KR20090088029A - Probe card - Google Patents

Abstract

A probe card is provided to control the height of the mount tip based on data of the field in case the poor contact is generated. The probe card comprises the frame(110), the probe mounting bar(200), the printed circuit board(120), the stiffener(140), a planarization controlling unit(300). The frame is installed at the lower part of a plurality of probes. And the probe mounting bar is positioned in the lower part of frame. The printed circuit board is positioned on the frame to which the probe which is installed. The planarization controlling unit is distributed on the stiffener. The stiffener is positioned on the printed circuit board.

Description

Probe Card

The present invention relates to a probe card for inspecting a semiconductor wafer, and more particularly, the height of the mounting tip can be adjusted up and down, and the flattening means for distributing the adjusting portion to the probe mounting bar and the frame can be used for the printed circuit board. The present invention relates to a probe card that can adjust flatness easily and accurately.

In general, in order to produce a semiconductor product, a process of manufacturing a pure silicon wafer, a process of manufacturing a semiconductor chip by forming a pattern on the pure silicon wafer, and testing the electrical characteristics of the semiconductor chip to determine the quality of the semiconductor chip A series of semiconductor manufacturing processes are required, including an electric die sorting (EDS) process, a process of packaging good semiconductor pips, and a final test of the packaged semiconductor chip.

Among the chips determined as defective through the process of testing the electrical characteristics, the repairable chips are repaired and repaired, and the non-repairable chips are removed before performing the assembly process. Therefore, the electrical property test process is one of the important processes to reduce the assembly cost in the assembly process and improve the yield of the semiconductor chip manufacturing process.

When the apparatus for performing the ID process is referred to as a probe system, such a probe system is provided with a probe card provided with probe tips contacting and applying an electrical signal to a conductive pad formed on an inspection object such as a wafer.

A probe card provided in a probe system for inspecting electrical characteristics of a conventional semiconductor device will be described with reference to the accompanying drawings.

1 is an exploded perspective view illustrating a probe card for testing a semiconductor device according to the related art.

As shown in the drawing, a conventional probe card 10 for testing a semiconductor device includes a plurality of probes 11 formed of thin plates, and a probe mounting bar on which the probes 11 are mounted directly or by a separate fixing member. The frame 11 and the frame 13 in which the opening 13a through which the probe 11 is exposed and the probe mounting bar 12 are arranged to be arranged in a plurality, and the frame 13 are fixed, the probe 11 A printed circuit board 14 to which is electrically connected.

In the conventional semiconductor device inspection probe card 10, the end of the probe 11 is inspected while the probe 11 is electrically connected to the pad of the printed circuit board 14, either directly or by a separate connection member. Are electrically connected to each other by contacting the connection pads 2 of the chips formed on the semiconductor wafer 1, which are the targets of the semiconductor wafers 1, thereby connecting the signals generated from the tester to the probe system to the connection pads on the semiconductor wafer 1. 2) to pass.

Since the conventional probe card 10 is deformed due to the characteristics of the printed circuit board 14, the surface on which the frame 13 is positioned on the printed circuit board 14 to prevent the deformation of the printed circuit board 14. On the opposite side of the reinforcement plate 15 is provided.

In the conventional semiconductor device test probe card 10, the flatness of the printed circuit board 14 has a great influence on the accuracy of the inspection of the chip of the semiconductor wafer 1 and the operation rate of the inspection equipment due to maintenance and repair. The flatness of the printed circuit board 14 is controlled.

As a method of adjusting the flatness of the printed circuit board 14, in particular, the flatness of the vertical probe card is a method of inserting a height adjusting shim member between the fixed frame 13 and the reinforcing plate 15. After the coupling of the probe mounting bar 12 and the reinforcing plate 13 with a bolt or the like, a method of flattening is mainly used by narrowing with a mounting tip attached to the probe mounting bar 12.

However, in the method of inserting the shim member, productivity is reduced due to repeated disassembly and assembly of the structure, and there is a problem that may cause damage to the product, and the method of narrowing the tip may be a length of the tip of the probe mounting bar 12. Because it is limited, the depth that can be narrowed is also limited, there is a problem that the structure is not easy to apply.

In addition, there is a problem that the poor contact of the mounting tip or the scrub is weakened by the heat source generated during the test process.

The present invention has been devised in accordance with the present invention, the purpose of which is to adjust the height of the mounting tip up and down, and to facilitate the flattening of the printed circuit board by distributing the adjustment portion to the probe mounting bar and the frame to adjust the flatness of the entire probe mounting bar. It also provides a probe card that can be precisely adjusted.

The probe card of the present invention for achieving the above object is provided with a frame in which a plurality of probes are installed at the bottom, and a probe mounting bar which is provided at the bottom of the frame is provided with mounting tips for mounting the probes to the frame, and on the frame A printed circuit board positioned on the frame to which a probe installed at the connected circuit is connected, a reinforcement plate positioned on the printed circuit board, and distributed over the entire surface of the reinforcement plate, and adjusting the height of the mounting tip, and adjusting And a plurality of flat adjustment means for adjusting the flatness of the mounting tip by distributing the portion to the frame and the probe mounting bar.

In the present invention, each of the flat adjustment means is formed on the upper end, one is screwed to the frame through the reinforcement plate, the printed circuit board, the other is the reinforcement plate, the printed circuit board, First and second leveling bolts which are screwed to the probe mounting bar through the frame and are capable of adjusting the height of the mounting tip by rotation, and are positioned on the reinforcement plate so as to be located above the engaging portion of the leveling bolts. It characterized in that it comprises a leveling nut screwed to the upper base plate.

According to the present invention, the height of the corresponding mounting tip is adjusted up and down according to the rotation of the leveling bolt, and the adjustment portions are distributed to the probe mounting bar and the frame so as to adjust the height of the entire probe mounting bar. The height can be adjusted so that the height can be adjusted.When testing or mass-producing the probe card at the work site, if the contact is weak or poor in scrub, adjust the height of the mounting tip based on the data of the site. It does not cause waste and product damage.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

FIG. 2 is a perspective view illustrating a probe card according to an exemplary embodiment of the present invention, and FIG. 3 is a partial cutaway cross-sectional view showing the flat adjustment means of the probe card of FIG. 2 in detail.

As shown, the semiconductor device test probe card 100 of the present invention is provided in a probe system that inspects electrical characteristics of a semiconductor device, and a frame 110 in which a plurality of probes (not shown) is installed at a lower portion thereof. ), A printed circuit board 120 positioned on the frame 110, and mounting tips 210 for mounting the probes to the frame 110 are provided to provide a probe mounting bar positioned below the frame 110. 200, a printed circuit board 120 positioned on the frame 110 to be connected to a probe installed in the frame 110, a stiffener 140 located on the printed circuit board 120, and It is distributed over the entire area of the reinforcing plate 140, it is possible to adjust the height of the mounting tip 210, the control portion is distributed to the frame 110 and the probe mounting bar 200 so that the printed circuit board as a whole flat It includes a plurality of flat adjustment means 300 to adjust. A pad 124 made of silicon or a metal material is inserted between the frame 110 and the printed circuit board 120 to electrically connect the two.

The flat adjustment means 300 are arranged in a vertical direction and distributed over the entire area of the reinforcing plate 140.

The flat adjustment means 300 shown in detail in FIG. 3 is composed of first and second leveling bolts 320 and leveling nuts 350 in contact with their respective upper portions, each of which is a leveling bolt 320. A catching part 310 is formed at an upper end thereof, and the first leveling belt 320 passes through the through hole 122 of the reinforcing plate 140 and the printed circuit board 120 with the bush 126 interposed therebetween. The screw is rotatably coupled to the 110, and the second leveling bolt 320 is rotatably screwed to the probe mounting bar 200 through the reinforcing plate 140, the printed circuit board 120 and the frame 110. do. Accordingly, the adjusting portion is distributed to the frame 110 and the probe mounting bar 200.

The leveling nut 350 is screwed to the upper base plate 330 positioned above the reinforcing plate 140, and is fixed with a predetermined torque in contact with the engaging portion 310 of the leveling bolt 320.

The flat adjustment method of the probe card of the present invention configured as described above will be described with reference to FIG. 4.

First, the leveling portion for adjusting the flatness is adjusted to adjust the probe mounting bar 210 to the reinforcing plate 140, the printed circuit board 120, the frame 110 through the probe mounting bar 200 The first leveling bolt 320 is screwed to a predetermined torque) and the adjustment portion for adjusting the frame 110 through the reinforcement plate 140, the printed circuit board 120 is fixed to the frame 110 After separating with the second leveling bolt 320 screwed with torque, and arranged to enable leveling for a specific position, the leveling nut 350 is contacted on the engaging portion 310 of each leveling bolt 320 In one state, the upper base plate 330 is fixed by screwing with a constant torque.

After checking the flatness by measuring the height of the mounting tip 210 in such an assembled state, the leveling bolt 320 is rotated according to the flat deviation to adjust the height of the mounting tip 210 up and down.

When the leveling bolt 320 is rotated clockwise in the tightening direction, the mounting tip 210 squeezed with the prop card 100 is raised, and conversely, in the counterclockwise direction in the unwinding direction of the leveling bolt 320. When rotated to the mounting tip 210 is lowered.

Although not described as a specific example, the probe card of the present invention as described above, if the flat adjustment means that can adjust the height of the mounting tip 210 up and down by properly distributing the adjustment portion to the probe mounting bar and the frame, the specific portion It will be appreciated that the height can be adjusted for.

On the other hand, Figure 5 and Figure 6 shows a cross section of the probe card according to another embodiment of the present invention, Figure 5 is a reinforcement plate 140 and the upper base plate 330 is integrally configured, Figure 6 is printed Since the plate 170 is interposed between the circuit board 120 and the reinforcing plate 140, the same structure as in the embodiment of FIG. 3 operates in the same manner, and thus the detailed description thereof will be omitted.

What has been described above is only preferred embodiments of the probe card according to the present invention, and the present invention is not limited to the above-described embodiments, so as not to depart from the gist of the present invention as claimed in the following claims. Without departing from the scope of the present invention, those skilled in the art will have the technical spirit of the present invention to the extent that various modifications can be made.

1 is an exploded perspective view showing a probe card for testing a semiconductor device according to the prior art;

2 is a perspective view of a probe card according to an embodiment of the present invention,

3 is a partially cutaway cross-sectional perspective view illustrating the flat adjustment means of FIG. 2 in detail;

Figure 4 is a cross-sectional view illustrating the height adjustment operation of the probe card of the present invention,

5 and 6 are cross-sectional views of probe cards according to another preferred embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: probe card 110: frame

120: printed circuit board 140: reinforcement plate

200: probe mounting bar 210: mounting tip

300: flat adjustment means 310: locking portion

320: leveling bolt 330: upper base plate

350: leveling nut

Claims (4)

A probe card for inspecting a semiconductor device, The probe card is a frame in which a plurality of probes are installed at the bottom, Probe mounting bars provided at the bottom of the frame to provide mounting tips for mounting the probes to the frame; A printed circuit board positioned on the frame to which a probe installed on the frame is connected; A reinforcing plate positioned on the printed circuit board; It is distributed over the entire area of the reinforcing plate, and the tension given at the time of adjusting the height of the mounting tip according to the flat deviation of the printed circuit board according to the height of the mounting tip is distributed to the frame and the probe mounting bar of the mounting tip It includes a plurality of flat adjustment means for adjusting the flatness Probe card for testing semiconductor devices. The method of claim 1, The flat adjustment means is formed on each upper end, One is screwed to the frame through the reinforcing plate and the printed circuit board, the other is screwed to the probe mounting bar through the reinforcing plate and the printed circuit board and the frame, by rotating the Leveling bolts to adjust the height of the mounting tip, And a leveling nut screwed to an upper base plate positioned above the reinforcement plate so as to be positioned above the engaging portion of the leveling bolt. Probe card. The method of claim 2, The leveling nut is fixed to a predetermined torque in a state in contact with the engaging portion of the leveling bolt Probe card. The method of claim 2, Rotating the leveling bolt in the tightening direction according to the height deviation of the mounting tip to raise the mounting tip, characterized in that rotating in the release direction to lower the mounting tip Probe card.

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