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KR20130115862A - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
KR20130115862A
KR20130115862A KR1020120038592A KR20120038592A KR20130115862A KR 20130115862 A KR20130115862 A KR 20130115862A KR 1020120038592 A KR1020120038592 A KR 1020120038592A KR 20120038592 A KR20120038592 A KR 20120038592A KR 20130115862 A KR20130115862 A KR 20130115862A
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KR
South Korea
Prior art keywords
disposed
light source
heat sink
side plate
base plate
Prior art date
Application number
KR1020120038592A
Other languages
Korean (ko)
Inventor
홍승균
곽재오
민병국
박인수
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120038592A priority Critical patent/KR20130115862A/en
Publication of KR20130115862A publication Critical patent/KR20130115862A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

An embodiment relates to a lighting device.
Illumination apparatus according to the embodiment, the heat sink having one surface and the heat radiation fins; A light source unit including a substrate disposed on one surface of the heat sink and a light emitting device disposed on the substrate; And an optical unit including a base plate disposed on a light emitting element of the light source unit, and a side plate disposed on one surface of the heat sink and supporting the base plate, wherein the heat sink fins are disposed on one surface of the heat sink. It extends upwards and is disposed on the side plate of the optical unit, and the base plate and the side plate of the optical unit emit light from the light emitting element of the light source unit.

Description

LIGHTING DEVICE

An embodiment relates to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Therefore, much research has been conducted to replace conventional light sources with light emitting diodes. Light emitting diodes are increasingly used as light sources for various lamps used in indoor / outdoor, liquid crystal display devices, electric sign boards, streetlights, and the like .

The embodiment provides an illumination device capable of increasing the amount of light and the speed of light.

In addition, there is provided a lighting device that is easy to assemble.

Illumination apparatus according to the embodiment, the heat sink having one surface and the heat radiation fins; A light source unit including a substrate disposed on one surface of the heat sink and a light emitting device disposed on the substrate; And an optical unit including a base plate disposed on a light emitting element of the light source unit, and a side plate disposed on one surface of the heat sink and supporting the base plate, wherein the heat sink fins are disposed on one surface of the heat sink. It extends upwards and is disposed on the side plate of the optical unit, and the base plate and the side plate of the optical unit emit light from the light emitting element of the light source unit.

Illumination apparatus according to the embodiment, the light source; An optical unit disposed on the light source unit and including a base plate and a side plate on which light from the light source unit is emitted; A driving unit providing power to the light source unit; And a radiator including an upper end having the light source unit and a first accommodating unit accommodating the optical unit, wherein an upper end of the radiator decreases in diameter toward the top thereof, and the radiator penetrates the upper end. It has a vent for exposing the negative side plate to the outside.

Using the lighting apparatus according to the embodiment, there is an advantage that can increase the amount of light and luminous flux.

In addition, there is an advantage that the assembly is easy.

1 is a perspective view from above of a lighting device according to an embodiment;
2 is a perspective view from below of the lighting device shown in FIG. 1;
3 is an exploded perspective view of the illumination device shown in Fig.
4 is an exploded perspective view of the lighting apparatus shown in FIG. 2;
5 is a cross-sectional view showing a state in which the driving unit and the case shown in FIG.
6 is a perspective view showing a state in which the driving unit and the case shown in FIG.
7 is a perspective view of a lighting apparatus according to another embodiment.
8 is an exploded perspective view of the lighting apparatus shown in FIG.
9 is a front view of the heat sink shown in FIG. 8;
10 is a plan view of the lighting apparatus shown in FIG.
FIG. 11 is a bottom view of the lighting device shown in FIG. 7. FIG.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

In the description of embodiments according to the present invention, it is to be understood that where an element is described as being formed "on or under" another element, On or under includes both the two elements being directly in direct contact with each other or one or more other elements being indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, a lighting apparatus according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view from above of a lighting apparatus according to an embodiment, FIG. 2 is a perspective view from below of the lighting apparatus illustrated in FIG. 1, FIG. 3 is an exploded perspective view of the lighting apparatus illustrated in FIG. 1, and FIG. 4. Is an exploded perspective view of the lighting apparatus shown in FIG. 2.

1 to 4, the lighting apparatus according to the exemplary embodiment may include a heat sink 100, a light source unit 200 disposed on the heat sink 100, and an optical unit disposed on the light source unit 200. 300, a case 500 and a case 500 disposed on the heat sink 100 to receive the driving unit 400, which provides power to the light source unit 200, and to accommodate the driving unit 400 and to be coupled with the heat sink 100. It may include a socket 600 coupled to and connected to an external power source. Hereinafter, each component will be described in detail with reference to the accompanying drawings.

<Heat radiator 100>

1 to 4, the radiator 100 may form an exterior of a lighting apparatus according to an embodiment together with the optical unit 300, the case 500, and the socket 600. The heat sink 100 may include one surface 110, a heat radiation fin 130, and an accommodating part 150.

One surface 110 may be a flat surface as part of the surface of the heat sink 100. The light source unit 200 is disposed on the one surface 110. In detail, the one surface 110 may be in surface contact with the bottom surface of the substrate 210 of the light source unit 200. Through surface contact, heat from the substrate 210 of the light source unit 200 may be transferred to the heat sink 100. Here, the heat dissipation pad 290 may be disposed between the one surface 110 and the substrate 210 of the light source unit 200.

The heat radiation fins 130 may be disposed on the surface of the heat sink 100. The heat dissipation fins 130 may extend outward from the surface of the heat sink 100. The heat dissipation fins 130 may be arranged in plurality.

Each of the plurality of heat dissipation fins 130 may be spaced apart from an adjacent heat dissipation fin in a range of 7 (mm) or more and 10 (mm) or less. If the spacing is less than 7 (mm) there is a problem that the production of the heat radiation fins 130 is difficult, if the spacing is more than 10 (mm) there is a problem that the heat dissipation performance is not effective.

The heat dissipation fins 130 may improve the heat dissipation efficiency of the heat dissipator 100 by widening the area of the outer surface of the heat dissipator 100.

The accommodating part 150 may be a recess. In detail, the accommodating part 150 may be a recess recessed in the direction of one surface 110 on the surface of the heat sink 100. The accommodating part 150 may include a part of the driving part 400 and the case 500 accommodating the driving part 400.

The radiator 100 is coupled to the optical unit 300. Specifically, the coupling part 315 of the first hole h1 penetrating the one surface 110 and the accommodating part 150 of the heat sink 100 and the optical part 300 disposed on the first hole h1. And using a screw (Screw) the radiator 100 and the optical unit 300 may be combined. The screw is inserted through the first hole h1 in the accommodating part 150 and coupled to the hole formed in the coupling part 315 of the optical part 300, whereby the radiator 100 and the optical part 300 are Can be combined.

The radiator 100 may be formed of a metal material or a resin material having excellent heat dissipation efficiency, but is not limited thereto. For example, the material of the heat sink 100 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), tin (Sn), and magnesium (Mg). .

<Light source part 200>

1 to 4, the light source unit 200 is disposed on the heat sink 100. In detail, the light source unit 200 may be disposed on one surface 110 of the heat sink 100. In addition, the light source unit 200 may be disposed between the radiator 100 and the optical unit 300.

The light source unit 200 includes a light emitting device 230 for emitting predetermined light. In detail, the light source unit 200 may include a substrate 210, a light emitting device 230, a lens 250, a connector 270, and a heat radiating pad 290.

The substrate 210 is disposed on one surface 110 of the heat sink 100. In detail, the bottom surface of the substrate 210 may be in surface contact with one surface 110 of the heat sink 100.

The light emitting device 230, the lens 250, and the connector 270 are disposed on the top surface of the substrate 210. The substrate 210 has a circular plate shape, but is not limited thereto and may have various shapes. For example, it may be a polygonal plate shape. The substrate 210 may have a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and the like. It may include. In addition, it is possible to use a Chips On Board (COB) type that can directly bond the LED chip unpacked on the printed circuit board.

The substrate 210 may be formed of a material that reflects light efficiently, or the upper surface of the substrate 210 may be formed of a color that reflects light efficiently, for example, white, silver, or the like.

The light emitting devices 230 may be disposed in plurality on the top surface of the substrate 210. Here, the light emitting device 230 may be a device that emits light using characteristics of the semiconductor material. As a specific example, the light emitting device 230 may be a light emitting diode (LED).

The light emitting device 230 may be a red, green, blue, or white light emitting diode that emits red, green, blue, or white light, respectively, but is not limited thereto. Here, the light emitting diode may be a horizontal type or a vertical type.

The light emitting device 230 may have a phosphor. The phosphor may include at least one of yellow, red, and green phosphors when the light emitting device 230 is a blue light emitting diode. Specifically, the phosphor may include at least one of a Garnet-based (YAG, TAG), a silicate (Silicate), a nitride (Nitride) and an oxynitride (oxyxyride) system.

The lens 250 is disposed on the light emitting element 230. The lens 250 may collect or diffuse the light emitted from the light emitting element 230. The lens 250 may be combined with the light emitting device 230 in a one-to-one manner. The number of lenses 250 and the number of light emitting elements 230 may be the same.

The lens 250 may have a light emitting surface, and the light emitting surface may contact the bottom surface of the base plate 310 of the optical unit 300. Therefore, the lens 250 may play a role of supporting the optical unit 300 on the light source unit 200.

The lens 250 may have a phosphor. The phosphor may be excited by light emitted from the light emitting element 230 to emit excitation light. The phosphor may comprise at least one or more of yellow, red and green phosphors. Specifically, the phosphor may include at least one of a Garnet-based (YAG, TAG), a silicate (Silicate), a nitride (Nitride) and an oxynitride (oxyxyride) system.

The connector 270 may be disposed to penetrate the substrate 210. In detail, the connector 270 penetrates through the first hole 211 of the substrate 210 and penetrates through the second hole h2 of the heat sink 100 to be coupled to the connection part 430 of the driving unit 400. . The connector 270 is electrically connected to the substrate 210 and is electrically connected to the driver 400. Thus, the connector 270 transfers the power from the driver 400 to the substrate 210. The connector 270 eliminates the need for a wire connecting the driving unit 400 and the light source unit 200. Therefore, a poor contact between the electric wire and the driving unit 400 and the electric wire and the light source unit 200 can not occur, there is an advantage in the speed and ease of fabrication and assembly.

The heat dissipation pad 290 may be disposed between the bottom surface of the substrate 210 and the one surface 110 of the heat sink 100. The heat radiation pad 290 may be a thermally conductive silicone pad or a thermally conductive tape having excellent thermal conductivity. The heat dissipation pad 290 may transfer heat generated from the substrate 210 to the heat sink 100 quickly and effectively.

<Optical Edition 300>

1 to 4, the optical plate 300 is disposed on the light source unit 200 and coupled to the heat sink 100.

The optical plate 300 passes the light emitted from the light emitting element 230 of the light source unit 200 to the outside. The optical plate 300 may include a base plate 310 and a side plate 330. Light is emitted to the outside through the base plate 310 and the side plate 330.

The base plate 310 may have a disc shape. Here, the shape of the base plate 310 is not limited to the original plate. The shape of the base plate 310 may be a plate, some or all of which has a predetermined curvature.

The base plate 310 is disposed spaced apart from the substrate 210 of the light source unit 200 by a predetermined interval. Here, the base plate 310 and the substrate 210 may be disposed in parallel.

The base plate 310 may be supported by the side plate 330 and disposed on the substrate 210. The base plate 310 may be supported by the lens 250 of the light source unit 200 and disposed on the substrate 210. In addition, the base plate 310 may be supported by the side plate 330 and the lens 250 and disposed on the substrate 210.

The base plate 310 may include a coupling portion 315. The coupling part 315 may protrude from the lower surface of the base plate 310 toward the light source part 200.

The side plate 330 may be disposed between the base plate 310 and one surface 110 of the heat sink 100. In addition, the side plate 330 may extend from the outer circumference of the base plate 310. An angle between the side plate 330 and the base plate 310 may be 0 degrees or more and 180 degrees or less.

The side plate 330 may support the base plate 310 on the light source unit 200. In detail, the side plate 330 may support the base plate 310 to be spaced apart from the substrate 210 of the light source unit 200 by a predetermined interval.

The side plate 330 is disposed on one surface 110 of the heat sink 100. That is, the side plate 330 is not embedded in the heat sink 100, and is disposed on the heat sink 100. When the side plate 330 is disposed on one surface 110 of the heat sink 100, the total amount of light emitted from the lighting apparatus according to the embodiment is emitted from the base plate 310 and the side plate 330. It is the sum of the amounts of light. Therefore, the lighting apparatus according to the embodiment has an advantage of emitting more light than the lighting apparatus having only the base plate 310. Since the amount of light is increased, the effect of improving the luminous flux can also be obtained.

The optical plate 300 may be made of glass. However, since glass has a weak problem in weight or external impact, the optical plate 300 may be plastic, polypropylene (PP), polyethylene (PE), or the like. Preferably, it may be a light diffusion polycarbonate (PC) having good light resistance, heat resistance, and impact strength characteristics.

 <Driver 400>

5 is a cross-sectional view illustrating a state in which the driving unit and the case illustrated in FIG. 3 are coupled, and FIG. 6 is a perspective view illustrating a state in which the driving unit and the case illustrated in FIG. 3 are coupled.

1 to 6, the driving unit 400 receives power from the outside and converts the received power to match the light source unit 200. Then, the converted power is supplied to the light source unit 200.

The driving part 400 is disposed inside the accommodating part 150 of the heat sink 100. In detail, the driver 400 may be accommodated in the case 500 to be housed in the accommodating part 150 of the radiator 100 to prevent electrical contact with the radiator 100.

The driving unit 400 may include a circuit board 410, a connecting unit 430, and a coupling unit 450.

The circuit board 510 has a circular plate shape, but is not limited thereto and may have various shapes. For example, it may be an oval or polygonal plate shape. The circuit board 510 may be a circuit pattern printed on the insulator.

The circuit board 510 is disposed inside the case 500. In detail, the circuit board 510 may be inserted into the insertion part 510 of the case 500, and may be coupled to the case 500 by the coupling part 450.

The connection part 430 may extend or protrude outward from one side of the circuit board 410. The connection part 430 may be integrated with the circuit board 410. The connection part 430 may have a printed circuit pattern electrically connected to the printed circuit pattern of the circuit board 410.

The connection unit 430 is coupled to the connector 270 of the light source unit 200 to transfer power from the driving unit 400 to the light source unit 200. In detail, the connection part 430 may be fitted into a groove of the connector 270 inserted into the second hole h2 of the heat sink 100. Since the driving unit 400 and the light source unit 200 are electrically connected without a separate wire, there is an advantage that a problem caused by the wire may not occur.

The coupling part 450 may extend or protrude to the outside from the other side of the circuit board 410. Coupler 450 may be two or more, as shown in the figure. The coupling part 450 may be integrated with the circuit board 410.

The coupling part 450 may fix the driving part 400 to the case 500. In detail, the coupling part 450 may be inserted into the coupling groove 515 of the insertion part 510 of the case 500, thereby fixing the circuit board 410 to the inside of the case 500.

Here, the coupling of the coupling portion 450 and the coupling groove 515 may be possible by the following process. When the inserting portion 510 of the case 500 is made of a flexible plastic material, the driving unit 400 is accommodated in the inserting portion 510, and a predetermined pressure is applied to the inserting portion 510 from the outside. The shape of the part 510 is modified. Here, the pressure acting on the insertion part 510 is a lateral pressure, the size of which is such that the insertion part 510 is not damaged, and the direction may be in both directions of the circuit board 410. In a state where the shape of the insertion part 510 is deformed, the coupling part 450 of the driving part 400 is inserted into the coupling groove 515 of the insertion part 510. Finally, the predetermined pressure applied to the insertion part 510 is removed. Through this process, the coupling part 450 may be fitted into the coupling groove 515, and through this, the driving part 400 and the case 500 may be coupled to each other.

The driver 400 may include a plurality of components (not shown) mounted on the circuit board 410. For example, the plurality of components may include, for example, a DC converter for converting an AC power provided from an external power source into a DC power source, a driving chip for controlling driving of the light source unit 200, and an ESD (ElectroStatic Discharge) to protect the light source unit 200. It may include a protection element.

<Case 500>

1 to 6, the case 500 may be coupled to the radiator 100 and may accommodate the driving unit 400 therein. The case 500 may be made of an insulating material for electrical insulation between the radiator 100 and the driving unit 400. For example, the case 500 may be made of plastic or the like.

The case 500 may include an inserting portion 510, a connecting portion 530, and a locking portion 550.

The insertion part 510 is inserted into the accommodating part 150 of the heat sink 100. The insertion unit 510 accommodates the driving unit 400 therein. To this end, the inserting portion 510 may have a hollow cylindrical shape.

Insertion portion 510 may have a coupling groove 515, for coupling with the driving unit 400, may have a predetermined ductility.

The connection part 530 may extend to one side from the insertion part 510. The connection part 530 is coupled to the socket 600. Here, the connection part 530 may have a screw groove structure corresponding to the screw thread structure of the socket 600.

The locking part 550 may be disposed on an outer surface of the insertion part 510. Specifically, the locking portion 550 may extend outward from the outer surface of the insertion portion 510. The locking part 550 prevents the insertion part 510 from falling out of the accommodation part 150 after the insertion part 510 is accommodated in the accommodation part 150 of the heat sink 100. To this end, a locking jaw (not shown) into which the locking portion 550 is inserted may be disposed on an outer wall of the accommodating portion 150 of the heat sink 100.

7 is a perspective view of a lighting apparatus according to another embodiment, FIG. 8 is an exploded perspective view of the lighting apparatus illustrated in FIG. 7, FIG. 9 is a front view of the heat sink illustrated in FIG. 8, and FIG. 10 is illustrated in FIG. 7. Is a plan view of the lighting device, and FIG. 11 is a bottom view of the lighting device shown in FIG.

The lighting apparatus according to another embodiment illustrated in FIGS. 7 to 11 differs only in the heat sink 100 ′ when compared with the lighting apparatus according to the exemplary embodiment illustrated in FIGS. 1 to 6. Therefore, other components of the lighting apparatus according to another embodiment are the same as the lighting apparatus according to the embodiment, the detailed description will be replaced by the above description.

7 to 11, the heat dissipator 100 ′ of the lighting apparatus according to another embodiment may further include additional heat dissipation fins 170 at the heat dissipator 100 of the lighting apparatus illustrated in FIGS. 1 to 6. can do. Hereinafter, for convenience of description, reference numeral 130 is defined as a first heat radiation fin and reference numeral 170 is defined as a second heat radiation fin.

The second heat dissipation fins 170 may extend from the surface of the heat dissipation element 100, and may specifically extend upward from one surface 110 of the heat dissipation element 100. The second heat dissipation fins 170 are disposed on the side plate 330 of the optical unit 300. The height of the second heat dissipation fin 170 may be equal to or smaller than the height of the side plate 330 of the optical plate 300. The second heat dissipation fins 170 are disposed on a part of the side plate 330 of the optical unit 300, but not all of them.

The second heat dissipation fins 170 may be plural in number. The plurality of second heat dissipation fins 170 are disposed to surround the side plate 330. Accordingly, the side plate 330 is partially exposed to the outside by the plurality of second heat dissipation fins 170.

Each of the plurality of second heat dissipation fins 170 may be spaced apart from an adjacent heat dissipation fin in a range of 7 (mm) or more and 10 (mm) or less. If the spacing is less than 7 (mm) there is a problem that the production of the second heat dissipation fins 170 is difficult, if the spacing is more than 10 (mm) there is a problem that the heat dissipation performance is not effective.

The second heat dissipation fin 170 may serve to protect not only the side plate 330 of the optical unit 300, but also the optical unit 300 from external impact.

Meanwhile, the heat sink 100 ′ of the lighting apparatus according to another embodiment may have a vent 190. The vent 190 is a hole penetrating the heat sink 100.

The heat sink 100 ′ may include an upper end 160 and a lower end 180 as shown in FIG. 9.

The upper end 160 may include one surface 110 and a second heat dissipation fin 170, and may have a first accommodating part 140. The light source unit 200 and the optical unit 300 are disposed in the first accommodating unit 140 of the upper end 160.

The lower portion 180 may include a first heat dissipation fin 130 and may have a second accommodating portion 150. The driving unit 400 and the case 500 are disposed in the second accommodating part 150 of the lower end 180.

The upper end 160 may have a shape in which the diameter decreases as it goes upward, and the lower end 180 may have a shape in which the diameter decreases as it goes downward.

The vent 190 may be a hole penetrating the lower end 180 at the upper end 160 or the upper end 160 at the lower end 180 as shown in FIGS. 10 to 11. The vent 190 is formed adjacent to the first accommodating part 140 and the second accommodating part 150, and is formed in the second accommodating part 150 or the second accommodating part 150 in the first accommodating part 140. It may be formed in the direction of the first accommodating part 140. The vent 190 penetrating the upper end 160 exposes the side plate 330 of the optical unit 300 to the outside.

The vent 190 may be formed in plurality. The plurality of vents 190 may be formed to be spaced apart by the thicknesses of the first and second heat dissipation fins 130 and 170.

Through the vent 190, the surface area of the radiator 100 is widened, and a passage through which air can move is created, which is advantageous for heat dissipation.

First and second heat dissipation fins 130 and 170 may be formed by the upper end 160, the lower end 180, and the vent 190. Specifically, the upper end portion 160 has a diameter that decreases as it goes upward, and the lower end portion 180 has a shape whose diameter decreases as it goes downward. When the above-described vent 190 is formed at the upper end 160 and the lower end 180, the side plate 330 of the optical unit 300 is exposed to the outside by the vent 190, and the first and the above-described first and second 2 heat radiation fins 130 and 170 may be formed.

Although the above description has been made with reference to the embodiments, these are only examples and are not intended to limit the present invention, and those of ordinary skill in the art to which the present invention pertains should not be exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: radiator
200: light source
300: optics
400:
500: case
600: socket

Claims (10)

A heat sink having one surface and a heat radiation fin;
A light source unit including a substrate disposed on one surface of the heat sink and a light emitting device disposed on the substrate;
And an optical unit including a base plate disposed on the light emitting element of the light source unit, and a side plate disposed on one surface of the heat sink and supporting the base plate.
The heat dissipation fins extend upward from one surface of the heat dissipator and are disposed on the side plate of the optical unit,
The base plate and the side plate of the said optical part emit light from the light emitting element of the said light source part.
The method of claim 1,
The heat dissipation fin is a plurality,
Each of the plurality of heat dissipation fins is spaced apart from an adjacent heat dissipation fin in a range of 7 (mm) or more and 10 (mm) or less.
The method of claim 1,
And a height of the heat dissipation fin is less than or equal to a height of the side plate of the optical unit.
A light source;
An optical unit disposed on the light source unit and including a base plate and a side plate on which light from the light source unit is emitted;
A driving unit providing power to the light source unit; And
And a radiator including an upper end having the light source unit and the first accommodation unit accommodating the optical unit.
The upper end of the heat sink is reduced in diameter as it goes up,
And the radiator penetrates the upper end portion and has a vent for exposing the side plate of the optical portion to the outside.
5. The method of claim 4,
The heat sink further includes a lower end portion disposed below the upper end portion and having a second accommodation portion in which the driving portion is accommodated.
The lower portion decreases in diameter as it goes down,
The vent is through the lower end of the lighting device.
5. The method of claim 4,
The vent is plural,
And each of the plurality of vents are spaced apart by a predetermined interval.
5. The method of claim 4,
The upper end of the heat sink has one surface,
The light source unit includes a substrate disposed on the one surface and a light emitting element disposed on the substrate,
8. The method of claim 1 or 7,
The side plate of the optical unit, the illumination device extends from the edge of the base plate of the optical unit in one surface direction of the heat sink.
8. The method of claim 1 or 7,
The base plate of the optical portion is disposed parallel to the substrate of the light source portion,
And the side plate is disposed between the base plate and the substrate.
8. The method of claim 1 or 7,
The light source unit further includes a lens disposed on the light emitting element,
And the lens supports the base plate of the optical unit.
KR1020120038592A 2012-04-13 2012-04-13 Lighting device KR20130115862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120038592A KR20130115862A (en) 2012-04-13 2012-04-13 Lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120038592A KR20130115862A (en) 2012-04-13 2012-04-13 Lighting device

Publications (1)

Publication Number Publication Date
KR20130115862A true KR20130115862A (en) 2013-10-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120038592A KR20130115862A (en) 2012-04-13 2012-04-13 Lighting device

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