0.1 to 2 parts by weight of the ionomer based on 100 parts by weight of the total curing agent;
Epoxy foaming composition containing a carboxyl group for manufacturing a ship structure, characterized in that the content of the carboxyl group in the main component is 15 to 30%.
상기 제 1 에폭시 수지는 반복 단위를 이루는 한 단위구조 내에 하나 이상의 히드록시기, 알콕시키, 할로겐기, 알데히드기, 카르보닐기, 카르복실기, 아민기, 니트릴기, 니트로기, 아미드기 및 이미드기를 단독 또는 둘 이상 포함하는 것을 특징으로 하는 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물.
According to claim 1,
The first epoxy resin includes one or more hydroxy groups, alkoxy groups, halogen groups, aldehyde groups, carbonyl groups, carboxyl groups, amine groups, nitrile groups, nitro groups, amide groups, and imide groups alone or two or more in one unit structure constituting a repeating unit. An epoxy foaming composition containing a carboxyl group for manufacturing a ship structure, characterized in that.
상기 a) 및 b)의 함량은 전체 주재 100 중량%에 대하여 80 내지 90 중량%을 포함하는 것을 특징으로 하는 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물.
According to claim 1,
The content of a) and b) is an epoxy foaming composition containing a carboxyl group for manufacturing a ship structure, characterized in that it comprises 80 to 90% by weight based on 100% by weight of the total main material.
상기 아민계 및 폴리아미드계 경화제는 전체 경화제 100 중량%에 대하여 아민계 경화제 10 내지 50중량%, 폴리아미드계 경화제 50 내지 90 중량%를 포함하는 것을 특징으로 하는 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물.
According to claim 1,
The amine-based and polyamide-based curing agents contain 10 to 50% by weight of the amine-based curing agent and 50 to 90% by weight of the polyamide-based curing agent based on 100% by weight of the total curing agent. Epoxy foam composition.
상기 경화제는 첨가 중에 조성물의 온도가 20 내지 100℃인 것을 특징으로 하는 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물.
According to claim 1,
The curing agent is an epoxy foaming composition containing a carboxyl group for manufacturing a ship structure, characterized in that the temperature of the composition during addition is 20 to 100 ℃.
A ship structure formed from the epoxy foam composition according to any one of claims 1 to 5.
이오노머를 포함하는 아민계 및 폴리아미드계 경화제로, 상기 이오노머를 전체 경화제 100 중량부 대비 0.1 내지 2 중량부를 함유하는 경화제;를 포함하는 2액형 조성물을 혼합하여 경화한 에폭시 발포 경화물로서,
상기 조성물은 주재 100 중량부 대비 경화제 20 내지 50 중량부로 혼합되고,
압축 강도가 500 내지 700 psi인 것을 특징으로 하는 선박구조체 제조를 위한 에폭시 발포 경화물.a) a first epoxy resin, b) a liquid bisphenol-based epoxy resin or a modified epoxy resin modified with an aliphatic amine compound, and a second epoxy resin including a mixture thereof, c) a silicone compound containing a silicon hydrogen compound, d) a reactive surfactant, and e) a main material comprising a filler; and
An amine-based and polyamide-based curing agent including an ionomer, and a curing agent containing 0.1 to 2 parts by weight of the ionomer based on 100 parts by weight of the total curing agent;
The composition is mixed with 20 to 50 parts by weight of the curing agent based on 100 parts by weight of the main material,
Epoxy foam cured material for manufacturing ship structures, characterized in that the compressive strength is 500 to 700 psi.
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US5575526A (en) | 1994-05-19 | 1996-11-19 | Novamax Technologies, Inc. | Composite laminate beam for radiator support |
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US5575526A (en) | 1994-05-19 | 1996-11-19 | Novamax Technologies, Inc. | Composite laminate beam for radiator support |
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