KR20140046267A

KR20140046267A - Display device having touchscreen panel

Info

Publication number: KR20140046267A
Application number: KR1020120112535A
Authority: KR
Inventors: 박성환
Original assignee: 삼성디스플레이 주식회사
Priority date: 2012-10-10
Filing date: 2012-10-10
Publication date: 2014-04-18
Also published as: KR102024860B1

Abstract

A display device includes: a display panel; a touch screen panel (TSP) provided on the display panel; a main flexible printed circuit board (FPCB) attached on the display panel; and a TSP FPCB bonded to the TSP.

Description

Display device with touch screen panel {DISPLAY DEVICE HAVING TOUCHSCREEN PANEL}

The present invention relates to a touch screen panel display device.

The present invention relates to an organic light emitting display panel, a liquid crystal display panel, an electrowetting display panel, an electrophoretic display panel, and a MEMS display panel. The present invention relates to a touch screen panel display device in which a touch screen panel (TSP) is mounted on a display panel including a system display panel, a plasma display panel, and the like.

The TSP is a screen with a built-in detector that detects a location by recognizing a coordinate value of the contact point when a finger presses or touches a point on the screen display unit.

Since the display panel and the TSP are independent of each other, a driving unit and a flexible printed circuit board (FPCB) capable of driving the associated display panel are provided in the TSP display apparatus.

An object of the present invention is to secure a cost reduction and price competitiveness by providing a non-separated integrated FPCB in the touch screen panel display.

The present invention relates to a display device including a display panel, a touch screen panel (TSP) provided on the display panel, and an integrated FPCB connected to each of the display panel and the TSP. The integrated FPCB includes a main flexible printed circuit board (FPCB) connected to the display panel and a TSP flexible printed circuit board (TSP FPCB) connected to the TSP.

The display panel has a first pad part connected to the main FPCB, and the TSP has a second pad part connected to the main FPCB.

The integrated FPCB may further include a connection part connecting the main FPCB and the TSP FPCB between the main FPCB and the TSP FPCB, wherein the connection part is bent by a step between the TSP and the display panel. .

The module of the integrated FPCB structure according to the present invention can achieve the effects of reducing the cost of main components, simplifying the structure, simplifying the process, reducing the management loss, and strengthening the anti-static due to the integration of the ground structure.

1 is a perspective view of a touch screen panel display according to an embodiment of the present invention;
2 is a plan view of an integrated FPCB according to an embodiment of the present invention;
3 is a plan view of an integrated FPCB according to another embodiment of the present invention;
4 is a plan view of an integrated FPCB according to another embodiment of the present invention;
5 is a perspective view showing the connection equipment according to different embodiments of the present invention.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a touch screen display device having an integrated FPCB 21 according to an embodiment of the present invention.

Referring to FIG. 1, the TSP display apparatus includes a display panel 10, a TSP 11, a driver 12, and a display panel 10 and the TSP 11 connected to the driver 12, respectively. An integrated FPCB 21 is included.

The display panel 10 displays an image, and includes an organic light emitting display panel, a liquid crystal display panel, an electrowetting display panel, and an electrophoretic display panel ( electrophoretic display panels, microelectromechanical system display panels, plasma display panels, and the like.

For example, when the display panel 10 is a liquid crystal display panel, the display panel 10 includes a base substrate 101, an opposing substrate 102 facing the base substrate, and the base substrate 101. And a liquid crystal layer (not shown) formed between the counter substrate 102.

According to an embodiment of the present invention, the base substrate 101 may include a plurality of signal wires, a plurality of thin film transistors connected to the signal wires, and a plurality of pixel electrodes electrically connected to the thin film transistors. have. Each thin film transistor switches the driving signal provided to the corresponding pixel electrode side. In addition, the opposing substrate 102 may include a common electrode together with the pixel electrodes to form an electric field for controlling the arrangement of the liquid crystals. The display panel 10 drives the liquid crystal layer to display an image forward.

The opposite substrate 102 may be provided with a smaller area than the base substrate 101 to expose a portion of the base substrate 101. The base substrate 101 includes a first pad portion 18 connected to a first connection portion 15 of the main FPCB 13, which will be described later, and the first pad portion 18 includes the exposed base substrate ( 101). The signal wires are connected to the main FPCB 13 which will be described later through the first pad part 18.

The TSP 11 is provided on the opposing substrate 102 of the display panel 10 and may have an area equal to or smaller than that of the opposing substrate 102. The TSP 11 includes a second pad portion 19 connected to a second connection portion 16 of the TSP FPCB 14 which will be described later, and the second pad portion 19 is provided at one side of the TSP 11. Can be provided.

The TSP 11 may use any one of a capacitive type, a resistive film type, an infrared ray type, and an ultrasonic type.

The driver 12 is a substrate on which an electronic circuit component is mounted, and may be flexible. Various patterns such as various wirings (not shown), controller integrated circuits (not shown), and power supply units (not shown) are formed on the driver 12 to drive the display panel 10 and the TSP 11 in association. have.

When the initial signal is transmitted from the driver 12 to the display panel 10 so that an image is displayed on the display panel 10, a signal given from a user in the TSP 11 is transmitted to the driver 12. The transmitted signal is transmitted from the driver 12 to the display panel 10 to display an image.

The integrated FPCB 21 includes the main FPCB 13 and the TSP FPCB 14. The main FPCB 13 is connected to the base substrate 101, and the TSP FPCB 14 is connected to the TSP 11.

The integrated FPCB 21 may include a flexible plastic substrate such as polyimide, polyetherether ketone (PEEK), or a transparent conductive polyester film.

The first connection part 15 located on the main FPCB 13 is connected to the first pad part 18 located on the base substrate 101 and the second connection part 16 located on the TSP FPCB 14. ) Is connected to the second pad portion 19 located on the TSP 11. In addition, the third connection part 17 of the integrated FPCB 21 is connected to the third pad part 20 located in the driving part 12.

The first connecting portion 15 and the first pad portion 18 are connected, the second connecting portion 16 and the second pad portion 19 are connected, and the third connecting portion 17 and the first connection portion are connected to each other. 3 pad portion 20 is connected. In addition, the display panel 10, the TSP 11, the integrated FPCB 21, and the driver 12 are synchronized.

The first connecting portion 15 is connected to the first pad portion 18 or the second connecting portion 16 is connected to the second pad portion 19 is generally an adhesive process using alignment and compression. However, separate connectors may be provided in the first and second connectors 15 and 16 to be connected to the first and second connectors 15 and 16 and the first and second pad units 18 and 19. It may be.

In addition, since the counter substrate 102 exists between the base substrate 101 and the TSP 11, a step exists between the base substrate 101 and the TSP 11 as shown in FIG. 1. As a result, a step may exist between the first pad part 18 and the second pad part 19. Accordingly, the TSP FPCB 14 may be designed in consideration of the above step difference. Accordingly, when the second connection part 16 is connected to the second pad part 19, the TSP FPCB 14 may be used. Can be bent and connected.

When the third connection part 17 is connected to the third pad part 20, a separate connector is generally provided in the third pad part 20, but may be connected through an adhesive process without the separate connector.

The integrated FPCB 21 will be described in more detail with reference to FIG. 2.

2 is a plan view showing the integrated FPCB 21 according to an embodiment of the present invention.

As shown in FIG. 2, the main FPCB 13 is provided with a first connection part 15 at one end in a direction extending from the main FPCB 13 toward the base substrate 101. The first connection part 15 is connected to the first pad part 18 provided on the base substrate 101. The TSP FPCB 14 is also provided with a second connecting portion 16 at one end in a direction extending from the TSP FPCB 14 toward the TSP 11. The second connecting portion 16 is connected to the second pad portion 19 provided on one side of the TSP 11. In addition, the integrated FPCB 21 is provided with a third connection portion 17 at one end in a direction extending from the base substrate 101 toward the integrated FPCB 21. The third connecting part 17 is connected to the third pad part 20 provided in the driving part 12.

In addition, since a step exists between the first pad part 18 and the second pad part 19, the step may be designed in consideration of the step when forming the TSP FPCB 14. Accordingly, when the second connecting portion 16 is connected to the second pad portion 19, the TSP FPCB 14 is bent and connected.

The main FPCB 13 and the TSP FPCB 14 may be a single layer or a multilayer circuit, and the first connector 15, the second connector 16 and the third connector 17 may be single. It may include the structure of the layer.

In the main FPCB 13 including the single layer or the multilayer circuit, the TSP FPCB 14 including the single layer or the multilayer circuit is provided in an area where the circuit is not mounted to provide the main FPCB. 13 and the TSP FPCB 14 may be integrated. In this case, the integrated FPCB 21 with the TSP FPCB 14 may be provided without further increasing the thickness in the thickness of the main FPCB 13 serving as the substrate.

According to the embodiment, it is possible to reduce the manufacturing cost and management cost of connecting the main FPCB 13 and the TSP FPCB 14 separately provided separately, and also reduce the additional component cost required in each manufacturing step. Can be. In addition, instead of providing the grounding structure necessary to prevent electrostatic discharge in the main FPCB 13 and the TSP FPCB 14, respectively, it is possible to be provided in the integrated FPCB 21.

Finally, the main FPCB 13 and the TSP FPCB, respectively, are connected to the first pad part 18 when the first pad part 18 is connected, and when the second connection part 16 and the second pad part 19 are connected to each other. The number of joining processes is reduced compared to that of (14) provided separately. Therefore, there is a cost reduction effect caused by not having to repeat the same process.

3 is a plan view of an integrated FPCB 31 according to another embodiment of the present invention.

The integrated FPCB 31 includes the main FPCB 33 and the TSP FPCB 34. The main FPCB 33 is connected to the base substrate 101, and the TSP FPCB 34 is connected to the TSP 11.

The integrated FPCB 31 may include a flexible plastic substrate such as polyimide, polyetherether ketone (PEEK), or a transparent conductive polyester film.

Unlike FIG. 2, the integrated FPCB 31 according to another embodiment is provided with an FPCB connector 30 connecting the main FPCB 33 and the TSP FPCB 34. As the FPCB connector 30 is provided, the main FPCB 33 and the TSP FPCB 34 are integrally formed without being separated from each other.

The FPCB connection part 30 is connected to one end in a direction extending from the TSP 11 toward the TSP FPCB 34. In addition, the length of the FPCB connecting portion 30 may be designed in consideration of the step difference between the first pad portion 18 and the second pad portion 19, so that the second connecting portion 36 is When connected to the 2 pad portion 19, the FPCB connecting portion 30 is flexible and can be bent and connected by the step.

In addition, the main FPCB 33 and the TSP FPCB 34 may include a single layer or multiple layers of circuits, and the FPCB connection unit 30 may include a single layer of circuits.

Referring to FIG. 3, the main FPCB 33 is provided with a first connection part 35 at one end in a direction extending from the main FPCB 33 toward the base substrate 101. The first connection part 35 is connected to the first pad part 18 provided on the base substrate 101. In addition, the TSP FPCB 34 is provided with a second connection portion 36 at one end in a direction extending from the TSP FPCB 34 toward the TSP 11. The second connection portion 36 is connected to the second pad portion 19 provided on one side of the TSP 11. In addition, the integrated FPCB 31 is provided with a third connection portion 37 at one end in a direction extending from the base substrate 101 toward the integrated FPCB 31. The third connection part 37 is connected to the third pad part 20 provided in the driving part 12.

According to another embodiment of the present invention, it is possible to reduce the manufacturing cost and the management cost for separately connecting the main FPCB 33 and the TSP FPCB 34 provided independently, and additional component costs required for each manufacturing step Can be reduced. In addition, instead of providing the grounding structure necessary for preventing electrostatic discharge to the main FPCB 33 and the TSP FPCB 34 one by one, the integrated FPCB 31 may be provided.

Finally, the main FPCB 33 and the TSP FPCB, respectively, are connected to the first pad part 18 when the first pad part 18 is connected and when the second connection part 36 and the second pad part 19 are connected. The number of connection processes is reduced compared to that of 34 which is provided separately. Therefore, there is a cost reduction effect caused by not having to repeat the same process.

4 is a plan view of an integrated FPCB 41 according to another embodiment of the present invention.

The integrated FPCB 41 includes the main FPCB 43 and the TSP FPCB 44. The main FPCB 43 is connected to the base substrate 101, and the TSP FPCB 44 is connected to the TSP 11.

The integrated FPCB 41 may include a flexible plastic substrate, such as polyimide, polyetherether ketone (PEEK), or a transparent conductive polyester film.

Unlike FIG. 3, in the integrated FPCB 41 according to another embodiment, the FPCB connecting portion 40 is connected to one end in a vertical direction extending from the TSP 11 toward the TSP FPCB 44. . In addition, the length of the FPCB connection part 40 may be designed in consideration of the step difference between the first pad part and the second pad part. Accordingly, when the second connection part is connected to the second pad part, the FPCB connection part Since is flexible, it may be bent and connected by the step.

In addition, the main FPCB 43 and the TSP FPCB 44 may include a single layer or multiple layers of circuits, and the FPCB connection unit 40 may include a single layer of circuits. At this time, as the material of the main FPCB 43, the TSP FPCB 44 and the FPCB connector 40, a flexible film such as polyimide, polyetherether ketone (PEEK), or transparent conductive polyester film It may include one plastic substrate.

Referring to FIG. 4, the main FPCB 43 is provided with a first connection part 45 at one end in a direction extending from the main FPCB 43 toward the base substrate 101. The first connection part 45 is connected to the first pad part 18 provided on the base substrate 101. In addition, the TSP FPCB 44 is provided with a second connection portion 46 at one end in a direction extending from the TSP FPCB 44 toward the TSP 11. The second connection part 46 is connected to the second pad part 19 provided on one side of the TSP 11. In addition, the integrated FPCB 41 is provided with a third connection portion 47 at one end in a direction extending from the base substrate 101 toward the integrated FPCB 41. The third connection part 47 is connected to the third pad part 20 provided in the driving part 12.

According to another embodiment of the present invention, it is possible to reduce the manufacturing cost and the management cost of separately connecting the main FPCB 43 and the TSP FPCB 44 provided separately, and additional component costs required in each manufacturing step Can be reduced. In addition, instead of providing the ground structure necessary to prevent electrostatic discharge in the main FPCB 43 and the TSP FPCB 44, respectively, it is possible to be provided in the integrated FPCB 41.

Finally, the main FPCB 43 and the TSP FPCB, respectively, are connected to the first pad part 18 when the first pad part 18 is connected and when the second connection part 46 and the second pad part 19 are connected. The number of connections is less than that of 44 being provided separately. Therefore, there is a cost reduction effect caused by not having to repeat the same process.

When the integrated FPCBs 21, 31, and 41 of the embodiment and the other embodiments are connected to the base substrate 101 and the TSP 11, a crimping process using bonding equipment may be used. A separate connector may be provided to connect to the connector. When proceeding to the crimping process, the connection process has the effect of reducing from two to one. Looking at the compression process in detail with reference to Figure 5 as follows.

1 to 5, the crimping equipment includes two headers 50, each header having a Z-axis step 51 and an X-axis step 52 with each other.

The Z-axis step 51 is the same as the step between the first pad part 18 and the second pad part 19, and the X-axis step 52 is connected to the main FPCBs 13, 33, 43. It is equal to the distance between the first connections 15, 35, 45 located and the second connections 16, 36, 46 located in the TSP FPCBs 14, 34, 44. Accordingly, the main FPCBs 13, 33, 43 and the TSP FPCBs 14, 34, 44 may be completed in one compression process. In addition, when connecting the two headers 50 in the form of a separate fixing screw, since the Z-axis step 51 can be used in common for different models, it can be used in common for many models as in the existing process equipment.

The pressing process may include a chip on glass (COG), a film on glass (FOG), or the like. The COG and the FOG form an invisible ITO pad on the lower substrate to be compressed, and bumps made of gold on the upper substrate to form an anisotropic conductive film (ACF). It is a process of attaching and attaching the upper substrate and the lower substrate to the space between them, and then applying heat and pressure to bond them.

At this time, the ACF is an anisotropic conductive film in which fine conductive particles are generally mixed with a thermosetting adhesive resin to form a film, and electrically connected only in one direction. Examples of the fine conductive particles include nickel (Ni), carbon, and lead balls.

The process when applying the COG and the FOG in the compression process in the embodiments of the present invention is as follows. First, bumps including gold may be formed on the first and second connection parts 15, 35, and 45 and the second connection parts 16, 36, and 46, and the first pad part 18 and the first substrate part of the base substrate 101 may be formed. After the pad is formed on the second pad portion 19 of the TSP 11, an anisotropic conductive film (ACF) is attached to the first pad portion 18 and the second pad portion 19. Thereafter, the bumps of the first connecting portions 15, 35, and 45 and the pads of the first pad portion 18 are aligned and temporarily attached, and the bumps of the second connecting portions 16, 36, 46 and the second pad are aligned. The pads of the unit 19 are aligned and temporarily attached. Thereafter, the first crimping portion 53 of the header 50 is aligned with the temporarily attached first connecting portions 15, 35, 45 so as to have reliability such as energization, insulation, adhesion, and the like. 54) is aligned with the temporarily attached second connection (16, 36, 46), and then bonded by applying heat and pressure.

With the integrated FPCBs 21, 31, 41 and the crimping equipment described above, the manufacturing of the TSP display apparatus can reduce the number of crimping processes and reduce the cost, and at the same time, provide a grounding structure necessary to prevent electrostatic discharge. There is an advantage in providing it to one integrated FPCB.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various modifications and changes may be made thereto without departing from the scope of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

101: base substrate 102: opposing substrate
10: display panel 11: TSP
12: PCB 13,33,43: main FPCB
14,34,44: TSP FPCB 15,35,45: first connection
16,36,46: second connection portion 17, 37,47: third connection portion
18: first pad portion 19: second pad portion
20: third pad portion 21, 31, 41: integral FPCB
30, 40: FPCB connection 50: Header
51: Z-axis step 52: X-axis step
53: first pressing part 54: second pressing part

Claims

Display panel;
A touch screen panel (TSP) provided on the display panel; And
An integrated FPCB connected to each of the display panel and the TSP;
The integrated FPCB includes a main flexible printed circuit board (FPCB) connected to the display panel and a TSP flexible printed circuit board (TSP FPCB) connected to the TSP.

The method of claim 1,
And the TSP has an area smaller than that of the display panel.

The method of claim 1,
The display panel has a first pad part connected to the main FPCB.
The TSP has a second pad portion connected to the main FPCB.

The method of claim 1,
The integrated FPCB further includes a connection portion connecting the main FPCB and the TSP FPCB between the main FPCB and the TSP FPCB.
And the connection part is curved by a step between the TSP and the display panel.

5. The method of claim 4,
And the TSP FPCB extends from the TSP toward the main FPCB and the connection part is connected to one end in an extension direction of the TSP.

5. The method of claim 4,
The TSP FPCB extends from the TSP toward the main FPCB, and the connection part is connected to one end in a direction perpendicular to the extending direction of the TSP.

6. The method according to any one of claims 4 and 5,
And the connection part is provided as a single layer FPCB.

The method according to claim 6,
And the main FPCB and the TSP FPCB are provided as multilayer FPCBs.

The method according to claim 6,
And the main FPCB and the TSP FPCB are provided as a single layer FPCB.