KR20170109315A

KR20170109315A - Elastic Thermistor Assembly

Info

Publication number: KR20170109315A
Application number: KR1020160033265A
Authority: KR
Inventors: 김선기
Original assignee: 조인셋 주식회사
Priority date: 2016-03-21
Filing date: 2016-03-21
Publication date: 2017-09-29
Also published as: KR101884601B1

Abstract

A chip thermistor having a body composed of a functional ceramic material in which at least a pair of external electrodes are spaced apart and whose electrical resistance changes according to a temperature change; And a thermally conductive elastic member having a surface bonded to the upper surface of the main body through an adhesive means, wherein the other surface of the elastic member maintains a state of being directly in elastic contact with the opposing object, A thermistor assembly having elasticity is provided that senses a temperature change due to heat flowing from the object through the elastic member.

Description

Elastic Thermistor Assembly < RTI ID = 0.0 >

[0001] The present invention relates to a thermistor assembly, and more particularly to a thermistor assembly capable of performing temperature sensing in direct contact with an object.

As is well known, a thermistor is a type of resistor that refers to an electrical device that uses properties that change the resistance of a material with temperature.

For example, it is mounted on a circuit board of a mobile device such as a mobile phone or a notebook computer, and is used to measure an internal temperature and perform an operation according to a temperature change.

Meanwhile, in recent years, since the metal case is used for a mobile device, heat is often transmitted from the outside through the metal case rapidly, and accordingly, the temperature of the thermistor needs to be quickly detected.

However, in the related art, there is no great problem because the thermistor is mounted on the circuit board and the air temperature inside the case is mainly measured by the electronic component. However, it is difficult to quickly measure the heat transmitted from the outside through the metal case There is a problem.

In other words, since the temperature of the air inside the case is increased by the heat transmitted from the outside through the metal case, the thermistor can measure the temperature of the increased air, and the response is accordingly delayed.

This necessity can be applied to a sensitive refrigerator or a meter, and it is necessary to provide a thermistor that can quickly and accurately detect a temperature change due to heat transmitted through a subject having good thermal conductivity.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a thermistor assembly capable of quickly and accurately detecting a temperature change due to heat transmitted from the outside through a metal case.

Another object of the present invention is to provide a thermistor assembly which is easy to manufacture and mount and which is economical.

It is another object of the present invention to provide a thermistor assembly which has a large working distance even in the mechanical dimensional tolerance between a printed circuit board and an object and can maintain reliable contact with an object sensitive to temperature change because of its elasticity and elastic restoration rate.

It is another object of the present invention to provide a thermistor assembly which is easy to mount and which can be soldered by vacuum pick-up.

The above object is also achieved by a chip thermistor having a body composed of a functional ceramic material in which at least a pair of electrodes are spaced apart and whose electrical resistance changes according to a temperature change; And a thermally conductive elastic member having a surface bonded to the upper surface of the main body through an adhesive means, wherein the other surface of the elastic member maintains a state of being directly in elastic contact with the opposing object, And a temperature change due to heat flowing from the object through the elastic member is sensed by the thermistor assembly having elasticity.

Preferably, at least one internal electrode electrically connected to the external electrode may be formed in the body.

Preferably, a protective layer made of glass or polymer is coated on the surface of the body.

Preferably, the elastic member may be bonded on the dummy pattern formed on the upper surface of the body by electrically separating the paste containing the metal powder from the external electrode by hardening, firing or baking.

Preferably, the electrode may be formed on the body by curing, firing or baking the paste containing the metal powder.

Preferably, the electrode may be formed on both side walls or bottom surfaces of the chip thermistor.

Preferably, the bonding means is thermally conductive and may be any of soldering by a solder cream, adhesion by a thermally conductive adhesive, or metal welding.

Preferably, the elastic member comprises: a) an elastic member composed of a) an elastic core including a foam rubber or a rubber tube and a thermally conductive coating layer wrapped around the elastic core, b) an elastic member composed of the elastic core and a metal layer wrapped thereon, c) a metal plate spring or a metal coil spring, or d) a gasket having a metal or a thermally conductive elastic rubber.

Preferably, the electrode can be mounted on the printed circuit board by soldering.

Preferably, the object is thermally conductive and may be a metal case, metal chassis or metal framework.

Preferably, the thermistor assembly is such that the elastic member is surface mounted on the circuit board by vacuum pick-up, and the electrode is fixed to the circuit board by reflow soldering by a solder cream.

Preferably, the thermistor assembly is mounted and used in a mobile device including a smart phone.

The above object is achieved by a thermistor assembly for a mobile device having a metal case, comprising: a ceramic chip thermistor composed of a ceramic material having external electrodes formed on at least a lower surface thereof; And a thermally conductive elastic member bonded to the upper surface of the ceramic chip thermistor by a thermally conductive adhesive means, wherein the thermally conductive elastic member maintains a state of being elastically brought into direct contact with the metal case, And the ceramic chip thermistor senses a temperature change due to heat flowing from the metal case through the thermally conductive elastic member. The thermistor assembly has elasticity.

Preferably, the thermally conductive adhesive means is soldering, bonding or welding with a thermally conductive adhesive, and the thermally conductive elastic member may be a metal spring, a gasket containing at least a metal, or a thermally conductive rubber.

According to the above configuration, since the thermistor assembly is elastically contacted directly with the metal case, the temperature increase due to heat transmitted from the outside through the metal case can be quickly detected.

Further, since the working distance of the thermally conductive elastic member is large, and the elasticity and the restoration ratio are good, the contact with the opposing object can always be maintained.

In addition, since the bonding means is thermally conductive, the temperature of the object can be quickly transmitted to the thermistor.

Also, the electrodes can be soldered to the printed circuit board by solder cream.

In addition, surface mounting by vacuum pickup is easy and reflow soldering is possible, which makes mounting easy.

1 (a) is a perspective view showing a thermistor assembly according to an embodiment of the present invention, and FIG. 1 (b) is a sectional view.
Figure 2 shows the use of a thermistor assembly.
3 shows a thermistor assembly according to another embodiment of the present invention.

It is noted that the technical terms used in the present invention are used only to describe specific embodiments and are not intended to limit the present invention. In addition, the technical terms used in the present invention should be construed in a sense generally understood by a person having ordinary skill in the art to which the present invention belongs, unless otherwise defined in the present invention, Should not be construed as interpreted or interpreted in an excessively reduced sense. In addition, when a technical term used in the present invention is an erroneous technical term that does not accurately express the concept of the present invention, it should be understood that technical terms can be understood by those skilled in the art. In addition, the general terms used in the present invention should be interpreted according to a predefined or prior context, and should not be construed as being excessively reduced.

Furthermore, the singular expressions used in the present invention include plural expressions unless the context clearly dictates otherwise. In the present invention, the terms such as " comprises " or " comprising " and the like should not be construed as encompassing various elements or various steps of the invention, Or may further include additional components or steps.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 (a) is a perspective view showing a thermistor assembly according to an embodiment of the present invention, FIG. 1 (b) is a side view, and FIG. 2 shows the use of a thermistor assembly.

A pair of external electrodes 112 and 113 are formed on the lower surface of the main body 110 and a leaf spring 130 made of a metal is adhered and fixed to the upper surface of the main body 110 by a thermally conductive adhesive 120.

The main body 110 is formed of a functional ceramic material having a chip shape, that is, a hexahedron shape and whose electrical resistance varies with temperature.

On the surface of the main body 110, a protective layer 111 coated with glass or a polymer material may be formed to prevent corrosion of the ceramic body 110.

An internal electrode electrically connected to the external electrodes 112 and 113 may be formed in the body 110. When the internal electrode is provided, it is advantageous that the thermistor characteristics can be more precisely and accurately realized in a small dimension.

The main body 110 and the pair of external electrodes 112 and 113 constitute a single thermistor assembly and the plate spring 130 is used in direct contact with the thermally conductive object such as the metal case or the metal structure 20 .

As shown in FIG. 2, the thermistor assembly 100 is reel taped and vacuum-picked up the leaf spring 130 to be surface-mounted on the conductive pattern 12 of the circuit board 10, And the plate spring 130 is pressed to be pressed by the metal case 20 at the upper portion so that the direct contact is always maintained.

The leaf spring 130 is adhered onto the body 110, which is used to mean both adhesion and adhesion, and may also include optical bonding and physical bonding.

In this embodiment, the plate spring 130 has a Z-shape when viewed from the side, but is not limited thereto. The plate spring 130 may have a Z- C 'shape or the like, and a coil type or pressure contact type spring can be applied.

The leaf spring 130 is made of a single body, and a metal foil having good elasticity such as phosphor bronze or copper alloy having a thickness of 0.05 mm to 0.15 mm, for example, can be continuously produced by press using a press die.

Here, the plate spring 130 may be manufactured by pressing tin, silver or gold to prevent oxidation.

The upper surface of the leaf spring 130 has a relatively large area and is planar and has an advantage of facilitating thermal contact with an opposing object having various structures and increasing contact with an object, thereby facilitating heat transfer.

The size of the lower surface of the leaf spring 130 is not particularly limited, but may be the same as or similar to the size of the upper surface of the main body 110. In addition, when the main body 110 is large, it may be considered to mount a plurality of small-sized leaf springs on the main body 110.

The dimensions of the thermistor assembly 100 are not limited, but may be, for example, 1 mm to 3 mm in width and 0.5 mm to 2.0 mm in height, and the vertical operating distance by elasticity is 30% or more of the original height, 0.5 W / K or more.

The external electrodes 112 and 113 are formed on the body 110 by curing, firing, or baking, etc., with a paste containing a metal powder.

In this embodiment, it is needless to say that the external electrodes 112 and 113 are formed on the lower surface of the main body 110, but are not limited thereto and may be formed on both opposite sides.

In this embodiment, the leaf spring 130 is bonded onto the main body 110 through the thermally conductive adhesive 120, but not limited thereto, and can be bonded by soldering by solder cream or metal welding.

When the protective layer 111 is formed on the surface of the main body 110, the leaf spring 130 is bonded to the protective layer 111 via the thermally conductive adhesive 120.

In addition, a dummy pattern can be formed in order to bond by soldering with a solder cream or metal welding. In other words, as described above, the external electrodes 112 and 113 are formed by curing, firing or baking the paste containing the thermally conductive powder. At this time, the dummy patterns electrically separated from the external electrodes 112 and 113 And the plate spring 130 can be bonded to the dummy pattern by soldering or metal welding on the solder cream.

The main body 110 may be formed of ceramics containing metal oxides such as Mn, Ni, and Co as main components, or may contain Fe, Cu, Al, Zr, or the like as a subcomponent for adjustment of characteristics. Further, instead of the respective metal oxides of Mn, Ni and Co, Mn and Ni metal oxides and Mn and Co metal oxides may be used.

In this embodiment, the leaf spring 130 is used as a constituent part for elasticity, but is not limited thereto, and is not limited thereto. That is, a) an elastic member composed of an elastic core including a foamed rubber or rubber tube and a thermally conductive coating layer c) a metal plate spring or a metal coil spring; or d) a gasket having a metal or a thermally conductive elastic rubber.

As shown in FIG. 2, when the external electrodes 112 and 113 of the thermistor assembly 100 are soldered and adhered to the conductive pattern 12 of the printed circuit board 10, 20 are directly contacted and resiliently supported, the heat generated by the outside is directly transmitted to the main body 110 through the leaf spring 130 when the heat is introduced through the metal case 20, can do.

The temperature change sensed by the thermistor assembly 100 may be used to indicate the temperature of the metal object 20 or to control the temperature.

Here, in addition to the metal case 20, a metal sash or a metal structure may be applied.

3 shows a thermistor assembly according to another embodiment of the present invention.

The thermally conductive elastic member 230 constituting the thermistor assembly 200 may be composed of an elastic core 231 including rubber and a thermally conductive sheet 232 wrapped around the elastic core 231.

Here, the thermally conductive sheet 232 may be, for example, a thermally conductive heat-resistant polymer film in which a metal layer is integrally formed on the back surface or a metal foil is adhered thereto.

A rubber tube can be applied to the elastic core 231 and provides the compression and resilient restoration of the thermistor assembly 200 and the thermally conductive sheet 232 wrapping around the elastic core 231 is used as a path for transferring heat.

External electrodes 212 and 213 are formed on opposite sides of the main body 210 and the elastic member 230 is bonded to the upper surface of the main body 210 through the thermally conductive adhesive 320, 212 and 213 so as not to be in contact with the external electrodes 212 and 213.

The thermistor assembly 200 is formed by successively laminating and bonding the main body 210 and the elastic member 230 having a uniform thickness of about 150 mm x 150 mm in width and length, And thus the production is easy, and the quality is stable and uniform as a whole.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or essential characteristics thereof. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100, 200: Thermistor assembly
112, 113, 212, 213: external electrodes
110, 210:
120, 220: thermally conductive adhesive
130: leaf spring
230: elastic member

Claims

A chip thermistor including a main body composed of a functional ceramic material in which at least a pair of external electrodes are spaced apart and whose electrical resistance changes according to a temperature change; And
And a thermally conductive elastic member having one surface bonded to the upper surface of the main body through an adhesive means,
Characterized in that the other surface of the elastic member is maintained in a state of being elastically contacted directly with an opposed object and the chip thermistor senses a temperature change due to heat flowing from the object through the elastic member Thermistor assembly.

In claim 1,
Wherein the external electrode is formed on the body by curing, firing or baking a paste containing metal powder.

In claim 1,
Wherein the external electrodes are formed on both side walls or bottom surfaces of the chip thermistor.

In claim 1,
Wherein the bonding means is thermally conductive and is any of soldering by a solder cream, adhesion by a thermally conductive adhesive, or metal welding.

In claim 1,
Wherein the chip thermistor has a hexahedral shape.

In claim 1,
The elastic member
a) an elastic member composed of an elastic core including a foam rubber or a rubber tube and a thermally conductive coating layer wrapped around the elastic core,
b) an elastic member comprising the elastic core and a metal layer wrapped thereon,
c) metal plate spring or metal coil spring, or
and d) a gasket having a metal or a thermally conductive elastic rubber.

In claim 1,
Wherein the external electrodes are bonded to the printed circuit board by soldering.

In claim 1,
Wherein the object is thermally conductive and is a metal case, a metal chassis or a metal framework.

In claim 1,
Wherein the thermistor assembly is such that the elastic member is surface-mounted to the circuit board by vacuum pick-up, and the external electrode is fixed to the circuit board by reflow soldering with a solder cream.

In claim 1,
Wherein the thermistor assembly is mounted on and used in a mobile device including a smart phone.

In claim 1,
Wherein at least one internal electrode electrically connected to the external electrode is formed in the body.

In claim 1,
Wherein a protective layer made of glass or polymer is coated on the surface of the main body.

In claim 1,
Wherein the elastic member is electrically separated from the external electrode by curing, firing, or baking, and the paste including the metal powder is bonded onto the dummy pattern formed on the upper surface of the main body.

A thermistor assembly for a metal object,
A ceramic chip thermistor composed of a ceramic material having external electrodes formed on at least a lower surface thereof; And
And a thermally conductive elastic member bonded to the upper surface of the ceramic chip thermistor by thermally conductive adhesive means,
Wherein the thermally conductive elastic member is held in a state of being elastically contacted directly with the metal object and the outer electrode is mounted on a circuit board by soldering, Wherein the thermistor assembly has an elasticity.

In claim 14,
Wherein the thermally conductive adhesive means is soldering, bonding or welding with a thermally conductive adhesive, and the thermally conductive elastic member is a metal spring, a gasket comprising at least a metal, or a thermally conductive rubber.