KR20130011623A - Rf module - Google Patents

Abstract

The present invention relates to an RF module, the RF module according to an embodiment of the present invention is a base substrate; And a DIP / SMD type connector connecting portion formed on the base substrate and capable of connecting a DIP type connector and a SMD type connector.

Description

RF module {RF module}

The present invention relates to an RF module, and more particularly, to an RF module capable of connecting various kinds of connectors.

In recent years, with the rapid development of information and communication devices, the parts of mobile devices are diversified and advanced, and the quality problem becomes a particularly important issue.

In the development of RF modules, quality-related tests are conducted using at least 120 samples. A variety of tests can be performed, including high and low temperature tests, thermal shock tests, high pressure tests, electrostatic discharge (ESD) tests, and drop tests.

During the test, a signal input should be provided to the RF module used as the sample. In particular, the mobile module of the RF module is inevitably attached to the sub-board, so the test is performed by inputting a signal by connecting directly to a connector.

In order to perform the test, the test may be performed by connecting the connector formed on the test cable and the connector formed on the RF module to each other. To input one test signal to one module, one connector per module can be used.

Depending on the type of connector formed on the test cable, a corresponding connector must also be formed on the RF module. DIP type connectors, such as SMA connectors, are typically used for testing RF modules.

However, since the manufacturing cost of the DIP type connector is expensive, when the DIP type connector is formed in the RF module, all DIP type connectors must be formed in the test cables used for hundreds of tests, thereby increasing the manufacturing cost.

An object of the present invention is to provide an RF module that can be applied to both the DIP type connector and SMD type connector to enable various types of testing.

RF module according to an embodiment of the present invention; And a DIP / SMD type connector connecting portion formed on the base substrate and connecting the DIP type connector and the SMD type connector.

The DIP / SMD type connector connection unit may include a plurality of ground terminals and a signal connection terminal.

The signal connection terminal may include a through signal connection terminal and a pad type signal connection terminal, and any one of the plurality of ground terminals may include a through type ground terminal and a pad type ground terminal.

The through signal connection terminal and the pad type signal connection terminal or the through type ground terminal and the pad type ground terminal may be formed to be electrically connected to each other.

The through-type signal connection terminal or the through-type ground terminal is formed of a conductive through hole and an annular conductive pattern formed around the conductive through hole, and the annular conductive pattern is a pad-type signal connection terminal or a pad-type ground terminal, respectively. It can also be used as.

The signal connection terminal may be disposed in the center of the plurality of ground terminals.

The DIP / SMD type connector connection unit may include four ground terminals arranged in a rectangular shape and a signal connection terminal disposed at the center of the four ground terminals.

The DIP type connector may be any one selected from the group consisting of an SMA connector, an SMB connector, an SSMB connector, an SMC connector, and an MCX connector.

The SMD type connector may be any one selected from the group consisting of a UFL connector, an IPEX connector, and an IPX connector.

The base substrate may be a test substrate for an RF module.

Since the RF module according to the embodiment includes both the DIP type connector and the SMD type connector, it may be connected to a test cable including the DIP type connector or the SMD type connector.

According to an embodiment of the present invention, since the DIP type connector is included, compatibility with other products may be increased, thereby increasing flexibility of the product. In addition, since the SMD type connector is included, a low-cost SMD type connector can be utilized when performing a large-scale test, thereby lowering the manufacturing cost.

1 is an exploded perspective view of an RF module according to an embodiment of the present invention.
2 is a plan view illustrating an RF module according to an exemplary embodiment of the present invention.
3A and 3B are graphs comparing transmission coefficients (S-parameters) when an RF module according to an embodiment of the present invention is used.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. However, in describing the preferred embodiment of the present invention in detail, if it is determined that the detailed description of the related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

In the drawings, like reference numerals are used throughout the drawings.

In addition, throughout the specification, when a part is 'connected' to another part, this includes not only 'directly connected' but also 'indirectly connected' with another element in between. do. Also, to include an element means to include other elements, not to exclude other elements unless specifically stated otherwise.

Hereinafter, an RF module including a DIP / SMD type connector connection unit according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3.

1 is an exploded perspective view showing an RF module 1 according to an embodiment of the present invention.

1 and 2, an RF module 1 according to an embodiment of the present invention is formed on a base substrate 10 and the base substrate 10, and has a dual inline package (DIP) type connector 30 and It may include a DIP / SMD type connector connection that is connected to the Surface Mounted Device (SMD) type connector 20.

The base substrate 10 may be implemented with a circuit for processing a radio frequency (RF) signal. In order to test the RF module, a test for inputting a test signal under a severe condition of numerous items may be performed. In the test, a test signal may be input by connecting a connector of a test cable to a connection part formed in an RF module.

In the case of the RF module, a signal is input under test conditions to determine whether the board is in good condition or not. In the case of a general electric module, it is attached to a test sub board to apply a current or signal through the sub board, but in the case of an RF module, a signal is directly input to an RF module without using a separate sub board.

According to an embodiment of the present invention, the DIP / SMD type connector connection portion may be formed on the base substrate 10. The DIP / SMD type connector connection part may be connected to both the DIP type connector 30 and the SMD type connector 20. When the DIP / SMD type connector connection part is connected to the connector connected to the DIP / SMD type connector connection part, the DIP / SMD type connector connection part is connected to the signal line 50 to be tested. It may be formed to.

The DIP type connector 30 is a dual inline package type connector for connecting an RF coaxial cable, and a plurality of contact parts 31, 33, 37, and 39 are formed. . Connection terminals of the DIP type connector 30 may be attached in a form that can be replaced by soldering or socket insertion into the opposite side inserted into the through hole H formed in the substrate.

The DIP type connector 30 as described above is a connector widely used in a test board for an RF module. Therefore, the present invention is not limited thereto, but when the female DIP type connector 30 is formed in the RF module, the male DIP type connector is formed in the test cable corresponding thereto and the male DIP type connector formed in the RF module and the male DIP type formed in the test cable. The mating of connectors allows electrical connection between the test cable and the RF module.

Since a typical company uses a lot of DIP type connectors, a test cable with a male DIP type connector may be prepared in the test cable. Therefore, when the DIP type connector 30 is formed in the RF module, it is possible to directly connect to a test cable provided in advance without having to manufacture a test cable having a separate connector.

The SMD type connector 20 is a type of surface mounted device, and is a connector that is mounted on a surface or a surface of a circuit board by surface mount technology (SMT).

In the case of the SMD type connector 20, since the board is mounted on the surface, many parts can be mounted in a small area. Therefore, it can be usefully used for miniaturizing the product.

In addition, since the SMD type connector 20 is inexpensive compared to the DIP type connector 30, the SMD type connector 20 may be useful when a large amount of RF modules are tested.

According to an embodiment of the present invention, since it includes a DIP / SMD type connector connecting part to which the DIP type connector 30 and the SMD type connector 20 can be simultaneously applied, it may be connected to a cable including a DIP type connector. It may also be connected to a cable including a SMD type connector.

Conventionally, in order to connect to a cable including a SMD-type connector, an RF module including a SMD-type connector must be manufactured. To connect to a cable including a DIP-type connector, an RF module including a DIP-type connector is used. Had to be manufactured separately.

However, according to an embodiment of the present invention, both the DIP type connector 30 and the SMD type connector 20 may be connected to the DIP / SMD type connector connection portion. Therefore, it is possible to connect a test cable including two types of connectors without having to manufacture a separate RF module.

According to an embodiment of the present invention, the DIP type connector 30 may be any one selected from the group consisting of an SMA connector, an SMB connector, an SSMB connector, an SMC connector, and an MCX connector.

In particular, the SMA connector is a coaxial RF connector, and is a compact connector that can connect a coaxial cable to a desired terminal through screw coupling between the connectors. SMA connectors offer excellent electrical characteristics when applying AC currents from DC current to 18 GHz.

SMA connectors can transmit and receive a wide range of signals, and because of their relatively small resistance, they can be used to input high current electricity or signals.

Since SMA connectors are generally applicable to test cables, they can easily be connected to common test cables if an SMA connector is formed on the RF module.

 According to an embodiment of the present invention, the SMD type connector 20 may be any one selected from the group consisting of a UFL connector, an IPEX connector, and an IPX connector.

In particular, UFL connectors are connectors for small coaxial RF modules and can be used to transmit and receive high frequency signals up to 6 GHz.

The UFL connector, even if formed in the RF module, occupies very little space, making it possible to form a connector that can be connected to a test cable including an SMD-type connector in a simple manner without spatially affecting the RF module.

Hereinafter, the structure of the RF module 1 including the DIP / SMD type connector connections 11, 13, 15, 17, and 19 will be described in more detail with reference to FIGS. 1 and 2.

Referring to FIG. 1, an RF module 1 according to an embodiment of the present invention includes a base board 10 including a DIP / SMD type connector connection part 11, 13, 15, 17, and 19, and a DIP type connector ( 30), the SMD type connector 20 may be included.

The base substrate 10 may have a circuit pattern for implementing an RF module. Although not limited thereto, the base substrate 10 may be a multilayer printed circuit board having signal lines formed therein.

The DIP / SMD type connector connecting parts 11, 13, 15, 17, and 19 may be formed of the ground terminals 11, 13, 17, and 19 and the signal connecting terminal 15.

The signal connection terminal 15 may be connected to a signal line 50 formed on a base substrate to transmit and receive an RF signal to an RF module. The signal connection terminal 15 may include a through type signal connection terminal 15a for connecting with a DIP type connector and a pad type signal connection terminal 15b for connecting with a SMD type connector. The through signal connection terminal 15a and the pad type signal connection terminal 15b may be electrically connected to each other.

The through signal connection terminal 15a is configured to mount the DIP type connector 20. The through signal connection terminal 15a forms a through hole H in the base substrate 10, a conductive material is formed on an inner wall of the through hole H, and forms a conductive through hole. An annular conductive pattern may be formed around the through-hole to form the through signal connection terminal 15a. The through signal connection terminal 15a is formed to be electrically connected to the signal line 50. Accordingly, the through-type signal connection terminal 15a is connected to a test cable through the DIP type connector 20 to apply a test signal to the signal line 50, thereby applying RF. You can test the module.

The pad type signal connection terminal 15b is a component for mounting an SMD type connector and may be formed to be in contact with the through type signal connection terminal 15a or integrally formed thereon. The pad type signal connection terminal 15b may be formed to contact the through type signal connection terminal 15a as shown in FIGS. 1 and 2.

The through-type signal connection terminal 15a and the pad-type signal connection terminal 15b may be integrally formed, for example, and may be formed around the conductive through hole H of the through-type signal connection terminal 15a. The annular conductive pattern formed in the substrate may be integrally manufactured to utilize the annular conductive pattern as the signal connection terminal 15b.

The ground terminals 11, 13, 17, and 19 have a configuration for connecting a ground terminal of a coaxial cable to be connected, and a through type ground terminal (11a, 13a, 17a, 19a) and a pad type for connecting to a DIP type connector. It may be composed of ground terminals 17b and 19b.

The pad-type ground terminal according to the embodiment of the present invention may be formed to be electrically connected to at least one of the plurality of through-type ground terminals, or a part of the through-type ground terminal may be used as the pad-type ground terminal. .

The through-type ground terminals 11a, 13a, 17a, and 19a are elements for connecting the ground portions of the DIP type connectors, similar to the through-type signal connection terminals 15a. The upper and lower surfaces of the hole and the base substrate 10 may be formed of an annular conductive pad formed around the conductive through hole H.

The pad-type ground terminals 17b and 19b may be conductive patterns formed on one surface of the base substrate 10 as a structure for grounding an SMD-type connector.

According to an embodiment of the present invention, the pad-type ground terminal may be a pad-shaped conductive pattern formed to contact the annular conductive pad of the through-type ground terminal. The pad-type ground terminal may be formed only in a portion of the plurality of through-type ground terminals, and may be formed in as many positions as necessary to form a SMD type connector.

1 and 2, four through-type ground terminals 11a, 13a, 17a, and 19a disposed on the base substrate 10 and formed in an annular conductive pattern formed around the conductive through hole H, respectively. It may include.

Pad-type ground terminals 17b and 19b may be formed to be adjacent to an annular conductive pattern of some of the through-type ground terminals 17a and 19a of the plurality of through-type ground terminals 11a, 13a, 17a, and 19a. .

According to an embodiment of the present invention, the pad-type ground terminals 17b and 19b may be formed to contact the through-type ground terminals 17a and 19a, but the present invention is not limited thereto. And pad-type ground terminals 17b and 19b may be integrally formed. For example, the annular conductive pattern may be formed integrally with an annular conductive pattern formed around the conductive through hole H of the through-type ground terminal. It can be formed to serve as a pad-type ground terminal.

According to an embodiment of the present invention, since the ground terminals 11, 13, 17, and 19 include a configuration for connecting a DIP type connector, the ground terminals 11, 13, 17, and 19 may include a plurality of ground terminals.

1 and 2, a connection terminal 15 may be formed at a central portion of the plurality of ground terminals 11, 13, 17, and 19 arranged in a quadrangular shape to minimize the mounting space.

Accordingly, the DIP / SMD type connector connecting portions 11, 13, 15, 17, and 19 may be formed to connect both the DIP type connector and the SMD type connector while minimizing the mounting space on the base substrate.

According to an embodiment of the present invention, the SMD type connector 20 may be mounted to be connected to the pad type ground terminals 19b and 17b and the pad type connection terminal 15b formed on the base substrate.

Referring to FIG. 1, an SMD type connector 20 may be mounted on a rectangle indicated by a dotted line, and may be mounted and electrically connected to the pad type ground terminals 19b and 17b and the pad type connection terminal 15b.

In addition, according to an embodiment of the present invention, the contact portions 31, 33, 35, 37, and 39 formed in the DIP type connector 30 may have through-type ground terminals 11a, 13a, 17a, 19a) and the through connection pattern 15a.

The contact portion of the DIP type connector may be inserted in a corresponding position of the base substrate 10 so as to be electrically connected to the through-type ground terminal or through-type connection pattern, and then be attached in a form that can be soldered or inserted by inserting a socket.

In the same manner as described above, the DIP type connector 30 and the SMD type connector 20 may be attached to each other so as to be connected to both the test cable with the DIP type connector or the test cable with the SMD type connector.

[Example]

The SMA connector and the UFL connector were connected to the DIP / SMD type connector connection part of the RF module manufactured according to an embodiment of the present invention, and the transmission coefficients (S-parameters) for the same input signal were compared for each connector.

3A and 3B are graphs comparing the transmission coefficients of signals when the SMA connector and the UFL connector are respectively connected to the DIP / SMD type connector connection part of the RF module according to an embodiment of the present invention.

In the case of the present invention, the SMA connector and the UFL connector are used as input / output terminals to check their reflection values and compare the transmission coefficients. The thin line corresponds to the input signal, and the thick line is a graph showing the transmission coefficient of the output signal.

3A is a graph showing the transmission coefficient of the input signal when the SMA connector is connected, Figure 3B is a graph showing the transmission coefficient of the UFL connector for the same input signal.

3A and 3B, the SMA connector and the UFL connector showed similar transmission coefficients for the same input signal represented by a thin line.

When the SMA connector and the UFL connector were connected to the DIP / SMD type connector connection according to the exemplary embodiment of the present invention, the transmission coefficient difference of the input signal was about 5 dB.

That is, according to the embodiment of the present invention, both connectors can be applied, and in this case, it can be confirmed that the input signal has a deviation of 5 dB or less. In most cases, it was confirmed that they had almost similar transmission coefficients.

According to an embodiment of the present invention, when the input signal is analyzed in consideration of a loss between the SMA connector and the UFL connector, sophisticated data measurement is possible.

According to an embodiment of the present invention, since the DIP type connector and the SMD type connector may be applied to the RF module, the utilization may be very high.

A single RF module can be used to connect a test cable utilizing a DIP type connector, and a test cable using an SMD type connector can be connected without a separate RF module.

Accordingly, by applying a low-cost SMD type connector can reduce the test cost and manufacturing cost, it can be manufactured to be compatible because it includes a connector of the DIP type commonly used when providing to other companies.

Since both types of connectors can be manufactured with a single SMD type connector and a DIP type connector connection, the manufacturing process can be simplified and manufacturing cost can be reduced.

10: base substrate
11, 13, 17, 19: ground terminal
15: Signal connection terminal
11a, 13a, 17a, 19a: through ground terminal
17b, 19b: padded ground terminal
15a: Through type connection terminal
15b: Pad type connection terminal
20: SMD type connector
30: DIP type connector
50: signal line

Claims (10)

A base substrate; And
A DIP / SMD type connector connecting portion formed on the base substrate and capable of connecting a DIP type connector and a SMD type connector;
RF module comprising a.
The method of claim 1,
The DIP / SMD type connector connection unit includes a plurality of ground terminals and signal connection terminals.
The method of claim 2,
The signal connection terminal includes a through-type signal connection terminal and a pad-type signal connection terminal,
Any one of the plurality of ground terminal RF module including a through-type ground terminal and the pad ground terminal.
The method of claim 3,
And the through-type signal connection terminal and the pad-type signal connection terminal or the through-type ground terminal and the pad-type ground terminal are electrically connected to each other.
The method of claim 3,
The through-type signal connection terminal or the through-type ground terminal is formed of an annular conductive pattern formed around the conductive through hole and the conductive through hole,
And the annular conductive pattern is also used as a pad type signal connection terminal or a pad type ground terminal, respectively.
The method of claim 2,
The RF module is disposed in the signal connection terminal in the center of the plurality of ground terminals.
The method of claim 1,
The DIP / SMD type connector connection part may include four ground terminals arranged in a rectangular shape.
RF module including a signal connection terminal disposed in the center of the four ground terminals.
The method of claim 1,
The DIP type connector is any one selected from the group consisting of SMA connector, SMB connector, SSMB connector, SMC connector, and MCX connector.
The method of claim 1,
The SMD type connector is any one selected from the group consisting of UFL connector, IPEX connector and IPX connector.
The method of claim 1,
The base substrate is an RF module test substrate for the RF module.

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