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KR20130084506A - Light emitting device package and manufacturing method of the same - Google Patents

Light emitting device package and manufacturing method of the same Download PDF

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Publication number
KR20130084506A
KR20130084506A KR1020120005333A KR20120005333A KR20130084506A KR 20130084506 A KR20130084506 A KR 20130084506A KR 1020120005333 A KR1020120005333 A KR 1020120005333A KR 20120005333 A KR20120005333 A KR 20120005333A KR 20130084506 A KR20130084506 A KR 20130084506A
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
wavelength conversion
wavelength
device package
Prior art date
Application number
KR1020120005333A
Other languages
Korean (ko)
Inventor
이동훈
최선열
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020120005333A priority Critical patent/KR20130084506A/en
Publication of KR20130084506A publication Critical patent/KR20130084506A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to correct color properties to a desired value by attaching a film type wavelength conversion part. CONSTITUTION: A light emitting device package main body (13) includes a light emitting device chip (10). A molded type wavelength conversion part (20) covers the light emitting chip and contains first wavelength conversion materials converting the wavelength of the light emitted from the light emitting chip. A film type wavelength conversion part (30) is attached on the molded type wavelength conversion part. The film type wavelength conversion part converts the wavelength of the light emitted from one of the light emitting device chip and the molded type wavelength conversion part.

Description

Light Emitting Device Package and Manufacturing Method of The Same

The present invention relates to a light emitting device package and a method of manufacturing the same.

A light emitting diode (LED), which is a kind of semiconductor light emitting device, is a semiconductor device capable of generating light of various colors based on recombination of electrons and holes at junctions of p and n type semiconductors when a current is applied thereto. Such semiconductor light emitting devices have a number of advantages, such as long lifespan, low power supply, excellent initial driving characteristics, high vibration resistance, etc., compared to filament based light emitting devices.

Such light emitting diodes (LEDs) can realize various colors of light by changing compound semiconductor materials such as GaAs, AlGaAs, GaN, InGaInP, and red light, blue light, green light, ultraviolet light depending on the composition. Each can emit light. Various mixed colors can be realized by appropriately mixing red, blue, and green light, and typically, white light emitting devices can be widely applied to BLU (backlight unit) of display, automobile and lighting, and the demand will increase rapidly. It is expected.

A common method of implementing white light includes a method in which a phosphor is disposed in a light emitting device package to mix a light emitting color of a light emitting device chip with a light emitting color whose wavelength is changed by the phosphor.

Typically, a part of the blue light emitted from the blue light emitting device chip that emits blue light is converted into red and green light by excitation of red and green phosphors, respectively, and mixed with blue light to realize white light.

However, the mixed light of the light emitting device package as described above is affected by the amount of the wavelength conversion material included in the molded wavelength conversion part, and the wavelength conversion material has a random distribution on the molded wavelength conversion part. In mass production of packages, there is a problem in that the color characteristics of each light emitting device package are different.

Such dispersion of color characteristics between light emitting device packages is a cause of quality deterioration in applications such as BLU (Backlight Unit), traffic lights, lighting, etc. using a plurality of light emitting device packages. This problem may be solved through the conventional color mixing technique. However, when the color mixing technique cannot be applied according to the use of the light emitting device package, a specific color characteristic of the mass-produced light emitting device package may not be applied. Since only the light emitting device package shown and used must be selected, it is a factor which reduces the manufacturing yield of a light emitting device package.

The present invention has been proposed to solve the above problems, and one of the objects of the present invention is to provide a light emitting device package of which color characteristics are adjusted.

Another object of the present invention is to provide a method of manufacturing a light emitting device package in which the color characteristics are adjusted.

However, the object of the present invention is not limited thereto, and even if not explicitly stated, the object or effect which can be grasped from the solution means or the embodiment of the problem described below will be included in this.

In order to solve the above problems, an embodiment of the present invention, the light emitting device package body is mounted a light emitting device chip, and the light emitting device chip covering the light emitting device to convert the wavelength of the light emitted from the chip A second wavelength converting material attached to the molded wavelength converting part having a first wavelength converting material and the molded wavelength converting part, and converting a wavelength of light emitted from at least one of the light emitting element and the molded wavelength converting part; It provides a light emitting device package comprising a film-type wavelength conversion unit having a.

In one embodiment of the present invention, the film-type wavelength conversion portion may be stacked on at least two or more on the molded wavelength conversion portion.

Here, the two or more laminated film type wavelength conversion parts may contain different second wavelength conversion materials.

In one embodiment of the present invention, the second wavelength conversion material may be the same material as the first wavelength conversion material.

In one embodiment of the present invention, the second wavelength conversion material may include any one of a red phosphor, a green phosphor, and a yellow phosphor.

In one embodiment of the present invention, the second wavelength conversion material may include at least two or more of red phosphor, green phosphor, yellow phosphor.

In one embodiment of the present invention, the first wavelength conversion material may include at least one or more of a red phosphor, a green phosphor, a yellow phosphor.

On the other hand, another aspect of the present invention,

Providing a package body in which a light emitting device chip is mounted to form a molded wavelength conversion unit covering the light emitting device chip and having a first wavelength converting material for converting a wavelength of light emitted from the light emitting device chip; Measuring the color characteristics of the light emitted from the device and the molded wavelength conversion part and the light emitting device and the molding on the molded wavelength conversion part so as to correct a deviation between the measured color characteristic and the target color characteristic. It provides a method of manufacturing a light emitting device package comprising the step of attaching at least one film-type wavelength conversion portion containing a second wavelength conversion material for converting the wavelength of light emitted from at least one of the wavelength conversion portion.

In one embodiment of the present invention, the film type wavelength conversion unit is at least two or more, the step of attaching the at least one film type wavelength conversion unit may be a step of attaching at least two film type wavelength conversion unit.

In one embodiment of the present invention, the second wavelength conversion material may include any one of a red phosphor, a green phosphor, and a yellow phosphor.

In one embodiment of the present invention, the second wavelength conversion material may include at least two or more of red phosphor, green phosphor, yellow phosphor.

In one embodiment of the present invention, the first wavelength conversion material may be at least one of a red phosphor, a green phosphor, a yellow phosphor.

In one embodiment of the present invention, the color characteristic may mean a color coordinate.

In this case, the CIE color coordinates of the light emitting device before the film-type wavelength conversion unit is attached are (x, y) to (x, y) to (x-0.03, y-0.03) compared to the target CIE color coordinates (x, y). It may be contained in the molded wavelength conversion unit.

In one embodiment of the present invention, the film-type wavelength conversion portion may be cured through a curing process after being attached on the molded wavelength conversion portion in a semi-cured state.

According to one embodiment of the present invention, a light emitting device package in which color characteristics are adjusted can be obtained.

According to one embodiment of the present invention, a method of efficiently manufacturing a light emitting device package in which color characteristics are adjusted can be obtained.

1 is a cross-sectional view of a light emitting device package according to an embodiment of the present invention.
2 is a cross-sectional view of a light emitting device package according to another embodiment of the present invention.
3 to 5 are cross-sectional views schematically illustrating a method of manufacturing a light emitting device package.
6 is a graph illustrating a CIE 1931 color coordinate system.
7 and 8 illustrate cross-sectional views of film-type wavelength converting portions and color coordinate shift level graphs of respective film-type wavelength converting portions according to another embodiment of the present invention.
9 and 10 are cross-sectional views of a CIE 1931 color coordinate system and a light emitting device package according to an embodiment of the present invention.
11 to 13 are cross-sectional views and graphs for illustrating a concept in which an embodiment of the present invention is applied to a mass production process.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

The embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. It is to be understood that both the foregoing general description and the following detailed description are exemplary, explanatory and are intended to provide further explanation of the invention, and are not intended to be exhaustive or to limit the invention to the precise forms disclosed. . Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 is a cross-sectional view of a light emitting device package 100 according to an embodiment of the present invention.

Referring to FIG. 1, a light emitting device package 100 according to an exemplary embodiment of the present invention may include a light emitting device chip 10, lead frames 12a and 12b electrically connected to the light emitting device chip 10, and the light emission. A package body 13 having a cavity open to expose the device chip 10 and the lead frames 12a and 12b, and the first wavelength conversion material 21 and 22 covering the light emitting device chip 10. Light attached to the molded wavelength conversion unit 20 and the molded wavelength conversion unit 20 containing a light emitted from at least one of the light emitting device chip 10 and the molded wavelength conversion unit 20. It may be configured to include a film-type wavelength conversion section 30 containing a second wavelength conversion material 31 for converting the wavelength of the following (first mixed light).

The light emitting device chip 10 may include a light emitting diode, which is a kind of semiconductor device that emits light having a predetermined wavelength by a power source applied from the outside. .

The lead frames 12a and 12b may be provided in plurality, such as the first and second lead frames 12a and 12b, and may be spaced apart from each other to be electrically separated. The light emitting device chip 10 is mounted on one side of the lead frames 12a and 12b, for example, the second lead frame 12b, and is electrically connected to the first lead frame 12a through the bonding wire 11. Can be connected. In addition, although not shown in the drawings, it may be connected by a flip chip bonding method through solder, etc. In this case, there is an advantage in that the light efficiency is improved.

The lead frames 12a and 12b are preferably exposed to the outside through the lower surface of the package body 13 as shown in the drawing. Therefore, heat generated in the light emitting device chip 10 mounted on the lead frames 12a and 12b can be directly discharged to the outside through the lead frames 12a and 12b.

The package body 13 may have an open cavity on an upper surface thereof to expose the light emitting device chip 10 and the lead frames 12a and 12b, and to support and fix the lead frames 12a and 12b. have.

The package body 13 is preferably formed of a resin having a high opacity or high reflectance and using a polymer resin that is easy to inject. However, the present invention is not limited thereto and may be molded from various other resin materials. That is, it can be formed of a non-conductive material such as ceramic, and in this case, there is an advantage that heat dissipation is easy.

The light emitting device chip 10 may be covered by the molding wavelength converter 20. The molded wavelength converting part 20 may include the first wavelength converting materials 21 and 22 and may also function as an encapsulant for protecting the light emitting device chip 10 from external impact and contaminants.

The molded wavelength conversion part 20 may be formed of a resin layer such as silicon or epoxy, and the first wavelength conversion material 21 or 22 may be formed of a light emitting device chip 10 such as a phosphor or a quantum dot. At least one wavelength conversion material capable of converting the wavelength light emitted from the other wavelength light. For example, the first wavelength converting materials 21 and 22 may be a yellow phosphor alone, a combination of red and green phosphors, or a combination of red, green and yellow phosphors.

Through the wavelength conversion process, the light emitting device package 100 may implement the first mixed light.

However, since the first wavelength converting materials 21 and 22 contained in the molded wavelength converting part 20 are generally randomly distributed in the molded wavelength converting part 20, the light emitting device package 100 may be formed in a large amount. When produced, each light emitting device package 100 exhibits a difference in color characteristics. For example, in a large number of manufactured white light emitting diode packages, some product families exhibit color characteristics that do not meet the target.

In this case, the film type wavelength converting part 30 containing the second wavelength converting material 31 may be attached on the molded wavelength converting part 20 as in the present embodiment for adjusting color characteristics. The film type wavelength converting part 30 may be attached onto the molding type wavelength converting part 20 in a semi-cured resin state, and may be cured through a heat treatment process after attachment.

The film type wavelength converting part 30 may be made of a light transmitting resin, and the second wavelength converting material 31 may be uniformly dispersed in the film type wavelength converting part 30.

The second wavelength converting material 31 is a known wavelength converting material selected to correct the color characteristic of the light emitting device package 100 to a target color characteristic condition, and may be a phosphor or a quantum dot. In addition, the second wavelength converting material 31 may be the same material as the first wavelength converting materials 21 and 22, and may be manufactured to have the same compounding ratio.

The second wavelength converting material 31 may be made of only a phosphor for converting a wavelength into one color light, but may be made of at least two of, for example, yellow, red, and green phosphors as necessary.

2 illustrates a light emitting device package 100 according to another embodiment of the present invention.

As shown, the film-type wavelength conversion unit 30A, 30B, 30C may be attached to two or more laminated on the molding wavelength conversion unit 20, in this case, each film-type wavelength conversion unit (30A, 30B) 30C may contain different second wavelength converting materials 31, 32, and 33. That is, the film-type wavelength conversion portion containing only the yellow phosphor, the film-type wavelength conversion portion containing only the red phosphor, the film-type wavelength conversion portion containing the green phosphor and the red phosphor may be three kinds.

The film type wavelength conversion units 30A, 30B, and 30C as described above are attached to shift the color characteristics of the first mixed light. Accordingly, the final output light of the light emitting device package 100 is corrected to have a target color characteristic. Can be.

According to the present embodiment, the light emission is corrected to a desired target color characteristic range without a separate correction process such as dispensing of additional phosphors only by attaching the film type wavelength converting portion 30 on the molded wavelength converting portion 20. The device package 100 is provided, and the film type wavelength conversion unit 30 is attached to the molding type wavelength conversion unit 20 in a semi-cured state, so that unlike the curable wavelength correction means such as a lens, the light emitting device package 100 This has the advantage that it does not have a big influence on the increase in the overall volume.

In addition, unlike a curable wavelength correction means such as a lens, it is easy to superimpose a plurality, so that when the concentration of the second wavelength conversion material 31 contained in the film type wavelength conversion unit 30 is set low, fine correction is possible. At the same time, when a large number of corrections are required, the film-type wavelength conversion unit 30 can be corrected by overlapping a plurality of the film-type wavelength conversion units 30, thereby allowing a simpler and more detailed correction than the curable wavelength correction means such as a lens.

Hereinafter, a method of manufacturing the light emitting device package 100 according to the embodiment of the present invention will be described.

3 to 5 are cross-sectional views schematically illustrating a method of manufacturing a light emitting device package 100 according to an embodiment of the present invention.

First, the manufacturing method starts from the step of forming the molded wavelength conversion unit 20 containing the first wavelength conversion materials 21 and 22 in the light emitting device package 100 (FIG. 3).

The light emitting device package 100 may have a light emitting device chip 10 mounted thereon, and the molded wavelength conversion unit 20 may be introduced from the dispenser 51 to cover the light emitting device chip 10.

The light emitting device chip 10 includes a light emitting diode, which is a kind of semiconductor device that emits light having a predetermined wavelength by a power source applied from the outside, and may be provided singly as shown in the drawing, or may be provided in plurality. have.

The molded wavelength converting part 20 may include the first wavelength converting materials 21 and 22 and may serve as a so-called encapsulant that protects the light emitting device chip 10 from external impact and contaminants. .

The molded wavelength conversion unit 20 may be formed of a resin layer such as silicon or epoxy as a light transmitting resin layer.

The first wavelength converting materials 21 and 22 may be at least one wavelength converting material capable of converting the wavelength light emitted from the light emitting device chip into another wavelength light such as a phosphor or a quantum dot. For example, the wavelength converting material may be a yellow phosphor alone, a combination of red and green phosphors, or a combination of red, green and yellow phosphors.

As a next step, the color characteristics of the light (first mixed light 40) emitted from the light emitting device chip 10 and the molded wavelength conversion part 20 are measured (FIG. 4).

The first mixed light 40 may be emitted by driving the light emitting device package 100 by applying a voltage. The color characteristics of the first mixed light 40 may be measured by a color characteristic measuring device ( 52).

The color characteristic measured in this step may be at least one of color coordinates and color temperature. In the case of color coordinates, the color coordinates may be measured based on the CIE 1931 color coordinate system.

Although the color characteristics of the first mixed light 40 are provided by suitably blended first wavelength converting materials 21 and 22, the errors in the blending process and the randomness of the first wavelength converting materials 21 and 22 are nevertheless. Due to one distribution or the like, target color characteristics and deviations can be indicated.

For example, as shown in FIG. 6, although the target color coordinate is point T, the color coordinate of the first mixed light 40 may be located at the point M. FIG. In this case, the light emitting device package 100 needs to be corrected to a target color coordinate.

As a next step, the deviation may be corrected by attaching at least one film-type wavelength conversion portion 30 containing the second wavelength conversion material 31 on the molded wavelength conversion portion 20 ( 5).

The film type wavelength conversion part 30 may be made of a light-transmissive resin, and is attached to the molding type wavelength conversion part 20 in a semi-cured state 30 'and then cured through a curing process such as heat treatment. 5 (a), 5 (b))

As a result, the light emitting device package 100 as illustrated in FIG. 1 is manufactured, and the light emitting device package 100 may emit light corrected to a target color characteristic value.

The second wavelength converting material 31 is a known wavelength converting material selected to correct the color characteristic of the first mixed light 40 to a target color characteristic, and may be a phosphor or a quantum dot. In addition, the second wavelength converting material 31 may be the same material as the first wavelength converting materials 21 and 22, and may be manufactured to have the same compounding ratio.

In addition, the film type wavelength conversion unit 30 may be at least two or more kinds. For example, a film type wavelength converting portion containing only a yellow phosphor, a film type wavelength converting portion containing a green phosphor and a red phosphor at the same time, a film type wavelength converting portion containing only a red phosphor, and the following three types of film type wavelengths The converter may be ready.

7 and 8 briefly illustrate color coordinate shift levels for each of the film type wavelength converting parts 30A, 30B, and 30C and the film type wavelength converting parts.

The kind and the number of the film type wavelength conversion parts 30A, 30B, and 30C employed in the present embodiment can be appropriately selected according to the deviation of the measured color characteristic and the target color characteristic.

Hereinafter, an embodiment of implementing the color characteristic correction by providing the film type wavelength conversion unit 30 in the light emitting device package 100 will be described in more detail.

First, a molding wavelength converting part 20 having first wavelength converting materials 21 and 22 is formed on the light emitting device package body 13, and then the first mixed light 40 of the light emitting device package 100 is formed. Measure the color characteristics.

Fig. 9 is a CIE 1931 color coordinate system showing the result of measuring the color coordinate (M point) and the target color coordinate (T point). Although the first wavelength converting materials 21 and 22 are properly formulated to have a target color coordinate (T point), they may exhibit deviations as shown in FIG. 9.

In this case, an appropriate film type wavelength converting portion 30 is attached based on the color coordinate shift level of the film type wavelength converting portions 30A, 30B, and 30C disclosed in FIG. 8 to correct the deviation. That is, one type A film type wavelength conversion unit 30A having a color coordinate shift level of 0.01 in the positive x-axis direction to correct the 0.01-axis deviation, and the y-axis positive direction to correct the 0.0-axis 0.02 deviation In this case, two C-type film-type wavelength conversion units 30C having a color coordinate shift level of 0.01 are superimposed and attached on the molded wavelength conversion unit 20.

The cross-sectional view of the light emitting device package 100 completed according to this step is as shown in FIG. 10, and the light emitting device package indicating a target color coordinate (point T) is manufactured by completing this step.

Hereinafter, a preferred embodiment in the case where the present invention is applied to mass production of the light emitting device package 100 will be described.

11 and 12 are cross-sectional views and CIE color coordinate systems for explaining the concept that one embodiment of the present invention is applied to a mass production process.

First, the light emitting device chip 10 is mounted, and the light emitting device package 100 including the molded wavelength converting part 20 containing the first wavelength converting materials 21 and 22 is manufactured in large quantities. (Figure 11)

Here, in order to facilitate the process of correcting the target color coordinates using the film type wavelength conversion unit 30, the color coordinates of the first mixed light 40 may be the target color coordinates ( x, y) intentionally to be located within (x, y) to (x-0.03, y-0.03) at the bottom left, preferably according to the distribution level of the first mixed light 40 of the light emitting device packages 100. Can be combined.

For example, FIG. 12 is a result of measuring color characteristics of the first mixed light 40 of the light emitting device package 100 produced in large quantities according to the steps of the manufacturing method. Here, as illustrated, the first wavelength converting materials 21 and 22 are intentionally blended to represent the color coordinates of the lower left end (point a) rather than the target color coordinate (point T). Accordingly, the color coordinates of the first mixed light 40 of the plurality of light emitting device packages 100 that are produced in a large quantity represent a form dispersed based on a point a.

As such, when the color coordinates of the first mixed light 40 of the light emitting device packages 100 produced in a large amount are dispersed and displayed based on the point a as described above than when the color coordinates of the first mixed light 40 are dispersed and displayed based on the target color coordinate (point T), The selection and application of the film type wavelength conversion part 30 to be attached in order to correct to the target color coordinate value (point T) can be made easier.

Next, the film type wavelength conversion unit 30 is attached to correct the color coordinates of the light emitting device package 100 to the target color coordinates. Here, based on the deviation between the measured color coordinates and the target color coordinates, the plurality of light emitting device packages 100 may be classified into several groups according to the number of the film type wavelength conversion units 30 to be attached.

FIG. 13 is classified into each i) group, ii) group, and iii) group according to the number (eg, three, two, and one) of the film type wavelength conversion unit 30 that needs to be attached for color coordinate correction. Represents the CIE color coordinate system.

The light emitting device package 100 belonging to each classification group is attached as many as the number of the film type wavelength conversion unit 30 according to each classification group, and the color coordinates of the light emitting device packages 100 produced in large quantities are corrected to have a target color coordinate. do.

According to the present embodiment, a light emitting device package 100 corrected to a desired target color characteristic without a separate correction process such as dispensing of additional phosphor is provided. In addition, since the film type wavelength conversion part 30 is attached in a semi-cured state, overlapping attachment is possible. In this case, only one kind of film type wavelength converting portion 30 suitably blended can be corrected to a desired value by superimposing them, so that there is no need to prepare several kinds of wavelength converting portions in advance.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

100 ... LED Package
10 ... light emitting element chip 11 ... bonding wire
12a, 12b ... lead frame 13 ... package body
20 ... molded wavelength conversion part 21, 22 ... first wavelength conversion material
30 ... film-type wavelength converting part 31, 32, 33 ... second wavelength converting material
40 ... first mixed light 51 ... dispenser
52. Color characteristic measuring device

Claims (15)

A light emitting device package body in which a light emitting device chip is mounted;
A molding wavelength conversion part covering the light emitting device chip and including a first wavelength conversion material for converting a wavelength of light emitted from the light emitting device chip; And
A film type wavelength conversion unit attached to the molded wavelength conversion unit and including a second wavelength conversion material for converting a wavelength of light emitted from at least one of the light emitting device and the molded wavelength conversion unit;
Light emitting device package including
The method of claim 1,
The film type wavelength conversion unit includes a light emitting device package comprising a plurality of layers stacked on the molding type wavelength conversion unit.
The method of claim 2,
The light-emitting device package, characterized in that the two or more laminated film-type wavelength conversion portion contains a different second wavelength conversion material
The method of claim 1,
The second wavelength conversion material is a light emitting device package, characterized in that the same as the first wavelength conversion material
The method of claim 1,
The second wavelength converting material includes a light emitting device package comprising any one of a red phosphor, a green phosphor, and a yellow phosphor
The method of claim 1,
The second wavelength conversion material may include at least two or more of red phosphors, green phosphors, and yellow phosphors.
The method of claim 1,
The first wavelength converting material includes at least one of a red phosphor, a green phosphor, and a yellow phosphor.
Providing a package body in which a light emitting device chip is mounted to form a molded wavelength conversion unit covering the light emitting device chip and including a first wavelength conversion material for converting a wavelength of light emitted from the light emitting device;
Measuring color characteristics of light emitted from the light emitting device and the molded wavelength conversion unit; And
A second wavelength conversion converting a wavelength of light emitted from at least one of the light emitting element and the molding wavelength conversion part on the molding wavelength conversion part so as to correct a deviation between the measured color characteristic and a target color characteristic; Attaching at least one film-like wavelength converting portion containing a material;
Method for manufacturing a light emitting device package comprising a
The method of claim 8,
The film type wavelength conversion unit is at least two or more,
Attaching the at least one film type wavelength converting part; attaching at least two film type wavelength converting parts; Method for manufacturing a light emitting device package, characterized in that
The method of claim 8,
The second wavelength converting material includes a light emitting device package, characterized in that any one of a red phosphor, a green phosphor, a yellow phosphor.
The method of claim 8,
The second wavelength converting material includes at least two or more of a red phosphor, a green phosphor, and a yellow phosphor.
10. The method according to claim 8 or 9,
The first wavelength converting material is at least one of a red phosphor, a green phosphor, and a yellow phosphor.
The method of claim 8,
The color characteristic is a light emitting device package manufacturing method characterized in that the color coordinates
The method of claim 13,
The first wavelength conversion material may have a CIE color coordinate value of (x, y) to (x, y) to (x-0.03, y-0.03) of the light emitting device before the film type wavelength conversion unit is attached. Method for manufacturing a light emitting device package, characterized in that contained in the molded wavelength conversion portion
The method of claim 8,
The film type wavelength conversion unit is attached to the molded wavelength conversion unit in a semi-cured state and then cured through a curing process characterized in that the light emitting device package manufacturing method
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US9391249B2 (en) 2014-10-10 2016-07-12 Lg Electronics Inc. Light emitting device package and method of fabricating the same
KR20160093945A (en) * 2015-01-30 2016-08-09 엘지이노텍 주식회사 Phosphor film, light emitting device package and lighting apparatus including the same
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US9773955B2 (en) 2015-04-30 2017-09-26 Lg Electronics Inc. Light conversion plate, and light-emitting diode package, backlight unit, and display device including the plate
WO2019031922A3 (en) * 2017-08-11 2019-03-21 Samsung Electronics Co., Ltd. Light emitting device package and light emitting device package module
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US11462594B2 (en) 2019-10-29 2022-10-04 Samsung Display Co., Ltd. Display apparatus having color converting layers and method of manufacturing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9618792B2 (en) 2014-06-27 2017-04-11 Lg Electronics Inc. Backlight unit and display device having the same
KR20160017697A (en) * 2014-07-31 2016-02-17 (주)위시스 Method for Manufacturing LED Device Using Phosphor Film Attaching Method
US9391249B2 (en) 2014-10-10 2016-07-12 Lg Electronics Inc. Light emitting device package and method of fabricating the same
KR20160093945A (en) * 2015-01-30 2016-08-09 엘지이노텍 주식회사 Phosphor film, light emitting device package and lighting apparatus including the same
KR20160096453A (en) * 2015-02-05 2016-08-16 엘지전자 주식회사 Display apparatus having light emitting device package
US9773955B2 (en) 2015-04-30 2017-09-26 Lg Electronics Inc. Light conversion plate, and light-emitting diode package, backlight unit, and display device including the plate
WO2019031922A3 (en) * 2017-08-11 2019-03-21 Samsung Electronics Co., Ltd. Light emitting device package and light emitting device package module
US10886443B2 (en) 2017-08-11 2021-01-05 Samsung Electronics Co., Ltd. Light emitting device package and light emitting device package module
US11462594B2 (en) 2019-10-29 2022-10-04 Samsung Display Co., Ltd. Display apparatus having color converting layers and method of manufacturing the same
CN113097364A (en) * 2021-03-23 2021-07-09 李清 Manufacturing method of full-spectrum LED light source

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