KR20130049108A - Liquid crystal display device having multi column spacer - Google Patents

Abstract

PURPOSE: A liquid crystal display device having a multi column spacer is provided to prevent the fault of touch and compression by arranging a gap spacer and a compression spacer in a liquid crystal display panel. CONSTITUTION: A first substrate(103) includes pixels and a thin film transistor. A second substrate(105) includes a color filter layer, an opening part, and an overcoat layer. A first column spacer(108) is formed in the overcoat layer on the color filter layer and is contacted with the first substrate. A second column spacer(109) is formed in the overcoat layer of the opening part and is separated from the first substrate. The second column spacer is contacted with the first substrate by external force.

Description

Liquid crystal display device having multiple column spacers {LIQUID CRYSTAL DISPLAY DEVICE HAVING MULTI COLUMN SPACER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to a liquid crystal display device capable of preventing touch and press failure by forming a gap spacer and a pressure spacer according to the position of the liquid crystal panel. It is about.

2. Description of the Related Art Recently, various portable electronic devices such as a mobile phone, a PDA, and a notebook computer have been developed. Accordingly, there is a growing need for a flat panel display device for a light and small size. Such flat panel displays are being actively researched, such as LCD (Liquid Crystal Display), PDP (Plasma Display Panel), FED (Field Emission Display), VFD (Vacuum Fluorescent Display), but mass production technology, ease of driving means, Liquid crystal display devices (LCDs) are in the spotlight for reasons of implementation.

1 is a schematic cross-sectional view of a typical liquid crystal display panel. As shown in the figure, the liquid crystal panel 1 is composed of a lower substrate 5 and an upper substrate 3 and a liquid crystal layer 7 formed between the lower substrate 5 and the upper substrate 3. Although the lower substrate 5 is a driving element array substrate, although not shown in the drawing, a plurality of pixels are formed on the lower substrate 5, and each pixel is a thin film transistor. A driving device is formed, and the upper substrate 3 is a color filter substrate, and a color filter layer for realizing color is formed. In addition, a pixel electrode and a common electrode are formed on the lower substrate 5 and the upper substrate 3, respectively, and an alignment layer for aligning the liquid crystal molecules of the liquid crystal layer 7 is coated. .

The lower substrate 5 and the upper substrate 3 are bonded by a sealant 9 formed on the outer periphery of the substrate and have a constant cell gap by a spacer 8 formed between them (the upper substrate and the lower substrate). Keep the cell gap. In addition, the liquid crystal layer 7 formed between the substrates 3 and 5 drives the liquid crystal molecules by a driving element formed on the lower substrate 5 to display information by controlling the amount of light passing through the liquid crystal layer. .

The liquid crystal panel configured as described above is formed by a drive element array substrate process of forming a drive element on the lower substrate 5, and the upper substrate 3 is formed by a color filter substrate process of forming a color filter. Thereafter, the liquid crystal display device is completed through a spacer and a sealant forming process.

In the driving element array substrate process, a plurality of gate lines and data lines are formed on the lower substrate 5 to define pixel regions, and the gate lines and data lines are respectively formed in the pixel regions. After forming a thin film transistor, which is a driving element to be connected, the pixel electrode is connected to the thin film transistor and forms a pixel electrode for driving a liquid crystal layer as a signal is applied through the thin film transistor.

In addition, the color filter substrate process is performed by forming a black matrix on the upper substrate 3, forming a color filter 2 on the upper substrate, and then forming a common electrode 4.

The spacer is mainly used as a column spacer (column spacer). Previously, ball spacers were mainly used, but ball spacers have a problem that it is difficult to maintain the cell gap of the liquid crystal panel uniformly due to uneven dispersion such as agglomeration with each other during scattering. There was a problem in that the ball spacers were irregularly distributed in the display area of to lower the aperture ratio.

Therefore, in recent years, mainly a column spacer is used because the column spacer can be formed at a desired position with the same density throughout the liquid crystal panel. As such, by forming the column spacer at a desired position, the cell gap of the liquid crystal display device can be kept constant and the aperture ratio can be prevented from being lowered.

However, these column spacers have the following problems.

First, touch defects occur in the liquid crystal display. That is, when sweeping the surface of the liquid crystal display device, the luminance of the sweeped portion becomes uneven and staining occurs.

Second, poor pressurization occurs. That is, when the surface of the liquid crystal display is pressed with a constant force, the color filter substrate or the thin film transistor substrate is deformed, and staining occurs in the corresponding portion.

The present invention has been made in view of the above, and an object of the present invention is to provide a liquid crystal display device and a method of manufacturing the same, which can prevent a touch defect and a press failure by forming a gap spacer and a pressing spacer between an upper substrate and a lower substrate. do.

Another object of the present invention is to form a gap spacer and a pressing spacer at the same height in one step, and to separate the pressing spacer from the substrate by an opening formed in the color filter layer, thereby simplifying the manufacturing process, and a manufacturing method thereof. To provide.

Another object of the present invention is to form a first pressing spacer and a second pressing spacer having different spacing between substrates, and thus a liquid crystal display device capable of simultaneously preventing touch and pressing failure when an external force is applied, and a manufacturing method thereof. To provide.

In order to achieve the above object, the liquid crystal display device according to the present invention comprises a first substrate comprising a plurality of pixels defined by the gate line and the data line and a thin film transistor formed on each pixel; A second substrate including a color filter layer, an opening formed in the color filter layer, and an overcoat layer formed on the color filter layer and the opening; A liquid crystal layer formed between the first substrate and the second substrate; A first column spacer formed on the overcoat layer on the color filter layer of the second substrate and in contact with the first substrate; A second column spacer formed on the overcoat layer on the color filter layer of the second substrate, the second column spacer being formed at a height smaller than the first column spacer and contacting the first substrate as an external force is applied at a predetermined distance from the first substrate; It is formed in the overcoat layer of the opening of the second substrate is spaced apart from the first substrate by a predetermined distance, and consists of a third column spacer in contact with the first substrate as an external force is applied.

The height of the first column spacer is greater than the height of the second column spacer, the height of the second column spacer is the same as the height of the third column spacer, and the separation distance between the second column spacer and the first substrate is the third column spacer and the second substrate spacer. It is smaller than the separation distance of the substrate.

In addition, the liquid crystal display device manufacturing method according to the present invention comprises the steps of providing a first substrate and a second substrate; Forming a color filter layer having an opening formed in the second substrate; Forming an overcoat layer over the second substrate; Stacking a photosensitive insulating layer on the overcoat layer; The photosensitive insulating layer is patterned by a photo process to form a first column spacer and a second column spacer in contact with the first substrate on the overcoat layer on the color filter layer of the second substrate, and the overcoat layer of the opening of the second substrate. Forming a third column spacer spaced apart from the first substrate; And bonding the first substrate and the second substrate with the liquid crystal layer interposed therebetween, wherein the separation distance between the second column spacer and the first substrate is smaller than the separation distance between the third column spacer and the second substrate. It is done.

In the present invention, the touch gap and the press failure can be prevented by disposing the gap spacer and the pressing spacer in the liquid crystal panel. In addition, in the present invention, since the gap spacer and the pressing spacer are formed by one process using a low-cost mask, the process can be simplified and the manufacturing cost can be reduced.

In addition, in the present invention, by forming a plurality of pressing spacers having a different distance from the substrate, by varying the number of spacers supporting the substrate by an external external force, it is possible to effectively prevent touch and pressing failure when the external force is applied.

1 is a cross-sectional view schematically showing a liquid crystal panel.
2 is a cross-sectional view of a liquid crystal panel according to the present invention.
3 is a plan view of a liquid crystal panel according to the present invention;
4 is a view showing the structure of a liquid crystal display device according to a first embodiment of the present invention.
5A to 5C are pixel arrays showing the arrangement of the column spacers.
6A to 6D illustrate a method of manufacturing a liquid crystal display device according to a first embodiment of the present invention.
7 is a view showing the structure of a liquid crystal display device according to a second embodiment of the present invention.
8A to 8D illustrate a method of manufacturing a liquid crystal display device according to a second embodiment of the present invention.

The reason why touch defects occur in the liquid crystal display device is due to the contact between the column spacer and the substrate. That is, since the column spacer is in contact with the substrate, a friction force is generated between the column spacer and the substrate, and when the substrate is touched by the friction force, the liquid crystal does not return to the original shape and stains occur in the corresponding area. The best way to prevent this touch failure is to minimize the column spacer in contact with the substrate.

On the other hand, the pressing failure is caused by deformation of the color filter substrate and the thin film transistor substrate when the pressure is applied to the substrate, the best way to prevent such pressing failure is to maximize the column spacer when the pressure is applied to the substrate It is to prevent deformation of the substrate.

As described above, the touch failure and the depression failure occur in opposite cases. That is, when the density of the column spacer increases, the contact area of the column spacer increases, so that a large amount of touch defects occur, and thus, the pressing defect decreases because a force against the pressure applied to the substrate increases. On the contrary, when the density of the column spacer decreases, the contact area between the column spacer and the substrate decreases, thereby reducing touch defects. Instead, the deformation of the substrate is facilitated by the pressure on the substrate, thereby increasing the pressing failure.

As described above, the touch failure and the bad depression are not deteriorated or improved at the same time, but have a mutually opposite relationship in which the other side becomes worse when one side is improved. Therefore, simply adjusting the number of column spacers, that is, the density, cannot satisfy the two characteristics.

The present invention provides a new type of column spacer in order to minimize these two characteristics, namely touch failure and depression. The basic concept of the new column spacer is illustrated in FIG. 2.

As shown in FIG. 2, the first substrate 103 having the driving element array such as the thin film transistor and the second substrate 105 having the color filter are bonded by the sealant 106, and the liquid crystal layer 107 therebetween. ) Is formed. A first column spacer 108 and a second column spacer 109 are formed on the second substrate 105. In this case, the first column spacer 108 is formed to have a height greater than that of the second column spacer 109 so that the first column spacer 108 contacts the first substrate 103, while the second column spacer 109 is formed. Is maintained at a constant distance from the first substrate 103.

The first column spacer 108 contacts the first substrate 103 to maintain a constant cell gap between the second substrate 105 and the first substrate 103. In this sense, the first column spacer 108 may be referred to as a gap spacer that maintains a cell gap.

Since the second column spacer 109 is spaced apart from the first substrate 103 by a predetermined distance, the second column spacer 109 does not contact the first substrate 103. However, when pressure is applied to the substrates 103 and 105, the second column spacer 109 is in contact with the second substrate 105 and the first substrate 103 so that the second substrate 105 and the first substrate ( 103 is prevented from being deformed. In this sense, the second column spacer 109 may be referred to as a pressing spacer.

Meanwhile, the first column spacer 108 and the second column spacer 109 are formed of the same material on the second substrate 105 by the same process. That is, after coating an insulating material such as resin, the first column spacer 108 and the second column spacer 109 having different thicknesses are formed by a photo process. However, in this process, to form the first column spacer 108 and the second column spacer 109 having different thicknesses, the photo process is performed twice or an expensive half-tone mask is used. One photo process must be performed. In other words, in order to form the first column spacer 108 and the second column spacer 109 having different thicknesses, a complicated process or an expensive process must be performed.

In the present invention, by forming the first column spacer 108 and the second column spacer 109 having a thickness without the complicated process or expensive process as described above, it is possible to simplify the process and reduce the manufacturing cost.

Hereinafter, the embodiment of the present invention will be described in more detail.

3 is a plan view showing that the column spacers 108 and 109 according to the first embodiment of the present invention are actually applied to a liquid crystal panel. In this case, although the transverse electric field mode liquid crystal display device is shown as an example, the present invention may be applied not only to the transverse electric field mode but also to the TN mode or VA mode liquid crystal display device.

As shown in FIG. 3, the liquid crystal display according to the present invention includes a plurality of pixels defined by a plurality of gate lines 130 and data lines 135, and a thin film transistor 150 is formed in each pixel. Is arranged.

The thin film transistor 150 is connected to the gate line 130 and is formed on the gate electrode 151 to which a scan signal is applied, and is formed on the gate electrode 151 to be activated as the scan signal is applied to the gate electrode. And a source electrode 153 and a drain electrode 154 formed on the semiconductor layer 152 to transfer an image signal input through the data line 135 to the pixel.

The common electrode 162 and the pixel electrode 164 are disposed substantially parallel to each other to form a transverse electric field in the pixel. In this case, the common electrode 162 is connected to the common line 137 disposed in the pixel, and the pixel electrode 164 is connected to the pixel electrode line 138 so that a signal is applied, and the common line 137 and the pixel electrode are applied. Lines 138 overlap to form a storage capacity.

The first column spacer 108 and the second column spacer 109 are formed on the gate line 130. In the drawing, the first column spacer 108 and the second column spacer 109 are formed in the gate line 130 of each pixel, but the first column spacer 108 and the second column spacer are formed in two or more pixels. The column spacer 109 may be formed.

The first column spacer 108 serves as a cap spacer and maintains a cell gap of the liquid crystal display device, and the second column spacer 109 is a pressing spacer.

From the viewpoint of such a gap spacer and a pressing spacer, the gap spacer and the pressing spacer are formed alternately in each pixel. Of course, the distribution of the gap spacer and the pressing spacer is not specified, but is distributed throughout the substrate to maintain the cell gap of the liquid crystal display device, and to effectively improve the touch and pressing failure.

Meanwhile, although the first column spacer 108 and the second column spacer 109 are disposed on the gate line 130 in the drawing, the first column spacer 108 and the second column spacer 109 may be disposed on the data line 135, or the gate line 130 and the data line. It may be disposed at the intersection of 135.

FIG. 4 is a cross-sectional view taken along line II ′ of FIG. 3 and illustrates the structures of the first column spacer 108 and the second column spacer 109 in more detail. In this case, the first substrate 103 is a thin film transistor substrate having a thin film transistor, and the second substrate 105 is a color filter substrate having a color filter. The thin film transistor includes a gate electrode 151 formed on the first substrate 103, a gate insulating layer 162 formed on the gate electrode 151, a semiconductor layer 153 formed on the gate insulating layer 162, and And a source electrode 154 and a drain electrode 155 formed on the semiconductor layer 153. The passivation layer 164 is formed on the thin film transistor as described above.

The black matrix 171 and the color filter layer 173 are formed on the second substrate 105. The black matrix 171 is to prevent light leakage from deterioration due to light leakage to areas where real images are not realized, such as gate lines, data lines, and thin film transistor formation areas, and is made of CrO, CrO _2, or the like. This prevents light from being transmitted. The color filter layer 173 is provided with R, G, B, and color filters. As the light is transmitted, the color filter layer 173 may implement an image by implementing the corresponding color. In this case, in the color filter layer 173, the same color filter may be arranged in a band shape.

As shown in FIG. 4, the color filter layer 173 is formed on the black matrix 171, and a portion of the color filter layer 173 is removed to form the opening 174, and the black matrix 171 is formed through the opening 174. Is exposed to the outside. Since the black matrix 171 is formed in a matrix shape only in the region excluding the pixel region, the color filter layer 173 is directly formed on the second substrate 105 in the pixel region, and the black matrix 171 is formed only in the non-pixel region. 171 formed above.

An overcoat layer 175 is formed on the color filter layer 173 to planarize the structure formed on the second substrate 105 as a whole. In this case, since the overcoat layer 175 is formed to have the same thickness on the color filter layer 173, the overcoat layer 175 and the overcoat layer formed on the color filter layer 173 of the opening 174 where the color filter layer 173 is not formed. There is a step between 175. In this case, the height t of the step is determined according to the thickness of the color filter layer 173.

In addition, the thickness of the step may be determined according to the width of the opening 174 formed in the color filter layer 173. The overcoat layer 175 is made of an inorganic insulating material. When the width of the opening 174 is small, for example, when the opening 174 is formed by removing a color filter corresponding to one pixel, the opening 174 is formed. ), The overcoat layer 175 filled in the inside of the opening 174 is not exactly formed along the shapes of the color filter layer 173 and the opening 174, and an inorganic insulating material at the corner of the opening 174 is formed in the opening 174. ), The thickness of the overcoat layer 175 in the opening 174 is larger than the thickness of the overcoat layer 175 on the color filter layer 173, so that the step of the overcoat layer 175 is substantially the color filter layer. It becomes smaller than the thickness of 173.

However, when the width of the opening 174 is increased, for example, when the color filters corresponding to the R, G, and B pixels are removed, an inorganic insulating material at the corner of the opening 174 may be formed in some areas inside the opening 174. Although the predetermined amount flows in, the inorganic insulating material does not flow in most of the regions, so that the thickness of the overcoat layer 175 in the most region of the opening 174 is the thickness of the overcoat layer 175 on the color filter layer 173. The level of the overcoat layer 175 is substantially equal to the thickness of the color filter layer 173. As a result, as the area of the opening 174 increases, the level of the overcoat layer 175 also increases. However, the step of the overcoat layer 175 may not be larger than the thickness of the color filter layer 173.

The first column spacer 108 and the second column spacer 109 are formed on the overcoat layer 175. In this case, the first column spacer 108 is formed on the overcut layer 175 on the color filter layer 173, and the second column spacer 109 is formed on the overcut layer 175 of the opening 174.

The first column spacer 108 and the second column spacer 109 are formed at substantially the same height. However, since the first column spacer 108 is formed on the overcoat layer 175 on the color filter layer 173 and the second column spacer 109 is formed on the overcoat layer 175 of the opening 174, the overcoat The distance H1 from the surface of the second substrate 105 to the end surface of the first column spacer 108 is reduced from the surface of the second substrate 105 by the thickness of the step of the layer 175. It becomes larger than the distance H2 to the end surface of 109. That is, the first column spacer 108 is in contact with the protective layer 164 of the first substrate 103, while the second column spacer 109 is in contact with the protective layer 164 of the first substrate 103. It is spaced apart by the set distance Δh.

In other words, the first column spacer 108 and the second column spacer 109 are formed at the same height, but the first column spacer 108 becomes a gap spacer and the second column spacer is formed by the step of the overcoat layer 175. 109 becomes the pressing spacer. Strictly speaking, the distinction between the gap spacer and the depression spacer is not substantially determined by the column spacers 108 and 109 itself, but rather, the openings 174 formed in the step formed in the overcoat layer 175, that is, the color filter layer 173. Determined by

That is, the formation position of the pressing spacer is determined according to the formation position of the opening 174, and the number and density of the pressing spacers are determined according to the number and density of the opening 174. Therefore, when referring to the position, number or density of the pressing spacer in the detailed description of the present invention, it means the position or number or density of the opening 174.

5A through 5C are diagrams illustrating a structure in which the first column spacer 108 and the second column spacer 109 are arranged in a liquid crystal display device composed of a plurality of pixels.

As shown in Fig. 5A, in the first embodiment of the present invention, pixels having R, G, and B color filters of the same color are arranged in a band shape in the vertical direction, and R, G, B colors in the horizontal direction. The pixels of the filter are repeated. At this time, the opening 174 is not formed in the G color filter and the B color filter, and the opening 174 is formed in the R color filter array. That is, all of the openings 174 are formed in the row of R color filter arrays in the vertical direction. At this time, the openings 174 are alternately formed in the rows of all the B color filters instead of the openings 174. That is, as shown in the figure, an opening 174 is not formed in the row of the first R color filter, and an opening 174 is formed in the next row of the R color filter, and the opening 174 is again formed in the next row. Not formed. As such, when the openings 174 are formed in the R color filters of the even columns (or odd columns), the openings 174 are not formed in the R color filters of the odd columns (even columns), and such a structure Repeated throughout the liquid crystal display element.

The first column spacer 108 is formed on the R color filter (strictly formed in the overcoat layer above the R color filter), and the second column spacer 109 is formed in the opening 174 (strictly speaking). And an overcoat layer formed in the opening 174).

Thus, in this structure, the first column spacer 108 and the second column spacer 109 are formed in the pixel having the same color, while the first column spacer 108 is formed on the curl filter, whereas the second column spacer 108 is formed on the pixel filter. 109 is formed in the opening 174 formed between the same color filters.

In FIG. 5A, an opening is formed between the R color filters so that the first column spacer 108 and the second column spacer 109 are formed on the upper portion of the R color filter and the opening 174 formed on the R color filter. The structure may be applied to the G color filter and the B color filter. That is, the openings may be alternately formed in the columns of the G color filter or the B color filter, the first column spacer 108 may be formed on the color filter, and the second column spacer 109 may be formed in the opening 174.

As shown in Fig. 5B, in this structure, the first column spacer 108 and the second column spacer 109 are formed in pixels of different colors, respectively. That is, the first column spacer 108 is formed in the pixel of R color, and the second column spacer 109 is formed in the pixel of G color and B color. At this time, since the openings 174 are not formed in the series of R color filters arranged in the vertical direction, the first column spacer 108 is formed on the R color filter (exactly, the overcoat layer on the R color filter). An opening 174 is formed between a series of G color filters and B color filters arranged in a vertical direction to form a gap spacer, and the second column spacer 109 is formed to become a pressing spacer. At this time, the second column spacer 109 is formed in a zigzag shape in the opening between the series of G color filters and the opening between the B color filters arranged in the vertical direction. In addition, the second column spacer 109 may be formed only in the opening between the series of G color filters arranged in the vertical direction or the opening between the B color filters.

In addition, an opening is not formed in the G color filter or the B color filter, so that the first column spacer 108 may be formed on the color filter layers, and the second column spacer 109 may be formed in the opening formed in the other color filter layer. There will be.

That is, in this structure, as long as the first column spacer 108 and the second column spacer 109 can be formed in different color filter layers rather than openings in a specific color filter layer, the first column spacer 108 and Each of the second column spacers 109 may be formed on any color filter layer.

In the structure shown in FIG. 5C, the openings 174 are formed in two band-shaped color filter arrays, and no openings are formed in one color filter array, but rather, the openings are formed between adjacent color filter arrays in the color filter array. The color filter extends, and the second column spacer 109 is formed in the opening 174, and the first column spacer 108 is formed on the color filter extending into the opening of the adjacent color filter array. In the drawing, although the opening 174 is formed in the R color filter and the G color filter, and the B color filter extends to the adjacent opening, it may be applied to other color filters.

As described above, in the liquid crystal display device according to the first embodiment of the present invention, the pixels are arranged in a specific structure and the first column spacer 108 and the second column spacer 109 are arranged in the pixel in various forms. This is not just arranged in this form. The first column spacer 108 is formed on the color filter layer to act as a gap spacer for maintaining the cell gap of the liquid crystal panel, and the second column spacer 109 is formed in the opening formed in the color filter layer to prevent the liquid crystal panel from being pressed. If acting as a spacer, any arrangement of pixels may be possible and various arrangements of column spacers 108 and 109 may be possible.

Hereinafter, a method of manufacturing the liquid crystal display device according to the first embodiment of the present invention as described above will be described.

6A to 6D illustrate a method of manufacturing a liquid crystal display device according to a first embodiment of the present invention.

First, as illustrated in FIG. 6A, CrO, CrOx, and the like are laminated on a second substrate 105 made of a transparent material such as glass, and then patterned to form a black matrix 171. Then, the color filter layer ( 173). In this case, the black matrix 171 is formed in a non-image display area around the pixel and arranged in a matrix, and the color filter layer 173 includes R, G, and B color filters. Although not shown in the figure, the R, G, B color filters have the same color arranged in a row in a vertical line, and R, G, B are repeated in the horizontal direction. In this case, a portion of the color filter layer 173 is removed to form the opening 174. Although not shown in the drawing, the opening 174 may be formed by removing one color filter among R, G, and B color filters, or may be formed by removing two or more color filters.

6B, an overcoat layer 175 is formed by stacking an insulating material such as SiO 2 or SiN x on the second substrate 105 on which the color filter layer 173 is formed by CVD (Chemical Vapor Deposition). After forming, an insulating layer 108a is formed by applying a photosensitive material such as a photosensitive resin thereon.

Thereafter, a mask 195 including a transmission part and a blocking part is positioned on the insulating layer 108a, and then light such as ultraviolet rays is irradiated. In this case, the transmission part corresponds to a region where the first column spacer 108 and the second column spacer 109 are to be formed, and light is irradiated to the insulating layer 108a of the corresponding region.

Subsequently, as illustrated in FIG. 6C, the insulating layer 108a irradiated with light is developed by a developer to form the first column spacer 108 and the second column spacer 109. In this case, the first column spacer 108 is formed on the overcoat layer 175 on the color filter layer 173, and the second column spacer 109 is formed on the overcoat layer 175 of the opening 174.

Although not shown in the drawing, an alignment layer may be formed on the overcoat layer 175.

Meanwhile, although the first column spacer 108 and the second column spacer 109 are illustrated in a structure in which one pixel is disposed in the drawing, this is for convenience of description. As shown in the plan view of FIG. 3, the first column spacer 108 and the second column spacer 109 are formed in one pixel or in a plurality of pixels along a gate line or a data line. The arrangement of the column spacer 108 and the second column spacer 109 may also be arranged in various ways. That is, they may be arranged in various arrangements as shown in FIGS. 5A-5C.

Thereafter, as illustrated in FIG. 6D, a sputtering method is performed on the first substrate 103 made of a transparent material such as glass to form an opaque metal having good conductivity such as Cr, Mo, Ta, Cu, Ti, Al, or an Al alloy. After stacking by sputtering process and etching by photolithography process to form gate electrode 151, CVD (Chemicla Vapor) is formed over the entire first substrate 103 on which the gate electrode 151 is formed. The gate insulating layer 162 is formed by stacking an inorganic insulating material such as SiO ₂ or SiNx by a deposition method. When the gate electrode 151 is formed, a gate line 130 is also formed on the first substrate 103.

Thereafter, a semiconductor material such as amorphous silicon (a-Si) is deposited on the first substrate 103 by CVD and then etched to form a semiconductor layer 152 and an ohmic contact layer (shown in the drawing). And a non-transparent opaque metal, such as Cr, Mo, Ta, Cu, Ti, Al, or Al alloy, is deposited on the first substrate 103 by sputtering and then etched to form a semiconductor layer ( 152, strictly speaking, the source electrode 153 and the drain electrode 154 are formed on the ohmic contact layer, and then the entire first substrate 103 having the source electrode 153 and the drain electrode 154 formed thereon. A protective layer 164 is formed by stacking an organic insulating material such as Benzo Cyclo Butene (BCB) or photo acryl.

Although not shown in the drawing, a data line is formed when the source electrode 153 and the drain electrode 154 are formed, and a common electrode and a pixel electrode are formed when the gate electrode 151 and the source electrode 153 are formed, respectively. Can be. In addition, the protection layer 164 may be formed on the common electrode and the pixel electrode.

Although not shown, an alignment layer may be formed on the protective layer 164.

Thereafter, the first substrate 103 and the second substrate 105 are bonded to each other, and the liquid crystal layer 107 is formed therebetween, thereby completing the liquid crystal display device.

As described above, in the first embodiment of the present invention, a gap spacer and a column spacer are formed to prevent touch failure and depression failure. Particularly, in the present embodiment, the gap spacer and the column spacer are formed to have the same height, but the gap spacer is placed in the area where the column spacer is formed so that the gap spacer contacts the first substrate and the second substrate is spaced apart from the first substrate by a predetermined distance. To act as a gap spacer and a column spacer, respectively. Thus, in order to form gap spacers and column spacers having different heights, they have the same height by one process using a low-cost general mask, without having to perform two photo processes or using an expensive halftone mask, However, it is possible to form a gap spacer and a column spacer having different gaps from the first substrate.

FIG. 7 is a cross-sectional view illustrating a structure of a liquid crystal display device according to a second exemplary embodiment of the present invention, which is a cross-sectional view taken along line II ′ of FIG. 3.

As shown in FIG. 7, in this embodiment, the gate electrode 251 is disposed on the first substrate 203, and the gate insulating layer 262 is formed on the gate electrode 251. A semiconductor layer 253 is formed on the gate insulating layer 262, and a thin film transistor is formed by forming a source electrode 254 and a drain electrode 255 formed on the semiconductor layer 253. The passivation layer 264 is formed on the thin film transistor.

The black matrix 271 and the color filter layer 273 are formed on the second substrate 205. The black matrix 271 prevents light from being deteriorated due to light leakage to areas where real images are not realized, such as gate lines, data lines, and thin film transistor formation areas, and the color filter layers 273 are R, G, and B. The color filter is used to realize an image. The liquid crystal layer 207 is formed between the first substrate 203 and the second substrate 205.

In this case, the color filter layer 273 is formed on the black matrix 271, and an opening 274 in which some regions are removed is formed to expose the black matrix 271 to the outside. Since the black matrix 271 is formed only in the region excluding the pixel region, the color filter layer 273 is directly formed on the second substrate 205 in the pixel region and is formed on the black matrix 271 only in the non-pixel region.

An overcoat layer 275 is formed on the color filter layer 273 to planarize the structure formed on the second substrate 205. In this case, since the overcoat layer 275 is formed to have the same thickness on the color filter layer 273, the overcoat layer 275 and the overcoat layer formed on the color filter layer 273 of the opening 274 in which the color filter layer 273 is not formed. A step is generated between the 275. In this case, the height t of the step is determined according to the thickness of the color filter layer 273 and the width of the opening 274.

A first column spacer 208, a second column spacer 209a, and a third column spacer 209b are formed on the overcoat layer 275. In this case, the distance from the surface of the second substrate 205 of the first column spacer 208, the second column spacer 209a and the third column spacer 209b is formed differently so that the first column spacer 208 ) Is in contact with the first substrate 203 (strictly speaking, the structure surface of the first substrate 203) and serves as a gap spacer, and the second column spacer 209a and the third column spacer 209b are formed in the first substrate 203. The substrate 203 is spaced apart from each other at a different distance to serve as a pressing spacer. That is, in this embodiment, a plurality of one kind of gap spacers are formed, and two kinds of pressing spacers are formed.

The first column spacer 208 and the second column spacer 209a are formed in the overcut layer 275 on the color filter layer 273, and the third column spacer 209b is formed in the overcut layer of the opening 274. 275).

The height h1 of the first column spacer 209a is larger than the height h2 of the second column spacer 209a (h1> h2), and the height h2 of the second column spacer 209a. And the height h3 of the third column spacer 209b is the same (h2 = h3).

In this case, since the first column spacer 208 and the second column spacer 209a are formed on the color filter layer 273 and the third column spacer 209b is formed in the opening 209a, the second substrate 205 is formed. The distance H1 from the surface of the first column spacer 208 to the end surface of the first column spacer 208 is greater than the distance H2 from the surface of the second substrate 205 to the end surface of the second column spacer 209a (H1>). H2), the distance H2 from the surface of the second substrate 205 to the end surface of the second column spacer 209a is from the surface of the second substrate 205 to the end surface of the third column spacer 209b. It becomes larger than the distance H3 (H2> H3). In other words, the distance H1 from the surface of the second substrate 205 to the end surface of the first column spacer 208 is largest and the end surface of the second column spacer 209a from the surface of the second substrate 205. The distance H2 is the next largest, and the distance H3 from the surface of the second substrate 205 to the end surface of the third column spacer 209b is the smallest (i.e., H1> H2>). H3>).

The first column spacer 208 contacts the surface of the structure formed on the first substrate 203 (that is, the protective layer 264) to close the cell gap between the first substrate 203 and the second substrate 205. The gap spacers are kept constant, and the second column spacer 209a and the third column spacer 209b are spaced apart from the surface of the structure formed on the first substrate 203 by a predetermined distance and press the liquid crystal panel from the outside. It is a pressing spacer that prevents the pressing failure by contact.

At this time, the distance between the surface of the structure formed on the second column spacer 209a, the third column spacer 209b and the first substrate 203 is Δh1 and Δh2, respectively, and the second column spacer 209a ) Is smaller than the interval Δh2 by the third column spacer 209b (Δh2> Δh1). Thus, the interval Δh1 by the second column spacer 209a is The reason why the interval Δh2 due to the third column spacer 209b is different is as follows.

The pressing spacer is for preventing the pressing failure that occurs in the color filter substrate and the thin film transistor substrate when the pressure is applied to the substrate. It is not to.

When the pressing spacers are formed at the same interval as the first substrate as in this embodiment, when the pressure is applied, all the pressing spacers 209a and 209b come into contact with the structure of the first substrate, thereby causing a touch failure. The best way to prevent the touch failure caused by the pressing spacer is to minimize the number or density of the pressing spacer. However, in this case, the supporting force against the external force applied to the substrate is weakened, and deformation occurs in the substrate.

In this embodiment, the pressing spacers are formed by two spacers 209a and 209b having different distances from the substrate, thereby preventing touch and pressing failures by varying the number of pressing spacers in contact with the substrate according to the magnitude of the external force. Will be. That is, when a small external force is applied to the first substrate 203 and the second substrate 205, the distance between the first substrate 203 and the second substrate 205 is reduced, so that the second column spacer 209a Although the end portion contacts the protective layer 264 of the first substrate 203, the third column spacer 209b has a gap Δh2 between the protective layer 264 and the protective layer 209a of the second column spacer 209a. Since it is larger than the distance Δh1 from the 264, the end of the third column spacer 209b does not come into contact with the protective layer 264, thereby preventing deformation of the substrate due to the external force and by the column spacer. The touch area is minimized to prevent touch defects from occurring.

When a larger external force is applied to the first substrate 203 and the second substrate 205, the distance between the first substrate 203 and the second substrate 205 is further reduced, so that only the second column spacer 209a is used. In addition, the third column spacer 209b is also in contact with the protective layer 264, thereby preventing deformation of the substrate due to a stronger external force.

As such, in this embodiment, only a portion of the pressing spacer is in contact with the structure of the first substrate when a small external force is applied, thereby minimizing touch defects, and all the pressing spacers are in contact with the structure of the first substrate when a strong external force is applied. By doing so, it is possible to prevent deformation due to strong external force.

As described above, in this embodiment, one gap spacer (of course, a plurality of one type of gap spacer is formed when viewed as a whole of the substrate) and two pressing spacers (two types of gap spacers having different gaps as a whole of the substrate are formed, respectively). However, the pressing spacer may be formed of three or more having different gaps (gaps from the first substrate). That is, by varying the type of the pressing spacer in contact with the substrate according to the external force applied to the liquid crystal panel it is possible to further minimize the touch failure when the external force is applied.

As such, when three or more pressing spacers are formed, a plurality of pressing spacers are formed at different heights on the overcoat layer on the top of the color filter layer, and one is formed at the same height as the pressing spacer of one of the pressing spacers formed on the top of the color filter layer. It may be formed.

In addition, one pressing spacer may be formed in the overcoat layer on the top of the color filter layer, and a plurality of openings may be formed so that the overcoat layer has different steps, and the pressing spacers may be formed in each of the openings. In this case, the step of the overcoat layer formed in the opening may be formed differently by changing the width of the opening, and the pressing spacers formed in the upper portion of the color filter and the plurality of openings may be formed at the same height, respectively, to be different from the first substrate. You can have different intervals.

Meanwhile, although the first column spacer 208, the second column spacer 209a, and the third column spacer 209a are arranged in one pixel in the drawing, this is for convenience of description. . As shown in the plan view of FIG. 3, the first column spacer 208, the second column spacer 209a, and the third column spacer 209a may be provided in one or more pixels per pixel along a gate line or a data line. One pixel is formed in each pixel, and the arrangement of the first column spacer 208, the second column spacer 209a, and the third column spacer 209a may be arranged in various ways.

8A to 8D illustrate a method of manufacturing a liquid crystal display device according to a second embodiment of the present invention.

First, as shown in FIG. 8A, CrO, CrOx, and the like are laminated on a second substrate 205 made of a transparent material such as glass, and then patterned to form a black matrix 271, and then a color filter layer ( 273). In this case, the black matrix 171 is formed in a non-image display area around the pixel and arranged in a matrix, and the color filter layer 273 is formed of R, G, and B color filters. In this case, a portion of the color filter layer 273 is removed to form the opening 274. Although not shown in the drawing, the opening 274 may be formed by removing one color filter among R, G, and B color filters, or may be formed by removing two or more color filters.

Subsequently, as shown in FIG. 8B, an overcoat layer 275 is formed by stacking an insulating material such as SiO 2 or SiN x by CVD, and then applying a photosensitive material such as a photosensitive resin thereon to the insulating layer 208a. To form.

Thereafter, the halftone mask 295 including the blocking portion 295a, the transmitting portion 295b, and the transflective portion 295c is positioned on the insulating layer 208a and then irradiated with light such as ultraviolet rays. In this case, the transmission part 295b corresponds to the area where the first column spacer 208 is to be formed, and the transflective part 295c corresponds to the area where the second column spacer 209a and the third column spacer 209c are to be formed. Light is irradiated to the insulating layer 208a in the corresponding region.

Subsequently, as shown in FIG. 8C, the insulating layer 208a to which light is irradiated is developed by a developer, and the insulating layer 208a of the region where the light is not irradiated is removed and light is irradiated through the transmission part 295b. The insulating layer 208a of the exposed region is not removed, and only a part of the light is transmitted, and only a part of the insulating layer 208a of the irradiated region is removed, so that the first column spacer 208, the second column spacer 209a and the first layer spacer 208a are removed. Three column spacers 209b are formed. In this case, the first column spacer 208 and the second column spacer 209a are formed on the overcoat layer 275 on the color filter layer 273, but the first column spacer 208 is the second column spacer 209a. Formed to a greater height. The third column spacer 209b is formed at the same height as the second column spacer 209a on the overcoat layer 275 of the opening 274, but the third column spacer 209b has the opening (274). 274 and the second column spacer 209a are formed on the color filter layer 273, so that a gap between the third column spacer 209b and the protective layer 264 is greater than the second column spacer 209a and the protective layer 209. 264) greater than the interval between.

Although not shown in the drawing, an alignment layer may be formed on the overcoat layer 175.

Subsequently, as shown in FIG. 8D, a non-transparent opaque metal such as Cr, Mo, Ta, Cu, Ti, Al, or Al alloy is applied to the first substrate 203 made of a transparent material such as glass. After forming the gate electrode 251 by laminating by photolithography, the inorganic substrate such as SiO ₂ , SiNx, or the like is deposited by CVD over the entire first substrate 203 on which the gate electrode 151 is formed. The gate insulating layer 262 is formed by stacking materials. When the gate electrode 251 is formed, the gate line 230 is also formed on the first substrate 103.

Thereafter, a semiconductor material such as amorphous silicon (a-Si) is deposited by CVD over the entire first substrate 203 and then etched to form a semiconductor layer 252 and an ohmic contact layer (not shown). After that, an electrically conductive opaque metal, such as Cr, Mo, Ta, Cu, Ti, Al, or Al alloy, is laminated on the first substrate 203 by sputtering and then etched, and then etched on the semiconductor layer 252. In other words, the source electrode 253 and the drain electrode 254 are formed on the ohmic contact layer, and then BCB or photoacryl is formed on the entire first substrate 203 on which the source electrode 253 and the drain electrode 254 are formed. The protective layer 264 is formed by stacking the same organic insulating material.

Although not shown in the drawing, a data line is formed when the source electrode 253 and the drain electrode 254 are formed, and a common electrode and a pixel electrode may be formed when the gate electrode 251 and the source electrode 253 are formed, respectively. have. In addition, the protective layer 264 may be formed on the common electrode and the pixel electrode.

Although not shown, an alignment layer may be formed on the passivation layer 264.

Thereafter, the first substrate 203 and the second substrate 205 are bonded to each other and the liquid crystal layer 207 is formed therebetween to complete the liquid crystal display device.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

Therefore, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also within the scope of the present invention.

103, 105: substrate 108: gap spacer
109: depression spacer 130: gate line
135: Dataline 171: Black Matrix
173: color filter layer 174: opening
175: overcoat layer

Claims (29)

A first substrate including a plurality of pixels defined by gate lines and data lines, and a thin film transistor formed on each pixel;
A second substrate including a color filter layer, an opening formed in the color filter layer, and an overcoat layer formed on the color filter layer and the opening;
A liquid crystal layer formed between the first substrate and the second substrate;
A first column spacer formed on the overcoat layer on the color filter layer of the second substrate and in contact with the first substrate;
And a second column spacer formed in the overcoat layer of the opening of the second substrate, the second substrate being spaced apart from the first substrate by a predetermined distance and contacting the first substrate when an external force is applied. The method of claim 1, wherein the thin film transistor,
A gate electrode formed on the first substrate;
A gate insulating layer formed on the gate electrode;
A semiconductor layer formed on the gate insulating layer;
A source electrode and a drain electrode formed on the semiconductor layer; And
And a protective layer formed on the first substrate. The liquid crystal display of claim 1, wherein the first column spacer and the second column spacer are disposed on a gate line. The liquid crystal display of claim 1, wherein the first column spacer and the second column spacer are disposed on a data line. The liquid crystal display device of claim 1, wherein the first column spacer and the second column spacer are made of an organic material. The liquid crystal display of claim 1, wherein the first column spacer and the second column spacer are formed at the same height. The liquid crystal display device according to claim 1, wherein the distance between the second column spacer and the first substrate varies depending on the size of the step of the overcoat layer by the opening of the color filter layer. The liquid crystal display of claim 1, wherein the liquid crystal display comprises a transverse electric field mode, a twisted nematic (TN) mode, and a vertical alignment (VA) mode. Providing a first substrate and a second substrate;
Forming a color filter layer having an opening formed in the second substrate;
Forming an overcoat layer over the second substrate;
Stacking a photosensitive insulating layer on the overcoat layer;
The photosensitive insulating layer is patterned by a photo process to form a first column spacer in contact with the first substrate on the overcoat layer on the color filter layer of the second substrate, and the first substrate and the overcoat layer of the opening of the second substrate. Forming a spaced second column spacer; And
A method of manufacturing a liquid crystal display device comprising the step of bonding a first substrate and a second substrate with a liquid crystal layer interposed therebetween. 10. The method of claim 9,
Forming a plurality of gate lines and data lines defining a plurality of pixels on the first substrate; And
A gate electrode is formed on each pixel of the first substrate, a gate insulating layer is formed on the gate electrode, a semiconductor layer is formed on the gate insulating layer, and a source electrode and a drain electrode are formed on the semiconductor layer. Forming a protective layer on the substrate to form a thin film transistor further comprising the step of manufacturing a liquid crystal display device. The method of claim 10, wherein the first column spacer and the second column spacer are formed on at least one of the gate line and the data line. A first substrate including a plurality of pixels defined by gate lines and data lines, and a thin film transistor formed on each pixel;
A second substrate including a color filter layer, an opening formed in the color filter layer, and an overcoat layer formed on the color filter layer and the opening;
A liquid crystal layer formed between the first substrate and the second substrate;
A first column spacer formed on the overcoat layer on the color filter layer of the second substrate and in contact with the first substrate;
A second column spacer formed on the overcoat layer on the color filter layer of the second substrate, the second column spacer being formed at a height smaller than the first column spacer and contacting the first substrate as an external force is applied at a predetermined distance from the first substrate;
And a third column spacer formed in the overcoat layer of the opening of the second substrate and spaced apart from the first substrate by a predetermined distance and contacting the first substrate as an external force is applied. The liquid crystal display of claim 12, wherein the height of the first column spacer is greater than the height of the second column spacer, and the height of the second column spacer is the same as the height of the third column spacer. The liquid crystal display device of claim 13, wherein the separation distance between the second column spacer and the first substrate is smaller than the separation distance between the third column spacer and the second substrate. 13. The liquid crystal display device according to claim 12, wherein the distance between the third column spacer and the first substrate is dependent on the size of the step of the overcoat layer by the opening of the color filter layer. Providing a first substrate and a second substrate;
Forming a color filter layer having an opening formed in the second substrate;
Forming an overcoat layer over the second substrate;
Stacking a photosensitive insulating layer on the overcoat layer;
The photosensitive insulating layer is patterned by a photo process to form a first column spacer and a second column spacer in contact with the first substrate on the overcoat layer on the color filter layer of the second substrate, and the overcoat layer of the opening of the second substrate. Forming a third column spacer spaced apart from the first substrate; And
Bonding the first substrate and the second substrate with the liquid crystal layer interposed therebetween,
The separation distance between the second column spacer and the first substrate is smaller than the separation distance between the third column spacer and the second substrate. 17. The method of claim 16,
Forming a plurality of gate lines and data lines defining a plurality of pixels on the first substrate; And
A gate electrode is formed on each pixel of the first substrate, a gate insulating layer is formed on the gate electrode, a semiconductor layer is formed on the gate insulating layer, and a source electrode and a drain electrode are formed on the semiconductor layer. Forming a protective layer on the substrate to form a thin film transistor further comprising the step of manufacturing a liquid crystal display device. The method of claim 16, wherein the forming of the first column spacer, the second column spacer, and the third column spacer comprises:
Irradiating light with a halftone mask including a blocking part, a transmitting part, and a transflective part positioned on the photosensitive insulating layer; And
Developing a photosensitive insulating layer irradiated with light to remove the insulating layer corresponding to the blocking portion, and removing only a part of the insulating layer corresponding to the transflective portion. Thin film transistor substrate and color filter substrate;
A first spacer formed on the color filter substrate and in contact with the thin film transistor substrate;
A plurality of second spacers formed on the color filter substrate and contacting the thin film transistor substrate as an external force is applied at a predetermined distance from the thin film transistor substrate.
And a separation distance between each of the plurality of second spacers and the thin film transistor substrate is different. The thin film transistor substrate of claim 19,
First substrate;
A plurality of gate lines and data lines formed on the first substrate to define a plurality of pixels; And
And a thin film transistor formed on each pixel. The method of claim 19, wherein the color filter substrate,
Second substrate;
A color filter layer formed on the second substrate;
An opening formed in the color filter layer; And
And an overcoat layer formed on the color filter layer and the opening and having a step formed between an upper portion and the opening of the color filter layer. 22. The liquid crystal display device according to claim 21, wherein the first spacer comprises a gap spacer formed on the overcoat layer on the color filter layer. 22. The liquid crystal display device according to claim 21, wherein the second spacer comprises a plurality of pressing spacers formed on the overcoat layer on the color filter layer. 23. The method of claim 21 or 22, wherein the height of the pressing spacer formed on the overcoat layer on the top of the color filter layer is smaller than the height of the gap spacer formed on the overcoat layer on the top of the color filter layer, the plurality of pressing spacers are formed to different heights A liquid crystal display device characterized by the above-mentioned. The method of claim 21, wherein the second spacer,
At least one first pressing spacer formed on the overcoat layer above the color filter layer; And
And at least one second pressing spacer formed in the overcoat layer of the opening. 26. The liquid crystal display device according to claim 25, wherein when the plurality of first pressing spacers are formed, the plurality of first pressing spacers are formed at different heights. 26. The liquid crystal display of claim 25, wherein when the plurality of second pressing spacers are formed, the plurality of second pressing spacers are formed at the same height, and the steps of the overcoat layer on which the plurality of second pressing spacers are formed are different from each other. device. 28. The liquid crystal display device according to claim 27, wherein the height of the step of the overcoat layer is determined by the width of the opening. The liquid crystal display device of claim 25, wherein the height of the second pressing spacer is equal to the height of the at least one first pressing spacer.

Images