KR20230069759A - Electronic device for generating an image and method thereof - Google Patents

Abstract

The present invention provides an electronic device capable of providing a degradation compensation method for a short-wavelength region. According to various embodiments of the present invention, the electronic device comprises: a display; a camera module arranged on a lower portion of the display, and including a first image sensor; and a processor. The processor can be configured to acquire first image data by using a first row of the first image sensor in a first exposure condition set based on a pixel input value of a first color arranged on the first row, acquire second image data by using a second row adjacent to the first row of the first image sensor in a second exposure condition set based on an input value of a second color arranged on the second row, and generate a first image based on the first image data and the second image data.

Description

Electronic device and method for generating an image {ELECTRONIC DEVICE FOR GENERATING AN IMAGE AND METHOD THEREOF}

Various embodiments relate to an electronic device for generating an image and a method for generating an image.

An electronic device such as a smart phone or a tablet PC may include a camera (or a camera module or camera device) and take pictures or videos.

There is an increasing user demand for an electronic device capable of providing a wider screen and a beautiful appearance while being miniaturized. In order to satisfy these user needs, a notch, a U-shaped hole, a V-shaped hole, or an O-shaped hole is formed in a part of a housing (or a part of a display), and the formed notch or hole An electronic device including a camera module that is exposed to the outside has been released.

Recently, in order to implement a full screen, an under display camera (UDC) technology in which a camera is disposed under a display is being implemented in an electronic device.

When the electronic device includes an under display camera (UDC), image quality may deteriorate due to the pattern characteristics of the display panel. For example, diffraction or scattering of light may occur due to a pattern of a display panel, and components of some frequency bands may be attenuated, resulting in deterioration in resolution. For example, a flare of light splitting may be lost, and a transmittance deviation for each wavelength may occur.

One of the criteria for determining the quality of an image sensor is dynamic range. The dynamic range is a difference in contrast that can be expressed in an image (or video), and represents a maximum range capable of processing an input signal without distorting it. When an under display camera (UDC) is used, short-wavelength transmittance is relatively low, so the short-wavelength dynamic range is relatively small, which causes noise in the short-wavelength region to be relatively amplified after image processing.

An apparatus and method for generating an image according to various embodiments, when using an under display camera (UDC), use a staggered high dynamic range (HDR) to set exposure conditions of an image sensor to a line ( By controlling for each line), it is possible to provide a method for compensating degradation in the short wavelength region.

According to various embodiments, an electronic device may include a display, a first camera module disposed under the display and including a first image sensor; and a processor, wherein the processor outputs first image data using the first column as a first exposure condition set based on input values of pixels of a first color disposed in a first column of the first image sensor. is obtained, and as a second exposure condition set based on input values of pixels of a second color disposed in a second column adjacent to the first column of the first image sensor, second image data is obtained using the second column. Acquiring and generating a first image based on the first image data and the second image data.

According to various embodiments, an operating method of an electronic device may include a first exposure condition set based on input values of pixels of a first color disposed in a first column of a first image sensor included in a first camera module of the electronic device. obtaining first image data using the first column, and a second exposure condition set based on input values of pixels of a second color disposed in a second column adjacent to the first column of the first image sensor. The method may include obtaining second image data using the second column and generating a first image based on the first image data and the second image data. The first camera module may be disposed below the display of the electronic device.

By providing an apparatus and method for generating an image according to various embodiments, a method of reducing noise of an image by compensating for a decrease in a wavelength region having a relatively low transmittance in an under display camera (UDC) is provided. can

1 is a block diagram of an electronic device in a network environment, according to various embodiments.
2 is a block diagram illustrating a camera module, in accordance with various embodiments.
3 is a diagram for describing an electronic device according to various embodiments.
4 is a cross-sectional view of a display and camera module according to various embodiments.
5 is a diagram illustrating an image sensor included in a camera module according to various embodiments.
6 is a diagram for describing an operation of an electronic device according to various embodiments.
7 is a flowchart illustrating an operation of an electronic device according to various embodiments.
8 is a block diagram of an electronic device, according to various embodiments.
9 is a flowchart illustrating an operation of an electronic device according to various embodiments.
10 is a diagram for describing an operation of an electronic device according to various embodiments.
11 is a flowchart illustrating an operation of an electronic device according to various embodiments.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 may be used to realize Peak data rate (eg, 20 Gbps or more) for realizing 1eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency (for realizing URLLC). Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a block diagram illustrating a camera module, in accordance with various embodiments. Referring to FIG. 2 , the camera module 180 includes a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (eg, a buffer memory), or an image signal processor. (260). The lens assembly 210 may collect light emitted from a subject that is an image capturing target. The lens assembly 210 may include one or more lenses. According to one embodiment, the camera module 180 may include a plurality of lens assemblies 210 . In this case, the camera module 180 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 may have the same lens properties (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly may have the same lens properties as other lens assemblies. may have one or more lens properties different from the lens properties of . The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

The flash 220 may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash 220 may include one or more light emitting diodes (eg, a red-green-blue (RGB) LED, a white LED, an infrared LED, or an ultraviolet LED), or a xenon lamp. The image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal. According to one embodiment, the image sensor 230 is, for example, an image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, It may include a plurality of image sensors having a property, or a plurality of image sensors having other properties. Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

The image stabilizer 240 moves at least one lens or image sensor 230 included in the lens assembly 210 in a specific direction in response to movement of the camera module 180 or the electronic device 101 including the same. Operation characteristics of the image sensor 230 may be controlled (eg, read-out timing is adjusted, etc.). This makes it possible to compensate at least part of the negative effect of the movement on the image being taken. According to an embodiment, the image stabilizer 240 may include a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180. Such a movement of the camera module 180 or the electronic device 101 may be detected using . According to one embodiment, the image stabilizer 240 may be implemented as, for example, an optical image stabilizer. The memory 250 may at least temporarily store at least a portion of an image acquired through the image sensor 230 for a next image processing task. For example, when image acquisition is delayed according to the shutter, or a plurality of images are acquired at high speed, the acquired original image (eg, a Bayer-patterned image or a high-resolution image) is stored in the memory 250 and , a copy image (eg, a low resolution image) corresponding thereto may be previewed through the display module 160 . Thereafter, when a specified condition is satisfied (eg, a user input or a system command), at least a part of the original image stored in the memory 250 may be obtained and processed by the image signal processor 260 , for example. According to one embodiment, the memory 250 may be configured as at least a part of the memory 130 or as a separate memory operated independently of the memory 130 .

The image signal processor 260 may perform one or more image processes on an image obtained through the image sensor 230 or an image stored in the memory 250 . The one or more image processes, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (eg, noise reduction, resolution adjustment, brightness adjustment, blurring ( blurring, sharpening, or softening. Additionally or alternatively, the image signal processor 260 may include at least one of the components included in the camera module 180 (eg, an image sensor). 230) may be controlled (eg, exposure time control, read-out timing control, etc.) The image processed by the image signal processor 260 is stored again in the memory 250 for further processing. or may be provided as an external component of the camera module 180 (eg, the memory 130, the display module 160, the electronic device 102, the electronic device 104, or the server 108). According to an example, the image signal processor 260 may be configured as at least a part of the processor 120 or may be configured as a separate processor that operates independently of the processor 120. The image signal processor 260 may be configured as a processor 120 When configured as a separate processor, at least one image processed by the image signal processor 260 may be displayed through the display module 160 as it is or after additional image processing by the processor 120 .

According to an embodiment, the electronic device 101 may include a plurality of camera modules 180 each having different properties or functions. In this case, for example, at least one of the plurality of camera modules 180 may be a wide-angle camera, and at least the other may be a telephoto camera. Similarly, at least one of the plurality of camera modules 180 may be a front camera, and at least another one may be a rear camera.

3 is a diagram for describing an electronic device according to various embodiments.

Referring to FIG. 3 , according to various embodiments, an electronic device 301 (eg, the electronic device 101 of FIG. 1 ) includes a main body 310 and a display 320 (eg, the electronic device 101 of FIG. 1 ). The display module 160) and the camera module 330 (eg, the camera module 180 of FIG. 1 or 2) may be included. In FIG. 3, a case including one camera module is shown as an example, but is not limited thereto.

According to various embodiments, the body part (or housing) 310 may include various components necessary for the operation of the electronic device 301 . For example, the body portion 310 may include a substrate (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)) therein, a processor (e.g., the processor 120 of FIG. 1) , memory (eg, memory 130 of FIG. 1) or communication module (eg, communication module 190 of FIG. 1).

According to various embodiments, the display 320 may be disposed on a first surface (eg, the front surface) of the body unit 310, and the camera module 330 may be disposed facing the first surface. For example, the camera module 330 may not be visually exposed and may be an under display camera (UDC).

In FIG. 3, a form in which the camera module 330 is disposed facing the first surface (eg, the front surface, where the display 320 is mainly disposed) of the main body unit 310 is shown as an example, but is limited thereto. it is not going to be For example, when the display 320 extends to the second surface (eg, rear) of the main body 310, the camera module 330 faces the second surface (eg, rear) of the main body 310. can be arranged to do so.

According to various embodiments, the display 320 may display various contents such as text or images. The display 320 may be composed of a plurality of layers. For example, the display 320 may have a structure in which a window layer, a touch screen panel, a display panel, and/or a protective layer are sequentially stacked.

According to various embodiments, the display 320 may pass external light through at least a partial region where the camera module 330 is disposed. For example, the display 320 may pass external light through an empty space between pixels included in the display 320 . The camera module 330 may capture an image using external light introduced through the display 320 .

According to various embodiments, the camera module 330 may be mounted in an area where at least some layers included in the display 320 are removed. For example, a layer (eg, a shielding layer) through which external light cannot pass may be removed, and a lens unit (eg, the lens unit 331 of FIG. 4 ) of the camera module 330 is disposed in the removed area. It can be.

According to various embodiments, a metal layer having a pattern (hereinafter, a pattern layer) may be disposed on the front surface of the lens unit (eg, the lens unit 331 of FIG. 4 ) of the camera module 330 . For example, the pattern layer (eg, the pattern layer 410 of FIG. 4 ) may be one layer constituting the display 320 and may be disposed between a pixel of the display panel and a lens unit of the camera module.

4 is a cross-sectional view of a display and camera module according to various embodiments. The camera module of FIG. 4 may be the camera module 330 of FIG. 3 . The display of FIG. 4 may be the display 320 of FIG. 3 . Figure 4 is illustrative and not limited thereto.

Referring to FIG. 4 , a display (eg, the display 320 of FIG. 3 ) may include a window layer 401, a display panel 403, and a protective layer (or shielding layer, back cover) 480. .

According to various embodiments, the window layer (eg, ultra thin glass (UTG)) 401 may include a polymer. In this case, the window layer 401 may include polyethylene terephthalate (PET) or polyimide (PI). In various embodiments, a plurality of window layers 401 may be disposed.

Although not shown in FIG. 4 , the display 320 may further include a touch panel (touch sensor) between the window layer 401 and the display panel 403 .

According to various embodiments, the display 320 may include a control circuit (not shown). For example, the control circuit (not shown) may include a display driver IC (DDI) and/or a touch display driver IC (TDDI) disposed in a chip on panel (COP) or chip on film (COF) method.

According to various embodiments, the electronic device 301 may include a plurality of displays (eg, first and second displays), and at least one of the plurality of displays may include a flexible characteristic. there is. For example, in the electronic device 301, the first display (eg, display 320) may include an on cell touch AMOLED (OCTA) display, and the second display (eg, flexible display) may include a UB (eg, flexible display). It may include an unbreakable) type active matrix organic light-emitting diode (OLED) display.

According to various embodiments, the display panel 403 includes a base layer 405, a pattern layer 410, a wiring layer 420, a light emitting layer (or organic layer) 430, and an encapsulation layer (or protective layer) 440. can include Although not shown in FIG. 2 , the display panel 403 may further include a polarizer (eg, a polarizer film), an adhesive layer, and a touch panel. For example, the adhesive layer, as an adhesive member (eg, OCA (optical clear adhesive), PSA (pressure sensitive adhesive)), may be disposed between the respective layers.

According to various embodiments, a base layer 405 may be formed in a downward direction of the pattern layer 410 (eg, a direction toward the camera module 330). For example, the wiring layer 420 and the light emitting layer 430 may be stacked on the base layer 405 . According to various embodiments, the base layer 405 may include a transparent insulating substrate (eg, a substrate). For example, the base layer 405 may be formed of a glass substrate, a quartz substrate, or a transparent resin substrate. For example, the transparent resin substrate may be a polyimide-based resin, an acryl-based resin, a polyacrylate-based resin, a polycarbonate-based resin, or a polyether-based resin. -based) resin, sulfonic acid-based resin, and/or polyethyleneterephthalate-based resin may be included.

According to various embodiments, the pattern layer (or bottom metal layer (BML)) 410 is formed in an area where the protection layer (or shielding layer, back cover) 480 is at least partially removed for the arrangement of the camera module 330. patterns can be formed. The pattern layer 410 may include a blocking portion (or blocking area) 415 and an opening (or open area) 416 . The blocking portion 415 may be a region corresponding at least partially to the pixels 431 of the light emitting layer (organic material layer) 430, and the opening 416 is a panel opening between the pixels 431 of the light emitting layer (organic material layer) 430. It may be at least a part of the corresponding region. According to an embodiment, the pattern layer 410 may be a metal material and may be formed below the wiring layer 420 by deposition and/or patterning. The pattern layer 410 may protect the pixels 431 of the light emitting layer (organic layer) 430 and block light generated from the pixels 431 . According to various embodiments, the pattern layer 410 may include a designated pattern (black matrix) for reducing diffraction of light introduced into the camera module 330 or an opaque metal layer (eg, a buffer layer) including designated patterns. can

According to various embodiments, external light passing through the opening 416 may be introduced into the lens unit 331 . For example, light may be diffracted or scattered depending on the shape or size of the opening 416 .

According to various embodiments, the wiring layer 420 and the light emitting layer 430 may be formed by depositing a light emitting element (eg, organic electro luminescence (EL)) on a thin film transistor (TFT) substrate. According to various embodiments, the light emitting layer 430 may include a plurality of pixels 431 in which a plurality of subpixels (eg, red, green, and blue) constitute one pixel. According to various embodiments, the display panel 403 may include an active area (eg, a display area) and an inactive area (eg, a non-display area). For example, the active area may be an area corresponding to the area where the plurality of pixels 431 are disposed, and the inactive area is disposed outside the active area and corresponds to the bezel area of the display panel 403. can be an area.

According to various embodiments, the wiring layer 420 may include a TFT element, metal wiring, or an insulating film for driving each pixel of the active region. According to various embodiments, the wiring layer 420 may include liquid crystal polymer (LCP), low temperature polycrystalline silicon (LTPS), or low temperature polycrystalline oxide (LTPO) glass, and the plurality of pixels are formed on the LTPS glass. It may include a formed thin film transistor (TFT).

According to various embodiments, the light emitting layer 430 may include a light emitting element (eg, organic electro luminescence (EL)). Organic EL can generate light when holes and electrons are injected from the cathode and anode.

According to various embodiments, when viewing the display panel 403 from the first side (eg, the front side), at least one component included in the electronic device 301 (eg, the camera module 330 or the sensor module) (eg, the sensor module 176 of FIG. 1 ) and at least a portion of the overlapping area may not have a plurality of pixels, or may include a plurality of pixels having a lower arrangement density than the non-overlapping area.

According to various embodiments, the encapsulation layer 440 (eg, TFE (thin film encapsulation)) may be a layer that protects the light emitting element from oxygen or moisture by alternately covering organic and inorganic layers on the light emitting layer 430. For example, The encapsulation layer 440 may be a pixel protection layer for protecting the plurality of pixels 431. For example, the encapsulation layer 440 may include encapsulation glass.

According to various embodiments, the protective layer (or shielding layer) 480 may support and protect the display panel 403 . The protective layer 480 may block light or electromagnetic waves introduced from the display panel 403 from being introduced into the electronic device 301 . The protective layer 480 may include a black film and a metal (eg, copper) plate. For example, the protective layer 480 is disposed under the display panel 403 to provide a dark background for ensuring visibility of the display panel 403 and to act as a buffering member (eg, a cushion) for a buffering effect. can be formed For example, the protective layer 480 is opaque to remove air bubbles that may occur between the display panel 403 and lower attachments thereof and to block light generated from the display panel 403 or light incident from the outside. A metal layer (eg, a black layer including a rough pattern) and/or a buffer layer (eg, a sponge layer) disposed to mitigate impact may be included.

According to various embodiments, the protective layer 480 may include a heat dissipation member (eg, a graphite sheet) and/or a conductive member (eg, a metal plate) for heat dissipation. For example, the conductive member may help to reinforce the rigidity of the electronic device 301, shield surrounding noise, and may be used to dissipate heat emitted from surrounding heat dissipating components.

According to various embodiments, at least a portion of the protective layer 480 may be open, and the lens unit 331 may be disposed in the open area. A pattern of the pattern layer 410 may be formed in a region where the protective layer 480 is removed.

Referring to FIG. 4 , according to various embodiments, light emitted from an external light source passes through a portion (eg, a first portion 499) of a display 320 (eg, a display panel 403). One light reaches the lens unit 331 and may be used for image capture. For example, the first part 499 of the display 320 (eg, the display panel 403) is a camera module 330 (eg, the lens unit 331) in the display panel 403. ) may mean a region corresponding to the disposed region. For example, the electronic device 301 may acquire an image using light emitted from a light source and introduced through the first portion 499 of the display panel 403 .

According to various embodiments, the electronic device 301 (eg, the processor 120 of the electronic device 101 of FIG. 1 or the image signal processor 260 of FIG. 2 ) is part of the display 320 (eg, the first portion 499) may be controlled. The electronic device 301 controlling one part (eg, the first part 499) of the display 320 means that one part (eg, the first part 499) of the display panel 403 can mean controlling. For example, controlling the first part 499 of the display 320 by the electronic device 301 means that the wiring layer 420 of the display panel 403 included in the first part 499, and/or This may mean controlling at least a portion of the light emitting layer 430 . For example, controlling the first part 499 of the display 320 by the electronic device 301 means that among a plurality of pixels (eg, pixels 431) of the electronic device 301, the first part This may mean controlling at least one pixel (eg, pixel 431) included in 499. For example, the electronic device 301 may display a screen on the first portion 499 of the display 320 by controlling the first portion 499 of the display 320. A state in which the screen is displayed on part 1 499 may be referred to as an active state (or an under display camera-on (UDC-On) state). For example, the electronic device 301 acquires an image using the camera module 330 in a state in which the first part 499 of the display 320 is activated (eg, UDC-On state). can For another example, the electronic device 301 may control the first portion 499 of the display 320 so that the screen is not displayed on the first portion 499 of the display 320, and the display 320 A state in which the screen is not displayed on the first part 499 of may be referred to as an inactive state (or an under display camera-off (UDC-Off) state). For example, the electronic device 301 acquires an image using the camera module 330 in a state in which the first part 499 of the display 320 is inactive (eg, UDC-Off state). can

5 is a diagram illustrating an image sensor included in a camera module according to various embodiments.

According to various embodiments, the camera module 330 (eg, the camera module 180) of the electronic device 301 (eg, the electronic device 101) may include an image sensor 500 (eg, the electronic device 101). , the image sensor 230).

According to various embodiments, the image sensor 500 may include a plurality of pixels. For example, the image sensor 500 includes a plurality of pixels (eg, 511, 513, 521, 522, 531, and 533) composed of a plurality of columns (eg, 510, 520, and 530). can do. The number of columns (eg, 510, 520, and 530) and the number of pixels (eg, 511, 513, 521, 522, 531, and 533) constituting the image sensor 500 are limited. does not exist. For example, the image sensor 500 may include a first column 510 , a second column 520 , and a third column 530 . For example, the second column 520 of the image sensor 500 may be adjacent to the first column 510 . For example, the third column 530 of the image sensor 500 may be adjacent to the second column 520 . For example, pixels disposed in the second column 520 of the image sensor 500 include pixels (eg, 521) corresponding to a first color (eg, green) and pixels corresponding to a second color (eg, green). For example, a pixel (eg, 522) corresponding to blue color may be included. For example, pixels disposed in the first column 510 of the image sensor 500 include pixels (eg, 511) corresponding to a first color (eg, green) and pixels corresponding to a third color (eg, green). For example, a pixel (eg, 513) corresponding to red) may be included. For example, pixels disposed in the third column 530 of the image sensor 500 include pixels (eg, 531) corresponding to a first color (eg, green) and pixels corresponding to a third color (eg, green). For example, a pixel (eg, 533) corresponding to red) may be included. For example, the number of pixels (eg, 522) of the second color (eg, blue) included in the image sensor 500 is equal to the number of pixels (eg, green) of the first color (eg, green). For example, it may be less than the number of 511, 521, and 531). For example, the number of pixels (eg, 513 and 533) of the third color (eg, red) included in the image sensor 500 is the number of pixels of the first color (eg, green) ( For example, it may be less than the number of pixels 511, 521, and 531) and more than the number of pixels (eg, 522) of the second color (eg, blue). For example, pixels (eg, 511 , 521 , and 531 ) of a first color (eg, green) are in the first column 510 , the second column 520 , and the second column 520 of the image sensor 500 . The pixels (eg, 522) of the second color (eg, blue) included in the third column 530 are included in the second column 520 of the image sensor 500, and the pixels of the third color (eg, blue) For example, red pixels (eg, 513 and 533 ) may be included in the first column 510 and the third column 530 of the image sensor 500 , respectively. For example, a first wavelength corresponding to a first color (eg, green) of pixels (eg, 511, 521, and 531) included in the image sensor 500 is included in the image sensor 500. It may be longer than the second wavelength corresponding to the second color (eg, blue) of the pixel (eg, 522 ). For example, a third wavelength corresponding to a third color (eg, red) of pixels (eg, 513 and 533) included in the image sensor 500 is a pixel included in the image sensor 500. (eg, 522) of pixels (eg, 511, 521, and 531) that are longer than a second wavelength corresponding to a second color (eg, blue) and included in the image sensor 500. It may be longer than the first wavelength corresponding to color (eg, red). For example, the first wavelength corresponding to the first color (eg, green) may be a wavelength in the range of 540 nm to 560 nm, and the second wavelength corresponding to the second color (eg, blue) may be in the range of 440 nm to 560 nm. It may be a wavelength of 460 nm band, and the third wavelength corresponding to the third color (eg, red) may be a wavelength of 640 nm to 660 nm band. For example, the image sensor 500 may be configured such that a pattern consisting of a first column 510, a second column 520, and a third column 530 is repeated. The configuration of 500 is not limited.

6 is a diagram for describing an operation of an electronic device according to various embodiments.

FIG. 6 is a diagram showing transmittance according to wavelength in an under display camera (UDC) (eg, the camera module 330 of FIG. 3 ).

Referring to FIG. 6 , a first transmittance of a first wavelength (eg, 540 nm to 560 nm) corresponding to a first color (eg, green) of the image sensor 500 of FIG. 5 is Higher than the second transmittance of the second wavelength (eg, 440 nm to 460 nm) corresponding to the second color (eg, blue) of the sensor 500, and the third color of the image sensor 500 of FIG. 5 ( For example, it may be lower than the third transmittance of the third wavelength (eg, 640 nm to 660 nm) corresponding to red.

7 is a flowchart illustrating an operation of an electronic device according to various embodiments. 7 will be described with reference to FIGS. 3, 4, and 5.

Referring to FIG. 7 , in operation 701, an electronic device 301 (eg, the electronic device 101) (eg, the processor 120 of the electronic device 101) according to various embodiments , the same as the pixel input value (eg, the input value of the pixel 511 or the pixel 511) of the first color (eg, green) disposed in the first column 510 of the image sensor 500. A first exposure condition may be set based on an average of pixel input values of pixels representing colors. For example, the exposure condition may include a condition for an exposure time or an exposure interval. A method of setting the exposure conditions of the image sensor 500 by the electronic device 101 will be described with reference to FIGS. 9, 10, and 11 .

In operation 703 , according to various embodiments, the electronic device 301 displays a second color (eg, blue) disposed in a second column 520 adjacent to the first column 510 of the image sensor 500 . ) (for example, the input value of the pixel 522 or the average of pixel input values of pixels having the same color as the pixel 522), the second exposure condition may be set.

In operation 705, according to various embodiments, the electronic device 301 displays image data (eg, first image data) using the first column 510 of the image sensor 500 as a first exposure condition. ) can be obtained. For example, the electronic device 301 determines a pixel input value (eg, pixel 511) of a first color (eg, green) disposed in a first column 510 of the image sensor 500 . As a first exposure condition set based on an input value or an average of pixel input values of pixels displaying the same color as the pixel 511), the image data ( For example, first image data) may be acquired. For example, the electronic device 301 may acquire image data using the third column 530 of the image sensor 500 as a first exposure condition. For example, the electronic device 101 is configured such that a plurality of columns of the image sensor 500 repeats a pattern consisting of a first column 510, a second column 520, and a third column 530. In this case, a plurality of image data (eg, a plurality of first image data) is obtained using a plurality of columns corresponding to the first column 510 and the third column 530 under the first exposure condition. You may.

In operation 707, according to various embodiments, the electronic device 301 generates image data (eg, second image data) using the second column 520 of the image sensor 500 as a second exposure condition. ) can be obtained. For example, the electronic device 301 determines the pixel input value (eg, the pixel 522 of the second color (eg, blue) disposed in the second column 520 of the image sensor 500). As a second exposure condition set based on an input value or an average of pixel input values of pixels displaying the same color as the pixel 522), the image data ( For example, second image data) may be acquired. For example, the electronic device 101 is configured such that a plurality of columns of the image sensor 500 repeats a pattern consisting of a first column 510, a second column 520, and a third column 530. In this case, a plurality of image data (eg, a plurality of second image data) may be acquired under the second exposure condition using a plurality of columns corresponding to the second column 520 .

In operation 709, the electronic device 301 according to various embodiments may generate an image based on the first image data obtained in operation 705 and the second image data obtained in operation 707.

8 is a block diagram of an electronic device, according to various embodiments.

According to various embodiments, referring to FIG. 8 , an electronic device 301 (eg, the electronic device 101) includes a processor 120, a first camera 801 (eg, the first camera module), a second camera 802 (eg, a second camera module), and a sensor module 176 . For example, the sensor module 176 may include an illuminance sensor 876 . For example, the electronic device 301 (eg, the electronic device 101) (eg, the processor 120) uses the illuminance sensor 876 to determine the environment around the electronic device 301. information can be sensed.

According to various embodiments, the first camera 801 may be a camera disposed on the front side of the electronic device 101, but the position where the first camera 801 is disposed is not limited. For example, the first camera 801 may be the camera module 330 of FIG. 3 . For example, the first camera 801 may be an under display camera (UDC). For example, the first camera 801 is disposed below the display module 160 (eg, the display 320), and the first image sensor (eg, the image sensor 500 of FIG. 5) ) may be included.

According to various embodiments, the second camera 802 may be a camera disposed on the back of the electronic device 101, but the position where the second camera 802 is disposed is not limited. For example, a description of the camera module 180 may be understood as a description of the second camera 802 . For example, the second camera 802 may be a camera different from the first camera 801 . For example, the second camera 802 may include a second image sensor. For example, the second image sensor of the second camera 802 may be the same type of image sensor as the image sensor 500 of FIG. 5 or a different image sensor from the image sensor 500 of FIG. 5 .

9 is a flowchart illustrating an operation of an electronic device according to various embodiments. 9 will be described with reference to FIGS. 3, 4, 5, and 8.

Referring to FIG. 9 , in operation 901, an electronic device 301 (eg, the electronic device 101) (eg, the processor 120 of the electronic device 101) according to various embodiments , the camera application can be executed. For example, the electronic device 301 may execute a camera application based on a user input, and conditions and methods for executing the camera application are not limited.

In operation 903, the electronic device 301 according to various embodiments may determine whether a camera module used for an operation through a camera application is an under display camera (UDC). For example, referring to FIG. 8 , the electronic device 101 determines whether a camera module used for an operation through a camera application is a first camera 801 (eg, a first camera module) or a second camera 802. ) (eg, the second camera module). According to various embodiments, the electronic device 301 performs operation 905 and/or based on the fact that the camera module used for operation through the camera application is the rear camera of the display (eg, the first camera 801). 907 action can be performed. Although FIG. 9 illustrates that operations 905 and 907 are performed after operation 903, this is exemplary and operation 905 may be performed before operation 903 is performed.

In operation 905, according to various embodiments, the electronic device 301 may check environmental information around the electronic device 301. For example, the environment information may include illuminance information and/or color temperature information around the electronic device 301 . For example, the environment information may include automatic exposure (AE) information, auto white balance (AWB) information, automatic focus (AF) information, and/or sensing information of the illuminance sensor 876 . Environmental information will be described with reference to FIGS. 10 and 11 .

In operation 907, the electronic device 301, according to various embodiments, detects the first camera 801 (eg, the camera module 330) based on the surrounding environment information of the electronic device 301. Exposure conditions for each line of the first image sensor (eg, the image sensor 500) may be set. Each line of the image sensor 500 may mean each of a plurality of columns including the first column 510 , the second column 520 , and the third column 530 of FIG. 5 . For example, the electronic device 301 is a first camera 801 (eg, a first camera module) in which a camera module used for an operation through a camera application is an under display camera (UDC). Based on this, exposure conditions for each line of the first image sensor (eg, image sensor 500) of the first camera 801 (eg, camera module 330) may be set. 701 of FIG. It can be understood by referring to the description of operation and 703 operation. An embodiment in which the electronic device 301 sets an exposure condition based on surrounding environment information will be described later with reference to FIGS. 10 and 11 .

In operation 911, the electronic device 301, according to various embodiments, as a result of operation 903, the camera module used for operation through the camera application is a display rear camera (eg, the first camera 801). Based on the camera (eg, the second camera 802) that is not the camera, general exposure conditions may be set. For example, the general exposure condition may be an exposure condition specified for an image sensor of a camera (eg, second camera 802) other than a display rear camera (eg, first camera 801), and , there is no limit to the setting value of general exposure conditions. For example, the electronic device 301 determines the second camera 802 based on the fact that the camera module used for operation through the camera application is the second camera 802 (eg, the second camera module). In the second image sensor (eg, the same type of image sensor as the image sensor 500 of FIG. 5 or a different image sensor from the image sensor 500), the first color of the image sensor 500 of FIG. 5 (eg For example, an exposure condition (eg, a general exposure condition) may be set based on a pixel input value of the same color as green. For example, when the image sensor (eg, the second image sensor) of the second camera 802 is implemented in the same form as the image sensor 500 of FIG. 5, the electronic device 101 executes a camera application. Based on the fact that the camera module used for the through operation is the second camera 802 (eg, the second camera module), it is included in the image sensor (eg, the second image sensor) of the second camera 802 Exposure conditions of a plurality of columns (for example, columns corresponding to 510, 520, and 530 in FIG. 5) may be set to general exposure conditions.

In operation 909 , according to various embodiments, the electronic device 301 may generate an image under the exposure condition set in operation 907 or operation 911 . For example, when an exposure condition is set in operation 907, an embodiment in which an image (eg, a first image) is generated in operation 909 will be understood from descriptions of operations 705, 707, and 709 of FIG. can For example, when exposure conditions are set in operation 911, the electronic device 301 detects an image sensor (eg, the second image sensor) of the second camera 802 according to the general exposure conditions set in operation 911. An image (eg, a second image) may be generated using the image.

10 is a diagram for describing an operation of an electronic device according to various embodiments.

10 is a diagram for describing a surrounding environment of an electronic device 301 according to various embodiments.

For example, (a) of FIG. 10 shows an image 1010 of a subject 1011 and a background 1012 generated using the electronic device 301 . In (a) of FIG. 10 , the surrounding environment (eg, the background 1012) of the electronic device 301 may be a low color temperature environment. For example, the background 1012 may have a color of a longer wavelength (eg, a region of wavelengths representing red and colors around red).

For example, (b) of FIG. 10 shows an image 1020 of a subject 1021 and a background 1022 generated using the electronic device 301 . In (b) of FIG. 10 , the surrounding environment (eg, the background 1022) of the electronic device 301 may be a low-light environment. For example, the image 1020 of FIG. 10(b) may be an image captured when the electronic device 301 is dark (eg, at night).

11 is a flowchart illustrating an operation of an electronic device according to various embodiments. 11 will be described with reference to FIGS. 3, 4, 5, 8, and 10.

In FIG. 11 , operations 1101, 1103, 1105, and 1107 are shown to be performed in order, but this is exemplary and the order of operations 1101 and 1103 is not limited. One of operation 1103 or operation 1103 may be omitted.

Referring to FIG. 11 , in operation 1101, an electronic device 301 (eg, the electronic device 101) (eg, the processor 120 of the electronic device 101) according to various embodiments , Environmental information (eg, illuminance information and/or color temperature information) around the electronic device 301 may be acquired using the illuminance sensor 876 . There are no limitations on a method and timing for the electronic device 301 to acquire environmental information (eg, illuminance information and/or color temperature information) around the electronic device 301 using the illuminance sensor 876 .

In operation 1103, the electronic device 301 according to various embodiments may obtain information on automatic exposure (AE), auto white balance (AWB), and automatic focus (AF). For example, the electronic device 301, based on information on automatic exposure (AE), auto white balance (AWB), and automatic focus (AF), surrounds the electronic device 301 information (eg, For example, illuminance information and/or color temperature information) may be obtained. The electronic device 301 obtains environmental information (eg, illuminance information and / or color temperature information) is not limited to a method and time to acquire.

In operation 1105, according to various embodiments, the electronic device 301 determines the ambient illumination of the electronic device 301 based on at least one piece of information obtained in operation 1101 or information obtained in operation 1103. / Or you can check the color temperature.

In operation 1107, the electronic device 301, according to various embodiments, determines a camera module (eg, the camera module 330) (eg, the camera module 330) based on the ambient illumination and/or color temperature of the electronic device 301. For example, an exposure condition of an image sensor (eg, the image sensor 500) of the first camera 801 may be set. For example, the electronic device 301 may use a camera module (eg, the camera module 330) (eg, the camera module 330) based on whether or not the surroundings of the electronic device 301 have low illumination and/or a low color temperature environment. For example, an exposure condition of an image sensor (eg, the image sensor 500) of the first camera 801 may be set. For example, the electronic device 301 may set different exposure conditions when the ambient illumination of the electronic device 301 is the first illumination intensity and the second illumination intensity, and the ambient environment of the electronic device 301 is the first illumination intensity. Different exposure conditions may be set for the case of the first color temperature environment and the case of the second color temperature environment. For example, the electronic device 301 generates a second color (eg, color temperature) from the image sensor 500 based on environmental information (eg, illuminance information and/or color temperature information) around the electronic device 301 . For example, an exposure condition for a line (eg, the second column 520 of FIG. 5 ) in which a blue color is present may be set.

Those skilled in the art can understand that the various embodiments described in this specification can be organically applied to each other within the applicable range. For example, those skilled in the art may understand that at least some operations of one embodiment described in this specification may be omitted and applied, or at least some operations of one embodiment and at least some operations of another embodiment may be organically connected and applied.

According to various embodiments, the electronic device 301 is disposed below the display 320 (eg, the display module 160) and the display 320 (eg, the display module 160) , a first camera module 801 including the first image sensor 500 (eg, the camera module 330); and a processor 120, wherein the processor 120 sets a first exposure condition based on an input value of a pixel of a first color disposed in a first column 510 of the first image sensor 500 , first image data is obtained using the first column 510, and based on a pixel input value of a second color disposed in a second column 520 adjacent to the first column of the first image sensor Under a set second exposure condition, second image data may be acquired using the second column 520 and a first image may be generated based on the first image data and the second image data. there is.

According to various embodiments, the number of pixels of the second color included in the first image sensor 500 may be less than the number of pixels of the first color.

According to various embodiments, the second column 520 of the first image sensor 500 may include at least one pixel (eg, 521) of the first color.

According to various embodiments, the electronic device 301 further includes an illuminance sensor 876, and the processor 120, based on illuminance information acquired using the illuminance sensor 876, It can be set to set 2 exposure conditions.

According to various embodiments, the processor 120 may be configured to set the second exposure condition based on auto exposure (AE) information, auto white balance (AWB) information, and auto focus (AF) information. there is.

According to various embodiments, the processor 120 checks the illuminance and/or color temperature of the surroundings of the electronic device 301 based on environment information around the electronic device 301, and determines the illuminance and/or color temperature of the surroundings of the electronic device 301. Alternatively, the second exposure condition may be set based on the color temperature.

According to various embodiments, the processor 120 executes a camera application, and a camera module used for an operation through the camera application is the first camera module 801 (eg, the camera module 330). Based on that, the second exposure condition may be set based on the pixel input value of the second color disposed in the second column 520 .

According to various embodiments, it further includes a second camera module 802, and the processor 120, based on the fact that the camera module used for operation through the camera application is the second camera module 802, Setting a third exposure condition of a second image sensor (eg, an image sensor of the same type as the image sensor 500 or a different image sensor from the image sensor 500) of the second camera module 802, Obtaining third image data using the second image sensor (eg, the same type of image sensor as the image sensor 500 or a different image sensor from the image sensor 500) under the third exposure condition; Based on the third image data, a second image may be generated.

According to various embodiments, the third exposure condition of the second image sensor (eg, an image sensor of the same type as the image sensor 500 or a different image sensor from the image sensor 500) is The first color (eg, the color corresponding to the pixel 511) in an image sensor (eg, the same type of image sensor as the image sensor 500 or a different image sensor from the image sensor 500) ( For example, it may be set based on a pixel input value of the same color as green).

According to various embodiments, the wavelength of the first color (eg, the color corresponding to the pixel 511) (eg, green) is the wavelength of the second color (eg, the color corresponding to the pixel 522). color) (eg, blue).

According to various embodiments, a method of operating an electronic device 301 includes a first image sensor 500 included in a first camera module 801 (eg, camera module 330) of the electronic device 301. Obtaining first image data using the first column 510 as a first exposure condition set based on the pixel input value of the first color disposed in the first column 510 of ); As a second exposure condition set based on input values of pixels of a second color disposed in a second column 520 adjacent to the first column 510 of one image sensor 500, the second column 520 It may include an operation of obtaining second image data using , and an operation of generating a first image based on the first image data and the second image data. The first camera module 801 (eg, the camera module 330) may be disposed below the display 320 (eg, the display module 160) of the electronic device 301. .

According to various embodiments, the number of pixels of the second color included in the first image sensor 500 may be less than the number of pixels of the first color.

According to various embodiments, the second column 520 of the first image sensor 500 may include at least one pixel of the first color.

According to various embodiments, the method may further include setting the second exposure condition based on illuminance information acquired using the illuminance sensor 876 of the electronic device 301 .

According to various embodiments, the method may further include setting the second exposure condition based on auto exposure (AE) information, auto white balance (AWB) information, and auto focus (AF) information. there is.

According to various embodiments, the method may include an operation of checking an illuminance and/or a color temperature of an area around the electronic device 301 based on environment information around the electronic device 301, and the illumination and/or The method may further include setting the second exposure condition based on the color temperature.

According to various embodiments, the method may include an operation of executing a camera application and a camera module used for operation through the camera application being the first camera module 801 (eg, the camera module 330). Based on this, an operation of setting the second exposure condition based on the pixel input value of the second color disposed in the second column 520 may be further included.

According to various embodiments, based on the fact that the camera module used for operation through the camera application is the second camera module 802, the second image sensor (eg, image sensor) of the second camera module 802 An operation of setting a third exposure condition of an image sensor of the same type as the image sensor 500 or a different image sensor from the image sensor 500, the second image sensor (for example, an image sensor ( 500), an operation of acquiring third image data using an image sensor of the same type or a different image sensor from the image sensor 500), and an operation of generating a second image based on the third image data. can include more.

According to various embodiments, the third exposure condition of the second image sensor (eg, an image sensor of the same type as the image sensor 500 or a different image sensor from the image sensor 500) is The first color (eg, the color corresponding to the pixel 511) in an image sensor (eg, the same type of image sensor as the image sensor 500 or a different image sensor from the image sensor 500) ( For example, it may be set based on a pixel input value of the same color as green).

According to various embodiments, the wavelength of the first color (eg, the color corresponding to the pixel 511) (eg, green) is the wavelength of the second color (eg, the color corresponding to the pixel 522). color) (eg, blue).

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

Claims (20)

In electronic devices,
display,
a first camera module disposed below the display and including a first image sensor; and
contains a processor;
the processor,
Obtaining first image data using the first column as a first exposure condition set based on input values of pixels of a first color arranged in a first column of the first image sensor;
Obtaining second image data using the second column as a second exposure condition set based on input values of pixels of a second color disposed in a second column adjacent to the first column of the first image sensor;
Based on the first image data and the second image data, set to generate a first image,
electronic device.
According to claim 1,
The number of pixels of the second color included in the first image sensor is less than the number of pixels of the first color,
electronic device.
According to claim 2,
wherein the second column of the first image sensor includes at least one pixel of the first color;
electronic device.
According to claim 1,
It further includes an illuminance sensor,
the processor,
Based on the illuminance information obtained using the illuminance sensor, the second exposure condition is set.
electronic device.
According to claim 1,
the processor,
Set to set the second exposure condition based on auto exposure (AE) information, auto white balance (AWB) information, and auto focus (AF) information,
electronic device.
According to claim 1,
the processor,
Based on environmental information around the electronic device, determine the illuminance and/or color temperature of the surroundings of the electronic device;
Based on the illuminance and/or the color temperature, the second exposure condition is set.
electronic device.
According to claim 1,
the processor,
Launch the camera application,
Based on the fact that the camera module used for operation through the camera application is the first camera module, the second exposure condition is set based on the pixel input value of the second color disposed in the second column. ,
electronic device.
According to claim 7,
Further comprising a second camera module,
the processor,
Based on the fact that the camera module used for operation through the camera application is the second camera module, a third exposure condition of a second image sensor of the second camera module is set,
Obtaining third image data using the second image sensor under the third exposure condition;
Based on the third image data, set to generate a second image,
electronic device.
According to claim 8,
The third exposure condition of the second image sensor is set based on a pixel input value of the same color as the first color in the second image sensor.
electronic device.
According to claim 1,
The wavelength of the first color is longer than the wavelength of the second color,
electronic device.
In the method of operating an electronic device,
As a first exposure condition set based on input values of pixels of a first color disposed in a first column of a first image sensor included in a first camera module of the electronic device, first image data is obtained by using the first column. the operation of obtaining
Obtaining second image data using the second column as a second exposure condition set based on input values of pixels of a second color disposed in a second column adjacent to the first column of the first image sensor; and
Generating a first image based on the first image data and the second image data;
The first camera module is disposed under the display of the electronic device,
method.
According to claim 11,
The number of pixels of the second color included in the first image sensor is less than the number of pixels of the first color,
method
According to claim 12,
wherein the second column of the first image sensor includes at least one pixel of the first color;
method.
According to claim 11,
Further comprising setting the second exposure condition based on illuminance information obtained using an illuminance sensor of the electronic device.
method.
According to claim 11,
Further comprising setting the second exposure condition based on auto exposure (AE) information, auto white balance (AWB) information, and auto focus (AF) information,
method.
According to claim 11,
Checking the illuminance and/or color temperature of the electronic device's surroundings based on environmental information around the electronic device; and
Further comprising setting the second exposure condition based on the illuminance and/or the color temperature.
method.
According to claim 11,
An operation of executing a camera application, and
An operation of setting the second exposure condition based on the pixel input value of the second color disposed in the second column based on that the camera module used for the operation through the camera application is the first camera module. more inclusive,
method.
18. The method of claim 17,
Setting a third exposure condition for a second image sensor of the second camera module based on the fact that the camera module used for the operation through the camera application is the second camera module;
obtaining third image data using the second image sensor under the third exposure condition; and
Based on the third image data, further comprising an operation of generating a second image,
method.
According to claim 18,
The third exposure condition of the second image sensor is set based on a pixel input value of the same color as the first color in the second image sensor.
method.
According to claim 11,
The wavelength of the first color is longer than the wavelength of the second color,
method.

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