KR20230010642A - Heating non-combustion baking device and its heating element - Google Patents

Abstract

A heating non-combustion baking device 1 and its heating element 12, wherein the heating element 12 is used for inserting into and heating the air mist forming matrix 2, and the heating element 12 is a long sheet-shaped conductive substrate (121), a first insulating layer (122) and at least one conductive circuit (123); The conductive substrate 121 includes a first surface 1211 on which a first insulating layer 122 is formed; At least one conductive circuit 123 is formed on the first insulating layer 122; The at least one conductive circuit 123 includes a first end and a second end, wherein the first end is electrically connected to the conductive substrate 121 and the second end is electrically insulated from the conductive substrate 121 . In the present invention, by using the conductive substrate 121 as an electrode, electrical connection performance is more stable, peeling is prevented, and contact resistance is lowered.

Description

Heating non-combustion baking device and its heating element

The present invention relates to a baking apparatus, and more particularly to a heating non-combustion baking apparatus and a heating element thereof.

Electronic cigarettes, as alternatives to conventional cigarettes, are receiving more and more attention from people due to their advantages of being safe, convenient, healthy and environmentally friendly. Heating non-combustion e-cigarettes that operate at low temperatures heat and atomize the components of the cigarette at low temperatures. The heating method generally uses a pipe-type outer heating method or a central embedded heating method. The former refers to a method of surrounding the outside of the tobacco pipe with a heating pipe, and the latter refers to a method of inserting a heating plate or heating rod into the tobacco pipe. Among them, the heating plate is widely used because it is simple to manufacture and convenient to use. However, in conventional plate-type heating, conductive traces are silk-screen printed or coated on the surface of insulating ceramics, which can cause problems such as poor electrical contact and instability of current when working with conductive traces.

In view of the deficiencies of the above technology, the present invention provides an improved heating non-combustion baking device and a heating element thereof.

In order to achieve the above object, the present invention provides a heating element for inserting into and heating an air mist forming matrix, the heating element comprising a long sheet-shaped conductive substrate, a first insulating layer and at least one conductive circuit, ; the conductive substrate includes a first surface on which the first insulating layer is formed; the at least one conductive circuit is formed in the first insulating layer; The at least one conductive circuit includes a first end and a second end, wherein the first end is electrically connected to the conductive substrate and the second end is electrically insulated from the conductive substrate.

In some embodiments, the at least one conductive circuit includes a first heating portion, a first end of the first heating portion is electrically connected to the conductive substrate, and a second end of the first heating portion is It is electrically insulated from the conductive substrate.

In some embodiments, the first heating portion is made of one or more of silver, platinum, copper, nickel, and palladium.

In some embodiments, the at least one conductive circuit includes a first connection portion and a second connection portion, wherein resistances of the first connection portion and the second connection portion are smaller than resistance of the first heating portion; the first connecting portion is mechanically and electrically coupled to the first surface and is mechanically and electrically connected to a first end of the first heating portion; The second connection portion is formed on the first insulating layer and is mechanically and electrically connected to a second end of the first heating portion.

In some embodiments, the first connection portion and the second connection portion are made of one or more of gold, silver, and copper.

In some embodiments, the at least one conductive circuit includes a first lead and a second lead, wherein the first lead and the second lead are mechanically and electrically connected to the first connecting portion and the second connecting portion, respectively. do.

In some embodiments, a notch is provided at one corner of a root portion of the first insulating layer, and the first connection portion is mechanically and electrically connected to the conductive substrate at the notch.

In some embodiments, the heating element includes a first protective layer covering an outer surface of the first heating part.

In some embodiments, the conductive substrate includes a second surface opposite to the first surface, and the heating element includes a second insulating layer formed on the second surface.

In some embodiments, the heating element includes a second protective layer formed on a surface of the second insulating layer.

In some embodiments, the first connection portion and the second connection portion are made of the same material as the first heating portion and integrally formed with the first heating portion.

In some embodiments, a through hole is also provided at a position adjacent to the notch of the first insulating layer, and a first end of the first heating part is electrically connected to the conductive substrate through the through hole.

In some embodiments, the at least one conductive circuit includes a first connection portion and a second connection portion having a relatively small resistance formed in the first insulating layer, wherein the first connection portion is mechanically and electrically connected to the first end. electrically connected, and the second connecting portion is mechanically and electrically connected to the second end of the first heating portion; the at least one conductive circuit includes a first lead and a second lead, the first lead and the second lead being mechanically and electrically connected to the first connecting portion and the second connecting portion, respectively; The at least one conductive circuit further includes a third connection portion, and the third connection portion mechanically and electrically connects the first lead and the conductive substrate.

In some embodiments, the third connecting portion is mechanically and electrically coupled to the lower edge of the conductive substrate.

In some embodiments, the at least one conductive circuit includes a first connection portion and a second connection portion formed on the first insulating layer, wherein the first connection portion is mechanically and electrically connected to the first end; the second connecting portion is mechanically and electrically connected to the second end; two through holes are formed in the first insulating layer, and the first connecting portion is electrically connected to the conductive substrate through one of the two through holes; A first end of the first heating part is electrically connected to the conductive substrate through the other one of the two through holes.

In some embodiments, the at least one conductive circuit includes a first connection portion and a second connection portion having a smaller resistance than that of the first heating portion, wherein the first connection portion is mechanically and electrically connected to the first surface. coupled and mechanically and electrically connected to the first end; the second connecting portion is formed on the first insulating layer and is mechanically and electrically connected to the second end of the first heating portion; the conductive substrate includes a planar second surface opposite the first surface; said at least one conductive circuit comprises a fourth connecting portion mechanically and electrically coupled to said second surface; The at least one conductive circuit includes a first lead and a second lead, wherein the first lead and the second lead are mechanically and electrically connected to the fourth connecting portion and the second connecting portion, respectively.

In some embodiments, the at least one conductive circuit includes a second heating portion connected in parallel with the first heating portion.

In some embodiments, both the first heating part and the second heating part are U-shaped, the second heating part is located inside the first heating part, and both ends of the first heating part are in the second heating part. Both ends of the heating part are connected mechanically and electrically, respectively.

In some embodiments, the first connection portion and the conductive substrate are connected in series or parallel between the first lead and the first end of the first heating portion.

In some embodiments, a first end of the first heating portion is electrically connected to one end of the conductive substrate; The at least one conductive circuit includes a first connection portion, and the first connection portion is electrically connected to the other end of the conductive substrate.

In some embodiments, a position where the first end of the first heating part is electrically connected to the conductive substrate and a position where the first connection part is electrically connected to the conductive substrate are each in a longitudinal direction of the conductive substrate. is located on the diagonal of

In some embodiments, the first heating part includes at least three heating arms connected in series in an S shape and arranged spaced apart in parallel, and a V-shaped heating part connected to an end of the heating arms.

The present invention provides a heating non-combustion baking device including any one of the heating elements described above.

In some embodiments, a power source is further included, but the conductive substrate electrically connects an anode of the power source and the first terminal.

The present invention has advantageous effects of more stable electrical connection performance, prevention of peeling, and lowering contact resistance by using a conductive substrate as an electrode.

1 is a schematic diagram of a three-dimensional structure of a heating non-combustion baking apparatus according to some embodiments of the present invention in a state of use.
FIG. 2 is a schematic diagram of the three-dimensional structure of the heating non-combustion baking device shown in FIG. 1 in a state separated from the air mist forming matrix.
FIG. 3 is a schematic view of the vertical cross-sectional structure of the heating non-combustion baking device shown in FIG. 1;
4 is a schematic diagram of the three-dimensional structure of a heating element of the heating non-combustion baking device shown in FIG. 3;
5 is a schematic diagram of a partial three-dimensional exploded structure of the heating element shown in FIG. 4;
6 is a schematic diagram of a three-dimensional decomposition structure of the heating element shown in FIG. 4;
FIG. 7 is a schematic view of the three-dimensional structure of the conductive substrate of the heating element shown in FIG. 4 from another angle.
8 is a schematic diagram of the three-dimensional structure of the first alternative solution of the heating element shown in FIG. 4;
9 is a schematic diagram of a partial three-dimensional exploded structure of the heating element shown in FIG. 8;
FIG. 10 is a schematic diagram of a three-dimensional decomposition structure of the heating element shown in FIG. 8 .
Fig. 11 is a schematic diagram of the three-dimensional structure of the second alternative scheme of the heating element shown in Fig. 4;
12 is a schematic diagram of a partial three-dimensional exploded structure of the heating element shown in FIG. 11;
13 is a schematic diagram of a three-dimensional exploded structure of the heating element shown in FIG. 11;
FIG. 14 is a schematic diagram of the three-dimensional structure of a third alternative solution of the heating element shown in FIG. 4;
15 is a schematic diagram of a partial three-dimensional exploded structure of the heating element shown in FIG. 14;
16 is a schematic diagram of a three-dimensional decomposition structure of the heating element shown in FIG. 14;
17 is a schematic diagram of the three-dimensional structure of a fourth alternative solution of the heating element shown in FIG. 4;
18 is a schematic diagram of a partial three-dimensional exploded structure of the heating element shown in FIG. 17;
19 is a schematic diagram of a three-dimensional decomposition structure of the heating element shown in FIG. 17;
FIG. 20 is a schematic diagram of a three-dimensional structure of a fifth alternative solution of the heating element shown in FIG. 4;
21 is a schematic diagram of a partial three-dimensional exploded structure of the heating element shown in FIG. 20;
22 is a schematic diagram of a three-dimensional decomposition structure of the heating element shown in FIG. 20;
FIG. 23 is a schematic diagram of the three-dimensional structure of a sixth alternative solution of the heating element shown in FIG. 4;
24 is a schematic diagram of a partial three-dimensional exploded structure of the heating element shown in FIG. 23;
25 is a schematic diagram of the three-dimensional exploded structure of the heating element shown in FIG. 23;

In order to express the present invention more clearly, the present invention will be described in more detail below in conjunction with the accompanying drawings.

1 and 2 show a heating non-combustion baking device 1 according to some embodiments of the present invention, wherein the heating non-combustion baking device 1 is detachably inserted into the air mist forming matrix 2 ) is heated and baked to release the aerosol extract in the air mist forming matrix 2 in a non-combustible state. As shown, the air mist forming matrix 2 may be a cylindrical pipe. Correspondingly, an insertion hole 10 having a size suitable for the air mist forming matrix 2 is installed at the top of the heating non-combustion baking device 1 . An insertion hole cover 15 is installed next to the insertion hole 10 to cover the insertion hole 10 when not in use, so that foreign substances enter the insertion hole 10 and use the heating non-combustion baking device 1 interference can be prevented.

3 together, in some embodiments, the heating non-combustion baking device 1 includes a case 11 and a heating element 12 installed in the case 11, a power source 13, and a main board 14 ) may be included. The heating element 12 is inserted into the insertion hole 10 from the bottom of the insertion hole 10, and when the air mist forming matrix 2 is inserted into the insertion hole 10, the heating element 12 forms an air mist. By being inserted into the air mist forming matrix 2 in the longitudinal direction from the lower end of the matrix 2, it can be brought into close contact with the low-temperature baking air mist forming matrix 2 in the air mist forming matrix 2. In this way, when heat is generated through electricity to the heating element 12, the heat is transferred to the air mist forming matrix 2, so that the air mist forming matrix 2 is heated and emits smoke. The power source 13 is electrically connected to the heating element 12, and connection and disconnection between the two is controlled through a switch. On the main board 14, the relevant main control circuits are arranged.

4 to 6, in some embodiments, the heating element 12 includes a conductive substrate 121, a first insulating layer 122 coupled to the conductive substrate 121, and a conductive circuit 123. , The first protective layer 124, the second insulating layer 125 and the second protective layer 126 may be included. In some embodiments, the conductive circuit 123 may include a first end and a second end electrically connected to the positive and negative electrodes of the power source 13, respectively, wherein the first end is connected to the conductive substrate 121 is electrically connected to, and the second end is electrically insulated from the conductive substrate 121 so that current flows from the first end to the conductive circuit 123 through the conductive substrate 121, and from the second end to the conductive circuit ( 123) to allow it to flow out.

In some embodiments, the conductive substrate 121 may be made of a metal such as stainless steel or a conductive material such as conductive ceramic, and may have a thickness of 0.4 mm to 0.7 mm. Referring together with FIG. 7 , in some embodiments, the conductive substrate 121 may be in the shape of a long sheet, and may include a first flat surface 1211 and a second flat surface 1212 opposite to the first surface 1211 . can include In some embodiments, the conductive substrate 121 may include a fixing part 1213 for fixing to the case 11 and an insertion part 1214 connected to the fixing part 1213 . The insertion part 1214 is used for insertion into the air mist forming matrix 2, and may include a V-shaped tip 1215 to facilitate insertion into the air mist forming matrix 2. Both edges of the insertion part 1214 facing each other and both adjacent edges of the tip 1215 may be formed sharp so as to be easily inserted into the air mist forming matrix 2 .

In some embodiments, the first insulating layer 122 may be made of one or more of glass, ceramic, and polyimide, is formed on the first surface 1211 of the conductive substrate 121, and is formed at one corner of a root portion. A notch 1220 may be provided in the notch 1220 so that the conductive substrate 121 is exposed to the outside of the first insulating layer 122 at the notch 1220 .

In some embodiments, the conductive circuit 123 may include a first heating portion 1231 and a second heating portion 1232 having resistance temperature characteristics and relatively high resistance, and the first heating portion 1231 The second heating portion 1232 may be formed on the surface of the first insulating layer 122 by silk screen printing or electroplating to electrically insulate the conductive substrate 121 . In some embodiments, the first heating portion 1231 and the second heating portion 1232 may be U-shaped, and the second heating portion 1232 may be located inside the first heating portion 1231 . The first end and the second end of the first heating part 1231 are connected to the first end and the second end of the second heating part 1232, respectively, so that the first heating part 1231 and the second heating part 1232 are to be connected in parallel. In some embodiments, the first heating portion 1231 and the second heating portion 1232 may be made of one or more of silver, platinum, copper, nickel, and palladium. In some embodiments, the first exothermic portion 1231 or the second exothermic portion 1232 may be used for temperature measurement to better monitor the exothermic temperature.

In some embodiments, the first heating part 1231 includes two long heating arms arranged spaced apart in parallel to the length direction of the conductive substrate 121 and a V-shaped heating part connecting the two heating arms in series at the top. A first end and a second end of the first heating part 1231 are respectively formed at the roots of the two long heating arms. Each heating arm may include a first heating section, a second heating section, and a third heating section sequentially connected in series along a longitudinal direction (direction from the fixing part 1213 to the insertion part 1214), The width of the heating section, the second heating section, and the third heating section sequentially increases so that the resistance of the first heating section, the second heating section, and the third heating section sequentially decreases, thereby forming the air mist forming matrix 2 Allows for more balanced heating and baking. As can be understood, the heating arm is not limited to the 3-stage resistance reduction type structure, and a 2-stage or 3-stage or more structure is also possible. Arranging resistors in a stepwise manner in the first heating part 1231 has advantages such as a large amount of mist and a good feeling of inhalation because the heating element 12 can have a better energy utilization rate and temperature field.

Since the cold air enters the pipe from the bottom up, the heating element 12 and the lower part of the air mist forming matrix 2 generally contact the low-temperature air first, so the temperature difference is large and the heat exchange efficiency is relatively high. Since the upper part of the heating element 12 and the air mist forming matrix 2 is generally in contact with the hot air heated from the lower part, the temperature difference is small and the heat exchange efficiency is low. At this time, if the heating power of the upper and lower parts of the heating element 12 is the same, the temperature of the upper region of the heating element 12 and the air mist forming matrix 2 in the process of use increases. ) is always higher than the temperature of the lower region of the tobacco, so that a portion of the tobacco is overbaked and a portion is underbaked. However, by using the heating element 12 according to some embodiments of the present invention, this problem can be well solved, and the temperature inside the air mist forming matrix 2 can be more balanced during use.

In some embodiments, the conductive circuit 123 may include a first connection portion 1233 and a second connection portion 1234 whose resistance is smaller than that of the first heating portion 1231 and the second heating portion 1232. In some embodiments, the first connection portion 1233 and the second connection portion 1234 may be made of one or more of gold, silver, and copper. In some embodiments, the first connection portion 1233 is formed at a location where the conductive substrate 121 is exposed by the notch 1220, and the first heating portion 1231 and the second heating portion 1232 have first heating elements. The first ends of the first heating part 1231 and the second heating part 1232 may be electrically connected to the conductive substrate 121 by being connected to the ends. The second connection portion 1234 is formed on the first insulating layer 122 and is connected to second ends of the first heating portion 1231 and the second heating portion 1232 . As a result, current may be transmitted to the first end of the first heat generating part 1231 and the second heat generating part 1232 through two paths connected in parallel to the conductive substrate 121 and the first connection part 1233 .

In some embodiments, the conductive circuit 123 may include a first lead 1235 and a second lead 1236, and the first lead 1235 and the second lead 1236 may include a first connection portion ( 1233) and the second connection portion 1234 may be connected to each other by welding. The first connection portion 1233 is preferably electrically connected to the positive electrode of the power source 13 through the first lead 1235 to electrically connect the conductive substrate 121 and the positive electrode of the power source.

In some embodiments, when the conductive substrate 121 and one electrode of the power source are electrically connected (preferably electrically connected to the positive electrode of the power source), (1) the thermal conductivity of the conductive substrate 121 is higher and the temperature is more uniform. And, even when the temperature of the first heating part 1231 is relatively low, the overall atomization effect can be guaranteed; (2) It has beneficial effects such as more stable electrical connection performance, preventing peeling, and lowering contact resistance.

The first protective layer 124 covers the outer surfaces of the first heating part 1231 and the second heating part 1232 so that the first heating part 1231 and the second heating part 1232 form air mist during use. By preventing direct contact with the matrix 2, the first heating portion 1231 and the second heating portion 1232 are prevented from being corroded by the air mist forming matrix 2. In some embodiments, first protective layer 124 may be made of a glass or ceramic material.

In some embodiments, the second insulating layer 125 may be formed on the second surface 1212 of the conductive substrate 121 to improve insulation performance of the second surface 1212 side of the conductive substrate 121 . The second protective layer 126 is formed on the surface of the second insulating layer 125 to prevent corrosion of the second insulating layer 125 by the air mist forming matrix 2 during use, or the second insulating layer Harmful substances in 125 are prevented from entering the air mist forming matrix 2. It should be understood that in some embodiments, if the conductive substrate 121 is made of a food-grade harmless and corrosion-resistant material, the second insulating layer 125 and/or the second protective layer 126 may be omitted. .

It should be appreciated that in some embodiments, the heating element 12 may include two conductive circuits 123, the two conductive circuits 123 being the first surface 1211 of the conductive substrate 121. ) and the second surface 1212 to heat both sides of the conductive substrate 121 at the same time, thereby further improving heating efficiency.

8 to 10 show a heating element 12a according to some embodiments of the present invention, the heating element 12a may be used as an alternative to the heating element 12 described above, and in some embodiments, the heating element 12a The heating element 12a includes a conductive substrate 121a and a first insulating layer 122a coupled to the conductive substrate 121a, a conductive circuit 123a, a first protective layer 124a, and a second insulating layer 125a. and a second protective layer 126a. In some embodiments, the conductive circuit 123a may include a first end and a second end electrically connected to the positive and negative electrodes of the power source 13, respectively, wherein the first end is connected to the conductive substrate 121a. And electrically connected, the second end is electrically insulated from the conductive substrate 121a so that current flows from the first end to the conductive circuit 123a through the conductive substrate 121a, and again from the second end to the conductive circuit ( 123a).

In some embodiments, the conductive substrate 121a may have a long sheet shape and may include a flat first surface 1211a and a flat second surface 1212a opposite to the first surface 1211a. The first insulating layer 122a is formed on the first surface 1211a of the conductive substrate 121a, and a notch 1220a is provided at one corner of the root portion so that the conductive substrate 121a is formed at that position. It may be exposed to the outside of the layer 122a.

In some embodiments, the conductive circuit 123a may include a first heating portion 1231a and a second heating portion 1232a having relatively high resistance, and the first heating portion 1231a and the second heating portion ( 1232a) may be formed on the surface of the first insulating layer 122a by silk screen printing or electroplating to be electrically insulated from the conductive substrate 121a. In some embodiments, the first heating portion 1231a and the second heating portion 1232a may be U-shaped, and the second heating portion 1232a may be located inside the first heating portion 1231a. The first end and the second end of the first heating part 1231a are connected to the first end and the second end of the second heating part 1232a, respectively, so that the first heating part 1231a and the second heating part 1232a are formed. to be connected in parallel. In some embodiments, the first heating portion 1231a and the second heating portion 1232a may be made of one or more of silver, platinum, copper, nickel, and palladium.

In some embodiments, the conductive circuit 123a may include a first connection portion 1233a and a second connection portion 1234a having a smaller resistance than the first heating portion 1231a and the second heating portion 1232a. In some embodiments, the first connection part 1233a and the second connection part 1234a may be made of the same material as the first heating part 1231a and the second heating part 1232a, and the first heating part 1231a and the second heating part 1232a may be used. It may be integrally formed with the portion 1231a and the second heating portion 1232a. In some embodiments, the first connecting portion 1233a is formed at a location where the conductive substrate 121a is exposed by the notch 1220a, and the first heating portion 1231a and the second heating portion 1232a have first heat generating portions 1231a. The first ends of the first heating portion 1231a and the second heating portion 1232a may be electrically connected to the conductive substrate 121a. The second connection portion 1234a is formed on the first insulating layer 122a and is connected to the first heating portion 1231a and the second end of the second heating portion 1232a. As a result, current may be transmitted to the first end of the first heat generating part 1231a and the second heat generating part 1232a through two paths connected in parallel to the conductive substrate 121a and the first connection part 1233a.

In some embodiments, the conductive circuit 123a may include a first lead 1235a and a second lead 1236a, and the first lead 1235a and the second lead 1236a may include a first connection portion ( 1233a) and the second connection portion 1234a may be connected to each other by welding. Preferably, the first lead 1235a is electrically connected to the positive electrode of the power supply.

The first protective layer 124a covers the outer surfaces of the first heating part 1231a and the second heating part 1232a so that the first heating part 1231a and the second heating part 1232a form air mist during use. By preventing direct contact with the matrix 2, the first heating portion 1231a and the second heating portion 1232a are prevented from being corroded by the air mist forming matrix 2. In some embodiments, the first protective layer 124a may be made of a glass or ceramic material.

In some embodiments, the second insulating layer 125a may be formed on the second surface 1212a of the conductive substrate 121a to improve insulation performance of the second surface 1212a side of the conductive substrate 121a. The second protective layer 126a is formed on the surface of the second insulating layer 125a to prevent corrosion of the second insulating layer 125a by the air mist forming matrix 2 during use, or to prevent the second insulating layer 125a from being corroded. It prevents harmful substances in (125a) from entering the air mist forming matrix (2).

11 to 13 show a heating element 12b according to some embodiments of the present invention, the heating element 12b may be used as an alternative to the heating element 12 described above, and in some embodiments, the heating element 12b The heating element 12b includes a conductive substrate 121b and a first insulating layer 122b coupled to the conductive substrate 121b, a conductive circuit 123b, a first protective layer 124b, and a second insulating layer 125b. and a second protective layer 126b. In some embodiments, the conductive circuit 123b may include a first end and a second end electrically connected to the positive and negative electrodes of the power supply 13, respectively, wherein the first end is connected to the conductive substrate 121b. And electrically connected, the second end is electrically insulated from the conductive substrate 121b so that current flows from the first end to the conductive circuit 123b through the conductive substrate 121b, and from the second end to the conductive circuit ( 123b).

In some embodiments, the conductive substrate 121b may have a long sheet shape and may include a flat first surface 1211b and a flat second surface 1212b opposite to the first surface 1211b. The first insulating layer 122b is formed on the first surface 1211b of the conductive substrate 121b, and a notch 1220b is provided at one corner of the root portion, so that the conductive substrate 121b is formed at that position. It may be exposed to the outside of the layer 122b. A through hole 1221b is also provided at a position adjacent to the notch 1220b on the first insulating layer 122b, and the conductive substrate 121b is also exposed to the outside of the first insulating layer 122b at that position.

In some embodiments, the conductive circuit 123b may include a first heating portion 1231b and a second heating portion 1232b having relatively high resistance, and the first heating portion 1231b and the second heating portion ( 1232b) may be formed on the surface of the first insulating layer 122b by silk screen printing or electroplating to be electrically insulated from the conductive substrate 121b. In some embodiments, the first heating portion 1231b and the second heating portion 1232b may be U-shaped, and the second heating portion 1232b may be located inside the first heating portion 1231b. The first and second ends of the first heating part 1231b are connected to the first and second ends of the second heating part 1232b, respectively, so that the first heating part 1231b and the second heating part 1232b are formed. to be connected in parallel. In some embodiments, the first heating portion 1231b and the second heating portion 1232b may be made of one or more of silver, platinum, copper, nickel, and palladium. The position where the first end of the first heating part 1231b and the first end of the second heating part 1232b are connected also corresponds to the through hole 1221b of the first insulating layer 122b, so that the first heating part 1231b ) and the first end of the second heating part 1232b are connected to each other so as to be coupled to the conductive substrate 121b. As a result, current may be transmitted to the first end of the first heat generating part 1231b and the second heat generating part 1232b through two paths connected in parallel to the conductive substrate 121b and the first connection part 1233b.

In some embodiments, the conductive circuit 123b may include a first connection portion 1233b and a second connection portion 1234b having a smaller resistance than the first heating portion 1231b and the second heating portion 1232b. In some embodiments, the first connection portion 1233b and the second connection portion 1234b may be made of one or more of gold, silver, and copper. In some embodiments, the first connection portion 1233b is formed at a position where the conductive substrate 121b is exposed by the notch 1220b and is electrically connected to the conductive substrate 121b so that the first connecting portion 1233b passes through the conductive substrate 121b. It may be electrically connected to the first end of the heating part 1231b and the second heating part 1232b. The second connection portion 1234b is formed on the first insulating layer 122b and is connected to the second ends of the first heating portion 1231b and the second heating portion 1232b.

In some embodiments, the conductive circuit 123b may include a first lead 1235b and a second lead 1236b, and the first lead 1235b and the second lead 1236b may include a first connection portion ( 1233b) and the second connection portion 1234b may be connected to each other by welding.

The first protective layer 124b covers the outer surfaces of the first heating part 1231b and the second heating part 1232b so that the first heating part 1231b and the second heating part 1232b form air mist during use. By preventing direct contact with the matrix 2, the first heating portion 1231b and the second heating portion 1232b are prevented from being corroded by the air mist forming matrix 2. In some embodiments, the first protective layer 124b may be made of a glass or ceramic material.

In some embodiments, the second insulating layer 125b may be formed on the second surface 1212b of the conductive substrate 121b to improve insulation performance of the second surface 1212b side of the conductive substrate 121b. The second protective layer 126b is formed on the surface of the second insulating layer 125b to prevent corrosion of the second insulating layer 125b by the air mist forming matrix 2 during use, or to prevent the second insulating layer 125b from being corroded. Harmful substances in (125b) are prevented from entering the air mist forming matrix (2).

14 to 16 show a heating element 12c according to some embodiments of the present invention, the heating element 12c may be used as an alternative to the heating element 12 described above, and in some embodiments, the heating element 12c The heating element 12c includes a conductive substrate 121c and a first insulating layer 122c coupled to the conductive substrate 121c, a conductive circuit 123c, a first protective layer 124c, and a second insulating layer 125c. and a second protective layer 126c. In some embodiments, the conductive circuit 123c may include a first end and a second end electrically connected to the positive and negative electrodes of the power source 13, respectively, wherein the first end is connected to the conductive substrate 121c. And electrically connected, the second end is electrically insulated from the conductive substrate 121c so that current flows from the first end to the conductive circuit 123c through the conductive substrate 121c, and from the second end to the conductive circuit ( 123c).

In some embodiments, the conductive substrate 121c may have a long sheet shape and may include a flat first surface 1211c and a flat second surface 1212c opposite to the first surface 1211c. The first insulating layer 122c is formed on the first surface 1211c of the conductive substrate 121c.

In some embodiments, the conductive circuit 123c may include a first heating portion 1231c and a second heating portion 1232c having relatively high resistance, and the first heating portion 1231c and the second heating portion ( 1232c) may be formed on the surface of the first insulating layer 122c by silk screen printing or electroplating to be electrically insulated from the conductive substrate 121c. In some embodiments, the first heating part 1231c and the second heating part 1232c may be U-shaped, and the second heating part 1232c may be located inside the first heating part 1231c. The first and second ends of the first heating part 1231c are connected to the first and second ends of the second heating part 1232c, respectively, so that the first heating part 1231c and the second heating part 1232c are formed. to be connected in parallel. In some embodiments, the first heating portion 1231c and the second heating portion 1232c may be made of one or more of silver, platinum, copper, nickel, and palladium.

In some embodiments, the conductive circuit 123c may include a first connection portion 1233c and a second connection portion 1234c having a smaller resistance than the first heating portion 1231c and the second heating portion 1232c. In some embodiments, the first connection portion 1233c and the second connection portion 1234c may be made of one or more of gold, silver, and copper. Both the first connection part 1233c and the second connection part 1234c are formed on the first insulating layer 122c, and the first connection part 1233c is the first heating part 1231c and the second heating part 1232c. ), and the second connection portion 1234c is connected to the second ends of the first heating portion 1231c and the second heating portion 1232c. As a result, current may be transferred to the first end of the first heat generating part 1231c and the second heat generating part 1232c through two paths connected in parallel to the conductive substrate 121c and the first connection part 1233c.

In some embodiments, the conductive circuit 123c may include a first lead 1235c and a second lead 1236c, and the first lead 1235c and the second lead 1236c may include a first connection portion ( 1233c) and the second connection portion 1234c may be connected to each other by welding. In some embodiments, the conductive circuit 123c may include a third connection portion 1237c, and the third connection portion 1237c mechanically and electrically connects the first lead 1235c and the conductive substrate 121c. connect In some embodiments, the third connection portion 1237c is coupled to the lower edge of the conductive substrate 121c.

The first protective layer 124c covers the outer surfaces of the first heating part 1231c and the second heating part 1232c so that the first heating part 1231c and the second heating part 1232c form air mist during use. By preventing direct contact with the matrix 2, the first heating portion 1231c and the second heating portion 1232c are prevented from being corroded by the air mist forming matrix 2. In some embodiments, the first protective layer 124c may be made of a glass or ceramic material.

In some embodiments, the second insulating layer 125c may be formed on the second surface 1212c of the conductive substrate 121c to improve insulation performance of the second surface 1212c side of the conductive substrate 121c. The second protective layer 126c is formed on the surface of the second insulating layer 125c to prevent corrosion of the second insulating layer 125c by the air mist forming matrix 2 during use, or the second insulating layer 125c. It prevents harmful substances in (125c) from entering the air mist forming matrix (2).

17 to 19 show a heating element 12d according to some embodiments of the present invention, the heating element 12d may be used as an alternative to the heating element 12 described above, and in some embodiments, the heating element 12d The heating element 12d includes a conductive substrate 121d, a first insulating layer 122d coupled to the conductive substrate 121d, a conductive circuit 123d, a first protective layer 124d, and a second insulating layer 125d. and a second protective layer 126d. In some embodiments, the conductive circuit 123d may include a first end and a second end electrically connected to an anode and a cathode of the power source 13, respectively, wherein the first end is connected to the conductive substrate 121d. And electrically connected, the second end is electrically insulated from the conductive substrate 121d so that current flows from the first end to the conductive circuit 123 through the conductive substrate 121d, and from the second end to the conductive circuit ( 123d).

In some embodiments, the conductive substrate 121d may have a long sheet shape and may include a flat first surface 1211d and a flat second surface 1212d opposite to the first surface 1211d. The first insulating layer 122d is formed on the first surface 1211d of the conductive substrate 121d, and two through holes 1221d are formed thereon, and the two through holes 1221d are formed on the conductive substrate 121d. ) are respectively exposed to the outside of the first insulating layer 122d.

In some embodiments, the conductive circuit 123d may include a first heating portion 1231d and a second heating portion 1232d having relatively high resistance, and the first heating portion 1231d and the second heating portion ( 1232d) may be formed on the surface of the first insulating layer 122d by silk screen printing or electroplating to be electrically insulated from the conductive substrate 121d. In some embodiments, the first heating portion 1231d and the second heating portion 1232d may be U-shaped, and the second heating portion 1232d may be located inside the first heating portion 1231d. The first end and the second end of the first heating part 1231d are connected to the first end and the second end of the second heating part 1232d, respectively, so that the first heating part 1231d and the second heating part 1232d are to be connected in parallel. The position where the first ends of the first heating part 1231d and the second heating part 1232d are connected corresponds to one of the two through holes 1221d and is electrically connected to the conductive substrate 121d. In some embodiments, the first heating portion 1231d and the second heating portion 1232d may be made of one or more of silver, platinum, copper, nickel, and palladium.

In some embodiments, the conductive circuit 123d may include a first connection portion 1233d and a second connection portion 1234d whose resistance is smaller than that of the first heating portion 1231d and the second heating portion 1232d. In some embodiments, the first connection portion 1233d and the second connection portion 1234d may be made of one or more of gold, silver, and copper. Both the first connection portion 1233d and the second connection portion 1234d are formed on the first insulating layer 122d, and the first connection portion 1233d is the first heating portion 1231d and the second heating portion 1232d. ), and the second connection portion 1234d is connected to the second ends of the first heating portion 1231d and the second heating portion 1232d. In addition, the first connection portion 1233d also corresponds to the other one of the two through holes 1221d and is electrically connected to the conductive substrate 121d, so that current flows from the first connection portion 1233d to the first heating portion ( 1231d) and the first end of the second heating part 1232d, but also transferred back to the first end of the first heating part 1231d and the second heating part 1232d through the conductive substrate 121d. This improves the safety of electrical connections. As a result, current may be transmitted to the first end of the first heat generating part 1231d and the second heat generating part 1232d through two paths connected in parallel to the conductive substrate 121d and the first connection part 1233d.

In some embodiments, the conductive circuit 123d may include a first lead 1235d and a second lead 1236d, and the first lead 1235d and the second lead 1236d may include a first connection portion ( 1233d) and the second connection portion 1234d may be connected by welding.

The first protective layer 124d covers the outer surfaces of the first heating part 1231d and the second heating part 1232d so that the first heating part 1231d and the second heating part 1232d form air mist during use. By preventing direct contact with the matrix 2, the first heating portion 1231d and the second heating portion 1232d are prevented from being corroded by the air mist forming matrix 2. In some embodiments, the first protective layer 124d may be made of a glass or ceramic material.

In some embodiments, the second insulating layer 125d may be formed on the second surface 1212d of the conductive substrate 121d to improve insulation performance of the second surface 1212d side of the conductive substrate 121d. The second protective layer 126d is formed on the surface of the second insulating layer 125d to prevent corrosion of the second insulating layer 125d by the air mist forming matrix 2 during use, or the second insulating layer 125d. (125d) prevents harmful substances from entering the air mist forming matrix 2.

20 to 22 show a heating element 12e according to some embodiments of the present invention, the heating element 12e may be used as an alternative to the heating element 12 described above, and in some embodiments, the heating element 12e The heating element 12e includes a conductive substrate 121e and a first insulating layer 122e coupled to the conductive substrate 121e, a conductive circuit 123e, a first protective layer 124e, and a second insulating layer 125e. and a second protective layer 126e. In some embodiments, the conductive circuit 123e may include a first end and a second end electrically connected to an anode and a cathode of the power source 13, respectively, wherein the first end is connected to the conductive substrate 121e. And electrically connected, the second end is electrically insulated from the conductive substrate 121e so that current flows from the first end to the conductive circuit 123e through the conductive substrate 121e, and again from the second end to the conductive circuit ( 123e).

In some embodiments, the conductive substrate 121e may have a long sheet shape and may include a flat first surface 1211e and a flat second surface 1212e opposite to the first surface 1211e. The first insulating layer 122e is formed on the first surface 1211e of the conductive substrate 121e, and a notch 1220e is provided at one corner of the root portion, so that the conductive substrate 121e is formed at that position. It may be exposed to the outside of the layer 122e.

In some embodiments, the conductive circuit 123e may include a first heating portion 1231e and a second heating portion 1232e having relatively high resistance, and the first heating portion 1231e and the second heating portion ( 1232e) may be formed on the surface of the first insulating layer 122e by silk screen printing or electroplating to be electrically insulated from the conductive substrate 121e. In some embodiments, the first heating portion 1231e and the second heating portion 1232e may be U-shaped, and the second heating portion 1232e may be located inside the first heating portion 1231e. The first end and the second end of the first heating part 1231e are connected to the first end and the second end of the second heating part 1232e, respectively, so that the first heating part 1231e and the second heating part 1232e are to be connected in parallel. In some embodiments, the first heating portion 1231e and the second heating portion 1232e may be made of one or more of silver, platinum, copper, nickel, and palladium.

In some embodiments, the conductive circuit 123e may include a first connection portion 1233e and a second connection portion 1234e having a smaller resistance than the first heating portion 1231e and the second heating portion 1232e. In some embodiments, the first connection portion 1233e and the second connection portion 1234e may be made of one or more of gold, silver, and copper. In some embodiments, the first connection portion 1233e is formed at a location where the conductive substrate 121e is exposed by the notch 1220e, and the first heating portion 1231e and the second heating portion 1232e have first heating elements. The first ends of the first heating portion 1231e and the second heating portion 1232e may be electrically connected to the conductive substrate 121e. The second connection portion 1234e is formed on the first insulating layer 122e and is connected to the second end of the first heating portion 1231e and the second heating portion 1232e. In some embodiments, the conductive circuit 123e may include a fourth connection portion 1238e, and the fourth connection portion 1238e is coupled to the second surface 1212e of the conductive substrate 121e to provide conductivity. It is electrically connected to the first connection portion 1233e through the substrate 121e. As a result, current flows to the first end of the first heat generating part 1231e and the second heat generating part 1232e through the fourth connection part 1238e, the conductive substrate 121e and the first connection part 1233e which are sequentially connected in series. can be transmitted

In some embodiments, the conductive circuit 123e may include a first lead 1235e and a second lead 1236e, and the first lead 1235e and the second lead 1236e may include a fourth connection portion ( 1238e) and the second connection portion 1233e may be connected to each other by welding.

The first protective layer 124e covers the outer surfaces of the first heating part 1231e and the second heating part 1232e so that the first heating part 1231e and the second heating part 1232e form air mist during use. By preventing direct contact with the matrix 2, the first heating portion 1231e and the second heating portion 1232e are prevented from being corroded by the air mist forming matrix 2. In some embodiments, the first protective layer 124e may be made of a glass or ceramic material.

In some embodiments, the second insulating layer 125e may be formed on the second surface 1212e of the conductive substrate 121e to improve insulation performance of the second surface 1212e of the conductive substrate 121e. A notch 1250e is provided in the second insulating layer 125e so that the fourth connection portion 1238e is coupled to the second surface 1212e of the conductive substrate 121e. The second protective layer 126e is formed on the surfaces of the second insulating layer 125e and the fourth connection portion 1238e, and during use, the second insulating layer 125e and the fourth protective layer 125e by the air mist forming matrix 2 Corrosion of the connection portion 1238e is prevented, or harmful substances in the second insulating layer 125e are prevented from entering the air mist forming matrix 2.

23 to 25 show a heating element 12f according to some embodiments of the present invention, the heating element 12f may be used as an alternative to the heating element 12 described above, and in some embodiments, the heating element 12f The heating element 12f includes a conductive substrate 121f and a first insulating layer 122f coupled to the conductive substrate 121f, a conductive circuit 123f, a first protective layer 124f, and a second insulating layer 125f. and a second protective layer 126f. In some embodiments, the conductive circuit 123f may include a first end and a second end electrically connected to the positive and negative electrodes of the power source 13, respectively, wherein the first end is connected to the conductive substrate 121f. and the second end is electrically insulated from the conductive substrate 121f so that current flows from the first end to the conductive circuit 123f through the conductive substrate 121f, and from the second end to the conductive circuit ( 123f).

In some embodiments, the conductive substrate 121f may have a long sheet shape and may include a flat first surface 1211f and a flat second surface 1212f opposite to the first surface 1211f. The first insulating layer 122f is formed on the first surface 1211f of the conductive substrate 121f, and a notch 1220f is provided at the right corner of the root portion so that the conductive substrate 121f is formed at that position. It may be exposed to the outside of the layer 122f. A through hole 1221f is also provided at a tip portion spaced apart from the notch 1220f in the first insulating layer 122f, the through hole 1221f and the notch 1220f are distributed in a diagonal shape, and the conductive substrate 121f is also exposed to the outside of the first insulating layer 122f at that position.

In some embodiments, the conductive circuit 123f may include a first heating portion 1231f having a relatively high resistance, and the first heating portion 1231f is a first insulating layer by silk screen printing or electroplating. It may be formed on the surface of (122f). In some embodiments, the first heating part 1231f may be S-shaped, and three heating arms A, B, and C arranged in series and spaced apart in parallel and an end of the heating arm C are connected in an S shape. The first heating portion 1231f may be uniformly distributed over the surface of the conductive substrate 121f by including the V-shaped heating portion D connected to the first heating portion 1231f. In some embodiments, the first heating portion 1231f may be made of one or more of silver, platinum, copper, nickel, and palladium. The first end of the first heating part 1231f (that is, the end of the heating part D) corresponds to the through hole 1221f of the first insulating layer 122f, and through the through hole 1221f, the conductive substrate ( 121f).

In some embodiments, the conductive circuit 123f may include a first connection portion 1233f and a second connection portion 1234f whose resistance is smaller than that of the first heating portion 1231f. The first connection portion 1233f and the second connection portion 1234f may be made of one or more of gold, silver, and copper. In some embodiments, the first connection portion 1233f is formed at a position where the conductive substrate 121f is exposed by the notch 1220f and is electrically connected to the conductive substrate 121f so that the first connecting portion 1233f is connected through the conductive substrate 121f. It may be electrically connected to the first end of the heating part 1231f. As a result, current may be transmitted to the first end of the first heating part 1231f through the first connection part 1233f and the conductive substrate 121f sequentially connected in series. In addition, since the first connection portions 1233f are distributed at diagonal positions on both ends of the conductive substrate 121f, the current passes through almost all of the diagonal lines in the longitudinal direction of the conductive substrate 121f during transmission.

In some embodiments, the conductive circuit 123f may include a first lead 1235f and a second lead 1236f, the first lead 1235f and the second lead 1236f having a first connection portion ( 1233f) and the second connection portion 1234f may be connected by welding.

The first protective layer 124f covers the outer surface of the first heating portion 1231f to prevent the first heating portion 1231f from directly contacting the air mist forming matrix 2 during use, thereby preventing the first heating portion ( 1231f) is not corroded by the air mist forming matrix 2. In some embodiments, the first protective layer 124f may be made of a glass or ceramic material.

In some embodiments, the second insulating layer 125f may be formed on the second surface 1212f of the conductive substrate 121f to improve insulation performance of the second surface 1212f of the conductive substrate 121f. The second protective layer 126f is formed on the surface of the second insulating layer 125f to prevent corrosion of the second insulating layer 125f by the air mist forming matrix 2 during use, or the second insulating layer 125f. It prevents harmful substances in (125f) from entering the air mist forming matrix (2).

It should be understood that the foregoing examples merely represent preferred embodiments of the present invention, and the description is more specific and detailed, but should not be construed as limiting the patent scope of the present invention.

Claims (24)

In the heating element,
It is used to insert and heat the air mist forming matrix,
The heating element includes a long sheet-shaped conductive substrate, a first insulating layer and at least one conductive circuit; the conductive substrate includes a first surface on which the first insulating layer is formed; the at least one conductive circuit is formed in the first insulating layer; wherein said at least one conductive circuit comprises a first end and a second end, said first end electrically connected to said conductive substrate and said second end electrically insulated from said conductive substrate; device. According to claim 1,
The at least one conductive circuit includes a first heating portion, a first end of the first heating portion is electrically connected to the conductive substrate, and a second end of the first heating portion is electrically connected to the conductive substrate. Heating element characterized in that it is insulated. According to claim 2,
The heating element, characterized in that the first heating portion is made of at least one material of silver, platinum, copper, nickel and palladium. According to claim 2,
the at least one conductive circuit includes a first connection portion and a second connection portion, wherein the resistance of the first connection portion and the second connection portion is smaller than that of the first heating portion; the first connecting portion is mechanically and electrically coupled to the first surface and is mechanically and electrically connected to a first end of the first heating portion; The second connection part is formed on the first insulating layer and is mechanically and electrically connected to the second end of the first heat generating part. According to claim 4,
The heating element, characterized in that the first connection portion and the second connection portion are made of at least one material of gold, silver and copper. According to claim 4,
The at least one conductive circuit includes a first lead and a second lead, wherein the first lead and the second lead are mechanically and electrically connected to the first connection portion and the second connection portion, respectively. heating element. According to claim 4,
A heating element, characterized in that a notch is provided at one corner of the root portion of the first insulating layer, and the first connection portion is mechanically and electrically connected to the conductive substrate at the notch. According to claim 2,
The heating element comprises a first protective layer covering an outer surface of the first heating part. According to claim 2,
The heating element according to claim 1 , wherein the conductive substrate includes a second surface opposite to the first surface, and the heating element includes a second insulating layer formed on the second surface. According to claim 9,
The heating element is characterized in that it comprises a second protective layer formed on the surface of the second insulating layer. According to claim 5,
The heating element, characterized in that the first connection portion and the second connection portion are made of the same material as the first heating portion and integrally formed with the first heating portion. According to claim 7,
A heating element, characterized in that a through hole is further provided at a position adjacent to the notch of the first insulating layer, and a first end of the first heating part is electrically connected to the conductive substrate through the through hole. According to claim 2,
The at least one conductive circuit includes a first connection portion and a second connection portion having relatively low resistance formed in the first insulating layer, wherein the first connection portion is mechanically and electrically connected to the first end, the second connecting portion is mechanically and electrically connected to the second end of the first heating portion; the at least one conductive circuit includes a first lead and a second lead, the first lead and the second lead being mechanically and electrically connected to the first connecting portion and the second connecting portion, respectively; The heating element of claim 1, wherein the at least one conductive circuit further comprises a third connection portion, and the third connection portion mechanically and electrically connects the first lead and the conductive substrate. According to claim 13,
The heating element, characterized in that the third connecting portion is mechanically and electrically coupled to the lower edge of the conductive substrate. According to claim 2,
The at least one conductive circuit includes a first connection portion and a second connection portion formed on the first insulating layer, wherein the first connection portion is mechanically and electrically connected to the first end, and the second connection portion is mechanically and electrically connected to the second end; two through holes are formed in the first insulating layer, and the first connecting portion is electrically connected to the conductive substrate through one of the two through holes; The heating element, characterized in that the first end of the first heating portion is electrically connected to the conductive substrate through the other one of the two through holes. According to claim 2,
The at least one conductive circuit includes a first connection portion and a second connection portion having a smaller resistance than the first heating portion, wherein the first connection portion is mechanically and electrically coupled to the first surface, and wherein the first connection portion is coupled to the first surface. mechanically and electrically connected to stage 1; the second connecting portion is formed on the first insulating layer and is mechanically and electrically connected to the second end of the first heating portion; the conductive substrate includes a planar second surface opposite the first surface; said at least one conductive circuit comprises a fourth connecting portion mechanically and electrically coupled to said second surface; The at least one conductive circuit includes a first lead and a second lead, wherein the first lead and the second lead are mechanically and electrically connected to the fourth connection portion and the second connection portion, respectively. heating element. According to any one of claims 2 to 16,
The heating element, characterized in that the at least one conductive circuit comprises a second heating portion connected in parallel with the first heating portion. According to claim 17,
Both the first heating part and the second heating part are U-shaped, the second heating part is located inside the first heating part, and both ends of the first heating part are connected to both ends of the second heating part. Heating elements, characterized in that they are connected mechanically and electrically, respectively. According to claim 6,
The heating element, characterized in that the first connection portion and the conductive substrate are connected in series or parallel between the first lead and the first end of the first heating portion. According to claim 2,
a first end of the first heating portion is electrically connected to one end of the conductive substrate; The heating element according to claim 1 , wherein the at least one conductive circuit includes a first connection portion, and the first connection portion is electrically connected to the other end of the conductive substrate. According to claim 20,
The position where the first end of the first heating part is electrically connected to the conductive substrate and the position where the first connection part is electrically connected to the conductive substrate are located at diagonal portions of the conductive substrate in the longitudinal direction, respectively. Heating element, characterized in that. According to claim 20,
The first heating element comprises at least three heating arms connected in series in an S shape and arranged spaced apart in parallel, and a V-shaped heating unit connected to an end of the heating arms. In the heating non-combustion baking device,
A heating non-combustion baking device comprising the heating element according to any one of claims 1 to 22. According to claim 23,
Further comprising a power source, wherein the conductive substrate electrically connects the anode of the power source and the first terminal.

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