KR20180003107A - Substrate treating apparatus, index robot and substrate transferring method - Google Patents

Abstract

The present invention relates to a substrate treating apparatus, an index robot, and a substrate transferring method. The substrate treating apparatus according to one embodiment of the present invention comprises: a rod port having a cassette; a linked module where a substrate can be temporarily located; an index robot for transferring the substrate between the rod port and the linked module; and a control portion, wherein the index robot comprises: a first hand capable of supporting a first substrate; a second hand capable of supporting a second substrate; and a sensor for detecting a corner location of the first substrate or a corner location of the second substrate. In addition, the control portion computes the location of the first substrate or the location of the second substrate via information provided by the sensor. An object of the present invention is to efficiently treat a substrate and improve transferring efficiency of the substrate.

Description

[0001] DESCRIPTION [0002] Substrate processing apparatus, index robot, and substrate transfer method [

The present invention relates to a substrate processing apparatus, an index robot, and a substrate transfer method.

To fabricate semiconductor devices or liquid crystal displays, various processes such as photolithography, etching, ashing, ion implantation, thin film deposition, and cleaning are performed on the substrate. The photolithography process is a process for forming a desired circuit pattern on a substrate, and the application process, the exposure process, and the development process are sequentially performed. In the coating step, a photosensitive liquid such as a photoresist is coated on the substrate. In the exposure step, a circuit pattern is exposed on the substrate having the photosensitive film. In the developing step, the exposed region is selectively developed on the substrate. The substrate etching process or the cleaning process is largely performed by a chemical processing step, a rinsing processing step, and a drying processing step. In the chemical treatment step, a chemical for etching the thin film formed on the substrate or removing foreign substances on the substrate is supplied to the substrate, and in the rinsing step, a rinsing liquid such as pure water is supplied onto the substrate.

An object of the present invention is to provide a substrate processing apparatus, an index robot and a substrate transfer method capable of efficiently processing a substrate.

The present invention also provides a substrate processing apparatus, an index robot, and a substrate transfer method capable of improving the transfer efficiency of the substrate.

According to an aspect of the invention, there is provided a cassette comprising: a load port in which a cassette is located; A coupling module in which the substrate can be temporarily placed; And an index robot for transferring the substrate between the load port and the coupling module; And a control unit, wherein the index robot includes: a first hand capable of supporting a first substrate; A second hand capable of supporting a second substrate; And a sensor for sensing an edge position of the first substrate or an edge position of the second substrate, wherein the controller calculates a position of the first substrate or a position of the second substrate through information provided by the sensor A substrate processing apparatus can be provided.

The index robot may transfer the first substrate and the second substrate from the coupling module to the load port or from the load port to the coupling module.

The control unit may control the first hand and the second hand to simultaneously pick up the first substrate and the second substrate.

In addition, the controller may control the first hand and the second hand to sequentially pick up the first substrate and the second substrate.

In addition, the control unit may control the first hand and the second hand to simultaneously flush the first substrate and the second substrate.

The controller may control the first hand and the second hand to successively flush the first substrate and the second substrate.

In addition, the controller may be configured to control the first substrate and the second substrate in such a manner that the first substrate and the second substrate are positioned such that the first and second hands are positioned, The position information of the first substrate and the second substrate can be calculated based on the information about the edge of the second substrate.

In addition, the controller may control the distance between the edges of the first substrate or the edges of the second substrate, which are sensed by being located at positions facing each other among the sensors, to the diameter of the first substrate or the second substrate The positional information can be calculated if it is within an error.

Also, the controller may control a center of a circle having a radius of a half of a distance between an edge of the first substrate or an edge of the second substrate, 1 substrate and the second substrate.

The first and second hands may be positioned such that the first and second hands are positioned such that the first substrate and the second substrate are positioned up and down, So that the position of the first substrate or the second substrate can be sensed by the sensors.

According to another aspect of the present invention, there is provided a substrate transfer method for transferring a substrate using a first hand and a second hand, the method comprising: transferring a first substrate and a second substrate, And a second hand supporting the second substrate; Sensing the edges of the first substrate and those positioned outside of the second substrate with sensors; And calculating a position of the first substrate and the second substrate based on the positions of the corners.

The positions of the first substrate and the second substrate can be calculated if the distance between the opposite corners of the corners is within an allowable tolerance with respect to the diameter of the first substrate or the second substrate.

A center of a circle having a radius of a half of a distance between opposing edges among the corners may be set as a center of the first substrate and the second substrate.

According to an embodiment of the present invention, a substrate processing apparatus, an index robot, and a substrate transfer method capable of efficiently processing a substrate can be provided.

Further, according to an embodiment of the present invention, a substrate processing apparatus, an index robot, and a substrate transfer method capable of improving the transfer efficiency of the substrate can be provided.

1 is a top view of the substrate processing apparatus.
Fig. 2 is a view of the facility of Fig. 1 viewed from the direction AA.
Fig. 3 is a view of the equipment of Fig. 1 viewed from the BB direction.
Fig. 4 is a view of the facility of Fig. 1 viewed from the CC direction; Fig.
5 is a view showing an index robot.
6 is a view showing a state in which the index robot carries out the substrate from the cassette.
7 is a side view of the first and second hands supporting the substrate.
8 is a plan view of the first and second hands supporting the substrate.
9 and 10 are diagrams showing a state in which position information is calculated for two superimposed substrates according to another embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

The facilities of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of this embodiment can be used to perform a coating process and a developing process on a substrate, which is connected to an exposure apparatus. Hereinafter, a case where a wafer is used as a substrate will be described as an example.

1 is a plan view of the apparatus of FIG. 1 viewed from the direction AA, FIG. 3 is a view of the apparatus of FIG. 1 viewed from the BB direction, FIG. 4 is a view of the apparatus of FIG. 1 In the CC direction.

1 to 4, the substrate processing apparatus 1 includes a load port 100, an index module 200, a coupling module 300, a coating and developing module 400, a buffer module 500, A processing module 600, and an interface module 700. The load port 100, the index module 200, the coupling module 300, the coating and developing module 400, the buffer module 500, the pre-exposure processing module 600, and the interface module 700 sequentially Lt; / RTI >

The load port 100, the index module 200, the coupling module 300, the coating and developing module 400, the buffer module 500, the before and after exposure processing module 600, and the interface module 700 are arranged A direction perpendicular to the first direction 12 is referred to as a second direction 14 and a direction perpendicular to the first direction 12 and the second direction 14 is referred to as a first direction 12, Are referred to as a third direction 16, respectively.

The substrate W is moved in a state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door at the front can be used.

Hereinafter, description will be made for the load port 100, the index module 200, the linking module 300, the coating and developing module 400, the buffer module 500, the before and after exposure processing module 600, and the interface module 700 Will be described in detail.

The load port 100 has a mounting table 120 on which the cassette 20 accommodating the substrates W is placed. A plurality of mounts 120 are provided, and the mounts 200 are arranged in a line along the second direction 14. [ In Fig. 2, four placement tables 120 are provided.

The index module 200 transfers the substrate W between the cassette 20 and the coupling module 300 placed on the table 120 of the load port 100. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is provided generally in the shape of an internally hollow rectangular parallelepiped and is disposed between the load port 100 and the coupling module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the coupling module 300 described later. The index robot 220 and the guide rail 230 are disposed within the frame 210. The index robot 220 picks up and flakes the substrate W. [ The index robot 220 can be moved along the guide rail 230. Further, the index robot 220 can be rotated with respect to the guide rail 230. Further, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

The linking module 300 can be brought in after the substrate to be processed is taken out of the cassette 20 or placed in the path where the processed substrate is transported to the cassette 20 so that the substrate can be temporarily placed. The linking module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an inner rectangular parallelepiped and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed in the third direction 16 from below. The second buffer 330 and the cooling chamber 350 are located at a height corresponding to the coating module 401 of the coating and developing module 400 described later and the coating and developing module 400 at a height corresponding to the developing module 402. [ The first buffer robot 360 is spaced apart from the second buffer 330, the cooling chamber 350 and the first buffer 320 by a predetermined distance in the second direction 14.

The first buffer 320 and the second buffer 330 temporarily store a plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 332. The housing 331 is constructed so that the index robot 220, the first buffer robot 360 and the developing robot 482 of the developing module 402 described later mount the substrate W on the support 332 in the housing 331 (Not shown) in the direction in which the index robot 220 is provided, in the direction in which the first buffer robot 360 is provided, and in the direction in which the developing robot 482 is provided, so that the developing robot 482 can carry it in or out. The first buffer 320 has a structure substantially similar to that of the second buffer 330. The housing 321 of the first buffer 320 has an opening in a direction in which the first buffer robot 360 is provided and in a direction in which the application unit robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to one example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support base 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable configuration so that the hand 361 is movable along the second direction 14. The arm 362 is coupled to the support 363 so as to be linearly movable along the support 363 in the third direction 16. The support base 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support member 363 may be provided longer in the upward or downward direction. The first buffer robot 360 may be provided so that the hand 361 is simply driven in two directions along the second direction 14 and the third direction 16.

The cooling chamber 350 cools the substrate W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling means 353 for cooling the substrate W. [ As the cooling means 353, various methods such as cooling with cooling water and cooling using a thermoelectric element can be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) for positioning the substrate W on the cooling plate 352. The housing 351 is provided with an index robot 220 so that the developing robot 482 provided in the index robot 220 and a developing module 402 to be described later can carry the substrate W into or out of the cooling plate 352 (Not shown) in the direction provided and the direction in which the developing robot 482 is provided. Further, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The application and development module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The application module 401 and the development module 402 are arranged so as to be partitioned into layers with respect to each other. According to one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photosensitive liquid such as a photoresist to the substrate W and a heat treatment process such as heating and cooling for the substrate W before and after the resist application process. The application module 401 has a resist application chamber 410, a bake chamber 420, and a transfer chamber 430. The resist application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. [ The resist application chamber 410 and the bake chamber 420 are positioned apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 are provided, and a plurality of resist coating chambers 410 are provided in the first direction 12 and the third direction 16, respectively. In the figure, six resist coating chambers 410 are provided. A plurality of bake chambers 420 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 420 are provided. Alternatively, however, the bake chamber 420 may be provided in a greater number.

The transfer chamber 430 is positioned in a first direction 12 with the first buffer 320 of the coupling module 300. In the transfer chamber 430, a dispenser robot 432 and a guide rail 433 are positioned. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 is connected to the bake chambers 420, the resist application chambers 400, the first buffer 320 of the coupling module 300 and the first cooling chamber 520 of the buffer module 500 The substrate W is transferred. The guide rails 433 are arranged so that their longitudinal directions are parallel to the first direction 12. The guide rails 433 guide the applying robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. The arm 435 is provided in a stretchable configuration so that the hand 434 is movable in the horizontal direction. The support 436 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 435 is coupled to the support 436 so as to be linearly movable in the third direction 16 along the support 436. The support 436 is fixedly coupled to the pedestal 437 and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

The resist coating chambers 410 all have the same structure. However, the types of the photoresist used in each of the resist coating chambers 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 applies a photoresist on the substrate W. [ The resist coating chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located in the housing 411 and supports the substrate W. [ The support plate 412 is rotatably provided. The nozzle 413 supplies the photoresist onto the substrate W placed on the support plate 412. The nozzle 413 has a circular tube shape and can supply photoresist to the center of the substrate W. [ Alternatively, the nozzle 413 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 413 may be provided as a slit. In addition, the resist coating chamber 410 may further be provided with a nozzle 414 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W to which the photoresist is applied.

The bake chamber 420 heat-treats the substrate W. For example, the bake chambers 420 may be formed by a prebake process for heating the substrate W to a predetermined temperature to remove organic substances and moisture on the surface of the substrate W, A soft bake process is performed after coating the substrate W on the substrate W, and a cooling process for cooling the substrate W after each heating process is performed. The bake chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with a cooling means 423 such as a cooling water or a thermoelectric element. The heating plate 422 is also provided with a heating means 424, such as a hot wire or a thermoelectric element. The cooling plate 421 and the heating plate 422 may be provided in a single bake chamber 420, respectively. Optionally, some of the bake chambers 420 may include only the cooling plate 421, and the other portions may include only the heating plate 422.

The developing module 402 includes a developing process for supplying a developing solution to obtain a pattern on the substrate W to remove a part of the photoresist and a heat treatment process such as heating and cooling performed on the substrate W before and after the developing process . The development module 402 has a development chamber 800, a bake chamber 470, and a transfer chamber 480. [ The development chamber 800, the bake chamber 470, and the transfer chamber 480 are sequentially disposed along the second direction 14. The development chamber 800 and the bake chamber 470 are positioned apart from each other in the second direction 14 with the transfer chamber 480 therebetween. A plurality of developing chambers 800 are provided and a plurality of developing chambers 800 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, an example in which six developing chambers 800 are provided is shown. A plurality of bake chambers 470 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 470 are provided. Alternatively, however, the bake chamber 470 can be provided in greater numbers.

The transfer chamber 480 is positioned in parallel with the second buffer 330 of the coupling module 300 in the first direction 12. In the transfer chamber 480, the developing robot 482 and the guide rail 483 are positioned. The delivery chamber 480 has a generally rectangular shape. The development robot 482 is connected to the bake chambers 470, the development chambers 800, the second buffer 330 of the coupling module 300 and the cooling chamber 350, And transfers the substrate W between the chambers 540. The guide rail 483 is arranged such that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing robot 482 to linearly move in the first direction 12. The developing sub-robot 482 has a hand 484, an arm 485, a supporting stand 486, and a pedestal 487. The hand 484 is fixed to the arm 485. The arm 485 is provided in a stretchable configuration to allow the hand 484 to move in a horizontal direction. The support 486 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 485 is coupled to the support 486 such that it is linearly movable along the support 486 in the third direction 16. The support table 486 is fixedly coupled to the pedestal 487. The pedestal 487 is coupled to the guide rail 483 so as to be movable along the guide rail 483.

The buffer module 500 is provided as a path through which the substrate W is transferred between the coating and developing module 400 and the pre- and post-exposure processing module 600. In addition, the buffer module 500 performs a predetermined process on the substrate W such as a cooling process or an edge exposure process. The buffer module 500 has a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560. The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located within the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the development module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged in a row along the third direction 16. The buffer 520 is disposed along the first direction 12 with the transfer chamber 430 of the application module 401. [ The edge exposure chamber 550 is spaced a certain distance in the second direction 14 from the buffer 520 or the first cooling chamber 530.

The second buffer robot 560 carries the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. A second buffer robot 560 is positioned between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided in a structure similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform a subsequent process on the substrates W that have been processed in the application module 401. The first cooling chamber 530 cools the substrate W processed in the application module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes its edge to the substrates W that have undergone the cooling process in the first cooling chamber 530. [ The buffer 520 temporarily stores the substrate W before the substrates W processed in the edge exposure chamber 550 are transported to a preprocessing module 601 described later. The second cooling chamber 540 cools the substrates W before the processed substrates W are transferred to the developing module 402 in the post-processing module 602 described later. The buffer module 500 may further have a buffer added to the height corresponding to the development module 402. [ In this case, the substrates W processed in the post-processing module 602 may be temporarily stored in the added buffer and then conveyed to the developing module 402.

The pre- and post-exposure processing module 600 may process a process of applying a protective film for protecting the photoresist film applied to the substrate W during liquid immersion exposure, when the exposure apparatus 900 performs the liquid immersion exposure process. In addition, the pre- and post-exposure processing module 600 may perform a process of cleaning the substrate W after exposure. In addition, when the coating process is performed using the chemically amplified resist, the pre- and post-exposure processing module 600 can process the post-exposure bake process.

The pre-exposure post-processing module 600 has a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a process of processing the substrate W before the exposure process, and the post-process module 602 performs a process of processing the substrate W after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged so as to be partitioned into layers with respect to each other. According to one example, the preprocessing module 601 is located on top of the post-processing module 602. The preprocessing module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the developing module 402. The pretreatment module 601 has a protective film application chamber 610, a bake chamber 620, and a transfer chamber 630. The protective film application chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially disposed along the second direction 14. The protective film application chamber 610 and the bake chamber 620 are positioned apart from each other in the second direction 14 with the transfer chamber 630 therebetween. A plurality of protective film application chambers 610 are provided and are arranged along the third direction 16 to form layers. Alternatively, a plurality of protective film application chambers 610 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of bake chambers 620 are provided and are disposed along the third direction 16 to form layers. Alternatively, a plurality of bake chambers 620 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 630 is positioned in parallel with the first cooling chamber 530 of the buffer module 500 in the first direction 12. In the transfer chamber 630, a pre-processing robot 632 is located. The transfer chamber 630 has a generally square or rectangular shape. The preprocessing robot 632 is connected between the protective film application chambers 610, the bake chambers 620, the buffer 520 of the buffer module 500 and the first buffer 720 of the interface module 700, W). The preprocessing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixed to the arm 634. The arm 634 is provided with a retractable structure and a rotatable structure. The arm 634 is coupled to the support 635 so as to be linearly movable along the support 635 in the third direction 16.

The protective film applying chamber 610 applies a protective film for protecting the resist film on the substrate W during liquid immersion exposure. The protective film application chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with its top opened. The support plate 612 is located in the housing 611 and supports the substrate W. [ The support plate 612 is rotatably provided. The nozzle 613 supplies a protective liquid for forming a protective film onto the substrate W placed on the supporting plate 612. The nozzle 613 has a circular tube shape and can supply the protective liquid to the center of the substrate W. [ Alternatively, the nozzle 613 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 613 may be provided with a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid includes a foamable material. The protective liquid may be a photoresist and a material having a low affinity for water. For example, the protective liquid may contain a fluorine-based solvent. The protective film application chamber 610 supplies the protective liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 612.

The bake chamber 620 heat-treats the substrate W coated with the protective film. The bake chamber 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with a cooling means 623 such as a cooling water or a thermoelectric element. Or heating plate 622 is provided with a heating means 624, such as a hot wire or a thermoelectric element. The heating plate 622 and the cooling plate 621 may be provided in a single bake chamber 620, respectively. Optionally, some of the bake chambers 620 may have only the heating plate 622, while others may only have the cooling plate 621.

The post-processing module 602 has a cleaning chamber 660, a post-exposure bake chamber 670, and a delivery chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake chamber 670 are sequentially disposed along the second direction 14. Accordingly, the cleaning chamber 660 and the post-exposure baking chamber 670 are positioned apart from each other in the second direction 14 with the transfer chamber 680 therebetween. A plurality of cleaning chambers 660 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of cleaning chambers 660 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of post-exposure bake chambers 670 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of post-exposure bake chambers 670 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 680 is positioned in parallel with the second cooling chamber 540 of the buffer module 500 in the first direction 12 as viewed from above. The transfer chamber 680 has a generally square or rectangular shape. A post processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 is connected to the cleaning chambers 660, post-exposure bake chambers 670, the second cooling chamber 540 of the buffer module 500, and the second buffer (not shown) of the interface module 700 730). ≪ / RTI > The postprocessing robot 682 provided in the postprocessing module 602 may be provided with the same structure as the preprocessing robot 632 provided in the preprocessing module 601. [

The cleaning chamber 660 cleans the substrate W after the exposure process. The cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located in the housing 661 and supports the substrate W. [ The support plate 662 is rotatably provided. The nozzle 663 supplies the cleaning liquid onto the substrate W placed on the support plate 662. As the cleaning liquid, water such as deionized water may be used. The cleaning chamber 660 supplies the cleaning liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 662. Optionally, while the substrate W is rotating, the nozzle 663 may move linearly or rotationally from the central region of the substrate W to the edge region.

The post-exposure bake chamber 670 heats the substrate W subjected to the exposure process using deep UV light. The post-exposure baking step heats the substrate W and amplifies the acid generated in the photoresist by exposure to complete the property change of the photoresist. The post-exposure bake chamber 670 has a heating plate 672. The heating plate 672 is provided with a heating means 674 such as a hot wire or a thermoelectric element. The post-exposure bake chamber 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with a cooling means 673 such as a cooling water or a thermoelectric element. Further, a bake chamber having only the cooling plate 671 may be further provided.

As described above, the pre-processing module 601 and the post-processing module 602 in the pre-exposure processing module 600 are provided to be completely separated from each other. The transfer chamber 630 of the preprocessing module 601 and the transfer chamber 680 of the postprocessing module 602 are provided in the same size and can be provided so as to completely overlap each other when viewed from above. Further, the protective film application chamber 610 and the cleaning chamber 660 may be provided to have the same size as each other and be provided so as to completely overlap with each other when viewed from above. Further, the bake chamber 620 and the post-exposure bake chamber 670 are provided in the same size, and can be provided so as to completely overlap each other when viewed from above.

The interface module 700 transfers the substrate W between the exposure pre- and post-processing module 600 and the exposure apparatus 900. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located within the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance and are stacked on each other. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to the preprocessing module 601 and the second buffer 730 is positioned at a height corresponding to the postprocessing module 602. The first buffer 720 is arranged in a line along the first direction 12 with the transfer chamber 630 of the preprocessing module 601 while the second buffer 730 is arranged in the postprocessing module 602, Are arranged in a line along the first direction 12 with the transfer chamber 630 of the transfer chamber 630. [

The interface robot 740 is spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 carries the substrate W between the first buffer 720, the second buffer 730 and the exposure apparatus 900. The interface robot 740 has a structure substantially similar to that of the second buffer robot 560.

The first buffer 720 temporarily stores the substrates W processed in the preprocessing module 601 before they are transferred to the exposure apparatus 900. The second buffer 730 temporarily stores the processed substrates W in the exposure apparatus 900 before they are transferred to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 722. The housing 721 is movable in the direction in which the interface robot 740 is provided and in the direction in which the interface robot 740 and the preprocessing robot 632 transfer the substrate W to and from the support table 722, 632 are provided with openings (not shown) in the direction in which they are provided. The second buffer 730 has a structure substantially similar to that of the first buffer 720. However, the housing 731 of the second buffer 730 has an opening (not shown) in the direction in which the interface robot 740 is provided and in a direction in which the postprocessing robot 682 is provided. Only the buffers and robots can be provided as described above without providing a chamber for performing a predetermined process on the substrate W in the interface module.

The development chambers 800 all have the same structure. However, the types of developers used in the respective developing chambers 800 may be different from each other. The development chamber 800 is provided with an apparatus for developing a substrate. The development chamber 800 removes a region of the photoresist on the substrate W where light is irradiated. At this time, the area of the protective film irradiated with the light is also removed. Depending on the type of selectively used photoresist, only the areas of the photoresist and protective film that are not irradiated with light can be removed.

5 is a view showing an index robot.

5, the index robot 220 includes hands 2210 and 2220, a pedestal 2200, and sensors 2230.

The index robot 220 includes a first hand 2210 and a second hand 2220 which are positioned from the upper side to the lower side. The first hand 2210 and the second hand 2220 pick up and flush the first substrate S1 and the second substrate S2, respectively.

The pedestal 2200 supports the hands 2210 and 2220. For example, the pedestal 2200 is provided in a block shape having a setting volume, and the first hand 2210 and the second hand 2220 are movably coupled to the pedestal 2200 in the forward and backward directions, respectively. The hands 2210 and 2220 are provided in the shape in which the inside is opened in the up and down direction and can be provided to support the outer bottom surface of the substrates S1 and S2.

Sensors 2230 sense the position of the substrate S1, S2 located in the first hand 2210 and the second hand 2220. [

For example, the sensors 2230 may be provided at four opposing positions. Sensors 2230 include light emitting portions 2231 and light receiving portions 2232. [ The light emitting portions 2231 and the light receiving portions 2232 are provided at positions corresponding to the outer edges of the substrates S1 and S2 so that each of the sensors 2230 detects the position of the outer edge of the substrates S1 and S2 can do.

The light emitting units 2231 may be positioned below the second hand 2220 and the light receiving units 2232 may be positioned above the first hand 2210 so as to face the light emitting units 2231 in the vertical direction. For example, the light emitting units 2231 may be positioned on the upper surface or the side surface of the pedestal 2200, and the light receiving units 2232 may be positioned with a predetermined distance upward from the first hand 2210. The light receiving portions 2232 are positioned below the second hand 2220 and the light emitting portions 2231 are arranged on the upper side of the first hand 2210 so as to face the light receiving portions 2232 in the vertical direction Lt; / RTI > The configuration of the hands 2210 and 2220 is not positioned in the space where the light emitting units 2231 and the light receiving units 2232 face each other and the light emitted from the light emitting units 2231 can be received by the light receiving units 2232 have. When the substrates S1 and S2 are positioned on the hands 2210 and 2220, the substrates S1 and S2 cut off the light, and the light-receiving units 2232 receive the light through the area where the light is received, (S1, S2).

The control unit 900 may calculate the position information of the substrates S1 and S2 through signals provided by the sensors 2230. [ When the substrates S1 and S2 are flashed, the controller 900 controls the index robot 220 to flush the substrates S1 and S2 to a predetermined position using the calculated position information of the substrates S1 and S2. . For example, the control unit 900 may calculate the position of the center of the substrate S1, S2 located in the hands 2210, 2220 through the signals provided by the sensors 2230. [ When the substrates S1 and S2 are flashed, the controller 900 may control the index robot 220 so that the calculated center is at the set position.

6 is a view showing a state in which the index robot carries out the substrate from the cassette.

Referring to FIG. 6, the index robot 220 may take out two substrates S1 and S2 from the cassette 20 and transmit the two substrates S1 and S2 to the coupling module 300.

The first hand 2210 and the second hand 2220 simultaneously carry out the two substrates S1 and S2 when the two substrates are adjacent to each other, for example, in the case where the two substrates are successively placed vertically on the cassette 20 . As another example, if the two substrates S1, S2 are spaced apart as if they were discontinuously located in the cassette 20 or placed in different cassettes 20, the first hand 2210 and the second hand 2220 ) Takes out the substrate, and the other takes out the substrate.

When the substrates S1 and S2 are brought into the coupling module 300 and the positions at which the substrates S1 and S2 are brought in are vertically continuous, (2220) simultaneously carry the two substrates (S1, S2). When one of the first hand 2210 and the second hand 2220 carries the substrate and then the other is moved to the other position, And the substrate is carried in.

The index robot 220 can take out the two substrates S1 and S2 from the coupling module 300 and transfer them to the cassette 20 in a similar manner as described above.

When the substrate to be transferred is one, the first hand 2210 or the first hand 2210 can transfer the substrate between the cassette 20 and the coupling module 300.

Before the index robot 220 loads the substrates S1 and S2 into the cassette 20 or the coupling module 300, the controller 900 calculates the positions of the substrates S1 and S2, To control the index robot 220 so that the substrate is flushed to a predetermined position.

When one of the first hand 2210 and the second hand 2220 picks up the substrate first, a delay time may occur until the other picks up the substrate. The control unit 900 may calculate the position of the substrate picked up first by the first hand 2210 or the second hand 2220 through the information provided by the sensors 2230 at the delay time. In this case, the controller 900 picks up the substrate of the first hand 2210 or the second hand 2220 in the course of flicking the substrate, and performs the flicking on the substrate having the position information of the substrate. The controller 900 calculates the positional information of the first hand 2210 and the second hand 2220 through the sensors 2230, and performs the flushing using the calculated positional information.

Fig. 7 is a side view of the first and second hands supporting the substrate, and Fig. 8 is a plan view of the first and second hands supporting the substrate.

7 and 8, when the first hand 2210 and the second hand 2220 simultaneously pick up the substrates S1 and S2 or when the substrates S1 and S2 are sequentially picked up, In the case where the position information of the picked-up substrate is not calculated, the two substrates S1 and S2 on which no position information is calculated are placed together between the light emitting portions 2231 and the light receiving portions 2232. Accordingly, the sensors 2230 can sense only the edge of the substrate positioned outside without being overlapped among the two substrates S1 and S2. At this time, the controller 900 calculates the position information of the substrate by considering the distance between the edge of the substrate and the edge of the substrate. Specifically, when the two substrates S1 and S2 are positioned so as to be superposed vertically, the distance between the edge and the edge of the substrate sensed by the sensors 2230 becomes equal to the diameter of the substrate. In this case, the controller 900 can calculate position information on both of the two substrates S1 and S2 using the information provided by the sensors 2230. [ The index robot 220 may simultaneously or sequentially perform the first and second hand 2210 and 2220 using the position information.

When the two substrates S1 and S2 are positioned to be offset from each other, the distance between the edge and the edge of the substrate provided by the pair of sensors 2230 or the pair of sensors 2230 facing each other is . At this time, if the distance between the facing corner and the edge is within the tolerance, the controller 900 calculates the position information of the virtual substrate based on the position of the edge provided by the sensors 2230. For example, you can calculate the center of a hypothetical circle with a radius of 1/2 the distance between the edges facing each other and the edge. Then, the center of the imaginary circle can be set as the center of the two substrates S1 and S2.

Then, the index robot 220 may simultaneously or sequentially perform the first and second hands 2210 and 2220 using the position information. When the index robot 220 performs sequential sequencing with respect to the first hand 2210 and the second hand 2220, it is preferable that the first hand 2210 and the second hand 2220 are flashed later For a hand to be performed, the position information of the remaining one of the substrates may be calculated again, and then it may be subjected to theplacing. On the other hand, the controller 900 may determine that the distance between the edge and the edge of the substrate provided by the pair of sensors 2230 or the pair of sensors 2230 is in an error state when the tolerance is exceeded. For example, when the diameter of the substrate is 300 mm, if the distance between the edge and the edge is 302 mm or less, it can be judged to be within the tolerance.

9 and 10 are diagrams showing a state in which position information is calculated for two superimposed substrates according to another embodiment.

9 and 10, when the first hand 2210a of the index robot 220a moves forward by a predetermined distance, only the substrate placed on the second hand 2220a is moved rearward of the sensors 2230a And is located between the positioned light emitting portions 2231a and the light receiving portions 2232a. Therefore, the controller 900 can detect the corner position of the substrate placed on the second hand 2220a through the information provided by the sensors 2230a positioned at the rear. Thereafter, when the first hand 2210a moves backward by the predetermined distance, only the substrate placed on the second hand 2220a is irradiated with the light emitting portions 2231a and the light receiving portions 2232a positioned in front of the sensors 2230a, . Accordingly, the controller 900 can sense the edge position of the substrate placed on the second hand 2220a through the information provided by the sensors 2230a located at the front. Then, the control unit 900 may combine the information provided by the sensors 2230a to calculate the position information of the substrate placed on the second hand 2220a. Therefore, in the process of flipping the substrate, the controller 900 first flakes the substrate of the second hand 2220a where the position information is calculated, then calculates the position information of the substrate of the first hand 2210a, The index robot 220a can be controlled to perform the racing. Although the first hand 2210a moves forward and backward to calculate the position information of the substrate placed on the second hand 2220a while the second hand 2220a is stopped, the first hand 2210a The second hand 2220a moves forward and backward to calculate the position information of the substrate placed on the first hand 2210a. Also, although the second hand 2220a moves forward and then moves rearward, the second hand 2220a may move backward and then move forward.

Although the ideal coupling module 300 includes buffers 320 and 330, the coupling module 300 may be provided to include a load lock chamber.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

100: Load port 200: Index module
220: index robot 300: linkage module
400: dispensing and developing module 500: buffer module
600: before and after exposure processing module 700: interface module

Claims (20)

A load port in which the cassette is located;
A coupling module in which the substrate can be temporarily placed; And
An index robot for transferring the substrate between the load port and the coupling module; And
And a control unit,
The index robot includes:
A first hand capable of supporting a first substrate;
A second hand capable of supporting a second substrate;
And a sensor for sensing an edge position of the first substrate or an edge position of the second substrate,
Wherein the controller calculates the position of the first substrate or the position of the second substrate through information provided by the sensor. The method according to claim 1,
Wherein the index robot transfers the first substrate and the second substrate from the coupling module to the load port or from the load port to the coupling module. The method according to claim 1,
Wherein the control unit controls the first hand and the second hand to simultaneously pick up the first substrate and the second substrate. The method according to claim 1,
Wherein the control unit controls the first hand and the second hand to sequentially pick up the first substrate and the second substrate. The method according to claim 1,
Wherein the control unit controls the first hand and the second hand to simultaneously flush the first substrate and the second substrate. The method according to claim 1,
Wherein the control unit controls the first hand and the second hand to successively flush the first substrate and the second substrate. The method according to claim 1,
Wherein the controller is configured to control the first substrate and the second substrate in a state in which the first and second hands are positioned such that the first substrate and the second substrate are positioned up and down, And calculates positional information of the first substrate and the second substrate on the basis of information about an edge of the substrate. 8. The method of claim 7,
Wherein the controller determines that the distance between the edges of the first substrate or the edges of the second substrate sensed by being located at positions facing each other among the sensors is within an allowable tolerance with respect to the diameter of the first substrate or the second substrate , The position information is calculated. 9. The method of claim 8,
Wherein the controller controls a center of a circle having a radius of a half of a distance between an edge of the first substrate or an edge of the second substrate, And the center of the second substrate. The method according to claim 1,
The control unit moves the first and second hands forward and backward by a predetermined distance in a state in which the first and second hands are positioned such that the first substrate and the second substrate are positioned up and down, Wherein the sensors detect the position of the first substrate or the second substrate. A first hand capable of supporting a first substrate;
A second hand capable of supporting a second substrate;
A sensor for sensing an edge position of the first substrate or an edge position of the second substrate; And
When the position of the edge sensed by the sensors is within an allowable error in a state where the first hand and the second hand are positioned so that the first substrate and the second substrate are positioned up and down, And the position information of the index robot. 12. The method of claim 11,
Wherein the tolerance is determined by comparing the distance between the edge of the first substrate or the edge of the second substrate sensed by being positioned at the center of the sensors with the diameter of the first substrate or the second substrate The indexed robot judged. 13. The method of claim 12,
Wherein the first substrate and the second substrate have a diameter of 300 mm and the tolerance is 2 mm. A substrate transfer method for transferring a substrate using a first hand and a second hand,
Placing a first hand supporting the first substrate and a second hand supporting the second substrate such that the first substrate and the second substrate are positioned up and down;
Sensing the edges of the first substrate and those positioned outside of the second substrate with sensors; And
And calculating the position of the first substrate and the second substrate based on the position of the edges. 15. The method of claim 14,
Wherein the positions of the first substrate and the second substrate are calculated when a distance between opposing corners of the corners is within an allowable tolerance with respect to a diameter of the first substrate or the second substrate. 16. The method of claim 15,
Wherein the tolerance is 2 mm. 15. The method of claim 14,
Wherein a center of a circle having a radius of 1/2 of a distance between opposing edges among the corners is set as a center of the first substrate and the second substrate. A substrate transfer method for transferring a substrate using a first hand and a second hand,
Placing a first hand supporting the first substrate and a second hand supporting the second substrate such that the first substrate and the second substrate are positioned up and down;
Sensing the edges of the first substrate and those positioned outside of the second substrate with sensors; And
And calculating positional information of the first substrate and the second substrate at positions of the edges detected by the sensors. 19. The method of claim 18,
Wherein the position information is calculated only when a distance between opposing corners of the corners is within an allowable error with respect to a diameter of the first substrate or the second substrate. 20. The method of claim 19,
Wherein the tolerance is 2 mm.

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