KR20180108396A - Die bonding device and method of manufacturing semiconductor device - Google Patents

Abstract

Provided is a die bonding device capable of cleaning a collet preventing a foreign matter from being scattered and certainly removing a foreign matter with high adhesive force. According to the present invention, the die bonding device comprises: a pickup head sucking a device forming surface side of a die on a suction surface of a collet installed at a front end to pick up the die from a wafer; a cleaning device including a brush to remove a foreign matter from the suction surface, a suction unit to suck the foreign matter, and a driving unit to rotate the brush along the suction surface; and a control unit to control the pickup head and the cleaning device. A brushing surface of the brush has a rectangular shape. The control unit allows the brush to come in contact with the suction surface to move the suction surface of the collet in a straight line shape or move the center of the suction surface of the collet as if a circle is drawn and, at the same time, to rotate the brush, and thus the removed foreign matter is sucked by the suction unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a die bonding apparatus,

The present disclosure relates to a die bonding apparatus, and is applicable, for example, to a semiconductor manufacturing apparatus having a collet cleaning apparatus.

There is a step of assembling a package by mounting a semiconductor chip (hereinafter simply referred to as a semiconductor chip) on a wiring board or a lead frame (hereinafter, simply referred to as a board) in a part of the manufacturing process of the semiconductor device, In part, there are a step of dividing a die (a dicing step) from a semiconductor wafer (hereinafter simply referred to as a wafer) and a bonding step of mounting the divided die on a substrate. The semiconductor manufacturing apparatus used in the bonding process is a die bonding apparatus such as a die bonder.

The die bonder is a device for bonding (mounting and bonding) a die onto a substrate or a die already bonded, using solder, gold plating, or resin as a bonding material. In a die bonder for bonding a die, for example, to a surface of a substrate, a die is picked up from a wafer by using a suction nozzle called a collet, and is carried on a substrate to give a pressing force, (Operation) for performing bonding is repeatedly performed. The collet is a holding support having a suction hole and sucking air to adsorb and hold the die.

Japanese Patent Application Laid-Open No. 2016-58575

In the above-described series of operations, since the die needs to be attracted to the collet, a foreign matter mainly composed of chip residue of the wafer generated in, for example, the dicing process is adhered to the gap between the tip (attracting surface) . There is a possibility that the element portion or the protective film of the die may be broken or the wiring may be disconnected.

The object of the present invention is to provide a die bonding apparatus capable of reducing scattering of foreign matter adhering to a collet and removing foreign matter.

Other objects and novel features will be apparent from the description of the present specification and the accompanying drawings.

An outline of representative examples of the present disclosure will be briefly described below.

That is, the die bonding apparatus comprises a pick-up head for picking up the die from the wafer by adsorbing the element-formed surface side of the die on the adsorption surface of the collet provided at the tip end, a brush for removing foreign matters from the adsorption surface, A cleaning unit having a suction unit and a driving unit for rotating the brush along the suction surface; and a control unit for controlling the pick-up head and the cleaning device. The brush surface of the brush has a rectangular shape. Wherein the control unit causes the brush to contact the suction surface to move the suction surface of the collet in a straight line or the center of the suction surface of the collet in a circle and rotate the brush, And aspirate the foreign substance removed by the above.

According to the die bonding apparatus, it is possible to reduce scattering of foreign matter adhering to the collet and to remove foreign matter.

1 is a schematic top view showing a configuration of a die bonder according to an embodiment.
Fig. 2 is a view for explaining the operation of the bonding head when viewed in the direction of arrow A in Fig.
Fig. 3 is an external perspective view of the pickup apparatus of Fig. 1. Fig.
Fig. 4 is a schematic cross-sectional view showing a main part of the pickup apparatus of Fig. 1;
Fig. 5 is a diagram showing the configuration of the collet cleaning apparatus of Fig. 1. Fig.
Fig. 6 is a diagram showing the configuration of the brush of Fig. 5;
7 is a flow chart showing the bonding operation and the collet cleaning operation of the die bonder of Fig.
Fig. 8 is a flowchart showing brush cleaning and brush replacement of the collet cleaning device of Fig. 1;
9 is a diagram showing the state of the brush cleaning operation.
10 is a diagram showing a configuration of a collet cleaning apparatus according to a first modification.
11 is a view showing the brush and the brush holder of Fig.
12 is a diagram showing a collet cleaning operation of the collet cleaning apparatus of FIG.
Fig. 13 is a view for explaining brush cleaning of the collet cleaning device of Fig. 10; Fig.
Fig. 14 is a view for explaining the brush replacement of the collet cleaning apparatus of Fig. 10;
15 is a view for explaining a collet cleaning apparatus according to a second modification.
16 is a view for explaining a collet cleaning apparatus according to a third modification.
17 is a view for explaining a collet cleaning apparatus according to a fourth modification.
18 is a view for explaining a collet cleaning apparatus according to a fifth modification.
Fig. 19 is a view for explaining a collet cleaning apparatus according to Modification 6. Fig.
Fig. 20 is a view showing the brush and the brush holder of Fig. 19;
21 is a schematic top view showing a configuration of a die bonder according to a seventh modified example.
22 is a view for explaining the operation of the bonding head when viewed in the direction of the arrow G in Fig.
23 is a schematic diagram showing the locus of the rotating brush.
Fig. 24 is a schematic diagram showing a state of a brush and a collet of the collet cleaning according to the embodiment. Fig.
Fig. 25 is a schematic diagram showing a state of a brush and a collet of the collet cleaning according to the embodiment. Fig.
26 is a schematic diagram showing a state of a brush and a collet of the collet cleaning according to the embodiment.
Fig. 27 is a view for explaining a collet cleaning device according to a modification 8; Fig.

Hereinafter, embodiments, examples, and comparative examples will be described with reference to the drawings. In the following description, the same constituent elements are denoted by the same reference numerals, and repetitive description thereof may be omitted. In order to make the description more clear, the drawings are schematically expressed in terms of the width, thickness, shape, and the like of the respective parts in comparison with the actual shapes, but they are merely examples and do not limit the interpretation of the present invention .

The present inventors have studied cleaning the collet by rotating the brush. 23 is a schematic diagram showing the locus of a rotating brush. As shown in Fig. 23, only the movement of the brush is small at the center portion of the collet, and the foreign object can not be removed by putting the rotating brush on the collet.

Further, in the case of a circular brush (disc-shaped brush having a circular brush face), the foreign object removed from the collet comes to the brush face continuously while rotating thereafter, so that the brush is curled (left).

Next, the collet cleaning according to the embodiment will be described with reference to Figs. 24 to 26. Fig. Figs. 24 to 26 are schematic diagrams showing the movement of the brush and collet of the collet cleaning according to the embodiment. Fig.

In the embodiment, as shown in Fig. 24, the rotation center of the brush is shifted (relatively moved) with respect to the collet by rotating (rotating) the brush with the rectangular center as the axis and moving the collet, The foreign matters in the entire collet can be removed.

The movement of the collet is not limited to the linear movement in the left and right (Y directions), the right and left (Y directions), the forward and backward directions (X directions) The collet may be rotated (revolved) around an axis shifted from the center of the collet without changing the direction of the collet. Further, as shown in Fig. 26, the collet may be rotated (rotated) about the center of the collet and the brush may be moved. The movement of the brush can be performed only in one direction of left and right (Y direction), one direction of left and right (Y direction), one direction of forward and backward (X direction) , The brush may be revolved.

In addition, when the suction portion is provided around the rectangular brush, foreign matter removed by the brush is sucked by the suction of the suction portion on the outer periphery of the brush and separated from the brush surface, and the foreign matter can be prevented from reattaching have.

In addition, when the diameter of the circular brush is equal to the length of the long side of the rectangular brush, the area of the brush portion of the rectangular brush is small, so that the suction area (the area of the brush portion sucked by the suction portion) can be reduced, .

<Examples>

1 is a schematic top view of a die bonder according to an embodiment. Fig. 2 is a view for explaining the operation of the bonding head 41 when viewed in the direction of arrow A in Fig.

The die bonder 10 includes a die feeder 1 for feeding a die D mounted on a substrate P and a die D for picking up the die from the die feeder 1, A bonding unit 4 for bonding the substrate P or an already bonded die on the die, a collet cleaning device 60 for cleaning the foreign substance on the die adsorption face of the collet 6, A substrate carrying section 9K for supplying the substrate P to the carry section 5; a substrate carry section 9H for receiving the mounted substrate P; And a control unit 7 for controlling the control unit.

First, the die feeder 1 has a pick-up device 12 for holding the wafer 11 and a push-up unit 13 indicated by a dotted line pushing the die D from the wafer 11. The die feeder 1 moves in the XY direction (horizontal direction) by a driving means (not shown) and moves the pick-up die D to the position of the push-up unit 13. [

The bonding section 4 includes a bonding head 41 for picking up a die D from the wafer 11 and bonding to the substrate P that has been transported and a Y drive section 41 for moving the bonding head 41 in the Y direction. A substrate recognition camera 44 for picking up a position recognition mark (not shown) of the substrate P being conveyed and recognizing the bonding position of the die D to be bonded, And a die posture recognition camera 45 for detecting the posture of the die D picked up from the die. As shown in Fig. 2, the bonding head 41 has a collet holder 6h for detachably holding the collet 6 at the tip thereof. The collet 6 has a suction hole (not shown) connected to a suction pump (not shown) through the bonding head 41, and holds and holds the die D in the suction hole. The collet 6 is rectangular in plan view and is of the same size as the die D.

The collet cleaning device 60 is provided between a pick-up position for picking up the die D from the wafer 11 and a bonding position for bonding the die by pressurizing and pressing the die. As described later, Foreign matters on the suction surface of the die (D) of the cleaning unit (6) are removed and cleaned.

With this configuration, the bonding head 41 corrects the posture of the die D based on the image pickup data of the die posture recognition camera 45 and corrects the posture of the die D based on the image pickup data of the substrate recognition camera 44 And the bonding operation shown by the thin broken line in Fig. 2, which is returned to the pickup position of the wafer 11, is performed.

The bonding head 41 moves to the position of the collet cleaning device 60 at the appropriate time, for example, after starting a series of bonding operations, during or after the operation, and performs cleaning of the collet 6 A cleaning operation indicated by a thick broken line is performed.

Therefore, it is preferable that the proper installation position of the collet cleaning device 60 is provided at a position where the bonding route of the bonding head 41 in the bonding operation is not disturbed. However, when the bonding operation is disturbed or the mounting place is not sufficiently taken, it may be offset at both ends outside the normal route or in the direction of transporting the substrate of the normal route. The urine may be provided in the movable range of the bonding head 41.

The carrying section 5 is provided with a substrate carrying pallet 51 on which one or a plurality of substrates (four in Fig. 1) are mounted and a pallet rail 52 on which the substrate carrying pallet 51 moves, And has first and second transport sections of the same structure installed in parallel. The substrate transport pallet 51 is moved by driving a nut (not shown) provided on the substrate transport pallet 51 by a ball screw (not shown) provided along the pallet rail 52.

With this configuration, the substrate transport pallet 51 is transported to the substrate transport section 9H after the substrate P is loaded on the substrate supply section 9K, moved to the bonding position along the pallet rail 52, And transfers the substrate P to the substrate carrying-out section 9H. The first and second transport sections are driven independently from each other and while the die D is bonded to the substrate P mounted on one of the substrate transport pallets 51 while the other substrate transport pallet 51 is transported to the substrate P The substrate P is removed, and the substrate P is returned to the substrate supply unit 9K to prepare a new substrate P or the like.

The control section 7 includes a memory for storing a program (software) for monitoring and controlling the operation of each section of the die bonder 10 and a central processing unit (CPU) for executing a program stored in the memory. The control unit 7 introduces various kinds of information such as image information from the substrate recognition camera 44 and the die position recognition camera 45 and the position of the bonding head 41 and controls the bonding operation of the bonding head 41 and the cleaning Operation, and cleaning operation of the collet cleaning device 60. [0050]

Next, the configuration of the pickup device 12 will be described with reference to Figs. 3 and 4. Fig. Fig. 3 is a view showing an external perspective view of the pickup apparatus of Fig. 1. Fig. 4 is a schematic sectional view showing a main part of the pickup apparatus of FIG. 3 and 4, the pickup device 12 includes an expander ring 15 for holding the wafer ring 14, a plurality of dies D held by the wafer ring 14, A support ring 17 for positioning the dicing tape 16 adhered horizontally and a push-up unit 13 disposed inside the support ring 17 and for pushing up the die D upward. The push-up unit 13 is moved in the vertical direction by a drive mechanism (not shown), and the pickup device 12 is moved in the horizontal direction.

Up device 12 moves down the expander ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is stretched to widen the distance between the dies D, and the die D is pushed up from below the die by the push-up unit 13 So that the pickup performance of the die D is improved. An adhesive material on a film called a die attach film (hereinafter abbreviated as DAF) 18 is attached between the die D (wafer 11) and the dicing tape 16. [ In the wafer 11 having the DAF 18, dicing is performed on the wafer 11 (die D) and the DAF 18. Therefore, in the peeling step, the wafer 11 and the DAF 18 are peeled from the dicing tape 16.

At the time of dicing, a foreign matter of the Si residue of the wafer (silicon Si) is mainly generated and attached to the collet 6 at the peeling step. Since the attracting surface of the collet 6 is in contact with the element forming surface of the die D, there is a possibility that breakage of the element portion or the protective film of the die or disconnection of the wiring occurs if the amount of the attaching becomes larger than a predetermined amount.

Next, the collet cleaning device 60 will be described.

Fig. 5 is a diagram showing the configuration of the collet cleaning apparatus of Fig. 1. Fig. FIG. 5A is a view of the collet cleaning device viewed from the direction of arrow A in FIG. 1. FIG. Fig. 5B is a view of the collet cleaning device viewed from the direction of arrow B in Fig. 5A. 5A and 5B correspond to FIGS. 5A and 5B, respectively. The bonding head 41 is lowered to contact the brush 61 And shows the state of the cleaning operation. 6 is a view showing a configuration of a brush. 6 (a) is a top view, FIG. 6 (b) is a side view in the direction of arrow A1 in FIG. 6 (a), and FIG. 6 (c) And is a side view seen from the direction of arrow A2.

The collet cleaning device 60 includes a brush 61 for cleaning the adsorption face of the die D of the collet 6 and a removable foreign matter such as silicon (Si) residue in the brush 61 provided below the brush 61 A moving frame portion 62 having a nut 62n therein and a driving portion 65 for moving the brush 61. The suction portion 63, the brush 61 and the suction portion 63, And a fixing portion 66 for fixing these components to a mechanism portion (not shown) of the die bonder 10. [

The brush 61 is preferably a superfine metal brush, and it is preferable that the metal of the base material is flexible as SUS (stainless steel). In addition, as the diameter of the base material of the brush 61, a diameter capable of maintaining a certain degree of elasticity is preferable. If it has flexibility such as SUS, it may have a line diameter of about 10 탆 to several hundred 탆.

More specifically, the brush 61 is formed by, for example, inserting a wire made of SUS having a wire diameter of 30 mu m and a length of 6 mm into a rectangular brush base 61B, for example, in a lattice or zigzag form, Thereby constituting a rectangular brush portion 61H. In the rectangular shape, the angle becomes rounded, and at least the long side has the shape of the width of the collet 6. The length LB of the brush effective portion in the long side direction has at least the length of the width of the collet 6. The wire determines the wire diameter, the length and the length of the short side of the rectangle so as to have a predetermined elasticity of the wire as described above. The predetermined elasticity or the wire diameter, the length of the wire, and the length of the short side of the rectangular shape can be determined by experimentally obtaining in advance. The width (WE) of the short side of the effective portion of the brush 61 of the brush 61 is smaller than the length (width WE) of the effective portion of the brush 61 in the Y direction of the collet 6 And is preferably as short as possible. So that the removed foreign matter is prevented from adhering to the collet 6 again by the movement of the brush 61.

The brush 61 does not improve the removal rate even when it is pressed against the suction surface of the die D of the collet 6 but does not improve the degree of contact with the collet 6 ) Is preferably about 0 to 1 mm). If the brush 61 is a conductive metal, it is possible to remove (charge) the charge charged in the collet 6 by grounding the brush 61. The brush base 61B has a large number of holes passing through from the top to the bottom and communicates with the suction portion 63. [

The suction portion 63 is formed in the moving frame portion 62 and includes a suction hole portion 63a formed on both sides of the ball joint 65b for driving and a connecting portion 63a connecting the two suction hole portions 63a 63b, a flexible connection pipe 63h disposed from a suction pump (not shown), and a connection plug 63s to which the connection pipe is connected.

The driving portion 65 includes a ball joint 65b which is engaged with a nut 62n fixed to the moving frame portion 62 and is supported by the fixing portion 66, a motor 65m which rotates the ball joint, The concave portion formed in the movable frame portion 62 has two guide rails 65g which are provided on both sides of the fixed portion 66 which slides.

Bonding operation of the bonding head 41 to the substrate P and cleaning operation of the collet 6 by the collet cleaning device 60 will be described with reference to Figs. 2, 7, and 8. Fig. 7 is a flowchart showing the bonding operation and the collet cleaning operation of the die bonder of Fig. Fig. 8 is a flowchart showing brush cleaning and brush replacement of the collet cleaning apparatus of Fig. 1; Figs. 9A and 9B are views corresponding to Figs. 5C and 5D, respectively, in which the bonding head is lowered to make contact with the brush, and the state of the brush cleaning operation Fig.

First, an operation precedent to bonding and an operation after termination will be described. The wafer ring 14 holding the dicing tape 16 with the die D divided from the wafer 11 is stored in a wafer cassette (not shown), and the wafer ring 14 is carried into the die bonder 10. The control section 7 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply section 1. [ Further, the substrate P is prepared and carried into the die bonder 10. The control section 7 loads the substrate P onto the substrate transport pallet 51 from the substrate supply section 9K.

After the completion of the bonding, the control section 7 takes out the substrate P on which the die D is bonded from the substrate carrying pallet 51 at the substrate carrying-out section 9H. And the substrate P is carried out from the die bonder 10.

Next, the bonding operation will be described. Normally, the bonding operation indicated by the thin broken line in Fig. 2 is repeatedly performed. In the bonding operation, the control unit 7 sucks the die D pushed up by the push-up unit 13 from the wafer 11 by the collet 6 mounted on the tip of the bonding head 41, (Step B1). The control unit 7 recognizes the posture of the die D by the die posture recognition camera 45 while the picked up die D is moving to the bonding position, (6) is rotated to correct the posture of the die (D2) (step B2). The control unit 7 bonds the die D to the substrate P conveyed by the pallet rail 52 (step B3). The control unit 7 returns the bonding head 41 from the wafer 11 to the pickup position of the die D (step B4).

During the above-described bonding operation, the control unit 7 controls the pickup position of the collet 6 to be picked up by the die position recognition camera 45 in the middle of the operation for returning to the pickup position of step B4 for each predetermined number of bonding times , And determines whether cleaning of the collet 6 is necessary (steps J1 and J2). This determination of necessity of cleaning is to clean the collet for each bonding, reduce the number of cleaning as much as possible, and shorten the cleaning time (improve throughput). The determination of necessity is made by determining the number or size of foreign matter such as Si residue in a predetermined region of the adsorption surface. The predetermined region designates, for example, a stain-resistant region having a step. Of course, it may be determined in the entire area of the adsorption face. In the case where the image processing takes time, the image processing may be performed once until the image is picked up, after the next bonding process, or after the next bonding process, and the cleaning of the collet 6 may be determined. If the control unit 7 determines that the cleaning of the collet 6 is unnecessary, the process proceeds to step B4.

When the controller 7 determines that cleaning of the collet 6 is necessary, the controller 7 enters a cleaning operation indicated by a thick broken line in Fig. The control unit 7 moves the collet 6 (the bonding head 41) to the upper portion of the collet cleaning device 60 and drops it so that the brush 61 (see FIG. 5C) (Step C1). Thereafter, the control unit 7 causes the bonding head 41 to rotate about the center of the collet 6 and controls the motor 65m to move the brush 61 to the position indicated by the arrow C As shown, for example, one reciprocating, and if necessary, reciprocating several times, the adsorption face of the collet is cleaned (step C2). Further, only a one-way operation may be performed if a predetermined degree of cleanliness is obtained by only one-way operation. Thereafter, the control section 7 raises the bonding head 41 to return to the pickup position of the die D (step C3), and returns to the bonding operation.

The control section 7 repeats the process until the number of the die for which the flow is scheduled to be bonded (step J3).

When the cleaning of the collet 6 is repeated, foreign matter removed from the collet 6 is collected in the brush 61. [ Thus, as shown in Fig. 8, the control unit 7 determines whether cleaning or replacement of the brushes 61 is necessary (steps J4 and J5). Whether or not the cleaning of the brush 61 is necessary is determined, for example, by judging whether or not the cleaning operation of the collet 6 has been performed a predetermined number of times (step J4). Whether or not the replacement of the brush 61 is necessary is determined, for example, by judging whether cleaning of the brush 61 has been performed a predetermined number of times (step J5). If the determination in step J4 is not necessary, the process returns to step C3. If the determination in step J4 is necessary, the process proceeds to step J5. If the determination in step J5 is not necessary, the brushes 61 are cleaned (step C4). If necessary, the brushes 61 are exchanged (step C5). The cleaning of the brush 61 can be carried out by, for example, a bonding head 41 on which a brush, a brush-cleaning plate 6C composed of a plate or flat plate with concavo-convex or the like is mounted on the brush 61, The brush 61 is linearly moved while the suction is performed in the suction portion 63 and the brush cleaning plate 6C is rotated (operation similar to the cleaning operation of the collet in the collet cleaning device 60) .

In the above flow, whether or not the cleaning of the collet 6 is necessary is determined based on the imaging data every predetermined number of bonding times, in other words, every predetermined number of pick-ups of the die D from the wafer 11. However, But may be performed periodically every predetermined number of times of pickup. Although it is judged whether or not the cleaning of the collet 6 is necessary for each predetermined number of bonding operations based on the imaging data in the above flow, , The subsequent determination cycle may be shorter than the predetermined number of bonding times.

The cleaning of the collet 6 may be performed automatically whenever the rows of the dies on the wafer 11 held by the dice are changed or the collet cleaning is performed every two rows . Further, the operator may operate the die bonder whenever necessary and execute it from time to time.

In the above description, the bonding head 41 is lowered during the cleaning operation of the collet 6, but may be cleaned by raising the collet cleaning device 60.

According to the embodiment, the foreign matter can be removed by combining the rotational motion of the collet 6 and the linear motion of the brush 61. [ Further, by providing the suction portion 63, the removed foreign matter can be recovered, and the die can be securely bonded to the substrate. Further, by using a metal for the brush 61, the collet 6 can be discharged, and electrostatic destruction of the die can be prevented.

<Modifications>

Hereinafter, some representative variations are exemplified. In the following description of the modified example, the same reference numerals as in the above-described embodiments can be used for the parts having the same configuration and function as those described in the above-mentioned embodiments. The description of these parts is not intended to be technically inconsistent, and the description in the above-mentioned embodiments can be appropriately used. In addition, some or all of the above-described embodiments, and all or part of the plurality of modifications, can be applied appropriately and complexly within a range that is not technically contradictory.

(Modified Example 1)

In the embodiment, the collet 6 is rotated to linearly move the brush 61, but in the first modification, the collet 6 is linearly moved to rotate the brush 61.

10 is a view showing a collet cleaning apparatus according to a first modification. Fig. 10A is a view seen from the direction of arrow A in Fig. 10 (b) is a view seen from the direction of arrow A3 in Fig. 10 (a). 11 (a) is a top view of the brush and brush holder of the collet cleaning device. 11 (b) is a cross-sectional view taken along the line A4-A5 in Fig. 11 (a). 11 (c) is a cross-sectional view taken along the line A6-A7 in Fig. 11 (a). Fig. 12 is a view corresponding to Fig. 10 (a), showing the state of the cleaning operation by raising the main body of the collet cleaning device to make contact with the pick-up head.

The collet cleaning device 60 includes a brush holder 64 for holding a brush 61 and a brush 61, a driving part 65 and a lifting device 67 supported by the fixing part 66.

The brush holder 64 has a rectangular bottom surface portion 64a, long side surface portions 64d and 64e, short side surface portions 64b and 64c and short side surfaces 64b and 64c A convex portion 64f for supporting the bottom surface of the brush base 61B and a convex portion 64g provided at four corners for supporting the side surface of the brush base 61B and extending downward from the center of the bottom surface 64a And a piping portion 64h. The gap formed between the side surface of the long side of the brush 61 and the side surface portions 64d and 64e of the long side of the brush holder 64 and the gap formed between the bottom surface of the brush 61 and the bottom surface of the brush holder 64 A part of the suction portion 63 is formed by the gap formed between the suction portions 63a.

The suction portion 63 is formed between the inside of the brush holder 64 and the brush 61 and includes a suction groove 63c formed on both sides of the brush 61 and two suction grooves 63c, A flexible connection pipe 63h disposed from a suction pump (not shown), and a connection plug 63s to which the connection pipe is connected.

The driving unit 65 has a rotation shaft engaged with the brush holder 64, a motor for rotating the rotation shaft, and a pipe connecting the connection portion 63d to the connection plug 63s.

The main points different from the embodiment of the collet cleaning device 60 of Modified Example 1 are the following three points.

First, in the embodiment, the collet 6 is rotated and the brush 61 is linearly moved to remove foreign matters from the adsorption surface. In the first modification, the brush 61 is rotated to move the bonding head 41 to the position shown in FIG. 16 And moves leftward and rightward in the direction of the arrow J shown in the figure to remove foreign matters from the adsorbing surface. The direction of the arrow J is a direction (Y direction) in which the bonding head 41 moves leftward and rightward in a different direction (normal bonding) apart from the purpose of cleaning and performs cleaning to provide a useless function There is no.

Second, in the embodiment, the bonding head 41 is lowered and the suction surface of the collet 6 is brought into contact with the brush 61. In contrast, in the modification example 1, by the elevating device 67 having the ascending / And the brush 61 is brought into contact with the suction surface of the collet 6 by raising the brush 61. [ The brush 61 can be moved up and down to be brought into contact with the bonding head 41 in accordance with the upward movement of the bonding head 41 by the upward movement of the brush 61, Can be improved. The second point is that the bonding head 41 may be lowered in the same way as the embodiment in order to reduce the drive shaft in the first modified example.

Third, in the embodiment, the suction hole portion 63a of the suction portion 63 is a hole formed in the brush base 61B, while in the modification 1, the suction hole 63a is formed in the brush holder 64 and the brush base 61B It is an elongated groove.

Next, a cleaning operation of the collet 6 by the collet cleaning device 60 according to the first modification will be described with reference to FIG. Further, the bonding operation is the same as the embodiment.

When the controller 7 determines that cleaning of the collet 6 is necessary, the controller 7 enters a cleaning operation indicated by a thick broken line in Fig. The control unit 7 moves the collet 6 (bonding head 41) to the upper portion of the collet cleaning device 60 and controls the elevating device 67 to raise the brush 61, The brush 61 is brought into contact with the collet 6 (step C1). The control unit 7 controls the driving unit 65 to rotate the brush 61 and control the bonding head 41 to move the collet 6 to the position shown by the arrow J, For example, the suction surface of the collet is cleaned by reciprocating one round, and if necessary, several rounds (step C2). Further, only a one-way operation may be performed if a predetermined degree of cleanliness is obtained by only one-way operation. Thereafter, the control section 7 raises the bonding head 41 to return to the pickup position of the die D (step C3), and returns to the bonding operation.

Next, brush cleaning (step C4) will be described with reference to Fig. 13 is a view for explaining the cleaning of the brush of the collet cleaning apparatus according to the first modification. Fig. 13 (a) corresponds to Fig. 11 (b), and is a cross-sectional view showing the state of the brush cleaning operation by bringing the brush into contact with the brush. Fig. 13B is a cross-sectional view showing the state of the brush cleaning operation by contacting the brush with a brush cleaning plate, corresponding to Fig. 11C.

A brush cleaning plate 6C having surface projections such as comb-like protrusions or brushes or grooves reaching the inside of the brush is mounted on the brush cleaning holder 6Ch of the bonding head 41 in the same manner as the collet 6, The cleaning operation is performed. The holder 6Ch for brush cleaning is slightly larger than the brush holder 64. [ 13 (b), the control unit 7 controls the driving unit 65 to align the long side direction of the brush 61 in the X direction (the short side direction is the Y direction) The brush cleaning plate 6C is moved at a short interval in the up and down direction (Z direction) and the left and right direction (Y direction), and the brush cleaning plate 6C is exhausted from the suction unit 63 to perform brush cleaning. The brush cleaning plate 6C protrudes downward from the lower end of the holder 6Ch for brush cleaning and the control unit 7 controls the drive unit 65 to rotate the brush 61 similarly to the collet cleaning The brush cleaning plate 6C may be moved in the Y direction by controlling the bonding head 41 to perform brush cleaning while exhausting the liquid from the suction unit 63. [

Generally, there are many foreign objects gathered in the brush 61 (brush base 61H) near the brush stand (simulated source)), and this can be effectively removed.

Next, the brush exchange (step C5) will be described with reference to Fig. 14 is a view for explaining the brush replacement of the cleaning apparatus according to the first modification. Fig. 14 (a) corresponds to Fig. 11 (b) and is a cross-sectional view showing the state of the brush exchange operation by holding the exchange arm in the brush. Fig. 14 (b) is a cross-sectional view corresponding to Fig. 11 (c) and showing the state of the brush exchange operation by holding the exchange arm on the brush. Fig. 14 (c) corresponds to Fig. 14 (b), and is a front view of the exchange arm.

The dedicated exchange arm 6Ah is provided with a grip portion that can be inserted into the suction groove 63c between both side surfaces of the long side of the brush base 61B and the side portions 64d and 64e of the brush holder 64, Like the holder 6Ch, is loaded on the bonding head 41, and the brush 61 is exchanged.

The control unit 7 controls the driving unit 65 to adjust the long side direction of the brush 61 to the X direction (the short side direction to the Y direction) and controls the bonding head 41 to control the wave of the dedicated exchange arm 6Ah The grip portion 61B is gripped by inserting the grip portion into the suction groove 63c by controlling the bonding head 41 and the brush 61 is pulled out from the brush holder 64, Replace the brush (61).

The dedicated exchange arm 6Ah is a collet type jig (a brush handling jig that can be replaced with a collet) and can be exchanged using the bonding head 41. [

According to the first modified example of the collet cleaning apparatus described above, by using the suction unit by rotating the brush 61, the foreign matter can be removed without scattering the foreign matter around. Further, the brush 61 can be cleaned or replaced.

(Modified example 2)

The brush according to Modification 2 has an air blow function. Fig. 15 is a sectional view corresponding to Fig. 11 (c) for explaining a collet cleaning apparatus according to a second modification. Fig.

The brush base 61B of the brush 61 according to Modification 2 is provided with a plurality of holes 61a for jetting air and a cavity 61b connected to the hole 61a and a cavity 61b for supplying air And a pipe 61c. The brush holder 64 according to the modified example 2 is the same as the modified example 1 except that the pipe 61c extends in the connecting part 63d.

The drive unit 65 according to the second modification includes a rotation shaft engaged with the brush holder 64, a motor for rotating the rotation shaft, a pipe connecting the connection portion 63d to the connection plug 63s, a pipe 61c, To the air supply unit.

The control unit 7 controls the air supply unit to blow air from the bristles of the brush (a plurality of holes 61a of the brush stand 61B) during the collet cleaning or brush cleaning. As a result, it is possible to make it difficult for foreign matter to adhere to the brush portion 61H (the inside of the brush portion 61H).

(Modification 3)

The brush according to Modification 3 exchanges a new face of the brush face by rotating along the vertical face. 16 is a view for explaining a collet cleaning apparatus according to a modification 3; Fig. 16A is a cross-sectional view corresponding to Fig. 11B. Fig. 16 (b) is a cross-sectional view corresponding to Fig. 11 (c).

The brush base 61B of the brush 61 is a horizontally long rectangular parallelepiped body and is rotatable about the central axis (the rotary shaft rod 61C) in the direction along the long side direction of the rectangular parallelepiped. A brush portion 61H is formed on four sides of the brush base 61B.

Side portions 64b and 64c of the brush holder 64 rotatably support the rotary shaft rod 61C. Therefore, the brush holder 64 does not include the convex portions 64f and 64g of the first modification.

The suction portion 63 is formed between the inside of the brush holder 64 and the brush 61 and has suction grooves 63c formed on both sides of the brush 61, And a connecting portion 63d connecting the suction groove 63c. The cleaning apparatus according to Modification 3 is similar to Modification 1 except for the brush and the brush holder. The collet cleaning operation and the brush cleaning operation of the cleaning apparatus according to the modified example 3 are the same as those of the operation modification example 1.

The control unit 7 controls a driving unit (not shown) to rotate the rotary shaft rod 61C and exchange the brush (replace the brush surface) (step C5).

Rotate a plurality of surfaces in a rotary manner to clean with a new surface each time the brush is dirty. Whether the brush 61 needs to be rotated may be determined by a predetermined number of times of cleaning, or the contamination of the brush may be confirmed by the cleaning recognition camera. In Modification 3, the brush is described as four sides, but it may be two or three, or five or more.

(Variation 4)

Modification 3 does not have a special mechanism for cleaning the brush, but Modification 4 has a mechanism for cleaning the brush. 17 is a view for explaining a collet cleaning apparatus according to a fourth modification. FIG. 17A is a cross-sectional view corresponding to FIG. 16A. FIG. 17B is a cross-sectional view corresponding to FIG. 16B.

The cleaning apparatus according to Modification 4 has a projection or a brush portion 62C provided inside the side portions 64b and 64c of the brush holder 64. [ The remaining configuration is the same as that of the third modification. The collet cleaning operation is the same as that of the first modification. The control unit 7 controls a driving unit not shown to rotate the rotating shaft rod 61C of the brush 61 and to rotate the brush 61H of the brush 61 against the brush holder 61 And the collet cleaning is performed again with the cleaned brush. At this time, exhaust is performed from the suction portion 63. The structure of the brush 61 and the brush holder 64 may be such that the air is blown out in the same manner as in the second modified example, and further air blowing may be performed at the time of brush cleaning. The same brush cleaning as in Modification 1 may be performed.

(Modified Example 5)

The hair length HH of the brush portion 61H of the brush 61 of Modification Example 5 is made longer than that of the embodiment and Modification 1. [ A collet cleaning apparatus according to Modification 5 will be described with reference to Fig. 18 (a) is a top view of the brush of the collet cleaning device. 18 (b) is a cross-sectional view taken along the line B1-B2 in Fig. 18 (a). 18 (c) is a cross-sectional view taken along the line B3-B4 in Fig. 18 (a).

The length HH of the brush portion 61H of the brush 61 of the modified example 5 is about 10 mm and the height of the brush holder 64 is increased accordingly. Assuming that the upper end of the brush portion 61H is higher than the upper end of the brush holder 64 and the height from the upper end of the brush stand 61B to the upper end of the brush holder 64 is HF, About 1 to 2 mm. The remaining structure is similar to that of the first modification.

According to Modification 5, the gap between HH and HF is narrow, and the exhaust can be efficiently performed, so that foreign matter can be removed without scattering the foreign object around. In addition, since there are many foreign objects gathered in the inside of the brush 61 (brush base 61H of the brush base 61 (simulated source)), and this portion is disposed inside the brush holder, It can be removed.

(Modified Example 6)

In the modified example 1, the suction groove 63c (brush holder 64) is rotated together with the brush 61. In the modified example 6, the brush 61 is rotated without rotating the suction part 63 (frame part 62) . Fig. 19 is a diagram showing a configuration of a collet cleaning apparatus according to Modification 6. Fig. Fig. 19 (a) is a view of the collet cleaning device viewed from the direction of arrow A in Fig. 1. Fig. Fig. 19 (b) is a view of the collet cleaning device in the direction of the arrow B5 in Fig. 19 (a). Figs. 19 (c) and 19 (d) correspond to Figs. 19 (a) and 19 (b), respectively, And shows the state of the cleaning operation. 20 (a) is a top view of the collet cleaning device. Fig. 20 (b) is a view seen from the direction of arrow B6 in Fig. 20 (a). Fig. 20C is a view seen from the direction of arrow B7 in Fig. 20A.

The collet cleaning device 60 according to the modified example 6 is provided with the brush 61, the frame part 62, the driving part 65, the elevating device 67 and the suction part 63 supported by the fixing part 66 do.

The brush holder 64 includes a rectangular bottom surface portion 64a, long side surface portions 64d and 64e, short side surface portions 64b and 64c, and downwardly extending from the center of the bottom surface portion 64a. And a connection portion 64j. A portion of the brush base 61B is exposed in the side portions 64d and 64e on the long side of the brush holder 64 in order to exchange the brush 61. [ The side surface portions 64b and 64c on the short side of the brush holder 64 may or may not be exposed to a part of the brush stand 61B for replacement of the brush 61. [

The suction portion 63 is connected to a flexible connection pipe 63h formed between the inside of the cylindrical frame portion 62 and the cylindrical driving portion 65 and arranged from a suction pump And a connection plug 63s to which the pipe is connected. In the modified example 1, the brush holder 64 and the suction part 63 (suction groove 63c) rotate together with the brush 61, while in the modified example 6, the frame part 62 and the suction part 63 are not rotated Do not. The driving unit 65 has a rotation shaft engaged with the brush 61 and a motor for rotating the rotation shaft.

The bonding operation, the collet cleaning operation, the brush cleaning operation, and the brush exchange operation according to the modified example 6 are the same as those of the first modified example.

(Modification 7)

In Modification 7, the pick-up portion 2 is provided between the die supplying portion 1 and the bonding portion 4. 21 is a schematic top view showing a configuration of a die bonder according to a seventh modified example. 22 is a view for explaining the operation of the pickup head and the bonding head 41 when viewed in the direction of the arrow G in Fig.

The die bonder 10 according to the modified example 7 has the pickup unit 2 picked up from the wafer 11 separately from the bonding head 41 and the picked up die D on the die bonder 10 according to the embodiment. And an intermediate stage 31 for once loading the intermediate stage 31 is further provided. The die bonder 10 according to the modified example 7 has the collet cleaning device 60 between the pickup position of the intermediate stage 31 and the die D. The collet cleaning device 60 may be any one of the collet cleaning devices of the embodiment, Modifications 1 to 6, and 8.

As described above, the collet cleaning device 60 is arranged between the pickup position of the intermediate stage 31 and the pick-up position of the die D as foreign objects or the like are attached to the collet 6 of the pickup head 21 from the wafer 11. [ Is installed. When it is necessary to perform collet cleaning in the bonding head 41 in the die bonder in which the intermediate stage 31 is present as well, it is necessary to perform the bonding between the intermediate stage 31 and the bonding position of the die D As shown in FIG.

The pick-up section 2 picks up the dies D from the wafer 11 and picks up the pickup heads 21 mounted on the intermediate stage 31 and the pickup heads 21 for moving the pick- And a driving unit 23. The pick-up head 21 has the same structure as the bonding head 41 and has driving parts (not shown) for moving the collet 6 up, down and in the X direction in addition to the Y driving part 23.

In the embodiment, the degree of the foreign object is monitored by using the die posture recognition camera. However, in Modification Example 7, when the die D is loaded on the intermediate stage 31, it is not necessary to obtain an accurate die posture as in bonding In the seventh modification, the degree of foreign matter is monitored by the pickup number of the die D from the wafer 11 by the pickup head 21, without monitoring the degree of foreign matter as an image. Of course, as in the embodiment, means for picking up the suction surface of the collet 6 of the pick-up head may be provided, and the necessity of cleaning may be determined based on the image pickup result.

(Modification 8)

In the brush 61 of Modification 8, a part of the central portion of the brush portion 61H is removed. A collet cleaning apparatus according to Modification 8 will be described with reference to Fig. 27A is a top view of the brush and brush holder of the collet cleaning device. Fig. 27 (b) is a cross-sectional view taken along the line A4-A5 in Fig. 27 (a). Fig. 27C is a cross-sectional view taken along the line A6-A7 in Fig. 27A.

In the method of rotating the brushes of Modifications 1 to 6, it is preferable that the brush portion 61H and the brush stand 61B at the central portion (rotation center portion) of the rotary brush are removed with a predetermined width as shown in Fig. 27 This is effective because it does not damage the collet 6 at the time of cleaning. This is to prevent the damage from accelerating because the brushes come into contact continuously at four revolutions in the central portion as compared with the other brush contacting portions. The predetermined width LW for removing the brush is preferably about 1 to 6 mm.

While the invention made by the present inventors has been specifically described based on the embodiments, the examples and the modifications, the present invention is not limited to the embodiments, the examples and the modifications, and various changes There is no need.

For example, in the embodiment, it is judged whether or not the cleaning of the brush is necessary and the necessity of the brush replacement is judged by the number of times of cleaning. However, a brush recognition camera is provided above the cleaning device, It may be determined whether cleaning is necessary.

Further, in the embodiment, the amount of press-in of the brush after being brought into contact with the collet is set to about 0 to 1 mm. However, instead of performing the management by the amount of indentation, a pressure sensor may be provided at a portion where the brush is pressed, Control may be performed.

Further, the brush portion or the entire rotating portion may be flexibly fixed so as to follow the collet so that the brush can be brought into contact with the collet in parallel.

Although the DAF is attached to the back surface of the wafer in the embodiment, the DAF may be omitted.

In the embodiment, each of the pickup head and the bonding head is provided, but two or more of them may be used. In the embodiment, the intermediate stage is provided, but the intermediate stage may be omitted. In this case, the pick-up head and the bonding head may be used together.

Further, in the embodiment, although bonding is performed with the surface of the die facing upward, the front and back of the die may be inverted after the die is picked up, and the back surface of the die may be bonded. In this case, the intermediate stage need not be installed. This device is called flip chip board. In the case of applying to a flip chip bonder, the suction surface of the collet may be upward, and therefore, it may be provided above the movable range of the head for picking up the cleaning device. That is, the cleaning device is provided so as to face the adsorption surface.

1:
2: Pickup section
21: Pickup head
31: Intermediate stage
4:
41: bonding head
44: Substrate recognition camera
45: Die position recognition camera
6: Collet
7:
10: die bonder
11: wafer
12: Pickup device
13: Push-up unit
18: Die attach film (DAF)
60: Collet cleaning device
61: Brush
62:
63: suction portion
64: Brush holder
65:
67: lifting device
D: Die
P: substrate

Claims (20)

A pick-up head for picking up the die from the wafer by adsorbing the element-formed surface side of the die on the adsorption surface of the collet provided at the tip,
A suction unit for sucking the foreign object, and a driving unit for rotating the brush along the suction surface;
A controller for controlling the pick-up head and the cleaning device;
And,
Wherein the brush surface of the brush has a rectangular shape,
Wherein the control unit causes the brush to contact the suction surface to move the suction surface of the collet in a straight line or the center of the suction surface of the collet in a circle and rotate the brush, And sucking the foreign matter removed by the die bonding apparatus. The cleaning apparatus according to claim 1, wherein the cleaning device further comprises a brush holder for holding the brush,
Wherein the brush includes a brush portion that is in contact with the collet, and a brush base that holds the brush portion,
Wherein the suction portion comprises a gap between the brush holder and the brush base. The brush device according to claim 2, wherein the brush has a rotation axis for rotating the brush base along a plane perpendicular to the attraction surface,
And a brush portion on a plurality of surfaces of the brush stand. The die bonding apparatus according to claim 3, wherein the brush holder has a projection or a brush portion for cleaning the brush portion on a surface facing the brush base. The die bonding apparatus according to claim 2, wherein the brush stand has a hole for spraying air into the brush section. The die bonding apparatus according to claim 1, wherein the cleaning device is provided in a movable range of the pick-up head. The cleaning apparatus according to claim 6, wherein the cleaning device is installed at a position facing the adsorption surface when removing the foreign matter on the adsorption surface, between a pickup position for picking up the wafer from the die and a position for loading the die Gt; The die bonding apparatus according to claim 1, wherein the control unit causes the collet or the brush to move up and down, bringing the brush into contact with the adsorption surface, and setting the amount of pressurization of the brush to 0 to 1 mm. The die bonding apparatus according to claim 1, wherein the brush comprises a plurality of bristles of a metal having a line width of 10 mu m to several hundred mu m. The die bonding apparatus according to claim 1, wherein the brush has a brush portion having a long side on one side of the suction surface. The die bonding apparatus according to claim 1, wherein the pick-up head also serves as a bonding head, and bonds the die directly from the wafer onto a substrate or a die already bonded. 2. The apparatus of claim 1, further comprising a bonding head for bonding the pick-up die onto a substrate or an already bonded die,
The pick-up head once loading the die onto the intermediate stage, and the bonding head picking up the die from the intermediate stage and bonding to the substrate. The die bonding apparatus according to claim 1, wherein a portion of the rotation center portion of the brush having no brush face is formed with a predetermined width. The die bonding apparatus according to claim 13, wherein the predetermined width is 1 to 6 mm. (a) preparing a die bonding apparatus according to any one of claims 1 to 14;
(b) carrying a wafer ring holder holding a dicing tape to which a die is attached,
(c) preparing and transporting a substrate,
(d) picking up the die,
(e) bonding the picked-up die onto the substrate or an already bonded die,
(f) cleaning the collet with the cleaning device. 16. The method of claim 15, further comprising: (g) cleaning the brush,
The step (g)
(g1) attaching a brush cleaning plate having a projection or a brush portion to the pickup head,
(g2) contacting the brush cleaning plate with the brush,
(g3) moving the pick-up head or the brush, and cleaning the brush by suction by the suction unit. The method according to claim 16, further comprising: (h) replacing the brush,
The step (h)
(h1) attaching the brush exchange jig to the pick-up head,
(h2) holding the brush by the brush exchange jig and taking it out of the brush holder. The method according to claim 16, further comprising: (h) replacing the brush,
Wherein the step (h) is performed by rotating the rotating shaft to replace the brush face. 16. The method of claim 15, wherein step (d) comprises: picking up the die on the dicing tape with the pick-
Wherein the step (e) bonding the die picked up with the pick-up head onto the substrate or the die already bonded. 16. The method according to claim 15, wherein the step (d)
(d1) picking up a die on the dicing tape with a pickup head,
(d2) a step of loading the die picked up by the pick-up head onto an intermediate stage,
The step (e)
(e1) picking up a die loaded on the intermediate stage with a bonding head,
(e2) mounting the die picked up with the bonding head on the substrate.

Images