KR20220062809A - Retainer ring and substrate polishing appratus comprising the same - Google Patents

Abstract

A retainer ring according to one embodiment comprises: an upper part including an inner body formed in a ring shape and an outer body that surrounds an outer surface of the inner body and has an accommodation groove on an upper surface; and a lower part coupled to the accommodation groove. The outer body and the lower body can contain a same material. The lower part of the retainer ring can be easily replaced from the upper part.

Description

Retaining ring and substrate polishing apparatus including the same

The following embodiment relates to a retaining ring and a substrate polishing apparatus including the same.

BACKGROUND ART In manufacturing a semiconductor device, a CMP (chemical mechanical polishing) operation including polishing, buffing, and cleaning is required. A semiconductor device has a multilayer structure, and a transistor device having a diffusion region is formed on a substrate layer. In the substrate layer, connecting metal lines are patterned and electrically connected to the transistor elements forming the functional elements. As is known, the patterned conductive layer is insulated from the other conductive layers with an insulating material such as silicon dioxide. As more metal layers and associated insulating layers are formed, the need to flatten the insulating material increases. Without flattening, the production of additional metal layers becomes substantially more difficult because of the many variations in surface morphology. In addition, the metal line pattern is formed of an insulating material, so that the metal CMP operation removes the excess metal.

The CMP process includes a process of physically abrading the surface of a substrate through a polishing pad. This process is performed by pressing the substrate against the polishing head while holding the substrate through the substrate carrier. In general, since the polishing pad has elasticity, a pressing force applied to the substrate during the polishing process is non-uniform, so that the substrate is separated from the carrier head. Accordingly, the substrate carrier has a retaining ring that supports the edge region of the substrate.

On the other hand, since the retaining ring is worn while in contact with the polishing pad during the polishing process of the substrate, the flatness of the surface becomes non-uniform as the polishing process progresses. Accordingly, a method has been introduced in which the retaining ring is composed of an upper part and a lower part and used while replacing the worn lower parts. However, in the case of such a structure, there is a problem that the lower part is separated from the upper part due to friction with the polishing pad. Accordingly, there is a need for a retaining ring that has a structure in which the lower part can be stably fastened to the upper part to prevent the lower part from being detached and the lower part can be easily replaced.

The above-mentioned background art is possessed or acquired by the inventor in the process of deriving the disclosure of the present application, and cannot necessarily be said to be a known technology disclosed to the general public prior to the present application.

SUMMARY An object of an embodiment is to provide a retaining ring capable of easily replacing a lower part from an upper part, and a substrate polishing apparatus including the same.

SUMMARY An object of an embodiment is to provide a retaining ring capable of preventing a lower part from being separated from an upper part, and a substrate polishing apparatus including the same.

An object of the embodiment is to provide a retaining ring including an upper part and a lower part made of the same material, and a substrate polishing apparatus including the same.

The retaining ring according to an embodiment includes an inner body formed in a ring shape, an upper part including an outer body surrounding the outer surface of the inner body and having a receiving groove formed on the upper surface, and a lower part coupled to the receiving groove, The outer body and the lower part may include the same material.

The outer body and the inner body may include different materials.

The outer body and the lower part may include a resin material.

The inner body may include a metal material.

The outer body may include a first outer circumferential surface positioned at the lowermost side and a second outer circumferential surface connected to an upper side of the first outer circumferential surface to have a step difference from the first outer circumferential surface.

A diameter of the first outer circumferential surface may be smaller than a diameter of the second outer circumferential surface.

After the outer body and the lower part are coupled, the first outer circumferential surface of the outer body and the outer circumferential surface of the lower part may be machined to be positioned on the same plane.

The outer body may further include a third outer circumferential surface connected to an upper side of the second outer circumferential surface so as to have a step difference from the second outer circumferential surface.

A diameter of the third outer circumferential surface may be greater than a diameter of the first outer circumferential surface and smaller than a diameter of the second outer circumferential surface.

The outer body and the lower part may be joined through compression.

The lower part may include a plate part and an insertion part protruding from an upper surface of the plate part and inserted into the receiving groove.

A plurality of the receiving grooves may be formed to be spaced apart from each other at predetermined intervals along a circumferential direction of the upper part.

The lower part may be provided in a number corresponding to the receiving groove.

In a state in which the lower part is inserted into the receiving groove, a flow path may be formed between adjacent lower parts.

The flow path may be inclined with respect to a radial direction of the retaining ring.

The lower part may include a shape inclined along a circumferential direction of the upper part.

A substrate polishing apparatus according to one embodiment, the retaining ring according to claim 1; and a carrier head connected to an upper side of the retaining ring.

The retainer ring and the substrate polishing apparatus including the same according to an embodiment may prevent the lower part from being separated from the upper part through the fastening of the fastening protrusion and the fastening groove.

A retainer ring and a substrate polishing apparatus including the same according to an embodiment may have a structure in which an outer body of an upper part and a lower part are made of the same material to facilitate replacement of the lower part.

Effects of the retaining ring and the substrate polishing apparatus including the retaining ring according to an embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a schematic diagram of a substrate polishing apparatus according to an embodiment.
2 is a cross-sectional view of a substrate carrier according to an embodiment.
3 is a lower perspective view of a retaining ring according to an embodiment;
4 is a cross-sectional perspective view of a retainer ring according to an embodiment.
5 is an exploded perspective view of a retainer ring according to an embodiment;
6 is a cross-sectional view of a retaining ring according to an embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various changes may be made to the embodiments, the scope of the patent application is not limited or limited by these embodiments. It should be understood that all modifications, equivalents and substitutes for the embodiments are included in the scope of the rights.

The terms used in the examples are used for the purpose of description only, and should not be construed as limiting. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as "comprise" or "have" are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that this does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiment belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

In addition, in the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and the overlapping description thereof will be omitted. In describing the embodiment, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but another component is between each component. It will be understood that may also be "connected", "coupled" or "connected".

Components included in one embodiment and components having a common function will be described using the same names in other embodiments. Unless otherwise stated, descriptions described in one embodiment may be applied to other embodiments as well, and detailed descriptions within the overlapping range will be omitted.

1 is a schematic diagram of a substrate polishing apparatus according to an embodiment. 2 is a cross-sectional view of a substrate carrier according to an embodiment.

1 and 2 , a substrate polishing apparatus 1 according to an exemplary embodiment may be used for a CMP process of a substrate W. Referring to FIG.

The substrate W may be a silicon wafer for manufacturing a semiconductor device. However, the type of the substrate W is not limited thereto. For example, the substrate W may include glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) or a plasma display panel (PDP).

The substrate polishing apparatus 1 can polish the substrate W. The substrate polishing apparatus 1 may include a substrate carrier 10 and a polishing unit U.

The polishing unit U may polish the to-be-polished surface of the substrate W. The polishing unit U may include a polishing platen T and a polishing pad P.

A polishing pad P may be connected to the polishing plate T. For example, the polishing pad P may be attached to the upper portion of the polishing platen T. The polishing platen T may orbitally polish the polished surface of the substrate W in contact with the polishing pad P while rotating about the axis. The polishing platen T can adjust the position of the polishing pad P with respect to the ground while moving in the vertical direction. The polishing pad P may be in contact with the surface to be polished of the substrate W to physically abrade the surface to be polished of the substrate W. The polishing pad P may include a polyurethane (polyurethane) material.

Referring to FIG. 2 , the substrate carrier 10 may hold the substrate W . The substrate carrier 10 may chuck and hold the substrate W to be polished, and move the gripped substrate W to the upper portion of the polishing pad P. The substrate carrier 10 may perform polishing of the substrate W by bringing the substrate W transferred to the upper portion of the polishing pad into contact with the polishing pad P. The substrate carrier 10 presses the substrate W in contact with the polishing pad P, thereby controlling the friction force between the substrate W and the polishing pad P to determine the degree of polishing of the substrate W. The substrate carrier 10 may include a carrier head 11 , a membrane 12 and a retaining ring 13 .

The carrier head 11 may adjust the position of the substrate W. The carrier head 11 may receive power from the outside and may rotate about an axis perpendicular to the surface of the polishing pad P. The substrate W gripped by the rotation of the carrier head 11 may be polished while rotating while in contact with the polishing pad P.

The carrier head 11 may move the substrate W horizontally. For example, the carrier head 11 may translate in a first direction parallel to the surface of the polishing pad P and a second direction perpendicular to the first direction. Through the combined movement in the first direction and the second direction, the carrier head 11 may move the substrate W on a plane parallel to the surface of the polishing pad P. As a result, according to the horizontal movement of the carrier head 11 , the substrate W may be transferred to or removed from the polishing position.

The carrier head 11 may move the substrate W in the vertical direction with respect to the ground. The carrier head 11 may move up and down with respect to the substrate W support for chucking/dechucking the substrate W, or move up and down with respect to the polishing pad P for polishing the substrate W. there is.

The membrane 12 is connected to the carrier head 11 and may form a pressure chamber C for applying pressure to the substrate W. According to the pressure fluctuation of the pressure chamber C formed by the membrane 12 , the pressure acting on the substrate W may be adjusted. For example, the degree to which the substrate W is pressed against the polishing pad P may be increased by increasing the pressure of the pressure chamber C while the substrate W is in contact with the polishing pad P. The membrane 12 may include a bottom plate that forms a bottom surface of the pressure chamber C, and a flap that forms a sidewall of the pressure chamber C. A plurality of flaps may be formed to have different radii based on the center of the bottom plate, and respective pressure chambers C may be formed for each space between adjacent flaps. Different pressures may be applied to the pressure chambers C, and a portion of the substrate W corresponding to each pressure chamber C may be locally pressurized according to the pressure applied to each pressure chamber C.

3 is a lower perspective view of a retaining ring according to an embodiment, FIG. 4 is a cross-sectional perspective view of the retaining ring according to an embodiment, FIG. 5 is an exploded perspective view of the retaining ring according to an embodiment, and FIG. 6 is an embodiment It is a cross-sectional view of a retaining ring according to an example.

3 to 6 , the retaining ring 13 may be connected to the carrier head 11 so as to surround the periphery of the gripped substrate W . The retaining ring 13 may prevent the substrate W from being separated from the gripped position. For example, the retaining ring 13 may support the side surface of the substrate W so that the substrate W does not separate from the substrate carrier 10 due to vibration generated during the polishing process of the substrate W .

The retaining ring 13 may be directly connected to the carrier head 11 or indirectly connected through a separate connecting member. The retaining ring 13 may be connected to the carrier head 11 to move up and down relative to the substrate carrier 10 via a separate actuator, for example.

The retaining ring 13 may include an upper part 131 and a lower part 132 .

The upper part 131 may have an upper side connected to the carrier head 11 . A lower part 132 may be connected to a lower side of the upper part 131 . The upper part 131 may include an inner body 1310 and an outer body 1311 .

The inner body 1311 may be formed in a ring shape.

The outer body 1312 may surround the outer surface of the inner body 1311 and a receiving groove 1312a may be formed on the upper surface. A carrier head may be connected to an upper side of the outer body 1312 . In addition, the lower part 132 may be connected to the lower side of the outer body 1312 . The outer body 1312 may be formed in a ring shape. The inner side of the annular shape of the outer body 1312 may correspond to the circumferential shape of the substrate (W). Accordingly, the substrate W may be fixed in a state positioned inside the annular shape.

The receiving groove 1312a may be recessed in the lower surface of the outer body 1312 . Specifically, the receiving groove 1312a may be formed to be depressed upwardly from the lower surface of the outer body 1312 . A plurality of receiving grooves 1312a may be formed to be spaced apart from each other at predetermined intervals along the circumferential direction of the upper part 131 . In addition, the receiving groove 1312a may include various shapes. For example, the receiving groove 1312a may be formed in any one of a circle, a square, and a triangle.

The outer body 1312 may include a first outer circumferential surface 1312b, a second outer circumferential surface 1312c, and a third outer circumferential surface 1312d.

The first outer circumferential surface 1312b may be located at the lowermost side of the outer body 1312 . The second outer circumferential surface 1312c may be connected to the upper side of the first outer circumferential surface 1312b so as to have a step difference from the first outer circumferential surface 1312b. A diameter of the first outer circumferential surface 1312b may be smaller than a diameter of the second outer circumferential surface 1312c. After the outer body 1312 and the lower part 132 are coupled, the first outer circumferential surface 1312b of the outer body 1312 and the outer circumferential surface 1321a of the lower part may be machined to be positioned on the same plane. The effect of such a structure will be described as an effect due to the structural relationship of the upper part 131 and the inner circumferential surface 1321b of the lower part to be described later.

The third outer circumferential surface 1312d may be connected to the upper side of the second outer circumferential surface 1312c so as to be stepped with the second outer circumferential surface 1312c. A diameter of the third outer circumferential surface 1312d may be greater than a diameter of the first outer circumferential surface 1312b and smaller than a diameter of the second outer circumferential surface 1312c.

The outer body 1312 and the inner body 1311 may include different materials. The outer body 1312 may include an elastically deformable material. For example, the outer body 1312 may include an engineering plastic material. Specifically, the outer body 1312 may include a resin material. Also, the inner body 1311 may include a metal material. According to such a configuration, the retaining ring 13 can prevent shaking due to chucking and polishing of the substrate W, and can be replaced and repaired more easily with respect to abrasion that occurs on the outer surface during the polishing process.

The lower part 132 may be connected to a lower side of the upper part 131 . For example, the lower part 132 and the outer body 1312 may be joined through compression. Specifically, the lower part 132 and the outer body 1312 may be bonded by applying an adhesive to the contact surface and pressing.

The material of the lower part 132 and the material of the outer body 1312 may be the same. In other words, the lower part 132 may include an elastically deformable material. For example, the lower part 132 may include an engineering plastic material. Specifically, the lower part 132 may include a resin material. According to this material configuration, even if the lower part 132 is replaced, it is easy to process the lower part 132 like the upper part 131 , so that the replacement operation can be simplified.

The lower part 132 is provided in a number corresponding to the receiving groove 1312a, and each of the lower parts 132 may be inserted into each receiving groove 1312a. Specifically, the plurality of lower parts 132 may be disposed to be spaced apart from each other along the circumferential direction of the upper part 131 while being inserted into the receiving groove 1312a. According to such a structure, the flow path F may be formed between the adjacent lower parts 132 . The flow path F may be formed to be inclined with respect to the radial direction of the retaining ring 13 . Through the flow path F, the inner and outer spaces of the retaining ring 13 may communicate with each other. Accordingly, through the flow path F, the slurry or chemical used in the polishing process may be discharged from the inside of the retaining ring 13 to the outside.

The inner circumferential surface 1312e of the upper part and the inner circumferential surface 1321b of the lower part may be machined to be positioned on the same plane. In other words, the inner circumferential surface 1312e of the outer body and the inner circumferential surface 1321b of the lower part may constitute the same surface. For example, the inner circumferential surface 1321b of the lower part may be a surface extending from the inner circumferential surface 1312e of the upper part. That is, in a state in which the upper part 131 and the lower part 132 are coupled, the inner peripheral surfaces of the upper part and the lower part may be integrally formed.

By processing the inner circumferential surface 1312e of the outer body and the inner circumferential surface 1321b of the lower part and the first outer circumferential surface 1312b and the outer circumferential surface 1321a of the lower part to be located on the same plane, the replacement operation of the lower part 132 is easy And the retainer ring 13 can more stably fix and hold the substrate W.

The lower part 132 may have a shape inclined along the circumferential direction of the upper part 131 . for example. The lower part 132 may include an inclined parallelogram shape.

Lower portions of the lower parts 132 and 132 may be in contact with the polishing pad P. When the lower side of the lower part 132 is worn by the contact with the polishing pad P, the lower part 132 may be replaced.

The lower part 132 may include a plate portion 1321 and an insertion portion 1322 .

One surface of the plate part 1321 may be connected to the upper part 131 , and the other surface may be worn by contacting the polishing pad P. For example, the plate part 1321 and the upper part 131 may be attached to each other in a state in which an adhesive is applied to the upper surface of the plate part 1321 and the lower surface of the upper part 131 .

The insertion part 1322 may be formed to protrude from the upper surface of the plate part 1321 and be inserted into the receiving groove 1312a. For example, the insertion part 1322 may include a shape corresponding to the receiving groove 1312a and be inserted and fixed in the receiving groove 1312a. Specifically, in a state in which the adhesive is applied to the insertion part 1322 and the receiving groove 1312a, the insertion part 1322 and the receiving groove 1312a may be inserted and fixed.

As described above, although the embodiments have been described with reference to the limited drawings, those skilled in the art may apply various technical modifications and variations based on the above. For example, the described techniques are performed in an order different from the described method, and/or the described components of the system, structure, apparatus, circuit, etc. are combined or combined in a different form than the described method, or other components Or substituted or substituted by equivalents may achieve an appropriate result.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

1: substrate polishing device
13: Retaining
131: upper part
132: lower part

Claims (17)

an upper part including an inner body formed in a ring shape, an outer body surrounding an outer surface of the inner body and an outer body having a receiving groove formed on the upper surface; and
It includes a lower part coupled to the receiving groove,
wherein the outer body and the lower part comprise the same material.
2. The method of claim 1
wherein the outer body and the inner body comprise different materials.
3. The method of claim 2
The retaining ring, wherein the outer body and the lower part include a resin material.
4. The method of claim 3
wherein the inner body comprises a metallic material.
2. The method of claim 1
the outer body
A first outer peripheral surface located on the lowermost side; and
and a second outer circumferential surface connected to an upper side of the first outer circumferential surface so as to be stepped with the first outer circumferential surface.
6. The method of claim 5
and a diameter of the first outer circumferential surface is smaller than a diameter of the second outer circumferential surface.
7. The method of claim 6
After the outer body and the lower part are joined, the retaining ring is machined such that the first outer circumferential surface of the outer body and the outer circumferential surface of the lower part are positioned on the same plane.
6. The method of claim 5
The outer body,
The retaining ring further comprising a third outer circumferential surface connected to an upper side of the second outer circumferential surface so as to be stepped with the second outer circumferential surface.
9. The method of claim 8
and a diameter of the third outer circumferential surface is greater than a diameter of the first outer circumferential surface and smaller than a diameter of the second outer circumferential surface.
The method of claim 1
and the outer body and the lower part are joined by pressing.
2. The method of claim 1
The lower part is
A retaining ring comprising: a plate part; and an insertion part protruding from an upper surface of the plate part and inserted into the receiving groove.
12. The method of claim 11
A retaining ring, wherein a plurality of the receiving grooves are spaced apart from each other at predetermined intervals along a circumferential direction of the upper part.
13. The method of claim 12
The lower part is provided in a number corresponding to the receiving groove, a retaining ring.
14. The method of claim 13
In a state in which the lower part is inserted into the receiving groove, a flow path is formed between adjacent lower parts.
15. The method of claim 14
and the flow path is formed to be inclined with respect to a radial direction of the retaining ring.
16. The method of claim 15
The retaining ring, wherein the lower part includes a shape inclined along a circumferential direction of the upper part.
retaining according to claim 1; and
and a carrier head coupled to an upper side of the retaining ring.

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