KR20090042045A

KR20090042045A - Chip mounter having height measurement apparatus of parts

Info

Publication number: KR20090042045A
Application number: KR1020070107918A
Authority: KR
Inventors: 박형근
Original assignee: 삼성테크윈 주식회사
Priority date: 2007-10-25
Filing date: 2007-10-25
Publication date: 2009-04-29

Abstract

The present invention provides a component mounter having a component height measuring device. The component mounter includes a bed, a component supply apparatus mounted on the bed to supply components, a substrate transportation apparatus for transporting a substrate so that the components are mounted, and picking up the components from the component supply apparatus to transfer the picked-up components to the substrate. A head to be mounted and a component height measuring device for measuring the height of the components that are previously mounted on the substrate before the head is mounted to the substrate. Therefore, the component mounter according to the present invention uses the component mounter of the present invention because the component height measuring device is provided so that the head can measure the height of the component that is mounted in advance on the substrate before the component is mounted on the substrate. When the new component is mounted on the substrate, the height of the existing component previously mounted on the substrate can be measured in advance.

Description

Chip mounter having height measurement apparatus of parts

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounter for mounting a component on a substrate provided in a surface mount system, and more particularly, to a component mounter having a component height measuring device to measure a height of a component pre-mounted on a substrate. It is about.

In general, surface mount technology (Surface Mount Technology) is printed on the printed circuit board (Solder Paste) on the printed circuit board (Solder Paste), and then mounted a variety of surface-mount components on it and melt the solder paste at high temperature Refers to a technology for bonding a printed circuit board and leads of a surface mount component to each other.

In order to perform the surface mounting work by the surface mounting technology, a plurality of devices for performing each unit process should be provided, and the plurality of devices should be arranged very appropriately.

Therefore, in recent years, in order to maximize the efficiency of the process, a surface mounting system in which a plurality of devices performing each unit process are arranged in-line has been widely used.

1 is a block diagram illustrating an example of a surface mount system having a conventional component mounter.

Referring to FIG. 1, a conventional surface mounting system 90 solders a component to a loader 10 for loading a printed circuit board, and a surface of the surface of the loaded printed circuit board on which the component is to be mounted. A screen printer 20 for printing solder paste, a plurality of component mounters 40 for mounting the components on a printed circuit board on which the solder paste is printed, and the component mounters 40 A first inspector 50 for checking whether the component is well mounted on the printed circuit board, and a printed circuit board with the component heated to a high temperature so that the component can be soldered to the printed solder. A reflow oven 60 for melting paste, a second inspector 70 for checking whether the parts are soldered well, and an unloader for unloading a printed circuit board to which the parts are soldered ( po unloader, 80) It is.

At this time, the plurality of devices 10, 20, 40, 50, 60, 70, 80 are arranged inline, the interior of the plurality of devices (10, 20, 40, 50, 60, 70, 80) Alternatively, the substrate transport apparatus 43, 45, 47, such as a belt, is provided at the lower portion to transfer the printed circuit board according to the process progression of the surface mounting process.

On the other hand, the component mounting process for mounting the component on the printed circuit board of each of the unit processes that the plurality of devices proceed takes a lot of time compared to other unit processes.

Therefore, the conventional surface mount system 90 is provided with a plurality of component mounters 40 that perform the same role, such as the first, second, and third component mounters 42, 44, and 46, to compensate for this. It is placed inline.

Accordingly, each component is quickly mounted on a printed circuit board loaded into the surface mount system 90 by a plurality of devices including the plurality of component mounters 40 arranged inline.

2 is a view for explaining the configuration and operation of the component mounting apparatus provided in the surface mounting system of FIG.

As shown in Fig. 2, the plurality of component mounters 40 provided in the conventional surface mount system 90 are first, second and third component mounters 42, 44 and 46 arranged inline with each other. And a head (41, 48, 49) for picking up the parts (31, 32, 33) supplied from the parts supply device and mounting them on the printed circuit board (30), and the surface mounting process And a substrate transporting device (43, 45, 47) for transferring the printed circuit board 30 in the order of progress.

Accordingly, the component mounters 40, that is, the first, second, and third component mounters 42, 44, and 46, are mounted on the printed circuit board 30 which is transferred in the process progress direction of the surface mount process. The same components 31, 32, 33 or similar components 31, 32, 33, etc. are mounted, respectively.

In an embodiment, the first component mounter 42 of the component mounters 40 mounts the first component 31 on the printed circuit board 30 transferred from the screen printer or the like. The second component mounter 44 of the component mounters 40 may be different from the first component 31 on the printed circuit board 30 transferred from the first component mounter 42. Another second component 32 is mounted, and the third component mounter 46 of the component mounters 40 is transferred from the second component mounter 44, which is a previous step. ), A third component 33 different from the first and second components 31 and 32 is mounted.

Therefore, the component mounters 40 can quickly proceed with the component mounting process, which takes much time compared to other unit processes in the above manner.

3 is a view for explaining the operation of any one of the component mounters shown in FIG.

As shown in FIG. 3, the head 49 provided in the component mounter 46 is supplied from the component supply device 38 while being moved in the up, down, left, and right directions by a predetermined distance and height (H). After picking (33), it is mounted on the printed circuit board 30 conveyed by the board | substrate transportation apparatus 47. As shown in FIG.

At this time, in the component mounting process using the component mounter 46, in order to proceed with a faster process, the vertical movement distance of the head 49, that is, the moving height of the head 49 (H of FIG. 3). ) Should be minimized.

Here, the moving height H, which is the vertical movement distance of the head 49, is a predetermined value for each component mounter, that is, a fixed height value is used or a value input in advance by the user before proceeding with the component mounting process. It is used.

However, since the height of the component supplied from the component supply device may be somewhat low or somewhat high, it is very fluid, and thus, even though the height difference of such components is very large, a predetermined value for each component mounter, that is, a fixed height value There is a risk of causing a lot of time loss if you apply.

That is, since the height difference of the components mounted on the printed circuit board is very large, the method of setting the moving height of the head so that the smooth mounting process can be carried out without being caught by these components is higher than that of the highest component. The only way to set the movement height is. However, when the moving height of the head is set in the above manner, the head moving height is high regardless of the height of the parts (H in FIG. There is a problem that can only be lengthened.

In addition, when a value input in advance by the user before the progress of the component mounting process is used as a method of setting the movement height of the head, the movement height of the head appropriately corresponds to the height of the component supplied from the component supply device. Since H) of FIG. 3 can be set, the component mounting process can be performed relatively quickly compared to the former.

However, in the case of such a method, since the height value of the input part is applied to the user's naked eye, the height of the part is incorrectly judged or incorrectly judged by the user's wrong judgment. If the height input is incorrect, the part mounting process time is slowed down again, or the height of the head moved to mount the part is lower than the height of the previously mounted part, and the head does not work or the part is broken. Several problems arise.

Accordingly, the present invention has been made in view of the above problems, and the problem to be solved by the present invention is that the head is not caught by the existing parts previously mounted on the printed circuit board, and a new part mounting process can be performed in the shortest time. It is to provide a component mounter that enables it.

In addition, another problem to be solved by the present invention is a component mounting having a component height measuring device to measure in advance the height of the existing components previously mounted on the printed circuit board, before mounting the new component on the printed circuit board In providing a flag.

The present invention for solving the above problems provides a component mounter. The component mounter includes a bed, a component supply apparatus mounted on the bed to supply components, a substrate transportation apparatus for transporting a substrate so that the components are mounted, and picking up the components from the component supply apparatus to transfer the picked-up components to the substrate. A head to be mounted and a component height measuring device for measuring the height of the components that are previously mounted on the substrate before the head is mounted to the substrate.

In another exemplary embodiment, the substrate transport apparatus may transport the substrate from one side of the bed to the other side of the bed so that the substrate passes through the component mounting region of the head, and the component height measuring apparatus is mounted on the component mounting apparatus. It is provided on one side of the bed, which is the front region of the region, it is possible to measure the height of the components previously mounted on the substrate.

In another embodiment, the component height measuring device is arranged to cross the path that the substrate is transported and irradiates a predetermined amount of light to the component side previously mounted on the substrate and then detects the received amount or position of the received light The height of the part can be measured.

In another embodiment, the component height measuring device is disposed on one side of the path that the substrate is transported and the light emitting portion for irradiating a predetermined amount of light in the other direction facing the one side, the substrate to face the light emitting portion Is disposed on the other side of the transport route may include a light receiving unit for receiving the light irradiated from the light emitting portion and detects the light receiving amount or the light receiving position of the light.

In this case, the light emitting portion and the light receiving portion may be vertically disposed to have a predetermined height with respect to the surface of the substrate being transported, and the height of the light emitting portion and the light receiving portion is higher than the maximum height of the component to be mounted on the substrate. It may be formed to have, and the light emitting portion and the light receiving portion can be irradiated and received light from the lower side to the upper continuous or at a predetermined interval.

Since the component mounter according to the present invention is provided with a component height measuring device to measure the height of a component that is pre-mounted on the substrate before the head mounts the component on the substrate, the component mounter according to the present invention provides a substrate. Before mounting a new component on the board, it is possible to measure in advance the height of the existing component previously mounted on the board.

Therefore, when the component mounting process is performed using the component mounter according to the present invention, the height of the components that have been previously mounted is measured by using the component height measuring device provided therein, and the moving height of the head is measured through this value. You can control it.

Therefore, by using the component mounter of the present invention, it is possible to minimize the height of movement of the head while preventing the head from being caught by the previously mounted parts. As a result, when using the component mounter according to the present invention, it is possible to proceed with the component mounting process in a relatively short time compared to the existing component mounter.

Hereinafter, with reference to the accompanying Figures 4 to 8 will be described in detail preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the scope of the invention to those skilled in the art will fully convey. Like numbers refer to like elements throughout.

Figure 4 is a plan view showing an embodiment of a component mounting machine according to the present invention, Figures 5 and 6 are perspective views for explaining the operation of the component height measuring device shown in Figure 4, Figure 7 is a present invention It is a block diagram for demonstrating the control relationship of the component mounter according to this. 8 is a plan view showing a state in which the component mounters according to the present invention are arranged inline.

4 to 8, the component mounter according to an embodiment of the present invention is configured to pick up and mount components using an XY coordinate system, that is, a rectangular coordinate system. However, the component mounting apparatus according to the present invention shown in Figs. 4 to 8 is only one embodiment, and the technical idea according to the present invention is to pick up and mount a part using another coordinate system, for example, a polar coordinate system. It can also be applied to a mounting machine.

4 to 8, the parts mounters 100, 100a and 100b according to an embodiment of the present invention (hereinafter, will be described based on '100') are a bed 110 and the bed 110. A component supply device 170 for supplying components 31, 32, and 33 to be mounted on a substrate 30 such as a printed circuit board, and the substrate 30 such that the components 31, 32, and 33 are mounted. A substrate transporting device 150 for transporting the gas, and at least one nozzle 145 for picking up the components 31, 32, and 33 supplied from the component supply device 170 and then mounting the components 31, 32, and 33 on the substrate 30. One head 140, Y-axis transport mechanism 120 is mounted on both sides of the bed 110 for the Y-axis direction of the head 140, mounted side by side in the Y-axis direction of the bed 110, the X-axis feed mechanism 130, the X-axis feed mechanism 130 is mounted to the Y-axis feed mechanism 120 for mounting the X-axis direction of the head 140 side by side in the X-axis direction of the bed 110 ) The first drive unit 182 for moving along the Y axis, the second drive unit 184 for moving the head 140 along the X-axis transport mechanism 130, and the head 140 to the substrate 30 Driving of the component height measuring device 190 and the component mounter 100 for measuring the height of the component 31 previously mounted on the substrate 30 before mounting the components 31, 32, and 33. It includes a central control unit 199 for controlling the overall, it can be arranged inline as shown in FIG.

In more detail, the bed 110 is formed in a substantially square shape, and the component supply apparatus 190 is mounted to the central portion of the other side facing the central portion of one side and the central portion of the bed 110.

The substrate transporting device 150 may include the component supply device from one side of the bed 110 in which the component supply device 170 is not mounted so that the substrate 30 passes through the component mounting area of the head 140. 170 serves to transport the substrate 30 to the other side of the bed 110 is not mounted. In one embodiment, the component mounting area may be provided at the center of the bed 110, the substrate transport apparatus 150 is the bed (30) so that the substrate (30) via the center of the bed (110) The substrate 30 is transported from one side of the 110 to the other side of the bed 110. In this case, the substrate transport apparatus 150 may be implemented as one conveyor or a pair of conveyors.

On the other hand, the component height measuring device 190 is installed on one side of the bed 110, which is the front region of the component mounting area among the areas in which the substrate 30 is transported and is pre-mounted on the substrate 30 It measures the height of the existing component 31, and transmits the measured value to the central control unit (199).

In other words, as shown in FIGS. 5 and 6, the component height measuring device 190 is disposed to cross the path P through which the substrate 30 is transported, and is pre-mounted on the substrate 30. After irradiating a predetermined amount of light to the component 31, the height of the component 31 is measured by detecting the light receiving amount or the light receiving position of the irradiated light. For example, the component height measuring device 190 irradiates a predetermined amount of light such as visible light, infrared light, or ultraviolet light toward the component 31 that is previously mounted on the substrate 30, and then is blocked by the component 31. The height and height of the component 31 previously mounted on the substrate 30 by receiving and detecting the amount and the position of the light that is not blocked by the component 31 and not blocked by the component 31. Will be measured.

Specifically, the component height measuring device 190 is disposed on one side of the path (P) for transporting the substrate 30, the light emitting unit 194 for irradiating a predetermined amount of light in the other direction facing the one side, The light receiving unit disposed on the other side of the path (P) for transporting the substrate 30 so as to face the light emitting unit 194, and receives the light emitted from the light emitting unit 194 and detects the light receiving amount or the light receiving position of the light ( 192).

In this case, the light emitting unit 194 and the light receiving unit 192 are vertically disposed to have a predetermined height with respect to the surface of the transported substrate 30, the height of the light emitting unit 194 and the light receiving unit 192 is It is formed to have a height higher than the maximum height of the components 31, 32, 33 to be mounted or mounted on the substrate 30. 5 and 6, the light emitter 194 irradiates light continuous from the lower side to the upper side or light at a predetermined interval, and the light receiver 192 is discharged from the light emitter 194. Receives continuous light to be irradiated or light at a predetermined interval.

Therefore, when the substrate 30 via the previous process is transferred to the component mounter 100 according to the present invention, the substrate transport apparatus 150 of the component mounter 100 according to the present invention is transferred to the substrate ( The substrate 30 is transported such that the substrate 30 passes through the component mounting area of the head 140. In this case, the substrate 30 is the component mounter 100 according to the present invention as shown in FIGS. The component height measuring device 190, that is, passes between the light emitting unit 194 and the light receiving unit 192.

Therefore, the light irradiated from the light emitting part 194 of the component height measuring device 190 according to the present invention hits the part 31 previously mounted on the substrate 30 so as not to be irradiated toward the light receiving part 192. Only the other part is irradiated toward the light receiving portion 192 without hitting the component 31 previously mounted on the substrate 30. As a result, the light receiving unit 192 of the component height measuring device 190 detects the amount or position of the received light, so that the height of the component 31 previously mounted on the substrate 30 can be measured. do.

In addition, the light receiving unit 192, which measures the height of the component 31 previously mounted on the substrate 30, transmits the measured value to the central controller 199. Accordingly, the central controller 199 may be configured such that the head 140 may have a minimum moving height without being caught by the component 31 previously mounted on the substrate 30 according to the value thereof. It will control the movement.

Therefore, when the component mounting process is performed using the component mounter 100 according to the present invention, the height of the component 31 that has been previously mounted is measured by using the component height measuring device 190 provided therein. In addition, since the moving height of the head can be controlled through this value, the moving height of the head 140 can be minimized while the head 140 is not caught by the previously mounted component 31. As a result, using the component mounter 100 according to the present invention, it is possible to proceed with the component mounting process in a relatively short time compared to the existing component mounter.

Meanwhile, in addition to the light receiving unit 192 and the light emitting unit 194, the determination unit 196 for measuring the height of the component 31 is provided in the component height measuring apparatus 190 of the component mounter 100 according to the present invention. It may be further provided. In this case, the determination unit 196 is electrically connected to the light receiving unit 192, and receives the light receiving amount and the position data of the light from the light receiving unit 192 and has been previously mounted on the substrate 30 through the light receiving unit 192. The height of the component 31 can be measured. Therefore, in this case, the light receiving unit 192 only serves to receive light, and the determination unit 196 transmits the data value of the measured component to the central controller 199. Accordingly, the central controller 199 controls the movement of the head 140 according to the transmitted data value.

In addition, in the component mounter 100 according to the exemplary embodiment of the present invention, a predetermined amount of light is irradiated toward the component 31 that is previously mounted on the substrate 30, and then not blocked by the component 31. Although the amount and position of the light passing through the component 31 were received and sensed, the height of the component 31 previously mounted on the substrate 30 was measured, but this is only one embodiment, and according to the present invention, The component height measuring device 190 of the component mounter 100 may measure the height of the component 31 previously mounted on the substrate 30 in another manner. For example, the component height measuring device 190 of the component mounter 100 according to the present invention irradiates a predetermined amount of light to a component 31 that is previously mounted on the substrate 30, and then the substrate 30. The height and height of the component 31 previously mounted on the substrate 30 may be measured by receiving and sensing the amount or position of the light reflected by the component 31 previously mounted on the substrate 30.

9 is a block diagram showing another embodiment of a component mounter according to the present invention.

9, the component mounter according to the present invention may be implemented in other embodiments. That is, in addition to the components in the above-described embodiment, the component mounter according to another embodiment of the present invention includes a drive switch 197 capable of turning on / off only the driving of the component height measuring device 190, and It is connected to the drive switch 197 and installed in the front part of the component height measuring device 190, that is, the substrate 30 is introduced into the substrate transporting device 150, the substrate 30 to the substrate transporting device 150 ) May be further provided with a substrate detecting device 198 that can detect whether or not the inflow. In this case, the substrate detecting device 198 detects whether the substrate 30 is introduced into the substrate transporting device 150 through reflection and blocking of light, and then transfers the detected value to the driving switch 197. Will be sent. Accordingly, the driving switch 197 may be driven so that the component height measuring device 190 is driven only when the substrate 30 is introduced into the substrate transporting device 150 through the detection value of the substrate sensing device 198. It becomes possible. Therefore, according to another embodiment of the present invention, there is an advantage that the life of the component height measuring device 190 can be made longer.

4 is a plan view showing an embodiment of a component mounter according to the present invention.

5 and 6 are perspective views for explaining the operation of the component height measuring apparatus shown in FIG.

7 is a block diagram illustrating a control relationship of a component mounter according to the present invention.

8 is a plan view illustrating a state in which the component mounters according to the present invention are arranged inline.

Claims

Bed;

A component supply device mounted on the bed to supply components;

A substrate transporting device for transporting the substrate so that the component is mounted;

A head for picking up the part from the parts supply device and mounting the picked up part on the substrate; And,

And a component height measuring device for measuring a height of a component previously mounted on the substrate before the head mounts the component on the substrate.

The method of claim 1,

The substrate transport apparatus transports the substrate from one side of the bed to the other side of the bed so that the substrate passes through the component mounting area of the head,

The component height measuring device is installed on one side of the bed, which is the front region of the component mounting area, the component mounter, characterized in that for measuring the height of the components that are previously mounted on the substrate.

The method according to claim 1 or 2,

The component height measuring device is arranged to cross the path in which the substrate is transported, and then irradiates a predetermined amount of light toward a component that has been pre-mounted on the substrate, and then measures the height of the component by sensing a received amount or a received position of the irradiated light. A component mounter characterized by the above-mentioned.

The method of claim 3, wherein

The component height measuring device may be disposed on one side of a path through which the substrate is transported, and the light emitting part irradiating a predetermined amount of light in the other direction facing the one side, and on the other side of the path through which the substrate is transported to face the light emitting part. And a light receiving unit disposed to receive the light emitted from the light emitting unit and to sense the light receiving amount or the light receiving position of the light.

The method of claim 4, wherein

The light emitting portion and the light receiving portion are disposed vertically to have a predetermined height with respect to the surface of the substrate to be transported,

The height of the light emitting portion and the light receiving portion is formed to have a height higher than the maximum height of the component to be mounted on the substrate,

And the light emitting portion and the light receiving portion irradiate and receive light continuous from the lower side to the upper side or light at a predetermined interval.