KR20170081052A - Pad area electrode structure and display device having the same - Google Patents

Abstract

The present invention discloses a pad electrode structure and a display device having the pad electrode structure designed to prevent defective SiON residue film from occurring in the process of removing the outer protective layer by a laser patterning process.
To this end, the pad electrode structure and the display device having the pad structure according to the present invention are designed to protrude outward from both long sides of the second pad when designing the second pad.
Accordingly, the pad electrode structure and the display device having the pad electrode structure according to the present invention can increase the area of the second pad through the design of the protrusion while minimizing the area increase of the pad electrode, It is possible to secure the bonding resistance by the effect of expanding.
Accordingly, the pad electrode structure according to the present invention and the display device having the pad electrode structure according to the present invention can completely remove the outer protective layer covering the pad electrode, thereby preventing defective SiON residual film, thereby improving the production yield.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a pad electrode structure,

The present invention relates to a pad electrode structure and a display device having the same.

2. Description of the Related Art In recent years, various flat panel display devices capable of reducing weight and volume, which are disadvantages of a cathode ray tube (CRT), have been developed. Such flat panel display devices include a liquid crystal display, a field emission display, a plasma display panel, and an electro-luminescence display device.

Researches for increasing the display quality of such a flat panel display device and attempting to make it larger have been actively conducted. Among these, the plasma display panel has attracted attention as a most advantageous display device in terms of simplicity and small size because of its simple structure and manufacturing process, but it has a disadvantage of low luminous efficiency, low luminance and high power consumption. On the other hand, an active matrix liquid crystal display device to which a thin film transistor (TFT) is applied as a switching device is difficult to make a large screen because it uses a semiconductor process. Further, there is a drawback in that power consumption is large due to the backlight unit, and optical elements such as a polarizing filter, a prism sheet, and a diffusion plate have a large optical loss and a narrow viewing angle.

On the other hand, the organic electroluminescence display device is a self-luminous element which emits light by itself, has a high response speed, and is advantageous in luminous efficiency, luminance and viewing angle. In addition, the organic light emitting display device can be driven at a low DC voltage of several tens volts, have a fast response speed, can obtain high luminance, and emit various colors of R, G, and B.

FIG. 1 is a cross-sectional view of a conventional organic light emitting display device, and FIG. 2 is a schematic view illustrating a process of removing an outer protective layer by a laser patterning method.

1 and 2, a conventional organic light emitting display device 1 includes a first substrate 10 and a second substrate 95 opposed to the first substrate 10.

At this time, the first substrate 10 has a display area AA for realizing an image and a non-display area NAA for not realizing an image. As the material of the first substrate 10, glass, plastic, or the like may be used. As the material of the second substrate 95, glass, plastic, stainless steel, face seal metal, or the like can be used. In the process of using the face seal metal, have.

A plurality of pixel regions (not shown) defined by intersecting a plurality of gate wirings (not shown) and a plurality of data wirings (not shown) are formed in the display region AA on the first substrate 10, A thin film transistor DTr arranged for each pixel region, and an organic light emitting diode E connected to the thin film transistor DTr.

In addition, the conventional organic light emitting display device 1 may further include a protective bonding layer 90 and a capping layer 65.

The protective adhesive layer 90 is disposed between the first substrate 10 and the second substrate 95 and serves to adhere the first substrate 10 and the second substrate 95 to each other.

The capping layer 65 is designed to cover the top of the organic light emitting diode E and protects the organic light emitting diode E from moisture and moisture introduced from the outside.

On the other hand, the pad portion 40 is disposed in the non-display area NAA of the first substrate 10. At this time, the pad portion 40 may include a gate pad portion and a data pad portion. In addition, the pad portion 40 may include a power supply pad portion connected to power supply wiring (not shown) spaced apart from the plurality of data wirings.

At this time, the pad portion 40 disposed in the non-display area NAA on the first substrate 10 and the outer protective layer 85 covering the entire surface of the capping layer 65 disposed in the display area AA are further disposed . The outer protective layer 85 protects the thin film transistor DTr and the organic light emitting diode E disposed inside the first substrate 10 from moisture and moisture.

In this case, the outer protective layer 185 is deposited on the entire surface of the first substrate 10 without using a mask, and then only the outer protective layer 85 covering the pad portion 40 is selectively patterned by laser patterning equipment The pad portion 40 is exposed.

That is, after the outer protective layer 85 is formed by performing front-surface deposition on the entire surface of the display area AA and the non-display area NAA on the first substrate 10 without using a mask, The first substrate 10 and the second substrate 95 are attached to each other through the through hole 90.

When the adhesion between the first substrate 10 and the second substrate 95 is completed, the laser patterning equipment L is mounted on the upper portion of the outer protective layer 85 covering the pad portion 40 The pad portion 40 on the first substrate 10 is exposed by laser irradiation while moving the laser patterning equipment L along the X-axis and Y-axis directions.

However, in the conventional organic light emitting display device 1, in the laser patterning process using the laser patterning device L, the outer protective layer 85 covering the pad portion 40 can not be completely removed, The residual film defect has occurred. Accordingly, the organic light emitting display device 1 according to the related art has a problem that the contact reliability of the pad portion 140 is deteriorated due to a defective residual film occurring in a laser patterning process.

This will be described more specifically with reference to the accompanying drawings.

3 is a cross-sectional view taken along the line IV-IV 'in FIG. 3, and FIG. 5 is a cross-sectional view taken along the line V-V' in FIG. Sectional view.

3 to 5, a conventional pad electrode structure 40 includes a first pad 42, insulating films 25 and 35, a second pad 44, and a pad electrode 46 do.

The first pad 42 is disposed in the non-display area NAA on the first substrate 10. [ The first pads 42 may be disposed on the same layer as the gate wiring (not shown) disposed along the first direction on the first substrate 10.

The insulating films 25 and 35 may include a gate insulating film 25 and an interlayer insulating film 35 which are sequentially stacked on the first substrate 10. At this time, the first pad 42 may be disposed on the gate insulating film 25.

The insulating films 25 and 35 have a plurality of pad contact holes PCH exposing the first pads 42. More specifically, the plurality of pad contact holes PCH may be formed by removing a part of the interlayer insulating film 25 from among the insulating films 25 and 35 covering the first pads 42.

The second pad 44 is connected to the first pad 42 through a plurality of pad contact holes PCH. Accordingly, the second pads 44 are disposed on the interlayer insulating film 25.

The pad electrode 46 is stacked on the second pad 44 and connected to the second pad 44. The pad electrode 46 may be formed of a transparent metal such as ITO, IZO, or ITZO.

At this time, the second pad 44 is designed as a rectangle having a first area when viewed in a plan view. The electrode pad 46 is designed to extend from the upper portion of the second pad 44 to the outside of the second pad 44 and cover the second pad 44 when viewed in a plan view . Accordingly, the pad electrode 46 has a second area larger than the first area.

Particularly, in the conventional pad electrode structure 40, the distance d from the end of the second pad 44 to the end of the pad electrode 46 is designed to be 2.6 to 3.4 μm, ) Is designed to be 13.5 to 15.5 mu m.

The pad electrode structure 40 according to the related art has a structure in which a plurality of pad contact holes PCH are arranged and a plurality of pads 44 are formed by designing the second pad 44 and the pad electrode 46 in a rectangular shape, The distance from the end of the second pad 44 to the end of the pad electrode 46 is designed to be 2.6 to 3.4 탆 without any distinction of the portion where the contact hole PCH is not disposed.

In this case, when the distance from the end of the second pad 44 to the end of the pad electrode 46 is increased to improve the conductivity by enlarging the area of the pad electrode 46, The transfer may be performed well and the residual film may not be generated.

However, in the conventional organic light emitting display device 1, since the area of the pad portion 40 becomes narrower in accordance with the trend of high resolution, the distance from the end of the second pad 44 to the end of the pad electrode 46 There is a limitation in the circuit design to increase the interval, and therefore it is impossible to design the area of the pad electrode 46 by extension.

For this reason, the organic electroluminescent display device 1 according to the related art has a problem in that the production yield is lowered due to defective residual film occurring in the laser patterning process.

A related prior art is Korean Patent Registration No. 10-0624314 (published on Sep. 19, 2006), which discloses a light emitting display device and a thin film transistor.

The present invention provides a pad electrode structure and a display device having the pad electrode structure, which are designed to prevent defective SiON residue film from occurring in the process of removing the external protection layer by a laser patterning process.

To this end, the pad electrode structure and the display device having the pad structure according to the present invention are designed to protrude outward from both long sides of the second pad when designing the second pad.

More specifically, the pad electrode structure and the display device having the pad electrode structure according to the present invention are designed so that the first distance d1, which is the distance between the long side ends of both sides of the pad electrode and the end of the projection of the second pad, is 2.6 to 3.4 μm .

In contrast, the pad electrode structure and the display device having the pad electrode structure according to the present invention are designed to have a second gap d2 of 4 to 6 μm, which is a distance from both long side ends of the pad electrode to both long side ends of the second pad .

Accordingly, the pad electrode structure and the display device having the pad electrode structure according to the present invention can increase the area of the second pad through the design of the protrusion while minimizing the area increase of the pad electrode, Can be improved to improve the bonding resistance.

In addition, the pad electrode structure and the display device having the pad electrode structure according to the present invention can minimize the area increase of the pad electrode, and can prevent the pad electrode and the second pad from being damaged during the laser patterning process using the laser pad- As the conductivity increases due to the increased contact area, heat transfer can be efficiently performed.

The pad electrode structure according to the present invention and the display device having the pad electrode structure according to the present invention are designed such that protrusions protruding outward from both long sides of the second pad when designing the second pad are designed.

Accordingly, the pad electrode structure according to the present invention and the display device having the pad electrode structure have a first distance d1 of 2.6 to 3.4 탆 which is a distance from both long sides of the pad electrode to the end of the projection of the second pad.

In contrast, in the pad electrode structure and the display device having the pad electrode structure according to the present invention, the second interval d2 between the long side ends of both sides of the pad electrode to the long side ends of both sides of the second pad is 4 to 6 탆.

Therefore, the pad electrode structure and the display device having the pad electrode structure according to the present invention have a length deviation between the first interval and the second interval.

As a result, the pad electrode structure and the display device having the pad electrode structure according to the present invention can increase the area of the second pad through the design of the projection while minimizing the area increase of the pad electrode, Can be improved to improve the bonding resistance.

In addition, the pad electrode structure and the display device having the pad electrode structure according to the present invention can minimize the area increase of the pad electrode, and can prevent the pad electrode and the second pad from being damaged during the laser patterning process using the laser pad- As the conductivity increases due to the increased contact area, heat transfer can be efficiently performed.

Therefore, the pad electrode structure and the display device having the pad electrode structure according to the present invention can completely remove the outer protective layer covering the pad electrode, so that defective SiON residual film is not generated.

The pad electrode structure and the display device having the pad electrode structure according to the present invention can increase the area of the second pad by designing the protrusion while minimizing the area increase of the pad electrode, It is possible to improve the bonding resistance.

In addition, the pad electrode structure and the display device having the pad electrode structure according to the present invention can minimize the area increase of the pad electrode, and can prevent the pad electrode and the second pad from being damaged during the laser patterning process using the laser pad- As the conductivity increases due to the increased contact area, heat transfer can be efficiently performed.

Therefore, the pad electrode structure and the display device having the pad electrode structure according to the present invention can completely remove the outer protective layer covering the pad electrode, and the defective SiON residual film does not occur, so that the production yield can be improved.

1 is a cross-sectional view of a conventional organic light emitting display device.
2 is a schematic view for explaining a process of removing an outer protective layer by a laser patterning method.
3 is a plan view of a conventional pad electrode structure.
4 is a cross-sectional view taken along line IV-IV 'of FIG. 3;
5 is a cross-sectional view taken along the line V-V 'in FIG. 3;
6 is a cross-sectional view illustrating a display device according to an embodiment of the present invention.
7 is a plan view showing a pad electrode structure according to an embodiment of the present invention.
FIG. 8 is an enlarged plan view of the unit pad portion of FIG. 7; FIG.
9 is a cross-sectional view taken along line IX-IX 'of Fig.
10 is a sectional view taken along the line X-X 'in Fig. 8; Fig.

The above and other objects, features, and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings, which are not intended to limit the scope of the present invention. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to denote the same or similar elements.

Hereinafter, a pad electrode structure according to a preferred embodiment of the present invention and a display device having the same will be described with reference to the accompanying drawings.

FIG. 6 is a cross-sectional view illustrating a display device according to an embodiment of the present invention, and FIG. 7 is a plan view illustrating a pad electrode structure according to an embodiment of the present invention.

6 and 7, a display device 100 according to an exemplary embodiment of the present invention includes a first substrate 110, a thin film transistor DTr, an organic light emitting diode E, a capping layer 165, A second pad 144, a pad electrode 146, and an external protection layer 185. The first and second pads 144,

The first substrate 110 has a display area AA and a non-display area NAA. As the material of the first substrate 110, glass, plastic, or the like may be used. Although not shown in detail in the drawing, a buffer layer (not shown) may be further disposed on the first substrate 110. At this time, the buffer layer prevents the characteristic of the semiconductor layer 120 from being deteriorated due to the release of the alkali ions, which are released from the inside of the first substrate 110, when the semiconductor layer 120 of the thin film transistor DTr is crystallized.

The thin film transistor DTr includes a semiconductor layer 120 disposed on the first substrate 110, a gate insulating layer 125 covering the semiconductor layer 120, a gate insulating layer 125 overlapping the semiconductor layer 120, An interlayer insulating film 135 covering the gate electrode 122 and a source connected to the semiconductor layer 120 so as to be spaced apart from each other and sandwiching the gate electrode 122 between the gate electrode 122 and the gate electrode 122, Drain electrodes 122 and 124, respectively. The thin film transistor DTr may include a driving transistor and a switching transistor, and in FIG. 6, only the driving transistor is shown as an example.

At this time, the semiconductor layer 120 is made of silicon, and includes an active region 120a disposed at the center and forming a channel, a source and drain region 120b doped with a high impurity concentration at both sides of the active region 120a, , And 142c.

The source and drain electrodes 132 and 134 are electrically connected to the source and drain regions 120a and 120b of the semiconductor layer 120 through first and second semiconductor layer contact holes (not shown) (120b, 120c), respectively.

The organic light emitting diode E includes a first electrode 160 connected to the thin film transistor DTr, an organic light emitting layer 170 laminated on the first electrode 160, and a second electrode 160 laminated on the organic light emitting layer 170. [ Electrode 180 as shown in FIG. For example, the first electrode 160 may serve as an anode, and the second electrode 180 may serve as a cathode.

The capping layer 165 is designed to cover the upper side of the organic light emitting diode E and protects the organic light emitting diode E from moisture and moisture introduced from the outside.

The first pad 142 is disposed in the non-display area NAA on the first substrate 110. [ The first pad 142 may be disposed at the edge of the non-display area NAA on the first substrate 110. The first pad 142 may be disposed on the same layer as the gate wiring (not shown) disposed in the display area AA on the first substrate 110.

The insulating films 125, 135, and 145 cover the display area AA and the non-display area NAA on the first substrate 110 and include a plurality of pad contact holes PCH ). The insulating layers 125, 135, and 135 may include a first insulating layer 125, a second insulating layer 135, and a third insulating layer 145, which are sequentially stacked on the first substrate 110.

Here, the first insulating layer 125 may be a gate insulating layer, the second insulating layer 135 may be an interlayer insulating layer, and the third insulating layer 145 may be a protective layer. The third insulating layer 135 may be formed to cover only the display area AA on the first substrate 110. [ Here, the first pad 142 may be disposed on the first insulating layer 125.

The plurality of pad contact holes PCH may be formed by removing a portion of the second insulating layer 135 among the insulating layers 125, 135, and 145 covering the first pad 142. The plurality of pad contact holes PCH are spaced apart in a matrix form having a plurality of rows and a plurality of rows. In FIG. 7, a plurality of pad contact holes (PCH) are arranged in a 4 x 5 array structure. However, the array structure may be variously applied.

The second pad 144 is connected to the first pad 142 through a plurality of pad contact holes PCH. The second pad 144 has a plurality of protrusions 144a protruding from both long sides. At this time, the plurality of protrusions 144a are arranged on the same line corresponding to the plurality of pad contact holes PCH.

The pad electrode 146 is stacked on the second pad 144 and connected to the second pad 144. The pad electrode 146 is extended to the outside of the second pad 144. The pad electrode 146 may be disposed on the same layer as the first electrode 160 of the organic light emitting diode E disposed in the display area AA of the first substrate 110. Accordingly, the pad electrode 146 may be formed of a transparent metal such as ITO, IZO, or ITZO.

The pad portion 140 may include the first pad 142, the second pad 144, and the pad electrode 146 described above. At this time, the pad portion 140 may include a gate pad portion and a data pad portion. In addition, the pad portion 140 may include a power supply pad portion connected to a power supply line (not shown) spaced apart from the plurality of data lines.

The external protection layer 185 covers the capping layer 165 and the pad electrode 146 and has a pad electrode contact hole LCH exposing a part of the pad electrode 146. As the material of the outer protective layer 185, for example, SiON may be used. At this time, the pad electrode contact hole (LCH) is formed by selectively removing the outer protective layer 185 covering a part of the pad electrode 146 by a laser patterning process using laser patterning equipment.

In addition, the display device 100 according to the embodiment of the present invention may further include a second substrate 195 and a protective adhesive layer 190.

At this time, the second substrate 195 is disposed at an upper portion apart from the outer protective layer 190. As the material of the second substrate 195, glass, plastic, stainless steel, face seal metal, or the like can be used, and the use of the face seal metal is increasing.

The protective adhesive layer 190 is disposed between the second substrate 195 and the outer protective layer 185 to bond the first and second substrates 110 and 195 together.

The display device 100 according to the embodiment of the present invention may have a protrusion 144a formed on both sides of both sides of the second pad 144 so that the protrusion 144a of the second pad 144 may be protruded from both long- The spacing between the ends of the pad electrode 146 and both ends of both sides of the pad electrode 146 is differentially designed to improve the defects that may occur during the laser patterning process.

This will be described more specifically with reference to the accompanying drawings.

8 is a cross-sectional view taken along the line IX-IX 'of Fig. 8, and Fig. 10 is a cross-sectional view taken along the line X-X' of Fig. 8 Sectional view.

8 to 10, the pad electrode structure 140 according to the embodiment of the present invention includes a first pad 142, insulating films 125 and 135, a second pad 144, and a pad electrode 146).

The first pad 142 is disposed in the non-display area NAA on the first substrate 110 having the display area AA and the non-display area NAA. The first pad 142 may be disposed at the edge of the non-display area NAA on the first substrate 110.

The insulating films 125 and 135 cover the display area AA and the non-display area NAA on the first substrate 110 and include a plurality of pad contact holes PCH exposing a part of the first pad 142 . The insulating layers 125 and 135 may include a first insulating layer 125 and a second insulating layer 135 sequentially stacked on the first substrate 110. The insulating films 125 and 135 may further include a third insulating film 145 (FIG. 6) stacked on the second insulating film 125.

Here, the first insulating layer 125 may be a gate insulating layer, the second insulating layer 135 may be an interlayer insulating layer, and the third insulating layer may be a protective layer. The third insulating film may not be formed in the non-display area NAA on the first substrate 110 but may be formed to cover only the display area AA.

The plurality of pad contact holes PCH may be formed by removing a part of the second insulating layer 135 from among the insulating layers 125 and 135 covering the first pad 140. The plurality of pad contact holes PCH are spaced apart in a matrix form having a plurality of rows and a plurality of rows. In FIG. 7, a plurality of pad contact holes (PCH) are arranged in a 4 x 5 array structure. However, the array structure may be variously applied.

The second pad 144 is connected to the first pad 142 through a plurality of pad contact holes PCH and has a plurality of protrusions 144a projecting from both long sides. Accordingly, the plurality of projecting portions 144a can protrude in mutually symmetrical structures on opposite sides.

The shape of the protrusion 144a may have a rectangular shape, but it is not limited thereto, and may be modified in various shapes such as a triangle, a pentagon, and the like.

At this time, when misalignment occurs in the process of forming a plurality of protrusions, when the plurality of protrusions 144a are not arranged in line with the plurality of pad contact holes PCH, A contact defect may be generated in which the pad contact hole PCH is disposed at a position deviated to the outside of the second pad 144. Therefore, it is preferable that the plurality of projecting portions 144a are arranged in line with the plurality of pad contact holes PCH.

The pad electrode 146 is stacked on the second pad 144 and connected to the second pad 144 and extended to the outside of the second pad 144. At this time, the pad electrode 146 is extended to the outside of the second pad 144 at an upper portion overlapping the second pad 144. Thus, the pad electrode 146 covers the entire area of the second pad 144.

The first pad 142 is disposed between the first insulating layer 125 and the second insulating layer 135 and the second pad 144 is disposed on the second insulating layer 135. At this time, the first pad 142 may be formed using the same material in the same layer as the gate wiring (not shown) disposed in the display area AA on the first substrate 110. The second pad 144 may be formed using the same material in the same layer as the data line (not shown) disposed in the display area AA on the first substrate 110.

At this time, the second pad 144 has a projection 144a protruding from both long sides when viewed in plan, and is designed as a rectangle having a first area. The pad electrode 146 is designed to extend from the top of the second pad 144 to the outside of the second pad 144 to cover the second pad 144 when viewed in a plan view. Accordingly, the pad electrode 146 has a second area larger than the first area.

In particular, the first spacing d1, which is the distance between the long side ends of both sides of the pad electrode 146 and the end of the projection 144a of the second pad, is 2.6 to 3.4 占 퐉. In other words, the second spacing d2, which is a distance from both long side ends of the pad electrode 146 to both long side ends of the second pad 144, is 4 to 6 占 퐉.

In addition, the spacing D between the adjacent pad electrodes 146 is designed to be 13.5 to 15.5 탆, thereby ensuring a spacing between the pad electrodes 146.

As described above, the pad electrode structure 140 according to the embodiment of the present invention can design the protrusion 144a protruding outward from both long sides of the second pad 144 when designing the second pad 144, 1 distance d1 and the second spacing d2.

Accordingly, the pad electrode structure 140 according to the embodiment of the present invention can increase the area of the second pad 144 through the design of the protrusion 144a while minimizing the area increase of the pad electrode 146 , The contact area between the second pad 144 and the pad electrode 146 is enlarged, so that the bonding resistance can be improved.

Accordingly, the pad electrode structure 140 according to the embodiment of the present invention can minimize the increase of the area of the pad electrode 146, but can be formed by the laser patterning technique using the laser patterning equipment through the second pad 144 having the protrusion 144a. Since the heat transmission can be efficiently performed by increasing the conductivity by increasing the contact area between the pad electrode 146 and the second pad 144, the outer protective layer 185 (FIG. 6) covering the pad electrode 146 is completely It is possible to eliminate the SiON residual film defect.

This will be described in more detail with reference to Figs. 6 and 7 again.

6 and 7, the outer protective layer 185 may be deposited on the entire surface of the first substrate 110 without using a mask, and then patterned using the laser patterning equipment to form the pad electrode 146, A pad terminal contact hole (LCH) is formed by selectively removing only the external protection layer 185 covering the contact hole.

That is, after the outer protective layer 185 is formed over the entire surface of the display area AA and the non-display area NAA on the first substrate 110 without using a mask, the protective adhesive layer 190 is formed, The first substrate 110 and the second substrate 195 are bonded together.

After the adhesion between the first substrate 110 and the second substrate 195 is completed, the laser patterning device is mounted on the upper part of the outer protective layer 185 covering the pad electrode 146, The pad electrode 146 on the first substrate 110 is exposed by laser irradiation while moving the laser patterning device along the Y axis direction to form a pad electrode contact hole LCH.

At this time, in the case of the display device 100 according to the embodiment of the present invention, the first spacing d1 is designed to have a thickness of 2.6 to 3.4 μm, and the second spacing d2 is designed to have a thickness of 4 to 6 μm. As a result, the display device 100 according to the embodiment of the present invention can increase the area of the second pad 144 through the design of the protrusion 144a while minimizing the increase in the area of the pad electrode 146, 2, the contact area between the pad 144 and the pad electrode 146 is enlarged, so that the bonding resistance can be improved.

Accordingly, the display apparatus 100 according to the embodiment of the present invention can perform the laser patterning process using the laser patterning equipment through the second pad 144 having the protrusion 144a while minimizing the area increase of the pad electrode 146 The heat transmission can be efficiently performed by increasing the conductivity by increasing the contact area between the pad electrode 146 and the second pad 144.

As a result, in the display device according to the embodiment of the present invention, it is possible to completely remove the outer protective layer 185 covering the pad electrode 146, so that defective SiON residual film does not occur and the production yield can be improved .

While the present invention has been particularly shown and described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It is therefore to be understood that such changes and modifications are intended to be included within the scope of the present invention unless they depart from the scope of the present invention.

100: display device 110: first substrate
120: semiconductor layer 122: gate electrode
125: gate insulating film 132: source electrode
134: drain electrode 135: interlayer insulating film
140: pad part 142: first pad
144: second pad 146: pad electrode
150: Protective layer 155: Bank layer
160: first electrode 165: capping layer
170: organic emission 180: second electrode
185: outer protective layer 190: protective adhesive layer
195: second electrode DTr: thin film transistor
E: organic light emitting diode DTr: thin film transistor
DCH: drain contact hole PCH: pad contact hole
LCH: pad electrode contact hole AA: display area
NAA: non-display area

Claims (10)

A first pad disposed in the non-display area on the substrate having a display area and a non-display area;
An insulating film covering the display region and the non-display region on the substrate and having a plurality of pad contact holes exposing a part of the first pad;
A second pad connected to the first pad through the plurality of pad contact holes and having a plurality of protrusions protruding from both long sides; And
A pad electrode laminated on the second pad and connected to the second pad, the pad electrode extending outwardly of the second pad;
Electrode structure.
The method according to claim 1,
The pad electrode
And a pad electrode structure extending from the upper portion of the second pad to overlap the second pad and covering the entire area of the second pad.
The method according to claim 1,
The plurality of pad contact holes
A pad electrode structure spaced apart in a matrix form having a plurality of rows and a plurality of rows.
The method of claim 3,
The plurality of projections
And a pad electrode structure arranged on the same line as the plurality of pad contact holes.
The method according to claim 1,
Wherein a distance between the long side ends of both sides of the pad electrode and the end of the protrusion of the second pad is 2.6 to 3.4 占 퐉.
The method according to claim 1,
Wherein the distance between the long side ends of both sides of the pad terminal and the long side ends of both sides of the second pad is 4 to 6 占 퐉.
The method according to claim 1,
The insulating film
A gate insulating film disposed in a non-display region on the substrate,
And an interlayer insulating film disposed on the gate insulating film.
8. The method of claim 7,
The first pad
And the second pads are disposed on the interlayer insulating film.
A first substrate having a display region and a non-display region;
A thin film transistor arranged in a display region on the first substrate;
An organic light emitting diode connected to the thin film transistor;
A capping layer covering the organic light emitting diode;
A first pad disposed in a non-display area on the first substrate;
An insulating film covering the display area and the non-display area on the first substrate and having a plurality of pad contact holes exposing a part of the first pad;
A second pad connected to the first pad through the plurality of pad contact holes and having a plurality of protrusions protruding from both long sides;
A pad electrode laminated on the second pad and connected to the second pad, the pad electrode extending outwardly of the second pad; And
An external protection layer covering the capping layer and the pad electrode and having a pad electrode contact hole exposing a part of the pad electrode;
.
10. The method of claim 9,
A second substrate disposed at an upper portion spaced apart from the outer protective layer,
And a protective bonding layer disposed between the second substrate and the outer protective layer, for bonding the first and second substrates together.

Images