KR20230066976A - Apparatus for substrate support and method for substrate loading using the same - Google Patents

Abstract

Provided is a substrate support device including: a support table having an axis parallel to a first direction; a support pin that penetrates the support table in the first direction and can move up and down; and a repulsive force generator that provides repulsive force to the substrate placed on the support table, wherein a horizontal distance between the repulsive force generator and the axis is greater than a horizontal distance between the support pin and the axis.

Description

Substrate support device and substrate loading method using the same {Apparatus for substrate support and method for substrate loading using the same}

The present invention relates to a substrate support device and a substrate loading method using the same, and more particularly, to a substrate support device capable of preventing deformation of a substrate and a substrate loading method using the same.

Manufacturing of semiconductor devices may be performed through several processes. For example, manufacturing of a semiconductor device may be performed through a photo process for a wafer, an etching process, a deposition process, and the like. The photo process may include an exposure process of forming a pattern on a substrate using a mask. In the exposure process, exposure may be performed with the substrate placed on the substrate support device. A substrate may be loaded onto the substrate holding device by a robot arm or the like. For example, a substrate transported by a robot arm may be lowered down and placed on a substrate holding device. The substrate support device may hold the substrate in place.

An object to be solved by the present invention is to provide a substrate support device capable of improving yield by preventing deformation of a substrate and a substrate loading method using the same.

An object to be solved by the present invention is to provide a substrate support device capable of preventing abrasion of the substrate support device and increasing its lifespan, and a substrate loading method using the same.

The problem to be solved by the present invention is to provide a substrate support device applicable to various substrates and a substrate loading method using the same.

The problem to be solved by the present invention is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

In order to achieve the object to be solved, a substrate supporting device according to an embodiment of the present invention includes a support table having an axis parallel to a first direction; a support pin penetrating the support table in the first direction and movable up and down; and a repulsive force generator providing a repulsive force to the substrate disposed on the support table. Including, a horizontal distance between the repulsive force generator and the shaft may be greater than a horizontal distance between the support pin and the shaft.

In order to achieve the object to be solved, the substrate loading method according to an embodiment of the present invention includes raising the support pin to protrude upward from the upper surface of the support table; placing a substrate on the support pin; and lowering the support pin on which the substrate is disposed. The lowering of the support pin includes: first lowering of the support pin so that the substrate comes to a position away from the upper surface of the support table by a first distance; a repulsive force generator providing a primary repulsive force that pushes the substrate upward; and secondarily descending the support pin so that the substrate is seated on the upper surface of the support table. Including, the repulsive force generator may be located outside the support pin.

Details of other embodiments are included in the detailed description and drawings.

According to the substrate support device and the substrate loading method using the same of the present invention, it is possible to improve the yield by preventing deformation of the substrate.

According to the substrate support device and the substrate loading method using the same of the present invention, wear of the substrate support device can be prevented and its lifespan can be increased.

According to the substrate support device and the substrate loading method using the device of the present invention, it can be applied to various substrates.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

1 is a schematic diagram showing an exposure apparatus according to embodiments of the present invention.
2 is a plan view showing a substrate support device according to embodiments of the present invention.
3 is a cross-sectional view showing a substrate support device according to embodiments of the present invention.
FIG. 4 is a cross-sectional view illustrating an enlarged area X of FIG. 3 .
5 is a flowchart illustrating a substrate loading method according to embodiments of the present invention.
6 to 11 are cross-sectional views sequentially illustrating a substrate loading method according to the flowchart of FIG. 5 .
12 is a cross-sectional view showing a substrate support device according to embodiments of the present invention.
13 is a cross-sectional view showing a substrate support device according to embodiments of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Like reference numbers throughout the specification may refer to like elements.

1 is a schematic diagram showing an exposure apparatus according to embodiments of the present invention.

Hereinafter, D1 of FIG. 1 is a first direction, D2 crossing the first direction D1 is a second direction D2, D3 crossing each of the first and second directions D1 and D2 It may be referred to as a third direction. The first direction D1 may be referred to as a vertical direction, and each of the second and third directions D2 and D3 may be referred to as a horizontal direction.

Referring to FIG. 1 , an exposure apparatus may be provided. The exposure apparatus may include a light source SO, a beam delivery system BD, an illuminator IL, a mask blinder MB, a mask table MT, a projection system PS, and a substrate support device D.

The light source SO may emit light. For example, the light source SO may include ultraviolet light having a wavelength in a range of about 10 nm to about 400 nm, near ultraviolet light having a wavelength in a range of about 300 nm to about 400 nm, and light having a wavelength in a range of about 200 nm to about 300 nm. Deep ultraviolet light or extreme ultraviolet light having a wavelength ranging from about 10 nm to about 200 nm may be emitted. When the light source SO is an excimer laser, the light source SO may not be part of the exposure apparatus. That is, the light source SO may be a component separate from the exposure apparatus. When the light source SO is a mercury lamp, the light source SO may be part of an exposure apparatus.

The beam delivery system BD may deliver light from the light source SO to the illuminator IL. The beam delivery system (BD) may include a directing mirror and/or a beam expander.

The illuminator IL may illuminate the mask MS by adjusting the light transmitted from the light source SO through the beam delivery system BD. The illuminator IL may include optical components for directing, shaping, and controlling the light. For example, the illuminator IL may include refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components or combinations thereof. The illuminator IL may include an adjuster AD, a condenser IN, and a condenser CO for adjusting the angular intensity distribution of light. The illuminator IL may adjust the light to have desired uniformity and intensity distribution.

The mask blinder MB may be configured to adjust an area of the mask MS illuminated by the exposure device. In some embodiments, the mask blinder MB may be positioned between the mask table MT and the illuminator IL. A part of the light emitted from the illuminator IL may pass through the opening of the mask blinder MB and reach the mask MS, and the remaining part may be blocked by the mask blinder MB. When the opening of the mask blinder MB is opened to the maximum, the maximum area of the mask MS can be illuminated by the exposure device.

A mask MS may be mounted on the mask table MT. The mask table MT may move the mask MS. The mask table MT may be connected to a mask positioner configured to accurately position the mask MS according to specific parameters.

The projection system PS may project the light passing through the mask MS onto the substrate W. For example, projection system PS may include a refractive projection lens system. A space between the projection system PS and the substrate W may be filled with a liquid having a relatively high refractive index. For example, a space between the projection system PS and the substrate W may be filled with water.

A substrate W may be placed on the substrate support device D. The substrate support device D may fix the substrate W at a predetermined position. Also, the substrate support device D may move the substrate W. The substrate support device D may include a support table 1 and an air compressor 7 and the like. Details thereof will be described later with reference to FIGS. 2 to 4 .

2 is a plan view showing a substrate supporting device according to embodiments of the present invention, FIG. 3 is a cross-sectional view showing a substrate supporting device according to embodiments of the present invention, and FIG. 4 is a cross-sectional view showing an enlarged area X of FIG. 3 am.

Referring to FIG. 2 , the substrate support device D may include a support table 1 , a support pin 3 , a repulsive force generator 5 and an air compressor 7 .

Referring to FIGS. 2 to 4 , a substrate W (refer to FIG. 1 ) may be disposed on the support table 1 . The support table 1 may have an axis CA parallel to the first direction D1. The support table 1 may include a base member 11 and a support member 13 . In embodiments, the base member 11 may have a cylindrical shape centered on the axis CA. The base member 11 may include chromium nitride (CrN) and/or silicon carbide (SiSiC), but is not limited thereto. The support member 13 may extend upwardly from the base member 11 . That is, it may protrude from the upper surface 11u of the base member 11 . The support member 13 may be integrally formed with the base member 11, but is not limited thereto. A substrate W (refer to FIG. 1 ) may come into contact with the upper surface of the support member 13 . That is, the support member 13 may support the substrate W. A plurality of support members 13 may be provided. A plurality of support members 13 may be spaced apart from each other in a horizontal direction. However, in the following, for convenience, the support member 13 will be described in the singular. A region of the base member 11 in which the support member 13 is disposed on the upper surface 11u may be referred to as a first region 111 . The first area 111 may have a cylindrical shape centered on the axis CA. The axis CA may pass through the first area 111 . The diameter of the first region 111 may be about 140 mm to about 149 mm. More specifically, the diameter of the first region 111 may be about 147 mm to about 148 mm. A region of the base member 11 in which the support member 13 is not disposed on the upper surface 11u may be referred to as a second region 113 . The support member 13 may be located inside the upper surface 11u of the base member 11 . Accordingly, the second region 113 may be located outside the first region 111 . That is, the second region 113 may surround the first region 111 in a plan view. The second region 113 may have a ring shape centered on the axis CA.

Referring to FIGS. 2 and 3 , the support pin 3 may pass through the support table 1 vertically. To this end, the support table 1 may provide a through hole 11h. The through hole 11h may pass through the support table 1 vertically. The support pin 3 may be disposed in the through hole 11h. The support pin 3 may move up and down in the through hole 11h. A support pin driving mechanism (not shown) may be provided for driving the support pin 3 for this purpose. The support pin drive mechanism may include actuators such as electric motors and/or hydraulic motors. The support pin 3 can be raised and lowered by the support pin driving unit to load and unload a substrate onto and from the support member 13 . A horizontal distance between the support pin 3 and the shaft CA may be referred to as a first horizontal distance d1. The first horizontal distance d1 may be smaller than the diameter of the first region 111 . That is, the support pins 3 may vertically penetrate the first region 111 . Accordingly, the through hole 11h may be provided in the first region 111 . A plurality of support pins 3 may be provided. For example, three support pins 3 may be provided. A plurality of support pins 3 may be spaced apart from each other in a horizontal direction. For example, three support pins 3 may be spaced apart from each other so as to be located on the three vertexes of a triangle in plan view. The three support pins 3 may form three vertexes of an equilateral triangle in plan view, but are not limited thereto. Hereinafter, for convenience, the support pin 3 will be described in the singular.

Referring to FIG. 2 , the repulsive force generator 5 may provide repulsive force to a substrate (W, see FIG. 1 ) placed on the support table 1 . More specifically, the repulsive force generator 5 may provide upward repulsive force to the substrate W such that the substrate W receives upward force. The repulsive force generator 5 may provide repulsive force in a variety of ways. For example, the repulsive force generator 5 may generate repulsive force by spraying a fluid. In this case, the repulsive force generator 5 may be connected to the air compressor 7.

The repulsive force generator 5 may be coupled to the support table 1 . The horizontal distance between the repulsive force generator 5 and the shaft CA may be referred to as a second horizontal distance d2. The second horizontal distance d2 may be greater than the first horizontal distance d1. For example, the second horizontal distance d2 may be about 140 mm or more. More specifically, the second horizontal distance d2 may be about 145 mm or more. That is, the repulsive force generator 5 may be located outside the support pin 3 . The repulsive force generator 5 may be disposed in the second area 113 . However, it is not limited thereto.

Referring to FIG. 3 , the repulsive force generator 5 may include an air nozzle 51 and an air connection unit 53 . The air nozzle 51 may inject fluid upward. The air connection unit 53 may connect the air nozzle 51 and the air compressor 7 . In embodiments, the repulsive force generator 5 may be embedded within the support table 1 . In this case, the level of the upper surface of the air nozzle 51 may be lower than the height of the upper surface 1u of the support table 1 . That is, the air nozzle 51 may not be exposed above the upper surface 1u of the support table 1 . A direction in which the air nozzle 51 discharges air may be parallel to the first direction D1, but is not limited thereto.

Referring to FIG. 2 , from a plan view, the repulsive force generator 5 may extend in a circumferential direction. More specifically, the air nozzle 51 may provide a slit-shaped discharge port extending in the circumferential direction. Alternatively, the air nozzle 51 may provide a plurality of discharge ports arranged along the circumferential direction.

A plurality of repulsive force generators 5 may be provided. For example, three repulsive force generators 5 may be provided. A plurality of repulsive force generators 5 may be spaced horizontally from each other. For example, the three repulsive force generators 5 may be arranged circumferentially offset from the arrangement of the three support pins 3 . However, hereinafter, for convenience, the repulsive force generator 5 will be described in the singular.

The air compressor 7 may be connected to the repulsive force generator 5 . The air compressor 7 may provide high-pressure air to the repulsive force generator 5 . Accordingly, the repulsive force generator 5 may discharge air upward to provide a repulsive force to the substrate W (refer to FIG. 1).

5 is a flowchart illustrating a substrate loading method according to embodiments of the present invention.

Referring to FIG. 5 , a substrate loading method (S) may be provided. The substrate loading method (S) may refer to a method of loading a substrate (W) on the substrate support device (D) described with reference to FIGS. 1 to 4 . The substrate loading method (S) includes raising the support pin (S1), placing the substrate on the support pin (S2), lowering the support pin on which the substrate is placed (S3), and placing the substrate on the support table. It may include fixing (S4).

The lowering of the support pin on which the substrate is placed (S3) includes the first lowering of the supporting pin (S31), the first repulsive force being provided by the repulsive force generator (S32), and the support so that the substrate is in contact with the upper surface of the support table. It may include the second lowering of the pin (S33).

Fixing the substrate on the support table (S4) may include the support table providing a fixing force to the substrate (S41) and the repulsive force generator providing a secondary repulsive force (S42).

Hereinafter, the substrate loading method (S) of FIG. 5 will be described in detail with reference to FIGS. 6 to 11 .

6 to 11 are cross-sectional views sequentially illustrating a substrate loading method according to the flowchart of FIG. 5 .

Referring to FIGS. 6 and 5 , lifting the support pin ( S1 ) may include lifting the support pin 3 by the support pin driver. More specifically, the support pin 3 can rise so as to protrude upward from the upper surface 1u of the support table 1 .

Placing the substrate on the support pin ( S2 ) may include placing the substrate W on the support pin 3 protruding above the upper surface 1u of the support table 1 . The substrate W may be transferred by a robot arm or the like. The substrate W transported by the robot arm may be placed on the support pin 3 .

Referring to FIGS. 7, 8, and 5, the primary descent of the support pin (S31) occurs when the substrate W is positioned upward by a first distance from the upper surface 1u of the support table 1. It may include lowering the support pin 3 up to . The first distance may mean a specific point at which a repulsive force is required to be provided by the repulsive force generator. Information on the first distance may be previously input to a controller (not shown).

9 and 5 , providing the first repulsive force by the repulsive force generator (S32) may include discharging air provided to the repulsive force generator 5 by the air compressor 7 upward. More specifically, the air AC is sprayed upward through the air nozzle 51 to push the lower surface of the substrate W upward. However, it is not limited thereto, and the air nozzle 51 may spray other fluids than air. For example, the air nozzle 51 may spray a volatile liquid or the like. Since the air nozzle 51 is located in the second region 113 , the portion pressed upward by the air AC may be the edge region EG of the substrate W. That is, the edge region EG of the substrate W may receive upward force by the repulsive force generator 5 . Before the repulsive force is provided by the repulsive force generator 5, the edge region EG of the substrate W disposed on the support pin 3 (see FIG. 7) may be lowered. The edge region EG of the substrate W, which was drooped down, may be lifted up by the air AC provided by the repulsive force generator 5 . Accordingly, the curved substrate W can be relatively flattened.

Referring to FIGS. 10 and 5, the second lowering of the support pin so that the substrate comes into contact with the upper surface of the support table (S33) further lowers the support pin (3, see FIG. 7) so that the substrate W moves to the support table. (1). In some embodiments, a portion of the edge region EG of the substrate W may still be curved. Accordingly, a lower part of the edge region EG of the substrate W may come into contact with the upper surface 11u of the base member 11 . In this case, the upper surface of a part of the support member 13 may not come into contact with the lower surface of the substrate W.

Referring to FIGS. 11 and 5 , providing a fixing force to the substrate by the support table ( S41 ) may include fixing the substrate W at a predetermined position by providing the fixing force by the support table 1 . The support table 1 may provide a fixing force to the substrate W in various ways. For example, the support table 1 may fix the substrate W using electrostatic force and/or vacuum pressure. To this end, a chuck electrode and/or a vacuum pressure providing device may be coupled to the base member 11 .

Providing the second repulsive force by the repulsive force generator ( S42 ) may include lifting the edge region EG of the substrate W upward by injecting the air AC2 upward from the air nozzle 51 . When the edge region EG of the substrate W is bent downward while the substrate W is placed on the support table 1, the substrate W is held constant by the fixing force provided by the support table 1. Prior to being fixed in position, the substrate W may need to be flattened. Accordingly, the repulsive force generator 5 provides a secondary repulsive force to the substrate W on the support table 1, so that the edge region EG of the substrate W can be lifted upward. As a result, the substrate W can be flattened. In this state, the support table 1 may provide a fixing force to fix the substrate W at a predetermined position.

In the above, it has been sequentially described that the support table provides a fixing force to the substrate (S41) and the repulsive force generator provides a secondary repulsive force (S42), but is not limited thereto. That is, providing a fixing force to the substrate by the support table (S41) and providing a second repulsive force by the repulsive force generator (S42) may be simultaneously performed. Alternatively, after the repulsive force generator provides the secondary repulsive force (S42), the supporting table provides a fixing force to the substrate (S41) may be performed.

In the above, the substrate holding device D has been described as being a part of the exposure device, but is not limited thereto. That is, the substrate support device D may also be used for etching equipment, cleaning equipment, deposition equipment, and the like.

According to the substrate support device and the substrate loading method using the same according to embodiments of the present invention, it is possible to fix a substrate that is struck by its own weight in a flattened state. More specifically, the edge region of the substrate, which is hit by its own weight after being placed on the support pin, may be lifted up to make the substrate generally flat. Therefore, in the exposure process, the etching process, the cleaning process, and/or the deposition process, the substrate process can be precisely performed. Accordingly, process yield may be improved.

According to the substrate support device and the substrate loading method using the same according to embodiments of the present invention, when loading a substrate on the substrate support device, the circumference of the substrate first contacts the base member and/or the support member, so that the substrate is bent. It can be prevented from being fixed on the substrate holding device in the state of being. Alternatively, it is possible to prevent the substrate from spreading due to its own weight after the periphery of the substrate first comes into contact with the base member and/or the support member. Accordingly, it is possible to prevent scratching or denting of the upper surface of the substrate holding device by the circumference of the substrate. Accordingly, wear of the substrate holding device can be prevented, and its lifespan can be increased.

According to the substrate support device and the substrate loading method using the same according to embodiments of the present invention, it can be applied to all substrates of various weights and shapes. Accordingly, it may not be necessary to change the shape of the substrate support device to fit the substrate.

According to the substrate support device and the substrate loading method using the same according to embodiments of the present invention, the repulsive force generator may not overlap the support member in plan view. That is, the repulsive force generator may be located outside the support member. Accordingly, the arrangement of the repulsive force generator may not interfere with the arrangement of the support member. Accordingly, design may be facilitated.

12 is a cross-sectional view showing a substrate support device according to embodiments of the present invention.

Hereinafter, descriptions of substantially the same or similar contents to those described with reference to FIGS. 1 to 11 may be omitted for convenience.

Referring to FIG. 12 , the repulsive force generator 5a may include an air nozzle 51a and an air connector 53a. The air nozzle 51a may not be parallel to the first direction D1. That is, the air nozzle 51a may form an acute angle α with the first direction D1 . More specifically, the air nozzle 51a may be inclined from the edge toward the axis CA (see FIG. 2). The level of the upper surface of the air nozzle 51a may be higher than the level of the upper surface 1u of the support table 1 . That is, the air nozzle 51a may be exposed on the support table 1 . However, since the air nozzle 51a is located in the second region 113, it may not collide with the substrate disposed on the support member 13. The air nozzle 51a sprays a fluid from the outside to the inside to flatten the substrate.

13 is a cross-sectional view showing a substrate support device according to embodiments of the present invention.

Hereinafter, descriptions of substantially the same or similar contents to those described with reference to FIGS. 1 to 12 may be omitted for convenience.

Referring to FIG. 13 , the repulsive force generator 5b may include an electrostatic force providing member 51b and a connecting member 53b. The electrostatic force providing member 51b may generate electrostatic force by receiving a voltage from the voltage applying unit 7b. The edge region EG of the substrate W may receive an upward force by the electrostatic force provided by the electrostatic force providing member 51b. Accordingly, the substrate W may be flattened.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art can implement the present invention in other specific forms without changing the technical spirit or essential features. You will understand that there is Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

W: substrate
D: substrate support device
1: support table
11: base member
111: first area
113 second area
13: support member
3: support pin
5: repulsive force generator
51: air nozzle
53: air connection
7: air compressor

Claims (10)

a support table having an axis parallel to the first direction;
a support pin penetrating the support table in the first direction and movable up and down; and
a repulsive force generator providing a repulsive force to the substrate placed on the support table; Including,
The substrate support device of claim 1 , wherein a horizontal distance between the repulsive force generator and the shaft is greater than a horizontal distance between the support pin and the shaft.
According to claim 1,
Further including an air compressor,
The repulsive force generator includes an air nozzle for injecting air upward,
The air nozzle is connected to the air compressor.
According to claim 2,
A height of the upper surface of the air nozzle is lower than a height of the upper surface of the support table.
According to claim 2,
wherein the air nozzle is tilted toward the axis from an edge of the support table to form an acute angle with the first direction.
According to claim 4,
A height of the upper surface of the air nozzle is higher than that of the upper surface of the support table.
According to claim 1,
The support table has a circular shape in plan view,
Three support pins are provided,
Three repulsive force generators are provided,
The three support pins are spaced apart from each other in the horizontal direction so as to be located on the three vertices of the triangle in a plan view,
The three repulsive force generators are arranged so as to shift from the arrangement of the three support pins in the circumferential direction of the support table.
According to claim 1,
The support table is:
base member; and
A plurality of support members (burl) protruding upward from the upper surface of the base member; Including,
The plurality of support members are spaced apart from each other in a horizontal direction,
The substrate support device of claim 1 , wherein the repulsive force generator is positioned outside each of the plurality of support members.
According to claim 1,
The horizontal distance between the repulsive force generator and the shaft is 145 mm or more.
raising the support pin to protrude upward from the upper surface of the support table;
placing a substrate on the support pin; and
lowering the support pin on which the substrate is disposed; Including,
The lowering of the support pin is:
first lowering of the support pin so that the substrate comes to a position away from the upper surface of the support table by a first distance;
a repulsive force generator providing a primary repulsive force that pushes the substrate upward; and
secondarily lowering the support pin so that the substrate is seated on the upper surface of the support table; including,
The substrate loading method of claim 1, wherein the repulsive force generator is located outside the support pin.
According to claim 9,
Further comprising fixing the substrate in contact with the upper surface of the support table on the support table,
Fixing the substrate on the support table is to:
the support table providing a fixing force to the substrate; and
the repulsive force generator providing a secondary repulsive force for pressing the substrate upward; Substrate loading method comprising a.

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