KR20220145042A - Apparatus for directional heat transfer - Google Patents

Abstract

The present invention is to provide a directional heat transfer device. According to the present invention, a directional heat transfer device comprises: a radiating heat transfer member having a curved low-emissivity radiating surface and a flat high-emissivity radiating surface to absorb and radiate heat in a low-temperature space to an absorbing heat transfer member; and the absorbing heat transfer member which is provided with a low-emissivity absorbing surface formed in a curved surface to absorb heat radiated from the high-emissivity radiating surface, and a high-emissivity absorbing surface formed as a curved surface to absorb heat radiated from the low-emissivity radiating surface, and absorbs heat radiated from the radiating heat transfer member and transfers it to a high-temperature space. Accordingly, it is possible to improve insulation performance by configuring the facing surface of the heat transfer member as a curved surface with low emissivity and high emissivity so that the heat transfer device has directionality.

Description

Directional heat transfer device {Apparatus for directional heat transfer}

The present invention relates to a directional heat transfer device, and more particularly, to a directional heat transfer device in which the facing surface of a heat transfer member is configured with curved surfaces of low and high emissivity to make the heat transfer device have directionality to improve thermal insulation performance. .

In general, thermal energy moves from a pyrometer to a low temperature system through conduction, convection, and radiation modes according to the second law of thermodynamics. Heat transfer by conduction and convection requires a temperature gradient in the medium, but heat transfer by radiation is achieved through mutual radiation and absorption between two surfaces even in the absence of a medium.

The wavelength of thermal radiation emitted by the surface is 0.1 to 100 μm, including some UV (ultraviolet, ultraviolet) and all visible and infrared rays, and this range is related to heat transfer.

According to the Planck distribution and Wien's displacement law, in an ideal black body below 800K (800 - 273.15 = 526.85℃), only infrared radiation is involved in radiative heat transfer, and the actual surface around 300K In , only wavelengths in the range of 5 to 45 μm are involved in heat transfer.

When irradiated to a translucent medium, the thermal radiation spectrum in the range of 5 to 45 μm has the characteristics of being reflected from the surface, absorbed by the medium, and transmitted through the medium. This is a common electrical insulator, and a shiny electrical conductor reflects most of the energy.

The reflected energy and the radiated energy are called radiosity. If the surface is a diffuse reflector like a black body and a diffuse emitter, it emits uniform energy in all directions.

However, a surface coated with an electrically insulator on a metal surface (eg, an aluminum surface coated with a matte paint) absorbs most of the irradiated energy (α = 0.95) and reflects only a portion (r = 0.05). Also, the surface emissivity (ε = 0.95) is equal to the absorption rate. Unlike a black body, the radiation direction is mainly emitted in a vertical direction, and the direction of radiation can be controlled by changing the surface shape and molecular weight of the coated material.

In addition, the well polished aluminum surface has a very high reflectance (reflectance = 98%), the incident angle and the reflection angle of the irradiation energy are the same, and has a very low (about 0.02) emissivity.

Radiant heat transfer is achieved through mutual radiation and absorption between two surfaces. Through this principle, in space, multi-layer insulation (MLI) is used to realize the insulation properties of space suits. The electromagnetic wave radiated from the sun's surface at 5800K includes all the thermal radiation spectrum, and the visible light region has the highest radiation intensity. The space suit heated by solar radiation is about 400K or less, and only emits electromagnetic waves in the infrared region. Therefore, it is possible to prevent the temperature rise of the spacesuit due to solar radiation by making the outer surface of the spacesuit have a low absorption rate for visible light and a high infrared radiation rate. In addition, when there is no solar radiation, the outer temperature of the spacesuit is also about 120K, mainly emitting infrared rays of 30um wavelength, and with body temperature of 310K, astronauts mainly radiate infrared rays of 10um wavelength. At this time, by increasing the infrared emissivity of 30um wavelength and lowering the infrared emissivity of 10um wavelength on the inner surface of the spacesuit, heat loss from astronauts to space can be minimized.

However, the multi-layer insulation used in space suits has limitations in its use on Earth. According to Kirchhoff's law, it is known that the emissivity is equal to the absorption rate in the same wavelength band, and since the infrared spectrum radiated from both sides of the insulating material is irradiated on both sides of the earth on Earth, the amount of radiant heat transfer in both directions is the same. That is, the radiant heat transfer between the hot and cold surfaces cancels each other out, so that the net heat transfer amount is close to zero.

On the other hand, in order to transfer thermal energy from a low temperature region to a high temperature region, a refrigeration cycle is used or a Peltier element is applied. Such a heat pumping device or element consumes a certain amount of energy.

In addition, recently, when high-performance insulation properties are required, such as a refrigerator, vacuum insulation is applied to minimize the insulation thickness and secure insulation performance.

This vacuum insulator (0.0035W/mK) has lower thermal conductivity than conventional polyurethane foam (0.026W/mK) or glass fiber (0.039W/mK). The insulation principle of vacuum insulation material is to keep the inside of the envelope in a vacuum to minimize the deterioration of insulation performance due to conduction and convection of air.

Multilayer insulation using aluminum foil and glass fiber with a reflective surface has a thermal conductivity of 0.000017 W/mK at cryogenic temperatures. (Source: Machine Robot Research Information Center, 'Material property table', 'Aluminum foil and glass paper laminate; 75-150 layers; evacuated; for cryogenic application (150K)')

As a prior paper, in 2018, Shanhui Fan et al. reviewed various literatures on nanotexture and thermal radiation on the surface, and summarized the technology to control thermal radiation. [Optics Express, Vol. 26, No. 12]

In addition, in the patent literature, "a vacuum insulation material, a manufacturing method of a vacuum insulation material, and a refrigerator including a vacuum insulation material" [1018303740000] has been disclosed.

However, in the case of a multi-layered insulating material used in space, the prior art has a limit to use on the earth because the infrared spectrum on the earth is almost the same. That is, in realizing thermal insulation performance through low-emissivity surface treatment for multi-layer insulators, it is difficult to improve thermal insulation performance because the two surfaces in thermal equilibrium have a net radiant heat transfer amount of "0" according to Kirchhoff's law. Therefore, the need for a device that can be applied to the earth by improving the insulation performance of the multi-layer insulation material is emerging.

US 10-18303740 B1

WEI LI AND SHANHUI FAN, Nanophotonic control of thermal radiation for energy applications, Optics Express, Vol. 26, No. 12, 11 Jun 2018

Accordingly, the present invention has been proposed to solve the problems of the related art as described above, and an object of the present invention is to configure the facing surface of the heat transfer member with curved surfaces of low emissivity and high emissivity so that the heat transfer device has a directionality to provide thermal insulation performance. To provide a directional heat transfer device that can improve

1 is a front view of a directional heat transfer device according to an embodiment of the present invention, FIG. 2 is a partial enlarged view of FIG. 1, FIG. 3 is a side view and a plan view of FIG. 1, and FIG. 4 is an exploded perspective view of FIG.

As shown in this figure, a radiating heat transfer member ( 100) and; A low emissivity absorbing surface 220 formed as a curved surface to absorb heat radiated from the high emissivity surface 130 and a high emissivity absorbing surface 230 formed as a curved surface to absorb heat radiated from the low emissivity emissive surface 120 . and an absorption heat transfer member 200 that absorbs heat radiated from the radiation heat transfer member 100 and transfers it to the high temperature space 600;

The radiation base material 110 of the radiation heat transfer member 100 and the absorption base material 110 of the absorption heat transfer member 200 are each made of aluminum.

The low emissivity emitting surface 120 of the radiating heat transfer member 100 and the low emissivity absorbing surface 210 of the absorbing heat transfer member 200 are formed by electrolytic polishing of an aluminum sheet and deposition of high purity aluminum, respectively. do.

The high emissivity emitting surface 130 of the radiating heat transfer member 100 and the high emissivity absorbing surface 230 of the absorbing heat transfer member 200 are each coated with a non-metallic or multiwalled carbon nanotube (MWCNT). It is characterized in that it is formed through coating.

The directional heat transfer device includes: a first support member 300 for coupling the radiation heat transfer member 100 and the absorption heat transfer member 200; A second support for separating the inner space 700 from the low-temperature space 500 and the high-temperature space 600 by coupling the radiating heat transfer member 100 , the absorption heat transfer member 200 , and the first support member 300 . member 400; characterized in that it is configured to include.

The first and second support members 300 and 400 are characterized in that the flexible urethane foam or rigid urethane foam.

The directional heat transfer device is characterized in that the inside is formed in a vacuum.

The directional heat transfer device according to the present invention has the effect of improving the thermal insulation performance by configuring the facing surface of the heat transfer member to have a curved surface of low emissivity and high emissivity so that the heat transfer device has directionality.

1 is a front view of a directional heat transfer device according to an embodiment of the present invention.
FIG. 2 is a partially enlarged view of FIG. 1 .
3 is a side view and a plan view of FIG. 1 ;
4 is an exploded perspective view of FIG. 1 , (a) is an exploded perspective view on the left, and (b) is an exploded perspective view on the right.
FIG. 5 is a view showing radiation and absorption paths of heat in FIG. 1 .
6 is a view showing a simulation result of the thermal insulation performance of the present invention.
7 shows the calculated values of emissivity and absorption, (a) shows the calculated values of emissivity and absorption according to Kirchhoff's law, (b) is the emissivity of the absorption heat transfer member and the absorption heat transfer member according to the present invention It is a diagram showing the calculated value of the absorption rate.
8 shows a comparison of the thermal insulation performance, (a) shows the thermal insulation performance according to the present invention, (b) shows the thermal insulation performance by the conventional vacuum insulator.
9 is a diagram schematically showing the thermal insulation performance of the present invention and the conventional thermal insulation material.

A preferred embodiment of the directional heat transfer device according to the present invention configured as described above will be described in detail based on the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related well-known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. And the terms to be described later are terms defined in consideration of functions in the present invention, which may vary depending on the intention or precedent of the user or operator, and accordingly, the meaning of each term should be interpreted based on the contents throughout this specification. will be.

First, the present invention is to improve the thermal insulation performance by configuring the opposite surface of the heat transfer member to have a curved surface of low emissivity and high emissivity so that the heat transfer device has directionality.

1 is a front view of a directional heat transfer device according to an embodiment of the present invention, FIG. 2 is a partial enlarged view of FIG. 1, FIG. 3 is a side view and a plan view of FIG. 1, and FIG. 4 is an exploded perspective view of FIG.

The radiating heat transfer member 100 has a curved low-emissivity radiating surface 120 and a planar high-emissivity radiating surface 130 to radiate heat from the low-temperature space 500 to the absorption heat transfer member 200 . Here, the curved surface includes a parabolic surface.

To this end, the radiation heat transfer member 100 includes a radiation base material 110 , a low-emissivity radiation surface 120 , and a high-emissivity radiation surface 130 .

The radiation base material 110 uses aluminum with high thermal conductivity to facilitate diffusion after the absorbed infrared rays are converted into thermal energy.

The low emissivity radiation surface 120 is formed in the central portion of the radiation heat transfer member 100 and is made of a parabolic surface. The low-emissivity radiation surface 120 is electrolytically polished of an aluminum sheet, which is the radiation base material 110 , to increase the surface roughness, and then, when high-purity aluminum is deposited, an infrared reflectance of 95% or more can be realized.

The high emissivity radiation surface 130 is formed in a portion other than the center of the radiation heat transfer member 100 and has a flat surface. The high emissivity emitting surface 130 can be implemented with a non-metallic coating. In addition, an emissivity close to 1 can be achieved through the coating of multiwalled carbon nanotube (MWCNT). At this time, the thickness of the non-metallic coating is preferably formed to be 5 μm or more.

In addition, the absorbing heat transfer member 200 has a high emissivity absorbing surface 220 formed as a curved surface to absorb heat radiated from the high emissivity surface 130 and a high emissivity absorbing surface 220 formed as a curved surface to absorb heat radiated from the low emissivity emitting surface 120 . The emissivity absorption surface 230 is provided to absorb heat radiated from the radiation heat transfer member 100 and transfer it to the high temperature space 600 .

The absorption base material 210 uses aluminum having high thermal conductivity to facilitate diffusion after the absorbed infrared rays are converted into thermal energy.

The low emissivity absorbing surface 220 is formed in a portion other than the center of the absorbing heat transfer member 200 and is formed of a parabolic surface. The low-emissivity absorbing surface 220 is electrolytically polished of an aluminum sheet, which is the radiation base material 210 , to increase the surface roughness, and then, by depositing high-purity aluminum, an infrared reflectance of 95% or more can be realized.

The high emissivity radiating surface 230 is formed in the central portion of the radiating heat transfer member 200 and has a flat surface. If the high emissivity absorption surface 230 is coated with a non-metal, it is possible to realize a high emissivity surface. In addition, an emissivity close to 1 can be achieved through the coating of multiwalled carbon nanotube (MWCNT). At this time, the thickness of the non-metallic coating is preferably formed to be 5 μm or more.

The first support member couples the radiation heat transfer member 100 and the absorption heat transfer member.

The second support member 400 combines the radiation heat transfer member 100, the absorption heat transfer member 200, and the first support member 300 to form the inner space 700 into the low temperature space 500 and the high temperature space 600. separate from

The first support member 300 and the second support member 400 may be formed of a flexible urethane foam or a rigid urethane foam that is foamed urethane.

So, the low-emissivity radiating surface 120 of the radiating heat transfer member 100 and the low-emissivity radiating surface 220 and the high-emissivity radiating surface 230 of the absorbing heat transfer member 200 are formed as two parabolic surfaces whose focus coincides with each other. . The radiation heat transfer member 100 forms a parabolic surface in the center and performs a low emissivity surface treatment, and the remaining planar area is subjected to a high emissivity surface treatment. The absorption heat transfer member 200 forms a parabolic surface as a whole, and a high emissivity surface treatment is performed in the center, and a low emissivity surface treatment is performed in the remaining area. The two surfaces of the radiating heat transfer member 100 and the absorption heat transfer member 200 are assembled with each other using the first support member 300 , and the inner space 700 is separated into the low temperature space 500 using the second support member 400 . ) and formed separately from the high-temperature space (600).

The first support member 300 and the second support member 400 may be formed of urethane foam with low thermal conductivity to prevent backflow of thermal energy transferred in one direction by radiation.

Also, in order to minimize conduction and convective heat transfer through the air in the interior space, the pressure of the air is made in a vacuum state lower than the atmospheric pressure.

FIG. 5 is a view showing radiation and absorption paths of heat in FIG. 1 .

Referring to the red solid line (① in FIG. 5) in FIG. 5, the infrared rays emitted from the high-emissivity radiating surface 130, which is the planar area of the radiating heat transfer member 100, are absorbed by the absorption heat transfer member 200 having a large parabolic surface. It is reflected from the surface 120 and transmitted to the low emissivity radiating surface 220 of the radiative heat transfer member 100 . And it is reflected from the low-emissivity emitting surface 220 having a small parabolic surface and absorbed by the high-emissivity absorbing surface 230 of the absorbing heat transfer member 200 .

Referring to the blue solid line (② in FIG. 5 ) in FIG. 5 , infrared rays emitted from the high emissivity absorbing surface 230 of the absorbing heat transfer member 200 having a large parabolic surface have a low emissivity having a small parabolic surface of the radiating heat transfer member 100 . transmitted to the radiating surface 220 . And, except for a certain portion, it is reflected from the low-emissivity emitting surface 220 which is a small parabolic surface and is reabsorbed to the high-emissivity absorbing surface 230 of the absorbing heat transfer member 200 .

In addition, the blue dotted line in FIG. 5 ( 3 in FIG. 5 ) shows that some infrared rays of the absorption heat transfer member 200 are transferred back to the radiation heat transfer member 100 .

Accordingly, the net radiant heat transfer of the inner surfaces facing each other moves from the radiative heat transfer member 100 to the absorption heat transfer member 200, so that directional heat transfer is possible.

6 is a view showing a simulation result of the thermal insulation performance of the present invention.

Therefore, it can be confirmed that the directional heat transfer is made from the radiation heat transfer member 100 to the absorption heat transfer member 200 .

7 shows the calculated values of emissivity and absorption, (a) shows the calculated values of emissivity and absorption according to Kirchhoff's law, (b) is the emissivity of the absorption heat transfer member and the absorption heat transfer member according to the present invention It is a diagram showing the calculated value of the absorption rate.

In Figure 7 (a), Stefan-Boltzmann law (Stefan-Boltzmann law) is composed of the following equation (1).

Here, each item means the following.

E: surface emissive power

ε: emissivity

σ: Stefan-Boltzmann constant, 5.67 x 10 ^-8 Wm ^-2 K ^-4

T _S : Absolute temperature of the surface (K)

Therefore, according to Kirchhoff's law, the surface radiation force in the radiating part becomes as follows.

Emissivity = Absorption = 0.01, T = 273K, Area = 1m ²

E = 0.01 x 5.67 x 10 ^-8 Wm ^-2 K ^-4 273 ⁴ ≒ 3.15 W/m ²

In addition, the surface radiation force at the absorption part becomes as follows.

Emissivity = Absorption = 0.9, T = 273K, Area = 1 m ²

E = 0.9 x 5.67 x 10 ^-8 Wm ^-2 K ^-4 273 ⁴ ≒ 283 W/m ²

Therefore, in realizing thermal insulation performance through low-emissivity surface treatment for multi-layer insulators, the net radiant heat transfer amount becomes "0" between the two surfaces in thermal equilibrium according to Kirchhoff's law.

In Figure 7 (b), the present invention has the following emissivity.

First, the inner surface emissivity of the radiating heat transfer member 100 is equal to the average emissivity of its surface, and the absorption rate is equal to the average emissivity of the inner surface of the absorption heat transfer member 200 . In addition, the inner surface emissivity of the absorption heat transfer member 200 is equal to the surface emissivity, and the absorption rate is equal to the average inner surface emissivity of the radiative heat transfer member 100 .

The radiant heat transfer member 100 has an emissivity of 0.62, an absorption of 0.35, T = 273K, and an area of 1 m ² .

The emissivity of the low emissivity emissivity surface 120 of the radiating heat transfer member 100 becomes 0.01, and the emissivity of the high emissivity emissivity surface 130 becomes 0.9. The average emissivity is 0.62.

In addition, the emissivity of the absorption heat transfer member 200 is 0.35, the absorption is 0.62, T = 273K, the area is 1 m ² .

The low emissivity emitting surface 220 of the absorbing heat transfer member 100 has an emissivity of 0.01, and the high emissivity absorbing surface 230 has an emissivity of 0.9. The average emissivity is 0.35.

Accordingly, the surface radiation of the high emissivity emitting surface 130 is 195 W/m ² , and the high emissivity absorbing surface 230 absorbs 121 W/m ² of the surface.

In addition, the low-emissivity absorbing surface 220 is to emit 110W/m ² surface, and the high-emissivity emitting surface 130 absorbs 38W/m ² to the surface.

Accordingly, about 82W/m ² (= 121W/m ² -39W/m ² ) per square meter can be transferred from the radiant heat transfer member 100 to the absorption heat transfer member 200 .

8 shows a comparison of the thermal insulation performance, (a) shows the thermal insulation performance according to the present invention, (b) shows the thermal insulation performance by the conventional vacuum insulator.

The case of FIG. 7 is a result of calculating the net radiant heat transfer amount on a surface having the same temperature. However, the absorption heat transfer member 200 is continuously heated, and the radiation heat transfer member 100 is continuously cooled, so that the thermal equilibrium state is changed to a transient state. At this time, if a temperature difference between the two surfaces or more occurs, heat is transferred from the absorption heat transfer member 200 to the radiant heat transfer member 100 through the conduction of the internal air and the convection of the internal air with the support members 300 and 400, and all components When the temperature of the elements is saturated, the heat transfer diagram becomes as in FIG. 8 . (b) of FIG. 8 is a heat transfer diagram of a general vacuum insulator, in which the net radiant heat transfer amount of the conventional vacuum insulator approaches "0". Therefore, in the conventional vacuum insulation material, the thermal insulation performance is realized by suppressing convection and lowering the thermal conductivity of the components. However, if the present invention is applied, it is possible to improve the thermal insulation performance without suppressing convection or lowering the thermal conductivity of the component.

9 is a diagram schematically showing the thermal insulation performance of the present invention and the conventional thermal insulation material.

Therefore, the present invention shows better thermal insulation performance than the conventional general thermal insulation material or vacuum insulation material.

On the other hand, the radiation heat transfer member 100 is completed by forming a parabolic surface with a focal length of 0.2 mm on a high-gloss aluminum sheet with a thickness of 0.1 mm, and coating the paint on all areas other than the parabolic surface. The absorption heat transfer member 200 is completed by forming a parabolic surface with a focal length of 1.8 mm on a 0.1 mm thick high-gloss aluminum sheet, and coating a paint in the center of the parabolic surface. The two members are arranged so that their focal points coincide, and the support member is applied to the planar area of the absorbing heat transfer member 200 and bonded to the radiating heat transfer member 100 .

In the 5mm x 5mm unit module, when the low-temperature space is sealed and vacuum is set, and the support member is set with foamed Teflon (thermal conductivity 0.07W/mK) with a length of 1.32mm and a cross-sectional area of 0.3mm x 0.3mm (thermal conductivity 0.07W/mK), radiant heat transfer member (100) Heat transfer of about 5% of the temperature difference between the heat transfer member 200 and the absorption heat transfer member 200 (0.05 W when the temperature difference is 1° C.) is performed.

On the other hand, the energy radiated from the surface is q = εσT ⁴ = 0.95 x 5.67 x 10 ^-8 x (25 + 273) ⁴ = 424W/m ² 200), energy of 1.06W/25mm ² is transferred by radiation, and about 1W of heat pumping is possible per unit module.

Energy efficiency can be improved by using the device according to the present invention in a building/transportation water system and cold/hot storage system requiring heating and cooling. For example, the size of the 830L electric refrigerator is about 0.9mx 0.9mx 1.8m, and if this insulation is applied to the left and right sides of the refrigerator, it can be applied to an area of 2.7 x 1.8 = 4.86m ² . In addition, it is possible to pump 4.86m ² x 424W/m ² = 2kW of energy, making it possible to use the refrigerator without electricity.

For reference, the annual power consumption of the 380L class 1 electric refrigerator is 370 kWh, so the average energy consumption is 370/(365 days/year x 24 hours) = 0.04kW.

As such, in the present invention, the heat transfer device has a directionality by configuring the opposite surface of the heat transfer member with curved surfaces of low emissivity and high emissivity, thereby improving thermal insulation performance.

Although the present invention has been described in more detail with reference to examples above, the present invention is not necessarily limited to these examples, and various modifications may be made within the scope without departing from the technical spirit of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: radiant heat shear member
110: spinning base material
120: low emissivity emitting surface
130: high emissivity emitting surface
200: absorption heat transfer member
210: absorbent base material
220: low emissivity absorption surface
230: high emissivity absorption surface
300: first support member
400: second support member
500: low temperature space
600: high temperature space
700: internal space

Claims (7)

a radiation heat transfer member having a curved low-emissivity radiation surface and a planar high-emissivity radiation surface to radiate heat in a low-temperature space to the absorption heat transfer member;
A low emissivity absorbing surface formed as a curved surface to absorb heat radiated from the high emissivity surface and a high emissivity absorbing surface formed as a curved surface to absorb heat radiated from the low emissivity surface to absorb heat radiated from the radiating heat transfer member an absorption heat transfer member that absorbs and transfers it to a high-temperature space;
Directional heat transfer device comprising a.
The method according to claim 1,
A directional heat transfer device, characterized in that each of the radiation base material of the radiation heat transfer member and the absorption base material of the absorption heat transfer member is made of aluminum.
The method according to claim 1,
The directional heat transfer device, characterized in that the low emissivity radiating surface of the radiating heat transfer member and the low emissivity absorbing surface of the absorbing heat transfer member are formed by electrolytic polishing of an aluminum sheet and deposition of high-purity aluminum, respectively.
The method according to claim 1,
The directional heat transfer device, characterized in that the high emissivity radiating surface of the radiating heat transfer member and the high emissivity absorbing surface of the absorbing heat transfer member are formed through a non-metallic coating or MWCNT coating, respectively.
The method according to claim 1,
The directional heat transfer device may include: a first support member coupling the radiation heat transfer member and the absorption heat transfer member; A second support for separating the inner space 700 from the low-temperature space 500 and the high-temperature space 600 by coupling the radiating heat transfer member 100 , the absorption heat transfer member 200 , and the first support member 300 . A directional heat transfer device comprising a; member (400).
The method according to claim 1,
The first and second support members are directional heat transfer device, characterized in that the flexible urethane foam or rigid urethane foam.
The method according to claim 1,
The directional heat transfer device is a directional heat transfer device, characterized in that the inside is formed in a vacuum.

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