KR20080007836A - Substrate Cutting System and Method - Google Patents

Abstract

A substrate cutting system and method are disclosed. In the substrate cutting system of the present invention, a cutting operation is performed on a substrate formed by joining an upper plate and a lower plate, and a plurality of conveyors crossing each other in at least one region to form a first work line and a second work line, respectively. ); It is provided in the conveyor area forming the first working line, the first line in the Y axis direction parallel to the first working line and the first line X-axis direction formed horizontally on the first working line of the base substrate A first cutting module which forms a plurality of intermediate step substrates by forming and cutting predetermined scribe lines on upper and lower surfaces; It is provided in the conveyor area forming the second work line, the intermediate step substrate along any one of the direction of the second line Y axis parallel to the second work line and the second line X axis direction formed horizontally on the second work line A second cutting module which forms a plurality of unit substrates by forming and cutting a predetermined scribe line on upper and lower surfaces of the second substrate; And a transfer unit provided at an intersection area where the plurality of conveyors cross each other, and transferring the plurality of intermediate step substrates to the conveyor area forming the second work line. According to the present invention, it is possible to reduce the tact time by preventing in-line cutting of the substrate while preventing the pad portion of the substrate on which the IC driver or the like is to be damaged. Can further improve productivity.

Description

Substrate cutting system and its method {System and method for Scribing substrate}

1 is a schematic perspective view of a general LCD substrate (unit substrate).

FIG. 2 is a plan view of a large-area original substrate for forming the unit substrate of FIG. 1.

3 is a perspective view of a substrate cutting apparatus according to an embodiment of the present invention.

4 is a plan view of FIG. 3.

5 is a view illustrating an operation of the first cutting module region.

6 is a view illustrating an operation of a second cutting module region.

7 is a flow chart of a substrate cutting method according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

1: Original board 3a ~ 3d: Dummy board

5: Intermediate board 8: Unit board

10a ~ 10g: Belt Conveyor 12a, 12b: Spacing

20: first cutting module 21: first scribe unit

23: first breaking portion 25: first upper scribing portion

28: first lower scribing portion 35: first connection portion

40: transfer unit 45: gripping head

50: second cutting module 51: second scribe unit

53: second breaking portion 55: second upper scribing portion

58: second lower scribing portion 65: 21st connection portion

70a, 70b: outlet 80: distributor

84: trans conveyor 85: inverter

87: reverse conveyor 90: takeout conveyor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cutting system and a method thereof, and more particularly, to cutting a substrate in a cutting operation while preventing the pad portion of the substrate on which the IC driver or the like is to be damaged. The present invention relates to a substrate cutting system and a method for reducing the tact time and further improving productivity.

The substrate includes a flat panel display (FPD) used as an image display device including a semiconductor substrate. FPD substrates include liquid crystal display (LCD) substrates, plasma display panel (PDP) substrates, and organic light emitting diodes (OLED) substrates.

Among them, the LCD substrate refers to a liquid crystal (Liquid Crystal) is injected between the two glass (Glass). Although LCD substrates have the disadvantage of slow response speed and relatively high cost, LCD substrates have advantages over PDP substrates in terms of resolution because they are produced by semiconductor processes. Therefore, it is recently attracting attention as a next generation display device such as a mobile phone, a computer monitor, and a television.

The LCD substrate will be described in more detail with reference to FIGS. 1 and 2 as follows.

1 is a schematic perspective view of a general LCD substrate (unit substrate), Figure 2 is a plan view of a large area substrate for forming the unit substrate of FIG.

As shown in these drawings, one LCD substrate (hereinafter referred to as unit substrate 8) shown in FIG. 1 is a glass top plate which is bonded by partially contacting each other in a state where liquid crystal is injected therein ( 8a, CF, Color Filter) and lower plate (8b, TFT, Thin Film Transistor), and upper and lower polarizers that are coupled to the exposed surface of the upper plate (8a) and the lower plate (8b), respectively, to impart optical characteristics at the corresponding positions ( Polarizer Film, not shown).

The upper plate 8a forming the image of the color is formed smaller in area than the lower plate 8b. Therefore, a pad portion P (Pad Portion), which is a portion where the upper plate 8a does not overlap, is present on the upper surface of the lower plate 8b. The pad portion P is combined with an IC driver as a means for controlling the unit substrate 8, and a flexible printed circuit (FPC) for connecting the IC driver to a printed circuit board (PCB).

As shown in FIG. 2, the unit substrate 8 is generally formed in a state where the upper plate 1a and the lower plate 1b are joined together, and the large-area original substrate 1 having a large area is divided into several tens of equal parts. After cutting to make the unit substrate 8 of the form as shown in Figure 1, by mounting the IC driver or the like on the pad portion (P) of the unit substrate 8 in the module process is released as a finished product.

Therefore, the manufacturing process of the substrate includes a cutting process for cutting (or scribing) the large-area original substrate 1 into several to several tens of unit substrates 8.

In particular, when the one substrate 1 as shown in FIG. 2 is cut and manufactured as the unit board 8 as shown in FIG. The scribe line formed on the upper plate 1a and the lower plate 1b of the base plate 1 and cut is inevitably different, and these need to be precisely controlled. For reference, a portion (not shown overlapping with a dotted line) in the solid line in FIG. 2 indicates a position where the upper plate 1a of the base plate 1 is cut, and the portion shown by the dotted line is a portion of the base plate 1. The position at which the lower plate 1b is cut is shown.

The cutting process for the base plate 1 is carried out through a separate system, usually through a cutting system, also called a scriber or scribe device (Scribe Apparatus).

Cutting systems known to date are largely divided into stage types and belt conveyor types according to the type supporting the base plate 1.

Since the stage type does not have a big problem in discharging the dummy substrates 3a to 3d, a scribe line is formed at a desired portion while transferring the original substrate 1, and based on this, the plurality of unit substrates 8 are completely cut in sequence. ) To form.

However, as described above, the base plate 1 is composed of the upper plate (1a) and the lower plate (1b) bonded to each other, the upper plate (1a) of the base plate 1 for the formation of the unit substrate (8) Since the scribe lines formed and cut on the lower plate 1b are different from each other, in the cutting system to which the stage type is applied, any one of the upper plate 1a and the lower plate 1b of the base plate 1 is cut and then the upper plate ( Means are further required for inverting (turning) the original substrate 1 by 180 degrees in order to cut the other one of the 1a) and the lower plate 1b, so that the height of the cutting system is inevitably increased.

In contrast, the belt conveyor type has a short tact time, but due to its structure, a substrate cut out from the large-area original substrate 1 (hereinafter, referred to as a dummy substrate (3a-3d, Dummy Substrate)) is directly used. It cannot be discharged. The dummy substrates 3a to 3d refer to portions not hatched in FIG. 2.

Therefore, in the cutting system to which the belt conveyor type is applied, the first substrate is not cut completely but only half is cut first, and then the original substrate 1 is finally cut while advancing a crack through heating and cooling processes. In this way, a plurality of unit substrates 8 are formed.

By the way, in the cutting system to which the belt conveyor type is applied, as described above, the base plate 1 is not cut completely, but only half is cut first and then the crack is advanced through the heating and cooling process. Since the base substrate 1 is being cut, the dummy substrates 3a to 3d are continuously transported in a state of being attached to each other without falling off from the large-area original substrate 1, and must be completely cut after the heating and cooling process, but are cut in advance. The phenomenon occurs and there is a high possibility that the pad portion P of the unit substrate 8 on which the IC driver or the like will be mounted is damaged during the transfer of the base substrate 1.

An object of the present invention is to prevent the damage to the pad portion of the substrate on which the IC driver or the like is to be damaged while cutting the substrate in-line, thereby reducing the tact time. It is possible to provide a substrate cutting system and a method thereof, which can reduce and further improve productivity.

The object is, according to the present invention, the cutting operation for the base plate formed by joining the upper plate and the lower plate is in progress, a plurality of conveyors that cross each other in at least one region to form a first work line and a second work line ( Conveyor); It is provided in the conveyor area to form the first work line, along the direction of any one of the first line Y-axis direction parallel to the first work line and the first line X-axis direction formed horizontally on the first work line A first cutting module which forms a plurality of intermediate step substrates by forming and cutting predetermined scribe lines on upper and lower surfaces of the original substrate; A second line Y-axis direction parallel to the second work line and a second line X-axis direction formed horizontally on the second work line; A second cutting module which forms a plurality of unit substrates by forming and cutting a predetermined scribe line on upper and lower surfaces of the intermediate stage substrates; And a transfer unit provided at an intersection area where the plurality of conveyors cross each other, and transferring the plurality of intermediate step substrates to the conveyor area forming the second work line.

Here, the conveyor may be a belt conveyor (Belt Conveyor), the first cutting module is formed of the plurality of intermediate stage substrate by cutting the substrate along the X-axis direction of the first line, the second cutting The module may cut the plurality of intermediate stage substrates along the X-axis direction of the second line to form the plurality of unit substrates.

The transfer unit may linearly move the intermediate step substrates cut in the belt conveyor area forming the first work line to transfer the belt to the belt conveyor area forming the second work line.

The first cutting module may include a first scribing unit which forms a scribe line along the X-axis direction of the first line at upper and lower surfaces of the substrate at first intervals formed in a belt conveyor region forming the first work line. ; And a first unit installed adjacent to the first scribing unit, the substrate being heated and cooled to cut the substrate along a scribe line in the X-axis direction of the first line to form the plurality of intermediate step substrates. It may include a breaking part.

The first scribing unit may include: a first upper scribing unit provided in an upper region of the belt conveyor at the first interval to form an upper scribe line in the X-axis direction of the first line on the upper plate of the original substrate; And a first lower scribing unit provided in the lower region of the belt conveyor at the first interval to form a lower scribe line in the X-axis direction of the first line on the lower plate of the original substrate.

The first upper scribing unit may include a first upper horizontal axis fixed along the X-axis direction of the first line; And at least one first upper portion coupled to one side of the first upper horizontal axis, the upper scribe line being formed on the upper plate of the base plate supported and moving on the belt conveyor, and relatively movable on the first upper horizontal axis. It may include a scriber.

The first lower scribing unit may include: a first lower horizontal axis positioned below the first upper horizontal axis and fixed along an X-axis direction of the first line; And at least one first lower portion coupled to one side of the first lower horizontal axis to form the lower scribe line on a lower plate of the base plate supported and moving on the belt conveyor, wherein the lower scribe line is relatively movable on the first lower horizontal axis. It may include a scriber.

The first upper part and the first lower horizontal axis may be connected to each other by a predetermined first connection part.

The second cutting module may include a scribe line forming a scribe line along the X-axis direction of the second line on the upper and lower surfaces of the intermediate step substrate at a second interval formed in the belt conveyor area forming the second work line. Ice sheet; And forming the plurality of unit substrates by cutting the intermediate stage substrate along the scribe line in the X-axis direction by heating and cooling the intermediate stage substrate to be adjacent to the second scribing unit. It may include two breaking parts.

The second scribing unit may include: a second upper scribing unit provided in an upper region of the belt conveyor at the second interval to form an upper scribe line in the X-axis direction of the second line on the upper plate of the intermediate step substrate; And a second lower scribing unit provided in the lower region of the belt conveyor at the second interval to form a lower scribe line in the X-axis direction of the second line on the lower plate of the intermediate stage substrate.

The second upper scribing unit may include: a second upper horizontal axis fixed along the X-axis direction of the second line; And an upper scribe line coupled to one side of the second upper horizontal axis, the upper scribe line formed on the upper plate of the intermediate step substrate supported and moving on the belt conveyor, wherein the second upper horizontal axial line is relatively movable on the second upper horizontal axis. It may include an upper scriber.

The second lower scribing unit may include a second lower horizontal axis positioned below the second upper horizontal axis and fixed along an X-axis direction of the second line; And at least one second scribe line coupled to one side of the second lower horizontal axis, the lower scribe line being formed on a lower plate of the intermediate step substrate supported and moving on the belt conveyor, and relatively movable on the second lower horizontal axis. It may include a lower scriber.

The second upper portion and the second lower horizontal axis may be connected to each other by a predetermined second connection portion.

The belt conveyor in which the second cutting module is located may be divided into each other along the X-axis direction of the second line, and the transfer unit may transfer one by one to the divided belt conveyor by holding the intermediate stage board one by one.

The transfer unit may include a pair of first rail parts disposed on both sides of the belt conveyors forming the first work line and provided to cover the crossing area; A moving bar having both ends coupled to the pair of first rail portions, the movable bars being movable along the first rail portion; And a gripping head coupled to the moving bar so as to be movable along the longitudinal direction of the moving bar, and holding the intermediate stage board one by one to transfer to the divided belt conveyor one by one.

Each of the first and second cutting modules may further include a discharge part for discharging a dummy substrate cut off from the substrate or the intermediate step substrate, respectively.

The discharge portion is accessible and spaced apart from the first and second cutting modules, respectively, at the corresponding position.

The discharge part may further include a crushing part for crushing the dummy substrate and the dummy part.

The apparatus may further include a distributor disposed at the rear of the second cutting module along the second work line and distributing the unit substrates corresponding to one by one to the trans conveyor.

The distributor may include a pair of second rail parts disposed along the second work line on both sides of the trans conveyor; And coupled to the pair of second rails to move relative to the pair of second rails and to rotate relative to the pair of second rails, respectively, to absorb the unit substrates of which the cutting operation is completed. It may include a dispensing head.

The apparatus may further include an inverter for reversing the upper and lower positions of the unit substrates distributed by the trans conveyor.

The inverter, the inverting axis; And a pair of reverse conveyors that are invertible based on the inversion axis and adsorb the upper and lower surfaces of the unit substrate so that the unit substrate can be inserted therein.

The apparatus may further include a take-out conveyor in which the unit substrate inverted by the inverter is loaded and taken out.

The upper and lower plates of the substrate initially introduced into the first work line may be TFTs and thin film transistors, respectively, and are inverted when taken out by the take-out conveyor. Can be.

The substrate may be a flat panel display (FPD) of any one of a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED).

On the other hand, according to the present invention, a) a step of bringing the base plate of the cutting operation target formed by the upper plate and the lower plate is joined to a predetermined first work line; b) a predetermined scribe line (Scribe) on the upper and lower surfaces of the substrate along one of the first line Y-axis direction parallel to the first work line and the first line X-axis direction formed horizontally on the first work line Forming a plurality of intermediate step substrates by cutting lines; c) transferring the plurality of intermediate step substrates formed in step b) to a second work line crossing the first work line; And d) a predetermined scribe line on the upper and lower surfaces of the intermediate step substrates in one of a second line Y-axis direction parallel to the second work line and a second line X-axis direction formed laterally on the second work line. It is also achieved by a substrate cutting method comprising the step of forming a plurality of unit substrates by forming and cutting (Scribe Line).

Here, the first and the second working line may be formed by a plurality of belt conveyor (Belt Conveyor), in the step b) by cutting the substrate along the X-axis direction of the first line by cutting the plurality of intermediate And forming a plurality of unit substrates by cutting the plurality of intermediate stage substrates along the X-axis direction of the second line in the step d), and in the step c), the first work line. The intermediate step substrates formed at the side may be linearly transferred to the second work line.

In step c), the intermediate step substrate may be linearly transferred to the second work line from the first work line.

e) inverting the upper and lower positions of the unit substrate after step c); And f) taking out the unit substrate having the upper and lower positions reversed.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

For reference, the substrate to be described below refers to a flat panel display (FPD) substrate including a liquid crystal display (LCD), a plasma display panel (PDP), organic light emitting diodes (OLED), and the like, for convenience of description. For the sake of brevity, these are referred to as substrates.

3 is a perspective view of a substrate cutting apparatus according to an embodiment of the present invention, Figure 4 is a plan view of Figure 3, Figure 5 is a view showing the operation of the first cutting module region, Figure 6 is a second cutting module region 7 is a flowchart illustrating a substrate cutting method according to an embodiment of the present invention.

Referring to these drawings, mainly referring to Figures 3 and 4, the substrate cutting apparatus according to an embodiment of the present invention, the first and second cross cutting operation of the substrate 1 is in progress A plurality of belt conveyors (10a ~ 10g, Belt Conveyor) forming a work line, and the first cutting module 20 is provided on the side of the first work line for cutting the base substrate 1 into three intermediate stage substrate (5) And a transfer part 40 for transmitting the intermediate step substrate 5 to the second work line side, and a second portion provided at the second work line side for cutting the intermediate step substrate 5 into a plurality of unit substrates 8. The cutting module 50 is provided.

In addition, the substrate cutting device of the present embodiment, the discharge unit (70a, 70b) located in the lower region of the first and second cutting module (20, 50), and the distributor provided in the rear of the second cutting module ( 80), a trans conveyor 84, a reversing machine 85 and a take-out conveyor 90 are further provided.

Through these configurations, the substrate 1 of FIG. 2 carried into the first work line is cut into the intermediate stage substrate 5 of FIG. 2 by the first cutting module 20, and then the second cutting module ( 50 is formed by cutting the unit substrate 8 of FIG.

Therefore, since the in-line of the substrate 1 can be constructed, the tact time can be reduced, and further, the productivity can be improved. In particular, according to the substrate cutting system of the present embodiment, the base substrate 1 may be several to several tens while preventing the pad portion (P, Pad Portion, see FIG. 1) of the unit substrate 8 on which the IC driver or the like is to be damaged. It is possible to form a cut into two unit substrate (8).

Prior to the description, the original substrate 1 and the intermediate substrate 5 shown in FIG. 2, the unit substrate 8 shown in FIG. 1, and the cutting direction or the moving direction of the belt conveyors 10a to 10g, etc. do.

The base substrate 1 shown in FIG. 2 is a matrix for forming the unit substrate 8 shown in FIG. Therefore, in this embodiment, twelve parts hatched from the original substrate 1 shown in FIG. 2 represent one unit substrate 8 shown in FIG. In addition, as described above, a bundle of four unit substrates 8 arranged along the Y-axis direction without being cut into the unit substrate 8 in FIG. 2 is referred to as an intermediate stage substrate 5.

Referring to FIG. 2, the total number of unit boards 8 is 12, the middle step boards 5 are three, and the remaining parts without hatching are dummy boards 3a to 3d discharged to the discharge parts 70a and 70b. ) For reference, referring to FIGS. 5 and 6, an end dummy part which is cut out together with the other dummy substrates 3a to 3d is further present. For convenience, reference numerals will be omitted.

Like the unit substrate 8, the base substrate 1 is composed of an upper plate 1a and a lower plate 1b on which two sheets of glass are bonded.

Usually, in the unit substrate 8 finally placed on the take-out conveyor 90, as shown in FIG. 1, the top plate 8a, which is a color filter CF, faces upward, and the TFT, Thin The lower plate 8b, which is a film transistor, is directed downward, and then taken out in a later step.

However, before the cutting process, the original substrate 1 is carried into the belt conveyors 10a to 10g forming the first and second working lines in an inverted state as opposed to the unit substrate 8. That is, the upper plate 1a, which is a TFT (thin film transistor), is brought upward, and the lower plate 1b, which is a color filter (CF, Color Filter), is brought in a state where it is disposed to face downward, thereby performing a series of cutting operations. Proceed. In addition, the intermediate stage substrate 5 is also arranged similarly to the original substrate 1.

In this embodiment, one substrate 1 shown in FIG. 2 is cut into three intermediate stage substrates 5 through a cutting system, and then cut into 12 unit substrates 8. Doing.

At this time, in relation to the cutting direction or the moving direction of the belt conveyors 10a to 10g, the direction in which the first to third belt conveyors 10a to 10c are lined up in the first line Y axis direction and the first line Y axis The horizontal direction in the direction is referred to as the first line X-axis direction. Then, the direction in which the fourth and sixth belt conveyors 10d and 10f and the fifth and seventh belt conveyors 10e and 10g are lined is arranged in the horizontal direction in the second line Y axis direction and the second line Y axis direction. It will be described as a two-line X-axis direction.

Then, hereinafter, the respective components provided in the substrate cutting device will be described sequentially.

The belt conveyors 10a-10g are the parts which comprise the 1st and 2nd working line of the cutting | disconnection work with respect to the base board 1. As shown in FIG. Since the base substrate 1, the intermediate stage substrate 5 and the unit substrate 8 can be transported without being damaged, they are suitable for use compared to stages and the like. The movement of the belt conveyors 10a to 10g may be precisely controlled by linear motion or the like.

As described above, in the belt conveyors 10a to 10g, the first work line and the second work line intersect with each other based on the intersection area.

The first to third belt conveyors 10a to 10c forming the first work line are involved in cutting the original substrate 1 into the intermediate step substrate 5 and the fourth to seventh to form the second work line. The belt conveyors 10d to 10g are involved in cutting the intermediate stage substrate 5 into the unit substrate 8.

More specifically, the first belt conveyor 10a is a portion in which the original substrate 1 is initially loaded, and the second and third belt conveyors 10b and 10c are circled together with the first cutting module 20. The substrate 1 is cut and formed into an intermediate stage substrate 5. The fourth and fifth belt conveyors 10d and 10e are portions in which the intermediate stage substrate 5 is disposed and transported one by one, and the sixth and seventh belt conveyors 10f and 10g are the fourth and fifth belt conveyors ( The intermediate step substrate 5 is cut into the unit substrate 8 by the mutual operation between the 10d and 10e and the second cutting module 50.

A predetermined gap is formed between the first to seventh belt conveyors 10a to 10g. Spacing intervals allow the cutting operations or the substrates 1, 5 and 8 to be moved smoothly at the corresponding positions.

In the present embodiment, as shown in Figure 3, a plurality of separation intervals are formed, in the following for the convenience of the description, the second and third belt conveyor (10b, 10c) where the first cutting module 20 is located The gap between the gaps is called the first gap 12a, and the fourth and fifth belt conveyors 10d and 10e and the sixth and seventh belt conveyors 10f and 10g in which the second cutting module 50 is located. The spacing between them will be described as a second spacing 12b.

In the present embodiment, the first to third belt conveyors 10a to 10c forming the first work line stop at a corresponding position or are driven in the direction of the first line Y axis. The fourth to seventh belt conveyors 10d to 10g forming the second work line also stop at the corresponding positions or are driven in the second line Y-axis direction.

The first cutting module 20 is configured to cut the substrate 1 into the intermediate stage substrate 5, and is installed in the first spacing interval 12a of the first work line.

The first cutting module 20 may refer to the first scribing unit 21 (FIG. 5) forming a scribe line along the X-axis direction of the first line on the upper and lower surfaces of the substrate 1 at the first spacing 12a. And a front side of the first scribing unit 21, and the substrate 1 is heated and cooled to cut the substrate 1 along the scribe line in the X-axis direction of the first line, thereby cutting a plurality of intermediate steps. The first breaking part 23 formed of the board | substrate 5 is provided.

The first scribing unit 21 is again provided in the upper regions of the second and third belt conveyors 12b and 12c at the first spacing 12a to the upper plate 1a of the base substrate 1. The first upper scribing portion 25 forming the upper scribe line in the one-line X-axis direction and the lower substrate of the second and third belt conveyors 12b and 12c at the first spacing 12a. A first lower scribing portion 28 forming a lower scribe line in the first line X-axis direction on the lower plate 1b of (1).

First, the first upper scribing unit 25 includes a first upper horizontal axis 26 fixed along the first line X-axis direction, and a plurality of first upper scrabs coupled to one side of the first upper horizontal axis 26. A driver 27 (Scriber) is provided.

Whereas the second and third belt conveyors 10b, 10c located close to the first upper scribing portion 25 can be moved in the direction of the first line Y axis, the first upper horizontal axis 26 is Only the first upper scriber 27 fixed and coupled to the first upper horizontal axis 26 is moved in the X-axis direction.

On the other side of the first upper horizontal axis 26, a first upper line observer (not shown) for observing the upper scribe line in the X-axis direction of the first line may be further provided. The position of the first upper scriber 27 on the first upper horizontal axis 26 may be determined through control based on the image observed by the first upper line observer.

The first upper scriber 27 includes a first upper holder 27a coupled to the first upper horizontal axis 26 and a base plate 1 supported and moved by the second and third belt conveyors 10b and 10c. The first upper cutter 17b which forms the upper scribe line of the 1st line X-axis direction in the upper board 1a of the said is provided. At this time, the first upper holder 27a is relatively movable on the first upper horizontal axis 26.

Next, the first lower scribing unit 28 includes a first lower horizontal axis 29 and a first lower horizontal axis 29 positioned below the first upper horizontal axis 26 and fixed along the first line X-axis direction. A plurality of first lower scribers (30, Scriber) coupled to one side of the).

Whereas the second and third belt conveyors 10b, 10c located proximate to the first lower scribing portion 28 may be moved in the direction of the first line X axis, the first lower horizontal axis 29 may Only the first lower scriber 30 fixed and coupled to the first lower horizontal axis 29 is moved in the X-axis direction.

On the other side of the first lower horizontal axis 29, a first lower line observer (not shown) for observing the lower scribe line in the first line X-axis direction may be further provided. The position of the first lower scriber 30 on the first lower horizontal axis 29 may be determined through control based on the image observed by the first lower line observer.

The first lower scriber 30 includes a first lower holder 30a coupled to the first lower horizontal axis 29 and a base plate 1 supported and moved by the second and third belt conveyors 10b and 10c. The first lower cutter 30b which forms the lower scribe line of the 1st line X-axis direction in the lower board 1b of this is provided. At this time, the first lower holder 30a is relatively movable on the first lower horizontal axis 29.

Based on the operation of the first scribe unit 21, to form upper and lower scribe lines in the X-axis direction of the first line on the upper and lower plates (1a, 1b) of the original substrate 1 shown in FIG. In this case, the second and third belt conveyors 10b and 10c may be applied to the first upper and first lower scribers 27 and 30 positioned on the first upper and first lower horizontal axes 26 and 29. It progresses as it moves. At this time, the first upper portion and the first lower horizontal axes 26 and 29 are connected to each other by the first connecting portion 35.

On the other hand, in order for the base substrate 1 to be cut along the scribe line and formed into three intermediate step substrates 5, a means for cutting the base substrate 1 is required. The first breaking part 23 is in charge of this. The first breaking part 23 may be located behind the first scribing part 21, but in the present exemplary embodiment, the first breaking part 23 is located in front of the first scribing part 21.

The first breaking portion 23 is formed by the first scribing portion 21 on the upper plate 1a and the lower plate 1b, respectively, where the upper and lower scribe lines in the X-axis direction of the first line are to be formed ( After heating 1), the scribe line is formed along the corresponding scribe line and serves to cut the substrate 1 by spraying cooling air.

For reference, in order to cut the substrate 1 along the scribe line, pressure is applied to the scribe line region, or a portion of the substrate is formed by using a thermal stress of the brittle material by heating and rapidly cooling a portion where the scribe line is formed. (1) must be cut.

Therefore, a means for applying pressure to the base plate 1 or for heating and cooling the base plate 1 is required, and the first breaking part 23 is responsible for this. In the present embodiment, the first breaking part 23 cuts the base plate 1 by using the thermal stress of the brittle material by the method of heating and cooling the base plate 1, You may apply. In this case, the compressed air injection unit may be installed instead of the first breaking unit 23.

Accordingly, the substrate 1 facing the area of the first cutting module 20 is based on the mutual operation of the first scribing unit 21 and the first breaking unit 23 in which the operation as shown in FIG. 5 proceeds. It can be cut into three intermediate stage substrate (5). In this process, dummy substrates 3a and 3b and end dummy parts are generated, which fall and are discharged to the discharge part 70a as described below.

The three intermediate stage substrates 5 cut by the first cutting module 20 are located on the third belt conveyor 10c, one by one to the fourth and fifth belt conveyors 10d and 10e at the rear thereof. Must be communicated. Therefore, it is required to transfer the three intermediate stage substrates 5 located on the third belt conveyor 10c to the corresponding fourth and fifth belt conveyors 10d and 10e one by one, which is a transmission unit 40. ) Is in charge.

The transmission part 40 includes a pair of first rail parts 41 disposed on both sides of the belt conveyors 10a to 10c forming the first work line and provided to span the cross region, and a pair of both ends thereof. Coupled to the first rail portion 41, the movable bar 43 is movable along the first rail portion 41, and coupled to the movable bar 43 to be movable along the longitudinal direction of the movable bar 43. It is provided with a holding head 45 for holding the intermediate stage substrate (5) one by one to transfer to the fourth and fifth belt conveyor (10d, 10e) one by one.

At this time, the holding head 45 is a linear movement along the moving bar 43, while holding the three intermediate stage substrate (5) located on the third belt conveyor (10c) one by one to the fourth and fifth belt conveyor Move to (10d, 10e). As a result, the intermediate stage substrate 5 transferred from the third belt conveyor 10c to the fourth and fifth belt conveyors 10d and 10e by the transfer unit 40 is in a linear motion.

As such, when the intermediate stage substrate 5 is moved to a corresponding position while performing a linear movement, the structure is not only simple because the mechanism for rotating the intermediate stage substrate 5 is required, and the intermediate stage substrate 5 is moved. This can prevent as much error as possible.

On the other hand, the second cutting module 50 is configured to cut the intermediate stage substrate 5 into the unit substrate 5, it is provided in the second spacing interval (12b) region formed on the second work line side. The second cutting module 50 has substantially the same configuration as the above-described first cutting module 20 will be described.

The second cutting module 50 may refer to the second scribing unit 51 (see FIG. 6) which forms a scribe line along the X-axis direction of the second line on the upper and lower surfaces of the intermediate stage substrate 5 at the second separation interval 12b. And the second scribing unit 51, and the intermediate stage substrate 5 is heated and cooled to cut the intermediate stage substrate 5 along the scribe line in the X-axis direction of the second line. A second breaking part 53 formed of the unit substrate 8 is provided.

The second scribing unit 51 is again provided in the upper region of the belt conveyors 12d to 12g at the second spacing 12b and on the upper plate (not shown) of the intermediate stage substrate 5. The second upper scribing portion 55 forming the upper scribe line in the axial direction, and the lower plate of the intermediate step substrate 5 is provided in the lower region of the belt conveyors 12d to 12g at the second spacing 12b. And a second lower scribing unit 58 forming a lower scribe line in the X-axis direction of the second line.

First, the second upper scribing unit 55 includes a second upper horizontal axis 56 fixed along the X-axis direction of the first line, and a plurality of second upper scrabs coupled to one side of the second upper horizontal axis 56. A driver 57 (Scriber) is provided.

Corresponding belt conveyors 12d-12g positioned close to the second upper scribing portion 55 can be moved in the direction of the second line Y axis, whereas the second upper horizontal axis 56 is fixed at the corresponding position and the second Only the second upper scriber 57 coupled to the upper horizontal axis 56 is moved.

A second upper line observer (not shown) for observing the upper scribe line in the X-axis direction of the second line may be further provided on the other side of the second upper horizontal axis 56. The position of the second upper scriber 57 on the second upper horizontal axis 56 may be determined through control based on the image observed by the second upper line observer.

The second upper scriber 57 is a second upper holder 57a coupled to the second upper horizontal axis 56 and an upper plate of the intermediate step substrate 5 supported and moved by the belt conveyors 12d to 12g. The second upper cutter 57b which forms the upper scribe line of a 2nd line X-axis direction at the back is provided. At this time, the second upper holder 57a is relatively movable on the second upper horizontal axis 56.

Next, the second lower scribing unit 58 includes a second lower horizontal axis 59 positioned below the second upper horizontal axis 29 and fixed along the X-axis direction of the second line, and a second lower horizontal axis 59. A plurality of second lower scribers (60, Scriber) coupled to one side of the) is provided.

Corresponding belt conveyors 12d-12g located in close proximity to the second lower scribing portion 58 can be moved in the direction of the second line Y axis, whereas the second lower horizontal axis 59 is fixed at that position and the second Only the second lower scriber 60 coupled to the lower horizontal axis 59 is moved in the X-axis direction.

A second lower line observer (not shown) for observing the lower scribe line in the X-axis direction of the second line may be further provided on the other side of the second lower horizontal axis 59. The position of the second lower scriber 60 on the second lower horizontal axis 59 may be determined through subzero-based control observed by the second lower line observer.

The second lower scriber 60 has a second lower holder 60a coupled to the second lower horizontal axis 59 and a lower plate of the intermediate stage substrate 5 supported and moved by the belt conveyors 12d to 12g. And a second lower cutter 60b for forming a lower scribe line in the second line X-axis direction. At this time, the second lower holder 60a is relatively movable on the second lower horizontal axis 59.

Based on the operation of the second scribing unit 51, to form upper and lower scribe lines in the X-axis direction of the second line on the upper and lower plates of the intermediate step substrate 5 shown in FIG. The belt conveyors 12d to 12g are moved with respect to the second upper and second lower scribers 57 and 60 positioned on the second upper and second lower horizontal axes 56 and 59. At this time, the second upper portion and the second lower horizontal axes 56 and 59 are connected to each other by the second connecting portion 65.

Meanwhile, in order to form the plurality of unit substrates 8 by cutting the intermediate stage substrates 5 along the corresponding scribe lines, a means for cutting the intermediate stage substrate 5 is required. The second breaking unit 53 is in charge of this. The second breaking unit 53 may be located behind the second scribing unit 51, but in the present embodiment, is located in front of the second scribing unit 51. Since the operation of the second breaking unit 53 is the same as the first breaking unit 23 described above, the description of the first breaking unit 23 will be referred to.

Accordingly, the intermediate stage substrate 5 facing the region of the second cutting module 50 is based on the mutual operation of the second scribing unit 51 and the second breaking unit 53, which are operated as shown in FIG. 6. It is possible to cut and form a plurality of unit substrates (8). That is, in the present embodiment, a total of four unit substrates 8 are cut off from one intermediate stage substrate 5. In this process, dummy substrates 3c and 3d and end dummy parts are generated, which fall and are discharged to the discharge part 70b as described below.

Meanwhile, the dummy substrates 3a and 3b and the end dummy parts cut from the original substrate 1 in the above-described first cutting module 20 region, and the intermediate step substrate (in the second cutting module 50 region). The dummy substrates 3c and 3d and the end dummy portions cut from 5) fall downward by their own weight or by separate removal means or the like. The dropping substrates 70a and 70b are provided to be discharged to one place without scattering the dummy substrates 3a to 3d and the end dummy part.

In the present embodiment, as described above, the discharge parts 70a and 70b are provided in the lower regions of the first and second cutting modules 20 and 50, respectively, and the dummy substrates 3a to 3d falling at the corresponding positions. And end dummy. The discharge parts 70a and 70b form a hopper shape in which the inlet part is large and the volume gradually decreases toward the rear end so that the dummy substrates 3a to 3d and the end dummy part are not scattered.

These discharge parts 70a and 70b are provided to be accessible and spaced apart from the first and second cutting modules 20 and 50 for their efficiency. Such a structure can be easily realized by a cylinder or a combination of a motor and a ball screw.

In addition, since the dummy boards 3a to 3d and the end dummy parts which are cut out have a certain length and an area, the dummy boards 3a to 3d are disposed on the discharge parts 70a and 70b to be crushed and reused. Crushing parts 72a and 72b may be further provided to crush the piles and the end dummy parts.

At the rear of the sixth and seventh belt conveyors 10f and 10g, a transformer conveyor 84 forming the same line as the sixth and seventh belt conveyors 10f and 10g, respectively, is provided. The distributor 80 is provided.

The dispenser 80 distributes the plurality of unit substrates 8, each of which has been cut, to the trans conveyor 84 one by one. That is, since the unit substrates 8 finally produced are individually managed one by one in a later process, the distributor unit 80 transfers the unit substrates 8 placed on the sixth and seventh belt conveyors 10f and 10g. 84) one by one.

The distributor 80 is movable along a pair of second rail portions 81 and a pair of second rail portions 81 disposed along the second work line on both sides of the trans conveyor 84. And a distribution head 82 which is coupled to the pair of second rail portions 81 so as to be relatively rotatable with respect to the pair of second rail portions 81 and adsorbs the unit substrates 8 which have been cut. Include.

If the cutting system of this embodiment is provided with one trans conveyor 84, it is sufficient that one distribution head 82 of the distributor 80 is also provided. However, in the case of this embodiment, since two trans conveyors 84 are provided for productivity improvement, two distribution heads 82 are also provided. Their number can be adjusted by design.

On the other hand, in the beginning, the base plate 1 is a state in which the top plate 1a, which is a TFT (thin film transistor), is disposed upward, and the bottom plate 1b, which is a color filter CF, is downward. Since it was formed into a unit substrate 8 after being cut into three intermediate stage substrates 5, the unit substrates 8 finally placed on the trans conveyor 84, a top plate which is a color filter (CF) 8a faces downward, and a lower plate 8b, which is a TFT (thin film transistor), faces upward.

However, for the process control, the unit substrate 8 finally produced, as shown in Figure 1, the top plate 8a, which is a color filter (CF, Color Filter) is facing upward, TFT, Thin (TFT, Thin) The lower plate 8b, which is a film transistor, should face downward.

To this end, a reverser 85 is further provided at the rear of the trans conveyor 84 to reverse the upper and lower positions of the unit substrate 8.

The inverter 85 is inverted based on the inverted shaft 86 and the inverted shaft 86, and a pair of upper and lower surfaces of the unit substrate 8 so that the unit substrate 8 can be inserted therein. Reverse Conveyor (87) is provided.

Accordingly, after the unit substrate 8 placed on the trans conveyor 84 is inserted between the pair of reverse conveyors 87, the pair of reverse conveyors 87 are rotated 180 on the inverted shaft 86. If it is also reversed, the position of the unit substrate 8 can be easily changed. That is, as desired, the unit substrate 8 is disposed so that the top plate 8a, which is a color filter CF, faces upward, and the bottom plate 8b, TFT, which is a thin film transistor, faces downward. do.

At the rear of the inverter 85 is provided a take-out conveyor 90 in which the final unit substrate 8 whose top and bottom positions are reversed through the inverter 85 is loaded and taken out in a later process. The take-out conveyor 90 is also provided in the same number on the same axis as the transformer conveyor 84.

A method of cutting the original substrate 1 into three intermediate stage substrates 5 using a substrate cutting system having such a configuration, and then cutting and forming the total 12 unit substrates 8 into FIGS. 3 and 4. And briefly described with reference to Figure 7 as follows.

First, when the base plate 1 is carried in the 1st belt conveyor path 10a (S11), by the movement of the 1st belt conveyor path 10a, the base board 1 is moved to the 2nd and 3rd belt conveyor. Head to 10b and 10c. After that, the upper plate 1a and the lower plate 1b of the base plate 1 by the first cutting module 20 positioned at the separation interval 12a between the second and third belt conveyor paths 10b and 10c. The upper and lower scribe lines in the X-axis direction of the first line are formed and cut at S12.

That is, the substrate 1 facing the area of the first cutting module 20 is based on the mutual operation of the first scribing unit 21 and the first breaking unit 23 in which the operation as shown in FIG. 5 proceeds. It can be cut into three intermediate stage substrate (5). In this process, the dummy substrates 3a and 3b and the end dummy part are generated, which falls and is discharged to the discharge part 70a.

Next, the three intermediate stage substrates 5 placed on the third belt conveyor 10c are gripped by the transfer unit 40 one by one, and then transferred to the fourth and fifth belt conveyors 10d and 10e (S13). ). The longitudinal direction of the intermediate stage substrate 5 transferred to the fourth and fifth belt conveyors 10d and 10e is the second line Y-axis direction.

After the intermediate stage substrate 5 is transferred to the fourth and fifth belt conveyors 10d and 10e, the intermediate stage substrate 5 is directed toward the second cutting module 50 along the fourth and fifth belt conveyors 10d and 10e. The upper and lower scribe lines in the X-axis direction of the second line are formed on the upper and lower plates of the intermediate step substrate 5 by the operation of the cutting module 50, and are cut (S14).

That is, the intermediate stage substrate 5 facing the region of the second cutting module 50 may be based on the mutual operation of the second scribing unit 51 and the second breaking unit 53, which are operated as shown in FIG. 6. Each of the plurality of unit substrates 8 may be cut and formed. In this process, the dummy substrates 3c and 3d and the end dummy part are generated, which falls and is discharged to the discharge part 70b.

Then, the unit substrate 8 cut and formed into the unit substrate 8 by the second cutting module 50 and placed on the sixth and seventh belt conveyors 10f and 10g is transferred to the trans conveyor 84, respectively. . Thereafter, the unit substrate 8 placed on the trans conveyor 84 is inserted between the pair of reverse conveyors 87, and then the pair of reverse conveyors 87 are rotated 180 degrees around the inversion shaft 86. By reversing, the position of the upper and lower surfaces of the unit substrate 8 is changed (S15).

Thus, the final unit substrate 8 having the upper and lower positions reversed through the inverter 85 may be taken out in a post process while being loaded on the takeout conveyor 90 (S16).

As described above, according to the present embodiment, the cutting operation on the original substrate 1 is inlined while preventing the pad portion P of the unit substrate 8 on which the IC driver or the like is mounted from being damaged. This can reduce the tact time and further increase productivity.

In the above-described embodiment, a single substrate 1 is cut into three intermediate stage substrates 5, and then three intermediate stage substrates 5 are cut into four, respectively, for a total of 12 unit substrates 8. It was described to form a. However, the number thereof is only one embodiment, and the number of intermediate stage substrates 5 formed from the base substrate 1 and the number of unit substrates 8 formed from the intermediate stage substrate 5 are It can be properly adjusted in design.

In the above-described embodiment, although the first cutting module 20 cuts the substrate 1 in the first line X-axis direction, the first cutting module 20 cuts the substrate 1 in the first line Y-axis. You can also cut in the direction. In this case, the transfer unit 40 may be rotated while holding the intermediate stage substrate (not shown) in the base plate 1 and transferred to the fourth and fifth belt conveyors 10d and 10e.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, the cutting operation on the substrate can be in-lined while preventing the pad portion of the substrate on which the IC driver or the like is mounted from being damaged. Tact time can be reduced and productivity can be improved further.

Claims (29)

A plurality of conveyors for cutting the original substrate formed by bonding the upper plate and the lower plate to each other, wherein at least one area crosses each other to form a first work line and a second work line; It is provided in the conveyor area to form the first work line, along the direction of any one of the first line Y-axis direction parallel to the first work line and the first line X-axis direction formed horizontally on the first work line A first cutting module which forms a plurality of intermediate step substrates by forming and cutting predetermined scribe lines on upper and lower surfaces of the original substrate; A second line Y-axis direction parallel to the second work line and a second line X-axis direction formed horizontally on the second work line; A second cutting module which forms a plurality of unit substrates by forming and cutting a predetermined scribe line on upper and lower surfaces of the intermediate stage substrates; And And a transfer unit provided at an intersection area where the plurality of conveyors cross each other, and transferring the plurality of intermediate step substrates to a conveyor area forming the second work line. The method of claim 1, The conveyor is a belt conveyor (Belt Conveyor), The first cutting module cuts the substrate along the first line X-axis direction to form the plurality of intermediate step substrates, and the second cutting module includes the plurality of intermediate parts along the second line X-axis direction. Cutting a step substrate to form a plurality of unit substrate substrate cutting system. The method of claim 2, The transfer unit is a substrate cutting system, characterized in that for transferring the intermediate step substrate cut in the belt conveyor area forming the first work line to the belt conveyor area forming the second work line by linear movement. The method of claim 2, The first cutting module, A first scribing unit for forming a scribe line along the X-axis direction of the first line on the upper and lower surfaces of the substrate at first intervals formed in the belt conveyor area forming the first work line; And A first breaker disposed adjacent to the first scribing unit, the first breaker forming the plurality of intermediate step substrates by cutting the substrate along a scribe line in the X-axis direction by heating and cooling the substrate; Substrate cutting system comprising a portion. The method of claim 4, wherein The first scribe unit, A first upper scribing unit provided in the upper region of the belt conveyor at the first interval to form an upper scribe line in the X-axis direction of the first line on the upper plate of the base substrate; And And a first lower scribing unit provided in the lower region of the belt conveyor at the first interval to form a lower scribe line in the X-axis direction of the first line on the lower plate of the original substrate. . The method of claim 5, The first upper scribing unit, A first upper horizontal axis fixed along the X-axis direction of the first line; And At least one first upper screed coupled to one side of the first upper horizontal axis, the upper scribe line being formed on an upper plate of the base plate supported and moving on the belt conveyor, and relatively movable on the first upper horizontal axis Substrate cutting system comprising a driver (Scriber). The method of claim 6, The first lower scribing unit, A first lower horizontal axis positioned below the first upper horizontal axis and fixed along an X-axis direction of the first line; And At least one first lower screen coupled to one side of the first lower horizontal axis, the lower scribe line being formed on a lower plate of the base plate supported and moving on the belt conveyor, and relatively movable on the first lower horizontal axis. Substrate cutting system comprising a driver (Scriber). The method of claim 7, wherein And the first upper portion and the first lower horizontal axis are interconnected by a predetermined first connection portion. The method of claim 2, The second cutting module, A second scribing unit forming a scribe line along the X-axis direction of the second line on the upper and lower surfaces of the intermediate step substrate at second intervals formed in the belt conveyor region forming the second work line; And A second substrate disposed adjacent to the second scribing unit, the intermediate stage substrate being heated and cooled to cut the intermediate stage substrate along a scribe line in the X-axis direction of the second line to form the plurality of unit substrates; Substrate cutting system comprising a breaking portion. The method of claim 9, The second scribe unit, A second upper scribing unit provided in an upper region of the belt conveyor at the second interval to form an upper scribe line in the X-axis direction of the second line on the upper plate of the intermediate step substrate; And And a second lower scribing unit provided in the lower region of the belt conveyor at the second interval to form a lower scribe line in the X-axis direction of the second line on the lower plate of the intermediate stage substrate. system. The method of claim 10, The second upper scribing unit, A second upper horizontal axis fixed along the X-axis direction of the second line; And At least one second upper portion coupled to one side of the second upper horizontal axis, the upper scribe line being formed on the upper plate of the intermediate step substrate supported and moving on the belt conveyor, and relatively movable on the second upper horizontal axis Substrate cutting system comprising a scriber (Scriber). The method of claim 11, The second lower scribing unit, A second lower horizontal axis positioned below the second upper horizontal axis and fixed along the X-axis direction of the second line; And At least one second lower portion coupled to one side of the second lower horizontal axis, the lower scribe line being formed on a lower plate of the intermediate step substrate supported and moving on the belt conveyor, and relatively movable on the second lower horizontal axis Substrate cutting system comprising a scriber (Scriber). The method of claim 12, And the second upper and second lower horizontal axes are interconnected by a predetermined second connecting portion. The method of claim 2, The belt conveyor where the second cutting module is located is divided with each other along the X-axis direction of the second line. The transfer unit is a substrate cutting system, characterized in that for holding the intermediate step board one by one transfer to the divided belt conveyor. The method of claim 14, The delivery unit, A pair of first rail parts disposed on both sides of the belt conveyors forming the first work line, the pair of first rail parts being provided to span the crossing area; A moving bar having both ends coupled to the pair of first rail portions, respectively, and movable along the first rail portion; And And a holding head coupled to the moving bar so as to be movable along the longitudinal direction of the moving bar, and holding the intermediate stage board one by one to transfer the belt head to the divided belt conveyor one by one. The method of claim 2, And a discharge unit provided in the lower regions of the first and second cutting modules, respectively, and discharging a dummy substrate cut off from the substrate or the intermediate stage substrate. The method of claim 16, And the discharge part is accessible and spaced apart from the first and second cutting modules, respectively, at a corresponding position. The method of claim 17, And a shredding part for crushing the dummy substrate and the dummy part in the discharge part. The method of claim 1, And a distributor arranged at a rear side of the second cutting module along the second working line and distributing the unit substrates corresponding to one by one to the trans conveyor, in which the cutting operation is completed. The method of claim 19, The distributor, A pair of second rail parts disposed along the second work line on both sides of the trans conveyor; And A distribution which is movable along the pair of second rail portions and is respectively coupled to the pair of second rail portions so as to be rotatable relative to the pair of second rail portions to adsorb the unit substrates on which the cutting operation is completed. A substrate cutting system comprising a head. The method of claim 20, And a reverser for reversing the upper and lower positions of the unit substrates distributed by the trans conveyor. The method of claim 21, The inverter, Inverted axis; And And a pair of reverse conveyors that are reversible based on the inverted shaft and adsorb the upper and lower surfaces of the unit substrate so that the unit substrate can be inserted therein. The method of claim 22, Substrate cutting system, characterized in that further comprising a take-out conveyor is loaded by taking out the inverted unit substrate by the inverter. The method of claim 23, wherein The upper and lower plates of the original substrate first brought into the first work line are TFT, thin film transistor, and color filter, respectively. Substrate cutting system, characterized in that the reversed when taken out by the take-out conveyor. The method of claim 1, The substrate is a substrate cutting system, characterized in that the flat panel display (FPD) of any one of a liquid crystal display (LCD), a plasma display panel (PDP) and organic light emitting diodes (OLED). a) bringing into the predetermined first work line a base substrate to be cut, formed by joining the upper and lower plates; b) a predetermined scribe line (Scribe) on the upper and lower surfaces of the substrate along one of the first line Y-axis direction parallel to the first work line and the first line X-axis direction formed horizontally on the first work line Forming a plurality of intermediate step substrates by cutting lines; c) transferring the plurality of intermediate step substrates formed in step b) to a second work line crossing the first work line; And d) a predetermined scribe line on the upper and lower surfaces of the intermediate step substrates in one of a second line Y-axis direction parallel to the second work line and a second line X-axis direction formed laterally on the second work line; Forming a plurality of unit substrates by forming and cutting a scribble line. The method of claim 26, The first and second work lines are formed by a plurality of belt conveyors, In step b), the substrate is cut along the first line X-axis direction to form the plurality of intermediate step substrates. In step d), the plurality of intermediate step substrates are arranged along the second line X-axis direction. Cutting to form a plurality of unit substrates, In the step c), the intermediate step substrate formed on the first work line side by linear movement to the second cutting line, characterized in that for transferring to the side. The method of claim 26, In the step c), the intermediate substrate is linearly moved substrate transfer method, characterized in that for transferring from the first work line to the second work line. The method of claim 26, e) inverting the upper and lower positions of the unit substrate after step c); And and f) taking out the unit substrate having its upper and lower positions reversed.

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