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KR20100105289A - Heat-sink for led lighting unit - Google Patents

Heat-sink for led lighting unit Download PDF

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Publication number
KR20100105289A
KR20100105289A KR1020090037987A KR20090037987A KR20100105289A KR 20100105289 A KR20100105289 A KR 20100105289A KR 1020090037987 A KR1020090037987 A KR 1020090037987A KR 20090037987 A KR20090037987 A KR 20090037987A KR 20100105289 A KR20100105289 A KR 20100105289A
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South Korea
Prior art keywords
led lighting
coupled
lighting module
hole
heat
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KR1020090037987A
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Korean (ko)
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KR101052605B1 (en
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박창수
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박창수
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PURPOSE: A heat-sink for an LED lighting unit is provided to increase the efficiency of discharging heat to the outside through air which is circulated inside a body. CONSTITUTION: A body(10) has a penetration hole(11) passing through top and bottom of the body. An LED illumination module(50) is combined in an upper part of the body. A plurality of air current holes(20) are formed on the side of the body to flow air between the penetration hole and the outside. The air current holes are comprised of a plurality of small current holes, having a diameter which increases inward, as well as a plurality of large current holes, having a diameter which increases outward.

Description

ＬＥＤ조명용 히트싱크{Heat-Sink for LED lighting unit} Heat-Sink for LED Lighting Unit

본 발명은 LED조명용 히트싱크에 관한 것으로서, 보다 상세하게는 몸체 내외의 압력차에 의해 공기가 몸체의 내부와 외부 사이를 자연스럽게 오가면서 LED조명모듈에서 발산되어 몸체로 전달되는 열을 보다 효율적으로 방출시키고, 몸체는 상호 대칭된 구조를 갖는 제1분체와 제2분체가 암수결합방식으로 조립되도록 하여 생산성과 조립성을 높인 LED조명용 히트싱크에 관한 것이다. The present invention relates to a heat sink for LED lighting, and more particularly, by the pressure difference between the inside and outside of the body, the air naturally flows between the inside and the outside of the body and radiates heat transmitted from the LED lighting module to the body more efficiently. In addition, the body relates to a heat sink for LED lighting that has the first powder and the second powder having a mutually symmetrical structure to be assembled in a male and female coupling method to increase productivity and assembly.

조명기구는 백열전구나 형광등과 같은 전통적인 광원에서 LED(발광다이오드; Light Emitted Diode)를 광원으로 사용하는 것으로 발전되고 있다. LED를 광원으로 사용하는 조명기구는 환경오염 유발 요인이 적고 수명이 오래간다는 장점이 있다는 이유로 전통적인 조명기구를 대체할 수 있는 조명기구로 기대를 받고 있으며, 근래 이에 관한 많은 연구 및 개발이 이루어지고 있다. Luminaires are being developed using light-emitting diodes (LEDs) as light sources in traditional light sources such as incandescent lamps and fluorescent lamps. Lighting fixtures that use LEDs as light sources are expected to replace traditional lighting fixtures due to their low environmental pollution and long lifespan. Recently, many researches and developments have been made. .

LED조명기구 분야에서는 개발 아이템이 크게 3가지 부분으로 집중되는데, 그 첫째는 광원 즉, LED가 실장되는 PCB에 관한 연구이고, 둘째는 LED의 발광에 수반되는 발열을 방열하기 위한 방열구조에 관한 연구이고, 셋째는 LED의 발광을 위한 전원에 관한 연구이다. In the field of LED lighting equipment, development items are largely concentrated in three parts. First, the study on the light source, that is, the PCB on which the LED is mounted, and the second, a study on the heat dissipation structure for radiating heat generated by the light emission of the LED. The third is a study on the power source for the light emission of the LED.

본 발명은 LED조명기구 분야의 두 번째 개발 아이템인 방열구조에 관한 것이며, 특히 본 발명가가 기존 단순한 형태의 LED조명용 PCB에서 탈피하여 다면다각도 구현이 가능하고 제조 공정 및 빛 조사 범위에서 효율성을 증진시키기 위한 엘이디조명 램프용 인쇄회로기판을 개발하여 특허등록 제885197호 및 제875724호로 권리를 획득한 LED조명모듈의 방열에 보다 바람직한 방열구조에 관한 것이다. The present invention relates to a heat dissipation structure, which is the second development item in the field of LED lighting equipment, and in particular, the inventor can realize a multi-sided angle from the existing simple-type LED lighting PCB and improve efficiency in the manufacturing process and light irradiation range. The present invention relates to a more preferable heat dissipation structure for heat dissipation of LED lighting modules, which have been developed under the patent registration Nos. 885197 and 875724 by developing a printed circuit board for LED lighting lamps.

초기의 LED조명용 방열구조(히트싱크; Heat Sink)는 단순히 LED가 실장된 PCB 저면에 알루미늄과 같이 열전달률이 높은 방열판을 접촉시키는 것이었는데, 방열효율이 만족할 만한 수준이 이르지 못하였다. 그리하여 방열효율을 보다 높이기 위해 등록특허 제754405호 "조명기구", 공개특허 제2008-71812호 "히트파이프를 이용한 냉각장치를 구비한 LED조명 조립체" 등에서 개선된 LED조명용 방열구조를 개시하고 있다. Early heat sinks for LED lighting (heat sinks) simply contacted heat sinks with high heat transfer rates, such as aluminum, to the bottom of PCBs on which LEDs were mounted, but the heat dissipation efficiency was not satisfactory. Thus, in order to further improve heat dissipation efficiency, an improved heat dissipation structure for LED lighting is disclosed in Korean Patent No. 754405 "Lighting Mechanism" and Korean Patent No. 2008-71812 "LED Lighting Assembly with Cooling Device Using Heat Pipe."

상기 등록특허와 공개특허는 상부에 LED조명모듈이 결합되고, 상기 LED조명모듈에 전원을 공급하는 케이블이 삽입 관통되는 관통홀이 상하를 관통하여 형성되어 있는 몸체와, 상기 몸체 외주연에 상하방향 또는 좌우방향으로 돌출형성되어 외부로 열을 방출시키는 다수의 냉각핀을 포함하여 이루어진다. The registered patent and the published patent is the LED lighting module is coupled to the upper body, the through-hole through which the cable for supplying power to the LED lighting module is inserted is formed through the upper and lower, and the vertical direction in the outer periphery of the body Or it is formed to include a plurality of cooling fins protruding in the left and right to release heat to the outside.

이와 같이 구성되는 상기 등록특허와 공개특허의 방열구조(히트싱크)는 냉각핀의 공기 접촉면적을 늘려 LED조명모듈이 몸체에 직접 접촉되어 전달되는 열은 냉각핀을 통해 외부로 쉽게 방출될 수 있지만, 몸체에 직접 접촉되어 전달되지 않고 몸체 내부의 관통홀에 유입된 열(즉, 가열된 공기)은 몸체 관통홀 내면에 접촉되어 몸체 외면(외주연)의 냉각핀을 통해 서서히 방출되거나 몸체 하부의 관통홀 개구부를 통해 서서히 방출된다. 즉, 상기 등록특허와 공개특허의 방열구조는 기존의 방열판 보다는 방열효율이 높다고 할 수 있지만 만족할 만한 수준은 아니다. The heat dissipation structure (heat sink) of the patent and the disclosed patent is configured to increase the air contact area of the cooling fins so that the heat transmitted by direct contact with the LED lighting module can be easily released to the outside through the cooling fins. The heat (ie, heated air) introduced into the through-holes inside the body without being directly contacted with the body is contacted with the inner surface of the body through-holes and gradually released through the cooling fins on the outer surface (outer circumference) of the body, It is released slowly through the through hole opening. That is, the heat dissipation structure of the registered patent and the published patent can be said to be higher heat dissipation efficiency than the existing heat sink, but is not satisfactory.

그렇다고 몸체에 냉각수가 흐르도록 하거나 송풍팬을 통해 이용해 몸체 내외부의 공기를 강제 순환시켜 방열효율을 높이기에는 제조원가 상승과 전력소모량 증가 등의 문제가 있어 바람직하지 않다. However, it is not preferable to increase the heat dissipation efficiency and increase the power consumption to increase the heat dissipation efficiency by forcibly circulating the air inside and outside the body by using a coolant flow through the blower fan.

즉, 냉각수나 송??팬과 같은 별도의 기기를 장착하지 아니하면서도 방열효율을 높일 수 있는 수단(구조)이 필요하다. In other words, there is a need for a means (structure) to increase heat dissipation efficiency without installing a separate device such as cooling water or a fan.

본 발명은 상기와 같은 문제점을 해소하기 위해 안출된 것으로서, 몸체에 직접 접촉되어 LED조명모듈에서 전달되는 열은 몸체 외주연에 형성되어 있는 냉각핀 (즉, 방열날개)을 통해 방출시키고, 몸체 내부의 관통홀에 유입된 열은 몸체의 측면에 형성되어 있는 기류공을 통해 자연스럽게 순환되는 공기를 통해 방출시켜 방열효율을 한 차원 높이 LED조명용 히트싱크를 제공함을 목적으로 한다. The present invention has been made to solve the above problems, the heat transmitted directly from the LED lighting module in direct contact with the body is released through the cooling fins (that is, the heat dissipation wings) formed on the outer periphery of the body, the inside of the body The heat introduced into the through-holes is emitted through the air circulated naturally through the airflow holes formed on the side of the body to provide a heat sink for LED lighting with a one-dimensional height of heat dissipation efficiency.

그리고 몸체는 대칭구조로 이루어지고 양측의 접촉부위에서 암수결합되어 조립되는 제1분체와 제2분체로 이루어져 생산성과 조립성을 높인 LED조명용 히트싱크를 제공함을 또 다른 목적으로 한다.And the body is made of a symmetrical structure and is made of a first powder and a second powder are assembled by male and female at the contact portion of both sides to provide a heat sink for LED lighting with improved productivity and assembly.

또한, 입력전원을 가공처리하여 LED조명모둘에 구동전원을 공급하는 전원공급부재를 내장하고, 하단에는 전원공급부재에 전기적으로 연결되고 상용전원을 입력받아 전원공급부재로 공급하는 베이스를 구비하여 소켓에 간편하게 스크류결합되어 전기적으로 체결되는 LED조명용 히트싱크를 제공함을 또 다른 목적으로 한다.It also has a built-in power supply member that processes the input power and supplies driving power to both LED lightings, and has a base at the bottom that is electrically connected to the power supply member and has a base for receiving commercial power and supplying it to the power supply member. Another object of the present invention is to provide a heat sink for LED lighting, which is simply screwed on and electrically coupled to the LED.

이와 같은 목적을 달성하기 위한 본 발명의 LED조명용 히트싱크는 LED lighting heat sink of the present invention for achieving the above object

상하를 관통하는 관통공이 형성되어 있고, 상부에는 LED조명모듈이 결합되는 몸체;A through hole penetrating the upper and lower sides is formed, the upper body is the LED lighting module is coupled;

상기 관통공과 외부 사이를 공기가 이동되도록 상기 몸체 측면에 형성되어 있는 다수의 기류공;을 포함하여 이루어진다.And a plurality of airflow holes formed on the side of the body to move air between the through holes and the outside.

그리고 상기 다수의 기류공은 몸체 외면에서 내면으로 가면서 그 직경이 점차 작아지는 다수의 소기류공과, 외면에서 내면으로 가면서 그 직경이 점차 커지는 다수의 대기류공으로 구성되는 것을 특징으로 하고,And the plurality of air flow holes are characterized in that it consists of a plurality of small air flow holes that the diameter gradually decreases from the outer surface to the inner surface, and a plurality of air flow holes gradually increasing in diameter from the outer surface to the inner surface,

상기 몸체의 하부에 결합되는 하우징;A housing coupled to the lower portion of the body;

상하를 관통하여 상기 관통공과 연통되는 중공을 구비하고, 외주연에는 길이방향으로 방열편이 다수 형성되어 있으며, 반구 형상의 상기 LED조명모듈 내측에 배치되고, 상기 몸체 상부에 결합되는 방열체;A radiator having a hollow penetrating up and down and communicating with the through hole, and having a plurality of heat dissipation pieces formed in a longitudinal direction at an outer circumference thereof, the radiator being disposed inside the LED lighting module having a hemispherical shape and coupled to an upper portion of the body;

상기 LED조명모듈을 감싸 보호하는 보호커버;A protective cover surrounding and protecting the LED lighting module;

상기 LED조명모듈의 하부 외연을 감싸면서 상기 방열체에 결합되고, 상기 보호커버가 결합고정되는 결합부재;를 더 포함하는 것을 특징으로 하고,And a coupling member coupled to the radiator while surrounding the lower outer edge of the LED lighting module, wherein the coupling member is fixed to the protective cover.

상기 하우징 내측에 배치되고, 입력전원을 가공하여 상기 LED조명모듈에 구동전원을 공급하는 전원공급부재;A power supply member disposed inside the housing and processing input power to supply driving power to the LED lighting module;

상기 전원공급부재와 전기적으로 연결되고 상기 하우징 하부에 결합되며, 소켓에 결합되어 상용전원을 상기 전원공급부재로 입력하는 베이스;를 더 포함하는 것을 특징으로 하고,And a base electrically connected to the power supply member and coupled to the lower portion of the housing and coupled to a socket for inputting commercial power to the power supply member.

상기 몸체 외연에는 길이방향으로 다수의 방열날개가 형성되어 있고, 몸체는 상기 기류공과 상기 방열날개를 각각 구비하고 있으며 대칭된 형상을 갖는 제1분체 와 제2분체가 암수결합되어 형성되는 것을 특징으로 한다. The outer periphery of the body is formed with a plurality of heat dissipation wings in the longitudinal direction, the body is provided with the air flow hole and the heat dissipation wings, respectively, characterized in that the first powder and the second powder having a symmetrical shape is formed by female and female coupling do.

상기한 바와 같은 구성을 갖는 본 발명은 기류공을 통해 몸체 내외부를 자연스럽게 순환하는 공기를 통해 몸체 내부의 열을 방출시킴으로서 방열효율이 뛰어나고, 몸체는 대칭된 형상을 갖는 제1분체와 제2분체로 이루어져 생산성과 조립성이 탁월하고, 베이스를 구비하여 소켓에 간단하게 전기적으로 체결된다. The present invention having the configuration as described above is excellent in heat dissipation efficiency by releasing heat inside the body through the air circulating naturally inside and outside the body through the airflow hole, the body is the first powder and the second powder having a symmetrical shape It has excellent productivity and assemblability, and has a base that is simply electrically connected to the socket.

이하에서는 도면을 참조하여 본 발명을 보다 구체적으로 설명한다. Hereinafter, with reference to the drawings will be described the present invention in more detail.

도1은 본 발명에 따른 히트싱크(H)에 LED조명모듈(L)이 결합된 상태의 사시도이고, 도2는 도1의 분해사시도이고, 도3은 도1의 단면도이다. 1 is a perspective view of the LED lighting module L is coupled to the heat sink H according to the present invention, FIG. 2 is an exploded perspective view of FIG. 1, and FIG. 3 is a cross-sectional view of FIG. 1.

도면에서 보는 바와 같이 본 발명은 대별하여 몸체(10)와, 상기 몸체(10) 측면에 형성되어 있는 다수의 기류공(20)과, 몸체의 하부에 결합되는 하우징(30)과, 몸체의 상부에 결합되는 방열체(60)와, LED조명모듈(50)을 감싸 보호하는 보호커버(70)와, 방열체에 결합되고 보호커버가 결합되는 결합부재(80)와, 하우징에 내장되는 전원공급부재(90)와, 하우징 하부에 결합되는 베이스(40)를 포함하여 이루어진다. As shown in the figure, the present invention is roughly divided into a body 10, a plurality of airflow holes 20 formed on the side of the body 10, a housing 30 coupled to the lower part of the body, and an upper portion of the body. A heat dissipation unit 60 coupled to the heat dissipation unit, a protective cover 70 surrounding and protecting the LED lighting module 50, a coupling member 80 coupled to the heat dissipation unit, and a protective cover coupled thereto, and a power supply built into the housing. And a base 40 coupled to the lower portion of the housing.

상기 몸체(10)의 상부에는 방열체(60)를 통해 LED조명모듈(L)이 장착되고,The upper part of the body 10 is equipped with an LED lighting module (L) through the heat sink 60,

외면에는 공기와의 접촉면적을 늘려 방열효율을 높이기 위한 방열날개(13) 다수가 길이방향(즉, 상하방향)으로 형성되어 있고, On the outer surface, a plurality of heat dissipation blades 13 are formed in the longitudinal direction (that is, the vertical direction) to increase the contact area with air and to increase the heat dissipation efficiency.

중앙에는 상하를 관통하는 관통공(11)이 형성되어 있다. 상기 관통공(11)에는 상기 LED조명모듈(50)에 구동전원을 공급하는 케이블(미도시)이 관통 삽입된다. In the center, a through hole 11 penetrating up and down is formed. A cable (not shown) for supplying driving power to the LED lighting module 50 is inserted through the through hole 11.

그리고 상기 기류공(20)은 상기 몸체(10)의 측면에 형성되어 몸체(10) 외부와 내부(즉, 관통공(11))를 연결하여 공기의 순환(이동)경로를 형성한다. In addition, the airflow hole 20 is formed at the side of the body 10 to connect the outside and the inside of the body 10 (that is, the through hole 11) to form a circulation (movement) path of air.

상기 기류공(20)은 상기 몸체(10)의 측면에 형성되어 몸체(10)의 내외부를 연통시켜 공기가 몸체(10) 내외부를 순환될 수 있도록 한다. The airflow hole 20 is formed on the side of the body 10 to communicate the inside and outside of the body 10 to allow air to circulate inside and outside the body 10.

LED조명모듈(50)에서 발산되는 열 중 일부는 몸체(10)나 보호커버(70)로 전달되어 직접 외부로 방출되고 일부는 내부(보호커버로 감싸여진 공간과 몸체 내부의 관통공 공간 등) 공기를 가열시킨다. 가열된 공기는 팽창하여 외부와 기압차를 발생시킨다. 그리하여 내외부의 기압차로 인해 몸체(10)와 보호커버(70) 내부의 공기는 자연스럽게 기류공(20)을 통해 몸체(10) 외부로 배출되고, 내부의 공기가 배출됨에 따라 배출된 공기의 양만큼의 차가운 외부 공기가 역으로 내부로 유입된다. 이처럼 공기의 가열, 팽창, 기압차에 의해 내외부의 공기가 자연스럽게 순환되면서 LED조명모듈(50)에서 발산되는 열을 효율적으로 외부로 방출시킨다. Some of the heat emitted from the LED lighting module 50 is transferred to the body 10 or the protective cover 70 is directly discharged to the outside, and some of the inside (space enclosed by the protective cover and through-hole space inside the body) Heat the air. The heated air expands to create a pressure difference with the outside. Therefore, the air inside the body 10 and the protective cover 70 is naturally discharged to the outside of the body 10 through the airflow hole 20 due to the pressure difference between inside and outside, and as much as the amount of air discharged as the air inside is discharged. Cold outside air is introduced into the station in reverse. As the air is naturally circulated by the heating, expansion, and pressure difference of the air, the heat emitted from the LED lighting module 50 is efficiently discharged to the outside.

그리고 상기 기류공(20)은 몸체(10) 외면에서 내면으로 가면서 그 직경이 점차 작아지는 다수의 소기류공(20a)과, 외면에서 내면으로 가면서 그 직경이 점차 커지는 다수의 대기류공(20b)이 있고, 상기 소기류공(20a)과 대기류공(20b)은 교호적으로 배치되는 것이 바람직하다. 내경이 점차 작아지거나 커지는 소기류공(20a)과 대기류공(20b)을 구비하고 이들을 교호적으로 배치함으로서 몸체(10) 내외부 공기의 순환은 보다 원활하게 이루어진다. 몸체(10) 내부의 가열된 공기는 소기류공(20a)을 통해 외부로 배출되고, 몸체(10) 외부의 찬 공기는 대기류공(20b)을 통해 내부로 유입된다. And the air flow hole 20 has a plurality of small air flow holes (20a) gradually decreases in diameter as the diameter goes from the outer surface to the inner surface of the body 10, a plurality of air flow holes (20b) that gradually increases in diameter from the outer surface to the inner surface It is preferable that the small airflow holes 20a and the airflow holes 20b are alternately arranged. By providing a small airflow hole (20a) and the airflow hole (20b) that the inner diameter is gradually smaller or larger, and by arranging them alternately, the circulation of air inside and outside the body 10 is made smoother. Heated air inside the body 10 is discharged to the outside through the small air flow hole (20a), cold air outside the body 10 is introduced into the interior through the air flow hole (20b).

그리고 상기 몸체(10)는 대칭된 형상을 갖는 제1분체(H1)와 제2분체(H2)가 상호 암수결합되어 조립된다. 제1분체(H1)와 제2분체(H2)의 암수결합을 위해 (제1, 제2)분체의 일면과 타면에는 각각 암결합부(18)와 수결합부(17)가 구비된다.The body 10 is assembled by combining the first powder H1 and the second powder H2 having a symmetrical shape with each other. The female coupling part 18 and the male coupling part 17 are provided on one surface and the other surface of the (first and second) powders for the male and female coupling of the first powder H1 and the second powder H2, respectively.

전체적으로 원통형상이며, 측면에서 외부와 내부가 공간적으로 막혀 있는 구조의 몸체(10)는 금형이나 다이캐스팅 등의 방식으로 제조하는 것이 상당히 어려울 뿐만 아니라 금형이나 다이캐스팅 장비가 복잡해지고 생산성이 떨어진다. The overall body 10 is cylindrical, and the body 10 of the structure in which the outside and the inside are spatially blocked is not only difficult to manufacture by a mold or a die casting method, but also a mold or a die casting equipment is complicated and productivity is low.

그래서 본 발명은 몸체(10)를 내부와 외부가 공간적으로 연결되어 있는 제1분체(H1)와 제2분체(H2)가 조립되어 형성하도록 하여 제1분체(H1)와 제2분체(H2)의 제조와 이들이 조립되어 형성되는 몸체(10)의 제조가 용이하도록 하였으며, Thus, in the present invention, the first powder H1 and the second powder H2 are formed by assembling the first and second powders H1 and H2 having spatially connected interiors and exteriors. To facilitate the manufacture of the body and the body 10 is formed by assembling them,

제1분체(H1)와 제2분체(H2)는 대칭된 형상으로 하여 생산성을 높였다. 즉, 제1분체(H1)와 제2분체(H2)는 동일한 형상이며 제1분체(H1)의 일면은 제2분체(H2)의 타면과, 제1분체(H1)의 타면은 제2분체(H2)의 일면과 접촉되어 결합되는 구조로 이루어져, 제1분체(H1)와 제2분체(H2)를 제조하는 제조장치가 각각 필요한 것이 아니라 하나의 제조장치로 동일 형상의 분체 다수를 제작한 후에 두 분체를 조립결합시킴으로서 두 분체는 한 분체는 제1분체(H1)가 되고 다른 하나는 제2분체(H2)가 되는 것이다.The first powder H1 and the second powder H2 have a symmetrical shape to increase productivity. That is, the first powder H1 and the second powder H2 have the same shape, and one surface of the first powder H1 is the other surface of the second powder H2 and the other surface of the first powder H1 is the second powder. It consists of a structure that is in contact with one surface of the (H2), the manufacturing apparatus for manufacturing the first powder (H1) and the second powder (H2) is not required each, but a large number of powders of the same shape with a single manufacturing device After the two powders are assembled, the two powders become one powder (H1) and the second powder (H2).

상기 하우징(30)은 상기 몸체(10) 하부에 결합되고, 그 내측에는 상기 전원공급부재(90)가 내장되고, 하부에는 베이스(40)가 결합된다. The housing 30 is coupled to the lower portion of the body 10, the power supply member 90 is embedded therein, and the base 40 is coupled to the lower portion thereof.

상기 하우징의 상부에는 상기 몸체 하부에 형성되어 있는 걸림돌기(15)가 걸려 결합되는 걸림홀(35)이 형성되어 있고, 하우징 내면에는 내장되는 전원공급부재(90)의 테두리를 지지하는 다수의 지지부(31)와 몸체(10)의 테두리를 지지하는 단턱부(32)가 형성되어 있고, 하우징 하부면에는 전원공급부재(90)에서 발산되는 열을 외부로 방출시키기 위한 통기공(33)이 다수 형성되어 있고, 하부 중앙에는 베이스(40)가 결합되는 결합부(37)가 돌출형성되어 있다. 상기 결합부에 형성되어 있는 홀(37h)을 통해 케이블(미도시)이 베이스와 전원공급부재를 전기적으로 연결한다. The upper part of the housing is formed with a catching hole 35 for engaging the engaging projection 15 is formed in the lower portion of the body, the inner surface of the housing a plurality of support for supporting the edge of the power supply member 90 is built A step portion 32 supporting the edges of the 31 and the body 10 is formed, and a plurality of vent holes 33 for dissipating heat emitted from the power supply member 90 to the outside are provided on the lower surface of the housing. Is formed, the engaging portion 37 to which the base 40 is coupled is formed in the lower center protruding. A cable (not shown) electrically connects the base and the power supply member through the holes 37h formed in the coupling portion.

상기 베이스(40)는 일반적인 백열전구에 구비되어 있는 베이스와 같이 외주 연에는 소켓(미도시)에 스크류결합되는 나사산(41)이 형성되어 있고, 하부에는 소켓에 전기적으로 연결되는 제1단자(43)가 구비되고 상기 나사산 소정부위(또는 나사산 자체)에는 소켓에 전기적으로 연결되는 제2단자가 구비된다. The base 40 has a thread 41 which is screwed to a socket (not shown) at the outer circumference of the base, such as a base provided in a general incandescent lamp, and a first terminal 43 electrically connected to the socket at a lower portion thereof. ) Is provided and the predetermined portion of the thread (or the thread itself) is provided with a second terminal electrically connected to the socket.

참고로, 상기 LED조명모듈(50)은 광원으로서 LED(51)와, 상기 LED(51)가 실장되며 방열 효율이 뛰어난 메탈PCB(53)를 포함한다. 그리고 전방과 측면 전방향을 조명할 수 있도록 전체적으로 반구형상의 다면구조(도면상으로는 6면구조)로 되어있고, 중앙 상부에는 보호커버 내에서 가열된 공기가 몸체의 관통공(11)으로 이동할 수 있도록 하는 유통공(55)이 형성되어 있다. For reference, the LED lighting module 50 includes an LED 51 as a light source, and a metal PCB 53 on which the LED 51 is mounted and excellent in heat dissipation efficiency. And it has a hemispherical multi-sided structure (6 sides in the figure) so as to illuminate the front and side all directions, and in the upper part of the center to allow the heated air to move to the through hole 11 of the body The distribution hole 55 is formed.

상기 방열체(60)는 상기 몸체(10) 상부에 접촉 결합(결합구조 미도시)되고 반구형상의 상기 LED조명모듈(50) 내측에 배치되어 LED조명모듈에서 전달되는 열을 몸체로 전달한다. The radiator 60 is contact-coupled (not shown in the coupling structure) to the upper portion of the body 10 and disposed inside the LED lighting module 50 in a hemispherical shape to transfer heat transferred from the LED lighting module to the body.

그리고 방열체 외주연에는 길이방향으로 다수의 방열편(61)이 형성되어 공기와의 접촉면적을 늘림으로서 LED조명모듈(50)에서 발산되는 열을 보다 효율적으로 전달 받아 몸체(10)로 전달한다. In addition, a plurality of heat dissipation pieces 61 are formed on the outer periphery of the heat dissipator to increase the contact area with the air to more efficiently transmit heat emitted from the LED lighting module 50 to the body 10. .

그리고 상하를 관통하는 중공(63)이 형성되어 LED조명모듈(50) 및 보호커버(70) 내부와 몸체(10)의 관통공(11)을 연통시킴으로서 공기가 이들 사이를 원활 히 이동할 수 있도록 한다. A hollow 63 penetrating the upper and lower sides is formed to communicate the inside of the LED lighting module 50 and the protective cover 70 with the through hole 11 of the body 10 so that air can move smoothly between them. .

상기 보호커버(70)는 상기 반구형상의 LED조명모듈(50)을 감싸 보호하고 투명재질로 이루어져 LED(51)에서 발산되는 광을 투과시킨다. The protective cover 70 surrounds and protects the hemispherical LED lighting module 50 and is made of a transparent material to transmit light emitted from the LED 51.

그리고 하부에는 상기 결합부재(80) 외주연에 돌출 형성되어 있는 걸림돌기(85)가 삽입되어 걸리는 걸림홀(75)이 형성되어 있다. And the lower portion is formed with a locking hole 75 is inserted into the engaging projection 85 is formed protruding to the outer periphery of the coupling member (80).

상기 결합부재(80)는 반구형상의 LED조명모듈(50) 하부 외주연을 감싸면서 상기 방열체(60)에 결합(결합구조 미도시)되고, 상부에는 보호커버(70)의 하부가 결합된다. The coupling member 80 is coupled to the radiator 60 while surrounding the outer circumference of the hemispherical LED lighting module 50 (not shown in the coupling structure), and the lower portion of the protective cover 70 is coupled to the upper portion.

보호커버와 결합하기 위해 상부에는 보호커버의 걸림홀(75)에 걸리는 걸림돌기(85)가 돌출형성되어 있고, 결합된 보호커버가 돌출되지 않도록 상부 외주연에는 단턱(81)이 형성되어 있다. In order to engage with the protective cover, an upper locking protrusion 85 is formed at the upper portion of the locking hole 75 of the protective cover, and a stepped portion 81 is formed at the upper outer circumference so that the combined protective cover does not protrude.

그리고 결합부재의 내면은 삽입된 LED조명모듈이 움직이지 않도록 LED조명모듈(50)의 다면구조에 대응하는 다면구조(도면상 6면구조)로 되어 있다. And the inner surface of the coupling member is a multi-faceted structure (six-faced structure on the drawing) corresponding to the multi-faceted structure of the LED lighting module 50 so that the inserted LED lighting module does not move.

이상에서 본 발명을 설명함에 있어 첨부된 도면을 참조하여 특정 형상과 구조를 갖는 LED조명용 히트싱크에 대해 설명하였으나 본 발명은 당업자에 의하여 다 양한 변형 및 변경이 가능하고, 이러한 변형 및 변경은 본 발명의 보호범위에 속하는 것으로 해석되어야 한다.In the above description of the present invention, a heat sink for LED lighting having a specific shape and structure has been described with reference to the accompanying drawings. However, the present invention can be variously modified and changed by those skilled in the art. It should be interpreted as falling within the protection scope of.

도1은 본 발명에 따른 히트싱크에 LED조명모듈이 결합된 상태의 사시도.1 is a perspective view of the LED lighting module coupled to the heat sink according to the present invention.

도2는 도1의 분해사시도.Figure 2 is an exploded perspective view of Figure 1;

도3은 도1의 단면도.3 is a cross-sectional view of FIG.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10 : 몸체 11 : 관통공10: body 11: through hole

13 : 방열날개 15 : 걸림돌기13: heat dissipation wing 15: jamming projection

20 : 기류공 20a : 소기류공20: air flow hole 20a: small air flow ball

20b : 대기류공 30 : 하우징20b: air flow hole 30: housing

31 : 지지부 33 : 통기공31: support 33: aeration hole

40 : 베이스 50 : LED조명모듈40: base 50: LED lighting module

60 : 방열체 61 : 방열편60: radiator 61: radiator

63 : 중공 70 : 보호커버63: hollow 70: protective cover

80 : 결합부재 90 : 전원공급부재80: coupling member 90: power supply member

Claims (5)

상하를 관통하는 관통공이 형성되어 있고, 상부에는 LED조명모듈이 결합되는 몸체;A through hole penetrating the upper and lower sides is formed, the upper body is the LED lighting module is coupled; 상기 관통공과 외부 사이를 공기가 이동되도록 상기 몸체 측면에 형성되어 있는 다수의 기류공;을 포함하여 이루어진 기류를 이용한 LED조명용 히트싱크.Heat sink for LED lighting using airflow, including; a plurality of airflow holes formed on the side of the body to move the air between the through-hole and the outside. 제 1 항에 있어서,The method of claim 1, 상기 다수의 기류공은 몸체 외면에서 내면으로 가면서 그 직경이 점차 작아지는 다수의 소기류공과, 외면에서 내면으로 가면서 그 직경이 점차 커지는 다수의 대기류공으로 구성되는 것을 특징으로 하는 기류를 이용한 LED조명용 히트싱크.The plurality of air flow holes for the LED light using the air flow, characterized in that composed of a plurality of small air flow holes whose diameter gradually decreases from the outer surface to the inner surface, and a plurality of air flow holes gradually increasing in diameter from the outer surface to the inner surface Heatsink. 제 1 항 또는 제 2 항에 있어서,The method according to claim 1 or 2, 상기 몸체의 하부에 결합되는 하우징;A housing coupled to the lower portion of the body; 상하를 관통하여 상기 관통공과 연통되는 중공을 구비하고, 외주연에는 길이방향으로 방열편이 다수 형성되어 있으며, 반구 형상의 상기 LED조명모듈 내측에 배치되고, 상기 몸체 상부에 결합되는 방열체;A radiator having a hollow penetrating up and down and communicating with the through hole, and having a plurality of heat dissipation pieces formed in a longitudinal direction at an outer circumference thereof, the radiator being disposed inside the LED lighting module having a hemispherical shape and coupled to an upper portion of the body; 상기 LED조명모듈을 감싸 보호하는 보호커버;A protective cover surrounding and protecting the LED lighting module; 상기 LED조명모듈의 하부 외연을 감싸면서 상기 방열체에 결합되고, 상기 보호커버가 결합고정되는 결합부재;를 더 포함하는 것을 특징으로 하는 LED조명용 히 트싱크.And a coupling member coupled to the radiator while surrounding the lower outer edge of the LED lighting module and fixed to the protective cover. 제 4항에 있어서,The method of claim 4, wherein 상기 하우징 내측에 배치되고, 입력전원을 가공하여 상기 LED조명모듈에 구동전원을 공급하는 전원공급부재;A power supply member disposed inside the housing and processing input power to supply driving power to the LED lighting module; 상기 전원공급부재와 전기적으로 연결되고 상기 하우징 하부에 결합되며, 소켓에 결합되어 상용전원을 상기 전원공급부재로 입력하는 베이스;를 더 포함하는 것을 특징으로 하는 LED조명용 히트싱크.And a base electrically connected to the power supply member and coupled to a lower portion of the housing and coupled to a socket for inputting commercial power into the power supply member. 제 4 항에 있어서,The method of claim 4, wherein 상기 몸체 외연에는 길이방향으로 다수의 방열날개가 형성되어 있고, 몸체는 상기 기류공과 상기 방열날개를 각각 구비하고 있으며 대칭된 형상을 갖는 제1분체와 제2분체가 암수결합되어 형성되는 것을 특징으로 하는 LED조명용 히트싱크The outer periphery of the body is formed with a plurality of heat dissipation wings in the longitudinal direction, the body is provided with the air flow hole and the heat dissipation wings, respectively, characterized in that the first powder and the second powder having a symmetrical shape is formed by female and female coupling Heat sink for LED lighting
KR1020090037987A 2009-03-20 2009-04-30 LED Heat Sink KR101052605B1 (en)

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WO2013169498A1 (en) * 2012-05-08 2013-11-14 3M Innovative Properties Company Solid state light with aligned light guide and integrated vented thermal guide

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KR101911762B1 (en) 2011-08-09 2018-10-26 엘지이노텍 주식회사 Lighting device
KR101330698B1 (en) 2012-08-16 2013-11-18 후지라이테크 주식회사 Balloon illuminator

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KR100891433B1 (en) * 2007-04-16 2009-04-06 주식회사 남영전구 An apparatus for radiating heat of led light

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013169498A1 (en) * 2012-05-08 2013-11-14 3M Innovative Properties Company Solid state light with aligned light guide and integrated vented thermal guide
US8926131B2 (en) 2012-05-08 2015-01-06 3M Innovative Properties Company Solid state light with aligned light guide and integrated vented thermal guide

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