KR20180013746A - Electronic device and manufacturing method thereof - Google Patents

Abstract

The present invention relates to an electronic device and a manufacturing method thereof. The electronic device comprises: a first body; a first substrate having a first conductive layer; a second body facing the first conductive layer and spaced apart from the first conductive layer; a second substrate having a second conductive layer and having a first hole penetrating the second substrate; and a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole.

Description

[0001] ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF [0002]

Cross-reference to related application

This application is related to Japanese Patent Application No. 2016-149571 filed on July 29, 2016, No. 2016-149572 filed on July 29, 2016, No. 2016-149605 filed on July 29, And No. 2017-121427, filed on June 21, 2017, the entire contents of which are incorporated herein by reference.

An embodiment of the present invention relates to an electronic apparatus and a method of manufacturing the same.

BACKGROUND ART [0002] In recent years, various techniques for softening a display device have been studied. In one example, a wiring portion having an in-hole connection portion inside a hole penetrating an inner surface and an outer surface of a resin substrate made of resin and a wiring portion provided on the inner surface of the second substrate made of resin are electrically connected Technology is disclosed.

According to one embodiment,

A first substrate having a first substrate and a first conductive layer; a second substrate facing the first conductive layer and spaced apart from the first conductive layer; and a second conductive layer, A second substrate having a first hole penetrating the gas and a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole.

According to one embodiment,

A first substrate having a first substrate and a first conductive layer; a second substrate facing the first conductive layer and spaced apart from the first conductive layer; and a second conductive layer, A second substrate having a first hole penetrating the substrate and a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole, And a terminal portion connected to the detection portion in a second region adjacent to the first region, wherein the first hole is formed in the terminal portion, A device is provided.

According to one embodiment,

A first substrate having a first substrate and a first conductive layer; a second substrate having a second substrate and a second conductive layer, the second substrate facing the first conductive layer and spaced apart from the first conductive layer; 2 substrate, irradiating the second substrate with a laser beam to form a first hole penetrating the second base, and electrically connecting the first conductive layer and the second conductive layer through the first hole Forming a connection member to be connected to the electronic device.

According to the present embodiment, it is possible to provide a display device and a method of manufacturing the same that are capable of forming a dense film softening and a low cost.

1 is a cross-sectional view showing a structural example of a display device DSP of the present embodiment.
2 is a cross-sectional view showing another configuration example of the display device DSP of the present embodiment.
3 is a cross-sectional view showing another configuration example of the display device DSP of the present embodiment.
4 is a cross-sectional view showing another configuration example of the display device DSP of the present embodiment.
5 is a cross-sectional view showing another configuration example of the display device DSP of the present embodiment.
6 is a cross-sectional view showing another configuration example of the display device DSP of the present embodiment.
7 is a cross-sectional view showing another configuration example of the display device DSP of the present embodiment.
8 is a sectional view showing another configuration example of the display device DSP of the present embodiment.
9A is a cross-sectional view showing another configuration example of the display device DSP of the present embodiment.
9B is a cross-sectional view showing another configuration example of the display device DSP of the present embodiment.
9C is a sectional view showing another example of the configuration of the display device DSP of the present embodiment.
10 is a plan view showing a configuration example of the display device DSP of the present embodiment.
11 is a view showing a basic configuration and an equivalent circuit of the display panel PNL shown in Fig.
12 is a sectional view showing the structure of a part of the display panel PNL shown in Fig.
13 is a plan view showing a configuration example of the sensor SS.
Fig. 14 is a plan view showing another configuration example of the display device DSP of the present embodiment. Fig.
Fig. 15 is a diagram showing a configuration example of a detection portion RS of the detection electrode Rx1 shown in Figs. 10 and 14. Fig.
16A is a cross-sectional view of a display panel PNL cut by an AB line including the connection hole V1 shown in Fig. 10; Fig.
16B is a plan view showing the pad P1 and the second insulating layer 12 shown in Fig. 16A. Fig.
17 is a view for explaining a manufacturing method of the display device DSP of the present embodiment.
18 is a view for explaining a manufacturing method of the display device DSP of the present embodiment.
19 is a view for explaining a manufacturing method of a display device DSP of the present embodiment.
20A is a sectional view showing Comparative Example 1. Fig.
20B is a cross-sectional view showing Comparative Example 2;
21 is a plan view showing a first modification of the embodiment;
22 is a plan view showing a second modification of the embodiment;
23 is a sectional view of a display device DSP cut by a CD line including the terminal portion RT32 shown in Fig.
24 is a sectional view showing a third modification of the embodiment;
25 is a sectional view showing the seal SE and the third conductive layer L3 shown in Fig.
26 is a sectional view showing a structural example of a display device DSP of the present embodiment.
Fig. 27 is a perspective view showing a configuration example of a first hole VA formed in the second base 20. Fig.
28A is a cross-sectional view showing another configuration example of the first hole VA.
28B is a cross-sectional view showing another example of the structure of the first hole VA.
28C is a cross-sectional view showing another configuration example of the first hole VA.
29A is a cross-sectional view showing another configuration example of the first hole VA.
29B is a cross-sectional view showing another example of the structure of the first hole VA.
29C is a cross-sectional view showing another example of the structure of the first hole VA.
30 is an enlarged plan view of the pad P1 shown in Fig. 10; Fig.
31 is a sectional view showing an example of the configuration of a display panel PNL cut by an AB line including the connection hole V1 shown in Fig.
32 is a sectional view showing another configuration example of the display panel PNL;
33 is a cross-sectional view showing another configuration example of the display panel PNL;

Hereinafter, this embodiment will be described with reference to the drawings. It is to be understood that the disclosure is by way of example only and that those skilled in the art can easily overcome the problem of timely modification in the case of keeping the invention in common, as a matter of course included in the scope of the present invention. In the drawings, for the sake of clarity, the widths, thicknesses, shapes, and the like of the respective parts are schematically expressed in comparison with the actual shapes, but they are merely examples and are not intended to limit the interpretation of the present invention . In the present specification and the drawings, constituent elements which perform the same or similar functions as those described above with respect to the drawing of the drawings are denoted by the same reference numerals and redundant detailed explanations may be appropriately omitted.

In this embodiment, a display device is disclosed as an example of an electronic apparatus. This display device can be used for various devices such as a smart phone, a tablet terminal, a mobile phone terminal, a notebook type personal computer, a game machine, and the like. The main structure disclosed in this embodiment is a display device of a self-luminous type such as a liquid crystal display device and an organic electroluminescence display device, a display device of an electronic paper type having an electrophoretic device or the like, a MEMS (Micro Electro Mechanical Systems) A display device using electrochromism, or the like.

≪ First Embodiment: First Configuration Example >

1 is a cross-sectional view showing a first configuration example of a display device DSP of the present embodiment. Although the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, they may intersect at an angle other than 90 degrees. The first direction X and the second direction Y correspond to the direction parallel to the main surface of the substrate constituting the display device DSP, and the third direction Z corresponds to the thickness direction of the display device DSP. Here, a section of a part of the display device DSP in the Y-Z plane defined by the second direction Y and the third direction Z is shown.

The display device DSP includes a first substrate SUB1, a second substrate SUB2, a connection material C, and a wiring substrate SUB3. The first substrate SUB1 and the second substrate SUB2 face the third direction Z. In the following description, the direction from the first substrate SUB1 toward the second substrate SUB2 is referred to as upward (or simply upward), and the direction from the second substrate SUB2 toward the first substrate SUB1 is referred to as downward (or simply below) It is called. Also, viewing from the second substrate SUB2 toward the first substrate SUB1 is referred to as planar. The sectional view of the display device DSP in the Y-Z plane of FIG. 1 (or an X-Z plane defined by the first direction X and the third direction Z, though not shown) is referred to as a cross section.

The first substrate SUB1 includes a first base 10 and a first conductive layer L1 positioned on the side of the first base 10 facing the second substrate SUB2. The first base 10 has a main surface 10A opposed to the second substrate SUB2 and a main surface 10B opposite to the main surface 10A. In the illustrated example, the first conductive layer L1 is located on the main surface 10A. Although not shown, various insulating layers and various conductive layers may be disposed on the first base 10 and the first conductive layer L1, or on the first conductive layer L1.

The second substrate SUB2 includes a second base body 20 and a second conductive layer L2. The second base 20 has a main surface 20A opposed to the first substrate SUB1 and a main surface 20B opposite to the main surface 20A. The main surface 20A of the second base 20 is spaced from the first conductive layer L1 in the third direction Z while facing the first conductive layer L1. In the illustrated example, the second conductive layer L2 is located on the main surface 20B. The first base 10, the first conductive layer L1, the second base 20 and the second conductive layer L2 are arranged in the third direction Z in this order. Although the air layer is located between the first conductive layer L1 and the second base 20, the insulating layer may be located as described later, or the conductive layer may be located in addition to the insulating layer. Although not shown, various insulating layers and various conductive layers may be disposed on the second base 20 and the second conductive layer L2, or on the second conductive layer L2. Various insulating layers and various conductive layers may be disposed between the first substrate SUB1 and the second substrate SUB2.

The first base 10 and the second base 20 are formed of, for example, glass, and more specifically, formed of alkali-free glass. The first base 10 and the second base 20 may be resin substrates. The first conductive layer L1 and the second conductive layer L2 may be formed of a metal material such as molybdenum, tungsten, titanium, aluminum, silver, copper and chromium, an alloy of these metal materials, indium tin oxide (ITO) Or indium zinc oxide (IZO), and may be a single-layer structure or a multilayer structure. It is preferable that the connection material C includes a metallic material such as silver and includes fine particles having a particle diameter of about several nanometers to several tens of nanometers.

The wiring substrate SUB3 is mounted on the first substrate SUB1 and electrically connected to the first conductive layer L1. The wiring substrate SUB3 is, for example, a flexible substrate having flexibility. The flexible substrate applicable to the present embodiment may have at least a flexible portion formed of a bendable material. For example, the wiring board SUB3 of the present embodiment may be a flexible substrate which is entirely formed as a flexible portion, or may be provided with a rigid portion formed of a hard material such as glass epoxy or a flexible portion formed of a bendable material such as polyimide Or a rigid flexible substrate.

Here, the connection structure of the first conductive layer L1 and the second conductive layer L2 in the present embodiment will be described in detail. In the second substrate SUB2, the second base 20 has a first hole VA passing between the main surface 20A and the main surface 20B. In the illustrated example, the first hole VA also penetrates the second conductive layer L2. On the other hand, in the first substrate SUB1, the first conductive layer L1 has the second hole VB opposed to the first hole VA in the third direction Z. The first base 10 has a concave portion CC facing the second hole VB in the third direction Z. [ The concave portion CC, the second hole VB, and the first hole VA are arranged in the third direction Z in this order. The concave portion CC is formed from the main surface 10A toward the main surface 10B but does not penetrate to the main surface 10B in the illustrated example. In one example, the depth of the concave portion CC along the third direction Z is about 1/5 to about 1/2 of the thickness along the third direction Z of the first base 10. The first base 10 may have a hole passing between the main surface 10A and the main surface 10B instead of the concave portion CC. The second hole VB and the concave portion CC are all located immediately below the first hole VA. The first hole VA, the second hole VB, and the concave portion CC are located on the same straight line along the third direction Z to form a connection hole V. [ The connection hole V is formed by irradiating or etching the laser light from above the second substrate SUB2.

The connection member C electrically connects the first conductive layer L1 and the second conductive layer L2 through the first hole VA. In the illustrated example, the connection member C is formed on the upper surface LT2 of the second conductive layer L2 on the second substrate SUB2, the inner surface LS2 of the second conductive layer L2 in the first hole VA, And contacts the inner surface 20S of the base 20, respectively. These inner surfaces LS2 and 20S form the inner surface of the first hole VA. The connection member C is also in contact with the inner surface LS1 and the recess CC of the first conductive layer L1 in the second hole VB in the first substrate SUB1. The inner surface LS1 forms the inner surface of the second hole VB. In the illustrated example, the connection member C is filled so as to fill the first hole VA, the second hole VB and the concave portion CC, but may be provided at least on the inner surface thereof. The connection material C is continuously formed between the first conductive layer L1 and the second conductive layer L2 without interruption.

Thereby, the second conductive layer L2 is electrically connected to the wiring substrate SUB3 through the connection material C and the first conductive layer L1. As a result, the control circuit for writing a signal to the second conductive layer L2 or reading the signal output from the second conductive layer L2 can be connected to the second conductive layer L2 via the wiring substrate SUB3.

20A is a cross-sectional view showing Comparative Example 1; In this Comparative Example 1, the second conductive layer L2 is not connected to the first conductive layer L1. Therefore, the wiring board SUB4 connected to the second conductive layer L2 is required to write signals to the second conductive layer L2 or to read signals output from the second conductive layer L2. That is, in Comparative Example 1, in addition to the wiring substrate SUB3 mounted on the first substrate SUB1, the wiring substrate SUB4 mounted on the second substrate SUB2 is required.

20B is a sectional view showing Comparative Example 2. Fig. Comparative Example 2 differs from Comparative Example 1 in that an organic insulating layer OI is provided between the first substrate SUB1 and the second substrate SUB2.

20A) and Comparative Example 2 (see Fig. 20B) in which the wiring substrate SUB4 is mounted on the second substrate SUB2 in addition to the wiring substrate SUB3 mounted on the first substrate SUB1, It is not necessary to mount the wiring substrate SUB4 shown in Figs. 20A and 20B on the second substrate SUB2 in order to connect the second conductive layer L2 and the control circuit. Further, a terminal for mounting the wiring substrate SUB4 and a wiring for connecting the second conductive layer L2 and the wiring substrate SUB4 are not required. Thus, the substrate size of the second substrate SUB2 can be reduced in the X-Y plane defined by the first direction X and the second direction Y, and the liquid coupling width at the periphery of the display device DSP can be reduced. In addition, the cost of the unnecessary wiring substrate SUB4 can be reduced. As a result, it becomes possible to make the dense fluid softening and the cost lower.

Next, another configuration example of the present embodiment will be described with reference to Figs. 2 to 9C, respectively.

≪ Second Configuration Example &

The second configuration example shown in Fig. 2 differs from the first configuration example shown in Fig. 1 in that the connection material C is in contact with the upper surface LT1 of the first conductive layer L1. That is, the connection member C has a side surface CA positioned between the first substrate SUB1 and the second substrate SUB2. The side surface CA is located outside the position overlapping with the first hole VA and the second hole VB and is located between the first conductive layer L1 and the second base 20 in the illustrated example.

Also in this second configuration example, the same effect as that of the first configuration example can be obtained. In addition, since the connection material C is in contact with not only the inner surface LS1 of the first conductive layer L1 in the second hole VB but also the upper surface LT1 of the first conductive layer L1, the contact area of the connection material C with the first conductive layer L1 It is possible to suppress the connection failure between the connection material C and the first conductive layer L1.

«Third Configuration Example»

The third configuration example shown in Fig. 3 is different from the second configuration example shown in Fig. 2 in that the display device DSP includes an organic insulation layer OI positioned between the first conductive layer L1 and the second base 20 And the organic insulating layer OI has a third hole VC connected to the first hole VA and the second hole VB. Here, the organic insulating layer OI includes, for example, a second insulating layer, a light-shielding layer, a color filter, an overcoat layer, an orientation film, a seal for bonding the first substrate SUB1 and the second substrate SUB2 described later, and the like. 12, the second insulating layer 12, the first alignment film AL1, and the like are provided on the first substrate SUB1, and the light-shielding layer BM, the color filter CF, the overcoat layer OC, the second alignment film AL2, And is provided on the substrate SUB2. However, the organic insulating layer OI in the present embodiment may not be entirely formed by the organic insulating layer, and an inorganic insulating layer may be included in a part of the organic insulating layer OI.

The third hole VC extends in the second direction Y as compared with the first hole VA and the second hole VB. In addition, the third hole VC extends not only in the second direction Y but also over the entirety of the first hole VA and the second hole VB in the X-Y plane. The concave portion CC, the second hole VB, the third hole VC, and the first hole VA are arranged in the third direction Z in this order. The organic insulating layer OI is in contact with the top surface LT1 of the first conductive layer L1, but exposes a part of the top surface LT1 in the third hole VC.

The connection member C is provided seamlessly in the first hole VA, the second hole VB, and the third hole VC, and electrically connects the first conductive layer L1 and the second conductive layer L2. The connection member C contacts the inner surface OIS of the organic insulating layer OI and also contacts the inner surface LS1 of the first conductive layer L1 and the upper surface LT1 of the first conductive layer L1 in the first substrate SUB1.

The same effect can also be obtained in the third configuration example. In addition, since the connection material C is also in contact with the inner surface LS1 and the upper surface LT1 of the first conductive layer L1 at the third hole VC of the organic insulating layer OI, the contact area of the connection material C with the first conductive layer L1 can be increased So that the connection failure between the connection material C and the first conductive layer L1 can be suppressed.

In this example, the third hole VC is extended as compared with the first hole VA and the second hole VB. However, when sufficient conductivity can be obtained between the connection material C and the first conductive layer L1, The diameter of the hole VC may be equal to or smaller than the diameter of each of the first hole VA and the second hole VB in the XY plane.

≪ Fourth Configuration Example &

The fourth configuration example shown in Fig. 4 differs from the third configuration example shown in Fig. 3 in that the second substrate SUB2 includes a protection material PF covering the second conductive layer L2 and the connection material C. In the illustrated example, the protection material PF also covers the main surface 20B of the second base 20. Further, when the connection member C is provided on the inner surfaces of the first hole VA, the second hole VB and the third hole VC and is not charged in the vicinity of the central portion of each hole, the connection member C has a hollow portion. In this case, the protection member PF may be filled in the hollow portion of the connection member C. The protective material PF is formed of an organic insulating material such as acrylic resin, for example.

The same effect can also be obtained in the fourth configuration example. In addition, the second conductive layer L2 and the connection material C can be protected.

«Fifth Configuration Example»

The fifth configuration example shown in Fig. 5 differs from the third configuration example shown in Fig. 3 in that the second substrate SUB2 includes a protection material PF1 covering the second conductive layer L2. Although the second conductive layer L2 and the main surface 20B of the second base 20 are covered with the protection material PF1 in the illustrated example, the periphery of the first hole VA in the second conductive layer L2 is not covered with the protection material PF1 not. The connection member C contacts the upper surface LT2 of the second conductive layer L2 around the first hole VA and further contacts the upper surface T3 of the protection material PF1 around the first hole VA.

In the fifth configuration example, the same effect can be obtained, and the second conductive layer L2 can be protected.

Hereinafter, an example of a manufacturing method applicable to the fifth constitutional example will be described.

In the first manufacturing method, after the protective material PF1 is formed on the entire surface of the second substrate SUB2, the protective material PF1 is removed over a region that is larger than a region where the first hole VA is formed. The protective material PF1 is formed of an organic insulating material in an example, but may be formed of an inorganic insulating material. As a method for removing the protective material PF1, a method of irradiating a laser beam, a method of patterning using a photolithography technique, and the like can be applied. In the case of applying the laser irradiation method in removing the protective material PF1 formed by the organic insulating material, the protective material PF1 is removed over a region larger than the region irradiated with the laser. Thereafter, the first hole VA is formed, and the connection member C is formed. Formation examples of the first hole VA and the connection member C will be described later.

In the second manufacturing method, the protective material PF1 is selectively formed except for a region that is larger than the region where the first hole VA is formed. Thereafter, the first hole VA is formed, and the connection member C is formed.

By applying this manufacturing method, a step is formed between the second conductive layer L2 and the protective material PF1 in the periphery of the first hole VA. As a result, when the connection member C is formed in the first hole VA, the connection member C is less likely to climb over the protection member PF1, so that excessive expansion of the connection member C can be suppressed.

«Sixth Configuration Example»

The sixth configuration example shown in Fig. 6 differs from the fifth configuration example shown in Fig. 5 in that the second substrate SUB2 is provided with the protection material PF2 covering the connection material C. Fig. In the illustrated example, the protection material PF2 is in contact with the protection material PF1 around the connection material C. The protection material PF2 may be filled in the hollow portion when the connection member C has a hollow portion. The protection material PF2 may be disposed so as to cover not only the periphery of the connection material C but also the protection material PF1. Also in the sixth configuration example, the same effect can be obtained, and the second conductive layer L2 and the connection material C can be protected.

≪ Seventh Configuration Example &

The seventh configuration example shown in Fig. 7 differs from the third configuration example shown in Fig. 3 in that the organic insulating layer OI includes the conductive particles CP therein. Also in the seventh configuration example, the same effect can be obtained. In addition, even when the conductive particles CP come into contact with the connection material C located at the third hole VC, even if the connection material C is cut off at the third hole VC, the disconnected connection materials C can be conducted by the conductive particles CP, .

≪ Eighth Configuration Example &

The eighth configuration example shown in Fig. 8 is different from the third configuration example shown in Fig. 3 in that the connection material C is provided on the inner surfaces of the first hole VA, the second hole VB, the third hole VC, And the conductive filler FM is filled in the hollow portion of the connection member C. The filler FM is, for example, a paste obtained by curing a paste containing conductive particles such as silver. The same effect can also be obtained in the eighth configuration example. In addition, even if the connection material C is cut off, the filler FM can electrically connect the first conductive layer L1 and the second conductive layer L2, and reliability can be improved. In addition, it is possible to alleviate the step in the third direction Z due to the hollow portion formed in the connection member C.

Ninth Configuration Example

The ninth configuration example shown in Fig. 9A differs from the eighth configuration example shown in Fig. 8 in that a hollow portion of the connection member C is filled with an insulating filler FI. The filler FI is formed, for example, by an organic insulating material. Also in the ninth configuration example, in addition to the above-described effect, the connection material C can be protected.

≪ 10th Configuration Example &

The tenth configuration example shown in Fig. 9B differs from the third configuration example shown in Fig. 3 in that the connection hole V is formed at a position different from the organic insulation layer OI. In the illustrated example, the connection hole V is located closer to the wiring substrate SUB3 than the organic insulation layer OI. Alternatively, the connection hole V is located between the organic insulating layer OI and the end portion 20E of the second base 20. The organic insulating layer OI includes, for example, a seal for bonding the first substrate SUB1 and the second substrate SUB2. The same effect can also be obtained in the tenth configuration example.

11th Configuration Example

9C is different from the third configuration example shown in Fig. 3 in that the first base body 10 and the second base body 20 In the organic insulating layer OIB. The organic insulating layer OIA is located between the organic insulating layer OIB and the end portion 20E of the second base 20. The organic insulating layer OIB includes, for example, a seal for bonding the first substrate SUB1 and the second substrate SUB2. The organic insulating layer OIA includes, for example, various organic insulating layers provided on the first substrate SUB1 and various organic insulating layers provided on the second substrate SUB2. The same effect can also be obtained in the eleventh configuration example.

&Quot; Display device with sensor "

10 is a plan view showing a configuration example of the display device DSP of the present embodiment. Here, as an example of the display device DSP, a liquid crystal display device on which the sensor SS is mounted will be described.

The display device DSP includes a display panel PNL, an IC chip I1, a wiring board SUB3, and the like. The display panel PNL is a liquid crystal display panel and includes a first substrate SUB1, a second substrate SUB2, a seal SE, and a display functional layer (liquid crystal layer LC described later). The second substrate SUB2 is opposed to the first substrate SUB1. The seal SE corresponds to a part indicated by oblique lines rising to the right in Fig. 10, and adheres the first substrate SUB1 and the second substrate SUB2.

The display panel PNL includes a display area DA for displaying an image, and a non-display area NDA in the form of a grapple surrounding the display area DA. The display area DA corresponds to, for example, the first area, and is located on the inner side surrounded by the seal SE. The non-display area NDA corresponds to, for example, a second area adjacent to the display area (first area) DA. The seal SE is located in the non-display area NDA.

The IC chip I1 is mounted on the wiring board SUB3. In addition, the IC chip I1 may be mounted on the first substrate SUB1 extending outwardly from the second substrate SUB2, or may be mounted on an external circuit board connected to the wiring substrate SUB3. The IC chip I1 includes, for example, a display driver DD for outputting a signal necessary for displaying an image. The display driver DD here includes at least a part of the signal line driver circuit SD, the scanning line driver circuit GD and the common electrode driver circuit CD which will be described later. In the illustrated example, the IC chip I1 incorporates a detection circuit RC that functions as a touch panel controller or the like. Further, the detection circuit RC may be built in another IC chip different from the IC chip I1.

The display panel PNL is a transmissive type having a transmissive display function for displaying an image by selectively transmitting light from below the first substrate SUB1, for example, by selectively reflecting light from above the second substrate SUB2, A reflective type having a reflective display function for displaying an image, or a transflective type having a transmissive display function and a reflective display function may be used.

The sensor SS performs sensing for detecting contact or approach of the object to be detected with respect to the display device DSP. The sensor SS includes a plurality of detection electrodes Rx (Rx1, Rx2, ...). The detection electrode Rx is provided on the second substrate SUB2 and corresponds to the above-described second conductive layer L2. These detection electrodes Rx extend in the first direction X and are arranged at intervals in the second direction Y, respectively. In Fig. 10, the detection electrodes Rx1 to Rx4 are shown as the detection electrodes Rx. In this case, the detection electrode Rx1 will be noted, and a structural example thereof will be described.

That is, the detection electrode Rx1 includes a detection portion RS, a terminal portion RT1, and a connection portion CN.

The detection unit RS is located in the display area DA and extends in the first direction X. In the detection electrode Rx1, the detection unit RS is mainly used for sensing. In the illustrated example, the detection portion RS is formed in a band shape, but more specifically, as described with reference to Fig. 15, the detection portion RS is formed of an aggregate of fine metal wires. Although one detection electrode Rx1 includes two detection units RS, it may be provided with three or more detection units RS, or one detection unit RS.

The terminal portion RT1 is located at one end along the first direction X of the non-display region NDA and is connected to the detection portion RS. The connecting portion CN is located at the other end side in the first direction X of the non-display area NDA and connects the plurality of detecting portions RS to each other. In Fig. 10, one end corresponds to the left side of the display area DA, and the other end corresponds to the right side of the display area DA. A part of the terminal portion RT1 is formed at a position overlapping with the seal SE at a plan view.

On the other hand, the first substrate SUB1 includes a pad P1 and a wiring W1 corresponding to the above-described first conductive layer L1. The pad P1 and the wiring W1 are located on one end side of the non-display area NDA and overlap with the seal SE in a plan view. The pad P1 is formed at a position overlapping with the terminal portion RT1 in a plan view. Although the pad P1 is formed in a trapezoidal shape in one example, it may be formed in another polygonal shape, a circular shape, or an elliptical shape. The wiring W1 is connected to the pad P1, extends along the second direction Y, and is electrically connected to the detection circuit RC of the IC chip I1 via the wiring substrate SUB3.

The connection hole V1 is formed at a position where the terminal portion RT1 and the pad P1 are opposed to each other. Further, the connection hole V1 may penetrate the second substrate SUB2 including the terminal portion RT1 and the seal SE, and may penetrate the pad P1. In the illustrated example, the connection hole V1 is circular in plan view, but its shape is not limited to the illustrated example, and may be another shape such as an ellipse. As described with reference to Fig. 1 and the like, a connection member C is provided in the connection hole V1. Thereby, the terminal portion RT1 and the pad P1 are electrically connected. That is, the detection electrode Rx1 provided on the second substrate SUB2 is electrically connected to the detection circuit RC via the wiring substrate SUB3 connected to the first substrate SUB1. The detection circuit RC reads out the sensor signal output from the detection electrode Rx, detects whether or not the object to be inspected is in contact or approaches, and detects the position coordinates of the object to be detected.

In the illustrated example, odd-numbered detection electrodes Rx1, Rx3 ... Each of the terminal portions RT1, RT3 ... , Pads P1, P3 ... , Wirings W1, W3 ... , Connection holes V1, V3 ... Are all located at one end side of the non-display area NDA. Further, even-numbered detection electrodes Rx2, Rx4 ... Each terminal portion RT2, RT4 ... , Pads P2, P4 ... , Wirings W2, W4 ... , Connection holes V2, V4 ... Are all located on the other end side of the non-display area NDA. According to such a layout, the width of one end side and the width of the other end side in the non-display area NDA can be made uniform, which is suitable for the coarse liquid softening.

As shown in the drawing, in the layout in which the pad P3 is closer to the wiring board SUB3 than the pad P1, the wiring W1 bypasses the inside of the pad P3 (that is, the side close to the display area DA), and between the pad P3 and the wiring substrate SUB3 And is disposed in parallel with the inside of the wiring W3. Likewise, the wiring W2 bypasses the inside of the pad P4 and is arranged in parallel to the inside of the wiring W4 between the pad P4 and the wiring substrate SUB3.

11 is a diagram showing a basic configuration and an equivalent circuit of the display panel PNL shown in Fig. The display panel PNL includes a plurality of pixels PX in the display area DA. Here, the pixel means a minimum unit which can be individually controlled according to the pixel signal, and exists in a region including a switching element arranged at a position where, for example, a scanning line and a signal line intersect with each other as described later. The plurality of pixels PX are arranged in a matrix in the first direction X and the second direction Y. The display panel PNL includes a plurality of scanning lines G (G1 to Gn), a plurality of signal lines S (S1 to Sm), a common electrode CE, and the like in the display area DA. The scanning lines G extend in the first direction X and are arranged in the second direction Y, respectively. The signal lines S extend in the second direction Y and are arranged in the first direction X, respectively. In addition, the scanning lines G and the signal lines S may not necessarily be linearly extended, and some of them may be bent. The common electrode CE is arranged over a plurality of pixels PX. The scanning line G, the signal line S, and the common electrode CE are drawn out to the non-display area NDA, respectively. In the non-display area NDA, the scanning line G is connected to the scanning line driving circuit GD, the signal line S is connected to the signal line driving circuit SD, and the common electrode CE is connected to the common electrode driving circuit CD. The signal line driver circuit SD, the scanning line driver circuit GD, and the common electrode driver circuit CD may be formed on the first substrate SUB1, or some or all of them may be embedded in the IC chip I1 shown in Fig.

Each pixel PX includes a switching element SW, a pixel electrode PE, a common electrode CE, a liquid crystal layer LC, and the like. The switching element SW is constituted by, for example, a thin film transistor (TFT), and is electrically connected to the scanning line G and the signal line S. More specifically, the switching element SW includes a gate electrode WG, a source electrode WS, and a drain electrode WD. The gate electrode WG is electrically connected to the scanning line G. In the illustrated example, an electrode electrically connected to the signal line S is referred to as a source electrode WS, and an electrode electrically connected to the pixel electrode PE is referred to as a drain electrode WD.

The scanning lines G are connected to the switching elements SW in each of the pixels PX arranged in the first direction X. [ The signal lines S are connected to the switching elements SW in each of the pixels PX arranged in the second direction Y. [ Each of the pixel electrodes PE is opposed to the common electrode CE and drives the liquid crystal layer LC by an electric field generated between the pixel electrode PE and the common electrode CE. The holding capacitor CS is formed, for example, between the common electrode CE and the pixel electrode PE.

12 is a cross-sectional view showing a structure of a part of the display panel PNL shown in Fig. Here, a cross-sectional view of the display device DSP taken along the first direction X is shown. The illustrated display panel PNL has a configuration corresponding to a display mode mainly using a transverse electric field substantially parallel to the main surface of the substrate. Further, the display panel PNL may have a configuration corresponding to an electric current system vertical to the main surface of the substrate, an electric field in an oblique direction with respect to the main surface of the substrate, or a display mode using a combination thereof. In the display mode using the transversal electric field, for example, a configuration in which both the pixel electrode PE and the common electrode CE are provided on either the first substrate SUB1 or the second substrate SUB2 is applicable. In the display mode using the electric field or the tilting electric field, for example, either the pixel electrode PE or the common electrode CE is provided on the first substrate SUB1, and the other of the pixel electrode PE and the common electrode CE is provided on the second substrate SUB2 Configuration is applicable. Here, the main surface of the substrate is a surface parallel to the X-Y plane.

The first substrate SUB1 includes a first substrate 10, a signal line S, a common electrode CE, a metal layer M, a pixel electrode PE, a first insulating layer 11, a second insulating layer 12, a third insulating layer 13, , A first alignment film AL1, and the like. Here, switching elements, scanning lines, and various insulating layers interposed therebetween are omitted.

The first insulating layer 11 is located on the first base 10. A semiconductor layer of a scanning line or a switching element (not shown) is located between the first base 10 and the first insulating layer 11. The signal line S is located on the first insulating layer 11. The second insulating layer 12 is located above the signal line S and the first insulating layer 11. The common electrode CE is located on the second insulating layer 12. [ The metal layer M is in contact with the common electrode CE just above the signal line S. Although the metal layer M is located on the common electrode CE in the illustrated example, the metal layer M may be located between the common electrode CE and the second insulating layer 12. The third insulating layer 13 is located on the common electrode CE and the metal layer M. The pixel electrode PE is located on the third insulating layer 13. [ The pixel electrode PE is opposed to the common electrode CE through the third insulating layer 13. The pixel electrode PE has a slit SL at a position facing the common electrode CE. The first alignment film AL1 covers the pixel electrode PE and the third insulating layer 13.

The scanning line G, the signal line S, and the metal layer M are formed of a metal material such as molybdenum, tungsten, titanium, or aluminum, and may have a single layer structure or a multilayer structure. The common electrode CE and the pixel electrode PE are formed of a transparent conductive material such as ITO or IZO. The first insulating layer 11 and the third insulating layer 13 are inorganic insulating layers, and the second insulating layer 12 is an organic insulating layer.

The configuration of the first substrate SUB1 is not limited to the example shown in the drawings and the pixel electrode PE may be disposed between the second insulating layer 12 and the third insulating layer 13 and the common electrode CE may be disposed between the third insulating layer 13) and the first alignment film AL1. In this case, the pixel electrode PE is formed in a flat plate shape having no slit, and the common electrode CE has a slit opposed to the pixel electrode PE. Further, both of the pixel electrode PE and the common electrode CE may be formed in a comb-like shape and arranged so as to be engaged with each other.

The second substrate SUB2 includes a second substrate 20, a light-shielding layer BM, a color filter CF, an overcoat layer OC, a second alignment film AL2, and the like.

The light blocking layer BM and the color filter CF are located on the side of the second substrate 20 facing the first substrate SUB1. The light-shielding layer BM is located just above the signal line S, dividing each pixel. The color filter CF is opposed to the pixel electrode PE, and a part thereof overlaps with the light-shielding layer BM. The color filter CF includes a red color filter, a green color filter, a blue color filter and the like. The overcoat layer OC covers the color filter CF. The second alignment film AL2 covers the overcoat layer OC.

The color filter CF may be disposed on the first substrate SUB1. The color filter CF may include color filters of four or more colors. A white color filter may be disposed for a pixel displaying white, a colorless resin material may be disposed, or an overcoat layer OC may be disposed without arranging a color filter.

The detection electrode Rx is located on the main surface 20B of the second base 20. As described above, the detection electrode Rx corresponds to the second conductive layer L2. The detection electrode Rx may be formed of a conductive layer containing a metal, a transparent conductive material such as ITO or IZO, or a transparent conductive layer Or may be formed of a conductive organic material or a dispersion of a fine conductive material or the like.

The first optical element OD1 including the first polarizer PL1 is located between the first base 10 and the illuminator BL. The second optical element OD2 including the second polarizing plate PL2 is located above the detection electrode Rx. The first optical element OD1 and the second optical element OD2 may include a retarder if necessary.

Next, a configuration example of the sensor SS mounted on the display device DSP of the present embodiment will be described. The sensor SS described below is a capacitive type mutual capacitance type, for example, and detects contact or approach of an object to be detected based on a change in capacitance between a pair of electrodes facing each other with a dielectric interposed therebetween will be.

13 is a plan view showing a configuration example of the sensor SS.

In the illustrated configuration example, the sensor SS includes a sensor driving electrode Tx and a detection electrode Rx. In the illustrated example, the sensor driving electrode Tx corresponds to a portion indicated by a slanting line to the right and is provided on the first substrate SUB1. Further, the detection electrode Rx corresponds to a part indicated by oblique lines rising to the right, and is provided on the second substrate SUB2. The sensor driving electrode Tx and the detecting electrode Rx intersect each other in the X-Y plane. The detection electrode Rx is opposed to the sensor drive electrode Tx in the third direction Z.

The sensor driving electrode Tx and the detection electrode Rx are located in the display area DA, and a part of them extend to the non-display area NDA. In the illustrated example, each of the sensor driving electrodes Tx has a band-like shape extending in the second direction Y and is arranged at an interval in the first direction X. The detection electrodes Rx extend in the first direction X and are arranged at intervals in the second direction Y, respectively. As described with reference to Fig. 10, the detection electrode Rx is connected to a pad provided on the first substrate SUB1, and electrically connected to the detection circuit RC via a wiring. Each of the sensor driving electrodes Tx is electrically connected to the common electrode driving circuit CD via a wiring WR. The number, size, and shape of the sensor driving electrode Tx and the detecting electrode Rx are not particularly limited and may be variously changed.

The sensor driving electrode Tx includes the common electrode CE described above and has a function of generating an electric field between the pixel electrodes PE and a function for detecting the position of the object to be detected by generating a capacitance between the detecting electrode Rx and the detecting electrode Rx I have.

The common electrode driving circuit CD supplies a common driving signal to the sensor driving electrode Tx including the common electrode CE at the time of display driving for displaying an image in the display area DA. Further, the common electrode drive circuit CD supplies a sensor drive signal to the sensor drive electrode Tx during sensing drive for sensing. The detection electrode Rx outputs a sensor signal required for sensing (that is, a signal based on a change in inter-electrode capacitance between the sensor driving electrode Tx and the detection electrode Rx) in accordance with the supply of the sensor driving signal to the sensor driving electrode Tx. The detection signal output from the detection electrode Rx is input to the detection circuit RC shown in Fig.

In addition, the sensor SS in each of the above-described configurations detects the object to be detected based on the change in capacitance between the pair of electrodes (the capacitance between the sensor driving electrode Tx and the detection electrode Rx in the above example) The capacitance detection method is not limited to the mutual capacitance method in which the detection subject is detected based on the change of the capacitance of the detection electrode Rx.

14 is a plan view showing another configuration example of the display device DSP of the present embodiment. The configuration example shown in Fig. 14 is different from the configuration example shown in Fig. 10 in that detection electrodes Rx1, Rx2, Rx3 ... Extend in the second direction Y and are arranged at intervals in the first direction X. [ In the illustrated example, the detection part RS extends in the second direction Y in the display area DA. Further, the terminal portions RT1, RT2, RT3 ... Are arranged at intervals in the first direction X between the display area DA and the wiring substrate SUB3. Connection holes V1, V2, V3 ... Are arranged in the first direction X at intervals. Although not shown, the display device DSP may include a sensor driving electrode extending in the first direction X and arranged in the second direction Y at intervals.

The configuration example shown in Fig. 14 is applicable to the sensor SS of the magnetic capacity type using the detection electrode Rx and also to the sensor SS of the mutual capacitance type using the sensor drive electrode and the detection electrode Rx (not shown).

Fig. 15 is a diagram showing a configuration example of the detection portion RS of the detection electrode Rx1 shown in Figs. 10 and 14. Fig.

In the example shown in Fig. 15 (A), the detection portion RS is formed by a mesh-shaped metal fine line MS. The metal thin line MS is connected to the terminal RT1. In the example shown in FIG. 15 (B), the detection portion RS is formed by a wavy metal wire MW. In the illustrated example, the metal fine wire MW has a sawtooth shape, but may have another shape such as a sine wave shape. The metal thin wire MW is connected to the terminal RT1.

The terminal portion RT1 is formed of the same material as the detection portion RS, for example. In the terminal portion RT1, a circular connection hole V1 is formed.

16A is a cross-sectional view of a display panel PNL cut by the line A-B including the connection hole V1 shown in Fig. Here, only essential parts necessary for explanation are shown.

The first substrate SUB1 includes a first base 10, a pad P1 corresponding to the first conductive layer L1, a second insulating layer 12 corresponding to the organic insulating layer, and the like. The first conductive layer L1 is formed of the same material as the signal line S shown in Fig. 12, for example. The first insulating layer 11 and another insulating layer or another conductive layer shown in FIG. 12 are formed between the first base 10 and the pad P1 and between the first base 10 and the second insulating layer 12 .

The second substrate SUB2 includes a second base 20, a detection electrode Rx1 corresponding to the second conductive layer L2, a light-shielding layer BM corresponding to the organic insulating layer, and an overcoat layer OC.

The seal SE corresponds to the organic insulating layer and is located between the second insulating layer 12 and the overcoat layer OC. The liquid crystal layer LC is located in the gap between the first substrate SUB1 and the second substrate SUB2. Although not shown, the metal layer M, the third insulating layer 13, and the first alignment film AL1 shown in Fig. 12 may be interposed between the second insulating layer 12 and the seal SE. The second alignment film AL2 shown in Fig. 12 may be interposed between the overcoat layer OC and the seal SE.

The connection hole V1 has a first hole VA passing through the terminal portion RT of the second base 20 and the detection electrode Rx, a second hole VB passing through the pad P1, a third hole VC passing through the various organic insulating layers, And a concave portion CC formed in the base body 10. The third hole VC has a first portion VC1 passing through the second insulating layer 12, a second portion VC2 passing through the seal SE, and a third portion VC3 passing through the light-shielding layer BM and the overcoat layer OC. The connection member C is provided in the connection hole V1 and electrically connects the pad P1 and the detection electrode Rx.

The second insulating layer 12 is located between the pad P1 and the second base 20 and contacts the upper surface LT1 of the pad P1. The connection member C is in contact with the upper surface LT1 of the pad P1 and the inner surface LS1 of the pad P1 in the second hole VB.

16B is a plan view showing the pad P1 and the second insulating layer 12 shown in Fig. 16A.

In plan view, the size of the first portion VC1 is larger than the size of the second hole VB. The region RA of the upper surface LT1 of the pad P1 that is in contact with the connection material C is a region where the first portion VC1 does not cover the second insulating layer 12. [ In the present embodiment, the area RA is formed in an annular shape in plan view. The area RA is given an oblique line. The shape of the second hole VB and the first portion VC1 is formed in a circular shape in a plan view (X-Y plane). The width W21 of the first portion VC1 along the first direction X is larger than the width W22 of the second hole VB along the first direction X. [ When the shape of the second hole VB and the first portion VC1 is circular in plan view, the width of the first portion VC1 along the second direction Y is larger than the width of the second hole VB along the second direction Y . Further, the second hole VB and the first portion VC1 are not limited to the source, but may be other circular shapes such as an elliptical shape or a shape other than a circular shape. For example, when the second hole VB and the first portion VC1 are formed in an elliptical shape, these widths may be a width corresponding to the length of the major axis (long diameter) or a width corresponding to the length of the minor axis (short diameter) do. Further, the second hole VB and the first portion VC1 may be formed by skewing these contours. In addition, the shape of the area RA is not limited to an annular shape, and various modifications are possible.

According to the display device DSP having the sensor SS described above, the detection electrode Rx provided on the second substrate SUB2 is connected to the pad P provided on the first substrate SUB1 by the connection material C provided in the connection hole V. This eliminates the need to mount the wiring substrate for connecting the detection electrode Rx and the detection circuit RC to the second substrate SUB2. That is, the wiring board SUB3 mounted on the first substrate SUB1 forms a transmission path for transmitting a signal necessary for displaying an image on the display panel PNL, and also for transmitting a signal between the detection electrode Rx and the detection circuit RC Thereby forming a transmission path. Therefore, the number of wiring boards can be reduced, and the cost can be reduced, as compared with a configuration example requiring a separate wiring board in addition to the wiring board SUB3. In addition, since a space for connecting the wiring substrate to the second substrate SUB2 is unnecessary, the width of the non-display region of the display panel PNL, in particular, the short side where the wiring substrate SUB3 is mounted can be reduced. As a result, it becomes possible to make the dense fluid softening and the cost lower.

<< Manufacturing Method of Display Device >>

Next, an example of a method of manufacturing the above-described display device DSP will be described with reference to Figs. 17 to 19. Fig.

First, as shown in Fig. 17 (A), a display panel PNL is prepared. The illustrated display panel PNL includes a first substrate SUB1 having at least a first substrate 10 and a first conductive layer L1 and a second substrate SUB2 having at least a second substrate 20 and a second conductive layer L2 Respectively. In this display panel PNL, the second substrate 20 faces the first conductive layer L1, and the second substrate 20 is separated from the first conductive layer L1, the first substrate SUB1 and the second substrate 20 SUB2 are bonded by the seal SE. Here, the first conductive layer L 1 corresponds to, for example, the pad P 1 shown in FIG. 16A, and the second conductive layer L 2 corresponds to, for example, the detection electrode Rx 1 shown in FIG. 16A.

An example of such a manufacturing method of the display panel PNL will be described. That is, the first substrate SUB1 in which the first conductive layer L1, the second insulating layer 12, and the like are formed on the main surface 10A of the first substrate 10 is prepared. On the other hand, a second substrate SUB2 on which the light-shielding layer BM, the overcoat layer OC, and the like are formed on the main surface 20A of the second base 20 is prepared. At this point, the second conductive layer is not formed on the main surface 20B of the second substrate SUB2. A loop-shaped seal SE is formed on either one of the first substrate SUB1 and the second substrate SUB2, and a liquid crystal material is dropped to the inside of the seal SE. Thereafter, the first substrate SUB1 and the second substrate SUB2 are bonded, and the seal SE is cured to bond the first substrate SUB1 and the second substrate SUB2. Thereafter, the first base body 10 and the second base body 20 are etched by an etchant such as hydrofluoric acid (HF) to thin the first base body 10 and the second base body 20, respectively. Thereafter, the second conductive layer L2 is formed on the main surface 20B of the second base 20. Thereby, the display panel PNL shown in Fig. 17A is manufactured.

Another example of the manufacturing method of the display panel PNL will be described. That is, while the first substrate SUB1 is prepared and the light-shielding layer BM, the overcoat layer OC, and the like are formed on the main surface 20A of the second base body 20, the main surface 20a of the second base body 20 The second substrate SUB2 having the second conductive layer L2 formed thereon is prepared. Thereafter, a seal SE is formed and the liquid crystal material is dropped, and then the first substrate SUB1 and the second substrate SUB2 are bonded. Thereby, the display panel PNL shown in Fig. 17A is manufactured.

Next, as shown in Fig. 17B, the second substrate SUB2 is irradiated with the laser light L. As shown in Fig. In the illustrated example, the laser light L is irradiated from above the second conductive layer L2. As the laser light source, for example, a carbon dioxide gas laser device or the like can be applied, but any material that can perform punching processing on a glass material and an organic material can be used, and an excimer laser device or the like is also applicable.

As a result of the irradiation of the laser light L, a first hole VA is formed through the second base 20 and the second conductive layer L2, as shown in Fig. 17C. In the illustrated example, when the laser light L is irradiated, the light-shielding layer BM immediately under the first hole VA and the third portion VC3 passing through the overcoat layer OC, the seal portion located just below the third portion VC3 SE, a first portion VC1 passing through the second insulating layer 12 immediately below the second portion VC2, a first conductive layer L1 directly under the first portion VC1, The concave portion CC of the first base body 10 located immediately below the second hole VB and the second hole VB is formed at the same time. Thus, a connection hole V1 for connecting the first conductive layer L1 and the second conductive layer L2 is formed.

When thermal energy is applied to the display panel PNL by the irradiation of the laser light L, the organic insulating material forming the second insulating layer 12 is more likely to sublimate than the metal material forming the pad P1. As described above, the third hole VC is formed so as to extend beyond the first hole VA and the second hole VB.

Subsequently, as shown in Fig. 18, a connection material C for electrically connecting the first conductive layer L1 and the second conductive layer L2 is formed.

More specifically, first, as shown in Fig. 18 (A), after the display panel PNL is installed in the chamber CB, the air in the chamber CB is discharged, and under vacuum (under an atmosphere of atmospheric pressure lower than atmospheric pressure) And the connection material C is injected into the first hole VA. At this time, the connection material C does not flow into the first conductive layer L1, and a space SP is formed between the connection material C and the first conductive layer L1. However, the space SP is a vacuum.

Thereafter, as shown in Fig. 18B, by introducing a gas such as air or an inert gas into the chamber CB, the degree of vacuum is lowered. By the difference in air pressure around the space SP and the display panel PNL, And flows into the third hole VC, the second hole VB, and the concave portion CC from the first hole VA to bring the connection material C into contact with the first conductive layer L1. The connection member C is in contact with the inner surface LS1 and the upper surface LT1 of the first conductive layer L1.

Thereafter, as shown in Fig. 18C, by removing the solvent contained in the connection material C, the volume of the connection material C is reduced, and the hollow portion HL is formed. The connection member C formed in this manner is in contact with the second conductive layer L2 and the second base 20 in the first hole VA, and in the third hole VC, the light-shielding layer BM, the overcoat layer OC, the seal SE, Contact with the first conductive layer L1 in the second hole VB and in contact with the first base body 10 in the concave portion CC.

The method of forming the connection member C described with reference to Fig. 18 is merely an example, and the present invention is not limited to this. For example, the connection member C may be formed by removing the solvent contained in the connection member C after the connection member C is injected into the first hole VA under atmospheric pressure.

Subsequently, as shown in Fig. 19A, a protection material PF is formed. In the illustrated example, the protection member PF is filled in the hollow portion HL of the connection member C and covers the second conductive layer L2 and the connection member C. [ Thereby, the surface SUB2A of the second substrate SUB2 is substantially planarized, and the step on the portion overlapping with the connection hole V1 can be relaxed.

Subsequently, as shown in Fig. 19B, the second optical element OD2 is bonded to the protective material PF. In the illustrated example, the second optical element OD2 also extends to a portion overlapping with the connection hole V1. Since the step due to the connection hole V1 is alleviated by the protective material PF, it is possible to suppress the peeling of the second optical element OD2 due to the step difference of the base of the second optical element OD2 when the second optical element OD2 is bonded have.

&Lt; First Modified Example &

21 is a plan view showing a first modification of the embodiment. The first modification corresponds to a modification of the display device DSP. The first modification shown in Fig. 21 differs from the configuration shown in Fig. 10 in that each of the detection electrodes Rx provided on the second substrate SUB2 is provided with a plurality of terminal portions RT. In Fig. 21, the detection electrodes Rx1 to Rx4 are shown, but here, the detection electrode Rx1 will be noted, and a structural example thereof will be described.

That is, the detection electrode Rx1 includes detection portions RS11 and RS12, terminal portions RT11 and RT12, and connection portions CN11 and CN12.

Each of the detection units RS11 and RS12 is located in the display area DA and extends in the first direction X. [ In the illustrated example, one detection electrode Rx1 includes two detection units RS11 and RS12, but may include three or more detection units RS, or one detection unit RS.

The connection portions CN11 and CN12 are all located in the non-display region NDA and on the opposite side across the display region DA. The connecting portions CN11 and CN12 extend in the second direction Y, respectively, and connect the detecting portions RS11 and RS12 arranged in the second direction Y to each other.

The terminal portions RT11 and RT12 are located in the non-display region NDA and are connected to the connection portion CN11.

On the other hand, the first substrate SUB1 has a plurality of pads P11 and P12 corresponding to one detection electrode Rx1. The pads P11 and P12 are connected to the wiring W1. The pads P11 and P12 are formed at positions overlapping with the terminal portions RT11 and RT12, respectively, in a plan view.

The connection hole V11 is formed at a position where the terminal portion RT11 and the pad P11 are opposed to each other. As described with reference to Fig. 1 and the like, a connection member C is provided in the connection hole V11. Thereby, the terminal portion RT11 and the pad P11 are electrically connected. Similarly, the connection hole V12 is formed at a position where the terminal portion RT12 and the pad P12 are opposed to each other, and the terminal portion RT12 and the pad P12 are electrically connected by a connection material C (not shown).

According to the first modification, one detection electrode Rx has the plurality of terminal portions RT, and the pads P opposed to the respective terminal portions RT are provided, and the terminal portions RT and the pads P are electrically connected Even if a connection failure occurs between one terminal portion RT and the pad P, it is possible to electrically connect between the other terminal portion RT and the pad P, and reliability can be improved.

&Lt; Second Modified Example &

22 is a plan view showing a second modification of the present embodiment. The second modification corresponds to a modified example of the terminal portion RT in the detection electrode Rx. Here, the detection electrode Rx3 including the terminal portion RT32 enclosed by a dotted line in Fig. 21 will be described with particular attention, but the second modification shown in Fig. 22 can be applied to the terminal portion in the other constitutional example to be. 23 is a cross-sectional view of a display device DSP cut with a C-D line including the terminal portion RT32 shown in Fig.

The detection electrode Rx3 is substantially composed of a laminate including a first layer L31 and a second layer L32. That is, in the detection electrode Rx3, the detection portion, the connection portion, and the terminal portion are all formed of a laminate. The detection electrode Rx3 is not limited to a two-layer structure, and may be a laminate of three or more layers.

The first layer L31 is a low resistance conductive layer and constitutes a main part of the detection electrode Rx3. In one example, the first layer L31 is made of a metal material such as aluminum (Al), titanium (Ti), silver (Ag), molybdenum (Mo), tungsten (W), copper (Cu) And is a metal layer formed by an alloy of a metal material.

The second layer L32 is a reflection suppressing layer for suppressing reflection in the first layer L31 and is a blackening layer having a reflectance lower than that of the first layer L31 and substantially having its surface color visually recognized as black. The second layer L32 has, in the example, an electrical resistance higher than the electrical resistance of the first layer L31. The second layer L32 may be formed of a conductive material or an insulating material. The second layer L32 may be a multilayer body itself or a single layer body. The second layer L32 may be formed of an organic material such as a black resin, or may be formed of an inorganic material such as a metal oxide, or may be formed of both an organic material and an inorganic material.

For example, the second layer L32 is constituted by a dielectric multilayer body in which a plurality of dielectric layers having different refractive indices are laminated. In one example, the high refractive index dielectric layer is formed of TiO ₂ , Nb ₂ O ₅ , or Ta ₂ O ₅ , and the low refractive index dielectric layer is formed of SiO ₂ or MgF ₂ .

In another example, the second layer L32 is made of a light absorbing material such as a black resin.

As shown in Fig. 22, the terminal portion RT32 has an opening AP from which the second layer L32 is removed. The opening AP penetrates to the first layer L31. In Fig. 22, the hatched area extending to the right corresponds to the area where the first layer L31 and the second layer L32 are laminated, and the area indicated by the slanting line to the right is the area where the second layer L32 is removed and the first layer L31 is present . &Lt; / RTI &gt; The opening AP is formed along the contour of the terminal portion RT32. In the illustrated example, the opening APA having a small circular shape is connected in a ring shape. In addition, the shape of the opening AP is not limited to the example shown in the drawing, and the minute opening APA may be formed discontinuously. The opening APA can be formed by, for example, irradiating a laser beam.

At the center of the terminal portion RT32, a connection hole V32 is formed. The connection member C contacts the terminal portion RT32 and contacts the pad P32 through the connection hole V32. The connection member C is in contact with the first layer L31 which is a conductive layer in the opening AP of the terminal portion RT32. The filler FI is filled in the hollow portion of the connection member C. The filler FI not only covers the connection material C, but also covers the second layer L32 of the detection electrode Rx3 and the first layer L31 of the opening AP. The detection electrode Rx3 may be entirely covered with a protective material.

According to the second modification, when the paste-like connection material C is injected into the connection hole V32, the wettability of the connection material C to the second layer L32 is lower than the wettability of the connection material C to the first layer L31, The connection material C is widened from the surface of the first layer L31 and the conductivity of the detection electrode Rx3 and the connection material C can be improved. When the first layer L31 as well as the second layer L32 have conductivity, the connection material C is in contact with both the first layer L31 of the opening AP and the second layer L32 of the non-opening portion. Therefore, It is possible to enlarge the contact area with the contact surface.

&Quot; Third Modified Example &

24 is a cross-sectional view showing a third modification of the present embodiment. The third modification corresponds to a modification of the display device DSP. The third modification shown in Fig. 24 differs from the configuration shown in Fig. 16A in that the connection material C contacts not only the pad P1 (the first conductive layer L1) but also the third conductive layer L3.

The first substrate SUB1 further includes a third conductive layer L3. The third conductive layer L3 is located between the second insulating layer 12 and the seal SE. The third conductive layer L3 may be formed of, for example, a metal material such as molybdenum, tungsten, titanium, aluminum, silver, copper, chromium, or an alloy of these metal materials and may have a single layer structure or a multilayer structure . For example, the third conductive layer L3 can be formed simultaneously with the metal layer M shown in Fig. 12, using the same material. The third conductive layer L3 is electrically connected to the pad P1. In this modification, the third conductive layer L3 is in contact with the pad P1 through the contact hole CH formed in the second insulating layer 12. [ The connection hole V1 has a fourth hole VD through the third conductive layer L3. The fourth hole VD is connected to the first portion VC1 and the second portion VC2.

25 is a cross-sectional view showing the seal SE and the third conductive layer L3 shown in Fig. The fourth hole VD is formed in a circular shape at the plan view. The second portion VC2 extends beyond the fourth hole VD in all directions in the X-Y plane. In plan view, the size of the second portion VC2 is larger than the size of the fourth hole VD. The width W23 of the second portion VC2 along the first direction X is larger than the width W24 of the fourth hole VD along the first direction X. [

Also in this modification, when the display panel PNL is irradiated with laser light and thermal energy is applied to the display panel PNL, the organic insulating material forming the second insulating layer 12 and the organic insulating material forming the third insulating layer 12 The organic insulating material forming the seal SE is more likely to sublimate. As described above, the sizes of the first portion VC1 and the second portion VC2 are larger than the size of the fourth hole VD.

The third conductive layer L3 has an annular portion RI that is not covered with the second insulating layer 12 and the seal SE. The connection member C is in contact with the annular portion RI of the third conductive layer L3. 25, diagonal lines are given to the annular portion RI.

In order to form the connection hole V1, the display panel PNL may be irradiated with laser light and then subjected to ashing. Thus, the residue of the organic insulating material that may exist in the connection hole V1 can be removed, so that the annular portion RI can be further exposed.

According to the third modification, the connection material C is in contact with not only the pad P1 but also the third conductive layer L3. Therefore, the contact area can be increased by the contact area of the connection material C with the third conductive layer L3.

&Lt; Second Embodiment: First Configuration Example &gt;

Next, a second embodiment will be described. In the second embodiment, mainly the first hole VA among the connection holes V will be described.

26 is a sectional view showing a first configuration example of the display device DSP of the present embodiment.

The second base 20 has a main surface 20A opposed to the first substrate SUB1 and a main surface 20B opposite to the main surface 20A. The main surface 20A corresponds to the first main surface, and the main surface 20B corresponds to the second main surface. The main surface 20A is spaced apart from the first conductive layer L1 in the third direction Z while facing the first conductive layer L1. In the illustrated example, the second conductive layer L2 is located on the main surface 20B. The first base 10, the first conductive layer L1, the second base 20 and the second conductive layer L2 are arranged in the third direction Z in this order. Although the organic insulating layer OI is located between the first conductive layer L1 and the second base 20, there may be an inorganic insulating layer or another conductive layer, or an air layer may be disposed.

The connection member C is in contact with the upper surface LT2 and the inner surface LS2 of the second conductive layer L2 and the inner surface 20S of the second base 20 in the second substrate SUB2, respectively. Further, the connection material C is in contact with the inner surface OIS of the organic insulation layer OI. The connection member C is also in contact with the upper surface LT1, the inner surface LS1 and the concave portion CC of the first conductive layer L1 in the first substrate SUB1. In the illustrated example, the connection member C is formed on the inner surface (i.e., the inner surface LS2 and the inner surface 20S) of the first hole VA, the inner surface (i.e., inner surface OIS) of the third hole VC, And the concave portion CC, but the connection material C is not filled in the vicinity of the central portion of each hole. For this reason, the connection member C has a hollow portion. The connection member C having such a shape is formed by injecting from the first hole VA under the atmospheric pressure or atmospheric pressure lower than the atmospheric pressure, and removing the solvent contained in the connection material C.

An insulating filler FI is filled in the hollow portion of the connection member C. In the illustrated example, the filler FI covers the second conductive layer L2 which does not overlap with the connection material C while covering the connection material C overlapped with the second conductive layer L2 on the main surface 20B, And contacts the main surface 20B. The filler FI is formed of, for example, an organic insulating material such as acrylic resin. Further, the connection member C may be filled to fill the first hole VA, the third hole VC, the second hole VB, and the concave portion CC. The connection material C is continuously formed between the first conductive layer L1 and the second conductive layer L2 without interruption. Thereby, the second conductive layer L2 is electrically connected to the wiring substrate SUB3 through the connection material C and the first conductive layer L1.

In the second embodiment, the same effect as that of the first embodiment can be obtained. In addition, since the connection material C is in contact with not only the inner surface LS2 of the second conductive layer L2 but also the upper surface LT2, the contact area of the connection material C with the second conductive layer L2 can be enlarged and the connection of the connection material C and the second conductive layer L2 Defects can be suppressed. In addition, since the connection material C is in contact with not only the inner surface LS1 of the first conductive layer L1 but also the upper surface LT1, the contact area of the connection material C with the first conductive layer L1 can be increased, It is possible to suppress the connection failure. In addition, since the filler FI is filled in the hollow portion of the connection member C, the step in the third direction Z due to the hollow portion formed in the connection member C can be alleviated. Further, since the filler FI covers the connection material C and the second conductive layer L2, the second conductive layer L2 and the connection material C can be protected.

In addition, according to the present embodiment, the first hole VA has a first portion VA1 along the main surface 20A and a second portion VA2 along the major surface 20B, and the first portion VA1 has a larger area than the second portion VA2 small. In other words, the first portion VA1 of the first hole VA is formed in the main surface 20A, and the second portion VA2 is formed in the main surface 20B. In other words, the first portion VA1 is the interface of the first hole VA on the first main surface 20A, and the second portion VA2 is the interface of the first hole VA on the second main surface 20B . The first hole VA is formed in a net tapered shape in which the width in the second direction Y is enlarged as it goes upward along the third direction Z (i.e., from the main surface 20A toward the main surface 20B) Respectively. Further, at the time of sectioning, the inner surface 20S is formed in a straight line shape. The angle? Formed by the inner surface 20S and the main surface 20B is an obtuse angle greater than 90 degrees. The inner surface 20S is not limited to the example shown in the drawings, but is a shape including at least one of a straight line and a curved line at a cross section.

In the first hole VA having such a shape, in the process of forming the connection material C described later, more connecting material C is disposed on the inner surface 20S. In one example, the width W11 of the connecting member C arranged on the inner surface 20S in the vicinity of the second portion VA2 in the second direction Y is larger than the width W12 of the connecting member C arranged in the recess CC in the second direction Y. Further, since the angle? Formed is an obtuse angle, it is possible to suppress the breakage of the connection material C in contact with the second conductive layer L2 and the connection material C in contact with the inner surface 20S.

Although not described in detail, the width of the second hole VB and the concave portion CC in the second direction Y is equal to or smaller than the width of the first portion VA1 in the second direction Y, and the width of the second portion VA2 Is smaller than the width of the direction Y.

Fig. 27 is a perspective view showing a first configuration example of the first hole VA formed in the second base 20. Fig.

In the illustrated example, the first portion VA1 and the second portion VA2 are all formed in a circular shape. The first hole VA is formed in a truncated cone shape. 27. The first part VA1 corresponds to the area indicated by the oblique line rising to the right in Fig. 27, and the second part VA2 corresponds to the area indicated by the oblique line to the right in Fig. The area of the first portion VA1 is smaller than the area of the second portion VA2. The diameter D1 of the first portion VA1 is smaller than the diameter D2 of the second portion VA2. Here, the diameters D1 and D2 correspond to the length along the first direction X. [ In one example, the diameter D2 is 2 to 4 times the diameter D1. The center O1 of the first portion VA1 and the center O2 of the second portion VA2 are located on the same straight line LA parallel to the normal (third direction Z) of the second base 20.

&Lt; Second Configuration Example &

28A is a sectional view showing a second configuration example of the first hole VA. The second configuration example shown in Fig. 28A differs from the first configuration example shown in Fig. 26 in that the inner surface 20S is formed in a shape including the curve 20C at the section. The inner surface 20S may be formed in a shape in which a plurality of curved lines 20C are combined.

«Third Configuration Example»

28B is a cross-sectional view showing a third configuration example of the first hole VA. The third configuration example shown in Fig. 28B is different from the first configuration example shown in Fig. 26 in that the inner surface 20S is formed into a shape including a straight line 20L and a curved line 20C at a cross section It is different in point. In the illustrated example, the straight line 20L is located on the first portion VA1 side, and the curve 20C is located on the second portion VA2 side. The straight line 20L may be located on the second portion VA2 side and the curve 20C may be located on the first portion VA1 side. The curved line 20C is located closer to the second portion VA2 side than the intermediate position 20M when the middle position 20M of the thickness of the second base 20 along the third direction Z is taken as a reference. But may extend beyond the intermediate position 20M toward the first portion VA1.

&Lt; Fourth Configuration Example &

Fig. 28C is a sectional view showing a fourth structural example of the first hole VA. Fig. The fourth configuration example shown in Fig. 28C is different from the first configuration example shown in Fig. 26 in that the inner surface 20S is formed into a shape including the straight line 20L and the curved lines 20C1 and 20C2 . In the illustrated example, the curve 20C1 is located on the first portion VA1 side, the curve 20C2 is located on the second portion VA2 side, and the straight line 20L is located between the curve 20C1 and the curve 20C2. The inner surface 20S may be formed in a shape in which a plurality of straight lines 20L and a plurality of curved lines 20C are combined.

«Fifth Configuration Example»

29A is a sectional view showing a fifth configuration example of the first hole VA. In the fifth configuration example shown in Fig. 29A, the first hole VA has a third portion VA3 between the first portion VA1 and the second portion VA2. The third portion VA3 is parallel to the X-Y plane and is located on the first portion VA1 side of the intermediate position 20M.

The first hole VA is formed between the first portion VA1 and the third portion VA3 and between the third portion VA3 and the second portion VA2 so that the width of the second direction Y increases as it goes upward along the third direction Z As shown in Fig. In the illustrated example, the inner surface S23 between the third portion VA3 and the second portion VA2 of the inner surface 20S is a gentle slope than the inner surface S13 between the first portion VA1 and the third portion VA3. That is, the angle? 3 formed by the third portion VA3 and the inner surface S23 is larger than the angle? 1 formed by the first portion VA1 and the inner surface S13. Further,? 1 and? 3 are both obtuse angles. 29A to 29C, the inner surfaces S13 and S23 may all be straight, cross-sectional, curved, or a combination of a straight line and a curved line.

«Sixth Configuration Example»

29B is a sectional view showing a sixth configuration example of the first hole VA. 29B, the first hole VA has a substantially constant width in the second direction Y between the first portion VA1 and the third portion VA3, as compared with the fifth configuration shown in Fig. 29A It is different in point. In the illustrated example, the angle? 1 formed is approximately 90 °.

&Lt; Seventh Configuration Example &

29C is a sectional view showing a seventh configuration example of the first hole VA. 29C differs from the fifth example shown in Fig. 29A in that the first hole VA is located between the first portion VA1 and the third portion VA3 and is directed upward along the third direction Z In which the width in the second direction Y is reduced in accordance with the width of the tapered portion. In the illustrated example, the angle? 1 formed is an acute angle.

&Lt; Variation example of pad &

30 is an enlarged plan view of the pad P1 shown in Fig. Here, the pad P1 located at the panel end PNLE along the second direction Y is shown, and the wiring connected to the pad P1 and the wiring around the pad P1 are not shown. In the illustrated example, the pad P1 is formed into an octagonal shape. The pad P1 overlaps with the seal SE and is formed of the same material as the signal line S shown in Fig. 12, for example. The pad P1 is provided with a slit ST passing through the pad P1. In the illustrated example, the slits ST extend in the second direction Y and are arranged in the first direction X, respectively. Thus, in the case where the seal SE is formed using the photosensitive resin material, since the region of the photosensitive resin material overlapping the pad P1 is exposed through the slit ST, the seal SE can be prevented from being uncured. The number of the slits ST formed in the pad P1 and the shape of the slit ST are not limited to the illustrated examples.

Note the positional relationship between the pad P1 and the first hole VA, the second hole VB, and the third hole VC. In the plan view, the second hole VB passing through the pad P1 is formed at substantially the same position as the first portion VA1 of the first hole VA, and is formed to have substantially the same size as the first portion VA1. The first portion VA1 and the second hole VB are formed in a circular shape smaller than the width of the pad P1 in the first direction X and the second direction Y, and are located substantially at the center of the pad P1. The slit ST is located around the second hole VB. The second portion VA2 of the first hole VA is larger than the first portion VA1 and larger than the pad P1 in the illustrated example. As described above, since the first hole VA is formed in a net taper shape as described above, at least the first portion VA1 or the second hole VB of the first hole VA may be formed smaller than the pad P1, P1.

The seal SE is included in the organic insulating layer OI shown in Fig. The illustrated third hole VC penetrates the organic insulating layer OI including the seal SE to the pad P1. 30, the region BC between the second hole VB and the third hole VC corresponds to an area of the pad P1 (including the slit ST) which does not overlap with the organic insulating layer OI, as shown by a diagonal line rising to the right in Fig. The region BC is formed in a ring shape. The connection member C shown in Fig. 26 is in contact with the pad P1 located in the area BC.

In the illustrated example, the first portion VA1 and the second hole VB are formed over two adjacent slits ST as indicated by the solid line in Fig. Further, the first portion VA1 and the second hole VB may be formed between two slits ST, as shown by a dotted line in Fig. 30, and may be formed so as not to overlap with any slit ST.

&Quot; Display panel: first configuration example &quot;

31 is a cross-sectional view showing a first configuration example of a display panel PNL cut along the line A-B including the connection hole V1 shown in Fig. Here, only essential parts necessary for explanation are shown.

The first substrate SUB1 includes a first base 10, a pad P1 corresponding to the first conductive layer L1, a second insulating layer 12 corresponding to the organic insulating layer OI, and the like. The first insulating layer 11 and another insulating layer or another conductive layer shown in FIG. 12 are formed between the first base 10 and the pad P1 and between the first base 10 and the second insulating layer 12 .

The second substrate SUB2 includes a second base 20, a detection electrode Rx1 corresponding to the second conductive layer L2, a light-shielding layer BM corresponding to the organic insulation layer OI, and an overcoat layer OC. At least a part of the detection portion RS and the terminal portion RT1 of the detection electrode Rx1 is covered with the protection material PF. The protective material PF is formed of an organic insulating material such as acrylic resin, for example.

The seal SE corresponds to the organic insulating layer OI and is located between the second insulating layer 12 and the overcoat layer OC. The liquid crystal layer LC is positioned between the first substrate SUB1 and the second substrate SUB2. Although not shown, the metal layer M, the third insulating layer 13, and the first alignment film AL1 shown in Fig. 12 may be interposed between the second insulating layer 12 and the seal SE. The second alignment film AL2 shown in Fig. 12 may be interposed between the overcoat layer OC and the seal SE.

The connection hole V1 has a first hole VA passing through the terminal portion RT of the second base 20 and the detection electrode Rx, a second hole VB passing through the pad P1, a third hole VC passing through the various organic insulating layers OI, And a concave portion CC formed in the first base 10. The third hole VC has a first portion VC1 passing through the second insulating layer 12, a second portion VC2 passing through the seal SE, and a third portion VC3 passing through the light-shielding layer BM and the overcoat layer OC. When the first alignment film AL1 is interposed between the seal SE and the second insulating layer 12, the first portion VC1 also penetrates the first alignment film AL1. When the second alignment film AL2 is interposed between the seal SE and the overcoat layer OC, the third portion VC3 also penetrates the second alignment film AL2 (see Fig. 12). The first portion VC1, the second portion VC2, and the third portion VC3 are arranged in the third direction Z in this order. The second portion VC2 is connected to the first portion VC1 and the third portion VC3.

The connection member C is provided in the connection hole V1, and electrically connects the pad P1 and the detection electrode Rx. Insulating filler FI is filled in the hollow portion of connection member C. A member in contact with the connection member C in the connection hole V1 will be described in more detail. That is, the connection member C is in contact with the terminal portion RT1 and the second base 20 in the first hole VA. The connection member C contacts the light-shielding layer BM and the overcoat layer OC in the third portion VC3, contacts the seal SE in the second portion VC2, and contacts the second insulating layer 12 in the first portion VC1. Lt; / RTI &gt; The connection member C is in contact with the pad P1 in the second hole VB and is in contact with the first base 10 in the concave portion CC. In the illustrated example, since the slit ST is formed in the pad P1, the connection member C is also in contact with the side PS of the pad P1 in the slit ST. As a result, the contact area between the pad P1 and the connection member C can be increased as compared with the case where the slit ST is not formed in the pad P1.

&Quot; Display panel: second configuration example &quot;

Fig. 32 is a cross-sectional view showing a second configuration example of the display panel PNL cut with the A-B line including the connection hole V1 shown in Fig. 10; In addition, here, the slit of the pad P1 is omitted.

The second configuration example shown in Fig. 32 differs from the first configuration example shown in Fig. 31 in that the second insulation layer 12 has an end 12E on the side closer to the display area DA than the pad P1 It is different. That is, the second insulating layer 12 is not formed between the pad P1 and the seal SE. There may be a case where the first alignment film AL1 is interposed between the pad P1 and the second insulating layer 12 and the seal SE.

Also in this second configuration example, the same effect as that of the first configuration example can be obtained.

&Quot; Display panel: third configuration example &quot;

Fig. 33 is a cross-sectional view showing a third configuration example of the display panel PNL cut with the A-B line including the connection hole V1 shown in Fig. 10.

The third configuration example shown in Fig. 33 differs from the first configuration example shown in Fig. 31 in that an upper pad MP corresponding to the third conductive layer is provided. The upper pad MP is located between the second insulating layer 12 and the seal SE. The upper pad MP is formed of the same material as the metal layer M shown in Fig. The upper pad MP may be formed on the same layer as the metal layer M. The upper pad MP is located above the pad P1. The second insulating layer 12 is located between the pad P1 and the upper pad MP. The second insulating layer 12 has a penetrating portion VP penetrating to the pad P1. The upper pad MP is electrically connected to the pad P1 through the penetrating portion VP. The top pad MP has a fourth hole VD connected to the third hole VC. In the illustrated example, the fourth hole VD is connected to the first portion VC1 and the second portion VC2 of the third hole VC. In addition to being in contact with the pad P1, the connection member C is also in contact with the upper pad MP.

According to the third configuration example, an effect similar to that of the first configuration example is obtained. In addition, as compared with the first configuration example, the contact area can be enlarged by the upper pad MP contacting the connection member C.

INDUSTRIAL APPLICABILITY As described above, according to the present embodiment, it is possible to provide a display device and a method of manufacturing the same that can attain a tightening softening and a low cost.

Further, although a few embodiments of the present invention have been described, these embodiments are presented as examples, and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other forms, and various omissions, substitutions, and alterations can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of equivalents of the invention described in the claims.

An example of a display device obtained from the configuration disclosed in this specification will be described below.

(One)

A first substrate having a first base, a first conductive layer,

A second substrate facing the first conductive layer and spaced apart from the first conductive layer, and a second conductive layer, the second substrate having a first hole penetrating the second substrate;

And a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole.

(2)

The electronic device according to (1), wherein the first conductive layer has a second hole facing the first hole.

(3)

Wherein the first conductive layer has a first upper surface and a first inner surface facing the second hole,

(2), wherein the connection member is in contact with the first upper surface and the first inner surface.

(4)

The electronic device according to (2), wherein the first base has a concave portion facing the second hole.

(5)

The electronic device according to (4), wherein the connection member is in contact with the concave portion.

(6)

And the second conductive layer is located on a side opposite to a side of the second base body opposite to the first conductive layer.

(7)

And an organic insulating layer disposed between the first conductive layer and the second base, and the organic insulating layer has a third hole connected to the first hole and the second hole, device.

(8)

Wherein the organic insulating layer includes a first organic insulating layer formed on the first substrate, a seal joining the first substrate and the second substrate, and a second organic insulating layer formed on the second substrate,

(7), wherein the third hole has a first portion passing through the first organic insulating layer, a second portion passing through the seal, and a third portion passing through the second organic insulating layer. Electronics.

(9)

The second conductive layer has a second upper surface and a second inner surface facing the first hole,

(1), wherein the connection member is in contact with the second upper surface and the second inner surface.

(10)

Wherein the second conductive layer comprises a first layer, a second layer overlying the first layer and having a lower reflectance than the first layer, and an opening through which the second layer is removed to expose the first layer,

The electronic device according to (1), wherein the connection member is in contact with the second layer and is in contact with the first layer in the opening.

(11)

Wherein the first conductive layer has a first upper surface,

And an organic insulating layer disposed between the first conductive layer and the second base and contacting the first upper surface,

Wherein the organic insulating layer has a third hole connected to the first hole,

And the connection member is in contact with the first upper surface through the third hole.

(12)

Wherein the first conductive layer has a second hole facing the first hole and a first inner surface facing the second hole,

The electronic device according to (11), wherein the connection member is in contact with the first inner surface.

(13)

The electronic device according to (12), wherein, in plan view, the third hole is larger than the second hole.

(14)

The electronic apparatus according to (11), wherein a portion of the first upper surface that is in contact with the connection member is formed in an annular shape.

(15)

Wherein the organic insulating layer includes a first organic insulating layer formed on the first substrate and contacting the first upper surface, and a seal joining the first substrate and the second substrate,

The third hole has a first portion passing through the first organic insulating layer and a second portion passing through the seal,

The first substrate includes a third conductive layer located between the first organic insulating layer and the seal and electrically connected to the first conductive layer,

Wherein the third conductive layer has an annular portion not covered with the first organic insulating layer and the seal,

The electronic device according to (11), wherein the connection member is in contact with the annular portion.

(16)

The electronic device according to (2), wherein the first conductive layer has a slit around the second hole.

(17)

Wherein the organic insulating layer comprises a first organic insulating layer formed on the first substrate, a second organic insulating layer formed on the second substrate, and a seal joining the first substrate and the second substrate,

Wherein the first substrate comprises a third conductive layer located between the first organic insulating layer and the seal and electrically connected to the first conductive layer,

And the third conductive layer has a fourth hole connected to the third hole.

(18)

The second base has a first major surface facing the first conductive layer and a second major surface opposite to the first major surface,

Wherein the first hole passes through the first main surface and the second main surface,

The first hole has a first portion formed in the first main surface and a second portion formed in the second main surface, and the first portion is smaller than the second portion, device.

(19)

The electronic device according to (18), wherein the first hole increases in width, as it faces from the first main surface toward the second major surface.

(20)

The electronic device according to (18), wherein the first portion and the second portion are circular, and the first hole is formed in a truncated cone shape.

(21)

Wherein the center of each of the first portion and the second portion is located on the same straight line parallel to the normal line of the second base.

(22)

The electronic device according to (18), wherein the first hole includes at least one of a straight line and a curved line at a cross section between the first portion and the second portion.

(23)

A first substrate having a first base, a first conductive layer,

A second substrate facing the first conductive layer and spaced apart from the first conductive layer, and a second conductive layer, the second substrate having a first hole penetrating the second substrate;

And a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole,

Wherein the second conductive layer comprises:

A detection section for detecting contact or approach of the object to be detected in the first region,

And a terminal portion connected to the detection portion in a second region adjacent to the first region,

And the first hole is formed in the terminal portion.

(24)

And a detection circuit that is electrically connected to the first conductive layer and reads a sensor signal output from the second conductive layer.

(25)

The electronic apparatus according to (24), wherein the first substrate includes a sensor driving electrode crossing the detecting unit.

(26)

A first substrate having a first substrate and a first conductive layer; a second substrate having a second substrate and a second conductive layer, the second substrate facing the first conductive layer and spaced apart from the first conductive layer; 2 substrates were prepared,

Forming a first hole through the second substrate by irradiating laser light onto the second substrate,

And forming a connection material for electrically connecting the first conductive layer and the second conductive layer through the first hole.

(27)

Wherein when the laser beam is irradiated, a second hole penetrating the first conductive layer at a position facing the first hole is formed.

(28)

(27), wherein when the laser beam is irradiated, a concave portion is formed in the first base body at a position facing the second hole.

(a1)

A first substrate having a first glass base, a first conductive layer,

A second substrate facing the first conductive layer and spaced apart from the first conductive layer, and a second conductive layer, the second substrate having a first hole penetrating the second glass substrate;

And a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole.

(a2)

(A1) wherein the first conductive layer has a second hole facing the first hole.

(a3)

And the connection member is in contact with the upper surface of the first conductive layer and the inner surface of the first conductive layer in the second hole.

(a4)

The electronic apparatus according to (a2) or (a3), wherein the first glass base has a concave portion facing the second hole.

(a5)

The electronic device according to (a4), wherein the connection member is in contact with the concave portion.

(a6)

The electronic device according to any one of items (a1) to (a5), wherein the second conductive layer is located on the side opposite to the side of the second glass base opposite to the first conductive layer.

(a7)

A first substrate having a first glass base, a first conductive layer,

A second substrate facing the first conductive layer and spaced apart from the first conductive layer, and a second conductive layer, the second substrate having a first hole penetrating the second glass substrate;

And a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole,

Wherein the second conductive layer comprises:

A detection section for detecting contact or approach of the object to be detected in the first region,

And a terminal portion connected to the detection portion in a second region adjacent to the first region,

And the first hole is formed in the terminal portion.

(a8)

And a detection circuit that is electrically connected to the first conductive layer and reads a sensor signal output from the second conductive layer.

(a9)

The electronic apparatus according to (a7) or (a8), wherein the first substrate has a sensor driving electrode crossing the second conductive layer.

(a10)

(A2) having an organic insulating layer positioned between the first conductive layer and the second glass substrate, the organic insulating layer having a first hole and a third hole connected to the second hole, Electronics.

(a11)

Wherein the organic insulating layer includes a first organic insulating layer formed on the first substrate, a seal joining the first substrate and the second substrate, and a second organic insulating layer formed on the second substrate,

(A10) described in (a10), wherein the third hole has a first hole passing through the first organic insulating layer, a second hole passing through the seal, and a third hole passing through the second organic insulating layer device.

(a12)

The electronic device according to any one of (a1) to (a11), wherein the connection member is in contact with the upper surface and the inner surface of the second conductive layer.

(a13)

The second conductive layer has a laminate of a first layer and a second layer having a reflectance lower than that of the first layer,

The second conductive layer has an opening in which the second layer is removed in a region where the second conductive layer and the connection material contact,

The electronic device according to any one of (a1) to (a11), wherein the connection member is in contact with the first layer at the opening.

(a14)

A first glass substrate and a first conductive layer, a second glass substrate and a second conductive layer, wherein the second glass substrate faces the first conductive layer and also extends from the first conductive layer A second substrate spaced apart is prepared,

Forming a first hole through the second glass substrate by irradiating a laser beam onto the second substrate,

And forming a connection material for electrically connecting the first conductive layer and the second conductive layer through the first hole.

(a15)

(A14), wherein when the laser light is irradiated, a second hole is formed through the first conductive layer at a position facing the first hole.

(a16)

(A15) wherein a concave portion is formed in the first glass base at a position facing the second hole when the laser beam is irradiated.

(b1)

A first substrate having a first glass base, a first conductive layer,

A second glass substrate having the first glass base and the first conductive layer facing each other, a second substrate having a second conductive layer,

An organic insulating layer disposed between the first conductive layer and the second glass base and in contact with the upper surface of the first conductive layer,

A first hole penetrating the second glass substrate; a second hole penetrating the first conductive layer and facing the first hole; and a second hole penetrating the organic insulating layer to penetrate the first hole and the second hole, A connection hole having a third hole connected thereto,

And a connection member in which the first conductive layer and the second conductive layer are electrically connected through the connection hole,

Wherein the connection member is in contact with the upper surface of the first conductive layer and the inner surface of the first conductive layer in the second hole,

Electronics.

(b2)

The electronic device according to (b1), wherein in a plan view, the size of the third hole is larger than the size of the second hole.

(b3)

The electronic device according to (b1), wherein the region of the upper surface of the first conductive layer which is in contact with the connection member is not covered with the organic insulating layer.

(b4)

The electronic device according to (b3), wherein the region is formed in an annular shape.

(b5)

(B1), wherein the second conductive layer is located on the side opposite to the side of the second glass base opposite to the first conductive layer.

(b6)

Wherein the organic insulating layer comprises: a first organic insulating layer formed on the first substrate and in contact with the upper surface of the first conductive layer; a second organic insulating layer formed on the second substrate; And a seal for joining two substrates,

(B1), wherein the third hole has a first portion passing through the first organic insulating layer, a second portion passing through the seal, and a third portion passing through the second organic insulating layer. Electronics.

(b7)

Wherein the organic insulating layer includes a first organic insulating layer formed on the first substrate and contacting the upper surface of the first conductive layer, and a seal joining the first substrate and the second substrate,

The third hole has a first portion passing through the first organic insulating layer and a second portion passing through the seal,

Wherein the first substrate comprises a third conductive layer disposed between the first organic insulating layer and the seal and comprising an annular portion that is not covered by the first organic insulating layer and the seal and is electrically connected to the first conductive layer, Layer,

The connection hole has a fourth hole penetrating the third conductive layer and connected to the first portion and the second portion,

The electronic device according to (b1), wherein the connection member is in contact with the annular portion.

(b8)

A first substrate having a first glass base, a first conductive layer,

A second glass substrate having the first glass base and the first conductive layer facing each other, a second substrate having a second conductive layer,

An organic insulating layer disposed between the first conductive layer and the second glass base and in contact with the upper surface of the first conductive layer,

A first hole penetrating the second glass substrate; a second hole penetrating the first conductive layer and facing the first hole; and a second hole penetrating the organic insulating layer to penetrate the first hole and the second hole, A connection hole having a third hole connected thereto,

And a connection member in which the first conductive layer and the second conductive layer are electrically connected through the connection hole,

The connection member contacts the upper surface of the first conductive layer and the inner surface of the first conductive layer in the second hole,

Wherein the second conductive layer has a detection portion located in a first region and a terminal portion located in a second region adjacent to the first region and connected to the detection portion,

The first hole is formed in the second region,

Wherein the connection member is electrically connected to the terminal portion in the second region,

Electronics.

(b9)

And a detection circuit that is electrically connected to the first conductive layer and reads a sensor signal output from the second conductive layer.

(b10)

(B8) wherein the first substrate has a sensor driving electrode intersecting with the detection unit.

(c1)

A first substrate having a first glass base, a first conductive layer,

A second glass substrate facing the first conductive layer and having a first major surface spaced apart from the first conductive layer and a second major surface opposite to the first major surface, A second substrate having a first main surface and a first hole penetrating the first main surface and the second main surface,

And a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole,

Wherein the first hole has a first portion formed in the first main surface and a second portion formed in the second major surface, the first portion being smaller than the second portion.

(c2)

The electronic device according to (c1), wherein the first hole increases in width as it faces from the first main surface toward the second major surface.

(c3)

The electronic device according to (c1) or (c2), wherein the first portion and the second portion are circular, and the first hole is formed in a truncated cone shape.

(c4)

The electronic device according to (c3), wherein the center of each of the first portion and the second portion is located on the same straight line parallel to the normal line of the second glass base.

(c5)

The electronic apparatus according to (c1) or (c2), wherein the inner surface of the first hole includes at least one of a straight line and a curved line at a cross section.

(c6)

The electronic device according to any one of items (c1) to (c5), wherein the connection member is in contact with an upper surface of the second conductive layer and an inner surface of the second conductive layer in the first hole.

(c7)

The electronic device according to any one of (c1) to (c6), wherein the first conductive layer has a second hole facing the first hole.

(c8)

And the connection member is in contact with the upper surface of the first conductive layer and the inner surface of the first conductive layer in the second hole.

(c9)

The first glass base has a concave portion facing the second hole,

The electronic device according to (c7) or (c8), wherein the connection member is in contact with the concave portion.

(c10)

The electronic device according to any one of (c7) to (c9), wherein the first conductive layer has a slit around the second hole.

(c11)

A first substrate having a first glass base, a first conductive layer,

A second glass substrate facing the first conductive layer and having a first major surface spaced apart from the first conductive layer and a second major surface opposite to the first major surface, A second substrate having a first main surface and a first hole penetrating the first main surface and the second main surface,

And a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole,

Wherein the first hole has a first portion formed in the first main surface and a second portion formed in the second main surface, the first portion is smaller than the second portion,

Wherein the second conductive layer includes a detection section for detecting contact or proximity of the object to be detected in the first region and a terminal section connected to the detection section in a second region adjacent to the first region, Wherein the hole is formed in the terminal portion.

(c12)

And a detection circuit electrically connected to the first conductive layer and reading a sensor signal output from the second conductive layer.

(c13)

The electronic apparatus according to (c11) or (c12), wherein the first substrate has a sensor driving electrode crossing the second conductive layer.

(c14)

The electronic device according to any one of items (c11) to (c13), wherein the first area is a display area in which a plurality of pixels are arranged, and the second area is a non-display area surrounding the display area.

(c15)

A first substrate having a first glass base, a first conductive layer,

A second glass substrate facing the first conductive layer and having a first major surface spaced apart from the first conductive layer and a second major surface opposite to the first major surface, A second substrate having a first main surface and a first hole penetrating the first main surface and the second main surface,

An organic insulating layer disposed between the first conductive layer and the second glass substrate and having a third hole connected to the first hole,

And a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole and the third hole,

Wherein the first hole has a first portion formed in the first main surface and a second portion formed in the second major surface, the first portion being smaller than the second portion.

(c16)

Wherein the organic insulating layer

A first organic insulating layer formed on the first substrate; a seal bonding the first substrate and the second substrate; and a second organic insulating layer formed on the second substrate,

(C15) described in (c15), wherein the third hole has a first hole penetrating the first organic insulating layer, a second hole penetrating the seal, and a third hole penetrating the second organic insulating layer, Electronics.

(c17)

Wherein the organic insulating layer comprises a first organic insulating layer formed on the first substrate, a second organic insulating layer formed on the second substrate, and a seal joining the first substrate and the second substrate,

And a third conductive layer located between the first organic insulating layer and the seal and electrically connected to the first conductive layer,

And the third conductive layer has a fourth hole connected to the third hole (c16).

Claims (28)

A first substrate having a first base, a first conductive layer,
A second substrate facing the first conductive layer and spaced apart from the first conductive layer, and a second conductive layer, the second substrate having a first hole penetrating the second substrate;
And a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole. The electronic apparatus according to claim 1, wherein the first conductive layer has a second hole facing the first hole. 3. The semiconductor device according to claim 2, wherein the first conductive layer has a first upper surface and a first inner surface facing the second hole,
And the connection member is in contact with the first upper surface and the first inner surface. The electronic apparatus according to claim 2, wherein the first base has a concave portion facing the second hole. The electronic apparatus according to claim 4, wherein the connection member is in contact with the concave portion. The electronic apparatus according to claim 1, wherein the second conductive layer is located on the side opposite to the side of the second base facing the first conductive layer. 3. The organic electroluminescent device according to claim 2, further comprising an organic insulating layer disposed between the first conductive layer and the second substrate,
Wherein the organic insulating layer has the first hole and the third hole connected to the second hole. 8. The organic electroluminescent device according to claim 7, wherein the organic insulating layer comprises: a first organic insulating layer formed on the first substrate; a seal bonding the first substrate and the second substrate; Layer,
The third hole has a first portion passing through the first organic insulating layer, a second portion passing through the seal, and a third portion passing through the second organic insulating layer. The semiconductor device according to claim 1, wherein the second conductive layer has a second upper surface and a second inner surface facing the first hole,
And the connection member is in contact with the second upper surface and the second inner surface. The method of claim 1, wherein the second conductive layer comprises a first layer, a second layer overlying the first layer and having a lower reflectivity than the first layer, and a second layer overlying the first layer, Having an opening for exposing,
Wherein the connection member is in contact with the second layer and is in contact with the first layer in the opening. The semiconductor device according to claim 1, wherein the first conductive layer has a first upper surface,
And an organic insulating layer disposed between the first conductive layer and the second base and contacting the first upper surface,
Wherein the organic insulating layer has a third hole connected to the first hole,
And the connection member is in contact with the first upper surface through the third hole. 12. The semiconductor device according to claim 11, wherein the first conductive layer has a second hole facing the first hole, and a first inner surface facing the second hole,
And the connection member is in contact with the first inner surface. The electronic apparatus according to claim 12, wherein, in plan view, the third hole is larger than the second hole. The electronic apparatus according to claim 11, wherein the portion of the first upper surface that is in contact with the connection member is formed in an annular shape. The organic light emitting display according to claim 11, wherein the organic insulating layer comprises: a first organic insulating layer formed on the first substrate and contacting the first upper surface; and a seal joining the first substrate and the second substrate,
The third hole has a first portion passing through the first organic insulating layer and a second portion passing through the seal,
The first substrate includes a third conductive layer located between the first organic insulating layer and the seal and electrically connected to the first conductive layer,
Wherein the third conductive layer has an annular portion not covered with the first organic insulating layer and the seal,
And the connection member is in contact with the annular portion. 3. The electronic device according to claim 2, wherein the first conductive layer has a slit around the second hole. The organic electroluminescent device according to claim 8, wherein the organic insulating layer comprises: a first organic insulating layer formed on the first substrate; a second organic insulating layer formed on the second substrate; and a second organic insulating layer formed on the first substrate and the second substrate A seal is provided,
Wherein the first substrate comprises a third conductive layer located between the first organic insulating layer and the seal and electrically connected to the first conductive layer,
And the third conductive layer has a fourth hole connected to the third hole. 2. The semiconductor device according to claim 1, wherein the second base has a first major surface facing the first conductive layer and a second major surface opposite to the first major surface,
Wherein the first hole passes through the first main surface and the second main surface,
Wherein the first hole has a first portion formed in the first main surface and a second portion formed in the second major surface, the first portion being smaller than the second portion. 19. The electronic device according to claim 18, wherein the first hole increases in width, as it faces, from the first major surface toward the second major surface. 19. The electronic apparatus according to claim 18, wherein the first portion and the second portion are circular, and the first hole is formed in a truncated cone shape. The electronic apparatus according to claim 20, wherein the center of each of the first portion and the second portion is located on the same straight line parallel to the normal line of the second base. 19. The electronic device according to claim 18, wherein the first hole includes at least one of a straight line and a curved line at a cross section between the first portion and the second portion. A first substrate having a first base, a first conductive layer,
A second substrate facing the first conductive layer and spaced apart from the first conductive layer, and a second conductive layer, the second substrate having a first hole penetrating the second substrate;
And a connection member electrically connecting the first conductive layer and the second conductive layer through the first hole,
Wherein the second conductive layer comprises:
A detection section for detecting contact or approach of the object to be detected in the first region,
And a terminal portion connected to the detection portion in a second region adjacent to the first region,
And the first hole is formed in the terminal portion. 24. The electronic device according to claim 23, comprising a detection circuit electrically connected to the first conductive layer and reading a sensor signal output from the second conductive layer. 25. The electronic apparatus according to claim 24, wherein the first substrate includes a sensor driving electrode crossing the detection unit. A first substrate having a first substrate and a first conductive layer; a second substrate having a second substrate and a second conductive layer, the second substrate facing the first conductive layer and spaced apart from the first conductive layer; 2 substrates were prepared,
Forming a first hole through the second substrate by irradiating laser light onto the second substrate,
And forming a connection material for electrically connecting the first conductive layer and the second conductive layer through the first hole. 27. The method according to claim 26, wherein when irradiating the laser light, a second hole is formed through the first conductive layer at a position facing the first hole. 28. The method according to claim 27, wherein when the laser beam is irradiated, a concave portion is formed in the first base at a position facing the second hole.

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