KR20100050074A - Heatsink using nanoparticles - Google Patents

Abstract

PURPOSE: A radiator is provided to prevent the formation of the hot spot by transferring the heat to each site of a base member through the heat transfer materials. CONSTITUTION: A radiator comprises a base member(12), a plurality of heat radiation fans(13), a root(20), and heat transfer material(30). The base member has a heat generating component mounting part. A plurality of heat radiation fans are arranged in the base member and the outer circumference. The root is formed inside the base member or the heat radiation fan with a predetermined shape. The root comprises a main route and a branch root. The heat transfer material is filled inside the root. The heat transfer material is made of the gold nanopowder, the silver nanopowder, the copper nanopower, or the mixture of the copper nanopowder and the silver nanopowder.

Description

Heat dissipation device using nano powders {heatsink using Nanoparticles}

The present invention relates to a heat dissipation device, and more particularly, to a high output light emitting diode, and relates to a heat dissipation device using nano powder.

In general, the light emitting diodes are used for a relatively high illuminant emitter, backlight, lighting, etc. In particular, recently, low power consumption high output light emitting diodes have been developed. Such light emitting diodes have advantages such as high lifespan, low power consumption, environment friendliness, and thinning, but have low light efficiency. The light efficiency of the light emitting diode having this advantage is about 20-30%. When the light efficiency is 30% at the power consumption of the light emitting diode 1W, the power consumption rate generated by heat is 70%.

As described above, the heat generated from the light emitting diodes causes the light emitting diodes to deteriorate and the life thereof is halved. Therefore, heat dissipation means are essential for high output light emitting diodes. Such light emitting diodes have been extended to household appliances, and researches on heat radiation devices for dissipating heat from light emitting diodes have been actively conducted.

Korean Patent Laid-Open Publication No. 2005-0086391 discloses an LED package printed circuit board having a cooling function and a method of manufacturing the same. The disclosed printed circuit board is disclosed in which a heat pipe on a flat plate is provided.

In Korean Patent Laid-Open No. 2006-008605, a heat dissipation structure of an LED package and an LED package having the structure are provided. The disclosed LED package includes an LED chip, a metal slug bonded to the LED chip using an adhesive layer, and a molding surrounding the LED chip. It includes a substrate.

The heat dissipation structure of the LED package or the LED package having the cooling function configured as described above is relatively complicated in structure, and since heat dissipation is performed by heat transfer with air, it is difficult to expect a sufficient cooling effect. In particular, in the case of a high output LED, the heat dissipation structure as described above cannot prevent the degradation of the LED due to heat.

On the other hand, Korean Patent No. 0660126 discloses a circuit board having a heat sink structure. The disclosed circuit board includes a circuit board having a lead wire for supplying current to an optical element array on a first surface, a first metal heat sink for dissipating heat generated from an optical device in a whole of the circuit board, and a heat sink and lead wire. An insulating film for electrically insulating is provided, and the insulating film has a structure composed of an epoxy film in which aluminum nitride powder is injected therein. This technical configuration prevents the heat generated from the heat generated from the optical device by increasing the heat dissipation surface area, but the structure is relatively complicated and the manufacturing of the circuit board is difficult.

The present invention is to solve the problems described above, it is possible to improve the heat emission characteristics generated from the light emitting diode of high brightness, and to provide a heat dissipation device using a nano powder that can fundamentally prevent deterioration by heat of the light emitting diode In providing.

Another object of the present invention is to reduce the heat dissipation area and to improve the thermal conductivity, and to provide a heat dissipation device using a nano powder having a relatively simple structure.

In order to achieve the above object, the heat dissipation device of the present invention includes a base member having a heat generating part mounting portion, a plurality of heat dissipation fans installed on the base member and an outer circumferential surface, and a root formed in a predetermined shape inside the base member or heat dissipation fan. It characterized by including a heat transfer material on the nano-powder filled in the interior.

In the present invention, the heat transfer material may be made of gold nano powder, silver nano powder, copper nano powder, synthetic powder of silver nano powder and copper nano powder. Herein, the particle size of the silver nanopowder and the copper nanopowder is preferably set to 2 to 10 nm.

The heat dissipation device according to the present invention can improve heat dissipation characteristics by using nanoparticles having a property of increasing thermal conductivity by increasing the surface area per unit mass, and can prevent the formation of hot spots on a specific part. Such a heat dissipation device can be applied as a heat dissipation device of a high output light emitting diode.

The heat dissipation device according to the present invention can improve thermal conductivity by using nanopowders, and an embodiment thereof is shown in FIG. 1.

Referring to the drawings, the heat dissipation apparatus 10 includes a base member 12 having the light emitting diode module 100 having a heat generating component mounting portion 11, a plurality of heat dissipation fins 13 installed on the base member and an outer circumferential surface thereof, It includes a heat transfer material 30 of the nano-powder filled in the interior of the root 20 is formed in the base member or the heat radiation 소정.

The base member 12 may be manufactured in various forms according to a heat dissipation component to release (heat radiate) heat. As shown in FIG. 1, the heating part mounting part may be formed in a plate shape, or as illustrated in FIG. 2, the upper and lower plate members may be connected by struts.

The heat dissipation fins 13 formed on the base member 12 are intended to widen the surface area, and may be formed in the shape of a thin plate or a fin, but are not limited thereto and may be configured to increase the surface area. For example, unevenness may be formed in a region other than the heat dissipation part mounting portion 11 to increase its surface area.

The root 20 formed on the base member 12, that is, the main root part 21 formed on the side corresponding to the heat generating part mounting part 11 and the main root part 21 formed inside the main body and filled with the nanopowder, Branch roots 22 are formed radially from the root portion 21. The main route 21 is preferably formed to be substantially the same as or smaller than the area of the heating component mounting portion (11). In addition, the branch route 22 is radially formed from the main route 21, so that the cross-sectional area gradually decreases toward the end portion so that heat transfer can be smoothly performed by the heat transfer member 30. The present invention is not limited thereto and may be formed in various forms according to the structure of the base member 12. An auxiliary branch route 23 connecting them may be formed at the end of the separation route 22.

For example, as shown in FIG. 4, when the base members 12 and 14 are connected by the support 15, a root is formed in the base members 12 and 13 and the support as described above, and a heat transfer material is provided. 30 may be charged.

The heat transfer material may be composed of a mixture of gold nano powder, silver nano powder, copper nano powder or silver nano powder and copper nano powder gold nano powder. Herein, the particle size of the gold, silver or copper nano powder is preferably 2 to 10 nm or less.

On the other hand, although not shown, when the high output light emitting diode and the main body for heat dissipation are modularized, the main body for heat dissipation may be formed as described above, and the heat transfer material may be filled in the root.

Referring to the operation of the heat radiating device according to the present invention configured as described above are as follows.

In order to dissipate heat generated by a heat generating part such as a high brightness light emitting diode 100 using the heat dissipation device 10 using the nanopowder according to the present invention, first, a heat conductive adhesive or sheet is applied to the heat generating part mounting part 11 of the heat dissipation device. A high brightness light emitting diode 100 is attached using a thermal connection sheet.

In this state, if heat is generated therefrom due to the driving of the light emitting diodes 100, the heat is radiated by the outside air and the radiator 10. That is, the heat generated from the light emitting diodes 100 is transferred to the heat dissipation beam 13 of the base member 12 to be heat-exchanged with the outside air, thereby dissipating heat. In this process, since the base member 12 is filled with gold nanopowder, silver nanopowder, copper nanopowder, or a mixture thereof, which are heat transfer members 30, the base member 12 is radiated to the radial direction and the heat dissipation side of the base member by the heat transfer member 30. Heat transfer can be achieved within a short time. In more detail, the nano-powder-shaped heat transfer material 30 is higher than the thermal conductivity through the base member because the surface area per unit mass is relatively increased to increase the thermal conductivity. Accordingly, the heat transfer member 30 radially installed from the heat generating component mounting portion 11 of the base member 12 forms a core for transferring heat from the light emitting diode 100, and the base member 12 is formed from the core having a high temperature. Heat is transferred to each part of the heat dissipation 휜 (13) to maximize the heat dissipation efficiency.

In particular, since the gold nano powder, silver nano powder, copper nano powder or a mixture thereof is filled, the heat transfer material 30 is filled in the main route 21 and the branch route 22 to heat each part of the base member 11. It is possible to fundamentally prevent the formation of hot spots in which heat is regenerated at specific sites.

Meanwhile, as shown in FIG. 3, the base members 12 and 14 are connected by the support 15 to widen the heat dissipation surface area, and the support 15 may maximize the heat dissipation effect when the heat radiation fan is installed in the base member. have. In addition, the branch route 22 filled with the heat transfer member 30 has various patterns according to the characteristics of the base member 12, for example, as shown in FIG. 4. ) May form an auxiliary branch route 23.

As described above, the heat dissipation device using the nano-powder can maximize the emission efficiency of the heat generating parts, in particular the light emitting diodes or the module, thereby enabling the production of high power light emitting diode modules.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention.

Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

The heat dissipation device using the nano powder according to the present invention can be widely applied to heat dissipation in various electronic components such as light emitting diodes, modules, and semiconductor chips using the same.

1 is a partially cutaway perspective view of a heat dissipation device using a nano powder according to the present invention;

2 is a partially cutaway perspective view showing another embodiment of the heat dissipation device using the nanopowder according to the present invention;

3 and 4 are perspective views showing other embodiments of the heat dissipation device using a nano powder according to the present invention.

Claims (4)

A base member having a heat generating part mounting portion, a plurality of heat dissipation beams provided on the base member and an outer circumferential surface, a root formed in a predetermined shape inside the base member or heat dissipation glass, and nanopowder filled in the roots Heat dissipation device using nano-powder, characterized in that it comprises a phase transfer material. The method of claim 1, The heat transfer material is a heat dissipation device using a nano powder, characterized in that consisting of a mixture of gold nano powder, silver nano powder, copper nano powder, silver nano powder and copper nano powder. The method of claim 1, The route in which the heat transfer material is filled includes a main route formed in the base member on the side corresponding to the heat generating component mounting portion, and a branch route formed radially from the main route. The method of claim 1, The base member is connected to be spaced apart by a predetermined interval by the struts, the heat dissipation device using nano-powder, characterized in that stacked.

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