KR20120005759A - The radiant heat circuit board and the method for manufacturing the same - Google Patents

Abstract

PURPOSE: A radiant heat circuit board and the method for manufacturing the same are provided to improve the thermal property of a heating element by forming radiation slug in the bottom of a pad. CONSTITUTION: An insulating plate(110) comprises a heat dissipation hole(117) which is formed in an area in which a heating element is mounted. A metallic heat dissipation slug is formed by filling the heat dissipation hole. A plurality of circuit patterns(125) are formed on the insulating plate. A heating element mounting pad(130) is formed on the heat dissipation slug. The heat generation element is attached to the heat generation element mounting pad.

Description

The radiant heat circuit board and the method for manufacturing the same

The present invention relates to a heat radiation circuit board and a manufacturing method thereof.

The circuit board includes a circuit pattern on an electrically insulating substrate, and is a substrate for mounting electronic components or the like.

1 is a cross-sectional view of a conventional circuit board.

Referring to FIG. 1, a conventional circuit board 1 includes an insulating plate 10, a circuit pattern portion 20 on which a conductive layer is patterned, and a heating element pad 25.

The circuit board 1 may use an epoxy-based insulating plate 10, may include a through hole 11 to which electronic components are connected, and a circuit pattern formed on the insulating plate 10. The portion 20 is formed of a conductive material.

The heating element pad 25 is formed on the same plane as the circuit pattern portion 20, and the heating element 30 is mounted on the pad 25, and the heating element 30 is connected to the circuit through the wire 35. It is electrically connected to the pattern portion 20.

The heating element 30 may be a light emitting diode (LED) or the like, and the heating element 30 emits severe heat. The heat emitted from the heat generating element 30 raises the temperature of the circuit board 1, causing problems in the malfunction and reliability of the heat generating element 30.

In this case, in the circuit board 1 of FIG. 1, heat emitted from the mounted heating element 30 may not be emitted to the outside due to interference of the insulating plate 10 including the resin.

The embodiment provides a heat dissipation circuit board having a new structure and a method of manufacturing the same.

The embodiment provides a heat dissipation circuit board having improved thermal efficiency and a method of manufacturing the same.

In an embodiment, a heat dissipation circuit board on which a heat generating element is mounted may include an insulating plate having heat dissipation holes formed in an area in which the heat generating element is mounted, a heat dissipation slug of metal formed by filling the heat dissipation holes, and formed on the insulating plate. And a heat generating element mounting pad formed on the plurality of circuit patterns and the heat dissipating slug, to which the heat generating element is attached.

Meanwhile, in the method of manufacturing a heat dissipation circuit board according to an embodiment, the method may include forming and patterning a conductive layer on an insulation plate to form a circuit pattern, forming a heat dissipation hole penetrating the insulation plate, and dissipating the heat dissipation hole. Forming a slug and forming a heating element mounting pad on which the heating element is mounted.

According to the present invention, it is possible to improve the thermal characteristics of the heat generating element while using the resin plate by forming the heat dissipating slug under the pad to which the heat generating element is attached.

In addition, when the light emitting diode is used as a heat generating device due to improved thermal characteristics, the lifespan of the device may be increased and light efficiency may be increased.

1 is a cross-sectional view of a conventional heat dissipation circuit board.
2 is a cross-sectional view of a heat radiation circuit board according to a first embodiment of the present invention.
3 to 8 are cross-sectional views illustrating a first method for manufacturing the heat generating circuit board of FIG. 2.
9 to 11 are cross-sectional views illustrating a second method for manufacturing the heat generating circuit board of FIG. 2.
12 is a cross-sectional view of a heat radiation circuit board according to a second embodiment of the present invention.
13 is a cross-sectional view of a heat radiation circuit board according to a third embodiment of the present invention.
14 is a cross-sectional view of a heat radiation circuit board according to a fourth embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. On the contrary, when a part is "just above" another part, there is no other part in the middle.

The present invention provides a circuit board including a heat dissipation structure in a circuit board using an insulating resin substrate.

Hereinafter, a heat dissipation circuit board according to a first embodiment of the present invention will be described with reference to FIGS. 2 to 11.

2 is a cross-sectional view of a heat radiation circuit board according to a first embodiment of the present invention.

Referring to FIG. 2, the heat dissipation circuit board 100 according to the first embodiment of the present invention may include an insulation plate 110, a circuit pattern 125 formed on the insulation plate 110, and the insulation plate 110. The heating element mounting pad 130 is formed.

The insulation plate 110 may include an epoxy-based insulation resin having a low thermal conductivity (about 0.2 to 0.4 W / mk). Alternatively, the insulation plate 110 may include a polyimide resin having a relatively high thermal conductivity.

 The insulating plate 110 includes a plurality of holes 115 and 117.

The holes 115 and 117 include a plurality of through holes 115 for electrically penetrating an external element and a heat dissipation hole 117 for forming a heat dissipation structure of the heat generating element 160 to be described later.

The heat dissipation slug 150 is embedded in the heat dissipation hole 117.

The heat dissipation slug 150 may be formed to include a metal having high thermal conductivity. For example, the heat dissipating slug 150 may be formed of an alloy of copper and nickel as an alloy including copper. In addition, the heat dissipation slug 150 may be an alloy including silver, aluminum, and the like, which are commonly used for plating.

A plurality of circuit patterns 125 are formed on the insulating plate 110.

The circuit pattern 125 is formed by patterning a conductive layer stacked on the insulating plate 110.

The circuit pattern 125 is formed of a material having high electrical conductivity and low resistance, and may be formed by patterning a copper foil, which is a thin copper layer, as a conductive layer.

The circuit pattern 125 may be silver or aluminum plated with a thin copper layer as a seed layer.

As such, when the circuit pattern 125 is plated, the circuit pattern 125 is plated to the inner wall of the through hole 115 of FIG. 2 so that the circuit pattern 125 may be energized by physical coupling with a plurality of devices or power terminals.

Meanwhile, a heating element mounting pad 130 is formed on the heat dissipation slug 150 in the insulating plate 110.

The heating element mounting pad 130 may be formed by silver or aluminum plating on the heat dissipation slug 150 with the top surface of the heat dissipation slug 150 as a seed layer, and the same as or wider than the top surface of the heat dissipation slug 150. It may be formed to have an area.

The area of the heating element mounting pad 130 is determined according to the area of the heating element 160 mounted on the pad 130, and may be wider than the heating element 160 as shown in FIG. 2.

The heat generating device 160, for example, a light emitting device such as a light emitting diode package is adhered and mounted on the heat generating device mounting pad 130, and the light emitting device package is electrically connected to the circuit pattern 125 by bonding the wire 170. Can be connected. On the other hand, it is apparent that the heating element 160 may be mounted by flip chip bonding.

In this case, as shown in FIG. 2, a conductive layer may be formed under the insulating plate 110 to form a circuit pattern 125 as shown above, and heat from the heat radiating slug 150 may be formed below the heat radiating slug 150. The expansion region 131 may be further formed to emit light to the outside.

The expansion region 130 may have an area larger than that of the heat dissipation slug 150, and may be formed simultaneously with the plating of the circuit pattern 125 like the heating element mounting pad 130.

As such, the heat dissipation slug 150 is formed to be in close contact with the bottom of the heating element mounting pad 130 to penetrate the insulating plate 110, so that the heat emitted from the heating element 160 can be obtained while using an insulating resin substrate having a low thermal conductivity. It can be transferred to the outside to increase heat dissipation efficiency.

Hereinafter, a method of manufacturing the heat dissipation circuit board of FIG. 2 will be described with reference to FIGS. 3 to 11.

3 to 8 are cross-sectional views illustrating a first method for manufacturing the heat generating circuit board of FIG. 2.

First, as shown in FIG. 3, the conductive layer 120 is formed on the insulating plate 110.

The insulating plate 110 and the conductive layer 120 may be formed by thermocompression, and the temperature of thermocompression is determined according to the reaction temperature of the curing agent of the insulation plate 120.

In addition, as shown in FIG. 3, the conductive layer 121 may be further included below the insulating plate 110, and the adhesion of the lower conductive layer 121 and the insulating plate 110 may be formed by thermocompression bonding.

The insulation plate 110 may include an epoxy resin or a polyimide resin without using an expensive ceramic material having high thermal conductivity, and the conductive layers 120 and 121 may include copper having high electrical conductivity and low resistance. It may be copper foil which is a thin thin film to contain.

When the plurality of conductive layers 120 and 121 formed on the upper and lower portions of the insulating plate 110 are copper foils containing copper, a stacked clad laminate (CCL) of FIG. 3 may be used.

Next, as illustrated in FIG. 4, the seed circuit patterns 122 and 123 are formed by etching the upper or lower conductive layers 120 and 121 in a predetermined pattern.

In this case, the seed circuit patterns 122 and 123 may be formed by etching through a photolithography process or by performing a laser process of directly forming a pattern with a laser.

In this case, the seed circuit patterns 122 and 123 may be formed on the upper and lower portions, respectively. In contrast, the seed circuit patterns 122 may be formed only on the upper portion and the seed circuit patterns may be formed only on the region where the through hole 115 is formed on the lower portion. 123 may be formed.

Next, as shown in FIG. 5, a plurality of through holes 115 and a plurality of heat dissipation holes 117 are formed in the insulating plate 110.

The through hole 115 is formed by removing the insulating plate 110 in a region isolated by the seed circuit patterns 122 and 123 by a physical processing method, and the heat dissipation hole 117 is the heating element. It is formed by removing the insulating plate 110 in a region where the mounting pad 130 is formed by a physical processing method.

In this case, the physical processing method may be directly removed by laser processing or formed by drilling.

Next, as shown in FIG. 6, the heat radiation slug 150 is embedded in the heat radiation hole 117.

The heat dissipation slug 150 is formed of a material having a high thermal conductivity having the same area as that of the heat dissipation hole 117, and may be an alloy including copper.

The heat dissipation slug 150 is aligned with the heat dissipation hole 117 and is inserted into the heat dissipation hole 117 by applying heat and pressure.

The heat dissipation slug 150 may be manufactured to have the same area as the area of the heat dissipation hole 117 in advance, and the heat dissipation slug 150 may be manufactured by a mold or a laser cutting method. It may be a surface treated material such as etching.

Next, the heat dissipation slug 150 and the seed circuit patterns 122 and 123 are plated to form the heating element mounting pad 130 and the circuit pattern 125.

In this case, the plating may be performed with silver or aluminum having high conductivity, and plating of the seed circuit patterns 122 and 123 to isolate the through hole 115 may extend to an inner wall of the through hole 115 to extend the through hole. Plating may be performed such that 115 has conductivity.

Upper and lower portions of the heat dissipation slug 150 are plated to have an area equal to or larger than that of the heat dissipation slug 150 to form the heating element mounting pad 130 and the expansion region 131.

The heat generating device 160, for example, a light emitting diode is adhered and mounted on the heat generating device mounting pad 130 of the heat dissipation circuit board 100, and is electrically connected.

Such a heat dissipation circuit board is used as a light source for a backlight or a light source for lighting. In particular, when a light emitting diode having a large heat emission is mounted and used for a light source for backlight or an illumination light source, the heat emitted from the light emitting diode is radiated from the heat dissipating slug 150. By discharging to the outside through a), it is possible to provide a circuit board having high heat dissipation efficiency while using an insulating resin substrate.

Meanwhile, the heat dissipation circuit board of FIG. 2 may be formed by a method different from those of FIGS. 3 to 8.

Hereinafter, another method of manufacturing the heat dissipation circuit board of FIG. 2 will be described with reference to FIGS. 9 to 11.

3 and 4, the heat dissipation circuit board forms seed circuit patterns 122 and 123 on the upper and lower portions of the insulating plate 110, and the process is the same as described above, and thus will be omitted.

Next, as shown in FIG. 9, the insulating plate 110 in the through region and the region in which the heating element etch pad 130a is to be formed are etched by the etching of the seed circuit patterns 122 and 123 by laser etching. The through hole 115 and the heat dissipation hole 177a are formed.

At this time, the through hole 115 is formed to have a side perpendicular to the plane as shown in FIG. 5, the heat dissipation hole 177a may be formed to be inclined at a predetermined angle with respect to the plane, unlike in FIG. 5. .

Such a shape may be formed such that the size of the hole on the upper surface of the insulating plate 110 on which the heat generating element is mounted is smaller than the size of the hole on the bottom surface as shown in FIG. 9, and the shape of the heat dissipation hole 177b as shown in FIG. 10. It may be formed opposite to the heat radiating hole 177a of 9.

Alternatively, the heat dissipation holes 177a and 177b may be formed to have a layered structure.

Next, as shown in FIG. 11, the circuit pattern 125 is formed by performing silver or aluminum plating on the seed circuit patterns 122 and 123 as a seed layer, and the through hole 115 is conductive. Plating is performed on the inner wall of 115).

In addition, the heat dissipation hole 117a is filled by plating to form the heat dissipation slug 150a.

In this case, the inside of the heat dissipation hole 177a may be filled by plating to simultaneously form the pad region 130a extending above and below the insulating plate 110.

In this case, the thermal conductivity may be increased by forming a pad area 130a attached to the heat generating element 160 wider than an area of the heat dissipating slug 150a to secure a wide area for receiving heat.

As described above, a separate heat dissipation slug 150 may be processed and inserted into the heat generating hole 177a as in the first method, and simultaneously formed during plating of the circuit pattern 125, thereby reducing the manufacturing process.

Hereinafter, a heat dissipation circuit board according to various embodiments of the present disclosure will be described with reference to FIGS. 12 to 14.

12 is a cross-sectional view of a heat radiation circuit board according to a second embodiment of the present invention.

Referring to FIG. 12, the heat dissipation circuit board 200 according to the second embodiment of the present invention may include an insulation plate 210, a circuit pattern 225 formed on the insulation plate 210, and an insulation plate 210. The heating element mounting pad 230 is formed.

The insulating plate 210 may include an insulating material made of an epoxy-based material having a low thermal conductivity. Alternatively, the insulating plate 210 may include a polyimide resin having a high thermal conductivity.

 The insulating plate 210 includes a plurality of through holes 215 for electrical penetration with an external device, and alternatively, a plurality of heat dissipation holes 277a including a heat generating structure of the heat generating element 260 which will be described later. 277b, 277c).

In this case, a plurality of heat dissipation holes 277a, 277b, and 277c may be formed at a lower portion of one heating element mounting pad 230, and a plurality of heat dissipation holes 250a, 250b, and 250c may be formed in the lower portion of the heating element mounting pad 230, respectively. The heat dissipation slug 250a, 250b, 250c is embedded.

Each of the heat dissipating slugs 250a, 250b, and 250c may be formed to include a metal having high thermal conductivity, as illustrated in FIGS. 3 to 8, for example, an alloy including copper, and an alloy of copper and nickel. Can be formed. Alternatively, as shown in FIGS. 9 to 11, it may be formed by filling with silver or aluminum plating.

A plurality of circuit patterns 225 are formed on the insulating plate 210, and the circuit patterns 225 may be silver or aluminum plated.

The heating element mounting pad 230 to which the heating element 260 is bonded is formed on the heat dissipating slug 250a, 250b, and 250c, and the heating element mounting pad 230 is simultaneously plated with the circuit pattern 225. Can be formed.

As illustrated in FIG. 12, a plurality of heat dissipating slugs 250a, 250b, and 250c may be formed under the heating element mounting pad 230 to penetrate the insulating plate 210 to dissipate heat.

13 is a cross-sectional view of a heat radiation circuit board according to a third embodiment of the present invention.

Referring to FIG. 13, the heat dissipation circuit board 300 according to the third embodiment of the present invention may include an insulation plate 310, a circuit pattern 325 formed on the insulation plate 310, and the insulation plate as shown in FIG. 2. A heating element mounting pad 330 is formed on the 310.

The insulation plate 310 may include an insulation material made of an epoxy-based material. Alternatively, the insulation plate 310 may include a polyimide resin having high thermal conductivity.

The insulation plate 310 includes a plurality of through holes 315 and a plurality of heat dissipation holes 317.

The heat dissipation hole 317 is filled with a heat dissipation slug 350 as shown in Figure 2, the heat dissipation slug 350 may be formed containing a high thermal conductivity metal as shown in Figure 3 to 8, for example For example, as an alloy containing copper, it may be formed of an alloy of copper and nickel. Alternatively, as shown in FIGS. 9 to 11, it may be formed by filling with silver or aluminum plating.

A plurality of circuit patterns 325 are formed on the insulating plate 310, and may be silver or aluminum plated. A heating element mounting pad 330 to which the heating element 360 is bonded is formed on the heat dissipating slug 350, and the heating element mounting pad 330 may be formed at the same time as the plating of the circuit pattern 325. .

In this case, the heat dissipation circuit board 300 further includes a protective layer 390 that completely covers the circuit pattern 325 and covers all of the upper and lower surfaces of the insulating plate 310.

The protective layer 390 is made of an insulating material including an epoxy resin and the like, and an opening 395 exposing the heating element mounting pad 330 and the extended region 331 under the heat dissipation slug 350. And is formed.

The protective layer 390 protects the circuit pattern 325 from an external environment and electrically insulates the circuit patterns 325 from each other.

As shown in FIG. 13, the heat dissipation slug 350 is formed under the heating element mounting pad 330, and the protective layer 390 is formed on the entire substrate 300. By opening 331, the heat emitted from the heat dissipation slug 350 may be radiated to the outside.

14 is a cross-sectional view of a heat radiation circuit board according to a fourth embodiment of the present invention.

Referring to FIG. 14, the heat dissipation circuit board 400 according to the fourth embodiment of the present invention may include an insulation plate 410, a circuit pattern 425 formed on the insulation plate 410, and the insulation plate as shown in FIG. 2. A heating element mounting pad 430 is formed on the 410.

The insulating plate 410 may include an insulating material made of an epoxy material. Alternatively, the insulating plate 410 may include a polyimide resin having high thermal conductivity.

The insulating plate 410 includes a plurality of through holes 415 and a plurality of heat dissipation holes 417.

The heat dissipation hole 417 is filled with a heat dissipation slug 450 as shown in FIG. 2, the heat dissipation slug 450 may be formed to include a metal having high thermal conductivity as shown in FIGS. 3 to 8. For example, as an alloy containing copper, it may be formed of an alloy of copper and nickel. Alternatively, as shown in FIGS. 9 to 11, it may be formed by filling with silver or aluminum plating.

A plurality of circuit patterns 425 are formed on the insulating plate 410 and may be silver or aluminum plated. A heating element mounting pad 430 is formed on the heat dissipating slug 450 to which the heating element 460 is attached. The heating element mounting pad 430 may be formed simultaneously with the plating of the circuit pattern 425. .

In this case, the heating element mounting pad 430 includes a recess 435 in a region in which the heating element 460 is mounted, as shown in FIG. 14.

As described above, when the concave portion 435 is formed on the adhesive surface of the heating element mounting pad 430, and the heating element 460 is adhered to the concave portion 435, the concave portion 435 is formed from the heating element 460. In addition to an increase in the area for receiving heat, when the heat generating element 460 is a light emitting element, for example, a light emitting diode, light emitted from the light emitting diode is diffusely reflected in a concave region, thereby increasing light efficiency.

The heat dissipation circuit boards 100, 200, 300, and 400 according to various embodiments of FIGS. 12 to 14 may be manufactured by applying the manufacturing method described with reference to FIGS. 3 to 11, and the heat dissipation circuit of FIGS. 2 to 14. The substrates 100, 200, 300, and 400 may be applied to overlap each other.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

Heat Dissipation Circuit Board 100, 200, 300, 400
Insulation Plate 110, 210, 310, 410
Circuit pattern 125, 225, 325, 425
Heat Slug 150, 250, 350, 450
Heating element 160, 260, 360, 460

Claims (10)

In a heat radiation circuit board for mounting a heat generating element,
An insulating plate having heat dissipation holes formed in an area in which the heat generating element is mounted;
A heat dissipation slug formed of a metal filling the heat dissipation hole,
A plurality of circuit patterns formed on the insulating plate and
A heat dissipation circuit board formed on the heat dissipation slug and including a heat generation element mounting pad to which the heat generation element is attached. The method of claim 1,
The circuit pattern includes a copper foil layer that is a seed layer and a heat dissipation circuit board including a plating layer formed by plating the seed layer. The method of claim 1,
The heat dissipation device mounting pad is formed by plating the heat dissipation slug with a seed layer. The method of claim 1,
The heat dissipation slug and the heat generating element mounting pad is formed of the same metal. The method of claim 1,
The anti-air insulation plate includes a plurality of heat dissipation holes and a plurality of heat generating slugs filling the heat generating holes, wherein one heat generating element mounting pad is formed on the plurality of heat dissipating slugs. The method of claim 1,
The heat dissipation circuit board further includes a protective layer formed on the upper and lower surfaces of the insulating plate to cover the circuit pattern.
The protective layer is a heat dissipation circuit board including an opening for opening the lower surface of the heat dissipation slug. Forming and patterning a conductive layer on the insulating plate to form a circuit pattern,
Forming a heat dissipation hole penetrating the insulation plate;
Forming a heat radiation slug to bury the heat radiation hole; and
A method of manufacturing a heat dissipation circuit board comprising the step of forming a heating element mounting pad on which the heat generating element is mounted. The method of claim 7, wherein
Forming the heat dissipation slug,
Preparing a metal slug corresponding to the heat dissipation hole,
And arranging the metal slug in the heat dissipation hole and filling the metal slug with heat and pressure. The method of claim 7, wherein
The manufacturing method of the heat dissipation circuit board,
Plating the circuit pattern further;
The heat dissipation slug and the heating element mounting pad is a method of manufacturing a heat dissipation circuit board to be formed at the same time when the circuit pattern plating. The method of claim 6,
The manufacturing method of the heat dissipation circuit board,
And forming a protective layer on the upper and lower surfaces of the insulating plate so as to cover the circuit pattern, wherein the protective layer is formed to open the lower surface of the heat dissipating slug.

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