KR20130141652A - 구조용 혼성 접착제 - Google Patents
구조용 혼성 접착제 Download PDFInfo
- Publication number
- KR20130141652A KR20130141652A KR1020137019662A KR20137019662A KR20130141652A KR 20130141652 A KR20130141652 A KR 20130141652A KR 1020137019662 A KR1020137019662 A KR 1020137019662A KR 20137019662 A KR20137019662 A KR 20137019662A KR 20130141652 A KR20130141652 A KR 20130141652A
- Authority
- KR
- South Korea
- Prior art keywords
- curing agent
- epoxy
- composition
- adhesive
- resin
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 69
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 69
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 104
- 239000000203 mixture Substances 0.000 claims abstract description 96
- 239000004593 Epoxy Substances 0.000 claims abstract description 80
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 52
- 239000003822 epoxy resin Substances 0.000 claims abstract description 51
- 239000002313 adhesive film Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 239000011347 resin Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 229920000768 polyamine Polymers 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 3
- LDVVMCZRFWMZSG-OLQVQODUSA-N (3ar,7as)-2-(trichloromethylsulfanyl)-3a,4,7,7a-tetrahydroisoindole-1,3-dione Chemical compound C1C=CC[C@H]2C(=O)N(SC(Cl)(Cl)Cl)C(=O)[C@H]21 LDVVMCZRFWMZSG-OLQVQODUSA-N 0.000 claims 1
- 239000005745 Captan Substances 0.000 claims 1
- 229940117949 captan Drugs 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
- 238000012360 testing method Methods 0.000 description 14
- 239000000126 substance Substances 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 3
- 229920006243 acrylic copolymer Polymers 0.000 description 3
- 229940106691 bisphenol a Drugs 0.000 description 3
- 239000011258 core-shell material Substances 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000004005 microsphere Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical group N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- IHUNBGSDBOWDMA-AQFIFDHZSA-N all-trans-acitretin Chemical compound COC1=CC(C)=C(\C=C\C(\C)=C\C=C\C(\C)=C\C(O)=O)C(C)=C1C IHUNBGSDBOWDMA-AQFIFDHZSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 238000009991 scouring Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- WTFAGPBUAGFMQX-UHFFFAOYSA-N 1-[2-[2-(2-aminopropoxy)propoxy]propoxy]propan-2-amine Chemical compound CC(N)COCC(C)OCC(C)OCC(C)N WTFAGPBUAGFMQX-UHFFFAOYSA-N 0.000 description 1
- FPTQOQLMYGSLAW-UHFFFAOYSA-L 1h-imidazole;nickel(2+);phthalate Chemical compound [Ni+2].C1=CNC=N1.C1=CNC=N1.C1=CNC=N1.C1=CNC=N1.C1=CNC=N1.C1=CNC=N1.[O-]C(=O)C1=CC=CC=C1C([O-])=O FPTQOQLMYGSLAW-UHFFFAOYSA-L 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 1
- RCEJCSULJQNRQQ-UHFFFAOYSA-N 2-methylbutanenitrile Chemical compound CCC(C)C#N RCEJCSULJQNRQQ-UHFFFAOYSA-N 0.000 description 1
- 229910000547 2024-T3 aluminium alloy Inorganic materials 0.000 description 1
- JCEZOHLWDIONSP-UHFFFAOYSA-N 3-[2-[2-(3-aminopropoxy)ethoxy]ethoxy]propan-1-amine Chemical compound NCCCOCCOCCOCCCN JCEZOHLWDIONSP-UHFFFAOYSA-N 0.000 description 1
- HNDYULRADYGBDU-UHFFFAOYSA-N 8-methylnonyl benzoate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1 HNDYULRADYGBDU-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- PUNIDMUCDALJAS-UHFFFAOYSA-N C(C1=CC=C(C=C1)N(C(=O)NC)C)C1=CC=C(C=C1)N(C(=O)NC)C Chemical compound C(C1=CC=C(C=C1)N(C(=O)NC)C)C1=CC=C(C=C1)N(C(=O)NC)C PUNIDMUCDALJAS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- CVPZXHCZKMFVOZ-UHFFFAOYSA-N [4-(benzoyloxymethyl)cyclohexyl]methyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC(CC1)CCC1COC(=O)C1=CC=CC=C1 CVPZXHCZKMFVOZ-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000007844 bleaching agent Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- SZLIWAKTUJFFNX-UHFFFAOYSA-N dihydrocitronellol benzoate Natural products CC(C)CCCC(C)CCOC(=O)C1=CC=CC=C1 SZLIWAKTUJFFNX-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- -1 isophthaloyl Chemical group 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
- C09J2400/283—Presence of paper in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (17)
- 접착제 조성물로서,
a) 에폭시 수지를 포함하는 베이스 수지;
b) 제1 에폭시 경화제; 및
c) 제2 에폭시 경화제를 포함하며,
제1 에폭시 경화제 및 제2 에폭시 경화제는, 제1 에폭시 경화제가 조성물 내의 에폭시 수지와 실질적으로 반응하게 하는 온도 및 지속시간의 조건 하에서 제2 에폭시 경화제가 조성물 내에 실질적으로 미반응인 상태로 남아 있을 수 있도록 선택되는 접착제 조성물. - 제1항에 있어서, 제1 에폭시 경화제 및 제2 에폭시 경화제는, 제2 에폭시 경화제가 22℃ (72℉)에서 24시간 후에 조성물 내에 실질적으로 미반응인 상태로 남아 있고 제1 에폭시 경화제가 22℃ (72℉)에서 24시간 후에 조성물 내의 에폭시 수지와 실질적으로 반응하게 되도록 선택되는 접착제 조성물.
- 접착제 조성물로서,
a) 에폭시 수지를 포함하는 베이스 수지;
b) 제1 에폭시 경화제; 및
c) 제2 에폭시 경화제를 포함하며,
제1 에폭시 경화제는 조성물 내의 에폭시 수지와 실질적으로 반응하고, 제2 에폭시 경화제는 조성물 내에서 실질적으로 미반응하는 접착제 조성물. - 제1항 내지 제3항 중 어느 한 항에 있어서, 제1 에폭시 경화제는 폴리메르캅탄인 접착제 조성물.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 제2 에폭시 경화제는 폴리아민인 접착제 조성물.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 베이스 수지는 아크릴 수지를 포함하지 않는 접착제 조성물.
- 접착제 조성물로서,
a) 에폭시 수지를 포함하는 베이스 수지 - 상기 베이스 수지는 아크릴 수지를 포함하지 않음 -;
b) 폴리메르캅탄인 제1 에폭시 경화제; 및
c) 폴리아민인 제2 에폭시 경화제를 포함하는 접착제 조성물. - 제1항 내지 제7항 중 어느 한 항에 있어서, 베이스 수지는 단지 한 가지 유형의 베이스 수지를 포함하되 이는 에폭시 수지인 접착제 조성물.
- 제1항 내지 제8항 중 어느 한 항에 있어서, 제1 에폭시 경화제는 2 초과의 관능가(functionality)를 갖는 접착제 조성물.
- 제1항 내지 제9항 중 어느 한 항에 따른 접착제 조성물의 제1 에폭시 경화제 및 제2 에폭시 경화제 둘 모두를 실질적으로 경화시킴으로써 얻어지는 결합형(bound) 접착제 조성물.
- 제1항 내지 제9항 중 어느 한 항에 따른 접착제 조성물을 포함하는 접착 필름으로서, 제1 에폭시 경화제는 조성물 내의 에폭시 수지와 실질적으로 반응하고, 제2 에폭시 경화제는 조성물 내에서 실질적으로 미반응하는 접착 필름.
- 제1항 내지 제9항 중 어느 한 항에 따른 접착제 조성물로 본질적으로 이루어지는 접착 필름으로서, 제1 에폭시 경화제는 조성물 내의 에폭시 수지와 실질적으로 반응하고, 제2 에폭시 경화제는 조성물 내에서 실질적으로 미반응하는 접착 필름.
- 접착 필름으로서,
a) 제1항 내지 제9항 중 어느 한 항에 따른 접착제 조성물 - 상기 제1 에폭시 경화제는 조성물 내의 에폭시 수지와 실질적으로 반응하고, 상기 제2 에폭시 경화제는 조성물 내에서 실질적으로 미반응함 - 을 포함하는 접착제 층; 및
b) 접착제 층 내에 매립된 스크림(scrim)을 포함하는 접착 필름. - 접착 필름으로서,
a) 제1항 내지 제9항 중 어느 한 항에 따른 접착제 조성물 - 상기 제1 에폭시 경화제는 조성물 내의 에폭시 수지와 실질적으로 반응하고, 상기 2 에폭시 경화제는 조성물 내에서 실질적으로 미반응함 - 로 본질적으로 이루어진 접착제 층; 및
b) 접착제 층 내에 매립된 스크림을 포함하는 접착 필름. - 접착제 조성물로서,
a) 에폭시 수지 및 아세토아세테이트-작용성 수지를 포함하는 베이스 수지;
b) 아세토아세테이트-작용성 수지를 위한 제1 경화제; 및
c) 에폭시 수지를 위한 제2 경화제를 포함하며,
제1 경화제 및 제2 경화제는, 제1 경화제가 조성물 내의 아세토아세테이트-작용성 수지와 실질적으로 반응하게 하는 온도 및 지속시간의 조건 하에서 제2 경화제가 조성물 내에 실질적으로 미반응인 상태로 남아 있을 수 있도록 선택되는 접착제 조성물. - 제15항에 있어서, 제1 경화제는 조성물 내의 아세토아세테이트-작용성 수지와 실질적으로 반응하고, 제2 경화제는 조성물 내에서 실질적으로 미반응하는 접착제 조성물.
- 제16항에 따른 접착제 조성물을 포함하는 접착 필름.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201061428037P | 2010-12-29 | 2010-12-29 | |
US61/428,037 | 2010-12-29 | ||
PCT/US2011/067513 WO2012092332A2 (en) | 2010-12-29 | 2011-12-28 | Structural hybrid adhesives |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130141652A true KR20130141652A (ko) | 2013-12-26 |
KR101952462B1 KR101952462B1 (ko) | 2019-02-26 |
Family
ID=45509706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137019662A KR101952462B1 (ko) | 2010-12-29 | 2011-12-28 | 구조용 혼성 접착제 |
Country Status (8)
Country | Link |
---|---|
US (2) | US20130267136A1 (ko) |
EP (1) | EP2658939B1 (ko) |
JP (1) | JP5981451B2 (ko) |
KR (1) | KR101952462B1 (ko) |
CN (1) | CN103270075B (ko) |
BR (1) | BR112013014592A2 (ko) |
CA (1) | CA2823342A1 (ko) |
WO (1) | WO2012092332A2 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2601242A1 (en) | 2010-08-04 | 2013-06-12 | 3M Innovative Properties Company | Method of preparing benzoxazine-thiol polymer films |
US9611360B2 (en) | 2011-03-28 | 2017-04-04 | 3M Innovative Properties Company | Curable composition, article, method of curing, and tack-free reaction product |
US9156946B2 (en) | 2011-09-28 | 2015-10-13 | 3M Innovative Properties Company | Amine/thiol curing of benzoxazines |
WO2014007963A1 (en) | 2012-07-03 | 2014-01-09 | 3M Innovative Properties Company | Method of making structured hybrid adhesive articles |
WO2014054631A1 (ja) * | 2012-10-02 | 2014-04-10 | 大日本印刷株式会社 | 接着剤組成物およびそれを用いた接着シート |
CN107532120A (zh) | 2015-04-29 | 2018-01-02 | 3M创新有限公司 | 独立成套的产生无氧环境的培养装置 |
EP3170657B1 (en) | 2015-11-19 | 2020-09-09 | 3M Innovative Properties Company | Multilayer structural adhesive film |
US20170341300A1 (en) * | 2016-05-26 | 2017-11-30 | Wisconsin Alumni Research Foundation | Additive Manufacturing Process Continuous Reinforcement Fibers And High Fiber Volume Content |
WO2018081941A1 (zh) * | 2016-11-02 | 2018-05-11 | 宁德新能源科技有限公司 | 结构胶纸及其制备方法、在电极片预留极耳空位的方法 |
US20210363390A1 (en) * | 2018-03-23 | 2021-11-25 | Lohmann Gmbh & Co. Kg | Pressure-sensitive structural adhesive film based on epoxy resin composition |
JP2021534266A (ja) | 2018-08-06 | 2021-12-09 | ゼフィロス インコーポレイテッド | 改善された破壊ひずみを有する高弾性率構造発泡体材料 |
BR112021005284A2 (pt) | 2018-09-20 | 2021-06-22 | Ppg Industries Ohio, Inc. | composição contendo tiol |
EP3719090A1 (en) * | 2019-04-02 | 2020-10-07 | 3M Innovative Properties Company | Elastic one-part structural adhesive tape |
DE102019004057B4 (de) * | 2019-06-11 | 2022-02-03 | Lohmann Gmbh & Co. Kg | Komprimierbarer, haftklebriger, struktureller Klebefilm auf Basis einer latent reaktiven Zusammensetzung |
DE102020206619A1 (de) | 2020-05-27 | 2021-12-02 | Tesa Se | Vorvernetzte epoxid-haftklebmassen und klebebänder, welche diese enthalten |
CN112852370A (zh) * | 2021-03-18 | 2021-05-28 | 东莞市帆朗电子科技有限公司 | 一种透明单组份低温固化胶粘剂及其制备方法 |
CN119343394A (zh) | 2022-06-08 | 2025-01-21 | 泽菲罗斯有限公司 | 增韧的双组分环氧结构黏合剂 |
WO2024185519A1 (ja) * | 2023-03-08 | 2024-09-12 | 株式会社スリーボンド | 硬化性樹脂組成物 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61159417A (ja) * | 1984-12-29 | 1986-07-19 | Semedain Kk | 硬化性エポキシ樹脂組成物 |
JP2794062B2 (ja) * | 1988-11-23 | 1998-09-03 | チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド | ポリオキシアルキレンジチオールおよびポリアミンを含有するエポキシ樹脂材料の硬化性混合物 |
JP2006321867A (ja) * | 2005-05-18 | 2006-11-30 | Yokohama Rubber Co Ltd:The | エポキシ樹脂組成物 |
JP2007182578A (ja) * | 2006-01-05 | 2007-07-19 | Cognis Ip Management Gmbh | 硬化性エポキシ剤を含有する水性組成物を得る方法 |
JP2009167251A (ja) * | 2008-01-11 | 2009-07-30 | Yokohama Rubber Co Ltd:The | ハネムーン型接着剤組成物、実装基板の接着方法および実装基板組み立て体 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1460571A (en) * | 1973-11-16 | 1977-01-06 | Ciba Geigy Ag | Adhesive compositions |
JPS6021648B2 (ja) * | 1979-02-01 | 1985-05-29 | 三菱油化株式会社 | 硬化性の優れたエポキシ樹脂組成物 |
JPS5626965A (en) * | 1979-08-10 | 1981-03-16 | Nippon Steel Corp | Anticorrosive coating |
CA1229696A (en) * | 1981-03-24 | 1987-11-24 | Theodore R. Flint | Rapid cure epoxy adhesive sealant |
JPS5966476A (ja) * | 1982-10-08 | 1984-04-14 | Toshiba Chem Corp | フレキシブル印刷配線板用接着剤組成物 |
IE891601L (en) | 1989-05-18 | 1990-11-18 | Loctite Ireland Ltd | Latent hardeners for epoxy resin compositions |
DE69120006T2 (de) | 1990-09-11 | 1997-01-30 | Hitachi Chemical Co Ltd | Epoxyharz-Film und Verfahren zu seiner Herstellung |
EP0594133B1 (en) | 1992-10-22 | 1998-05-06 | Ajinomoto Co., Inc. | Polythiol epoxy resin composition with extended working life |
EP0706539A1 (en) | 1993-06-10 | 1996-04-17 | Minnesota Mining And Manufacturing Company | Universal adhesion promoting composition and kit for plastics repair |
JP3391074B2 (ja) | 1994-01-07 | 2003-03-31 | 味の素株式会社 | エポキシ樹脂組成物 |
US6060540A (en) | 1998-02-13 | 2000-05-09 | Landec Corporation | Modeling pastes |
US6313257B1 (en) | 1999-03-23 | 2001-11-06 | Lord Corporation | Poly (mercaptopropylaryl) curatives |
DE19926629A1 (de) * | 1999-06-11 | 2000-12-14 | Cognis Deutschland Gmbh | Epoxidharzhärter-Zusammensetzungen |
KR100680095B1 (ko) | 1999-12-20 | 2007-02-12 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 주위 온도 안정성의 1액형 경화성 에폭시 접착제 |
US6872762B2 (en) | 2000-07-13 | 2005-03-29 | Loctite (R&D) Limited | Epoxy resin composition with solid organic acid |
JP2002118144A (ja) * | 2000-10-06 | 2002-04-19 | Sony Chem Corp | 接着剤及び電気装置 |
US7429220B2 (en) | 2001-04-13 | 2008-09-30 | Acushnet Company | Golf balls containing interpenetrating polymer networks |
US7795744B2 (en) | 2003-12-19 | 2010-09-14 | Henkel Corporation | Cationically curable epoxy resin composition |
US20080029214A1 (en) | 2006-08-04 | 2008-02-07 | Zephyros, Inc. | Multiple or single stage cure adhesive material and method of use |
US7737199B2 (en) * | 2007-02-15 | 2010-06-15 | Ashland Licensing & Intellectual Property Llc | Two-component adhesive of epoxy resin/polyol pack and polyamide/aliphatic amine/tertiary amine pack |
KR20110005256A (ko) | 2008-04-11 | 2011-01-17 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 1액형 에폭시계 구조용 접착제 |
WO2009150818A1 (ja) * | 2008-06-11 | 2009-12-17 | 三菱樹脂株式会社 | 難燃性接着剤組成物及び積層フィルム |
WO2010011705A1 (en) | 2008-07-23 | 2010-01-28 | 3M Innovative Properties Company | Two-part epoxy-based structural adhesives |
JP2012517503A (ja) | 2009-02-06 | 2012-08-02 | スリーエム イノベイティブ プロパティズ カンパニー | 室温硬化性エポキシ接着剤 |
EP2223966B1 (en) * | 2009-02-25 | 2017-08-16 | 3M Innovative Properties Company | Epoxy adhesive compositions with high mechanical strength over a wide temperature range |
US20100227981A1 (en) * | 2009-03-04 | 2010-09-09 | Air Products And Chemicals, Inc. | Epoxide-based composition |
EP2635619A1 (en) | 2010-11-05 | 2013-09-11 | Henkel Ireland Limited | Epoxy-thiol compositions with improved stability |
-
2011
- 2011-12-28 CN CN201180062414.1A patent/CN103270075B/zh not_active Expired - Fee Related
- 2011-12-28 WO PCT/US2011/067513 patent/WO2012092332A2/en active Application Filing
- 2011-12-28 CA CA2823342A patent/CA2823342A1/en not_active Abandoned
- 2011-12-28 JP JP2013547637A patent/JP5981451B2/ja not_active Expired - Fee Related
- 2011-12-28 KR KR1020137019662A patent/KR101952462B1/ko active IP Right Grant
- 2011-12-28 BR BR112013014592A patent/BR112013014592A2/pt not_active Application Discontinuation
- 2011-12-28 US US13/988,581 patent/US20130267136A1/en not_active Abandoned
- 2011-12-28 EP EP11811275.4A patent/EP2658939B1/en not_active Revoked
-
2017
- 2017-01-04 US US15/397,834 patent/US20170114256A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61159417A (ja) * | 1984-12-29 | 1986-07-19 | Semedain Kk | 硬化性エポキシ樹脂組成物 |
JP2794062B2 (ja) * | 1988-11-23 | 1998-09-03 | チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド | ポリオキシアルキレンジチオールおよびポリアミンを含有するエポキシ樹脂材料の硬化性混合物 |
JP2006321867A (ja) * | 2005-05-18 | 2006-11-30 | Yokohama Rubber Co Ltd:The | エポキシ樹脂組成物 |
JP2007182578A (ja) * | 2006-01-05 | 2007-07-19 | Cognis Ip Management Gmbh | 硬化性エポキシ剤を含有する水性組成物を得る方法 |
JP2009167251A (ja) * | 2008-01-11 | 2009-07-30 | Yokohama Rubber Co Ltd:The | ハネムーン型接着剤組成物、実装基板の接着方法および実装基板組み立て体 |
Also Published As
Publication number | Publication date |
---|---|
CN103270075B (zh) | 2017-02-15 |
CN103270075A (zh) | 2013-08-28 |
EP2658939B1 (en) | 2021-06-16 |
US20130267136A1 (en) | 2013-10-10 |
WO2012092332A3 (en) | 2012-11-08 |
JP5981451B2 (ja) | 2016-08-31 |
US20170114256A1 (en) | 2017-04-27 |
WO2012092332A2 (en) | 2012-07-05 |
EP2658939A2 (en) | 2013-11-06 |
BR112013014592A2 (pt) | 2016-09-20 |
KR101952462B1 (ko) | 2019-02-26 |
JP2014504663A (ja) | 2014-02-24 |
CA2823342A1 (en) | 2012-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101952462B1 (ko) | 구조용 혼성 접착제 | |
JP6800188B2 (ja) | 構造用接着フィルム | |
CN108291130B (zh) | 具有改善的失败模式的结构粘合剂 | |
JP4242771B2 (ja) | 耐熱性エポキシ接着剤フィルム | |
JP5756178B2 (ja) | エポキシ構造接着剤 | |
CN108350335B (zh) | 具有改善的耐腐蚀性的结构粘合剂 | |
KR101882642B1 (ko) | 강화 경화제를 포함하는 이액형 접착제 | |
US8916020B2 (en) | Assembly bonded to a structural adhesive and method and applicator for making it | |
KR20170127472A (ko) | 이액형 구조용 접착제 | |
WO2021059154A1 (en) | Expandable structural adhesive film for dissimilar metal bonding | |
JP2007523969A (ja) | エポキシ接着剤組成物、製造及び使用方法 | |
JP5294387B2 (ja) | 2液型硬化性組成物 | |
US20210363390A1 (en) | Pressure-sensitive structural adhesive film based on epoxy resin composition | |
US20230017420A1 (en) | Two-Part Curable Adhesive | |
US11485881B2 (en) | High temperature structural adhesive films |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 20130724 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
AMND | Amendment | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20161220 Comment text: Request for Examination of Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20171013 Patent event code: PE09021S01D |
|
AMND | Amendment | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20180419 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20181030 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20180419 Comment text: Notification of reason for refusal Patent event code: PE06011S01I Patent event date: 20171013 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
AMND | Amendment | ||
PX0901 | Re-examination |
Patent event code: PX09011S01I Patent event date: 20181030 Comment text: Decision to Refuse Application Patent event code: PX09012R01I Patent event date: 20171207 Comment text: Amendment to Specification, etc. Patent event code: PX09012R01I Patent event date: 20161220 Comment text: Amendment to Specification, etc. |
|
PX0701 | Decision of registration after re-examination |
Patent event date: 20181205 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20181130 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20181030 Comment text: Decision to Refuse Application Patent event code: PX07011S01I Patent event date: 20171207 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20161220 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I |
|
X701 | Decision to grant (after re-examination) | ||
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20190220 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20190220 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration |