KR20200030192A - Cooling device - Google Patents

Abstract

According to an embodiment of the present invention, a cooling apparatus comprises: a working fluid storage chamber storing two-phase working fluid in liquid and gas phases; a heat absorption chamber receiving the gas-phase working fluid formed by evaporating the liquid-phase working fluid absorbing heat of a heating element; a separation plate including a channel in which the liquid-phase working fluid stored in the working fluid storage chamber is moved toward the heat absorption chamber, and disposed between the working fluid storage chamber and the heat absorption chamber; and a heat dissipation part releasing heat while the gas-phase working fluid supplied from the heat absorption chamber changes into liquid, wherein an inner bottom surface of the heat absorption chamber facing a bottom surface of the separation plate is formed in parallel with each other, and an outlet through which the gas-phase working fluid is discharged to be supplied to the heat dissipation part is formed on the inner bottom surface of the heat absorption chamber.

Description

Cooling system {COOLING DEVICE}

The cooling device according to the present invention relates to a device that is disposed adjacent to the heating element to cool the heating element.

In general, electronic devices such as integrated circuits (ICs) generate a lot of heat while operating. If heat generated at this time is not effectively dissipated, the integrated circuit malfunctions due to heat, causing malfunction of the electronic device including the integrated circuit.

In particular, as electronic devices equipped with CPUs, GPUs, APs, LEDs, etc., the heat generated relative to the area continuously increases with the advancement and high integration, the importance of cooling is increasingly emphasized.

Accordingly, development of a cooling device for rapidly diffusing heat generated from a major element in an electronic device to a wide area has been continuously conducted.

Republic of Korea Patent Publication No. 10-2008-0102297 (published on November 24, 2008)

The cooling device according to the present invention is disposed adjacent to the heating element, and attempts to cool the heating element by absorbing heat of the heating element while performing heat dissipation while the working fluid is vaporized from the liquid phase to the gas phase.

A cooling apparatus according to an embodiment of the present invention includes a working fluid storage chamber for storing two-phase working fluids in liquid phase and gas phase; A heat absorption chamber receiving a working fluid of a gas phase formed by evaporation of a liquid working fluid absorbing heat of the heating element; A porous separation plate including a channel in which the liquid working fluid stored in the working fluid storage chamber is moved toward the heat absorption chamber, and disposed between the working fluid storage chamber and the heat absorption chamber; And a heat dissipation unit in which heat is released while the working fluid of the gas phase supplied from the heat absorption chamber changes to a liquid phase, and the inner bottom of the heat absorbing chamber facing the bottom of the porous separator is formed parallel to the inner bottom facing each other. It provides a cooling device is formed on the inner bottom surface of the heat absorption chamber, the outlet to be discharged in order to supply the working fluid of the gas phase to the heat dissipation unit.

The cooling apparatus according to the present embodiment includes a first transfer pipe connected to the outlet, and communicating the heat absorption chamber and the heat dissipation portion to supply the working fluid of the gas phase in the heat absorption chamber to the heat dissipation portion, and the diameter of the first transfer pipe is porous It may be greater than or equal to the height of the bottom of the porous separator, which is measured based on the inner bottom of the heat absorbing chamber facing the separator.

In this embodiment, the outlet may be formed on the outer portion of the inner bottom surface of the heat absorbing chamber facing the porous separator.

The cooling apparatus according to the present embodiment includes a plurality of guides protruding on the inner bottom surface of the heat absorbing chamber facing the porous separator, and the plurality of guides are disposed in a gas phase in each of the plurality of guides. It is possible to form a flow path through which the working fluid flows to the outlet.

In this embodiment, at least one of the plurality of guides may be bent to extend toward the outlet.

In the present embodiment, at least one of the plurality of guides may include a communication port communicating the flow path so that the working fluid of the gas phase flows between each flow path.

The cooling device according to the present invention is disposed adjacent to the heating element, absorbs heat of the heating element while changing the working fluid from liquid phase to gas phase, and transfers heat to cool the heating element by performing heat dissipation in the spaced apart heat dissipation unit. You can.

1 is a perspective view showing a cooling device according to an embodiment of the present invention.
Figure 2 is a perspective view showing a side section of the arrangement structure of the main body portion, the first transfer pipe, the second transfer pipe and the heating element according to an embodiment of the present invention.
Figure 3 is an exploded perspective view showing the configuration of the main body according to an embodiment of the present invention.
4 is a side cross-sectional view schematically showing a cooling device according to an embodiment of the present invention.
5 is a front view schematically showing a body part according to an embodiment of the present invention.
6 is a plan view showing a guide according to a modified embodiment of the present invention.

The present invention will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only the present embodiments allow the disclosure of the present invention to be complete, and the ordinary knowledge in the technical field to which the present invention pertains. It is provided to fully inform the holder of the scope of the invention, and the invention is only defined by the scope of the claims. Meanwhile, the terms used in the present specification are for explaining the embodiments and are not intended to limit the present invention. In this specification, the singular form also includes the plural form unless otherwise specified in the phrase. As used herein, "comprises" and / or "comprising" refers to the components, steps, operations and / or elements mentioned above, the presence of one or more other components, steps, operations and / or elements. Or do not exclude additions. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only to distinguish one component from other components.

The present invention relates to a cooling device (1) for cooling a heating element (H), such as an electronic device. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a cooling device 1 according to an embodiment of the present invention. Figure 2 is a perspective view showing a side cross-section of the arrangement structure of the main body portion 10, the first transfer tube 12, the second transfer tube 13 and the heating element (H) according to an embodiment of the present invention. 3 is an exploded perspective view showing the configuration of the main body 10 according to an embodiment of the present invention. 4 is a side cross-sectional view schematically showing a cooling device 1 in an embodiment of the present invention.

1 to 4, the cooling device 1 according to an embodiment of the present invention includes a main body portion 10, a heat dissipation portion 11, a first transfer pipe 12 and a second transfer pipe 13 It may include.

The body portion 10 may be a portion for absorbing heat of the heating element (H). The body portion 10 may be a case member having an internal space of a predetermined size. The body portion 10 may be formed of a material having low thermal conductivity, such as stainless steel. The body portion 10 may have a hexahedral shape, but is not limited thereto. The heating element H may be disposed below the main body 10. It is preferable that the upper surface of the heating element H and the outer bottom surface of the main body part 10 are disposed in contact with each other because the thermal resistance can be reduced. However, the present invention is not limited thereto, and the upper surface of the heating element H and the outer bottom surface of the main body 10 may be arranged at a predetermined distance. The main body 10 may include a working fluid storage chamber 101, a heat absorption chamber 102, a porous separator plate 103, an outlet 104, and a guide 105.

The working fluid storage chamber 101 is provided on the upper layer in the main body 10, and may be a part for storing the two-phase working fluid of the liquid phase (L) and the gas phase (G). Here, the working fluid is determined according to the temperature of the heating element (H), and may include methanol, ethanol, acetone, distilled water, etc., which are mainly room temperature working fluids.

The interior of the working fluid storage chamber 101 can maintain a thermodynamically saturated state. Therefore, the working fluid of the gas phase (G) and the working fluid of the liquid (L) coexist and are filled therein. Specifically, the injection amount of the working fluid is the working fluid storage chamber 101 in the operating environment of the general cooling device 1 50% of the volume can be filled with the working fluid of the liquid (L). In the working fluid storage chamber 101, the working fluid of the liquid phase L may be phase-separated and disposed below the working fluid of the gas phase G due to a density difference.

As will be described later, the working fluid storage chamber 101 is the working fluid of the liquid (L) transferred from the heat dissipation unit 11 through the heat dissipation unit 11 and the second transfer pipe 13 connecting the working fluid storage chamber 101. To accommodate, it is possible to ensure that the working fluid of the liquid (L) is supplied to the heat absorption chamber 102 through the porous separator (103).

The heat absorption chamber 102 is provided on the lower layer in the main body 10, and the gas phase formed by evaporating the working fluid of the liquid L absorbing the heat of the heating element H disposed under the main body 10 is evaporated ( It may be a part receiving the working fluid of G). The working fluid of the gas phase G may flow in the heat absorption chamber 102. The heat absorption chamber 102 may be a space formed between the lower upper surface of the flat body portion 10 and the plate-shaped porous separator 103. Therefore, the inner upper surface of the heat absorption chamber becomes the bottom surface of the porous separator 103, and the inner bottom surface of the heat absorption chamber 102 becomes the lower top surface of the body portion 10, and the upper surface of the heat absorption chamber 102. The undersides may be formed parallel to each other. As a result, the contact area between the flat-type heating element H and the bottom of the main body portion 10 is widened, and heat transfer to the heat absorption chamber 102 and the porous separator 103 can be efficiently performed.

The porous separation plate 103 may be disposed between the working fluid storage chamber 101 and the heat absorption chamber 102 to separate the working fluid storage chamber 101 and the heat absorption chamber 102. The porous separation plate 103 may include a channel 103a in which the working fluid of the liquid L stored in the working fluid storage chamber 101 is moved toward the heat absorption chamber 102. The channel 103a may be formed in the form of a plurality of pores on the porous separator 103. Therefore, the porous separation plate 103 may be made of a porous metal plate, ceramic plate, or polymer plate.

The porous separator 103 is preferably made of a material having a flexible thickness and a low thermal conductivity so that an appropriate saturation temperature difference is generated on both sides exposed to the working fluid storage chamber 101 and the heat absorption chamber 102, respectively. And, the channel 103a is preferably formed to have a size of 10 µm or less in order to generate an appropriate capillary pressure difference. Therefore, a large amount of liquid (L) working fluid in the working fluid storage chamber 101 is rapidly heated by capillary pressure in the state of being adsorbed by the adsorption force of the channel 103a and / or the porous separator plate 103 by gravity. It can be moved to the absorption chamber (102). In addition, while the liquid (L) working fluid is transferred to the heat absorbing chamber 102, heat may be transferred from the heating element (H) to become a phase change to the gas phase (G).

As described above, the porous separation plate 103 that spatially separates the working fluid storage chamber 101 and the heat absorption chamber 102 heats the working fluid of the liquid (L) in the working fluid storage chamber 101. On the other hand, the working fluid of the gas phase (G) in the heat absorption chamber 102 is blocked from moving to the working fluid storage chamber 101. That is, the porous separation plate 103 selectively moves only the working fluid of the liquid L from the working fluid storage chamber 101 to the heat absorbing chamber 102 between the working fluid storage chamber 101 and the heat absorption chamber 102. To do. Therefore, the working fluid of the vaporized gas phase G is discharged through the outlet 104 of the heat absorption chamber 102, and the working fluid of the liquid phase L is a heat absorption chamber 102 through the porous separation plate 103. ) To enable continuous circulation of working fluid.

The outlet 104 may be formed on the inner bottom surface of the heat absorbing chamber 102 facing the porous separator 103. The working fluid of the gas phase G may be a portion that flows out from the heat absorption chamber 102 to be supplied to the heat dissipation unit 11. Outlet 104 is formed in a circular shape, the flow of the working fluid of the gas phase (G) can be made smoothly.

The outlet 104 may be formed on the outer portion of the inner bottom surface of the heat absorption chamber 102. Since the heating element (H) is disposed in the central portion of the bottom of the body portion (10), the outlet (104) has a first transfer pipe (12) connected to it and the heating element (H) on the bottom of the body portion (10) In order to be disposed in a portion that is not disposed, it is preferably formed on the outer portion of the inner bottom surface of the heat absorption chamber (102).

5 is a front view schematically showing a body part 10 according to an embodiment of the present invention.

Referring to FIG. 5, the guide 105 may be a portion that guides 105 such that the working fluid of the gas phase G inside the heat absorption chamber 102 flows toward the outlet 104. A plurality of guides 105 may be provided. The plurality of guides 105 may protrude on the inner bottom surface of the heat absorption chamber 102. Since the plurality of guides 105 are spaced apart from each other at predetermined intervals, a flow path through which the working fluid of the gas phase G flows to the outlet 104 may be formed between each of the guides 105. The guide 105 may be disposed in contact with the bottom surface of the porous separator 103, but is not limited thereto.

6 is a plan view showing a guide 105 'according to a modified embodiment of the present invention.

Referring to FIG. 6, at least one of the plurality of guides 105 ′ may be bent to extend toward the outlet 104.

For example, if the outlet 104 is formed in the right central portion of the inner bottom of the heat absorbing chamber 102, the guide 105 'disposed far from the central portion toward the outlet 104, the inner bottom of the heat absorbing chamber 102 It can be bent toward the right middle portion of the. As a result, the working fluid of the gas phase G can flow out smoothly along the guide 105 'from the heat absorption chamber 102 to the outlet 104. The degree of bending of the guide 105 ′ disposed outside may be greater than the guide 105 ′ disposed in the central portion.

At least one of the plurality of guides 105 ′ may include a communication port 105a communicating with each flow path so that the working fluid of the gas phase G flows between each flow path. The communication ports 105a formed in each guide 105 'may be arranged in a zigzag manner with each other. As a result, turbulence may be formed while working fluids of the gas phase G in the flow passages flow to each other. By forming turbulence, heat transfer becomes active to promote vaporization of the working fluid of the liquid phase (L) into the working fluid of the gas phase (G), and consequently, the cooling device 1 can increase the efficiency of cooling the heating element (H). have.

The heat dissipation unit 11 may be a portion in which heat is released while the working fluid of the gas phase G supplied from the heat absorption chamber 102 changes to the liquid phase L. For example, the heat dissipation unit 11 may be a condensation tube (not shown) in which the working fluid of the gas phase G is phase-changed into the working fluid of the liquid phase L. The condensation tube may be bent multiple times to have a zigzag-shaped structure.

The first transfer pipe 12 is connected to the outlet 104, and communicates the heat absorption chamber 102 and the heat dissipation unit 11 to dissipate the working fluid of the gas phase G in the heat absorption chamber 102. ). The first transfer pipe 12 may be a pipe made of a smooth material with low flow resistance for smooth transfer of the working fluid. The first transfer pipe 12 uses a flexible bellows tube to form a stable connection structure by allowing deformation due to a change in the relative position of the heat absorption chamber 102 and the heat dissipation unit 11 It is preferred.

The diameter D1 of the first transfer pipe 12 may be greater than or equal to the height D2 of the bottom of the porous separator 103 measured based on the inner bottom surface of the heat absorption chamber 102. The larger the diameter (D1) of the first transfer pipe 12, the less the pressure loss required for the working fluid flow, and accordingly, the upper gas phase (G) for the cooling device 1 to drive the working fluid and the lower gas phase ( G) Since the minimum pressure difference between working fluids is reduced, heat transfer can be performed at a lower operating temperature.

If the first transfer pipe 12 having a diameter D1 equal to or greater than the height D2 of the bottom of the porous separation plate 103 is connected to the side surface of the main body 10, the gas phase inside the first transfer pipe 12 Heat may be transferred from the working fluid of (G) to the porous separator 103. Thereby, the temperature of the porous separator 103 can be increased. When the temperature of the porous separator 103 increases, the temperature of the working fluid of the liquid phase L increases and the temperature difference with the working fluid of the gas phase G may decrease. When the temperature difference decreases, the flow force of the working fluid of the gas phase G may be weakened. In order to prevent this, it is desirable to form the outlet 104 of the gas phase (G) working fluid on the inner bottom surface of the heat absorption chamber 102.

The second transfer pipe 13 may be a portion in which the working fluid of the liquid L formed by dissipating heat from the heat dissipation unit 11 flows. One end of the second transfer pipe 13 may be connected to the working fluid storage chamber 101 and the other end may be connected to the heat dissipation unit 11. One end of the second transfer pipe 13 is directly penetrated and connected to a portion in which the working fluid of the liquid L is stored in the working fluid storage chamber 101 to form an inlet 131, through which the working fluid of the liquid L is The working fluid of the liquid (L) in the working fluid storage chamber 101 may be supplied to the stored part.

Hereinafter, the operating principle of the cooling device 1 according to an embodiment of the present invention will be described.

First, when the heating element (H) is heated, the working fluid of the liquid (L) absorbs heat from the bottom surface of the porous separation plate (103) disposed inside the body portion (10) located at its upper part to absorb heat. ) While evaporating. The working fluid of the gas phase G existing in the heat absorption chamber 102 may be discharged to the outlet 104 by the working fluid being introduced. The working fluid of the leaked gas phase G is transferred to the heat dissipation unit 11 through the first transfer pipe 12, where heat dissipation is performed to be liquefied into the liquid phase L. The working fluid of the liquid (L) may be introduced into the working fluid storage chamber 101 through the second transfer pipe 13. As the cycle is repeated, the heating element H may be cooled.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and variations without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain them, and the scope of the technical spirit of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the claims below, and all technical spirits within the equivalent range should be interpreted as being included in the scope of the present invention.

1: cooling device 10: main body
11: heat dissipation section 12: first transfer pipe
13: 2nd transfer hall
101: working fluid storage chamber 102: heat absorption chamber
103: separation plate 103a: channel
104: outlet 105: guide
105a: communication port 131: inlet

Claims (6)

A working fluid storage chamber for storing liquid and gas phase two-phase working fluids;
A heat absorption chamber receiving a working fluid of a gas phase formed by evaporation of the liquid working fluid absorbing heat of the heating element;
A porous separation plate including a plurality of channels in which the liquid working fluid stored in the working fluid storage chamber is moved toward the heat absorption chamber, and disposed between the working fluid storage chamber and the heat absorption chamber; And
It includes a heat dissipation unit in which heat is released while the working fluid of the gas phase supplied from the heat absorption chamber changes to a liquid phase,
A cooling device in which the bottom surface of the separation plate and the inner bottom surface of the heat absorption chamber are formed to face each other in parallel, and on the inner bottom surface of the heat absorption chamber, an outlet through which the working fluid of the gas phase flows to be supplied to the heat dissipation unit is formed. . According to claim 1,
And a first transfer pipe connected to the outlet and communicating the heat absorption chamber and the heat dissipation unit to supply the working fluid of the gas phase in the heat absorption chamber to the heat dissipation unit,
The diameter of the first transfer pipe is a cooling device that is higher than the height of the bottom surface of the separation plate, which is measured based on the inner bottom surface of the heat absorption chamber facing the separation plate. According to claim 1,
The outlet is a cooling device formed on the outer portion of the inner bottom of the heat absorption chamber facing the separation plate. According to claim 1,
It includes a plurality of guides projecting on the inner bottom of the heat absorbing chamber facing the bottom of the separation plate,
The plurality of guides,
A cooling device that forms a flow path through which the working fluid of the gas phase in the heat absorption chamber flows to the outlet between each of the plurality of guides. According to claim 4,
At least one of the plurality of guides,
Cooling device that is bent to extend toward the outlet. According to claim 4,
At least one of the plurality of guides,
And a communication port communicating the flow path so that the working fluid of the gas phase flows between the flow paths.

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