KR20230013015A - 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품 - Google Patents

광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품 Download PDF

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Publication number: KR20230013015A
Authority: KR; South Korea
Prior art keywords: moisture; meth; resin composition; curable resin; acrylate
Prior art date: 2020-05-15

Application number

KR1020227028022A

Other languages

English (en)

Korean (ko)

Inventor

료마 이시다테

모토미 시오지마

신지 가와다

Original Assignee

세키스이가가쿠 고교가부시키가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2020-05-15

Filing date

2021-05-14

Publication date

2023-01-26

2021-05-14 Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤

2023-01-26 Publication of KR20230013015A publication Critical patent/KR20230013015A/ko

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239000004417 polycarbonate Substances 0.000 claims abstract description 56
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239000011521 glass Substances 0.000 claims abstract description 19
239000003999 initiator Substances 0.000 claims abstract description 19
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- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
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- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C—CHEMISTRY; METALLURGY
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- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2597/00—Tubular articles, e.g. hoses, pipes
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G2110/00—Foam properties
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- C08J2325/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
- C08J2325/02—Homopolymers or copolymers of hydrocarbons
- C08J2325/04—Homopolymers or copolymers of styrene
- C08J2325/08—Copolymers of styrene
- C08J2325/12—Copolymers of styrene with unsaturated nitriles
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
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Inorganic Chemistry (AREA)
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Materials For Photolithography (AREA)
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KR1020227028022A 2020-05-15 2021-05-14 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품 KR20230013015A (ko)

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JP2019006854A (ja)	2017-06-21	2019-01-17	日立化成株式会社	反応性ホットメルト接着剤組成物及び被着体の接着方法

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CN115175945A (zh)	2022-10-11
CN115175945B (zh)	2024-09-03
CN115151578B (zh)	2024-04-23
TW202208448A (zh)	2022-03-01
JPWO2021230373A1 (zh)	2021-11-18
CN119039524A (zh)	2024-11-29
JPWO2021230372A1 (zh)	2021-11-18
CN118271531A (zh)	2024-07-02
TW202208582A (zh)	2022-03-01
CN115151578A (zh)	2022-10-04
KR20230010619A (ko)	2023-01-19
TW202208449A (zh)	2022-03-01
CN115135676B (zh)	2024-09-17
WO2021230373A1 (ja)	2021-11-18
WO2021230372A1 (ja)	2021-11-18
WO2021230371A1 (ja)	2021-11-18
KR20230013014A (ko)	2023-01-26
CN118878751A (zh)	2024-11-01
CN115135676A (zh)	2022-09-30
JPWO2021230371A1 (zh)	2021-11-18

Publication	Publication Date	Title
KR20230013015A (ko)	2023-01-26	광 습기 경화형 수지 조성물, 전자 부품용 접착제, 경화체, 및 전자 부품
JP7470054B2 (ja)	2024-04-17	光湿気硬化性樹脂組成物、及び硬化体
JP2024026609A (ja)	2024-02-28	硬化性樹脂組成物、及び硬化体
WO2022260053A1 (ja)	2022-12-15	光湿気硬化型樹脂組成物、電子部品用接着剤、硬化体、及び電子部品
JP7557461B2 (ja)	2024-09-27	硬化性樹脂組成物、硬化体、及び電子部品
KR20230028207A (ko)	2023-02-28	광 습기 경화형 수지 조성물, 및 경화체
KR102665572B1 (ko)	2024-05-14	경화성 수지 조성물, 경화체, 전자 부품 및 조립 부품
WO2023176795A1 (ja)	2023-09-21	光湿気硬化性樹脂組成物、電子部品用接着剤及び表示素子用接着剤
KR20240144936A (ko)	2024-10-04	광 습기 경화형 수지 조성물, 전자 부품용 접착제 및 표시 소자용 접착제
JP2020045403A (ja)	2020-03-26	硬化性樹脂組成物、硬化体、電子部品及び組立部品
WO2022114186A1 (ja)	2022-06-02	湿気硬化性樹脂組成物、及び電子機器用接着剤
KR20240119073A (ko)	2024-08-06	접착제 조성물, 전자 부품용 접착제 및 휴대 전자 기기용 접착제
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PA0105

International application

Patent event date: 20220812

Patent event code: PA01051R01D

Comment text: International Patent Application