KR20140064156A - Flexible organic light emitting display device - Google Patents

Abstract

The flexible organic light emitting display device of the present invention is a flexible organic light emitting display device in which a TFT substrate is folded back to form a driving element and other components existing in upper and / or lower / left and right bezel regions below the TFT substrate to realize a substantially zero bezel A panel assembly comprising a TFT substrate on which a display region and a pad region are defined and a thin film encapsulation layer formed on the TFT substrate while covering the display region, And a flexible printed circuit board attached to a pad portion of the panel assembly, wherein at least one of upper, lower, left, and right sides of the TFT substrate is folded back to face the back surface of the panel assembly .

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a flexible organic light-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible organic light emitting display device, and more particularly, to a flexible organic light emitting display device implementing a substantially zero-bezel.

In recent years, there has been a growing interest in information display and a demand for a portable information medium has increased, and a lightweight flat panel display (FPD) that replaces a cathode ray tube (CRT) And research and commercialization are being carried out.

In the field of flat panel display devices, a liquid crystal display device (LCD), which has been light and consumes less power, has attracted the greatest attention, but a new display device has been actively developed according to various demands.

Since the organic light emitting display device, which is one of the new display devices, is self-emitting type, it has a better viewing angle and contrast ratio than the liquid crystal display device and does not require a backlight, . In addition, it has the advantage of being able to drive a DC low voltage and has a high response speed, and is particularly advantageous in terms of manufacturing cost.

Unlike a liquid crystal display device or a plasma display panel (PDP), the manufacturing process of the organic light emitting display device is very simple since the deposition and encapsulation processes are all processes. Further, when an organic light emitting display device is driven by an active matrix method including a thin film transistor (TFT) as a switching element for each pixel, even if a low current is applied, the same luminance is exhibited, And has advantages of being large and large.

Hereinafter, the basic structure and operational characteristics of the organic light emitting display device will be described in detail with reference to the drawings.

1 is a diagram for explaining the principle of light emission of a general organic light emitting display device.

A general organic light emitting display device includes an organic light emitting diode as shown in FIG. The organic light emitting diode includes organic compound layers 19a, 19b, 19c, 19d, and 19e formed between an anode 18 as a pixel electrode and a cathode 8 as a common electrode.

The hole injection layer 19a, the hole transport layer 19b, the emission layer 19c, the electron injection layer 19b, An electron transport layer 19d and an electron injection layer 19e.

When driving voltage is applied to the anode 18 and the cathode 8, holes passing through the hole transport layer 19b and electrons passing through the electron transport layer 19d move to the light emitting layer 19c to form excitons, As a result, the light emitting layer 19c emits visible light.

An organic light emitting display device displays an image by arranging pixels having organic light emitting diodes of the above structure in a matrix form and selectively controlling the pixels with a data voltage and a scan voltage.

The organic light emitting display device is divided into a passive matrix type or an active matrix type display device using a TFT as a switching device. The active matrix method selectively turns on the TFT, which is an active element, to select a pixel and maintain the light emission of the pixel at a voltage held in a storage capacitor.

FIG. 2 is an equivalent circuit diagram of one pixel in a general organic light emitting display device. In an organic light emitting display device of an active matrix type, an equivalent circuit diagram for a pixel of a general 2T1C (including two transistors and one capacitor) For example.

Referring to FIG. 2, the active matrix organic light emitting display includes pixels including an organic light emitting diode (OLED), data lines DL and a scanning line GL, a switching TFT SW, A driving TFT DR and a storage capacitor Cst.

At this time, the switching TFT SW turns on in response to a scan pulse from the scan line GL, thereby conducting a current path between the source electrode and the drain electrode of the switching TFT SW. The data voltage from the data line DL during the on-time period of the switching TFT SW is supplied to the gate electrode of the driving TFT DR and the storage capacitor Cst through the source electrode and the drain electrode of the switching TFT SW, .

At this time, the driving TFT DR controls a current flowing in the organic light emitting diode OLED according to a data voltage applied to its gate electrode. Then, the storage capacitor Cst stores the voltage between the data voltage and the low potential power supply voltage VSS, and keeps it constant for one frame period.

In the case of a general organic light emitting display device having such characteristics, a glass substrate can be applied to a TFT substrate, and a polyimide (PI) substrate can be applied to the TFT substrate in the case of a flexible organic light emitting display device.

FIG. 3 is a perspective view illustrating a structure of a general flexible organic light emitting display device. FIG. 3 shows a flexible organic light emitting display device in which a flexible printed circuit board (FPCB) is fastened.

Referring to FIG. 3, the flexible organic light emitting display device generally includes a panel assembly for displaying an image and a flexible circuit board 30 connected to the panel assembly.

The panel assembly includes a TFT substrate 5 defining a display area AA and a pad area and a thin film encapsulation layer 5 formed on the TFT substrate 5 while covering the display area AA. layer (1).

At this time, the pad region is not covered by the thin film encapsulation layer 1 but is exposed.

A polyimide substrate can be used as the TFT substrate 5, and a back plate 10 is attached to the backside thereof.

A polarizing plate (not shown) is attached on the thin film sealing layer 1 to prevent reflection of light incident from the outside.

Although not shown in detail, sub pixels are arranged in a matrix form in the display area AA of the TFT substrate 5, and the outside of the display area AA, that is, a bezel area BA) includes driving elements such as a scan driver and a data driver for driving sub-pixels and other components.

In the pad region of the TFT substrate 5, pad electrodes for transmitting an electric signal to the scan driver and the data driver are located.

The thin film encapsulation layer 1 is formed on the organic light emitting diodes and the driving circuits formed on the TFT substrate 5 to seal the organic light emitting diodes and the driving circuits from the outside.

An integrated circuit chip (not shown) is mounted on the pad region of the panel assembly thus constructed in a chip on glass manner.

Electronic devices (not shown) for processing driving signals are mounted on the FPC 30 by a chip on film method and connectors for transmitting external signals to the FPC 30 City) is installed.

The flexible circuit board 30 is folded to the rear of the panel assembly so that the flexible circuit board 30 faces the rear surface of the panel assembly. That is, the flexible circuit board 30 having a bending portion is attached to the back surface of the organic light emitting display device through an adhesive layer (not shown) in a state where the thin film sealing layer 1 is bonded to the TFT substrate 5 to form a module assembly do.

At this time, an anisotropic conductive film (ACF) (not shown) is used to electrically connect the terminal portions of the TFT substrate 5 and the connection portions of the flexible circuit board 30.

For the current product design, the narrow bezel that minimizes the bezel area is implemented. In addition to the right and left bezels, the narrow bezel is also applied to the top and bottom bezels.

That is, the panel assembly includes a bezel region in which driving elements and other components for driving are located. Since the driving elements and other components are essential components, they must exist in the panel assembly. However, So I try to minimize it.

However, the present technology has a limitation in realizing the zero bezel. In particular, since the circuit components (COG, COF, FPCB) or the corresponding parts are bonded to the upper and lower bezel regions, it is necessary to secure a predetermined area, and it is more difficult to realize the right and left bezel.

It is an object of the present invention to provide a flexible organic light emitting display device capable of realizing a substantially zero-bezel.

Other objects and features of the present invention will be described in the following description of the invention and the claims.

In order to achieve the above object, the flexible organic light emitting display device of the present invention includes a TFT substrate on which a display region and a pad region are defined, and a thin film encapsulation layer formed on the TFT substrate while covering the display region A panel assembly for displaying images; And a flexible printed circuit board attached to a pad portion of the panel assembly, wherein at least one of upper, lower, left, and right sides of the TFT substrate is folded back to face the back surface of the panel assembly .

In this case, the TFT substrate is formed of a polyimide (PI) substrate.

In this case, a back plate attached to the back surface of the TFT substrate is further included.

Wherein the TFT substrate is disposed on a front surface of the back plate and includes sub-pixels arranged in a matrix form; A circuit region located on a rear surface of the back plate and including driving elements and other components for driving the panel assembly; And a wiring region which is located between the display region and the circuit region and is bent at a side of the back plate and in which various wirings are arranged.

At this time, various wirings are formed in the wiring region of the TFT substrate by using a thin metal, and the display region and the circuit region are electrically connected through the wirings.

The pad region is located at one end of the circuit region of the TFT substrate folded back and is exposed to the outside.

The flexible printed circuit board is attached to a circuit area of the TFT substrate folded rearward of the panel assembly and faces a back surface of the panel assembly.

And the pad region is exposed to the outside without being covered by the thin film sealing layer.

In this case, the flexible circuit board is folded to the rear of the panel assembly, and the flexible circuit board is opposed to the back surface of the panel assembly.

The driving elements and other parts formed in the circuit region of the TFT substrate are electrically connected to the display region through a single layer of wiring formed in the wiring region (hereinafter, referred to as main wiring).

And a first dummy wiring formed on the first insulating film and the first insulating film formed on the main wiring and electrically connected to the main wiring through a plurality of first contact holes.

And a second dummy wiring formed on the second insulating film and the second insulating film formed on the first dummy wiring and electrically connected to the first dummy wiring through the plurality of second contact holes .

And a first dummy wiring formed on the first insulating film and the first insulating film formed on the main wiring and electrically connected to the main wiring through the first contact hole at the beginning and the end of the main wiring .

And a second dummy wiring formed on the second insulating film and the second insulating film and electrically connected to the first dummy wiring through the second contact hole at the beginning and the end of the first dummy wiring, And further includes wiring.

And the first and second dummy wirings are configured so as to overlap with or overlap with the main wiring below the first and second dummy wirings.

In this case, the second dummy wiring is configured so as to overlap with or not to overlap with the first dummy wiring below the second dummy wiring.

The flexible circuit board is attached to the pad portion of the panel assembly through an anisotropic conductive film.

As described above, the flexible organic light emitting display device according to the present invention can realize a substantially zero-bezel by folding the TFT substrate backward and forming circuits and other components in the upper and / or lower / left and right bezel regions below the TFT substrate .

As a result, we can expect to achieve the standard of all flexible displays that will lead to design innovation and zero bezel implementation.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram for explaining the principle of light emission of a general organic light emitting display device. Fig.
2 is an equivalent circuit diagram for one pixel in a general organic light emitting display device.
3 is a perspective view exemplarily showing a structure of a general flexible organic light emitting display device.
FIG. 4 is a perspective view illustrating a structure of a flexible organic light emitting display device according to a first embodiment of the present invention. FIG.
FIGS. 5A and 5B are views schematically showing a cross section taken along the line A-A 'of the flexible organic light emitting display device according to the first embodiment of the present invention shown in FIG.
6 is a cross-sectional view illustrating a wiring structure of a wiring region in a flexible organic light emitting display device according to a first embodiment of the present invention.
7A and 7B are cross-sectional views illustrating another wiring structure of a wiring region in a flexible organic light emitting display device according to a first embodiment of the present invention.
8A and 8B are cross-sectional views illustrating another wiring structure of a wiring region in a flexible organic light emitting display device according to a first embodiment of the present invention.
9 is a perspective view exemplarily showing a structure of a flexible organic light emitting display device according to a second embodiment of the present invention.
FIGS. 10A and 10B are views schematically showing cross-sectional views of a flexible organic light emitting display device according to a second embodiment of the present invention shown in FIG.
11 is a cross-sectional view showing, for example, a wiring structure of a wiring region in a flexible organic light emitting display device according to a second embodiment of the present invention.
12A and 12B are cross-sectional views illustrating another wiring structure of a wiring region in a flexible organic light emitting display device according to a second embodiment of the present invention.
13A and 13B are cross-sectional views illustrating another wiring structure of a wiring region in a flexible organic light emitting display device according to a third embodiment of the present invention.
14 is a perspective view exemplarily showing a structure of a flexible organic light emitting display device according to a third embodiment of the present invention.
FIG. 15 is a schematic cross-sectional view taken along line A-A 'of a flexible organic light emitting display device according to a third embodiment of the present invention shown in FIG. 14; FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a method of manufacturing a flexible organic light emitting display device according to the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

FIG. 4 is a perspective view illustrating a structure of a flexible organic light emitting display device according to a first embodiment of the present invention. FIG. 4 shows a flexible organic light emitting display device in a state where a flexible circuit board is fastened.

5A and 5B are views schematically showing a cross section taken along the line A-A 'of the flexible organic light emitting display device according to the first embodiment of the present invention shown in FIG. 5B is an enlarged top cross-sectional view of the flexible organic light emitting display device according to the first embodiment of the present invention shown in FIG. 5A.

6 is a cross-sectional view illustrating a wiring structure of a wiring region in a flexible organic light emitting display device according to a first embodiment of the present invention.

Here, the flexible organic light emitting display device according to the first embodiment of the present invention shown in the above-mentioned drawings shows a case where only the upper bezel region is implemented as zero for convenience of explanation, but the present invention is not limited thereto , The upper and lower bezel regions may be substantially zero when the present invention is applied.

Referring to the drawings, the flexible organic light emitting display device according to the first embodiment of the present invention includes a panel assembly for displaying an image and a flexible circuit board 130 connected to the panel assembly.

The panel assembly includes a TFT substrate 105 defining a display area AA and a pad area and a thin film encapsulating layer 101 formed on the TFT substrate 105 while covering the display area AA.

At this time, a polyimide substrate may be used as the TFT substrate 105, and a back plate 110 may be attached to the back surface.

A polarizing plate (not shown) may be attached on the thin film sealing layer 101 to prevent reflection of light incident from the outside.

Sub-pixels are arranged in a matrix in the display area AA of the TFT substrate 105, and the upper side of the TFT substrate 105 is folded back to face the back side of the panel assembly, that is, the back side of the back plate 110 do.

For convenience of explanation, the TFT substrate 105 is divided into three regions, and the display region AA and the back plate 110, which are located on the front surface of the back plate 110 and are arranged in a matrix, A circuit region located on the rear surface and disposed with driving elements and other components for driving the panel assembly and a circuit region located between the display region AA and the circuit region and bent at the side of the back plate 110, Are arranged in a wiring area.

Various wirings 106 are formed on the wiring region of the TFT substrate 105 by using a thin metal and electrically connected between the display region AA and the circuit region through the wirings 106. That is, the driving elements and other parts formed in the circuit region of the TFT substrate 105 are electrically connected to the display region AA through the wirings 106 formed in the wiring region.

The TFT substrate 105 is formed of a polyimide substrate or a film or a material having a strong flexural strength corresponding to the polyimide substrate or the film, and the upper side of the TFT substrate 105 is folded back to face the back surface of the panel assembly.

At this time, the pad region is located at one end of the circuit region of the TFT substrate 105 folded back and is exposed to the outside.

In the pad region of the TFT substrate 105, pad electrodes for transmitting an electric signal to the scan driver and the data driver are located.

The thin film encapsulation layer 101 is formed on the organic light emitting diodes and the driving circuits formed on the TFT substrate 105 to seal the organic light emitting diodes and the driving circuits from the outside.

An integrated circuit chip (not shown) is mounted on the pad region of the panel assembly thus constructed in a chip on glass manner.

Electronic devices (not shown) for processing driving signals are mounted on the FPC 130 by a chip-on-film method and connectors (not shown) for transmitting external signals to the FPC 130 are installed .

The flexible circuit board 130 is attached to the circuit area of the TFT substrate 105 folded backward of the panel assembly, and faces the back surface of the panel assembly. That is, the flexible circuit board 130 is attached to the back surface of the organic light emitting display device through the adhesive layer 136 in a state where the thin film sealing layer 101 is attached to the TFT substrate 105 to form a module assembly.

At this time, the anisotropic conductive film 135 is used to electrically connect the terminal portion of the TFT substrate 105 and the connection portion of the flexible circuit board 130 with each other.

As described above, the low-speed bezel that minimizes the bezel area BA is implemented for the current product design, and the low-speed bezel is applied to the upper and lower bezels as well as the right and left bezels.

That is, the panel assembly has a bezel area BA in which driving elements and other parts for driving are located. Since the driving elements and other parts are essential components, they necessarily exist in the panel assembly. However, I want to minimize it because it is an unnecessary part.

Accordingly, in the first embodiment of the present invention, the driving elements and other parts existing in the upper and lower bezel areas BA are disposed in the circuit area located on the back surface of the back plate 110, so that the upper and lower bezels can be realized as substantially zero do.

By realizing such a practical zero-bezel, not only can it lead to design innovation of display products in the future, but it can be expected to be a standard for all displays that implement zero-bezel.

On the other hand, the flexible organic light emitting display device described above shows, for example, electrical connection between the display region AA and the circuit region by using the wiring layer 106 of a single layer. That is, the driving elements and other parts formed in the circuit region of the TFT substrate 105 are electrically connected to the display region AA through the single-layer wiring 106 formed in the wiring region.

However, the present invention is not limited to this, and if the wirings in the wiring region are composed of a double layer or a triple layer or more rather than a single layer, it is possible to prevent cracks in the wiring that may occur in bending the wiring region , Which will be described with reference to the drawings.

7A and 7B are cross-sectional views illustrating another wiring structure of a wiring region in a flexible organic light emitting display device according to the first embodiment of the present invention.

In this case, FIG. 7A shows a case where the wiring in the wiring region is composed of a double layer, and FIG. 7B shows a case where the wiring in the wiring region is made of a triple layer.

Referring to FIG. 7A, a first insulating layer 115a is formed on a single-layer wiring 106 (hereinafter, referred to as a main wiring for convenience of description), and a first dummy wiring 107 is further formed thereon Respectively.

At this time, the first dummy wiring 107 is electrically connected to the lower main wiring 106 through a plurality of first contact holes, so that even if a crack occurs in the main wiring 106, the signal can be prevented from being broken .

7B, a first insulating layer 115a, a first dummy wiring 107 and a second insulating layer 115b are sequentially formed on the main wiring 106, and a second dummy wiring line 108 are formed.

At this time, the second dummy wiring lines 108 are electrically connected to the first dummy wiring lines 107 through a plurality of second contact holes, and the first dummy wiring lines 107 are electrically connected through a plurality of first contact holes It is possible to prevent the signal from being broken even if cracks occur in the main wiring 106 or the first dummy wiring 107 due to the electrical connection with the main wiring 106 at the lower part.

If the wirings are constituted by a plurality of layers as described above, it is expected that the signal can be prevented from being broken even if cracks occur in the wirings.

In the above description, the first and second dummy wirings 107 and 108 are connected to the lower wiring through a plurality of first and second contact holes at various places, but the present invention is limited to this And can be connected only at the beginning and end of wiring, which will be described with reference to the drawings.

8A and 8B are cross-sectional views illustrating another wiring structure of the wiring region in the flexible organic light emitting display device according to the first embodiment of the present invention.

8A shows a case where the wiring in the wiring region is composed of a double layer, and FIG. 8B shows a case where the wiring in the wiring region is made of a triple layer.

Referring to FIG. 8A, a first insulating layer 115a is formed on the main wiring 106, and a first dummy wiring 107 'is further formed thereon.

At this time, the first dummy wiring 107 'is electrically connected to the main wiring 106 through the first contact hole at the beginning and the end of the main wiring 106.

8B, a first insulating layer 115a, a first dummy wiring 107 ', and a second insulating layer 115b are formed in this order on the main wiring 106, (108 ') are formed.

At this time, the second dummy wiring 108 'is electrically connected to the first dummy wiring 107' through the second contact hole at the beginning and the end of the first dummy wiring 107 ' The wiring 107 'is electrically connected to the main wiring 106 through the first contact hole at the beginning and the end of the main wiring 106.

The first and second dummy wirings 107 'and 108' may be configured so as to overlap with the main wirings 106 thereunder or not to overlap each other.

The second dummy wiring 108 'may be overlapped with the first dummy wiring 107' formed therebelow, or may be formed so as not to overlap.

In this way, there is a possibility that a crack or a corresponding damage may occur to a connected portion due to stress caused by bending of the wiring region, so that the connected portion is not located at the beginning and end portions of the wiring, that is, The potential damage can be compensated by restricting the connection to the area and the circuit area.

In the meantime, the first embodiment of the present invention has been described by exemplifying the case where the upper bezel region or the upper and lower bezel regions are substantially zero, but the present invention is not limited thereto. As described above, the present invention can implement the left and right bezel regions substantially at zero, which will be described in detail through the following second embodiment of the present invention.

FIG. 9 is a perspective view illustrating an exemplary structure of a flexible organic light emitting display device according to a second embodiment of the present invention. FIG. 9 illustrates a flexible organic light emitting display device in a state where a flexible circuit board is fastened.

FIGS. 10A and 10B are views schematically showing a cross section taken along line B-B of the flexible organic light emitting display device according to the second embodiment of the present invention shown in FIG. 10B is an enlarged sectional view of one side of the flexible organic light emitting display device according to the second embodiment of the present invention shown in FIG. 10A.

11 is a cross-sectional view illustrating a wiring structure of a wiring region in a flexible organic light emitting display device according to a second embodiment of the present invention.

Referring to the drawings, a flexible organic light emitting display device according to a second embodiment of the present invention includes a panel assembly for displaying an image and a flexible circuit board 230 connected to the panel assembly.

The panel assembly includes a TFT substrate 205 defining a display area AA and a pad area and a thin film encapsulation layer 201 formed on the TFT substrate 205 while covering the display area AA.

At this time, a polyimide substrate may be used as the TFT substrate 205. In this case, a back plate 210 made of polyethylene terephthalate may be attached to the back surface.

A polarizing plate (not shown) may be attached on the thin film sealing layer 201 to prevent reflection of light incident from the outside.

In the display area AA of the TFT substrate 205, sub-pixels are arranged in a matrix form, and the left and right sides of the TFT substrate 205 are folded back to form a back surface of the panel assembly, Facing each other.

For convenience of explanation, when the TFT substrate 205 is divided into three regions, the display region AA and the back plate 210, which are disposed on the front surface of the back plate 210 and are arranged in a matrix, A circuit region located on the rear surface and disposed with a driving element and other components for driving the panel assembly and a circuit region disposed between the display region AA and the circuit region and bent at the side of the back plate 210, Are arranged in a wiring area.

Various wirings 206 are formed in the wiring region of the TFT substrate 205 by using a thin metal and electrically connected between the display region AA and the circuit region through the wirings 206. That is, the driving elements and other components formed in the circuit region of the TFT substrate 205 are electrically connected to the display region AA through the wirings 206 formed in the wiring region.

As described above, the TFT substrate 205 is made of a polyimide substrate, a film or a material having a strong flexural strength corresponding to the polyimide substrate or the film, and the left and right sides of the TFT substrate 205 are folded back to face the back surface of the panel assembly.

At this time, the pad region is not covered with the thin film sealing layer 201 but is exposed to the outside.

In the pad region of the TFT substrate 205, pad electrodes for transmitting an electric signal to the scan driver and the data driver are located.

The thin film encapsulation layer 201 is formed on the organic light emitting diodes and the driving circuits formed on the TFT substrate 205 to seal and protect the organic light emitting diodes and the driving circuits from the outside.

An integrated circuit chip (not shown) is mounted on the pad area of the panel assembly in this manner, and a protective film (not shown) is formed around the integrated circuit chip to cover and protect the pad electrodes formed on the pad area.

Electronic devices (not shown) for processing driving signals are mounted on the FPC 230 in a chip-on-film manner and connectors (not shown) for transmitting external signals to the FPC 230 are installed .

The flexible circuit board 230 is folded to the rear of the panel assembly so that the flexible circuit board 230 faces the rear surface of the panel assembly. That is, the flexible circuit board 230 is attached to the back surface of the organic light emitting display device through the adhesive layer 236 in a state where the thin film sealing layer 201 is attached to the TFT substrate 205 to form a module assembly.

At this time, an anisotropic conductive film (not shown) is used in order to electrically connect the terminal portions of the TFT substrate 205 and the connection portions of the flexible circuit board 230 with each other.

As described above, in the second embodiment of the present invention, the driving elements and other parts existing in the left and right bezel areas BA are disposed in the circuit area located on the back surface of the back plate 210, thereby realizing a substantially zero do.

On the other hand, the above-described flexible organic light emitting display device shows, for example, electrical connection between the display region AA and the circuit region by using the wiring 206 of a single layer. That is, the driving elements and other parts formed in the circuit region of the TFT substrate 205 are electrically connected to the display region AA through the single-layer wiring 206 formed in the wiring region.

However, as described above, the present invention is not limited to this, and if the wirings in the wiring region are composed of a double layer or a triple layer or more rather than a single layer, it is possible to prevent wiring cracks Which will be described with reference to the drawings.

12A and 12B are cross-sectional views illustrating another wiring structure of a wiring region in a flexible organic light emitting display device according to a second embodiment of the present invention.

12A shows a case where the wiring in the wiring region is formed of a double layer, and FIG. 12B shows a case where the wiring in the wiring region is formed of a triple layer.

Referring to FIG. 12A, a first insulating layer 215a is formed on a single layer of wiring 206 (hereinafter, referred to as a main wiring for convenience of description), and a first dummy wiring 207 is further formed thereon Respectively.

At this time, the first dummy wiring 207 is electrically connected to the lower main wiring 206 through a plurality of first contact holes, so that even if a crack occurs in the main wiring 206, the signal can be prevented from being broken .

12B, a first insulating layer 215a, a first dummy wiring 207, and a second insulating layer 215b are sequentially formed on the main wiring 206, and a second dummy wiring line 208 are formed.

At this time, the second dummy wiring lines 208 are electrically connected to the first dummy wiring lines 207 through a plurality of second contact holes, and the first dummy wiring lines 207 are electrically connected to the first dummy wiring lines 207 through a plurality of first contact holes It is possible to prevent the signal from being broken even if a crack occurs in the main wiring 206 or the first dummy wiring 207 by electrically connecting to the lower main wiring 206.

If the wirings are constituted by a plurality of layers as described above, it is expected that the signal can be prevented from being broken even if cracks occur in the wirings.

In the above description, the first and second dummy wirings 207 and 208 are connected to the lower wiring through a plurality of first and second contact holes in various places, but the present invention is limited to this And can be connected only at the beginning and end of wiring, which will be described with reference to the drawings.

13A and 13B are cross-sectional views illustrating another wiring structure of a wiring region in a flexible organic light emitting display device according to a second embodiment of the present invention.

13A shows a case where the wiring in the wiring region is composed of a double layer, and FIG. 13B shows a case where the wiring in the wiring region is made of a triple layer.

Referring to FIG. 13A, a first insulating layer 215a is formed on the main wiring 206, and a first dummy wiring 207 'is further formed thereon.

At this time, the first dummy wiring 207 'is electrically connected to the main wiring 206 through the first contact hole at the beginning and the end of the main wiring 206.

13B, a first insulating layer 215a, a first dummy wiring 207 ', and a second insulating layer 215b are sequentially formed on the main wiring 206, (Not shown).

At this time, the second dummy wiring 208 'is electrically connected to the first dummy wiring 207' through the second contact hole at the beginning and the end of the first dummy wiring 207 ' The wiring 207 'is electrically connected to the main wiring 206 through the first contact hole at the beginning and the end of the main wiring 206.

The first and second dummy wirings 207 'and 208' may be overlapped with the lower main wiring 206, or may be formed so as not to overlap each other.

In addition, the second dummy wiring 208 'may be overlapped with the first dummy wiring 207' located below the second dummy wiring 208 ', or may be formed so as not to overlap.

As a result of the stress caused by the bending of the wiring region, there is a possibility that a crack or a corresponding damage may occur to the connected portion. Therefore, the connected portion is connected to the first and last portions of the wiring, that is, It is possible to compensate for the potential damage by connecting to the area.

The present invention can also be applied to a case where both of the upper and lower bezel regions and the left and right bezel regions are implemented with substantially zero, and this will be described in detail through a third embodiment of the present invention.

FIG. 14 is a perspective view illustrating a structure of a flexible organic light emitting display device according to a third embodiment of the present invention. FIG. 14 shows a flexible organic light emitting display device in a state where a flexible circuit board is fastened.

FIG. 15 is a schematic cross-sectional view taken along line A-A 'of a flexible organic light emitting display device according to a third embodiment of the present invention shown in FIG.

Referring to the drawings, a flexible organic light emitting display device according to a third embodiment of the present invention includes a panel assembly for displaying an image and a flexible circuit board 330 connected to the panel assembly.

The panel assembly includes a TFT substrate 305 defining a display area AA and a pad area and a thin film encapsulation layer 301 formed on the TFT substrate 305 while covering the display area AA.

At this time, a polyimide substrate may be used as the TFT substrate 305. In this case, a back plate 310 made of polyethylene terephthalate may be attached to the back surface.

A polarizing plate (not shown) may be attached on the thin film sealing layer 301 to prevent reflection of light incident from the outside.

The sub-pixels are arranged in a matrix in the display area AA of the TFT substrate 305. The upper, lower, left, and right sides of the TFT substrate 305 are folded back to form a back surface of the panel assembly, 310).

For convenience of explanation, the TFT substrate 305 is divided into three areas, and the display area AA and the back plate 310, which are positioned on the front surface of the back plate 310 and are arranged in a matrix, Four circuit regions in which the driving elements and other components for driving the panel assembly are disposed on the back side and the circuit regions are disposed between the display region AA and the circuit region and are bent at each side of the back plate 310, And can be divided into four wiring regions in which various wirings (not shown) are arranged.

In the wiring region of the TFT substrate 305, various wirings are formed using a thin metal, and the display region AA is electrically connected to the circuit region through the wirings. That is, the driving elements and other parts formed in the circuit region of the TFT substrate 305 are electrically connected to the display region AA through the wirings formed in the wiring region.

As described above, the TFT substrate 305 is formed by using a polyimide substrate or a film or a material having a strong flexural strength corresponding to the polyimide substrate, or folding the upper, lower, left, and right sides back to face the back surface of the panel assembly .

At this time, the pad region is positioned at one end of the circuit region of the TFT substrate 305 whose upper side is folded backward, and is exposed to the outside.

In the pad region of the TFT substrate 305, pad electrodes for transmitting an electric signal to the scan driver and the data driver are disposed.

The thin film encapsulation layer 301 is formed on the organic light emitting diodes and the driving circuits formed on the TFT substrate 305 to seal and protect the organic light emitting diodes and the driving circuits from the outside.

An integrated circuit chip (not shown) is mounted on the pad region of the panel assembly thus constructed in a chip on glass manner.

Electronic devices (not shown) for processing driving signals are mounted on the flexible circuit board 330 in a chip-on-film manner and connectors (not shown) for transmitting external signals to the flexible circuit board 330 are installed .

The flexible circuit board 330 is attached to the circuit area of the TFT substrate 305, which is folded toward the rear side of the panel assembly, and faces the back surface of the panel assembly. That is, the flexible circuit board 330 is attached to the back surface of the organic light emitting display device through the adhesive layer 336 in a state where the thin film sealing layer 301 is attached to the TFT substrate 305 to form the module assembly.

At this time, an anisotropic conductive film (not shown) is used to electrically connect the terminal portions of the TFT substrate 305 and the connecting portions of the flexible circuit board 330. [

As described above, in the third embodiment of the present invention, the driving elements and other components existing in the upper and lower and right and left bezel regions are disposed in the four circuit regions located on the back surface of the back plate 310, .

As described above, the flexible organic light emitting display device described above exemplifies electrically connecting the display region AA and the circuit region using a single layer of wiring. That is, the driving elements and other parts formed in the circuit region of the TFT substrate 305 are electrically connected to the display region AA through single-layer wirings formed in the wiring region.

However, the present invention is not limited to this, and the wirings in the wiring region may be composed of a double layer or a triple layer or more rather than a single layer. In this case, in order to prevent wiring cracks do.

Further, as described above, the first and second dummy wirings of the triple layer may be connected to the wiring below the first and second contact holes through a plurality of the first and second contact holes, but the present invention is limited to this It is possible to connect only at the beginning and end of the wiring.

While a great many are described in the foregoing description, it should be construed as an example of preferred embodiments rather than limiting the scope of the invention. Therefore, the invention should not be construed as limited to the embodiments described, but should be determined by equivalents to the appended claims and the claims.

101, 201, 301: thin film encapsulating layers 105, 205, 305:
106, 206: wirings 107, 207, 107 ', 207': first dummy wiring
108, 208, 108 ', 208': second dummy wiring
110, 210, and 310: back plate 130, 230, 330:
135, 235, 335: Anisotropic conductive film 136, 236, 336:

Claims (17)

1. A panel assembly comprising: a TFT substrate having a display region and a pad region defined therein; and a thin film encapsulation layer formed on the TFT substrate while covering the display region, the panel assembly displaying an image; And
And a flexible printed circuit board attached to the pad portion of the panel assembly,
Wherein at least one of upper, lower, left, and right sides of the TFT substrate is folded back to face the back surface of the panel assembly. The flexible organic light emitting display device of claim 1, wherein the TFT substrate is a polyimide (PI) substrate. The flexible organic light emitting display device according to claim 2, further comprising a back plate attached to a back surface of the TFT substrate. The liquid crystal display according to claim 2, wherein the TFT substrate
A display region located on a front surface of the back plate and having sub-pixels arranged in a matrix form;
A circuit region located on a rear surface of the back plate and including driving elements and other components for driving the panel assembly; And
Wherein the flexible organic light emitting display device is divided into a wiring region which is located between the display region and the circuit region and is bent at a side of the back plate and in which various wirings are arranged. 5. The flexible organic light emitting display according to claim 4, wherein various wirings are formed in the wiring region of the TFT substrate using a thin metal, and the display region and the circuit region are electrically connected through the wirings. Device. The flexible organic light emitting display device according to claim 4, wherein the pad region is located at one end of a circuit region of the TFT substrate folded back and is exposed to the outside. [7] The flexible organic light emitting display device of claim 6, wherein the flexible circuit board is attached to a circuit area of the TFT substrate folded rearward of the panel assembly and faces a back surface of the panel assembly. The flexible organic light emitting display device according to claim 1, wherein the pad region is exposed to the outside without being covered by the thin film sealing layer. The flexible organic light emitting display device according to claim 8, wherein the flexible circuit board is folded to the rear side of the panel assembly, and the flexible circuit board faces the backside of the panel assembly. 5. The display device according to claim 4, wherein the driving elements and other parts formed in the circuit region of the TFT substrate are electrically connected to the display region through a single layer of wiring formed in the wiring region (hereinafter referred to as main wiring) Wherein the flexible organic light emitting display device is a flexible organic light emitting display device. 11. The semiconductor device according to claim 10, further comprising a first dummy wiring formed on the first insulating film and the first insulating film formed on the main wiring and electrically connected to the main wiring through a plurality of first contact holes Wherein the organic light emitting display device is a flexible organic light emitting display device. The semiconductor device according to claim 11, further comprising a second insulating film formed on the first dummy wiring and a second dummy wiring formed on the second insulating film and electrically connected to the first dummy wiring through a plurality of second contact holes Wherein the organic light emitting display device comprises a flexible organic light emitting display device. The semiconductor device according to claim 10, further comprising: a first dummy wiring formed on the first insulating film and the first insulating film formed on the main wiring and electrically connected to the main wiring through the first contact hole at the beginning and the end of the main wiring Wherein the organic light emitting display device further comprises: 14. The semiconductor device according to claim 13, further comprising: a second insulating film formed on the first dummy wiring and a second insulating film formed on the second insulating film and electrically connected to the first dummy wiring through the second contact hole at the beginning and the end of the first dummy wiring And a second dummy wiring line connected to the second dummy wiring line. The flexible organic light emitting display device according to any one of claims 12 and 14, wherein the first and second dummy wirings are configured so as to overlap or not overlap with the main wirings below the first and second dummy wirings. 16. The flexible organic light emitting display device according to claim 15, wherein the second dummy wirings are configured so as not to overlap or overlap with the first dummy wirings below the first dummy wirings. The flexible organic light emitting display device according to claim 1, wherein the flexible circuit board is attached to a pad portion of the panel assembly through an anisotropic conductive film.

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