KR20110062886A - Particle removal device for a laser processing apparatus and laser processing apparatus haivng the same - Google Patents

Abstract

PURPOSE: A particle removal device for a laser processing device and a laser processing device therewith are provided to eliminate or minimize particles scattered when an object is processed using a laser. CONSTITUTION: A particle removal device for a laser processing device comprises a laser beam head(200). The laser beam head guides a laser beam to an object. The laser beam head comprises a high-pressure air outlet path(220) and a high-pressure air inlet path(230). The high-pressure air outlet path guides high-pressure air to be discharged to the irradiation direction of the laser beam. The high-pressure air inlet path is formed outside the high-pressure air outlet path and guides high-pressure air.

Description

Particle removal apparatus of laser processing equipment and laser processing equipment equipped with the same {PARTICLE REMOVAL DEVICE FOR A LASER PROCESSING APPARATUS AND LASER PROCESSING APPARATUS HAIVNG THE SAME}

The present invention relates to an apparatus for removing particles of a laser processing apparatus and a laser processing apparatus having the same, to improve processing efficiency by suction-removing or at least minimizing particles generated and scattered when processing an object by using a laser, and particle processing. The present invention relates to a particle removing apparatus of a laser processing apparatus and a laser processing apparatus having the same, so as to omit or simplify subsequent processes such as a removal or cleaning process.

Recently, the semiconductor industry has developed a lot, and accordingly, many developments have been made in processing technologies such as cutting, scribing, or patterning substrates such as semiconductor material substrates, piezoelectric material substrates, and glass substrates using lasers. This is being done.

In general, as the degree of integration of a memory semiconductor device increases, factors affecting a device occur. A representative obstacle factor is a particle generated during laser processing.

Some of these particles affect the device depending on the type, and others do not. Particularly, particles generated by processing such as cutting and scrubbing of the substrate during the semiconductor manufacturing process may damage the product itself or adversely affect the product yield.

Therefore, the removal of particles generated by such laser processing must be followed by a subsequent removal or cleaning process. As a method used to remove such particles, there are a washing method, a blowing method, or a method using a scrubber.

First, the washing method refers to a method in which the deionized water, which cleans the surface of the substrate by flowing deionized water from the bottom of the bath, is poured into the bath after the substrate is placed in a bath. Such a washing method has an advantage of not applying any physical force directly to the wafer surface, but it is difficult to completely remove particles physically and chemically fixed to the substrate surface.

Next, in the method using a scrubber, the surface of the substrate is cleaned while sweeping the substrate surface from the center direction to the outside using a brush. However, this method has a problem that when the adjustment of the distance between the brush and the substrate is incorrectly caused fine scratches due to mutual friction or thereby another particle. Also in this manner, as in the above-described manners, there is a problem in that the particles that are physically and chemically fixed to the substrate surface cannot be completely removed.

On the other hand, the blowing method according to the present invention will be described with reference to FIG. 1 is a block diagram schematically illustrating a blowing type laser processing apparatus that removes particles by blowing particles generated during processing from an object to be processed.

As shown in FIG. 1, the particle removal configuration of the laser processing equipment includes a particle 4 generated by the laser 3 separately from the laser head 10 in the object 2 positioned in the stage 1. It is configured to remove from the surface of the object to be processed 2 using the high pressure discharge air 6 supplied from the high pressure generator 5.

However, in the particle removal by the blowing method, there is a problem that the particles may fall into other parts of the surface of the workpiece (substrate), in particular the semiconductor element in the process of scattering the particles by using the discharge air, in the above water washing method As described above, there is a problem in that the particles that are physically and chemically fixed to the surface of the workpiece cannot be blown out completely.

The present invention has been proposed in order to solve the above-mentioned conventional problems, and the particles which are scattered when the workpiece is processed using a laser are immediately sucked off or at least minimized during the scattering process, and are again deposited and fixed to the workpiece. An object of the present invention is to provide a particle removing device of a laser processing device and a laser processing device having the same, which minimizes particles and improves processing efficiency of a processing object.

In addition, the present invention is to remove or minimize the particles generated during processing in the scattering process, to remove or simplify the subsequent process, such as particle removal process or cleaning process particle removal device of the processing equipment and laser processing equipment having the same There is another purpose to provide.

In addition, the present invention removes or minimizes the particles generated during processing in the process of scattering, and at the same time prevent the particles from processing in the processing area of the processing object to remove the particle of the laser processing equipment that can further maximize the processing efficiency And another object to provide a laser processing equipment having the same.

According to a first aspect of the present invention, an apparatus for removing particles generated during laser processing of a workpiece in laser equipment includes a laser beam head for guiding a laser beam to a workpiece. The beam head may include at least one high pressure air discharge passage guiding discharge of the high pressure air toward the laser beam irradiation direction to the object to be processed; And at least one suction passage formed outside the high pressure air discharge passage and configured to guide air to be sucked.

According to a second aspect of the present invention, an apparatus for removing particles generated during laser processing of a workpiece in laser equipment, comprising a laser beam head for guiding a laser beam to the workpiece, wherein the laser beam head is irradiated with a laser beam. A high pressure air discharge passage guiding discharge of the high pressure air through the passage; And at least one suction passage formed outside the high pressure air discharge passage and configured to guide air to be sucked.

According to a third aspect of the present invention, there is provided a laser beam generator for generating a laser beam; An optical system for irradiating a laser beam to a workpiece from the laser beam generation source; A particle removing device according to the first aspect or the second aspect; A high pressure air supply device for providing high pressure air to the high pressure air discharge passage; And it provides a laser processing equipment comprising an air suction device for sucking air through the suction passage.

The end of the suction passage is configured to have a step extending from the end of the high-pressure air discharge passage to the object to be processed, or the ports of the high-pressure air discharge passage and the suction passage are closer to the object toward the outside toward the laser beam to be irradiated It is preferably configured to be formed.

The high-pressure air discharge passage and the suction passage is preferably configured to converge toward the processing point toward the processing target side.

An auxiliary air discharge passage may be further formed at the outermost side of the laser head.

According to the laser processing equipment particle removing device of the present invention as described above, by removing or at least minimize the particles scattered when processing the workpiece during the scattering process to improve the processing efficiency of the object, the processing area of the object It is effective to maximize the processing efficiency by preventing splashing to another area in the.

In addition, according to the present invention, by removing or minimizing the particles generated during processing in the scattering process, it is possible to omit or simplify the subsequent process, such as particle removal process or cleaning process has the effect of improving the overall process speed.

Further objects, features and advantages of the present invention can be more clearly understood from the following detailed description and the accompanying drawings.

Laser processing equipment having a particle removing device according to the present invention, the laser beam generating source for generating a laser beam; An optical system for irradiating a laser beam to a workpiece from the laser beam generation source; A laser beam head accommodating a focusing member constituting the optical system and guiding a laser beam to a workpiece; A high pressure air discharge passage formed in the laser beam head and configured to guide high pressure air in a laser beam irradiation direction; A suction passage formed in the laser beam head outside the high pressure air discharge passage and configured to guide air to be sucked; A high pressure air supply device for providing high pressure air to the high pressure air discharge passage; And an air suction device for sucking air through the suction passage. Here, at least one high pressure air discharge passage may be formed, and at least one suction passage may be formed.

The outer wall end forming the suction passage is characterized in that it protrudes toward the workpiece rather than the end of the wall forming the high-pressure air discharge passage.

In addition, at least one of the high-pressure air discharge passage is characterized in that the discharge through the passage to which the laser beam is irradiated. In addition, at least one of the high-pressure air discharge passage is characterized in that formed on the laser head outside the position where the suction passage is formed.

Hereinafter, a specific embodiment of a particle control device of a laser processing apparatus according to the present invention will be described with reference to the accompanying drawings. Figure 2 is a schematic diagram showing a laser processing apparatus having a particle control apparatus according to an embodiment of the present invention.

As shown in FIG. 2, the particle removing apparatus 100 of the laser equipment according to an embodiment of the present invention includes a laser beam generating source 110 for generating a laser beam and a laser beam from the laser beam generating source 110. In the laser equipment including an optical system for irradiating to, comprising a laser beam head 200 for receiving the focusing member 210 constituting the optical system, and guiding a laser beam to the object, the laser beam head 200 One or more high-pressure air discharge passages 220 formed in the laser beam and guide the discharge of high-pressure air in a laser beam irradiation direction (see a solid arrow); At least one laser beam head 200 formed outside the high-pressure air discharge passage 220 (ie, radially outwardly around the irradiation line to which the laser beam is irradiated) and guides air to be sucked (see the dashed arrow). A suction passage 230 is provided.

In addition, in the particle removing device 100 of the present embodiment, an auxiliary air discharge passage (not shown) may be further formed in the laser head 200 outside the position where the suction passage 230 is formed. Since the configuration of the auxiliary air discharge passage is described in detail in the particle removing device of another embodiment, which will be described later, a description thereof will be omitted. In FIG. 2, reference numeral 250 denotes a protective mirror.

Particle removal apparatus 100 of the present invention is connected to the high-pressure air discharge passage 220, the high-pressure air through the high-pressure air supply device 300 provided outside the laser beam head 200 into the discharge passage 220 To provide.

In addition, the particle removal device 100 of the present invention is connected to the suction passage 230, the high pressure when processing the suction passage 230 through the air suction device 400 provided on the outside of the laser beam head 200 A suction force is provided to the suction passage 230 to suck together particles scattered by the air.

In the drawing, when the high pressure air discharge passage 220 and the suction passage 230 are viewed in front when viewed from the front for the sake of simplicity, at least one of the high pressure air discharge passage 220 and the suction passage 230 is preferable. Preferably, forming a plurality of particles increases the degree of scattering of particles generated during processing, and allows a large amount of particles to escape through the plurality of suction passages, thereby increasing the degree of particle removal and minimizing the amount of remaining particles. .

In addition, the particle removing device 100 of the present invention is the wall end (end or port of the suction passage) 231 forming the suction passage 230, the end of the wall (discharge) forming the high-pressure air discharge passage 220 It is formed to protrude toward the object to be processed more than the wall end 221 of the high-pressure air discharge passage 220 to have a step (Δt) extending downward than the end of the passage (port or port) (221).

In another embodiment of the configuration, in the particle removal device of the present invention, the ports of the high-pressure air discharge passage 220 and the suction passage 230 are configured to be formed closer to the processing object toward the outside with respect to the laser beam to be irradiated do.

Such a configuration allows the processing target area A to have a low pressure in the process of discharging and sucking particles generated during processing of the processing object through the high-pressure air discharge passage 220 and the suction passage 230, while the outside (A1) ) Is relatively higher in pressure than the region A to be processed. Therefore, in addition to the effect of preventing the particles generated in the processing region A from going out of the processing target region (other region) A1, the outer wall end portion 231 forming the suction passage 230 discharges the high pressure air. Since it is formed to protrude more toward the workpiece than the end 221 of the wall forming the passage 220, the particles are prevented from scattering or splashing from the machining area A to the other area A1 of the workpiece, thereby increasing the machining efficiency. Can be further maximized.

Meanwhile, although the high pressure air discharge passage 220 and the suction passage 230 are illustrated as being separately formed symmetrically in FIG. 2, the high pressure air discharge passages may be formed separately as shown in the drawing. And the suction passages are preferably formed in communication with each other.

In other words, FIG. 3 is a plan view of a laser head showing a form in which the high pressure air discharge passage and the suction passage formed in the laser head 200 are formed. As shown in FIG. 3, the high pressure air discharge passage 220 is viewed in a plan view. In this case, the converging shape toward the workpiece (approximate cross-sectional conical shape) (shown in FIG. 3 by a dashed-dotted line) and communicating with the laser head 200 outside from one side, the suction passage 230 also viewed from the plane , And has a form (approximately cross-sectional conical form) (shown as a dotted line when viewed from a plane in FIG. 3) that converges toward the object to be processed and communicates with the laser head 200 outside.

The particle removing device configured as described above is employed in laser processing equipment.

Next, a particle removal apparatus according to another embodiment of the present invention will be described with reference to FIG. 4. Figure 4 is a schematic diagram showing a laser processing apparatus having a particle removal apparatus according to another embodiment of the present invention. Like reference numerals denote the same elements as in the above-described exemplary embodiment, and a detailed description thereof will be briefly or omitted.

As shown in FIG. 4, the particle removing apparatus 500 according to another embodiment of the present invention is configured to irradiate a laser beam from a laser beam generation source 110 generating a laser beam and a laser beam from the laser beam generation source 110. In the laser equipment including an optical system, including a focusing member 210 constituting the optical system, and includes a laser beam head 200 for guiding a laser beam to the object to be processed, is formed on the laser beam head 200 At least one high pressure air discharge passage 510 for guiding discharge of the high pressure air through the laser beam irradiation passage; One or more suction passages 520 formed on the laser beam head 200 outside the high-pressure air discharge passage 510 (that is, radially outward with respect to the irradiation line to which the laser beam is irradiated) and guide air to be sucked. It is provided.

In addition, in the particle removing device 500 of the embodiment, the auxiliary air discharge passage 530 may be further formed in the laser head 200 outside the position where the suction passage 520 is formed.

The particle removal device 500 of the present invention is also connected to the high pressure air discharge passage 510 as described above, and discharged through a high pressure air supply device (not shown) provided outside the laser beam head 200. The high pressure air is provided to the passage 510, and is connected to the suction passage 520, and is processed at the suction passage 520 through an air suction device (not shown) provided outside the laser beam head 200. A suction force is provided to the suction passage 520 to suck together particles scattered by the air.

In the drawing, when the suction passage 520 and the auxiliary air discharge passage 530 are viewed from the front for the sake of simplicity, four suction passages 520 and two auxiliary air discharge passages 530 are shown. As shown in FIG. 3.

In addition, the particle removal device 500 of the present invention is a high pressure air discharge passage (510). Ports of the suction passage 520 and / or the auxiliary air discharge passage 530 are configured to be formed closer to the object to be processed toward the outside with respect to the laser beam to be irradiated. In this manner, in the process of discharging the high-pressure air and sucking the air including the particles, the region to be processed has a low pressure, while the outside thereof has a relatively high pressure as compared with the region to be processed. Therefore, in addition to the effect of preventing the particles generated in the processing area from going out to the processing area (other area), the auxiliary air discharge passage 530 functions as an air curtain, so that the particles are different from the processing area of the processing object. By preventing scattering or splashing into the area, the processing efficiency can be further maximized.

The particle removing device according to another embodiment of the present invention configured as described above may be employed in laser equipment capable of discharging particles to the outside at the same time as laser processing.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes within the scope not departing from the technical spirit of the present invention are possible in the art. It will be evident to those who have knowledge of.

1 is a block diagram schematically illustrating a blowing type laser processing equipment for removing particles by blowing particles generated during processing in a conventional laser processing equipment from a processing object.

Figure 2 is a schematic diagram showing a laser processing equipment having a particle control apparatus according to an embodiment of the present invention.

3 is a plan view of a laser head showing one embodiment in which a high pressure air discharge passage and a suction passage are formed in the laser head;

Figure 4 is a schematic diagram showing a laser processing apparatus having a particle removal apparatus according to another embodiment of the present invention.

* A brief description of the main drawing codes *

100, 500: particle removal device 200: laser head

210: focusing member 220, 510: high pressure air discharge passage

230, 520: air suction passage 300: high pressure air discharge device

400: air suction device 530: auxiliary air discharge passage

Claims (11)

As a device for removing particles generated during laser processing of the object in the laser equipment, It includes a laser beam head for guiding the laser beam to the workpiece, The laser beam head At least one high pressure air discharge passage guiding discharge of the high pressure air toward the laser beam irradiation direction toward the object; And And at least one suction passage formed outside the high pressure air discharge passage and configured to guide air to be sucked. Particle removal device for laser equipment. As a device for removing particles generated during laser processing of the object in the laser equipment, It includes a laser beam head for guiding the laser beam to the workpiece, The laser beam head A high pressure air discharge passage guiding discharge of the high pressure air through the laser beam irradiation passage; And And at least one suction passage formed outside the high pressure air discharge passage and configured to guide air to be sucked. Particle removal device for laser equipment. The method according to claim 1 or 2, The end of the suction passage is extended to the side of the object to be processed than the end of the high-pressure air discharge passage is configured to have a step Particle removal device of laser processing equipment. The method according to claim 1 or 2, Ports of the high-pressure air discharge passage and the suction passage is configured to be formed closer to the processing object toward the outside with respect to the laser beam to be irradiated Particle removal device of laser processing equipment. The method according to claim 1 or 2, The high-pressure air discharge passage and the suction passage are configured to converge toward the processing point toward the processing target side Particle removal device of laser processing equipment. The method according to claim 1 or 2, An auxiliary air discharge passage is further formed on the outermost side of the laser head. Particle removal device of laser processing equipment. A laser beam generating source for generating a laser beam; An optical system for irradiating a laser beam to a workpiece from the laser beam generation source; Particle removal apparatus according to claim 1 or 2; A high pressure air supply device for providing high pressure air to the high pressure air discharge passage; And An air suction device for sucking air through the suction passage; Laser processing equipment. The method of claim 7, wherein The end of the suction passage is extended to the side of the object to be processed than the end of the high-pressure air discharge passage is configured to have a step Laser processing equipment. The method of claim 7, wherein Ports of the high-pressure air discharge passage and the suction passage is configured to be formed closer to the processing object toward the outside with respect to the laser beam to be irradiated Laser processing equipment. The method of claim 7, wherein The high-pressure air discharge passage and the suction passage are configured to converge toward the processing point toward the processing target side Laser processing equipment. The method of claim 7, wherein An auxiliary air discharge passage is further formed on the outermost side of the laser head. Laser processing equipment.

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