KR20170023740A - 도전성 접착제 조성물 - Google Patents
도전성 접착제 조성물 Download PDFInfo
- Publication number
- KR20170023740A KR20170023740A KR1020167003725A KR20167003725A KR20170023740A KR 20170023740 A KR20170023740 A KR 20170023740A KR 1020167003725 A KR1020167003725 A KR 1020167003725A KR 20167003725 A KR20167003725 A KR 20167003725A KR 20170023740 A KR20170023740 A KR 20170023740A
- Authority
- KR
- South Korea
- Prior art keywords
- conductive adhesive
- polyurethane polyurea
- conductive
- resin
- reinforcing plate
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 57
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 57
- 239000000203 mixture Substances 0.000 title claims abstract description 43
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- 239000011347 resin Substances 0.000 claims abstract description 92
- 229920002396 Polyurea Polymers 0.000 claims abstract description 79
- 229920002635 polyurethane Polymers 0.000 claims abstract description 79
- 239000004814 polyurethane Substances 0.000 claims abstract description 79
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- 238000000034 method Methods 0.000 claims description 40
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- C09J11/02—Non-macromolecular additives
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- C—CHEMISTRY; METALLURGY
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- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Abstract
Description
도 2는 금속층을 갖는 전자파 실드 필름을 사용한 회로 기판의 모식도이다.
도 3은 도전성 접착 필름에 의해 보강판이 접착된 제1 회로 기판의 모식도이다.
도 4는 도전성 접착 필름에 의해 보강판이 접착된 제2 회로 기판의 모식도이다.
도 5는 가첩부성을 측정할 때의 개략을 나타내는 도면이다.
도 6은 본접착 후의 밀착성을 측정할 때의 개략을 나타내는 도면이다.
도 7은 폴리이미드 필름과의 밀착성을 측정할 때의 개략을 나타내는 도면이다.
도 8은 금도금 구리박과의 밀착성을 측정할 때의 개략을 나타내는 도면이다.
2 보호층
3 금속층
4 도전성 접착제층
5 그라운드부
6 절연성 접착제
7 커버 레이 필름
8 금속 보강판
9 커버 레이
10 구리박
11 개구부
12 금 도금층
13 구리 클래드 적층판의 폴리이미드 필름측
14 SUS제 금속 보강판
110 프린트 배선판 본체
111 절연 필름(커버 레이)
112 베이스 부재
113 절연성을 갖는 접착제층
114 그라운드용 배선 패턴
115 도전성 접착제를 갖는 층
116 보강 부재
117 전자 부품
118 구멍부
Claims (6)
- 폴리올 화합물(A), 디이소시아네이트 화합물(B) 및 카르복실기를 갖는 디올 화합물(C)을 반응시켜 얻어지는 우레탄 프리폴리머(D)와 폴리아미노 화합물(E)을 반응시켜 얻어지는 폴리우레탄 폴리우레아 수지(F),
2개 이상의 에폭시기를 갖는 에폭시 수지(G),
도전성 필러(H)를 적어도 가지며,
폴리우레탄 폴리우레아 수지(F)가 산가가 1~6mgKOH/g인 폴리우레탄 폴리우레아 수지(F-1)와 산가가 18~30mgKOH/g인 폴리우레탄 폴리우레아 수지(F-2)인 도전성 접착제 조성물. - 청구항 1에 있어서,
폴리우레탄 폴리우레아 수지(F-1) 100질량부에 대해 폴리우레탄 폴리우레아 수지(F-2)가 30~300질량부인 도전성 접착제 조성물. - 청구항 1 또는 청구항 2에 있어서,
폴리우레탄 폴리우레아 수지(F) 100질량부당 에폭시 수지(G)가 50~500질량부인 도전성 접착제 조성물. - 박리성 베이스재와, 청구항 1 내지 청구항 3 중 어느 한 항에 기재된 도전성 접착제 조성물로 이루어지는 접착제층을 갖는 도전성 접착 필름.
- 절연층과 도전성 접착제층을 적어도 갖는 전자파 실드 필름으로서, 도전성 접착제층이 청구항 1 내지 청구항 3 중 어느 한 항에 기재된 도전성 접착제 조성물로 이루어지는 전자파 실드 필름.
- 그라운드용 배선 패턴을 적어도 한쪽 면에 구비한 베이스 부재와,
상기 그라운드용 배선 패턴을 덮음과 동시에 상기 그라운드용 배선 패턴의 일부가 노출되도록 개구부가 설치된 커버 레이와,
상기 그라운드용 배선 패턴에 대향 배치된 도전성 보강판과,
상기 베이스 부재의 상기 그라운드용 배선 패턴과 상기 도전성 보강판을 도통 상태로 접합하는 도전성 접착제층과,
상기 베이스 부재의 다른 쪽 면에서 상기 도전성 보강판에 대응하는 위치에 배치된 전자 부품을 갖는 것을 특징으로 하는 프린트 배선판으로서,
상기 도전성 접착제층이 청구항 1 내지 청구항 3 중 어느 한 항에 기재된 도전성 접착제 조성물을 갖는 것을 특징으로 하는 프린트 배선판.
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KR20190074151A (ko) * | 2017-12-19 | 2019-06-27 | 주식회사 네패스 | 도전성 접착제 조성물 및 이를 통해 형성된 등방 도전성 필름 |
KR102051762B1 (ko) * | 2018-11-30 | 2019-12-04 | 주식회사 누리비스타 | 신축성 페이스트 조성물 |
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KR101896435B1 (ko) * | 2016-11-09 | 2018-09-07 | 엔트리움 주식회사 | 전자파차폐용 전자부품 패키지 및 그의 제조방법 |
JP6371460B1 (ja) * | 2017-12-06 | 2018-08-08 | タツタ電線株式会社 | 配線基板用補強板 |
KR102625694B1 (ko) | 2018-11-29 | 2024-01-15 | 로흐만 게엠베하 운트 캄파니, 카게 | 잠재 반응성 폴리우레탄계 접착 필름 |
CN113825815B (zh) * | 2019-05-31 | 2022-09-30 | 拓自达电线株式会社 | 各向同性导电性粘着片 |
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KR20190074151A (ko) * | 2017-12-19 | 2019-06-27 | 주식회사 네패스 | 도전성 접착제 조성물 및 이를 통해 형성된 등방 도전성 필름 |
KR102051762B1 (ko) * | 2018-11-30 | 2019-12-04 | 주식회사 누리비스타 | 신축성 페이스트 조성물 |
WO2020111805A1 (ko) * | 2018-11-30 | 2020-06-04 | 주식회사 누리비스타 | 신축성 페이스트 조성물 |
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TW201610057A (zh) | 2016-03-16 |
CN106068317B (zh) | 2020-03-24 |
JPWO2016002780A1 (ja) | 2017-04-27 |
CN106068317A (zh) | 2016-11-02 |
KR102072195B1 (ko) | 2020-01-31 |
WO2016002780A1 (ja) | 2016-01-07 |
JP5931305B1 (ja) | 2016-06-08 |
TWI627249B (zh) | 2018-06-21 |
HK1226090A1 (zh) | 2017-09-22 |
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