KR20070031264A - Flexible scan field - Google Patents

Abstract

The energy beam mechanical system includes a generator for generating beams for adjusting optics, such as zoom telescopes, for adjusting the aperture size of the system to energy beams and multiples. The adjustment of the aperture size may be performed automatically, semi-automatically or manually. In the manual form the command tells the operator how to indicate the aperture size (ie monitor or pre-programmed audio command). The focus lens focuses the control beam guided along different focal paths in the scan area surrounded by the field of view of the focus lens. A beam guided optic is formed that enables multiple scan areas within the field of view of the focus lens.

Laser, Scan, Trim, Lens, Focus

Description

Flexible scan area {FLEXIBLE SCAN FIELD}

The present invention relates to an energy beam scan and to optimize the characteristics of a laser beam that can be applied to machine operations in more detail.

Energy beams, such as laser beams, are commonly used in a variety of machine operations and are often used in micromachining. In conventional micromachining, laser beams are used to mechanize machine features on substrates, such as printed circuit boards and panels. One typical micromechanical operation involves laser trimming of a resistor.

Figure 1 shows a laser beam micromechanical system 10 of the type used in conventional resistor trimming. The system 10 includes a laser beam generator 15 performed by the control of the system controller 55. The generated laser beam 20 is transmitted to the scan subsystem 30 through the fixed beam expander 25.

As shown, the scan subsystem 30 includes a beam and lens 40 for pointing optics 35. In addition, the scan system 30 is operated by the control of the system controller 55. The beam 20 is guided by the beam which directs optics 35 through the focus lens 40. The beam specifying optics 35 includes a pair of galvos for operating the mirror. The focus lens 40 has a working field of view at the point 22 of the resistor 45 on the substrate 50 on which the beam 20 performs the trimming operation and concentrates the beam 20. An X-Y step 52 is provided to move the substrate 50 in two axes that locate a resistor under the field of view of the lens 40. The focus 22 of the guided beam on the substrate acts as the trimming operation.

The fixed beam expander 25 sets the size (effective insertion aperture) of the beam to be inserted into the scan system 30. By using the fixed beam expander 25 as shown in FIG. 1, a beam collimated to a scanning subsystem having an aperture size B corresponding to the focal size B 'of the beam at the focal point 22 at the focal surface Is inserted. Therefore, larger or smaller focal sizes are preferred and the fixed beam expander 25 must be replaced with another beam expander having an appropriate beam extension ratio to achieve the desired focal size.

In general, if a larger focal size at the focal point 22 is desired, the fixed beam expander sets an efficient insertion aperture of the beam that inserts into a scan subsystem lower than B that can replace the fixed beam expander 25. do. On the other hand, if a smaller focal size at the focal point 22 is desired, then the fixed beam expander is inserted into the scan subsystem higher than B which can replace the fixed beam expander 25. Set the effective insertion aperture size. In any case the beam expander is converted.

In addition, there is a need for such a machine as shown in FIG. 1 used in a mechanical shape for substrates of various sizes and / or shapes. Varying the size and / or shape of the substrate will necessitate varying the size of the scan area that must be covered by the focused beam with the desired focal size. The step size of the X-Y step operation must vary in relation. The degree of accuracy and parallelism of the beam placement may vary in the area size.

The feasible focal size in the scan area of a conventional laser mechanical system is limited by various factors and includes the aperture size and the focal lens feature. Relative focus lens features include the lens focal length, reduction of the lens operation at large angles, parallelism of the focus lens, and complexity and cost of the focus lens.

With regard to reduction, focusing the beam through the outer region of the focus lens is often reduced control when smaller points are desired. In addition, beam positional accuracy decreases near the perimeter of the focal surface as the area size increases. Also, in non-telecentric systems, the parallelism can be reduced to near the perimeter of the focal surface at increased area size.

To handle large scan areas, the focus lens has a large field of view and a long focal length must be used. The beam has a large focal size at the focal surface without increasing the beam aperture size. However, if the focal size increases, the beam specifying the size of the mirror or other components also increases and reduces the dynamic operation. The beam aperture size must be increased in the beam specifying optics to achieve a smaller beam focal size without increasing the focal length at the focal surface.

A focus lens with a high degree of parallelism may be needed for scan area applications. However, if the packing density of the mechanized shape is high, a small beam focus size is required at the focal surface and the complexity and cost of designing and manufacturing a focus lens or the like can be quite high.

Thus, the prior art of achieving mechanical shapes at various packing densities of substrates of different sizes and / or shapes utilizes separation systems with fixed area sizes and X-Y step sizes and is optimized for particular mechanical applications. Requires separate focus lens for other chapters. The other focal lens manually installs and disassembles the subcomponent before starting the mechanical shape for a particular task. As a result, the manufacturing cost increases.

Thus, it is possible to manually convert a focus lens that is required for a mechanical system that can achieve mechanical shapes at various packing densities of substrates of different sizes and / or shapes without being reclassified to other systems or scanning sub-components. .

One embodiment of the present invention is to provide a flexible material control processing system. The system includes a laser generator configured to generate a laser beam. A beam for adjusting optics having a beam magnification is formed to adjust the laser beam generated by adjusting the beam magnification. The beam guided optic provides a variable efficiency aperture corresponding to the adjusted laser beam. The beam specifying optics is formed to designate a beam adapted to one or a plurality of targets within the scan area. A lens having a field of view that surrounds at least the scan area is formed to focus a laser beam directed to one or a plurality of targets within the scan area. The control processor is configured to receive an input corresponding to the material control processing parameter and generates at least one optimized control signal based on the at least one material control processing parameter. The beam for adjusting the optics can be a zoom telescope. The beam specifying optics may be one or a plurality of galvanometer mirror scanners. The system includes an operating system configured to move a workpiece including at least one target relative to the scan area and within the scan area for processing (i.e., connection blasting in a laser trimming or storage array of circuit components). At least one target is located at.

In one embodiment, the optimized control signal is an optimum efficiency aperture of the beam that specifies optics corresponding to the scan area size. In another embodiment, the optimized control signal is an optimum scan area size corresponding to one of an effective aperture designating optics, a focused laser beam focus size, position accuracy, a scan speed, a material handling step size and a parallelism value of the operating system. . In another embodiment the optimized control signal corresponds to one of the scan area size, the step duration of the operating system, the substrate size and the size of the selected area of the substrate. For example, the beam adjusting optics is manipulated to adjust the beam spreading ratio by an optimal beam expansion ratio value determined by the controller automatically or manually.

For example, the material process parameters may include focal size, substrate size, size of selected area of substrate, orientation of selected area of substrate, packing density, step time of operating system, step size of operating system, multiple steps of operating system. , Scan speed, position accuracy, parallelism value and desirable focus quality. The controller may be configured to be determined at an optimized value of at least one of the beam magnification factor, scan area size and material handling step size of the operating system based on the material process parameter.

In a special case the beam magnification factor is a first value and the scan area is a first scan area. The beam for adjusting optics is formed to adjust from the first value to a second value and the beam for adjusting optics is formed to designate a beam adjusted to a target within the second scan area. In another embodiment, the first scan area has a second scan area having a first size and a second size. In another embodiment, the first scan area has a second shape having a first shape and a second size. In another particular case the field of view of the lens surrounds at least the first scan area and the second scan area and focuses a first designated laser beam having a first effective aperture size on one or a plurality of targets within the first scan area. At least one scan area is defined by a reduction in focus size over the field of view.

The system includes a control processing device configured to receive an input for identifying the scan area and to generate a scan control signal based on the received input. The beam specifying optics is formed to specify a controlled beam by the generated control signal. The system, which may include a control processing device, is configured to receive an input by a focused beam focal size and generates a focus size control signal based on the received input. The beam for adjusting the optics is formed to adjust the beam expansion ratio by the generated focus size control signal. The system including a control processing device is configured to receive an input corresponding to the beam focal size and generate a focus size control signal based on the received input. The display monitor may be configured to indicate a parameter for manually manipulating the beam for adjusting the optics for adjusting the beam expansion ratio by the generated focus size control signal. The system including a control processing device is configured to receive an input for identifying the scan area and generates an operation control signal based on the received input. The operating system is configured to move the workpiece about the scan area by the generated operating control signal.

Yet another embodiment of the present invention provides a method of flexible optimal material processing. The method includes at least one material process affecting a workpiece with a laser beam. The fraud method continuously generates at least one optimized control signal based on at least one material process parameter. The method further includes adjusting a laser beam to a first control beam by the at least one optimized control signal and designating a laser beam that is adjusted to one or a plurality of targets within the first scan area. The method allows focusing the designated beams on one or a plurality of targets within the first scan area. Adjusting the laser beam to the first adjusting beam includes automatically or manually adjusting the beam expansion ratio to the first optimization value.

In one embodiment, the at least one optimization control signal generates an optimum effective aperture corresponding to the scan area size. In another embodiment, generating at least one optimization control signal includes generating an optimal scan area size corresponding to one of the effective aperture, process beam focus size, position accuracy, scan speed, material handling step size, and parallelism values. do. In another embodiment generating at least one optimization control signal results in an optimal material handling step size corresponding to one of the scan area size, the step duration of the operating system, the substrate size and the size of the selected area of the substrate. In another embodiment generating the at least one optimization control signal includes forming an optimal value of at least one of the material handling step size based on the beam expansion ratio, the scan area size and the control parameter. For example, the at least one material processing parameter may include a focal size, a substrate size, a size of a selected area of the substrate, an orientation of a selected area of the substrate, a packing density, a step time of the operating system, a step size of the operating system, and a plurality of operations. Accepts any one of system level, scan speed, position accuracy, parallelism and focus quality.

In one particular case, adjusting the laser beam to the first adjusting beam includes adjusting the beam spreading ratio to the first value. The method further includes adjusting the beam spreading factor to the second value and assigning the adjusting beam to one or a plurality of targets in the second scan area. In this case, the first scan area is the first size and the second scan area is the second size. In another case, the first scan area has a first shape and the second scan area has a second shape. The laser beam is adjusted using a zoom telescope, for example. Specifying the adjusting laser beam is performed using one or a plurality of galvanometer mirror scanners. In another particular case, adjusting the laser beam to the first steering beam includes adjusting the beam spreading factor to a second value that provides a second steering beam and targeting one or more targets within the second scan area. Specifying a second steering beam and focusing the second steering beam on one or a plurality of targets within the second scan area. At least one scan area size is defined by a reduction in focus size in the first aperture of the entire field of view and the second scan area size is defined by a reduction in focus size in the entire second aperture.

The method includes accepting an input for identifying a scan area size, generating a scan control signal based on the accepted input and designating an adjustment beam according to the generated scan control signal. The method may accept an input for identifying a focused beam focus size and generate a focus size control signal based on the input and adjust the beam spreading ratio by the generated focus size control signal. The method includes accepting an input for identifying a focused beam focus size, generating a focus size control signal based on the received input and indicating a parameter for manually adjusting the beam expansion ratio by the generated focus size control signal. The method includes accepting an input for identifying a scan area size, generating an operation control signal based on the received input and moving the workpiece relative to the scan area by the generated scan control signal.

Yet another embodiment of the present invention provides a material processing system. The system includes a generation configured to generate a laser beam, a control processing device configured to generate an optimization control signal, and a beam for adjusting optics formed to adjust the laser beam generated by the at least one optimization control signal. . A lens having a field of view is formed to focus the adjusting beam on one or a plurality of targets within the scan area surrounded by the field of view. The beam guided optics are configured to specify at least one steering beam of one or a plurality of targets in the scan area. In one embodiment, the scan area is a first scan area. The beam for adjusting optics is formed to adjust the generated laser beam and the lens is formed to focus the adjusting beam on one or a plurality of targets within a second scan area surrounded by the field of view. In addition, the beam specifying optics is formed to specify an adjusting beam within the second scan area. The beam specifying the optics is configured to specify an adjustment beam according to at least one of the optimum control signals. The system is configured to move a workpiece relative to a scan area by at least one of the control signals.

Although only described in detail with respect to the described embodiments of the present invention, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, it is natural that such variations and modifications belong to the appended claims. .

1 illustrates a conventional micromechanical system.

2 illustrates a micromechanical system according to an embodiment of the present invention.

FIG. 3A shows the laser beam point at the focus using the micromechanical system of FIG. 2.

3B shows the laser beam point of FIG. 3A in relation to the scan area.

FIG. 4 shows various examples in the scan area that may be accommodated by the micromechanical system of FIG. 2.

Figure 5 illustrates in detail the micromechanical system controller according to one embodiment of the invention.

6 is a display table that may be used to control the micromechanical system in FIG. 2 according to one embodiment of the present invention.

Embodiments of the present invention may be applied to mechanize shapes at various sizes and / or packing densities of workpieces of different sizes and / or shapes. The machining can be done without using other systems and without manually installing and dismounting the other focus lens in the scan subassembly. For example, various material process parameters include area size, accuracy, parallelism, step size and / or focus size and can be flexibly optimized for specific applications.

summary

2 illustrates a micro mechanization system 110 according to an embodiment of the present invention. The system can be used for various forms of mechanized operations, such as film resistors, capacitors, and inductors, which are formed on an untrimmed PCB panel or any other form of panel or substrate. The system 110 may be used for other purposes (drilling, marking, micro-perforating) and includes various other elements and support functions, although not shown in FIG. Will be described.

For the trimming operation the substrate comprises one or a plurality of untrimmed circuit elements, for example resistors, capacitors and / or inductors formed adjacent to at least one dielectric or conductor layer forming the substrate. The untrimmed element is the case for a capacitor that is inserted without a trim, including part of the dielectric layer or part of the conductor layer. The substrate includes other circuits and interconnects (printed and positioned).

The substrate for other manipulations, such as marking, drilling and drilling, may include components or features related to the function of a particular substrate, depending on whether it is electrical, mechanical, chemical, organizational or visual. Regardless of the substrate topology, the law of the present invention can selectively and accurately use energy beams on the substrate for any purpose.

The substrate may be used to form a plurality of generally identical circuits and may be formed in a repeating pattern or may form a single circuit (eg, a computer motherboard). On the other hand, the substrate is assembled to the same size as the workpiece circuit board. Or it can be machined to form a plurality of smaller sized workpiece circuit boards.

System structure

As shown in FIG. 2, the system 110 includes a laser beam generator 115 operated by the system controller 155. System controller 155 is one or a plurality of controllers (e.g., programmable for controlling the position, speed of the focused laser beam, output and operation of the substrate during mechanization during the period when the system is not performing a mechanized operation. The microcontroller is formed with one or a plurality of processing devices, input / output capability, memory, and a plurality of coded processes for performing a plurality of desirable functions. For example, the beam generator 115 may include a laser beam generator such as a metal state or a gas laser, but may alternatively be a simple generator such as an optical fiber for generating a laser beam generated outside the system.

The laser generator 115 may be of any type and the laser generator 115 generates an energy beam at a wavelength that is manipulated to be compatible with the mechanization type. For example, if the dielectric material is mainly processed, a carbon dioxide laser is generated at a wavelength of about 10 μm. If the conductor layer is trimmed, a solid layer laser (eg laser diode) occurs at a wavelength of about 1.06 μm. If the trimming is a photochemical process, the laser wavelength may be visible or ultraviolet light of about 533 nm and lower wavelengths.

The generated laser beam 120 passes through an adjustable beam expander 125 (eg, a zoom telescope) towards the scan subsystem 130. Adjustment of the beam expander 125 may be manually controlled or may be controlled by the system controller 155 as shown in FIG. The scan subsystem 130 may be operated by the control of the system controller 155.

The scan subsystem 130 includes a beam pointing the optics 135 and the focus lens and can direct the laser beam over a selected area of the substrate 150, or other workpiece. The selected area refers to the selected scan area. The focus lens 140 is for concentrating a laser beam designated at a desired size and energy density at the focus.

In addition, the beam guided optics 135 may meet the prior art and may scan a laser beam in one or more directions. In the embodiment of FIG. 2, a pair of right angled mounted galvanometer mirror scanners (only one is shown) acts as the beam pointing optics 135. Each galvanometer mirror scanner (sometimes referred to as a galvo drive mirror or galvo mirror) has a respective deflection designating the laser beam along each positioner of the mirror and the desired position path for tracking each position of the mirror. It includes a servo driver for controlling each rotation of the mirror.

In the embodiment of FIG. 2, the system controller 155 includes all the operational controls for the laser beam generator 115 and the beam 135 specifying optics. However, the control may be incorporated into one or more subsystem controllers and, if desired, may be separate from the system controller 155.

For example, for a resistor trimming operation the lens 140 may range from about 1.0 inches in diameter to 8 inches and have a field of view that allows a designated laser beam over a square area or scan area of 2 to 4 inches. Can be. In one embodiment, the focus lens 140 may be easily raised to a 3.5-inch square scan area of the workpiece 150. However, the lens diameter and the field of view may be different from those in one embodiment, and the embodiment is merely illustrative of the present invention, and the scope of the present invention is not limited to the present embodiment.

In any case, the maximum scan area of the scan subsystem is defined by the field of view of the focus lens 140 and allows a focused beam to specify a selected position within the field of view. When the scan subsystem 130 is a galvanic scan subsystem with two mirrors, the effective aperture of the mirror is increased without increasing the mirror size to maintain a large aperture of the largest scan area over the intermediate scan area. can do.

In general, the field of view of the lens 140 is smaller than the size of the workpiece 150. All mechanization in the scan area is enclosed in the lens 140 field of view and is performed without moving the workpiece 150. The workpiece 150 is moved to position the next target portion of the workpiece 150 in the field of view of the lens 140 for processing. The X-Y stage 152 moves or moves the end of the workpiece 150 to the next target point of the workpiece 150 to move to the field of view of the lens 140.

For example, the X-Y stage 152 may operate under the control of the system controller 155. In addition, the X-Y stage 152 is a manual control (for example, a hand-controlled X-Y micrometer) or the control of the dedicated controller module is different from the system controller 155. In one embodiment the lens 140 is a parallel lens for the laser beam to affect the target surface at a standard or perpendicular angle and the beam 135 designating optics is generally at the focal surface of the lens 140. Located.

The scan subsystem 130 generates beams that are generally concentrated in the shape of the workpiece 150, such as resistors or simple surface workpieces 150, and processes the same or different machines or shapes with sufficient power to be precisely removed. It has a workpiece material in a controlled manner. The position of the laser beam 120 is generated by the laser beam generator 115 and the beam designating the optics 135 of the scan subsystem 130 is a focal surface within the field of view of the lens 140. Affects.

For example, the power of the laser beam may be controlled by the laser beam generator 115 by the laser control signal generated by the controller 155 to the generator 115. The system controller 155 according to one embodiment shown in FIG. 2 is generally programmed or configured to control the performance of the overall mechanical system. However, a plurality of control mechanisms will be clearly described.

The focus lens 140 concentrates the beam by the beam affecting the focus 122 in the shape of the workpiece 150, or on the workpiece, which performs the desired mechanization. In one embodiment, the shape 145 is a film resistor and a workpiece 150 formed on the substrate. The laser beam is focused to affect the target point.

In the above state, the adjustable beam expander 125 may be a zoom telescope. In an embodiment, the zoom telescope varies the aperture size of the beam inserted into the scan subsystem 130. Thus, by manipulating the performance of the zoom telescope, the effective mouth stop of the beam can be inserted into the scan subsystem 130 and preferably adjusted. For example, using the zoom telescope as shown in FIG. 2, the beam may be inserted into the scan subsystem 130 and may have an aperture size ranging from size A to size C and the focused beam may be at the point. It is shown in FIG. 3A that at 122 can correspond to a focal size in the range A 'to C'. Thus, by manipulating the performance of the zoom telescope, the focus size can be better modified in response to the preferred process.

The beam expander 125 is manually controlled by the operator or the system controller 155 or other control to adjust the aperture size of the beam inserted into the scan subsystem 130 based on the desired focus size. Environment). Combinations of manual and automatic forms (eg semi-automatic) can be formed and require a lower level of operator involvement. Since the system may be inexperienced by the operator, the system may operate the beam expander 125 to provide the desired aperture size or control how to adjust (eg, via a monitor or preprogrammed voice guidance). Do it.

Adjustable aperture size

Accordingly, the beam expander 125 may be operated to vary the aperture size of the beam inserted into the scan sub-component 130 from the aperture sizes A to B and C, and in turn to the focal size A '. To focus size B 'and focus size C', respectively. As shown in FIG. 3B, the aperture size A is the smallest and becomes the focal focal size A 'and is most optimized without the large reduction in the largest scan area 310 of the focus lens 140. Aperture size B is optimized to medium focus size B 'without significant reduction in the intermediate scan area. Focus size C is the largest aperture size and results in the smallest focus size C 'without significant reduction in the smallest optimized scan area 330. Within any scan area, the focus size can be increased by reducing the beam magnification of the laser beam. When the scan area is defined by a reduction, the beam cannot increase unless the scan area is reduced.

Adjustable scan area

4 shows various scan areas 410, 420, 430, 440 in the lens field 450 and in the optimized scan area (eg, by signals from the system controller 155). This is accomplished by controlling the beam specifying the corresponding optics 135. By controlling the adjustable beam expander 125 or modifying the beam aperture, an optimized combination of focal sizes A ', B', C 'and scan area sizes 410, 420, 430, 440 is shown in FIG. Can be accommodated as shown in FIG.

The optimized focal size and area size are achieved by controlling the incident pupil that converts the focal size and controlling the still-scan sub-system 130, in particular the beam that controls the optics 135 converts the scan area size. do. The control may be automatic (e.g., performed by the controller 155) or semi-automatic (e.g., performed in part by the controller, part in the operator) or manual (e.g. by the operator).

The optimized scan area can be determined in view with the operation of the X-Y stage 152. Another area of the workpiece may be staged to process components within the scan area using the stage 152. If the workpiece 150 has a process surface tiled with adjacent compartments, the operation of the X-Y stage 152 may be determined based on the characteristics of the scan area shape. For example, the controller 155 may control the stage 152 in increments proportional to the X-Y size of the scan area 430. In turn, the scan area may have a ratio determined to optimize the scan speed of the X-Y stage 152.

Referring to FIG. 3B, the scan area 310 may include an accuracy request. Since the scan area 320 is smaller than the scan area 310 and the scan area size is reduced, the purification may increase. The scan area 330 is the smallest scan area and may have the highest accuracy according to the smallest area size. As the scan area decreases (in order of 310-320-330), the non-equilibrium error of the non-balance image system is determined from the largest scan area 310 through the scan area 320 to the smallest scan area 330. In turn it decreases.

System control

5 is a block diagram of a controller 155 according to an embodiment of the present invention. The controller 155 includes a control processor 510 having interconnected processor 512 and memory 514. The memory 514 may be a multi-memory device and may include random access memory (RAM), read only memory (ROM), floppy disk memory, hard disk memory, and / or the like. Memory type. The processing unit 512 interacts with the memory 514 with the function of program learning storage in the memory 514 and access data in the memory 514.

The control processing device 510 is interconnected with the display monitor 520 and controls the exposure of relevant information about the system operator. The input device is provided including a keyboard 530 and a mouse 540. The apparatus may be used by the operator's control by the input data of the control processing apparatus 510. Connection to the communication network is provided to allow input and system programming at remote locations. The control processing device 510 is interconnected with the laser beam generator 115 and the scanning subsystem 130. The control processing device 510 may be selectively connected to the adjustable beam expander 125.

In operation, the control processing unit 510 accepts an operator input by means of the keyboard 530, mouse 540, data port (e.g., X-Y stage data port and RS232 data port) or communication network. The control processing unit 510 processes an input from the processing unit 512 by program learning storage in the memory 514 and is selective to the laser generator 115, the scanning subsystem 130, and the beam expander. To generate the control signal.

6 is a process stored in the memory of the control processing apparatus 510 and generating control signals to the laser generator 115, the scanning subsystem 130, the beam expander 125 and / or the display monitor. The reference table that can be used by the apparatus 512 is shown.

As shown in FIG. 6, a portion of the reference table includes a column having various scan area sizes, respectively. The column associated with each of the scan area sizes has a set of parameters for scanning the galvo mirror of the selected area size / shape. Further, the operator can insert a scan area size corresponding to the square scan area 410 shown in FIG. 4 and the processing unit 512 determines the galvo mirror that the galvo mirror should rotate to correspond to 610 '. The scan area size 610 can be processed by accessing the reference table of FIG. The processing unit 512 generates a scan control signal sent to the scan subsystem 130. By means of the received scan control signal, the galvo drive mirror (beam to adjust optics 135) is manipulated corresponding to 610 'and sets the desired scan area.

The operator can input the size of the shape, the density of the shape or the focal size, accessing the reference table shown in FIG. 6 in the memory for determining the zoom telescope (beam expander 125) for the applicable area size. Can be processed by the processing unit 512. For example, if the preferred focal size is a medium focal size (eg 35 microns), then the processing unit 512 may have the zoom telescope in FIG. It can be determined that it can be manipulated to correspond to b 'indicated in the fourth column of the illustrated reference table.

In addition, the processing unit 512 generates an adjustment signal corresponding to the determined zoom telescope adjustment and transmits the adjustment signal to the zoom telescope by automatically adjusting or becoming the display monitor. If the adjustment signal is transmitted to the display monitor 520, the display monitor is shown to the system operator along with learning to manually adjust the zoom telescope corresponding to b '. The adjustment of the zoom telescope corresponds to the aperture size B of the beam inserted into the scan system 130 and the focal size B 'of the beam at the focus 122.

Only a single list of each scan area size for the scan area shown in FIG. 4 is shown in FIG. 6 and a combination of scan area sizes and shapes is possible and the scan area size column for focus size to be included in the reference table. Includes multiple inlets for the same size and shape. Learning storage programmed in the memory 514, which may be recognized instead of a reference table, includes corresponding algorithms that may be performed by the processing unit 512 to generate a desired adjustment signal. In addition, memory structures other than reference tables, such as linked lists and simple index data files, can be used to store appropriate adjustment information.

FIG. 6 shows that XY step sizes for different area sizes and shapes are partitioned and the XY step parameters (e.g. step time, step size, number of steps) can be converted, for example, "b" to "a". "Is as. The step size can be adjusted in the X or Y direction, or both.

Although only described in detail with respect to the described embodiments of the present invention, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, it is natural that such variations and modifications belong to the appended claims. .

Claims (38)

In a flexible optimized material handling system, A laser generator configured to generate a laser beam; A beam adjusting optical unit having a beam expanding ratio and configured to adjust a laser beam generated by adjusting the beam expanding ratio; A beam induction optical device, configured to provide various efficient apertures corresponding to the adjusted laser beam, wherein the beam specifying optics is configured to designate a beam adjusted to one or a plurality of targets within a scan area; A lens having a field of view surrounding at least the scan area and configured to focus one or a plurality of guided laser beams within the scan area; And A control processing device configured to receive an input corresponding to a material processing parameter and to generate at least one optimized control signal based on the at least one material processing parameter; Flexible optimized material processing system comprising a. The method of claim 1, And wherein said optimized signal is an optimized cook of said beam specifying optics corresponding to a scan area size. The method of claim 1, The optimized signal is flexible, characterized in that the optimized scan area size corresponds to one of the efficient aperture of the beam specifying the focal size, position accuracy, scan speed, operating speed, material operating step size and parallelism value of the operating system. Optimized material handling system. The method of claim 1, And the optimized control signal is an optimal material operation step size corresponding to one of the scan area sizes. The method of claim 1, The material processing parameters may include focal size, substrate size, size of selected area of substrate, orientation of selected area of substrate, packing density, step size of operating system, multiple operating system steps, scan speed, position accuracy, parallelism value value) and one of the desired focal qualities. The method of claim 1, The controller is configured to determine at least one of an optimized value of at least one of the beam expansion ratio, the scan area size and the material operating step size of the operating system based on a material processing parameter. Processing system. The method of claim 1, The beam expansion ratio is a first value and the scan area is a first scan area, The beam for adjusting optics is configured to readjust the beam expansion ratio from the first value to a second value, And wherein the beam to be adjusted by the optics is configured to designate a beam adjusted to a target within the second scan area. The method of claim 7, wherein And wherein said first scan area comprises said second scan area having a first size and a second shape. The method of claim 7, wherein And wherein said first scan area comprises said second scan area having a first shape and a second shape. The method of claim 1, And wherein the beam for adjusting optics is manually operated by an optimized beam expansion factor value by the controller. The method of claim 1, The control processing apparatus is configured to receive an input for identifying the scan area, and generates a scan control signal based on the received input, and the beam induction optics is configured to designate a beam adjusted by the generated scan control signal. Flexible optimized material handling system. The method of claim 1, The control processing apparatus is configured to receive an input corresponding to a focused beam focus size and generates a focus size control signal based on the received input and adjusts the optics to adjust the beam expansion ratio by the generated focus size control signal. Flexibly optimized material handling system, characterized in that it is configured to adjust. The method of claim 1, The control processing device is configured to receive an input corresponding to the beam focus size and the display monitor is a display parameter for manually operating the beam for adjusting the optics for adjusting the beam expansion ratio by the generated focus size control signal. Flexible optimized material handling system. The method of claim 1, The beam for adjusting optics comprises a zoom telescope, Wherein said beam specifying optics comprises one or a plurality of galvanometer mirror scanners. The method of claim 1, The control processor is configured to receive an input for identifying the scan area. Flexibly optimized material processing system, characterized in that it is formed to move the workpiece with respect to the scan area by the generated operation control signal. The method of claim 1, The field of view of the lens surrounds at least the first scan area and the second scan area and is configured to focus a first guided laser beam having a first efficiency aperture size at one or a plurality of targets within the first scan area. And focus the second guided laser beam having a second efficiency aperture size in one or a plurality of targets in the second scan area, wherein the at least one scan area size is defined by a reduction in the focal size of the viewing range. Flexible material processing system, characterized in that. The method of claim 1, An operating system configured to move a workpiece including at least one target relative to the scan area, and at least one target positioned within the scan area for the process. In the flexible material processing method, Receiving material processing parameters suitable for impinging a workpiece with a laser beam; Generating at least one optimization control signal based on the at least one material optimization control signal; Adjusting a laser beam to a first control beam according to the at least one optimization control signal; Assigning a control laser beam to one or a plurality of targets in the first scan area; And Concentrating a control beam on one or a plurality of targets in the first scan area; Flexible optimized material processing method characterized in that it comprises a The method of claim 18, A flexible optimized material processing method comprising generating at least one optimum control signal comprising generating an optimum efficiency aperture corresponding to the scan area size The method of claim 18, Flexibly optimized generating at least one optimization control signal comprising generating an optimal scan area size corresponding to one of an effective aperture, process beam focus size, position accuracy, scan speed, and material handling step size Material treatment method. The method of claim 18, Flexibly optimized generating at least one optimum control signal comprising generating an optimal material handling step size corresponding to one of the scan area size, the step of the operating system, the substrate size and the selection area of the substrate Material treatment method. The method of claim 18, Acceptance of the at least one material processing parameter includes focal size, substrate size, substrate selection area size, orientation of substrate selection area, packing density, step time of operating system, step size of operating system, multiple of operating system. And a step, scan speed, position accuracy, telecentricity, and focus characteristics. The method of claim 18, Generating at least one optimization control signal flexibly optimized comprising generating an optimal value of at least one of at least one beam magnification factor, scan area size, and material handling step size based on the process parameter. Material treatment method. The method of claim 18, A method of adjusting the laser beam to a first control beam, the method comprising controlling a beam expansion ratio at a first value, the method comprising: Adjusting the beam expansion ratio to a second value; And Assigning a controlled beam to one or a plurality of targets in a second scan area; Flexibly optimized material processing method characterized in that it further comprises. The method of claim 24, And wherein the first scan region has a first shape and the first scan region has a second shape. The method of claim 24, And wherein the first scan area has a first shape and the second scan area has a second shape. The method of claim 18, And adjusting the laser beam to a first control beam comprising manually adjusting the beam extension to a first optimal value. The method of claim 18, Accepting an input for identifying a scan area size; Generating a scan control signal based on the received input; Designating a controlled beam according to the generated scan control signal; Flexibly optimized material processing method characterized in that it comprises a. The method of claim 18, Accepting an input that identifies the focal size of the focused beam; Generating a focus size control signal based on the received input; And Adjusting the beam expansion ratio according to the generated focus size control signal; Flexibly optimized material processing method characterized in that it comprises a. The method of claim 18, Accepting an input for identifying the focused beam focus size; Generating a focus size control signal based on the received input; And Indicating a parameter for manually adjusting a beam expansion ratio according to the generated focus size control signal; Flexibly optimized material processing method characterized in that it comprises a. The method of claim 18, Wherein said laser beam utilizes a zoom telescope, and wherein a controlled laser beam is specified using one or a plurality of galvanometer mirror scanners. The method of claim 18, Accepting an input for identifying a scan area size; And Generating an operation control signal based on the received input and moving the workpiece related to the scan area according to the generated scan area control signal; Flexibly optimized material processing method characterized in that it comprises a. The method of claim 18, A flexible optimized material processing method for adjusting a laser beam to a first control beam, the method comprising adjusting the beam expansion ratio to a first value. Adjusting the beam spreading factor to a second value providing a second control beam; Assigning a second control beam to one or a plurality of targets in a second scan area; And Concentrating one or a plurality of the second control beams within the second scan area; More, At least one scan area size is defined by a reduction in focus size within the field of view. The method of claim 33, The first scan area is defined by a reduction in focus size at a first efficiency aperture size in the viewing range and the second scan area is defined by a reduction in focus size at a second efficiency aperture size in the viewing range Flexibly optimized material handling method. In the material processing system, A generator configured to generate a laser beam; A control processing device configured to generate an optimum control signal; A beam for adjusting optics formed to adjust a laser beam generated by at least one said optimum control signal; A lens having a field of view and configured to focus a beam adjusted to one or a plurality of targets within a scan area surrounded by the field of view; And A beam induction optics configured to assign a controlled beam to at least one of the one or a plurality of targets in the scan area; Material processing system comprising a. The method of claim 35, wherein The scan area is a first scan area, The beam for adjusting optics is configured to adjust the generated laser beam, The lens is configured to focus the adjusted beam on one or a plurality of targets in a second scan area surrounded by the field of view, And the beam specifying optics is configured to specify a beam adjusted within the second scan area. The method of claim 35, wherein And said beam specifying optics is configured to specify a beam adapted in accordance with at least one said optimum control signal. The method of claim 35, wherein The operating system is configured to move the workpiece relative to the scan area according to at least one of the control signals.

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