KR20110039018A - Optical printed circuit board within connector unit - Google Patents

Abstract

PURPOSE: An optical printed circuit board is provided to directly connect another optical printed circuit board by including female and male connector units. CONSTITUTION: A base board(110) includes a light waveguide. A connector unit(130) is connected to the end of the light waveguide and is formed on one side of the base board. The connector unit is comprised of a female connector or male connector.

Description

Optical Printed Circuit Board within Connector Unit

The present invention relates to an optical printed circuit board having a connector unit.

Printed circuit boards (PCBs), which are commonly used, are used for electrical signal transmission by inserting various components by coating a substrate on which a copper thin film circuit is implemented as an electrical PCB. Such a conventional electrical PCB has a problem in signal transmission because the electrical signal transmission capability of the substrate does not match the processing capability of the component, which is an electrical element. In particular, these electrical signals are sensitive to the external environment and noise is generated, which is a great obstacle for electronic products requiring high precision. Complementary to this, instead of metallic circuits such as copper in electrical PCBs, optical PCBs used by optical waveguides have been developed, enabling the production of high-precision high-tech equipment that is more stable, such as interference and noise.

1A is a conceptual diagram illustrating a structure of a conventional optical printed circuit board. Referring to this, in the conventional optical printed circuit board, the passive optical device 6 including the active optical device 5, the optical connection block 1, and the optical waveguide 10 are formed for the optical connection. In particular, a separate printed circuit board 3 for mounting the optical transmission and reception elements 5, 6, 7, and 8 is formed, the optical connection block 1, the optical print path substrate 4, the light emitting element And the light receiving elements 5 and 6 are connected by the guide pins 2. However, in such a conventional structure, noise may occur in a line connecting electrical signals between the separate printed circuit board 3 and the optical printed circuit board 4, and the optical printed circuit board 4 may be manufactured to manufacture an optical connection block. Alignment between the light emitting element 5, the light receiving element 6, and the optical connection block 101 or the optical waveguide 10 in the optical connection block 1 and the optical printed circuit board 4 in the process of connecting to (1). An error inevitably occurs, resulting in a loss of light. In addition, as the guide pin 2 is used, problems of deviation or deformation due to vibration or temperature change in use occur.

Referring to FIG. 1B, this illustrates an example of implementing a three-dimensional coupling structure by connecting two or more optical PCBs described with reference to FIG. 1A.

The optical PCB of the conventional structure is implemented in a board (Board) shape, as described above in Figure 1a, the optical waveguide 10 is formed therein, and the optical fiber is embedded therein, each substrate optical connection block (1) is formed, and the guide pin 2 is protruded to the upper part, and it connects with the light emitting and light receiving element later. As illustrated, in order to connect two or more boards B, the boards are coupled to each other using an interconnection module 20 composed of an optical fiber and a ferrule 21 as shown. However, in order to have an interconnection module for connecting each of these optical PCBs, an additional space for inserting the module inside the substrate has to be formed, which complicates the manufacturing process and additionally attempts to connect through the interconnection module. Bar, as well as the mechanical strength is lowered, there is a restriction in the spatial constraints and the shape of the coupling to combine each board.

The present invention has been made to solve the above problems, an object of the present invention is to provide a direct connection between the optical printed circuit board having a male / male connector unit in one region of the optical printed circuit board including an optical waveguide therein In this way, it is possible to provide an optical printed circuit board capable of realizing the general purpose of application by enabling the connection, and to facilitate the connection and to implement a variety of connection methods of vertical and horizontal connection.

In order to solve the above problems, the present invention is a base substrate including an optical waveguide therein; It is connected to the distal end of the optical waveguide, it is possible to provide an optical printed circuit board comprising a; connector unit formed on one surface of the base substrate.

In particular, the connector unit described above is characterized in that it is formed of a female connector or a male connector.

Furthermore, the optical printed circuit board according to the present invention is preferably embedded in the base substrate, and comprises an optical transmitter or optical receiver connected to the other end of the optical waveguide.

In particular, the optical printed circuit board preferably further includes a support unit for supporting the optical waveguide forming portion.

The support unit may be formed to have a structure in which the optical waveguide is disposed on the upper surface of the support unit or accommodated therein, and in particular, a space other than the optical waveguide inside the connector unit or the inside of the support unit is connected. It may be formed to be filled with a thermosetting resin.

In addition, it is preferable that the optical transmitter or the optical receiver connected to the other end of the optical waveguide is mounted with a lower structure than the surface of the base substrate. For this purpose, the base substrate on which the optical transmitter or the optical receiver is mounted is the printed circuit board. It is more preferable to provide an array pattern region having a step lower than the surface of the.

In addition, the light transmitting unit or the light receiving unit may be formed so that the thermosetting resin is filled in a region outside the connection space of the optical waveguide connected therein.

According to the present invention, a male / female connector unit is provided in one region of an optical printed circuit board including an optical waveguide therein, so that direct connection between the optical printed circuit boards is possible, thereby facilitating easy connection and vertical and horizontal. By implementing various connection methods of connection, there is an effect that can realize the universality of application.

In particular, the board-to-board direct connection eliminates the need for additional interconnection modules, reducing material costs and overcoming spatial constraints.

In addition, due to the improved reliability of the optical transmitter or the optical receiver, constraints caused by temperature or mechanical impact on the printed circuit board can be removed. When the optical transmitter or the optical receiver is formed, an array pattern area having a stepped concave pattern is provided on the base substrate to facilitate mounting of the transceiver module automatically arranged so that the arrangement of the array between the optical connection module and the transmitter / receiver module can be easily achieved. It can increase the precision and increase the efficiency of the alignment work.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. In the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and duplicate description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The present invention is to provide an optical printed circuit board having a structure that allows a direct connection between each board, having a connector unit that can form a three-dimensional connection structure through the connection between the optical printed circuit board do.

2A, which is a conceptual diagram illustrating a connection structure of an optical printed circuit board according to the present invention.

The optical printed circuit board according to the present invention includes a base substrate 110 including an optical waveguide 120 therein and a connector unit 130 as an optical connector formed on one surface of the base substrate. In particular, the connector unit 130 may have a main body 131 buried in the substrate, and the outer surface of the main body 131 may have a female connector 132 or a male connector 133. Therefore, the optical printed circuit board according to the present invention may have one or more connector portions, and each connector unit may be provided with a female connector or a male connector evenly to form a structure in which each board can be directly coupled. It is desirable to be able to.

Referring to FIG. 2B, this illustrates an example of implementation of various connector units embedded in a substrate according to the present invention.

Connector unit according to the present invention, as shown, (a) the structure is formed of a structure in which the male connector (C1) and female connector (C2) are each connected by an optical waveguide, (b) the connector unit is connected by an optical waveguide All of the structure is formed of the male connector (C1), (c) the connector unit connected to the optical waveguide may be formed in various ways, such as all of the structure formed of the female connector (C2).

In particular, the structures are all buried in the substrate, and the optical printed circuit board may be configured such that only the connection portions of the male and female connectors are exposed to the surface of the substrate. This minimizes the space of the connection portion of the optical printed circuit board that is directly connected to each other, it is possible to realize the ease and robustness of the coupling.

In addition, each of the connector units C1 and C2 is connected to the optical waveguide 120, so that the optical waveguide connected to the inside of the connector unit is removed from the manufacturing process of the printed circuit board. It is more preferable to secure a bonding force by filling a thermosetting resin (such as an epoxy resin). In particular, the thermosetting resin such as epoxy resin can withstand the mechanical pressure and heat applied in the manufacturing process of the printed circuit board, thereby ensuring the mechanical strength to increase the reliability of the product.

In addition, the optical waveguide formed by implementing the optical waveguide and the like in each of the above-described structures in the present invention may be formed including a support unit 200 for supporting the main body of each connector unit. The support unit may be formed in a structure that accommodates the optical waveguide therein, or may be arranged on the surface of the support unit to form a structure to support it from the bottom to the mechanical structure of the overall optical waveguide integrated connector unit The strength can be enhanced. The support unit 200 may serve to protect a relatively weak optical waveguide from heat and pressure applied during the PCB manufacturing process. In addition, even in a structure for accommodating the optical waveguide therein, it is preferable to fill the inside of the support unit 200 with a thermosetting resin. This allows the optical waveguide to be stably fixed to secure the mechanical strength of the overall structure.

Figure 2c shows another application example of an optical printed circuit board having a connector unit according to the present invention.

As shown, (a) the optical transmission circuit (Tx) is formed at the other end connected to the optical waveguide and the connector unit (C1) is buried in the base substrate of the optical printed circuit board, it is formed (b The other end connected to the connector unit C2 and the optical waveguide may be formed to have a structure connected to the optical receiver Tr. Of course, the connect unit may be applied to a male / female connector. In addition, it may be formed by further comprising a support unit 200 in FIG. 2b. In addition, a portion of the connector unit connected to the optical waveguide of the optical transmitter Tx or the optical receiver Tr may be filled with a thermosetting resin to increase the mechanical strength of the coupling, and the thermosetting resin may be filled in the support unit. May be as described above.

Particularly, in the optical printed circuit board accommodating the above-described structure, the optical transmitter Tx and the optical receiver Tr are buried in the base substrate, but the base substrate has an array pattern having a step of lower structure than the surface thereof. In addition, the bottom surface of the array pattern may be formed such that the surface of the light transmitting unit Tx or the light receiving unit Tr is exposed.

That is, the part where the connector unit is formed is used as a place to be connected to another substrate, but the light transmitting part (Tx) or the light receiving part (Tr) is formed at a later light transmitting element (for example, semiconductor laser, etc.) or light receiving element ( For example, a photodiode or the like forms an arrangement pattern (step structure) so that the transmission / reception module may be coupled so that the transmission / reception module may be combined without the need for a separate arrangement.

An application example of the coupling method of the structure in which the above-described arrangement pattern is formed and the substrate on which the connector unit is formed according to the present invention will be described with reference to FIG. 3.

As shown, considering the method of connecting the three printed circuit boards having a three-dimensional coupling structure by combining the three substrates (B1, B2, B3), first, obtain the connector unit (C1), and the optical waveguide inside The connector unit C2 of the second substrate B2 is coupled to the connector unit C1 formed on both sides of the first substrate B1 having an optical waveguide, and an optical waveguide at the other end where the connector unit of the second substrate is not formed. The light receiving part Tr to be connected is formed. The surface of the light receiving part Tr is buried in the second substrate, and is formed in a structure exposed to the lower surface of the array pattern region P having a step. The array pattern region P is formed in a shape having a stepped structure lower than that of the surface of the second substrate, and the receiving module 320 is automatically arrayed and inserted into the light receiving unit Tr without a separate array. ) Can be combined.

In addition, the other end of the first substrate B1 is coupled to the connector unit C3 of the third board B3 to another connector unit C1 ', and the other end connected to the connector unit C3 of the third board by an optical waveguide. The optical transmitter Tx is connected thereto. An array pattern region P having a concave step as described above is formed at a portion to which the optical transmitter Tx is connected, and in the array pattern region P, the transmitting module 310 is configured to transmit the optical transmitter Tx. Automatically aligned to and can be combined. In addition, the transmission and reception module 310 is inserted into the step of the array pattern area to be mounted at a height equal to or lower than the surface of the entire printed circuit board, so that the strength of its own bonding strength can be increased to enhance the reliability of the entire product do.

As described above, the optical transmitter, the optical receiver, and the connector unit may further include a configuration such as the support unit 200 supporting the connection structure of the optical waveguide and a thermosetting filler material.

According to the present invention, it is possible to freely implement the horizontal or vertical connection of the optical printed circuit board with a connector unit, further comprising a thermosetting filling or support unit for enhancing the coupling strength of the connector unit and the optical waveguide. In this case, a more stable optical printed circuit board can be realized.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the described embodiments of the present invention, but should be determined not only by the claims, but also by those equivalent to the claims.

FIG. 1A illustrates a structure of a conventional conventional optical printed circuit board, and FIG. 1B illustrates a connection structure of at least one optical printed circuit board.

Figure 2a is a working state diagram showing a connection structure of an optical printed circuit board having a connector unit according to the present invention, Figures 2b and 2c shows various modified embodiments of the connector unit according to the present invention.

3 is an operational state diagram of an optical printed circuit board using the connector unit according to various embodiments of the present disclosure.

Claims (9)

A base substrate including an optical waveguide therein; A connector unit connected to the distal end of the optical waveguide and formed on one surface of the base substrate; Optical printed circuit board comprising a. The method according to claim 1, The connector unit is an optical printed circuit board, characterized in that formed of a female connector or a male connector. The method according to claim 2, An optical printed circuit board buried in the base substrate, the optical printed circuit board including an optical transmitter or optical receiver connected to the other end of the optical waveguide. Following claim 2 or 3, The optical printed circuit board, And a support unit for supporting the optical waveguide forming portion. The method according to claim 4, The support unit, And an optical waveguide disposed on an upper surface of the support unit or accommodated therein. The method according to claim 5, And a space other than an optical waveguide connected to the inside of the connector unit or the inside of the support unit is filled with a thermosetting resin. The method of claim 3, And an optical transmitter or optical receiver connected to the other end of the optical waveguide in a structure lower than the surface of the base substrate. The method of claim 7, The base substrate equipped with the optical transmitter or optical receiver, And an array pattern region having a step lower than a surface of the printed circuit board. The method of claim 7, The optical transmitter or optical receiver, An optical printed circuit board comprising a thermosetting resin filled in an area outside a connection space of an optical waveguide connected therein.

Images