KR20120018979A - Liquid crystal display device - Google Patents

Abstract

PURPOSE: A liquid crystal display apparatus is provided to effectively emit heat by utilizing an air layer formed at a separation space. CONSTITUTION: A light guide board(123) is installed on a reflection board(125). An LED(Light Emitting Diode) assembly(129) includes a PCB(Printed Circuit Board) which includes plural LEDs according to the reception light surface of the light guide board. An LED heat emission board(300) includes a first part which is connected with the PCB and second part which is vertically connected with the first part. A backlight unit includes a plural light sheet(121) installed on the light guide board. A liquid crystal panel(110) is located on the backlight unit. A support main(130) includes a horizontal unit. The support main covers the boundary of the backlight unit.

Description

[0001] Liquid crystal display device [0002]

The present invention relates to a liquid crystal display device using an LED as a light source, and more particularly to an efficient heat dissipation design of the LED.

Liquid crystal display devices (LCDs), which are used for TVs and monitors due to their high contrast ratio and are advantageous for displaying moving images, are characterized by optical anisotropy and polarization of liquid crystals. The principle of image implementation by

Such a liquid crystal display is an essential component of a liquid crystal panel bonded through a liquid crystal layer between two side-by-side substrates, and realizes a difference in transmittance by changing an arrangement direction of liquid crystal molecules with an electric field in the liquid crystal panel. do.

However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required in order to display the difference in transmittance as an image. To this end, a backlight including a light source is disposed on the back of the liquid crystal panel.

Here, a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp, and a light emitting diode (LED) are used as a light source of the backlight unit. .

Among them, LEDs are particularly widely used as light sources for displays with features such as small size, low power consumption, and high reliability.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.

As illustrated, a general liquid crystal display device includes a liquid crystal panel 10, a backlight unit 20, a support main 30, a cover bottom 50, and a top cover 40.

The liquid crystal panel 10 is a part that plays a key role in image expression and is composed of first and second substrates 12 and 14 bonded to each other with a liquid crystal layer interposed therebetween.

The backlight unit 20 is provided behind the liquid crystal panel 10.

The backlight unit 20 includes an LED assembly 29 arranged along at least one edge length direction of the support main 30, a white or silver reflecting plate 25 seated on the cover bottom 50, and a reflecting plate ( A light guide plate 23 seated on 25 and a plurality of optical sheets 21 interposed thereon.

At this time, the LED assembly 29 is configured on one side of the light guide plate 23, and the plurality of LEDs 29a emitting white light and the LED PCB (printed circuit board: 29b, hereinafter, PCB) is mounted on which the LED 29a is mounted. ).

The liquid crystal panel 10 and the backlight unit 20 have a top cover 40 surrounding the top edge of the liquid crystal panel 10 and a back surface of the backlight unit 20 in a state where the edges are surrounded by the support main 30 having a rectangular frame shape. Cover cover 50 to cover each is coupled in front and rear are integrated through the support main 30 as a medium.

In addition, reference numerals 19a and 19b denote polarizers attached to the front and rear surfaces of the liquid crystal panel 10 to control the polarization direction of light, respectively.

On the other hand, the LED (29a) is a light emitting device, the temperature is rapidly increased in accordance with the use time, this temperature rise has a feature that is accompanied by a change in brightness. Therefore, one of the most important matters when the LED 29a is used as the light source of the backlight unit 20 is a heat radiation design according to the temperature rise of the LED 29a.

However, in the general liquid crystal display device, the temperature of the LED 29a gradually increases during use since a specific method for rapidly discharging high-temperature heat generated from the LED 29a is not provided. The change in brightness eventually causes a decrease in image quality.

In addition, recently, the liquid crystal display device has a wide range of applications such as portable computers, desktop computer monitors and wall-mounted televisions. It is actively underway.

However, despite efforts to manufacture a liquid crystal display device in a light weight and a thin shape, there are too many components constituting the liquid crystal display device, which hinders the thinness and light weight of the liquid crystal display device.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a liquid crystal display device capable of effectively dissipating high temperature heat generated from an LED.

Another object of the present invention is to provide a thin and lightweight liquid crystal display device.

In order to achieve the object as described above, the present invention is a reflection plate; A light guide plate mounted on the reflection plate; An LED assembly including a plurality of LEDs arranged along the light guide plate incident surface and a PCB on which the plurality of LEDs are mounted; An LED heat sink comprising a first portion in contact with the PCB and a second portion perpendicular to the first portion; A backlight unit including a plurality of optical sheets seated on the light guide plate; A liquid crystal panel positioned above the backlight unit; A horizontal part covering a part of an edge rear surface of the backlight unit, and a support main that surrounds an edge of the liquid crystal panel and the backlight unit perpendicular to the horizontal part; The LCD device includes a top cover covering an upper edge of the liquid crystal panel and coupled to the support main, and a groove is formed at one edge of the support main corresponding to the position of the LED assembly.

Here, the lower side of the LED assembly and the second portion of the LED heat sink are exposed to the outside of the support main through the groove, the second portion is in contact with the top cover.

The LED heat sink includes a third part facing and spaced apart from each other in parallel with the first part, wherein the second part connects the first and third parts, and the first and third parts. The spaced apart areas of define the air layer.

The third portion is in contact with the top cover, and the groove of the support main is an edge groove from which a portion of the horizontal portion and the vertical portion are removed.

An adhesive tape is provided to correspond to the edge groove, and the adhesive tape extends from the top cover to the horizontal portion of the support main.

As described above, according to the present invention, the corner grooves are formed at the corners of one edge of the support main where the LED assembly is located, and the LED heat sink is positioned in parallel with the first part and the first part to which the PCB is attached. By forming a third portion facing each other and a second portion connecting the first and third portions, thereby forming high temperature heat generated from the plurality of LEDs in the spaced apart regions of the first and third portions. By rapidly radiating heat by the air layer, it is possible to quickly and efficiently radiate high-temperature heat to the outside, thereby preventing the problem of shortening the lifespan of LEDs or deteriorating image quality due to luminance change.

In addition, by eliminating the cover bottom, there is an effect that can provide a thin and lightweight liquid crystal display device.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.
2 is an exploded perspective view schematically illustrating a liquid crystal display according to an exemplary embodiment of the present invention.
3 is a schematic cross-sectional view of a partial cross section of FIG. 2 modularized;
4 is a cross-sectional view schematically showing a movement path of heat generated from the LED according to the heat dissipation design of the LED assembly of FIG.
5 is a perspective view schematically showing a cross section of a liquid crystal display according to a second embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of a partial cross section of FIG. 5 modularized;
Figure 7 is a schematic cross-sectional view showing the movement path of heat generated from the LED according to the heat dissipation design of the LED assembly according to a second embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

First Embodiment

2 is an exploded perspective view schematically illustrating a liquid crystal display according to a first embodiment of the present invention.

As illustrated, the liquid crystal display device includes a liquid crystal panel 110, a backlight unit 120, and a top cover 140 and a support main 130 for modularizing the liquid crystal panel 110 and the backlight unit 120. .

Looking at each of them in more detail, the liquid crystal panel 110 plays a key role in image expression, and the first substrate 112 and the second substrate 114 bonded to each other with the liquid crystal layer interposed therebetween. Include.

At this time, although not shown in the drawings under the premise of an active matrix method, a plurality of gate lines and data lines intersect each other and a pixel is defined on an inner surface of the first substrate 112, which is commonly referred to as a lower substrate or an array substrate. Thin film transistors (TFTs) are provided at each intersection to correspond one-to-one to the transparent pixel electrodes formed in each pixel.

An inner surface of the second substrate 114, called an upper substrate or a color filter substrate, may correspond to each pixel, for example, a color filter of red (R), green (G), and blue (B) color, and these. A black matrix is provided around each other to cover non-display elements such as gate lines, data lines, and thin film transistors. In addition, a transparent common electrode covering them is provided.

A polarizer (not shown) for selectively transmitting only specific light is attached to the outer surfaces of the first and second substrates 112 and 114, respectively.

Along the at least one edge of the liquid crystal panel 110, the printed circuit board 117 is connected through a connecting member 116 such as a flexible circuit board or a tape carrier package (TCP) to support the modularization process. The side surface or the back side of the main 130 is properly folded to be in close contact.

When the thin film transistor selected for each gate line is turned on by the on / off signal of the gate driver circuit, the liquid crystal panel 110 transmits the signal voltage of the data driver circuit to the corresponding pixel electrode through the data line. The arrangement direction of the liquid crystal molecules is changed by the electric field between the pixel electrode and the common electrode, indicating a difference in transmittance.

In addition, the liquid crystal display according to the present invention is provided with a backlight unit 120 for supplying light from its rear surface such that the difference in transmittance of the liquid crystal panel 110 is expressed to the outside.

The backlight unit 120 includes an LED assembly 129, a white or silver reflector 125, a light guide plate 123 seated on the reflector 125, and a plurality of optical sheets 121 interposed thereon. Include.

The LED assembly 129 is located at one side of the light guide plate 123 so as to face the light incident surface of the light guide plate 123, and the plurality of LEDs 129a and the plurality of LEDs 129a are mounted at a predetermined interval apart from each other. ).

At this time, the plurality of LEDs 129a include LED chips (not shown) which emit all of the colors of RGB or emit white, and emit white light toward the light incident surface of the light guide plate 123. The plurality of LEDs 129a emit light having the colors of red (R), green (G), and blue (B), respectively, and turn on the plurality of RGB LEDs (129a) at once to generate white light by color mixing. It can also be implemented.

On the other hand, the LED 129a is a light emitting device, the temperature is rapidly increased according to the use time, the temperature rise has a feature that is accompanied by a change in the lifetime and brightness of the LED (129a). Therefore, one of the most important matters when the LED 129a is used as a light source of the backlight unit 120 is a heat dissipation design according to the temperature rise of the LED 129a.

Thus, the backlight unit 120 of the present invention is further provided with an LED heat sink 200, the LED heat sink 200 is composed of a cross-section bent in the form of "b", made of a metal material with excellent thermal conductivity.

Therefore, the high temperature heat generated from the plurality of LEDs 129a is transferred to the LED heat sink 200 to be quickly and efficiently discharged to the outside. As a result, the liquid crystal display of the present invention minimizes the temperature rise due to the use of the LED 129a.

Accordingly, the liquid crystal display of the present invention has a heat dissipation design of the efficient LED assembly 129 by the LED heat sink 200. We will discuss this in more detail later.

The light guide plate 123 into which the light emitted from the plurality of LEDs 129a is incident is spread evenly to a large area of the light guide plate 123 while the light incident from the LED 129a propagates through the light guide plate 123 by a plurality of total reflections. The surface light source is provided to the liquid crystal panel 110.

The light guide plate 123 may include a pattern of a specific shape on the rear surface to supply a uniform surface light source.

Here, the pattern may be configured in various ways, such as an elliptical pattern, a polygon pattern, a hologram pattern, and the like to guide the light incident into the light guide plate 123. The pattern is formed on the lower surface of the light guide plate 123 by a printing method or an injection method.

The reflective plate 125 is positioned on the rear surface of the light guide plate 123, and reflects light passing through the rear surface of the light guide plate 123 toward the liquid crystal panel 110 to improve the brightness of the light.

The plurality of optical sheets 121 on the light guide plate 123 include a diffusion sheet and at least one light collecting sheet, and diffuse or condense the light passing through the light guide plate 123 to provide a more uniform surface to the liquid crystal panel 110. Allow the light source to enter.

The liquid crystal panel 110 and the backlight unit 120 are modularized through the top cover 140 and the support main 130. The top cover 140 has a cross section to cover the top and side edges of the liquid crystal panel 110. The rectangular frame shape bent in a shape of "a", the front cover 140 is opened to display an image implemented in the liquid crystal panel 110.

The support main 130 has a rectangular frame shape and the four edges of the liquid crystal panel 110 and the backlight unit 120 are perpendicular to the horizontal portion 130a and the horizontal portion 130a which surround a part of the edge rear surface of the backlight unit 120. It consists of a vertical portion 130b surrounding the edge.

Accordingly, the rear edge of the backlight unit 120 is supported by the horizontal portion 130a of the support main 130, and the edges of the liquid crystal panel 110 and the backlight unit 120 are surrounded by the vertical portion 130b. .

The support main 130 is fastened to the top cover 140 to integrally modularize the liquid crystal panel 110 and the backlight unit 120.

That is, the liquid crystal panel 110 and the backlight unit 120 of the present invention prevent the detachment of the liquid crystal panel 110 by surrounding the upper and side surfaces of the four edges of the liquid crystal panel 110 by the top cover 140. At the same time, the edge of the support main 130 is surrounded, and the detachment of the backlight unit 120 can be prevented.

This is to replace all of the original role of the existing cover bottom (50 in Figure 1) through the support main 130, it is possible to thin the modular liquid crystal display by removing the cover bottom (50 in Figure 1), Simplifying and reassembling the process has an easy effect.

In addition, due to the deletion of the cover bottom (50 in Figure 1) consisting of a metal material, it is possible to reduce the process cost.

At this time, a groove 130c is formed in the horizontal portion 130a of one edge of the support main 130 where the LED assembly 129 is positioned along the length direction, and the LED assembly 129 and the LED are formed through the groove 130c. The heat sink 200 is assembled to the inside of the vertical portion 130b of the support main 130.

In this case, the top cover 140 may also be referred to as a case top or a top case, and the support main 130 may be referred to as a guide panel or a main support or a mold frame.

In addition, the backlight unit 120 having the above-described structure is generally called a side light method, and according to the purpose, a plurality of LEDs 129a may be arranged on the PCB 129b. In addition, it is also possible to be provided with a plurality of LED assembly 129, respectively, to interpose corresponding to each other along both side edge portions of the support main 130 facing each other.

FIG. 3 is a schematic cross-sectional view of a partial cross-sectional view of FIG. 2, and FIG. 4 is a schematic cross-sectional view showing a movement path of heat generated from an LED according to a heat dissipation design of the LED assembly of FIG. 3.

As shown, a plurality of optical sheets on the reflective plate 125, the light guide plate 123, and the LED assembly 129, the LED heat sink 200, and the light guide plate 123 provided on one side of the light guide plate 123. 121 are stacked to form a backlight unit (120 of FIG. 2).

In addition, a liquid crystal panel 110 including a liquid crystal layer (not shown) is disposed between the backlight unit 120 and the first and second substrates 112 and 114 and the first and second substrates 120 and 120. On each of the outer surfaces of the two substrates 112 and 114, polarizing plates 119a and 119b for selectively transmitting only specific light are attached.

The backlight unit (120 of FIG. 2) and the liquid crystal panel 110 are surrounded by an edge and a back by the support main 130, and the top cover 140 covering the upper edge and the side of the liquid crystal panel 110 is supported by the main main. Coupled to the 130, the liquid crystal panel 110 and the backlight unit (120 of FIG. 2) are integrally modularized.

Meanwhile, although only one LED 129a of the LED assembly 129 is shown in the drawing, a plurality of LEDs 129a are mounted on the PCB 129b at a predetermined interval and receive driving power from the outside.

Here, the PCB 129b is an electronic circuit board that enables mounting and electrical connection of various electronic devices by printing a wiring pattern (not shown) on an insulating layer such as resin or ceramic. The PCB 129b is an epoxy-based FR4 PCB. Or FPCB (flexible printed circuit board), MCPCB can be formed.

The LED assembly 129 is attached to the LED heat sink 200, so that the high temperature heat generated from the plurality of LEDs (129a) to more easily discharge to the outside.

Here, the LED heat sink 200 is composed of a first portion (200a) to which the PCB (129b) is attached and a second portion (200b) formed perpendicular to the first portion (200a), the cross section is bent in the form of "b" In the form of one.

At this time, if one surface of the first portion 200a of the LED heat sink 200 toward the light guide plate 123 is defined as the inner side, the LED assembly 129 is erected on the inner side of the first portion 200a to be adhesive such as a double-sided tape. Attached through a material (not shown), the outside of the first portion 200a is in contact with the vertical portion 130b of the support main 130.

The second portion 200b is vertically bent outward from the first portion 200a.

The LED heat sink 200 is preferably formed of aluminum (Al), an aluminum (Al) having a purity of 99.5%, for example, a metal material having excellent thermal conductivity, and is also black through anodizing treatment. It is preferable that the oxide film of is formed on the surface. Therefore, since the LED heat sink 200 is black, the heat absorption rate is increased, and thus the LED heat sink 200 has a high thermal conductivity.

At this time, in the horizontal portion 130b of one edge of the support main 130 where the LED assembly 129 is located, grooves 130c are formed along the longitudinal direction of the horizontal portion 130b, and the LED heat sink 200 is provided. The second portion 200b is exposed to the outside through the groove 130c of the support main 130, and a part of the second portion 200b is in contact with the top cover 140.

Therefore, the second portion 200b of the LED heat sink 200 blocks a portion of the groove 130c of the support main 130 to form a portion of the rear surface of the liquid crystal display device.

In addition, the lower side of the LED assembly 129 attached to the LED heat sink 200 is exposed to the outside by the groove 130c of the support main 130.

Therefore, some of the high temperature heat generated from the LED (129a) is transferred to the LED heat sink 200 through the PCB (129b) is emitted to the outside, in particular the present invention is the lower side of the LED assembly 129 is the main support ( By being exposed to the outside through the groove 130c of the 130, the LED 129a is in direct contact with the external air, so that some of the high-temperature heat generated from the LED 129a is emitted directly from the LED 129a.

That is, when high temperature heat is generated from the LED 129a as shown in FIG. 4, some heat is directly emitted from the LED 129a to the outside, and some heat is transferred to the LED heat sink 200 through the PCB 129b. It is delivered to the first portion 200a.

Heat transferred to the first portion 200a of the LED heat sink 200 is diffused to the second portion 200b of the LED heat sink 200, and some of the hot heat diffused to the second portion 200b is external air. It is discharged to the outside by the second portion 200b in contact with the outside, and some heat is transferred to the top cover 140 in contact with the outside air in a large area and is discharged to the outside.

Therefore, the high temperature heat generated from the plurality of LEDs 129a is quickly and efficiently released to the outside.

As a result, the liquid crystal display of the present invention minimizes the temperature rise due to the use of the LED 129a, and cannot rapidly dissipate high temperature heat generated from the LED 129a to the outside. The problem that image quality deteriorates can be prevented.

As described above, in the liquid crystal display according to the first embodiment of the present invention, the groove 130c is formed in the horizontal portion 130a of one edge of the support main 130 where the LED assembly 129 is located. A plurality of LEDs are formed by forming the heat sink 200 as a first portion 200a to which the LED assembly 129 is attached and a second portion 200b perpendicular to the first portion 200a and forming part of the rear surface of the liquid crystal display. By dissipating the high temperature heat generated from 129a to the outside while allowing the high temperature heat to be discharged directly from the LED 129a of the LED assembly 129, the high temperature heat is quickly and efficiently discharged to the outside.

In addition, by eliminating the cover bottom (50 in FIG. 1), a thin liquid crystal display device can be provided.

Second Embodiment

FIG. 5 is a perspective view schematically illustrating a cross section of a liquid crystal display according to a second exemplary embodiment of the present invention, and FIG. 6 is a schematic cross-sectional view of a partial cross section of FIG.

Meanwhile, in order to avoid duplicate descriptions, the same reference numerals are given to the same parts that play the same role as the above-described first embodiment, and only the characteristic contents to be described in the second embodiment will be described.

As shown, the liquid crystal display device includes a liquid crystal panel 110, a backlight unit 120, a top cover 140, a support main 130, and an adhesive tape for modularizing the liquid crystal panel 110 and the backlight unit 120. It consists of 150.

Here, the liquid crystal panel 110 is formed with a liquid crystal layer (not shown) interposed between the first and second substrates 112 and 114, and the outer surfaces of the first second substrates 112 and 114, respectively. Polarizing plates 119a and 119b for selectively transmitting only specific light are attached.

The printed circuit board 117 is connected to at least one edge of the liquid crystal panel 110 through a connection member 115 such as a flexible circuit board, so that the side surface of the support main 130 or the backlight unit 120 is modularized. It is rolled up to the back of and closes.

The backlight unit 120 includes a reflective plate 125, a light guide plate 123, and a plurality of optical sheets on the LED assembly 129, the LED heat sink 300, and the light guide plate 123 provided on one side of the light guide plate 123. The 121 are made by stacking.

At this time, the LED heat sink 300 according to the second embodiment of the present invention is formed in a cross-section bent in the form of "U", made of a metal material excellent in thermal conductivity.

Therefore, the high temperature heat generated from the plurality of LEDs 129a is transferred to the LED heat sink 300 to be quickly and efficiently released to the outside. As a result, the liquid crystal display of the present invention minimizes the temperature rise due to the use of the LED 129a.

The backlight unit 120 and the liquid crystal panel 110 are surrounded by edges and rear surfaces by the support main 130, and the top cover 140 covering the upper edge and the side of the liquid crystal panel 110 is supported by the support main 130. Coupled to the liquid crystal panel 110 and the backlight unit 120 is integrally modular.

Here, the support main 130 has four edges perpendicular to the horizontal portion 130a and the horizontal portion 130a surrounding a portion of the edge rear surface of the backlight unit 120, so that the edges of the liquid crystal panel 110 and the backlight unit 120 may be separated. It consists of a vertical portion 130b.

Accordingly, the rear edge of the backlight unit 120 is supported by the horizontal portion 130a of the support main 130, and the edges of the liquid crystal panel 110 and the backlight unit 120 are surrounded by the vertical portion 130b. .

The support main 130 is fastened to the top cover 140 to integrally modularize the liquid crystal panel 110 and the backlight unit 120.

Therefore, the support main 130 replaces all of the original role of the existing cover bottom (50 in FIG. 1), thereby making it possible to thin the modular liquid crystal display by removing the cover bottom (50 in FIG. 1). Simplifying and reassembling the process has an easy effect.

In addition, due to the deletion of the cover bottom (50 in Figure 1) consisting of a metal material, it is possible to reduce the process cost.

In this case, the support main 130 in which the LED assembly 129 is positioned has a structure in which one edge is removed, that is, a portion of the vertical portion 130b and the horizontal portion 130a of one edge is removed and thus the corner groove 133 is disposed. Is formed.

The corner groove 133 is formed along the longitudinal direction of one edge of the support main 130, and the LED assembly 129 and the LED heat sink 300 are assembled into the top cover 140 through the corner groove 133. Is fastened.

At this time, the LED heat sink 300 is fixed to the inside of the top cover 140 by a method such as adhesive through an adhesive material (not shown) such as double-sided tape. In addition, an adhesive tape 150 is provided to correspond to the edge groove 133 of the support main 130 to prevent the LED assembly 129 and the LED heat sink 300 from being detached.

Thus, the liquid crystal display according to the second embodiment of the present invention through the fixed LED heat sink 300 has a heat radiation design of the efficient LED assembly 129. This will be described in more detail with reference to FIG. 6.

As shown in FIG. 6, the LED assembly 129 is attached to the LED heat sink 300 to more easily dissipate high temperature heat generated from the plurality of LEDs 129a to the outside.

Here, the LED heat sink 300 is a first portion 300a to which the PCB 129b is attached, a third portion 300c facing each other by being spaced apart in parallel with the first portion 300a, and the first and second portions 300a. The second part 300b connects the third parts 300a and 300c.

That is, the LED heat sink 300 has a cross section bent in the form of “U”, and the spaced areas of the first and third portions 300a and 300c facing each other define an air layer.

In this case, when the surfaces of the first and third portions 300a and 300c that face each other are defined as the inner side, the outside of the third portion 300c is in contact with the top cover 140, and the LED assembly 129 is the first portion. Standing outside the 300a and attached by an adhesive or the like through an adhesive material (not shown) such as a double-sided tape, the plurality of LEDs 129a are positioned to face the light incident surface of the light guide plate 123.

At this time, the position of the LED heat sink 300 is fixed through the adhesive tape 150 extending from the top cover 140 to the horizontal portion 130a of the support main 130.

The LED heat sink 300 is preferably formed of aluminum (Al), an aluminum (Al) having a purity of 99.5%, for example, a metal material having excellent thermal conductivity, and is also black through anodizing treatment. It is preferable that the oxide film of is formed on the surface. Therefore, since the LED heat sink 300 is black, the heat absorption rate is increased, and thus the LED heat sink 300 has a high thermal conductivity.

Therefore, the high temperature heat generated from the plurality of LEDs 129a of the LED assembly 129 is transferred to the LED heat sink 300 through the PCB 129b to quickly and efficiently transfer the high temperature heat from the LED 129a to the outside. Will be released.

FIG. 7 is a cross-sectional view schematically illustrating a movement path of heat generated from the LED according to the heat dissipation design of the LED assembly according to the second embodiment of the present invention.

As shown, the cross-sections of the first to third portions 300a, 300b, and 300c are bent in a “U” shape so that the first and third portions 300a and 300c are spaced apart from each other. The region of the LED heat sink 300 defining the air layer is transferred to the first portion 300a of the LED heat sink 300 through the PCB 129b some of the high temperature heat generated from the plurality of LEDs (129a).

In addition, some of the hot heat transferred to the first portion 300a is radiated by the air layer between the first and third portions 300a and 300c, and some of the hot heat is diffused to the second portion 300b. do.

At this time, the heat radiated from the first portion 300a of the LED heat sink 300 is about 60% of the high temperature heat generated from the LED 129a, thereby quickly removing heat generated from the LED 129a.

In addition, the blocking of the external air by the adhesive tape 150 is insignificant, and the heat diffused into the second part 300b is released to the outside by contact with the external air, and some heat is transferred to the third part 300c. The heat diffused and transferred to the third portion 300c is transferred to the top cover 140 in close contact with the third portion 300c.

The heat transferred to the top cover 140 is diffused to the entire top cover 140, and the heat of high temperature diffused to the entire top cover 140 is increased in contact with the outside air, whereby the LED (129a) The high heat generated from the heat is quickly released to the outside.

In addition, before some of the high temperature heat generated from the LED 129a is transferred to the LED heat sink 300, the lower side of the LED assembly 129 is connected to the outside air through the edge groove 133 of the support main 130. By contacting, some of the high temperature heat generated from the LED 129a is emitted directly from the LED 129a to the outside.

Therefore, the high temperature heat generated from the plurality of LEDs 129a is released more quickly and efficiently to the outside.

As a result, the liquid crystal display of the present invention minimizes the temperature rise due to the use of the LED 129a, and cannot rapidly dissipate high temperature heat generated from the LED 129a to the outside. The problem that image quality deteriorates can be prevented.

As described above, the liquid crystal display according to the second exemplary embodiment of the present invention forms a corner groove at an edge of one edge of the support main 130 where the LED assembly 129 is located, and the LED heat sink 200 is connected to the PCB. The first portion 300a to which the 129b is attached, the third portion 300c and the first and third portions 300a and 300c which are spaced apart from each other in parallel with the first portion 300a and face each other, are disposed. By forming the second portion 300b to be connected, the high temperature heat generated from the plurality of LEDs 129a is rapidly radiated by an air layer formed in the spaced apart regions of the first and third portions, thereby dissipating the high temperature heat to the outside. It will be released quickly and efficiently.

As a result, the liquid crystal display of the present invention minimizes the temperature rise due to the use of the LED 129a, and cannot rapidly dissipate high temperature heat generated from the LED 129a to the outside. The problem that image quality deteriorates can be prevented.

In addition, by eliminating the cover bottom (50 in FIG. 1), a thin liquid crystal display device can be provided.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

110: liquid crystal panel 112: first substrate, 114: second substrate
119a and 119b: first and second polarizing plates
121: a plurality of optical sheets, 123: light guide plate, 125: reflector, 127: LED
129: LED assembly, 130: support main, 140: top cover, 150: adhesive tape
300: LED heat sink (300a, 300b, 300c: first to third portions)

Claims (8)

A reflector; A light guide plate mounted on the reflection plate; An LED assembly including a plurality of LEDs arranged along the light guide plate incident surface and a PCB on which the plurality of LEDs are mounted; An LED heat sink comprising a first portion in contact with the PCB and a second portion perpendicular to the first portion; A backlight unit including a plurality of optical sheets seated on the light guide plate;
A liquid crystal panel positioned above the backlight unit;
A horizontal part covering a part of an edge rear surface of the backlight unit, and a support main that surrounds an edge of the liquid crystal panel and the backlight unit perpendicular to the horizontal part;
The top cover which covers the upper edge of the liquid crystal panel and is coupled to the support main
And a groove formed at one edge of the support main corresponding to the position of the LED assembly.
The method of claim 1,
The lower side of the LED assembly and the second portion of the LED heat sink is exposed to the outside of the support main through the groove.
The method of claim 1,
And the second portion is in contact with the top cover.
The method of claim 1,
The LED heat sink includes a third part facing each other by being spaced in parallel with the first part, wherein the second part connects the first and third parts.
The method of claim 4, wherein
The spaced apart regions of the first and third portions define an air layer.
The method of claim 4, wherein
And the third portion is in contact with the top cover.
The method of claim 4, wherein
And the groove of the support main is an edge groove from which a portion of the horizontal portion and the vertical portion are removed.
The method of claim 7, wherein
An adhesive tape is provided corresponding to the edge groove, and the adhesive tape extends from the top cover to the horizontal portion of the support main.

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