KR20110026376A - Decompression drier and decompression dry method - Google Patents

Abstract

PURPOSE: A decompression drier and a decompression dry method are provided to implement desired film property in a substrate by selecting processes performing decompression dry process of a coating film. CONSTITUTION: In a decompression drier and a decompression dry method, a chamber(224) accommodates a target substrate(G). A maintaining unit is installed in the chamber and supports the target substrate. A first lifting unit(264) lifts up the maintain unit. An airflow control part(260) is installed in the lower part of the maintaining unit. A second lifting unit(278) lifts up the airflow control part.

Description

DECOMPRESSION DRIER AND DECOMPRESSION DRY METHOD}

The present invention relates to a reduced pressure drying apparatus and a reduced pressure drying method for applying a drying treatment under reduced pressure to a film (coating film) of a coating liquid formed on a substrate to be processed.

For example, in the manufacture of FPD (flat panel display), a predetermined film is formed on a substrate to be processed, such as a glass substrate, and then a photoresist (hereinafter referred to as a resist), which is a processing liquid, is applied to form a resist film. The circuit pattern is formed by a so-called photolithography step in which a resist film is exposed to correspond to the circuit pattern and developed.

In such a photolithography step of FPD production, a reduced pressure drying device is used in order to dry a coating film of a resist liquid applied on a substrate to be processed, such as a glass substrate, prior to prebaking.

The conventional representative pressure reduction drying apparatus 50 is, for example, as described in Patent Literature 1, and has a lower chamber 51 in the form of a tray having a top surface or a low bottom container, and an airtightness on an upper surface of the lower chamber. And a lid-shaped upper chamber 52 configured to be in close contact or fit. A stage 53 is disposed in the lower chamber, and the substrate G is placed horizontally through the fixing pin 54 on the stage, and then the chamber is closed (by adhering the upper chamber to the lower chamber) to dry the vacuum. (See Fig. 23).

In this type of reduced pressure drying process, the vacuum is discharged in the chamber by an external vacuum pump through the exhaust port 55 provided at the bottom of the lower chamber. By this vacuum evacuation, the pressure in the chamber changes from the conventional atmospheric pressure state to a reduced pressure state, and under this reduced pressure state, the solvent (thinner) evaporates from the resist coating film on the substrate, and the deteriorated layer (hard layer) on the surface of the resist coating film. Is formed. Then, the pressure reduction drying process is terminated at the time when a predetermined time has elapsed since the start of the reduced pressure drying or when the set pressure is reached. For this purpose, the inert gas (for example, nitrogen gas or air) is blown out or diffused | released rather than the purge photo provided in the corner in a lower chamber, and the pressure in a chamber is returned to atmospheric pressure. Thereafter, the upper chamber is lifted and the chamber is opened to take out the substrate.

Japanese Patent Laid-Open No. 2000-181079

By the way, in recent years, the glass substrate used for FPD etc. is enlarged and the chamber which accommodates a glass substrate is enlarged also in the pressure reduction drying processing unit.

For this reason, the volume in a chamber increased and time was required for pressure reduction to a predetermined pressure. Moreover, since the quantity of the resist liquid apply | coated on the board | substrate increases, it requires a long time until the resist liquid dries uniformly over the board | substrate whole surface, and there existed a subject that the production efficiency fell.

In response to this problem, the applicant of the present application forms a airflow flowing in one direction near the upper surface of the substrate by providing a rectifying member in the chamber, so that the drying process on the substrate processing surface can be performed in a shorter time. An apparatus and a reduced pressure drying method are proposed (Japanese Patent Application No. 2009-172834).

However, since the drying time and the generation | occurrence | production condition of a dry stain vary with the processing conditions, such as the kind of resist liquid and film thickness, when performing several types of processing conditions in one chamber, it is necessarily good in a short time for all the board | substrates. It was not possible to form a film.

That is, in order to perform favorable film formation (drying process) with respect to all the board | substrates with which processing conditions differ, it is necessary to change the height of the board | substrate arrange | positioned in a chamber according to processing conditions at least. It was insufficient to cope with all the processing conditions.

For example, depending on the kind of resist liquid and the film thickness, in the case where the space below the substrate is narrow in the chamber, transfer traces by members below the substrate tend to occur in the resist film.

In order to prevent the occurrence of such transfer traces, it is preferable to raise the position of the substrate in the chamber and to separate it from the chamber bottom surface.

However, when the substrate is separated from the chamber bottom surface, the rectifying member provided in the chamber does not function sufficiently, a gap is formed on the back of the substrate, and sufficient airflow cannot be formed on the substrate, and the drying process cannot be performed in a short time. In addition, there is a problem that dry spots are likely to occur in the resist film due to airflow passing through the back side of the substrate (the gap between the substrate and the rectifying member).

In addition, there is a correlation between the residual film ratio of the resist pattern and the pattern cross-sectional shape and the line width. The higher the residual film ratio, the swelling of the shoulder portion of the resist pattern and the narrower the line width. The shoulder of the falls and the line width widens in the reverse tapered shape. In general, the former pattern characteristics having a high residual film ratio are preferred for miniaturization of the device, but the latter pattern characteristics having a low residual film ratio may be preferred when the wiring is crossed in a multilayer wiring structure. Therefore, either the decompression drying process with a high residual film rate or the decompression drying process with a low residual film rate is selected according to the specification of a device. In either case, it is possible to obtain the device performance in which the resist coating film after the reduced pressure drying process uniformly exhibits desired film quality characteristics in plane.

The present invention has been made under the above circumstances, and is a reduced pressure drying apparatus for performing a drying treatment of a treatment liquid on a substrate to which a treatment liquid is applied and forming a coating film, wherein the plurality of treatment targets having different treatment conditions are different. Provided are a reduced pressure drying apparatus and a reduced pressure drying method capable of shortening a drying time of a processing liquid and performing good film formation on a substrate, respectively.

In addition, the present invention enables a selective conversion between a process of rapidly performing a reduced pressure drying process on a coating film on a substrate to be processed and a process of gently performing the film, and the desired film quality characteristics of the substrate on the substrate. Provided is a reduced pressure drying apparatus and a reduced pressure drying method for uniformly obtaining in-plane.

In order to solve the said subject, the pressure reduction drying apparatus which concerns on this invention is a pressure reduction drying apparatus which performs the pressure reduction drying process of the said processing liquid with respect to the to-be-processed substrate to which the processing liquid was apply | coated, and forms a coating film. A chamber for accommodating and forming a processing space, a holding part installed in the chamber to hold the substrate to be processed, first lifting means for lifting and lowering the holding part, and an air flow control part provided below the holding part; And a second elevating means for elevating and moving the air flow controller, an exhaust port formed in the chamber, and an exhaust means for exhausting the atmosphere in the chamber from the exhaust port.

According to such a structure, the airflow formed in a chamber can be controlled by changing the height of the holding part which hold | maintains a to-be-processed board | substrate, and the height of an airflow control part during a pressure reduction drying process.

This makes it possible to perform a very suitable drying treatment depending on the processing conditions even if the processing conditions such as the type and the film thickness of the resist liquid differ depending on the substrate to be treated, thereby shortening the drying time of the resist liquid and forming a good film. Can be carried out.

In addition, the pressure reduction drying apparatus of the present invention is a pressure reduction drying apparatus for drying a film of a coating liquid formed on a substrate to be processed under a reduced pressure, and includes a pressure reducing chamber for receivably receiving the substrate, and a holding holding the substrate in the chamber. An inert gas supply unit having a first air supply port provided on one side of the holding unit in the chamber in a horizontal first direction and supplying an inert gas into the chamber through the first air supply port; An exhaust port provided in a second region except a first region between the first air supply port and the holding portion, the exhaust unit for evacuating the inside of the chamber through the exhaust port, and ejected from the first air supply port Flow of inert gas so that a majority of the inert gas passes over the holder and the substrate to reach the exhaust port And an airflow controllable switchable between the first mode for regulating the air flow and the second mode for substantially releasing the regulation of the airflow route to the inert gas.

The pressure reduction drying method according to the present invention is a pressure reduction drying method for forming a coating film by subjecting the substrate to which the treatment liquid is applied to the substrate to be treated with the pressure reduction drying method to form a coating film. Holding the substrate to be processed in a portion; raising the holding portion by the first elevating means to bring the substrate to be held close to the ceiling of the chamber; Performing a step of depressurizing the processing space in the chamber, and moving the air flow control part by the second elevating means after the predetermined time has elapsed to bring the air flow control part closer to the substrate to be processed held by the holding part. do.

The pressure reduction drying method according to the present invention is a pressure reduction drying method for forming a coating film by subjecting the substrate to which the treatment liquid is applied to the substrate to be treated with the pressure reduction drying method to form a coating film. And a step of holding the substrate to be processed in the portion. Moving the holding portion down by the first elevating means to bring the substrate to be processed closer to the air flow control portion; depressurizing the processing space in the chamber by the exhausting means; A step of moving the holding portion holding the substrate to be processed and the rectifying member up and down by the first lifting means and the second lifting means while keeping the distance from each other and stopping at a predetermined position in the chamber is executed. do.

The pressure reduction drying method according to the present invention is a pressure reduction drying method for forming a coating film by subjecting the substrate to which the treatment liquid is applied to the substrate to be treated with the pressure reduction drying method to form a coating film. Holding the substrate to be processed in a portion; raising the holding portion by the first elevating means to bring the substrate to be held close to the ceiling of the chamber; Depressurizing the processing space in the chamber, and after a predetermined time elapses, the air flow controller is moved upward by the second elevating means to bring the air flow controller close to the substrate to be processed held by the holding part. The step of supplying an inert gas into the chamber by the air supply means is performed.

The pressure reduction drying method according to the present invention is a pressure reduction drying method for forming a coating film by subjecting the substrate to which the treatment liquid is applied to the substrate to be treated with the pressure reduction drying method to form a coating film. A step of holding the substrate to be processed in the portion, a step of depressurizing the processing space in the chamber by the exhaust means, and after the predetermined time has elapsed, the holding portion is moved downward by the first elevating means, To the air flow control unit and supplying an inert gas into the chamber by the air supply means, and after a predetermined time elapses, a retaining unit holding the substrate to be processed and the retaining unit maintain the distance from each other. In this state, the step of raising and lowering by the first elevating means and the second elevating means is performed to stop at a predetermined position in the chamber.

The pressure reduction drying method according to the present invention is a pressure reduction drying method for forming a coating film by subjecting the substrate to which the treatment liquid is applied to the substrate to be treated with the pressure reduction drying method to form a coating film. A step of holding the substrate to be processed in a portion, moving the holding portion down by the first elevating means to bring the substrate to be close to the airflow control portion, and the processing space in the chamber by the exhaust means. A step of depressurizing, a step of supplying an inert gas into the chamber by the air supply means, and after a predetermined time elapses, the holding portion and the rectifying member holding the substrate to be processed are kept at a distance from each other. And moving up by the first elevating means and the second elevating means to stop at a predetermined position in the chamber.

By carrying out such a method, even if the processing conditions such as the type and the film thickness of the resist liquid differ depending on the substrate to be treated, it is possible to perform a very suitable drying treatment according to the processing conditions, thereby shortening the drying time of the resist liquid and Film formation can be performed.

In addition, the vacuum drying method of the present invention is provided on one side of the holding portion in the chamber in a pressure-reducing chamber for receivably receiving the substrate, a holding portion for placing the substrate in the chamber, and a horizontal first direction. An inert gas supply unit having a first air supply port and supplying an inert gas into the chamber through the first air supply port, and a second region other than a first region between the first air supply port and the holding unit in the intestine; A reduced pressure drying method for drying a film of a coating liquid formed on a substrate to be processed under a reduced pressure using a reduced pressure drying apparatus having an exhaust port provided in an area and having an exhaust portion for evacuating the inside of the chamber through the exhaust port. Most of the inert gas ejected from the first air supply port passes through the holding portion to reach the exhaust port. To a second mode in which substantially releases the regulation of the air flow route of the first mode and the inert gas for regulating the route of an inert gas stream is selectively converted to.

According to the present invention, when the airflow control unit selects the first mode, a large portion (preferably most) of the inert gas supplied from the first air supply port into the chamber during the decompression drying process flows in one direction on the substrate, Since the solvent volatilized from the coating film is quickly transferred to the air stream of the inert gas, decompression drying is accelerated and rapid and short pressure drying process is possible, and the effect of rapid pressure drying on the film quality of the coating film on the substrate is in-plane. It can be obtained uniformly.

In addition, when the airflow control section selects the second mode, since the airflow of the inert gas is not restricted in the chamber, particularly around the holding section and the substrate, the vacuum induction immediately after the start of the decompression drying process or the end of the decompression drying process is completed. Not only can purging be efficiently performed, but it is also possible to supply an inert gas into the chamber without forming a one-way airflow on the substrate during the vacuum drying process. Thereby, slow and long time vacuum drying process can also be performed stably and favorably, and the effect of slow pressure drying on the film | membrane characteristic of the coating film on a board | substrate can be acquired uniformly in surface.

According to the present invention, there is provided a pressure-sensitive drying apparatus for performing a drying treatment of a treatment liquid on a substrate to which a treatment liquid has been applied to form a coating film, wherein the treatment liquid is applied to a plurality of substrates having different treatment conditions. A reduced pressure drying apparatus and a reduced pressure drying method capable of shortening the drying time and achieving good film formation can be obtained.

Further, according to the present invention, it is possible to selectively convert between a process of rapidly performing a reduced pressure drying process on a coating film on a substrate to be processed and a process of slowly performing it, and in any of the reduced pressure drying processes, Desired film quality characteristics can be obtained uniformly in plane.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the whole structure of the coating apparatus provided with the pressure reduction drying apparatus which concerns on this invention.
FIG. 2 is a side view of the coating device of FIG. 1. FIG.
3 is a plan view of one embodiment of a pressure reduction drying apparatus according to the present invention.
4 is a cross-sectional view taken along the line AA of FIG. 3.
5 is a cross-sectional view taken along the line BB of FIG. 3.
Fig. 6 is a flow showing the flow of operation of the reduced pressure drying apparatus according to the present invention.
7 is a cross-sectional view for explaining a state transition of the pressure reduction drying apparatus according to the present invention.
8 is a cross-sectional view for explaining a state transition of the reduced pressure drying apparatus according to the present invention.
FIG. 9 is a partially exploded side view showing the configuration of a resist coating apparatus for manufacturing FPD in one embodiment. FIG.
Fig. 10 is a plan view showing the structure of the resist coating apparatus.
FIG. 11 is a diagram illustrating a configuration example of an air supply system in the resist coating unit of the embodiment. FIG.
FIG. 12 is a diagram illustrating an example of a configuration of an exhaust system in the resist coating unit of the embodiment. FIG.
It is a partial cross-sectional plan view which shows the structure inside a chamber in the resist coating unit of embodiment.
FIG. 14A is a longitudinal cross-sectional view taken along the line II in FIG. 13 when the first mode is selected by the air flow controller. FIG.
FIG. 14B is a longitudinal cross-sectional view taken along the line II in FIG. 13 when the second mode is selected by the air flow controller.
Fig. 15A is a longitudinal sectional view of the II-II line in Fig. 13 when the first mode is selected by the air flow controller.
Fig. 15B is a longitudinal sectional view of the II-II line in Fig. 13 when the second mode is selected by the air flow controller.
Fig. 16A is a plan view showing the parts in the chamber and the air flow state immediately after the start of the vacuum drying treatment.
Fig. 16B is a longitudinal sectional view showing various parts of the chamber and the airflow state immediately after the start of the decompression drying process.
Fig. 17A is a plan view showing the parts inside the chamber and the air flow state when the first mode is selected during the decompression drying process.
Fig. 17B is a longitudinal sectional view showing the parts inside the chamber and the air flow state when the first mode is selected during the decompression drying process.
18 is a longitudinal cross-sectional view illustrating the correspondence of an airflow control unit with respect to clearance adjustment on a substrate.
Fig. 19 is a plan view showing the parts and the air flow state when the case where an inert gas is supplied into the chamber in the second mode during the vacuum drying process is selected.
Fig. 20 is a longitudinal sectional view showing the parts and the airflow state when purging the chamber with inert gas at the end of the decompression drying process.
FIG. 21A is a longitudinal cross-sectional view showing the arrangement and operation of the device in the embodiment using the block structure of the stage and the lift pin. FIG.
Fig. 21B is another longitudinal sectional view showing the device configuration and operation of the embodiment using the block structure of the stage and the lift pins.
It is a top view which shows the structure of the apparatus of embodiment which provides an exhaust port under a stage.
It is a longitudinal cross-sectional view which shows the apparatus structure and operation | movement of embodiment which provides an exhaust port under a stage.
It is sectional drawing which shows schematic structure of the conventional pressure reduction drying unit.

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment which concerns on this invention is described based on FIG. The pressure reduction drying apparatus of the present invention can be applied to a pressure reduction drying unit in a coating apparatus for forming a resist film on a substrate to be processed in a photolithography step.

As shown to FIG. 1, FIG. 2, the application apparatus 100 is the resist coating unit 112 which has the nozzle 122, and the pressure reduction drying unit 114 on the support stand 110 in order of a process process. It is arranged along the side line. A pair of guide rails 116 are attached to both sides of the support 110, and the substrate G is formed of a resist coating unit 112 by a pair of transport arms 118 that move in parallel along the guide rails 116. ) Can be conveyed to the reduced pressure drying unit 114.

The resist coating unit 112 has a nozzle 122 as described above, and the nozzle 112 is fixed in a suspended state from the gate 120 fixed on the support 110. The nozzle 112 is supplied with a resist liquid R, which is a processing liquid, from a resist liquid supply means (not shown), and is provided from one end of the substrate G that passes through the gate 120 by the transfer arm 118. The resist liquid R is applied over the other end.

In addition, the pressure reduction drying unit 114 has a low bottom container-shaped lower chamber 124 having an upper surface opened, and a lid-shaped upper chamber 126 configured to be in close contact with airtightness on the upper surface of the lower chamber 124. Has)

As shown in FIG. 1, FIG. 3, the lower chamber 124 is substantially square, and the plate-shaped stage 130 (holding part) for horizontally mounting and holding the board | substrate G horizontally is arrange | positioned at the center part. . The upper chamber 126 is disposed so as to freely move up and down the stage 130 by the upper chamber moving means 128, the upper chamber 126 is lowered during the vacuum drying process, the lower chamber 124 The substrate G placed on the stage 130 by being in close contact with each other is brought into a state of being accommodated in the processing space.

On the other hand, as shown in Figs. 4 and 5, the stage 130 can be moved up and down by, for example, a lifting device 194 (first lifting means), which is a ball screw mechanism using a motor as a driving source. have.

3 and 4, an exhaust port 134 is provided on the side of the substrate G. As shown in FIG. More specifically, the exhaust ports 134 are provided at two locations near one side of the bottom surface of the lower chamber 124. An exhaust pipe 152 is connected to each exhaust port 134, and each exhaust pipe 152 communicates with a vacuum pump 148 (exhaust means). In the state where the upper chamber 126 is covered by the lower chamber 124, the processing space in the chamber can be reduced by a vacuum pump 148 to a predetermined degree of vacuum.

In the chamber, the air supply port 132 is provided on the substrate side opposite to the exhaust port 134 with the substrate G interposed therebetween. As shown in FIGS. 3 and 4, the air supply port 132 is provided on the bottom surface of the substantially rectangular lower chamber 124 near one side where the exhaust port 134 is provided and another side opposite to each other. It is. Inert gas (for example, nitrogen gas) is supplied from the air supply port 132 into the chamber, and the atmosphere in the chamber is purged. As shown in FIG. 4, the air supply pipe 142 connected to the air supply port 132 is connected to the inert gas supply part 136 (air supply means).

The supply of the inert gas from the air supply port 132 starts when the pressure in the chamber reaches a predetermined value (for example, 400 Pa or less), or after a predetermined time has elapsed since the inside of the chamber was depressurized. This is to maintain the air flow in the chamber in which the flow rate decreases due to the reduced pressure, and contribute to shortening the time of the reduced pressure drying process.

On the other hand, in order to always maintain a stable airflow during the decompression drying process, the supply of inert gas may be started before or at the same time as the decompression of the chamber.

Moreover, the block member 160 is arrange | positioned under the edge part of the board | substrate G on the air supply 132 side as an airflow control part. Moreover, between the air supply 132 and the exhaust port 134, the block member 161 is arrange | positioned as the airflow control part below the left and right both sides of the board | substrate G, respectively.

As shown in FIGS. 4 and 5, these block members 160 and 161 can be accommodated in the receiving port 124a formed in the bottom surface of the lower chamber 124.

Moreover, these block members 160 and 161 are movable up and down by the elevating apparatus 164 (2nd raising / lowering means) which consists of a ball screw mechanism which uses a motor as a drive source, for example.

That is, the block members 160 and 161 are moved up and down by the elevating device 164, and are arranged in the space inside the chamber, so that the block members 160 and 161 function as the air flow controller (rectifying means).

In addition, the block members 160 and 161 as an airflow control part may be a separate body in this way, or may be provided in unit (c-shape).

In addition, side bar members 162 are formed on the left and right sides of the block members 160 and 161 to form walls on the left and right sides of the substrate G, and to suppress the flow of inert gas to the substrate side. have.

This side bar member 162 is formed in a plate shape, for example, as shown, and is installed so that the upper end surface may contact the upper chamber 126, and to block the space of the left-right side of the board | substrate G, for example. do. Or the side bar member 162 may be provided so that the upper end surface may not contact the upper chamber 126, and may block the space of the left-right side of the board | substrate G. As shown in FIG.

In addition, the side bar member 162 is not limited to a plate shape, but may be provided in the shape which fills the space of the left-right side of the board | substrate G. As shown in FIG.

In addition, although the length of the side bar member 162 in the airflow direction is formed longer than the length of the left-right side of the board | substrate G in order to make it easy to form an airflow on the board | substrate G, FIG. 3, FIG. As shown in the figure, the end portion 162a (particularly, the exhaust port 134 side) may be provided so as not to contact the chamber inner wall 124b. Also in this case, a part of the space on the left and right sides of the substrate G is blocked, and the flow of the inert gas toward the substrate side can be sufficiently suppressed.

In addition, not only the example shown in the figure, but each side bar member 162 is formed in the length which the both ends contact | connects the chamber inner wall which mutually opposes, and the space | interval of the left-right side of the board | substrate G is interrupted | blocked (filling) ) May be a configuration.

Subsequently, the operation of the coating device 100 configured as described above will be described based on FIGS. 6 and 7.

First, when the board | substrate G is carried in and puts on the conveyance arm 118, the conveyance arm 118 moves on the rail 116, and passes under the gate 120 of the resist coating unit 112. . At that time, in the nozzle 122 fixed to the gate 120, the resist liquid R is discharged to the substrate G that moves below, and the resist liquid is directed from one side of the substrate G to the other side. (R) is apply | coated (step S1 of FIG. 6).

On the other hand, at the time point (coating end position) in which the resist liquid was applied over the entire surface of the substrate G, the substrate G is in a state located below the upper chamber 126 of the pressure reduction drying unit 114.

Subsequently, the substrate G is placed on the stage 130 of the reduced pressure drying unit 114 and covered by the upper chamber 126 which moves downward by the upper chamber moving means 128 from above. And the board | substrate G is accommodated in the process space formed by closing the upper chamber 126 with respect to the lower chamber 124 (step S2 of FIG. 6).

When the lower chamber 124 is closed by the upper chamber 126, as shown in FIG. 7A, the stage 130 is moved upward to the upper position in the chamber by driving of the elevating device 194. Then, the substrate G stops in a state close to the chamber ceiling (step S3 in FIG. 6). At this time, the block members 160 and 161 are in contact with the bottom of the lower chamber 124.

In this state, the vacuum pump 148 is operated so that the air in the processing space is sucked from the exhaust port 134 through the exhaust pipe 152, and the pressure is reduced until the atmospheric pressure of the processing space becomes a predetermined vacuum state (Fig. 6). Step S4).

Here, the upper surface of the substrate G is close to the chamber ceiling, and the upper surface of the substrate G is in a state in which almost no flow of atmosphere occurs. As a result, the resist liquid R formed on the substrate G is naturally dried (preliminary drying) under reduced pressure, and generation of traces of transfer, orthotolosis, and protruding is suppressed.

When the air pressure in the chamber reaches a predetermined value (for example, 400 Pa or less), or when a predetermined time elapses from the depressurization start (step S5 in FIG. 6), the stage 130 and the block members 160 and 161 are necessary. As it moves up or down, it stops at a predetermined position in the chamber.

Here, although the height position of the board | substrate G in a chamber is determined based on processing conditions, such as a kind of resist liquid, a film thickness, and a drying time, at least the block members 160 and 161 are the edge of the board | substrate G. Underneath it, it will be in the state near the board | substrate G (step S6 of FIG. 6).

In the example shown in FIG. 7B, in step S6, the position of the stage 130 does not change, and only the block members 160 and 161 are raised by the lifting device 194, and the substrate in the stationary state ( G) is disposed close to the bottom.

Moreover, the inert gas supply part 136 is driven, the inert gas of predetermined flow volume is supplied from the air supply port 132, and this drying process is started (step S7 of FIG. 6). In addition, the timing which starts supplying this inert gas to a chamber is not limited after the lifting movement of the stage 130 and the block members 160 and 161 in step S6 as mentioned above, You may transfer the lifting movement. Alternatively, the inert gas may be supplied and started while the stage 130 and the block members 160 and 161 move up and down.

Here, since the side bar member 162 is provided in the side of the board | substrate G, the gap of the side of the board | substrate G does not exist in most cases. In addition, since the block members 160 and 161 are provided below the board | substrate G, the side surface of the block member 20 carries the inert gas supplied from the air supply 132 above the board | substrate G. It functions as an airflow control unit leading to the

Therefore, the inert gas supplied from the air supply port 132 forms an air flow flowing in one direction above the substrate, and is exhausted from the exhaust port 134.

As a result, the drying speed of the resist liquid R coated on the upper surface of the substrate is improved, and the vacuum drying process can be performed in a short time, and dryness is satisfactory without drying spots.

In this main drying process, when the decompression drying process ends after a predetermined time elapses (step S8 in FIG. 6), the upper chamber 126 is moved upward by the upper chamber moving means 128, and the substrate G is moved. The silver is carried out from the vacuum drying unit 114 toward the next processing step.

On the other hand, in the flow of FIG. 6, at the time of the drying process, the block members 160 and 161 are lifted by the elevating device 164 to be in a state near the substrate G (stage 130). Although airflow is formed in the upper surface of a board | substrate, in this invention, it is not limited to the form.

That is, the air flow formed in the chamber is controlled by moving the stage 130 and the block members 160 and 161 to the appropriate height positions, respectively, by processing conditions such as the type of the resist liquid R and the film thickness. can do. For example, when it is desired to change the amount of airflow flowing in the upper surface of the substrate during the present drying process, for example, the following steps can be realized.

In addition, since the step of preliminary drying which performs pressure reduction drying in the state which brought the board | substrate G close to the chamber ceiling part is not necessarily required depending on a process condition, the said predrying step is abbreviate | omitted in the following description.

When the substrate G coated with the resist liquid is placed on the stage 130 of the vacuum drying unit 114, the processing space is closed by the upper chamber 126. In addition, the stage 130 holding the substrate G is moved downward.

As shown in FIG. 8A, the block members 160 and 161 are placed in the circumferential edge portion of the substrate G held by the stage 130 in a state accommodated in the receiving opening 124a. The upper ends of the 160 and 161 are in close proximity.

In addition, air in the processing space is sucked from the exhaust port 134, and the pressure is reduced until the atmospheric pressure of the processing space becomes a predetermined vacuum state. On the other hand, the timing of the decompression start may be either before, after, or during the movement of the stage 130 downward as described above after the chamber is closed.

In addition, the inert gas is supplied from the air supply port 132 into the chamber. Here, as shown, since a large space is formed above the substrate, a large amount of inert gas flows in one direction near the upper surface of the substrate, and the present drying process is started.

On the other hand, the timing at which the inert gas is started to be supplied into the chamber is before or after the stage 130 and the block members 160 and 161 are moved up and down to the position where the substrate G is to be dried according to processing conditions. You can go anywhere on the go.

When the drying process in the state shown in FIG. 8 (a) has elapsed for a predetermined time, the stage 130 and the block members 160 and 161 are shown in FIG. 8 (b) in a state where the distance between them is maintained. Ascending in the chamber at the same time and stop at a predetermined position.

Here, since the upper space of the board | substrate G is narrower as shown in figure, the flow volume of the airflow which flows near the upper surface of the board | substrate G decreases, and this drying process continues with a small flow volume.

On the other hand, the control for raising and lowering the stage 130 and the block members 160 and 161 in the decompression drying process in this way is not limited to the form of the control described with reference to FIG. 8 as described above, and it depends on the processing conditions. You may change it arbitrarily. In addition, it is preferable that the height position of the stage 130 and the block members 160 and 161 in a chamber during pressure reduction drying is set in detail according to process conditions, and drive control is carried out.

As mentioned above, according to 1st Embodiment which concerns on this invention, in the chamber by changing the height of the stage 130 holding the board | substrate G, and the height of the block members 160 and 161 between pressure reduction drying processes. The air flow formed is controlled.

As a result, even if the processing conditions such as the type and the film thickness of the resist liquid R differ depending on the substrate to be treated, a very suitable drying treatment can be performed according to the treatment conditions, and the drying time of the resist liquid R can be shortened. On the other hand, good film formation can be performed.

In addition, in the said embodiment, although the example provided with the air supply port 132 and the inert gas supply part 136 was shown, in this invention, it is not limited to this, The air supply port 132 and the inert gas supply part 136 are shown. The configuration may not be provided. In this case, the block member 160 as an airflow control part is provided in the space below the edge part of the board | substrate of the opposite side with the board | substrate G hold | maintained at the stage 130 with respect to the exhaust port 134.

That is, the airflow can be formed in the chamber in this drying process only by the exhaust treatment from the exhaust port 134 without supplying air, and the resist liquid R on the upper surface of the substrate is caused by the airflow flowing in one direction above the substrate. ), The drying speed can be improved, and a reduced pressure drying treatment can be performed in a shorter time.

In addition, in the said embodiment, although two exhaust ports 134 were shown below the board | substrate G as an exhaust port, the number and arrangement | sequence (layout) are not limited.

In addition, although the exhaust port 134 showed the example formed in the bottom surface of the process space, it is not limited to that and may be formed in the chamber inner wall etc., for example.

In addition, although the shape of the exhaust port 134 showed the round shape, it is not limited to this, Other shapes, such as a long hole and a square, may be sufficient.

In addition, although the air supply port 132 showed the example formed in the bottom surface of the process space, it is not limited to this and may be provided in the inner wall part of the lower chamber 124, etc., for example.

In addition, although the shape of the air supply port 132 showed the rectangular shape of one longitudinal length, it is not limited to this, Other shapes, such as a round shape and a long hole, may be sufficient, The number is not limited.

Alternatively, the exhaust port 134 and the air supply port 132 may be nozzle-type inlets instead of holes provided in the chamber, respectively.

EMBODIMENT OF THE INVENTION Hereinafter, 2nd preferable embodiment of this invention is described with reference to an accompanying drawing.

9 and 10 show another configuration example of a resist coating apparatus for manufacturing FPD to which the reduced pressure drying apparatus or the reduced pressure drying method according to the second embodiment of the present invention is applicable.

In the resist coating device 200 according to the second embodiment, the resist coating unit 212 and the reduced pressure drying unit 214 are provided on the support 210. The pressure reduction drying unit 14 is a pressure reduction drying apparatus according to the second embodiment of the present invention. Since the coating apparatus 200 which concerns on 2nd Embodiment is the same as the coating apparatus 100 of said 1st Embodiment except some structures, such as an airflow control part, as mentioned later, the overlapping description of the same member is abbreviate | omitted. do.

In the second embodiment, as described later, the resist coating unit 212 has a rapid and short time suitable for obtaining film quality characteristics of a high residual film ratio (for example, 99% or more of the residual film ratio) with respect to the resist coating film on the substrate G. Both the reduced pressure drying process and a gentle long time reduced pressure drying process suitable for obtaining a film quality characteristic of a low residual film ratio (for example, a residual film ratio of 95% or less) can be selectively performed. Desired resist film quality characteristics can be obtained uniformly in plane.

In addition, when the pressure reduction drying process of 1 time (for one board | substrate) is complete | finished by the pressure reduction drying unit 214, the chamber opening / closing mechanism 228 raises the upper chamber 226, and makes it chamber release state, and the conveyance arm 218 is there. ) Accesses, receives the processed board | substrate G from the stage 230, carries it out, and conveys the board | substrate G to the prebaking unit (not shown) which performs the prebaking which is a next process.

Below, the detailed structure and effect | action of the pressure reduction drying unit 214 are demonstrated.

As shown in FIG. 10, the lower chamber 224 has a rectangular shape in plan view. Inside the lower chamber 224, four (or four sets) air supply ports are adjacent to the chamber wall portions 224 (1), 224 (2), 224 (3), and 224 (4) of the four sides. (232 (1), 232 (2), 232 (3), 232 (4)) are installed and four (or four) exhaust ports 234 (1), 234 (2), 234 (3) and 234 (4) are provided.

11 shows an example of the air supply system in this reduced pressure drying unit 214. The air supply ports 232 (1), 232 (2), 232 (3) and 232 (4) have a common inert gas source 240 having an inert gas tank 236 and a blower (or compressor) 238. To the gas supply pipes 242 (1), 242 (2), 242 (3) and 242 (4), respectively. In the middle of the gas supply pipes 242 (1), 242 (2), 242 (3), and 242 (4), flow control valves 244 (1), 244 (2), 244 (3) and 244 (4) And on-off valves 246 (1), 246 (2), 246 (3), and 246 (4), respectively. The inert gas used is nitrogen gas, for example.

12 shows an example of the exhaust system in this reduced pressure drying unit 214. Exhaust ports 234 (1), 234 (2), 234 (3), and 234 (4) are each provided with an exhaust pipe (252) in a common exhaust device 251 having a vacuum pump 248 and a pressure control valve 250. 252 (1), 252 (2), 252 (3) and 252 (4) are connected. In the middle of the gas exhaust pipes 252 (1), 252 (2), 252 (3), and 252 (4), open / close valves 254 (1), 254 (2), 254 (3), and 254 (4) Each is installed.

13-15, the structure of the airflow control part which is a main characteristic part of this pressure reduction drying unit 214 is shown. 13 is a partial cross-sectional plan view showing the structure in the lower chamber 224, FIGS. 14A and 14B are longitudinal cross-sectional views taken along line II of FIG. 13, and FIGS. 15A and 15B are longitudinal cross-sectional views taken along line II-II in FIG. It is also.

In FIG. 13, the airflow control unit 260 has both sides (preferably stages) of the stage 230 inside the side walls 224 (2) and 224 (4) facing each other of the lower chamber 224 in the Y direction. First partition plates (or partitions) 262A, 262B, which are disposed at positions as close as possible (230), and the first height plates in which the first partition plates 262A, 262B are shown in FIG. 14A, and FIG. 14B. It has the 1st lifting mechanism 264 which moves up and down between the 2nd height positions shown to.

As shown in FIG. 13, the first partition plates 262A and 262B are adjacent to the air supply port 232 (1) provided on one side (the left side of the drawing) of the stage 230 in the X direction. In front of the air supply port 232 (3) and the exhaust port 234 (3), 234 (4) on the opposite side (right side) of the stage 230 from a position, i.e., a position almost in contact with the chamber wall 224 (1). Extends to position. Further, the first partition plates 262A and 262B preferably have a size that extends from the bottom surface of the lower chamber 224 to the lower surface (ceiling) of the upper chamber 226 in the vertical direction (Z direction). have.

And the 1st partition plates 262A and 262B are the height which reaches to the lower surface (chamber ceiling) of the upper chamber 226 from the bottom surface of the lower chamber 224 at the 1st height position, or is perpendicular to the height near it. Direction (FIG. 14A), and in the second height position, the tops of the first partition plates 262A, 262B are set to be close to, or lower than, the bottom of the lower chamber 224 (see FIG. 14A). 14b). In the bottom wall of the lower chamber 224, recesses 265A and 265B are formed to allow the first partition plates 262A and 262B to sink (retract) at the second height position, respectively.

The first lifting mechanism 264 includes one or each of the plurality of supporting rods 266A and 266B extending in the vertical direction connected to the lower ends of the first partition plates 262A and 262B, respectively, and these supporting rods 266A and 266B. ) And a horizontal support plate 268 for supporting in parallel with each other, and a lift actuator 272 coupled to the horizontal support plate 268 via a lift drive shaft 270. The lifting actuator 272 is made of, for example, an air cylinder or an electric linear motor. The support rods 266A and 266B penetrate vertically through the bottom wall of the lower chamber 224 and are vacuum sealed by the seal member 274.

In addition, as shown in FIG. 13, the airflow control unit 260 includes a second partition plate (or partition wall) 276 having a cross-sectional U-shape disposed around or beside the stage 230, and the second partition plate. The second lifting mechanism 278 which moves 276 up and down between the 3rd height position shown to FIG. 14A or FIG. 15A, and the 4th height position shown to FIG. 14B or FIG. 15B is provided.

The second partition plate 276 includes the first flat plate portion 276a extending in the Y-direction on the left side of the drawing facing the first air supply port 232 (1) of the stage 230, and the stage 230. And second plate portions 276b and 276c extending in the X direction next to the upper and lower sides of the drawing facing the first partition plates 262A and 262B. Although the structure which divides the opposite side (right side of the figure) of the stage 230 by the 2nd partition plate 276 is also possible, the structure which is liberated like this embodiment from the viewpoint of the exhaustability of the space below the stage 230 is desirable.

And the 2nd partition plate 276 is the height which contact | connects the back surface (lower surface) of the board | substrate G put on the stage 230 in the bottom surface of the lower chamber 224 in the 3rd height position, or is near it. 14a, 15a, the upper end is settled to a height close to or below the bottom surface of the lower chamber 224 in the fourth height position (Fig. 14b, Fig. 14a). 15b). The bottom wall of the lower chamber 224 is formed with a recess 280 for sinking (retracting) the second partition plate 276 to the fourth height position.

On the other hand, between the 1st partition plates 262A and 262B and the 2nd flat plate parts 276b and 276c of the 2nd partition plate 276, the 1st partition plates 262A and 262B are in a 1st height, and it is the 1st partition plate 262A, 262B. When the two partition plates 276 are at the third height, it is preferable to approach them through as small gaps as possible to the extent that they do not contact each other.

The second lifting mechanism 278 includes one or more support rods 282 extending in the vertical direction connected to the lower end of the second partition plate 276, and a horizontal support plate for supporting these support rods 282 in parallel. 284 and the lifting actuator 288 coupled to the horizontal support plate 284 via the lifting drive shaft 286. The lifting actuator 288 consists of an air cylinder or an electric linear motor, for example. The support rod 282 penetrates the bottom wall of the lower chamber 224 so that it can move up and down, and is vacuum-sealed by the sealing member 290.

The stage 230 is coupled to the elevating actuator 294 via a elevating drive shaft 292 extending in the vertical direction, so that the transfer arm 218 (FIGS. 1 and 2) and the substrate G can be flipped over. At the time, or in order to adjust the distance or clearance H from the chamber ceiling (lower surface of the upper chamber 226) in the decompression drying process, it is possible to move up and down. The lifting lowering drive shaft 292 penetrates the bottom wall of the lower chamber 224 so as to be movable upward and downward, and is vacuum-sealed by the sealing member 296.

In this embodiment, the air supply port 232 (1) on the left side of the drawing is the first air supply port, and the other air supply ports 232 (2), 232 (3), and 232 (4) are second air supply ports. . In addition, as shown in FIG. 13, the area between the air supply port 232 (1) and the second partition plate 276 in the chambers 224 and 226 is the first area E ₁ . First partition plates 262A, 262B and second partition plates 276 when in regions other than the first region E ₁ , in particular in the first and third positions, respectively, seen from the air supply port 232 (1). All regions located in the shade of are the second regions [E ₂ ].

This pressure reduction drying unit 214 is equipped with a main controller (not shown) which controls the operation of each part and the whole. The airflow control unit 260 may have a local controller (not shown) that controls the lifting operation of the first and second lifting mechanisms 264, 278 under the control of the main controller.

Next, with reference to FIGS. 16-20, the operation | movement of the airflow control part 260 in this pressure reduction drying unit 214 is shown.

Since the airflow control unit 260 has such a configuration, most of the inert gas blown out from the first air supply port 232 (1) on the left side of the drawing passes through the stage 230 and the substrate G. The first mode of regulating the route of the air stream of the inert gas to reach the exhaust ports 234 (3) and 234 (4) on the right side of the figure, and the regulation of the air stream route as described above for the inert gas or other gas It is possible to selectively convert the second mode that is substantially canceled.

In this pressure reduction drying unit 214, both the radical short-time vacuum drying process suitable for obtaining the high residual film quality and the gentle long-term vacuum drying process suitable for obtaining the low residual film quality are selectively selected. It is possible to implement. Whichever pressure reduction drying process is selected, it is preferable to start the pressure reduction drying process in the second mode.

16A and 16B show the states in the chambers 224 and 226 immediately after starting the reduced pressure drying process. Preferably, all the air supply ports 232 (1) to 232 (4) are closed, and the exhaust system (Fig. 12) is operated without introducing an inert gas, thereby all the exhaust ports 234 (1) to 234 (4). Vacuum exhaust through)). As shown, the air remaining in the chambers 224 and 226 and the solvent (thinner) volatilized from the resist coating film on the substrate G are exhaust ports 234 (1) to 234 (4) at four corners of the chamber. It is drawn in with uniform suction force and discharged quickly. First of all, as another embodiment, it is also possible to open the air supply ports 232 (1) to 232 (4) at the time of vacuum induction immediately after this start, and introduce an inert gas at a predetermined flow rate.

When the rapid and short time depressurization drying process is selected for the substrate G to be processed contained in the chambers 224 and 226, the predetermined time or the pressure in the chamber are set to a predetermined value after the decompression drying process starts. For example, at about 400 Pa), the mode is changed from the second mode shown in FIGS. 16A and 16B to the first mode shown in FIGS. 17A and 17B.

In this case, the airflow control unit 260 operates the first lifting mechanism 264 to move the first partition plates 262A and 262B up to the first height position from the second height position so far, By operating the two lifting mechanisms 278, the second partition plate 276 is moved upward from the fourth height position so far to the third height position.

In addition, in the air supply system (FIG. 11), the on-off valve 246 (1) is opened and all other on-off valves 246 (2), 246 (3), and 246 (4) are kept in the closed state. As a result, in the chambers 224 and 226, only the first air supply port 232 (1) ejects the inert gas. All other air supply ports 232 (2), 232 (3), and 232 (4) remain closed. Here, the flow control valve 244 (1) is adjusted so that the flow rate of the inert gas supplied from the air supply port 232 (1) becomes a set value (for example, 20 L (liter) / min).

On the other hand, in the exhaust system (FIG. 12), the open / close valves 254 (3) and 254 (4) remain open while the remaining open / close valves 254 (1) and 254 (2) are converted to the closed state. do. As a result, in the chambers 224 and 226, the exhaust ports 234 (3) and 234 (4) located on the opposite side of the stage 230 as viewed from the first air supply port 232 (1) perform exhaust operation. Subsequently, the exhaust ports 234 (1) and 234 (2) near the air supply port 232 (1) stop the exhaust operation. Here, according to the flow rate of the inert gas supplied from the air supply port 232 (1) into the chamber, the pressure control valve 250 is adjusted to obtain a predetermined pressure or exhaust speed in the chamber.

As shown in FIGS. 17A and 17B, in the first mode, the air supply port 232 (1) is formed by the partition wall action or the airflow restricting action by the first partition plates 262A and 262B and the second partition plate 276. Almost or most (preferably 90% or more) of the nitrogen gas blown out from)) flows (passes) in the X direction on the stage 230 and the substrate G, and the exhaust port 234 (3 ), 234 (4)).

In this way, inert gas flows uniformly in one direction (X direction) on the substrate G in the middle of the vacuum drying process, and preferably volatilizes from the resist coating film on the substrate G. The removed solvent is quickly removed through the airflow, thereby increasing the volatilization speed of the solvent, thereby facilitating the deterioration (solidification) of the resist surface, and in addition, obtaining the resist film quality characteristics of a high residual film ratio uniformly on the substrate G. Can be. In this way, the time required for the reduced pressure drying process ends shortly (for example, about 30 seconds).

On the other hand, in the reduced pressure drying process according to the second embodiment, not only the pressure and the flow rate of the inert gas, but also the distance interval (clearance) H between the substrate G and the ceiling of the chamber 226 is an important process parameter. For this reason, the height position of the stage 230 may be changed. In this case, as shown in FIG. 18, the airflow control unit 260 variably adjusts the third height position of the second partition plate 276 in accordance with the height position adjustment of the stage 230. The state where the upper surface of the second partition plate 276 is always in close contact with the lower surface of the substrate G with respect to any clearance H is maintained. Thereby, a part of inert gas blown out from the air supply port 232 (1) can be completely prevented from passing under the board | substrate G. As shown in FIG.

When the decompression drying process for a slow and long time is selected for the substrate G to be treated, the predetermined time elapses after the decompression drying process is started, or the pressure in the chamber reaches a set value (for example, about 400 Pa). At this point in time, the state is changed from the states shown in Figs. 16A and 16B to the state shown in Fig. 19 while maintaining the second mode.

In this case, in the air supply system (FIG. 11), all the opening / closing valves 246 (1), 246 (2), 246 (3) and 246 (4) are opened. As a result, in the chambers 224 and 226, all the air supply ports 232 (1), 232 (2), 232 (3), and 232 (4) blow off the inert gas. However, the flow rate adjusting valves 244 (1), 244 (2), 244 (3), and 244 (4) are adjusted so that the supply flow rate of the inert gas is set to a small amount (for example, 2 L / min). Moreover, it is preferable to make the discharge flow volume of the air supply port 234 (1), 234 (2), 234 (3), and 234 (4) uniform.

On the other hand, in the exhaust system (FIG. 12), all the opening / closing valves 254 (1), 254 (2), 254 (3), and 254 (4) are kept open and all the exhaust ports 234 (1) 234 (2), 234 (3), and 234 (4). However, in accordance with the flow rate of the inert gas supplied from the air supply ports 232 (1), 232 (2), 232 (3), and 232 (4), the pressure control valve 250 maintains a predetermined pressure in the chamber. Adjusted. In addition, the discharge flow rates of the air supply ports 232 (1), 232 (2), 232 (3) and 232 (4) are preferably made uniform with respect to the substrate G on the stage 230.

Thus, the substrate G on the stage 230 in the state where all the air supply ports 232 (1), 232 (2), 232 (3), and 232 (4) are opened (on) in the second mode during the vacuum drying process. To discharge the inert gas at a uniform and small flow rate, and exhaust the exhaust ports 234 (1), 234 (2), 234 (3), and 234 (4) in an open (on) state. In this case, most of the inert gas supplied into the chamber is likely to flow out and beneath the substrate G to the stage 230, and airflow, particularly in one direction, is hardly formed on the substrate G. . For this reason, the solvent volatilized from the resist coating film of the board | substrate G tends to remain in the vicinity, and volatilization rate is suppressed. Thereby, deterioration (solidification) of the resist surface by drying under reduced pressure becomes gentle, and the resist film quality characteristic of the low residual film rate on a board | substrate G can be obtained uniformly in surface. In addition, the time required for the vacuum drying treatment becomes long (for example, about 60 seconds).

On the other hand, as another embodiment when the slow and long time decompression drying process is selected, after a predetermined time has elapsed since the decompression drying process was started, or after the pressure in the chamber reached the set value, the air supply port 232 (1 ), Exhaust ports 234 (1), 234 (2), 234 (3), 234 (with all of 232 (2), 232 (3), 232 (4) kept closed (off) It is also possible to continue the exhaust operation using all of 4)). In this case, the solvent volatilized from the resist coating film of the board | substrate G becomes a main exhaust gas.

In this reduced pressure drying unit 214, when finishing the reduced pressure drying process, as shown in FIG. 20, a 2nd mode is selected and all the air supply ports 232 (1), 232 (2), and 232 (3) ), 232 (4) is discharged with a large flow rate in the open (on) state, and all the exhaust ports 234 (1), 234 (2), 234 (3) and 234 (4) are opened. In the (ON) state, high-speed exhaust (purging) is once performed, and then the exhaust ports 234 (1), 234 (2), 234 (3), and 234 (4) are all closed. As a result, the atmosphere in the chambers 224 and 226 is switched from the reduced pressure state to the atmospheric pressure state, and the opening operation (chamber release) of the upper chamber 226 is enabled.

As described above, in this embodiment, when the vacuum drying and the short time vacuum drying process are selected, the first partition plates 262A and 262B are used for purging at the end of vacuum induction immediately after the start of the vacuum drying process and at the end of the vacuum drying process. Select the second mode to evacuate the second height position and the fourth height position, respectively, and deactivate all the air supply ports 232 (1), 232 (2), 232 (3), and 232 (4). Gas can be supplied into the chamber and exhausted into the chamber using all exhaust ports 234 (1), 234 (2), 234 (3), and 234 (4), making this type of reduced pressure drying process more efficient. In this way, the processing time can be further shortened.

First of all, although the efficiency decreases slightly in another order, it is also possible to maintain the first mode without selecting the second mode from the start to the end of the vacuum drying process. Even in that case, it is necessary to change the flow rate and the exhaust velocity of the inert gas according to each step.

In addition, the vacuum drying of the use of the inert gas in the first mode is performed after a predetermined time elapses from the start of the vacuum drying process or until the pressure in the chamber reaches the set value and the vacuum drying process is completed (FIG. 17A). FIG. 17B) and the reduced-pressure drying (FIG. 19) of use of the inert gas in the second mode may be sequentially or alternately converted.

As mentioned above, although highly suitable embodiment of this invention was described, this invention is not limited to embodiment mentioned above, A various deformation | transformation or a change is possible within the range of the technical idea.

For example, as shown in FIGS. 21A and 21B, a block structure in which the stage 230 on which the substrate G is placed fills a space below the substrate G to the bottom surface of the lower chamber 224 is provided. You may have it. In such a stage structure, a lift mechanism 204 having an actuator 295 for elevating the bottom wall of the lower chamber 224 and the lift pin 231 capable of elevating through the stage 230 from below is provided on a substrate ( G) is raised and lowered to load / unload the substrate.

In this case, in the first mode, the stage 230 of the block structure prevents the passage below the substrate G with respect to the inert gas blown out from the air supply port 232 (1), and the first partition plate 262A. 262B moves together with each other, and functions to form airflow in one direction (X direction) on the substrate G. Therefore, the second partition plate 276 can be substituted for the stage 230.

Above all, in order to adjust the clearance H as described above, when the substrate G is dropped from the upper surface of the stage 230 during the vacuum drying process, the illustration is omitted. The structure provided with the partition plate 276 of is preferable.

In addition, with respect to the exhaust system, as shown in FIGS. 22A and 22B, a configuration in which one or a plurality of exhaust ports 206 are provided under the stage 230 is also possible. In this case, in the first mode, almost or most of the inert gas ejected from the air supply port 232 (1) flows in one direction (X direction) over the stage 230 and the substrate G, and the substrate G is provided. After passing through the corner on the opposite side (right side of the drawing), the substrate G and the stage 230 are turned down (submerged) and sucked into the exhaust port 206.

In the above-described embodiment, the first partition plates 262A and 262B and the second partition plates 276 are moved up and down by the first lifting mechanism 264 and the second lifting mechanism 278, so that the chamber 224 is moved. 226 can also be converted while the device is closed. As another embodiment, a configuration is also possible in which the first partition plates 262A and 262B and / or the second partition plates 276 are attached or mounted in the chamber to be detachably manually for mode switching.

Not only the structure and the shape of the chamber itself, but also the structures, the number, the arrangement positions, and the like of each part inside and outside the chamber, in particular, the stage, the air supply port, and the exhaust port, can be modified in various ways.

The substrate to be processed in the present invention is not limited to the glass substrate for LCD, and other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates, and the like can also be used. The coating liquid to be subjected to the vacuum drying process is not limited to the resist liquid, but for example, a processing liquid such as an interlayer insulating material, a dielectric material, a wiring material, or the like can be used.

100, 200 applicator
110, 210 support
112, 212 resist coating unit
114, 214 vacuum drying unit
116, 216 guide rail
118, 218 return arms
120, 220 gate
122, 222 nozzles
124, 224 lower chamber
126, 226 upper chamber
128, 228 chamber opening and closing mechanism
130, 230 stage
132 air supply
134 exhaust vent
148 vacuum pump
152 exhaust pipe
160, 161 block members
194 elevators
224 chamber wall
232 air supply port
234 exhaust port
260 airflow control
262A, 262B First Partition Plate
276 second partition plate
G board

Claims (30)

A pressure-sensitive drying apparatus for performing a vacuum drying treatment of the treatment liquid on a substrate to be treated with a treatment liquid to form a coating film,
A chamber accommodating a substrate to be processed and forming a processing space;
A holding part installed in the chamber to hold the substrate to be processed;
First lifting means for lifting and lowering the holding part;
An airflow control unit provided below the holding unit;
Second elevating means for elevating and moving the air flow controller;
An exhaust port formed in the chamber,
And exhaust means for exhausting the atmosphere in the chamber from the exhaust port. The method according to claim 1, wherein the holding unit and the air flow control unit in the chamber are arranged by the first raising and lowering means,
And a flow path of airflow flowing in one direction through the upper surface of the substrate by the exhausting operation of the exhausting means in a state in which the airflow control unit is close to the substrate to be processed held by the holding unit. The said exhaust port is formed in the side of the said to-be-processed board | substrate,
And the airflow control unit is provided in the space below the edge of the substrate on the opposite side with at least the substrate to be held held in the holding portion, with respect to the exhaust port. The sidebar member according to any one of claims 1 to 3, wherein at least left and right sides of the flow path formed on the upper surface of the substrate are buried or interposed with at least a portion of the space on the left and right sides of the substrate. Decompression drying apparatus, characterized in that there is. 4. The air supply port according to claim 3, further comprising: an air supply port formed inside the chamber on the substrate side opposite to the exhaust port with the substrate to be interposed therebetween;
And an air supply means for supplying an inert gas from the air supply port to a processing space in the chamber. 6. The pressure reduction drying apparatus according to claim 5, wherein side bar members are formed on both left and right sides of the flow path formed on the upper surface of the substrate to bury or block at least part of the spaces on the left and right sides of the substrate. . A pressure reduction drying apparatus for drying a film of a coating liquid formed on a substrate to be processed under a reduced pressure,
A pressure-sensitive chamber that accommodates the substrate in a retractable manner,
A holding part for placing a substrate in the chamber,
An inert gas supply unit having a first air supply port provided on one side of the holding unit in the chamber in a horizontal first direction, and supplying an inert gas into the chamber through the first air supply port;
An exhaust portion having an exhaust port provided in a second region in the chamber except a first region between the first air supply port and the holding portion, and evacuating the inside of the chamber through the exhaust port;
Deregulation of the air flow route for the inert gas and the first mode of regulating the route of the air flow of the inert gas so that a majority of the inert gas blown out from the first air supply port passes over the holding portion to reach the exhaust port. A decompression drying apparatus having an airflow controllable to be switched between the second mode. The airflow control unit of claim 7,
First partition plates disposed on both sides of the holding part inside the sidewall of the chamber in a horizontal second direction orthogonal to the first direction;
And a first lifting mechanism for lifting and lowering the first partition plate between the first height position for the first mode and the second height position for the second mode. The said 1st partition plate is a height which contact | connects a ceiling from the bottom surface of the said chamber at the said 1st height position, or protrudes perpendicularly to the height near it, In the said 2nd height position, A pressure reducing drying device that sinks so that the top is a height close to the bottom surface of the chamber, or less than that. 9. The pressure reducing drying device according to claim 8, wherein the first partition plate extends from a position in the vicinity of the first air supply port to a position opposite to the holding portion in the first direction. The air flow control unit of claim 8,
A second partition plate disposed at a side of the holding portion opposite to at least the first air supply port,
And a second lifting mechanism for lifting and lowering the second partition plate between the third height position for the first mode and the fourth height position for the second mode. The said 2nd partition plate protrudes in a perpendicular direction to the height which contact | connects the back surface of the board | substrate from the bottom surface of the said chamber, or near it at the 3rd height position, The said 4th height position In which the upper part sinks to a height close to or below the bottom of the chamber. The said 2nd partition plate is a 1st flat plate part extended in a said 2nd direction by the side which opposes the said 1st air supply port of the said holding part, The said 1st partition plate of the said holding part, And a second flat plate portion extending in the first direction from the side opposite to the opposite side. The method of claim 7, wherein the inert gas supply unit,
When the coating film on the substrate is subjected to the decompression drying process in the first mode, the second supply port is closed in the second region, and the second supply port is closed while the first supply port is opened and inert in the chamber. And supplying gas and opening all of the first and second air supply ports to supply inert gas into the chamber when the pressure in the chamber is returned to atmospheric pressure in the second mode after the completion of the decompression drying process. 15. The inert gas supply unit according to claim 14, wherein when the coating film on the substrate is subjected to the vacuum drying treatment in the second mode, all of the first and second air supply ports are opened during the processing to supply inert gas into the chamber. Decompression drying machine. 15. The chamber of claim 14, wherein the chamber is rectangular in plan view, and the first air supply port is provided in proximity to the chamber sidewall of one of the four sides, and some or all of the remaining three sides are close to the chamber sidewall. Pressure reduction drying device provided with an air supply port. The said exhaust part is provided with a plurality of said exhaust ports around the said holding | maintenance part in the said 2nd area, and it is possible to perform vacuum exhaust in the said chamber in the said 1st mode. The exhaust port relatively close to the first air supply port as viewed from the holding portion, opening the exhaust port relatively far from the first air supply port, and the plurality of air exhausts in the chamber in the second mode. Decompression dryer to open all exhaust ports. A reduced pressure drying method for forming a coating film by subjecting a substrate to which a treatment liquid is applied to the substrate to be treated with the pressure reduction drying apparatus according to any one of claims 1 to 4 to form a coating film.
Holding the substrate to be processed to the holding portion;
Raising the holding part by the first lifting means to bring the substrate to be processed held by the holding part into proximity to the ceiling of the chamber;
Depressurizing the processing space in the chamber by the exhaust means;
And after the predetermined time has elapsed, performing the step of moving the air flow controller up and down by the second elevating means to bring the air flow controller close to the substrate to be held held by the holding portion. A reduced pressure drying method for forming a coating film by subjecting a substrate to which a treatment liquid is applied to the substrate to be treated with the pressure reduction drying apparatus according to any one of claims 1 to 4 to form a coating film.
Holding the substrate to be processed to the holding portion;
Moving the holding portion down by the first elevating means to bring the substrate to be processed into proximity to the air flow control section;
Depressurizing the processing space in the chamber by the exhaust means;
After a predetermined time has elapsed, the holding portion holding the substrate to be processed and the air flow control portion are moved upward by the first lifting means and the second lifting means while keeping the distance from each other, and at a predetermined position in the chamber. A pressure reduction drying method, characterized in that the step of stopping is carried out. A reduced pressure drying method for forming a coating film by subjecting a substrate to which a treatment liquid is applied to the substrate to be treated with the pressure reduction drying apparatus according to claim 5 or 6 to form a coating film.
Holding the substrate to be processed to the holding portion;
Raising the holding part by the first lifting means to bring the substrate to be processed held by the holding part into proximity to the ceiling of the chamber;
Depressurizing the processing space in the chamber by the exhaust means;
After a predetermined time has elapsed, the air flow controller is moved upward by the second lifting means to bring the air flow controller close to the substrate to be held by the holding portion, and at the same time, an inert gas is introduced into the chamber by the air supply means. A pressure reduction drying method, characterized by performing a step of supplying air. A reduced pressure drying method for forming a coating film by subjecting a substrate to which a treatment liquid is applied to the substrate to be treated with the pressure reduction drying apparatus according to claim 5 or 6 to form a coating film.
Holding the substrate to be processed to the holding portion;
Depressurizing the processing space in the chamber by the exhaust means;
Moving the holding portion down by the first elevating means to bring the substrate to be processed closer to the air flow control part, and simultaneously supplying an inert gas into the chamber by the air supply means;
After a predetermined time has elapsed, the holding portion holding the substrate to be processed and the air flow control portion are moved upward by the first lifting means and the second lifting means while keeping the distance from each other, and at a predetermined position in the chamber. A pressure reduction drying method, characterized in that the step of stopping is carried out. A reduced pressure drying method for forming a coating film by subjecting a substrate to which a treatment liquid is applied to the substrate to be treated with the pressure reduction drying apparatus according to claim 5 or 6 to form a coating film.
Holding the substrate to be processed to the holding portion;
Moving the holding portion down by the first elevating means to bring the substrate to be processed into proximity to the air flow control section;
Depressurizing the processing space in the chamber by the exhaust means;
Supplying an inert gas into the chamber by the air supply means;
After a predetermined time has elapsed, the holding portion holding the substrate to be processed and the air flow control portion are moved upward by the first lifting means and the second lifting means while keeping the distance from each other, and at a predetermined position in the chamber. A pressure reduction drying method, characterized in that the step of stopping is carried out. A first air supply port provided on one side of the holding portion in the chamber in a horizontal first direction, and having a pressure-sensitive chamber for receivably receiving the substrate, a holding portion on which the substrate is placed in the chamber, An inert gas supply part for supplying an inert gas into the chamber through an air supply port, and an exhaust port provided in a second area except for a first area between the first air supply port and the holding part in the chamber, A pressure reduction drying method for drying a film of a coating liquid formed on a substrate to be processed under a reduced pressure using a reduced pressure drying apparatus having an exhaust port for evacuating the inside of the chamber through the exhaust port,
A first mode for regulating the route of the air flow of the inert gas so that most of the inert gas blown out from the first air supply port passes through the holding portion to reach the exhaust port; and the regulation of the air flow route for the inert gas is controlled. A decompression drying method for selectively converting a second mode that is substantially released. A first partition plate according to claim 23, wherein first partition plates disposed on both sides of the holding portion are used inside a side wall of the chamber in a horizontal second direction orthogonal to the first direction.
And a height position of the first partition plate is converted between the first height position for the first mode and the second height position for the second mode. The said 1st partition plate is a height which contacts the ceiling from the bottom surface of the said chamber, or protrudes perpendicular | vertical to the height near it in the said 1st height position, The said 1st partition plate is the said 2nd height position. A method for reducing pressure drying that sinks so that its upper end is at or near the bottom of the chamber. The method according to claim 23, wherein the holding portion uses a second partition plate disposed next to at least the side facing the first air supply port,
And a height position of the second partition plate is converted between the third height position for the first mode and the fourth height position for the second mode. 27. The fourth partition of claim 26, wherein the second partition plate protrudes in a vertical direction from a bottom surface of the chamber to a height that is in contact with the rear surface of the substrate at or near the substrate at the third height position. In which the upper part sinks to a height close to or below the bottom of the chamber. The said 2nd partition plate is a 1st flat part extended in a said 2nd direction by the side which opposes the said 1st air supply port of the said holding part, The said 1st partition plate of the said holding part, And a second flat plate portion extending in the first direction on the side opposite to the opposite side. 29. The method according to any one of claims 23 to 28, wherein when the coating film on the substrate is subjected to the vacuum drying treatment in the first mode, the second air supply port provided in the second region is closed during the processing. When the first air supply port is opened to supply an inert gas into the chamber, and the pressure in the chamber is returned to atmospheric pressure in the second mode after completion of the reduced pressure drying process, all of the first and second air supply ports are opened in the chamber. A reduced pressure drying method for supplying an inert gas. The reduced pressure drying method according to claim 29, wherein when the coating film on the substrate is subjected to the reduced pressure drying treatment in the second mode, all of the first and second air supply ports are opened to supply an inert gas into the chamber during the processing.

Images