KR20120090490A - Circuit board testing apparatus - Google Patents

Abstract

PURPOSE: A substrate inspection apparatus is provided to simplify structure by reducing the number of probes in half as compared with a four terminals probe inspection method. CONSTITUTION: A probe(110) for test is touched with a test point of a substrate under test(160). A probe socket(120) detachably unites the test probe and wires current supply line(121) for supplying a test current to the probe for test and a voltage measure line(123) for measuring a voltage. A control module(140) supplies the test current to a pattern(163) of the substrate under test through the probe for test. The control module measures a voltage value by using electric potential difference of a supply current. The control module produces resistance value of the substrate under test from the measured voltage value and an input current value.

Description

Substrate inspection device {CIRCUIT BOARD TESTING APPARATUS}

The present invention relates to a substrate inspection apparatus, and more particularly, to reduce the number of probes used in the substrate inspection apparatus to 1/2 compared to the conventional four-terminal probe inspection method, and to simplify the structure of the substrate inspection apparatus. The present invention relates to a substrate inspection apparatus.

In general, in the electrical conduction inspection of substrate wirings for semiconductor packages, probes are brought into contact with both ends of the wirings forming the wiring patterns, and only the electrical conduction of the wirings is detected.

However, in recent years, since it is necessary to accurately measure not only the electrical conduction but also the resistance value of the wiring, a four-terminal measurement method capable of measuring the resistance value while removing the influence of the probe contact resistance is generally used.

Hereinafter, a four-terminal substrate measuring apparatus will be described with reference to FIG. 1. 1 is a schematic view for explaining the concept of a conventional 4-terminal substrate measuring apparatus.

The measuring device as shown in FIG. 1 includes a current generating unit 10 and a voltage measuring unit 12. The first and second current probes 10F1 and 10F2 for current supply are connected to the current generator 10, and the first and second voltage probes 12S1 and 12S2 for voltage measurement are connected to the voltage measuring unit 12. Is connected.

As shown in FIG. 1, when measuring the resistance 14 of the wiring of the circuit board 16, the first and second voltage probes 12S1 and 12S2 and the first and second current probes 10F1 and 10F2 are measured. ) Is placed in contact with both ends of the wiring to be measured, and the resistance 14 of the wiring from the current generating section 10 via the first and second current probes 10F1 and 10F2. Supply a current of a predetermined size for measurement.

As a result, a potential difference occurs at both ends of the wiring, and thus, the voltage difference measuring unit 12 measures the potential difference at both ends through the first and second voltage probes 12S1 and 12S2. When the value of the potential difference, that is, the voltage value is obtained, the value of the resistance 14 of the wiring can be obtained from the current value for measurement and the measured voltage value.

In such four-terminal measurement, a probe for voltage measurement and a probe for current application are provided as close as possible, and both of them need to be reliably in contact with the same inspection point, and various means have been proposed.

Japanese Laid-Open Patent Publication No. 2004-279133 discloses a four-terminal measurement probe in which a current supply needle pin and a voltage measurement needle pin are integrally supported by a support member.

The four-terminal probe as disclosed in the related art is a flip chip having a relatively narrow wiring pitch and a high-density wiring pattern, whereas the four-terminal probe has an easy structure in the ball grid surface on which a wiring pattern with a relatively large wiring pitch is formed. In terms of problems, it was difficult to use.

That is, when the 4-terminal probe is to be brought into contact with the inspection surface side of the substrate on which the wiring pitch is relatively narrow and the high-density wiring pattern is formed, such as the flip chip surface, the number of 4-terminal probes per unit area is increased, and the required number of This is because probes cannot be placed.

An object of the present invention devised to solve the problems of the prior art is to reduce the number of probes used in the substrate inspection apparatus to 1/2 compared to the conventional four-terminal probe inspection method, while simplifying the structure of the substrate inspection apparatus. In order to configure, a probe socket for wiring a current supply line for supplying a current and a voltage measurement line for measuring a voltage is provided, and the probe for contacting the test point of the substrate to be inspected is detached from the probe socket. It is to provide a substrate inspection apparatus configured to be coupled to be possible.

Another object of the present invention is to provide a substrate inspection apparatus that enables inspection of a substrate having a higher density wiring pattern than that of a conventional four-terminal probe inspection method by minimizing inspection points on a substrate to be inspected.

According to an aspect of the present invention described above the inspection probe in contact with the inspection point of the inspection target substrate; A probe socket to which the test probe is detachably coupled and to which a current supply line for supplying a test current to the test probe and a voltage measuring line for measuring a voltage are wired; And a test current is supplied to the pattern of the test target through the test probe, and a voltage value is measured using a potential difference of the supply current, and a resistance value of the test target is determined from the measured voltage value and the input current value. Substrate inspection apparatus comprising a; control module to be calculated can be provided.

And, according to another aspect of the invention, the inspection probe in contact with the inspection point of the inspection target substrate; A probe socket to which the test probe is detachably coupled and to which a current supply line for supplying a test current to the test probe and a voltage measuring line for measuring a voltage are wired; A main body part in which the probe socket is arranged innumerably at uniform intervals and arrangement in a predetermined region; A jig unit coupled to the main body in a state capable of being disassembled and assembled, and configured to set an inspection probe according to a position of an inspection point of a substrate to be inspected; And a test current is supplied to the pattern of the test target through the test probe, and a voltage value is measured using a potential difference of the supply current, and a resistance value of the test target is determined from the measured voltage value and the input current value. Substrate inspection apparatus comprising a; control module to be calculated can be provided.

Here, the inspection probe may be deflected in the longitudinal direction by the contact pressure when contacting the inspection point of the substrate to be inspected.

In addition, the test probe may be installed such that a pair corresponds to one pattern of the test target substrate.

The control module may include a current supply unit connected to a probe socket and a current supply line to supply a test current to a pattern of a test target board; A voltage measuring unit connected to the probe socket and the voltage measuring line to measure the voltage of the pattern of the substrate under test; An arithmetic processor configured to calculate a resistance value of a pattern of the substrate under test based on the measured voltage of the voltage measuring unit and an input current value of the current supplying unit; And a control unit connected to the current supply unit, the voltage measuring unit, and the operation processor to control the same, compare the measured resistance value calculated from the operation processor with a preset resistance value, and determine whether or not it is normal, and notify the user thereof. do.

In this case, the control module may further include a display unit for receiving the signal from the control unit to display the inspection information of the inspection target substrate.

The main body may form a coupling plate in which a large number of probe sockets are uniformly distributed in a predetermined region.

In addition, the jig portion may form a jig plate having a probe guide hole for guiding the inspection probe according to the shape of the substrate to be inspected and the position of the inspection point.

The present invention according to the above configuration is provided with a probe socket for wiring the current supply line for supplying current and the voltage measurement line for measuring the voltage, the inspection socket for contacting the inspection point of the substrate to be tested By configuring the probes to be detachably coupled, the number of probes used in the substrate inspection apparatus can be reduced to one half, and thus, the structure of the substrate inspection apparatus can be concisely constructed, and the manufacturing cost of the substrate inspection apparatus can be reduced. It can reduce the cost and simplify the maintenance.

In addition, the present invention has the effect of inspecting a substrate having a higher density wiring pattern than the conventional four-terminal probe inspection method by minimizing the inspection point for the inspection target substrate.

1 is a conceptual diagram illustrating a conventional four-terminal substrate measuring method.
2 is a schematic view for explaining a two-terminal substrate inspection apparatus according to a first embodiment of the present invention.
3 is a schematic diagram for explaining a two-terminal substrate inspection apparatus according to a second embodiment of the present invention.
4 is a plan view of a coupling plate of the main body according to the embodiment of the present invention.
Figure 5 is a jig plate plan view of the jig unit according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

(First embodiment)

2 is a schematic view for explaining a two-terminal substrate inspection apparatus according to a first embodiment of the present invention.

Referring to FIG. 2, the substrate inspection apparatus 100 according to the present invention may be largely achieved by a configuration including an inspection probe 110, a probe socket 120, and a control module 140.

First, the test probe 110 will be described as follows. The inspection probe 110 is a conductor contacting the inspection point 161 of the substrate 160 to be inspected and may be manufactured in a thin and long pin shape. In addition, the inspection probe 110 may be made of an elastic body capable of bending deformation and restoration in the longitudinal direction by contact pressure when the inspection probe 110 contacts the inspection point 161 of the substrate 160 to be inspected.

In addition, the inspection probe 110 is detachably coupled to the probe socket 120.

The probe socket 120 is detachably coupled to the test probe 110 at the front end, and the current supply line 121 for supplying the test current to the test probe 110 at the rear end and for measuring the voltage. The voltage measuring line 123 is wired.

In addition, the current supply line 121 and the voltage measurement line 123 allow the inspection current to be supplied to the pattern 163 of the substrate 160 to be inspected through the inspection probe 110, and the potential difference between the supply currents is adjusted. The voltage value is measured, and is connected to the control module 140 which calculates a resistance value of the substrate 160 under test from the measured voltage value and the input current value.

The control module 140 may be connected to the probe socket 120 and the current supply line 121 to supply a test current to the pattern 163 of the substrate 160 to be tested and the probe. The voltage measuring unit 143 and the voltage measuring unit 143 connected to the socket 120 and the voltage measuring line 123 to measure the voltage of the pattern 163 of the test target substrate 160. The calculation processing unit 145 and the current supply unit 141 and the voltage measuring unit 143 which calculate the resistance value of the pattern 163 of the substrate 160 to be tested through the input current values of the voltage and current supply unit 141. And the control unit 145 in connection with the arithmetic processing unit 145, and compares the measured resistance value calculated from the arithmetic processing unit 145 with a predetermined resistance value to determine whether it is normal, and then notifies the user of the control unit 144. It consists of a configuration that includes.

In this case, the control module 140 may further include a display unit 146 that receives the signal from the controller 144 to display the inspection information of the test substrate 160.

In this case, the display unit 146 may be an alarm device and a monitor device.

Referring to the two-terminal measuring principle of the present invention having the above configuration is as follows.

First, the pair of inspection probes 110 come into contact with the inspection points 161 of the substrate 160 to be inspected, respectively. At this time, the inspection points 161 are formed at both ends of the pattern 163 of the substrate to be inspected 160, respectively.

The pair of test probes 110 is connected to the current supply unit 141 of the control module 140 through the current supply line 121, respectively, and when the test supply current for measurement flows from the current supply unit 141, The test current forms a closed circuit circulating through the current supply line 121 along the probe socket 120, the test probe 110, and the test substrate 160 along the +/− ground direction.

At this time, a potential difference is generated between the inspection point 161 and the inspection point 161 of the substrate 160 to be inspected, and the voltage measuring line 123 and the voltage measuring unit 143 for measuring the potential difference are formed. .

The voltage measuring line 123 is wired to the probe socket 120, and the voltage measuring line 123 is connected to the voltage measuring unit 143 installed in the control module 140, thereby providing a potential difference value, that is, a voltage value. Will be available.

In this case, the resistance value R5 of the pattern 163 of the substrate 160 to be obtained may be obtained based on the value of the current for measurement supplied to the substrate 160 to be tested and the voltage value detected by the substrate to be tested 160. It becomes possible.

This can be defined as Ohm's law, which means that the current is proportional to the potential difference between two points and is inversely proportional to the electrical resistance.The magnitude of the voltage is V, the strength of the current I, In the case of R, the relationship of V = IR is established.

That is, the resistance R of the closed circuit formed by the current I supplied from the current supply unit 141 may be defined as a relationship of R = V / I.

In this case, the total resistance R of the closed circuit is R as the sum of the resistances R1 and R4 of the current supply line 121, the resistances R2 and R3 of the voltage measuring line 123, and the resistance R5 of the pattern 163. Can be defined as = R1 + R2 + R3 + R4 + R5.

In this case, the resistances R1 and R4 of the current supply line 121 and the resistances R2 and R3 of the voltage measuring line 123 are previously measured fixed values, and the resistance R5 of the pattern 163 that is a variable value. We can get the value as R5 = R- (R1 + R2 + R3 + R4)

In the same manner as described above, the value of the resistance R5 of the pattern 163 of the substrate under test 160 may be calculated through the operation processor 145, and the value of the resistance R5 calculated by the operation processor 145 may be controlled by the controller. By determining whether the inspection target substrate 160 is defective by determining whether the inspection target 160 is normal or abnormal by comparing with the preset resistance value through 144.

In this case, when the inspection board 160 is determined to be defective, the discrimination information may be displayed on a separate display unit 146, that is, an alarm device or a monitor device.

(Second Embodiment)

Figure 3 is a schematic diagram for explaining a two-terminal substrate inspection apparatus according to a second embodiment of the present invention, Figure 4 is a plan view of the coupling plate of the body portion according to an embodiment of the present invention, Figure 5 is an embodiment of the present invention It is a jig plate top view of the jig | tool part.

3 to 5, the two-terminal substrate inspection apparatus 100 according to the second embodiment of the present invention is largely the inspection probe 110, the probe socket 120, the main body 130, the jig portion 150 and the control module 140 can be achieved by a configuration including.

First, the test probe 110 will be described as follows. The inspection probe 110 is a conductor contacting the inspection point 161 of the substrate 160 to be inspected and may be manufactured in a thin and long pin shape. In addition, the inspection probe 110 may be made of an elastic body capable of bending deformation and restoration in the longitudinal direction by contact pressure when the inspection probe 110 contacts the inspection point 161 of the substrate 160 to be inspected.

In addition, the inspection probe 110 is detachably coupled to the probe socket 120. The probe socket 120 is detachably coupled to the test probe 110 at the front end, and the current supply line 121 for supplying the test current to the test probe 110 at the rear end and for measuring the voltage. The voltage measuring line 123 is wired.

In addition, the probe socket 120 is fixedly coupled to the main body 130. The main body 130 is used as a base structure on which various components of the board inspection apparatus are mounted, and the main body 130 is a coupling plate in which countless probe sockets 120 are uniformly distributed in a predetermined region. 131 is formed.

At this time, the probe socket 120 coupled to the coupling plate 131 is arranged innumerably in a uniform interval and arrangement in the horizontal and vertical direction, between the probe socket 120 and the probe socket 120 The spacing may be provided so that the minimum spacing corresponding to the inspection point of the substrate having the high density wiring pattern is maintained. In this case, coupling holes arranged in a grid shape may be formed in the coupling plate 131 to which the probe socket 120 is coupled.

In addition, the jig unit 150 is coupled to the main body unit 130 in a disassembled and assembled state.

At this time, the jig unit 150 is to be set to the inspection probe 110 in accordance with the position of the inspection point 161 of the substrate to be inspected, the shape of the substrate to be tested 160 and the position of the inspection point 161. The design will be changed according to the structure.

The jig unit 150 forms a jig plate 151 having a probe guide hole 151a through which the inspection probe 110 is guided. The probe guide hole 151a is formed on the substrate 160 to be inspected. Processed according to the shape and position of the inspection point 161, by processing a hole in the vertical or inclined form, the end of the inspection probe 110 is accurately positioned at the inspection point 161 of the substrate 160 to be inspected. You can do that.

In addition, the probe socket 120 is connected to the control module 140 using the current supply line 121 and the voltage measurement line 123.

In this case, the control module 140 allows the inspection current to be supplied to the pattern 163 of the substrate 160 through the inspection probe 110, and measures the voltage value by using the potential difference of the supply current. The resistance value of the substrate under test 160 is calculated from the measured voltage value and the input current value, which is connected to the probe socket 120 and the current supply line 121 to the pattern 163 of the substrate 160 under test. Voltage measurement for measuring the voltage of the pattern 163 of the substrate 160 to be tested by being connected to the current supply unit 141, the probe socket 120, and the voltage measurement line 123 to supply the inspection current. An arithmetic processing unit configured to calculate a resistance value of the pattern 163 of the substrate 160 under test through the unit 143 and the measured voltage of the voltage measuring unit 143 and the input current value of the current supplying unit 141. 145 and the current supply unit 141, the voltage measuring unit 143, and the operation processing unit 145, A comprises a control and arithmetic processing and then comparing the measured resistance with a predetermined resistance value calculated from the (145) determines a normal status, the configuration including the control unit 144 to inform the user.

In this case, the control module 140 may further include a display unit 146 that receives the signal from the controller 144 to display the inspection information of the test substrate 160.

In this case, the display unit 146 may be an alarm device and a monitor device.

Referring to the substrate inspection method using a substrate inspection apparatus according to a second embodiment of the present invention having the above configuration is as follows.

First, the substrate inspection apparatus 100 of the present invention comes into contact with the substrate 160 to be inspected.

In this case, the substrate 160 to be inspected may have a form in which a plurality of substrates 160 having independent patterns 163 are simultaneously mounted and inspected at once.

To this end, the jig plate 150 is provided with a jig plate 151 holed in accordance with the shape, arrangement, inspection point of each substrate, the inspection probe 110 to correspond to the position of the jig plate 151 Is installed.

At this time, one end of the inspection probe 110 is selectively coupled to the probe socket 120 installed in the main body 130, respectively.

That is, the current supply and the voltage measurement are made only through the probe socket 120 to which the test probe 110 is coupled.

The pair of inspection probes 110 are in contact with the pattern 163 of the substrate 160 to be inspected, respectively. In this case, the inspection probes 110 are in contact with the inspection points 161, respectively, and the inspection points 161 are formed at both ends of the pattern 163 of the substrate 160 to be inspected, respectively.

In this case, as a plurality of inspection probes 110 are in contact at the same time, there is a problem that some inspection probes 110 and the inspection point 161 are not contacted due to the difference in length and assembly error between the inspection probes 110. In this case, by pressing between the substrate to be inspected 160 and the substrate inspection apparatus 100, all the inspection probes 110 and the inspection points 161 may be in contact with each other.

In this process, some inspection probes 110 may be deflected in the vertical direction, and such deflection may be returned to its original shape when the pressing force is removed.

In addition, the pair of test probes 110 are connected to the current supply unit 141 of the control module 140 through the current supply line 121, respectively, to allow the test supply current to flow from the current supply unit 141. In this case, the test current takes a current supply line 121 along the +/- ground direction to form a closed circuit circulating through the probe socket 120 and the test probe 110 and the test board 160 on both sides. do.

At this time, a potential difference is generated between the inspection point 161 and the inspection point 161 of the substrate 160 to be inspected, and the voltage measuring line 123 and the voltage measuring unit 143 for measuring the potential difference are formed. .

The voltage measuring line 123 is wired to the probe socket 120, and the voltage measuring line 123 is connected to the voltage measuring unit 143 installed in the control module 140, thereby providing a potential difference value, that is, a voltage value. Will be available. In this case, the resistance value R5 of the pattern 163 of the substrate 160 to be obtained may be obtained based on the value of the current for measurement supplied to the substrate 160 to be tested and the voltage value detected by the substrate to be tested 160. It becomes possible.

In this case, the principle of obtaining the resistance value R5 of the pattern 163 of the substrate 160 is the same as described through the first embodiment of the present invention.

The present invention according to the above configuration is provided with a probe socket for wiring the current supply line for supplying current and the voltage measurement line for measuring the voltage, the inspection socket for contacting the inspection point of the substrate to be tested By configuring the probes to be detachably coupled, the number of probes used in the substrate inspection apparatus can be reduced to one half, and thus, the structure of the substrate inspection apparatus can be concisely constructed, and the manufacturing cost of the substrate inspection apparatus can be reduced. It can reduce the cost and simplify the maintenance.

In addition, the present invention has the effect of inspecting a substrate having a higher density wiring pattern than the conventional four-terminal probe inspection method by minimizing the inspection point for the inspection target substrate.

100: substrate inspection apparatus 110: inspection probe
120: socket for probe 121: current supply line
123: voltage measurement line 130: main body
131: coupling plate 140: control module
141: current supply unit 143: voltage measurement unit
144: control unit 145: arithmetic processing unit
146: display unit 150: jig unit
151: jig plate 151a: probe guide hole
160: inspection substrate 161: inspection point
163: pattern

Claims (8)

An inspection probe 110 in contact with an inspection point 161 of the substrate 160 to be inspected;
The probe for the probe 110 is detachably coupled, the current supply line 121 for supplying a test current to the test probe 110 and the voltage measuring line 123 for measuring the voltage is wired for Socket 120; And
The inspection current is supplied to the pattern 163 of the substrate 160 to be inspected through the inspection probe 110, the voltage value is measured using the potential difference of the supply current, and the measured voltage value and the input current value. A control module 140 configured to calculate a resistance value of the test target substrate 160 from the control unit 140;
Substrate inspection apparatus comprising a.
An inspection probe 110 in contact with an inspection point 161 of the substrate 160 to be inspected;
The probe for the probe 110 is detachably coupled, the current supply line 121 for supplying a test current to the test probe 110 and the voltage measuring line 123 for measuring the voltage is wired for Socket 120;
A main body portion 130 in which the probe socket 120 is disposed innumerably in a predetermined area in accordance with a uniform interval and arrangement;
A jig unit 150 coupled to the main body unit 130 in a state capable of being disassembled and assembled, and configured to set an inspection probe 110 in accordance with a position of an inspection point 161 of the substrate 160 to be inspected; And
The inspection current is supplied to the pattern 163 of the substrate 160 to be inspected through the inspection probe 110, the voltage value is measured using the potential difference of the supply current, and the measured voltage value and the input current value. A control module 140 configured to calculate a resistance value of the test target substrate 160 from the control unit 140;
Substrate inspection apparatus comprising a.
3. The method according to claim 1 or 2,
The inspection probe (110) is a substrate inspection apparatus, characterized in that the bending deformation in the longitudinal direction by the contact pressure when the contact point (161) of the inspection target substrate (160).
3. The method according to claim 1 or 2,
The inspection probe 110 is a substrate inspection apparatus, characterized in that the pair is installed so as to correspond to one of the pattern (163) of the inspection target substrate (160).
3. The method according to claim 1 or 2,
The control module 140,
A current supply unit 141 connected to the probe socket 120 and the current supply line 121 to supply the inspection current to the pattern 163 of the substrate 160 to be inspected;
A voltage measuring unit 143 connected to the probe socket 120 and the voltage measuring line 123 to measure a voltage of the pattern 163 of the substrate 160 to be tested;
An arithmetic processor 145 configured to calculate a resistance value of the pattern 163 of the substrate to be tested 160 through the measured voltage of the voltage measuring unit 143 and an input current value of the current supplying unit 141; And
The control unit is connected to the current supply unit 141, the voltage measuring unit 143, and the operation processor 145 to control them, and compares the measured resistance value calculated from the operation processor 145 with a predetermined resistance value to determine whether it is normal. A control unit 144 configured to notify the user of this;
Substrate inspection apparatus comprising a.
The method of claim 5,
The control module 140 further includes a display unit 146 receiving a signal from the controller 144 to display the inspection information of the inspected substrate 160.
The method of claim 2,
The main body 130 is a substrate inspection apparatus, characterized in that to form a coupling plate (131) in which a myriad of probe sockets (120) are uniformly distributed in a predetermined region.
The method of claim 2,
The jig unit 150 forms a jig plate 151 having a probe guide hole 151a in which the inspection probe 110 is guided according to the shape of the substrate 160 and the position of the inspection point 161. Substrate inspection device characterized in that.

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